KR890009522A - Pretreatment of Lead Plating - Google Patents
Pretreatment of Lead Plating Download PDFInfo
- Publication number
- KR890009522A KR890009522A KR870014578A KR870014578A KR890009522A KR 890009522 A KR890009522 A KR 890009522A KR 870014578 A KR870014578 A KR 870014578A KR 870014578 A KR870014578 A KR 870014578A KR 890009522 A KR890009522 A KR 890009522A
- Authority
- KR
- South Korea
- Prior art keywords
- pretreatment
- lead plating
- lead
- plating
- rinsing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
첨부된 도면을 납 도금(Soldering)의 공정도이다.The accompanying drawings are a process chart of lead plating (Soldering).
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019870014578A KR900005844B1 (en) | 1987-12-19 | 1987-12-19 | Pretreatment method of lead plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019870014578A KR900005844B1 (en) | 1987-12-19 | 1987-12-19 | Pretreatment method of lead plating |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890009522A true KR890009522A (en) | 1989-08-02 |
KR900005844B1 KR900005844B1 (en) | 1990-08-13 |
Family
ID=19267125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870014578A KR900005844B1 (en) | 1987-12-19 | 1987-12-19 | Pretreatment method of lead plating |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR900005844B1 (en) |
-
1987
- 1987-12-19 KR KR1019870014578A patent/KR900005844B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR900005844B1 (en) | 1990-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
N231 | Notification of change of applicant | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050708 Year of fee payment: 16 |
|
LAPS | Lapse due to unpaid annual fee |