KR900004225B1 - Composition of insulating banish - Google Patents

Abstract

A self-melting adhesive insulating varnish compsn. cumprises an epoxy based and/or amide based resin as base resin; 0.001-1.0 PHR of a catalyst w.r.t. the base resin; and 0.001-1.0 PHR of an additive w.r.t. the base resin. Pref. the catalyst is N-methyl morphorine, triethyl amine, tetramethyl-1,3-butane diamine, triethylene diamine, tributyl tinacetate, dibutyl diacetate, diethyl cyclohexyl amine, dimethyl ethanol amine, methyl morphorine or cobalt naphthenate. Pref. the additive is phosphoric pentachloride, phosphoric trichlovide, phosphoric pentafluoride, phosphoric trifluoride, P2O5, or R-CO-X etc. (X= -OCH3, halogen; R= -C6H5, P-SO38C6H5 or P- fluorobenzyl).

Description

Self Fusing Insulation Varnish Composition

The present invention relates to a self fusion insulating varnish composition. In particular, the present invention relates to an enamel varnish composition useful for improving the adhesion of self-bonding insulated wire and increasing its productivity.

Conventional self fusion insulated wire has been pointed out some problems in the varnish manufacturing process, such as adding a large amount of hardener to obtain a certain level of adhesion. First of all, the moisture in the mixing process is a cause of poor appearance, and the finished varnish is sensitive to the baking temperature in the coating process, so when the work is performed at low speed or high speed, the adhesive strength decreases or the thermal softening point becomes low. Cases are common. On the other hand, the enamel electrically insulated wire is electrically or thermally treated to have a desired skeleton as well as to have a certain level of adhesion. However, when the energization time is shortened or the low temperature baking is performed in this process, since the isocyanate compound is not given enough time and activation energy to react with the surrounding activator, it exhibits a marked decrease in adhesion.

Therefore, appropriate reaction mechanisms should be assigned to each step from compounding, baking and final heat treatment.

That is, only when the reaction of the isocyanate compound with the surrounding active groups can be suppressed or sometimes activated, the physical properties of the final product are balanced.

However, in the selection of the catalyst, not only should there be no adverse effect on the final physical properties, but in the case of a solid, it must be well dissolved in cresol and the like and must have some stable chemical properties in the solvent.

In general, the self-fusion insulation wire is coated with the secondary coating of the self-fusion varnish on the 1st coating. At this time, the selection of the base resin in the compound should take into account the mutual affinity with the base resin of the primary coating. It should be suitable for the reaction with the active groups present.

Accordingly, an object of the present invention is to provide a varnish composition that can induce a unique reaction mechanism for each step by adding a catalyst composition suitable for the compounding, baking and final heat treatment.

That is, an object of the present invention is to remove moisture that may be included in the varnish in the mixing process to prevent appearance defects in advance, to prevent the consumption of the curing agent in the baking process, to suppress unwanted chemical bonds, and finally to obtain adhesion The present invention provides a varnish composition in which the desired adhesion is obtained not only by short-time energization or low temperature baking in the final heat treatment operation, but also in balanced physical properties with a thermal softening point and the catalyst used does not participate in other reactions.

The self-fusion insulating varnish composition according to the present invention is composed of epoxy-based and amide-based resins, and an additive and a catalyst are added thereto.

The catalyst used in the present invention is added according to the working temperature and chemical composition of each step, such as blending, baking and final heat treatment, and serves as a moisture scavenger to remove moisture that may be included during the blending process.

In addition, at the baking operation temperature, it plays a role of suppressing the reaction of the peripheral active groups of the isocyanate in order to reduce excessive loss of the curing agent at high temperature (300-400 ° C). In order to impart, it serves to promote the reaction of isocyanate with active hydrogen such as hydroxyl group, amine group and imine group.

The catalyst is preferably used 0.0001-1.0PHR of epoxy and amide base resin, and the catalysts such as N-methyl morpholine, triethylamine, tetramethyl-1, 3-butanediamine, triethylenediamine, Tributyl tin acetate, dibutyl tin diacetate, diethylcyclohexylamine, dimethylethanolamine, methylmorpholine and cobalt naphthalene.

On the other hand, the moisture inhaled during the mixing process reacts with the isocyanate in the baking process to generate carbon dioxide gas to generate amines. At this time, the produced amine is a basic substance, which acts as a self-catalyst in the reaction between the curing agent and the surrounding active group during the baking process, resulting in the loss of the curing agent.

This causes a decrease in physical properties along with a decrease in adhesion.

In order to prevent the above phenomenon, by reacting with water at a relatively low temperature to remove it, it prevents adverse effects caused by water, and at this time, additives are used to minimize the loss of curing agent during baking because the by-products reduce the pH of the entire reaction system. do.

[X는-OCH₃또는 할로겐이고, R은-C₆H₅, P-SO₃C₆H₅또는 p-플루오르 벤질임]를 들 수 있다.As the additive used in the present invention, a halogenated compound of aluminum, such as phosphorus pentoxide, phosphorus trioxide, phosphorus pentoxide, phosphorus trifluoride, P ₂ O ₅ , AlCl ₃ and AlBr ₃ , or

[X is -OCH ₃ or halogen, R is -C ₆ H ₅ , P-SO ₃ C ₆ H ₅ or p-fluor benzyl].

Such additives may use 0.0001-1.0 PHR of epoxy and amide based resins.

Examples of the composition of the composition according to the present invention are as follows.

[Composition 1]

Epoxy resin, 720 parts by weight of PKHH (U. C. C. products)

Blocked Isocyanate, 184 parts by weight TD-1400

Amide resin, 120 parts by weight of Ultramide-1C (U.C.C.

EDTA 1.5 parts by weight

P-SO ₃ C ₆ H ₅ COCOH ₃ 1.5 parts by weight

[Composition 2]

Epoxy resin, PKHH 900 parts by weight

Blocked Isocyanate, TD-1400

10 parts by weight of AP-stable (made by Bayer)

TD-1400 30 parts by weight

EDTA 1.8 parts by weight

P-SO ₃ C ₆ H ₅ COCl 1.8 parts by weight

Dibutyldine dilaurate 1.8 parts by weight

[Composition 3]

Epoxy resin, PKHH 900 parts by weight

Blocked Isocyanate, 40 parts by weight of TD-1400

EDTA 1.5 parts by weight

1.5 parts by weight

C ₆ H ₅ COCOl 1.5 parts by weight

1.5 parts by weight of cobalt naphthenate

[Composition 4] (for comparison)

Epoxy resin, 146 parts by weight of PKHH

6 parts by weight of block isocyanate (TD-1400)

EDTA 1.0 parts by weight

[Composition 5] (for comparison)

175 parts by weight of epoxy resin (PKHH)

AP-stable 23 parts by weight

Melamine formaldehyde resin, 3.5 parts by weight

Phenolic formaldehyde resin 3.5 parts by weight

Table 1 shows the adhesive strength of the self-sealing insulation wires prepared using the above self-sealing insulation varnish compositions.

TABLE 1

[How to measure]

1) wire size: 0.35ø

2) baking temperature: inlet is 330 ℃, outlet is 360 ℃

3) Adhesion test method: KSC3006

In the present invention, by using each step of the catalyst to remove the moisture sucked in the mixing process to improve the appearance and improved the final physical properties.

In the baking operation, the loss of the curing agent can be prevented even during high temperature baking, so that the amount of the curing agent in the formulation can be reduced, and the thermal softening temperature and the flexibility of the coating can be improved. Finally, in the final heat treatment process to give adhesion, short-time energization or baking treatment is very important in relation to productivity.

Therefore, it is very useful to use a catalyst which can promote the reaction between the isocyanate and the surrounding active hydrogen which impart adhesion without affecting the final physical properties.

The base resin of the primary film and the secondary film should have mutual affinity, and the adhesion between these resins is closely related to the peel strength of the entire film.

The selection of the base resin, the curing agent, and the composition of the catalyst during the compounding should give sufficient consideration to this relationship to obtain self-bonding insulation wire of excellent physical properties.

Claims (3)

A self-fusion insulating varnish composition comprising epoxy-based and amide-based resins, wherein the catalyst and the additives each contain 0.0001-1.0 PHR of the base resin. 2. The catalyst of claim 1 wherein the catalyst is N-methylmorpholine, triethylamine, tetramethyl-1, 3-butanediamine, triethylenediamine, tributyltinacetate, dibutyldiacetate, diethylcyclohexylamine, dimethylethanol A composition selected from the group consisting of amines, methylmorpholine and cobalt naphthenate. The aluminum halide compound according to claim 1, wherein the additive is phosphorus, phosphorus trichloride, phosphorus pentafluoride, phosphorus trifluoride, phosphorus such as P ₂ O ₅ , AlCl ₃ and AlBr ₃ , and

(X is -OCH ₃ , halogen: R is -C ₆ H ₅ , P-SO ₃₈ C ₆ H ₅ or P-fluorobenzyl).