KR890010035A - Modified Bismaleimide Resin and Manufacturing Method Thereof - Google Patents

Modified Bismaleimide Resin and Manufacturing Method Thereof Download PDF

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KR890010035A
KR890010035A KR1019870015196A KR870015196A KR890010035A KR 890010035 A KR890010035 A KR 890010035A KR 1019870015196 A KR1019870015196 A KR 1019870015196A KR 870015196 A KR870015196 A KR 870015196A KR 890010035 A KR890010035 A KR 890010035A
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South Korea
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bismaleimide
carbon atoms
diamino
dimethyl
group containing
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KR1019870015196A
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Korean (ko)
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KR910003569B1 (en
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여종기
김청수
이동재
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허신구
럭키 주식회사
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Priority to KR1019870015196A priority Critical patent/KR910003569B1/en
Priority to JP63330752A priority patent/JPH01279926A/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors
    • C08G73/121Preparatory processes from unsaturated precursors and polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Pyrrole Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음No content

Description

변성 비스말레이미드 수지 및 그의 제조방법Modified Bismaleimide Resin and Manufacturing Method Thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (9)

다음 일반식(I)로 표시되는 변성비스말레이미드 수지Modified bismaleimide resin represented by the following general formula (I) 상기식에서, n은 1-3이며, A는 최소한 2개이상으로 일반적으로 20개를 넣지 않는 탄소원자를 포함하는 2가의 기를 나타내며, A'는 최소한 1개 이상의 방향족 그룹을 포함하며, 일반적으로 20개 이하의 탄소원자를 포함하는 2가의 기이며,R는 최소한 1개 이상 10개 이하의 탄소원자를 포함하는 지방족 그룹.Wherein n is 1-3, A represents a divalent group containing at least two carbon atoms, generally not containing 20, and A 'contains at least one aromatic group, generally 20 A divalent group containing the following carbon atoms, wherein R is an aliphatic group containing at least 1 to 10 carbon atoms. 비스말레이미드와 방향족 2차 디아민을 100-150℃의 온도에서 마이클 부가반응시킴을 특징으로 하는 일반식(I)로 표시되는 변성비스마레이미드 수지의 제조방법.A method for producing a modified bismaleimide resin represented by formula (I), wherein bismaleimide and aromatic secondary diamine are added by Michael at a temperature of 100-150 ° C. 제2항에 있어서 비스말레이미드 하기 일반식(Ⅱ)로 표시되는 물질임을 특징으로 하는 방법.The method according to claim 2, wherein the bismaleimide is a substance represented by the following general formula (II). 여기서 B는 탄소-탄소 사이에 이중결합을 포함하여 탄소수 2개 이상 바람직하게는 2에서 6개의 탄소원자를 포함하는 2가의 기를 나타내며, A는 최소한 2개 이상으로 일반적으로 20개를 넣지 않는 탄소원자를 포함하는 2가의 기이다.Wherein B represents a divalent group containing two or more carbon atoms, preferably two to six carbon atoms, including a double bond between carbon and carbon, and A includes at least two carbon atoms, generally not containing 20 carbon atoms. It is a bivalent group. 제2항 또는 제3항에 있어서, 비스말레이미드는 N,N'-1,3-페닐렌 비스말레이미드, N,N'-4,4'-디페닐메탄 비스말레이미드, N,N'-4,4'-디페닐에테르 비스말레이미드, N,N'-4.4'-디페닐렌설폰 비스말레이미드, N,N'-3,4'-디페닐설폰비스말레이미드, N,N'-4,4'-디사이클로헥실 메탄비스말레이미드, N,N'-4,4'-디페닐렌사이클로헥산 비스말레이미드 N,N'-4,4'-디페닐 사이클로헥산 비스말레이미드, N,N'-1,3-자일리렌 비스말레이미드, 2,4-비스말레이미드 틀루엔 2,6-비스말레이미드 틀루엔임을 특징으로 하는 비스말레이미드 수지의 제조방법.The bismaleimide of claim 2 or 3, wherein the bismaleimide is N, N'-1,3-phenylene bismaleimide, N, N'-4,4'-diphenylmethane bismaleimide, N, N ' -4,4'-diphenylether bismaleimide, N, N'-4.4'-diphenylene sulfone bismaleimide, N, N'-3,4'-diphenylsulfon bismaleimide, N, N ' -4,4'-dicyclohexyl methanebismaleimide, N, N'-4,4'-diphenylenecyclohexane bismaleimide N, N'-4,4'-diphenyl cyclohexane bismaleimide, N, N'-1,3-xylylene bismaleimide, 2,4-bismaleimide toluene 2,6-bismaleimide toluene The manufacturing method of the bismaleimide resin characterized by the above-mentioned. 제2항에 있어서, 방향족 2차 디아민은 하기 일반식(Ⅲ)로 표시되는 물질임을 특징으로 하는 방법.The method according to claim 2, wherein the aromatic secondary diamine is a substance represented by the following general formula (III). 여기서, A'는 최소한 1개 이상의 방향족 그룹을 포함이며, 일반적으로 20개 이하의 탄소원자를 포함하는 2가의 기이며, R은 최소한 1개 이상 10개 이하의 탄소원자를 포함하는 지방족 그룹이다.Here, A 'is a divalent group containing at least one aromatic group, generally containing 20 carbon atoms or less, and R is an aliphatic group containing at least 1 carbon atom and 10 carbon atoms. 제2항 또는 5항에 있어서, 방향족 2차 디아민은 N,N'-디메틸-4,4'-디아미노 디페닐메탄, N,N'-메틸에틸-4,4'-디아미노 디페닐메탄, N,N'-디메틸-4,4'-디아미노 디페닐설폰, N,N'-디메틸-4,4'-디아미노 디페닐에테르, N-(1-3-디메틸부틸)-N'-페닐-파라페닐렌 디아민, N-이소프로필-N'-페닐-파라페닐렌디아민, N,N'-디페닐-파라페닐렌 디아민, N,N'-디메틸-2,4-디아미노 톨루엔, N,N'-디메틸-2,6-디아미노 톨루엔, N,N'-디사이클로헥실-4,4'-디아미노 디페닐메탄임을 특징으로 하는 비스말레이미드 수지의 제조방법.The method of claim 2 or 5, wherein the aromatic secondary diamine is N, N'-dimethyl-4,4'-diamino diphenylmethane, N, N'-methylethyl-4,4'-diamino diphenylmethane , N, N'-dimethyl-4,4'-diamino diphenylsulfone, N, N'-dimethyl-4,4'-diamino diphenylether, N- (1-3-dimethylbutyl) -N ' -Phenyl-paraphenylene diamine, N-isopropyl-N'-phenyl-paraphenylenediamine, N, N'-diphenyl-paraphenylene diamine, N, N'-dimethyl-2,4-diamino toluene And N, N'-dimethyl-2,6-diamino toluene and N, N'-dicyclohexyl-4,4'-diamino diphenylmethane. 제2항에 있어서, 비스말레이미드와 방향족 2차 디아민의 사용량은 1,2:1-10:1임을 특징으로 하는 비스말레이미드 수지의 제조방법.The method for producing a bismaleimide resin according to claim 2, wherein the amount of bismaleimide and aromatic secondary diamine is 1,2: 1-10: 1. 제2항에 있어서, 마이클 부가반응시에 이온성 촉매를 사용함을 특징으로 하는 비스말레이미드 수지의 제조방법.The method for producing a bismaleimide resin according to claim 2, wherein an ionic catalyst is used during the Michael addition reaction. 제2항에 있어서, 이온성 촉매가 디아자비 사이클로옥탄, 이미다졸, 2-메틸이미다졸, 2-페닐이미다졸, 4-메틸, 2-페닐이미다졸임을 특징으로 하는 비스말레이미드 수지의 제조방법.The bismaleimide resin according to claim 2, wherein the ionic catalyst is diazabicyclooctane, imidazole, 2-methylimidazole, 2-phenylimidazole, 4-methyl, 2-phenylimidazole. Manufacturing method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870015196A 1987-12-29 1987-12-29 Degenerated bismaleic amide plastics and preparation for thereof KR910003569B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019870015196A KR910003569B1 (en) 1987-12-29 1987-12-29 Degenerated bismaleic amide plastics and preparation for thereof
JP63330752A JPH01279926A (en) 1987-12-29 1988-12-27 Modified bismaleimide resin and its production

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Application Number Priority Date Filing Date Title
KR1019870015196A KR910003569B1 (en) 1987-12-29 1987-12-29 Degenerated bismaleic amide plastics and preparation for thereof

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KR890010035A true KR890010035A (en) 1989-08-05
KR910003569B1 KR910003569B1 (en) 1991-06-05

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JP2021181505A (en) * 2018-08-22 2021-11-25 昭和電工マテリアルズ株式会社 Resin composition, prepreg, laminate sheet, multilayer printed wiring board, semiconductor package and method for manufacturing multilayer printed wiring board

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JPS5372060A (en) * 1976-12-08 1978-06-27 Sumitomo Bakelite Co Ltd Production of thermosetting resin for molding
JPS62106927A (en) * 1985-11-01 1987-05-18 Mitsubishi Petrochem Co Ltd Heat-resistant resin composition

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