KR890014824U - Cavity block of semiconductor mold - Google Patents
Cavity block of semiconductor moldInfo
- Publication number
- KR890014824U KR890014824U KR2019870022692U KR870022692U KR890014824U KR 890014824 U KR890014824 U KR 890014824U KR 2019870022692 U KR2019870022692 U KR 2019870022692U KR 870022692 U KR870022692 U KR 870022692U KR 890014824 U KR890014824 U KR 890014824U
- Authority
- KR
- South Korea
- Prior art keywords
- cavity block
- semiconductor mold
- mold
- semiconductor
- cavity
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870022692U KR910000211Y1 (en) | 1987-12-22 | 1987-12-22 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870022692U KR910000211Y1 (en) | 1987-12-22 | 1987-12-22 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR890014824U true KR890014824U (en) | 1989-08-11 |
| KR910000211Y1 KR910000211Y1 (en) | 1991-01-18 |
Family
ID=19270590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019870022692U KR910000211Y1 (en) | 1987-12-22 | 1987-12-22 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR910000211Y1 (en) |
-
1987
- 1987-12-22 KR KR2019870022692U patent/KR910000211Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR910000211Y1 (en) | 1991-01-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20020119 Year of fee payment: 12 |
|
| EXPY | Expiration of term |