KR900003398A - Densely arrayed metal microspheres coated base - Google Patents

Densely arrayed metal microspheres coated base Download PDF

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Publication number
KR900003398A
KR900003398A KR1019890012341A KR890012341A KR900003398A KR 900003398 A KR900003398 A KR 900003398A KR 1019890012341 A KR1019890012341 A KR 1019890012341A KR 890012341 A KR890012341 A KR 890012341A KR 900003398 A KR900003398 A KR 900003398A
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South Korea
Prior art keywords
metal
base
microspheres
discontinuous
welding
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KR1019890012341A
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Korean (ko)
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클라렌스.코스켄마키 데이비드
Original Assignee
도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴패니
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Publication of KR900003398A publication Critical patent/KR900003398A/en

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/18Metallic material, boron or silicon on other inorganic substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

내용 없음No content

Description

밀집 배열된 금속 미소구가 코팅된 기부Densely arrayed metal microspheres coated base

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 방법을 수행하기 위하여 사용되는 장치의 개략도.1 is a schematic diagram of an apparatus used to carry out the method of the present invention.

Claims (19)

기부는 불연속된 금속 코팅부를 갖추며, 이 금속 코팅부는 불연속되며, 빽빽하게 놓여진 금속 미소구의배열을 구비하는 것을 특징으로 하는 기부.The base has a discontinuous metal coating, the metal coating having a discontinuous, densely arranged array of metal microspheres. 제1항에 있어서, 상기 미소구는 변형 가능한 것을 특징으로 하는 기부.The base according to claim 1, wherein the microspheres are deformable. 제1항에 있어서, 상기 금속은 납, 주석, 인듐 비스무드 아연, 카드뮴, 아연, 탈륨, 이 금속들의 합금 그리고 혼합물을 구비한 군으로부터 선택되는 것을 특징으로 하는 기부.The base of claim 1 wherein the metal is selected from the group consisting of lead, tin, indium bismuth zinc, cadmium, zinc, thallium, alloys and mixtures of these metals. 제2항에 있어서, 상기 금속 코팅부는 가시광선의 통과를 허용하는 것을 특징으로 하는 기부.The base of claim 2, wherein the metal coating allows passage of visible light. 제1항에 있어서, 상기 미소구는 약 0.1㎛-약 5.0㎛범위의 직경을 가지는 것을 특징으로 하는 기부.The base of claim 1, wherein the microspheres have a diameter in the range of about 0.1 μm to about 5.0 μm. 제1항에 있어서, 상기 기부는 폴리이미드 및 산화알루미늄 피복된 알루미늄을 구비한 군으로부터 선택되는 것을 특징으로 하는 기부.The base of claim 1 wherein the base is selected from the group having polyimide and aluminum oxide coated aluminum. 제1항에 있어서, 금속 미소구의 돌출된 영역은 적어도 기부 표면적의 60%를 차지하는 것을 특징으로 하는 기부.The base of claim 1, wherein the protruding regions of the metal microspheres comprise at least 60% of the base surface area. 제4항에 있어서, 상기 코팅부는 전기적으로 전도성을 갖춘 미소구를 구비하는 것을 특징으로 하는 기부.5. The base of claim 4, wherein the coating comprises microspheres that are electrically conductive. 기부상에 빽빽하게 놓여진 금속 미소구의 배열을 구비한 불연속된 금속코팅부를 형성하는 방법에 있어서, 상기 방법은 (a) 체임버 내에서 용착면을 갖춘 기부를 제공하는 단계, (b) 체임버 내에서 금속 증기를 형성하는 단계, (c) 상기 용착면에 금속 증기를 용착시키는 단계로 구비되고, 불연속되며, 빽빽하게 놓여진 금속 미소구의 배열이 상기 용착면 상에서 형성되는 것을 특징으로 하는 용착방법.A method of forming a discontinuous metal coating having an array of metal microspheres densely placed on a base, the method comprising the steps of: (a) providing a base with a weld surface in a chamber, (b) metal vapor in the chamber And (c) depositing metal vapor on the welding surface, wherein an array of discontinuous and densely arranged metal microspheres is formed on the welding surface. 제9항에 있어서, 체임버내에서 금속 증기가 형성되기 전에 거의 진공인 상태가 제공되는 것을 특징으로 하는 용착방법.10. The welding method according to claim 9, wherein a vacuum is provided before the metal vapor is formed in the chamber. 제9항에 있어서, 상기 금속은 용융온도 Tm를 가지고 그리고 금속이 용착면에 용착될때 상기 용착면은 유효온도 Tm 또는 그 이상의 온도를 가지는 것을 특징으로 하는 용착방법.10. The welding method according to claim 9, wherein the metal has a melting temperature Tm and when the metal is welded to the welding surface, the welding surface has an effective temperature Tm or higher. 제9항에 있어서, 상기 금속은 납, 주석, 인듐, 비스무드, 아연,카드뮴, 탈륨, 이 금속들의 합금, 혼합물을 구비한 군으로부터 선택되는 것을 특징으로 하는 용착 방법.10. The method of claim 9, wherein the metal is selected from the group consisting of lead, tin, indium, bismuth, zinc, cadmium, thallium, alloys of these metals, mixtures. 제9항에 있어서, 상기 미소구는 약 0.1㎛-약 5.0㎛범위의 직경을 가지는 것을 특징으로 하는 용착방법.The method of claim 9, wherein the microspheres have a diameter in the range of about 0.1 μm to about 5.0 μm. 제13항에 있어서, 상기 미소구는 약 0.1㎛-2㎛범위의 직경을 가지는 것을 특징으로 하는 용착방법.The method of claim 13, wherein the microspheres have a diameter in the range of about 0.1 μm-2 μm. 제9항에 있어서, 상기 금속증기는 응축수단에 의해서 용착면에 용착되는 것을 특징으로 하는 용착방법.10. The welding method according to claim 9, wherein the metal vapor is deposited on the welding surface by a condensation means. 제9항에 있어서, 상기 증기는 전자 비임 복사수단에 의해서 금속을 증기화시킴에 의해 만들어지는 것을 특징으로 하는 방법.10. The method of claim 9, wherein the vapor is produced by vaporizing the metal by electron beam radiation means. 빽빽하게 놓여진 금속 미소구의 배열을 구비한 불연속된 금속 코팅부를 갖춘 기부에 압력을 가함으로 전기적으로 전도되는 통로를 형성하는 방법에 있어서, 상기 압력은 미소구 사이에 전기 통로를 형성하도록 미소구의 어떤 배열을 충분하게 변형시키는 것을 특징으로 하는 전기통로 형성방법.A method of forming an electrically conductive passageway by applying a pressure to a base with a discontinuous metal coating having an array of densely placed metal microspheres, the pressure may cause any arrangement of microspheres to form an electrical passage between the microspheres. An electric passage forming method, characterized in that it is sufficiently deformed. 제9항의 방법에의해 제조되는 것과 같은 불연속된 금속 코팅부를 갖춘 기부.A base with a discontinuous metal coating as prepared by the method of claim 9. 제11항의 방법에 의해 제조되는 것과 같은 불연속된 금속 코팅부를 갖춘 기부.A base with a discontinuous metal coating, such as produced by the method of claim 11. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890012341A 1988-08-29 1989-08-28 Densely arrayed metal microspheres coated base KR900003398A (en)

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US23799888A 1988-08-29 1988-08-29
US237998 1988-08-29

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KR (1) KR900003398A (en)
DE (1) DE3928569A1 (en)
GB (1) GB2224040B (en)
MY (1) MY106602A (en)

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WO1995013406A1 (en) * 1993-11-08 1995-05-18 United Technologies Corporation Superplastic titanium by vapor deposition
US8685858B2 (en) * 2011-08-30 2014-04-01 International Business Machines Corporation Formation of metal nanospheres and microspheres
JP6504335B2 (en) * 2014-09-26 2019-04-24 アイシン精機株式会社 Method of manufacturing metal film

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GB510404A (en) * 1938-05-03 1939-08-01 Bernhard Berghaus Improvements in and relating to light metal pistons and coatings therefor
US3099588A (en) * 1959-03-11 1963-07-30 Westinghouse Electric Corp Formation of semiconductor transition regions by alloy vaporization and deposition
US3091556A (en) * 1959-11-25 1963-05-28 Ibm Method for improving the sharp transition of superconductive films
JPS5535238B2 (en) * 1975-01-24 1980-09-12
US4076866A (en) * 1975-03-30 1978-02-28 Massachusetts Institute Of Technology Method of growing films by flash vaporization
US4812352A (en) * 1986-08-25 1989-03-14 Minnesota Mining And Manufacturing Company Article having surface layer of uniformly oriented, crystalline, organic microstructures

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GB2224040A (en) 1990-04-25
MY106602A (en) 1995-06-30
DE3928569A1 (en) 1990-03-01
GB2224040B (en) 1992-09-30
GB8918884D0 (en) 1989-09-27
JPH02163364A (en) 1990-06-22

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