KR900702757A - 회로기판용 용제도포장치 - Google Patents
회로기판용 용제도포장치Info
- Publication number
- KR900702757A KR900702757A KR1019900700526A KR900700526A KR900702757A KR 900702757 A KR900702757 A KR 900702757A KR 1019900700526 A KR1019900700526 A KR 1019900700526A KR 900700526 A KR900700526 A KR 900700526A KR 900702757 A KR900702757 A KR 900702757A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- coating device
- solvent coating
- solvent
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
- B05C5/0229—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve
- B05C5/0233—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve rotating valve, e.g. rotating perforated cylinder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE8802571-3 | 1988-07-08 | ||
SE8802571A SE461822B (sv) | 1988-07-08 | 1988-07-08 | Anordning foer att laegga ut pastor och lim i diskreta punkter, foeretraedesvis vid ytmontering av komponenter paa kretskort |
PCT/SE1989/000397 WO1990000852A1 (en) | 1988-07-08 | 1989-07-07 | Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards |
SEPSE89/00397 | 1989-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900702757A true KR900702757A (ko) | 1990-12-08 |
KR0138992B1 KR0138992B1 (ko) | 1998-06-15 |
Family
ID=20372868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900700526A KR0138992B1 (ko) | 1988-07-08 | 1989-07-07 | 회로기판용 용제도포장치 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0423184B1 (ko) |
JP (1) | JPH04500332A (ko) |
KR (1) | KR0138992B1 (ko) |
DE (1) | DE68910128T2 (ko) |
SE (1) | SE461822B (ko) |
WO (1) | WO1990000852A1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE465713B (sv) * | 1990-02-12 | 1991-10-21 | Mydata Automation Ab | Anordning foer att utlaegga pastor och lim |
SE465307B (sv) * | 1990-02-16 | 1991-08-26 | Uva Ab | Saett och slipmaskin foer datorstyrd innerrundslipning av haal |
SE465756B (sv) * | 1990-03-02 | 1991-10-28 | Qenico Ab | Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat |
DE4325143C1 (de) * | 1993-07-27 | 1994-12-22 | Itw Dynatec Gmbh Klebetechnik | Auftragseinheit für Leim |
DE9315652U1 (de) * | 1993-10-15 | 1993-12-23 | Nordson Corp | Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte |
DE4411569C1 (de) * | 1994-04-02 | 1995-07-20 | Itw Dynatec Gmbh Klebetechnik | Auftragskopf zur dosierten Abgabe von strömenden Medien |
SE9901253D0 (sv) * | 1999-04-08 | 1999-04-08 | Mydata Automation Ab | Dispensing assembly |
SE0003647D0 (sv) | 2000-10-09 | 2000-10-09 | Mydata Automation Ab | Method, apparatus and use |
US7980197B2 (en) | 2006-11-03 | 2011-07-19 | Illinois Tool Works, Inc. | Method and apparatus for dispensing a viscous material on a substrate |
EP2844044A1 (de) * | 2013-09-03 | 2015-03-04 | Mass GmbH | Anlage und Verfahren zum Füllen von Löchern in einer Leiterplatte |
DE102017213841A1 (de) * | 2017-08-08 | 2019-02-14 | Continental Automotive Gmbh | Druckschablone zur Verwendung in einem Verfahren zur Durchkontaktierung einer Leiterplatte und Verwendung solch einer Druckschablone in einem solchen Verfahren |
-
1988
- 1988-07-08 SE SE8802571A patent/SE461822B/sv not_active IP Right Cessation
-
1989
- 1989-07-07 KR KR1019900700526A patent/KR0138992B1/ko not_active IP Right Cessation
- 1989-07-07 WO PCT/SE1989/000397 patent/WO1990000852A1/en active Search and Examination
- 1989-07-07 EP EP89907842A patent/EP0423184B1/en not_active Expired - Lifetime
- 1989-07-07 JP JP1507298A patent/JPH04500332A/ja active Pending
- 1989-07-07 DE DE89907842T patent/DE68910128T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1990000852A1 (en) | 1990-01-25 |
SE8802571L (sv) | 1990-01-09 |
EP0423184A1 (en) | 1991-04-24 |
KR0138992B1 (ko) | 1998-06-15 |
SE461822B (sv) | 1990-03-26 |
SE8802571D0 (sv) | 1988-07-08 |
DE68910128T2 (de) | 1994-05-05 |
JPH04500332A (ja) | 1992-01-23 |
EP0423184B1 (en) | 1993-10-20 |
DE68910128D1 (de) | 1993-11-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070130 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |