KR900017789U - Non-contact wafer mount chuck - Google Patents

Non-contact wafer mount chuck

Info

Publication number
KR900017789U
KR900017789U KR2019890002975U KR890002975U KR900017789U KR 900017789 U KR900017789 U KR 900017789U KR 2019890002975 U KR2019890002975 U KR 2019890002975U KR 890002975 U KR890002975 U KR 890002975U KR 900017789 U KR900017789 U KR 900017789U
Authority
KR
South Korea
Prior art keywords
wafer mount
contact wafer
mount chuck
chuck
contact
Prior art date
Application number
KR2019890002975U
Other languages
Korean (ko)
Other versions
KR920000571Y1 (en
Inventor
김강산
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019890002975U priority Critical patent/KR920000571Y1/en
Publication of KR900017789U publication Critical patent/KR900017789U/en
Application granted granted Critical
Publication of KR920000571Y1 publication Critical patent/KR920000571Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019890002975U 1989-03-17 1989-03-17 Wafer mount chuck KR920000571Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890002975U KR920000571Y1 (en) 1989-03-17 1989-03-17 Wafer mount chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890002975U KR920000571Y1 (en) 1989-03-17 1989-03-17 Wafer mount chuck

Publications (2)

Publication Number Publication Date
KR900017789U true KR900017789U (en) 1990-10-05
KR920000571Y1 KR920000571Y1 (en) 1992-01-15

Family

ID=19284428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890002975U KR920000571Y1 (en) 1989-03-17 1989-03-17 Wafer mount chuck

Country Status (1)

Country Link
KR (1) KR920000571Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3817733B2 (en) * 2003-09-30 2006-09-06 セイコーエプソン株式会社 Surface treatment jig

Also Published As

Publication number Publication date
KR920000571Y1 (en) 1992-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20031219

Year of fee payment: 13

EXPY Expiration of term