KR890007992Y1 - Molding apparatus for semiconductor - Google Patents
Molding apparatus for semiconductor Download PDFInfo
- Publication number
- KR890007992Y1 KR890007992Y1 KR2019870005012U KR870005012U KR890007992Y1 KR 890007992 Y1 KR890007992 Y1 KR 890007992Y1 KR 2019870005012 U KR2019870005012 U KR 2019870005012U KR 870005012 U KR870005012 U KR 870005012U KR 890007992 Y1 KR890007992 Y1 KR 890007992Y1
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- plate
- semiconductor
- fixing
- molding apparatus
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title description 5
- 239000004065 semiconductor Substances 0.000 title description 4
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000005266 casting Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 일부를 절개하고 분해한 전체 사시도.1 is a full perspective view of a cut and disassembled part of the present invention.
제2도는 본 고안의 요부에 대한 분해 사시도.Figure 2 is an exploded perspective view of the main part of the present invention.
제3도는 제2도의 조립상태 종단면도.3 is an assembled longitudinal cross-sectional view of FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 판스프링 2,2' : 보호판1: leaf spring 2,2 ': protective plate
3 : 캡 4, 4' : 지지봉3: cap 4, 4 ': support rod
5 : 고정판 6,9 : 금형판5: fixed plate 6,9: mold plate
7 : 고정편 8 : 상부금형7: fixing piece 8: upper mold
8' : 하부금형 10 : 유도편8 ': lower mold 10: guide piece
10' : 삽입공10 ': insertion hole
본 고안은 반도체 금형 지지장치에 관한 것이다.The present invention relates to a semiconductor mold support device.
기판상으로 장착한 하부금형의 상부로 프레스에 의해 상하작동되게 상부금형을 장착하여 성형작업을 하게된 통상의 방법에 있어서, 이의 성형작업은 상하부 금형을 가압되게 한 상태에서 탕구 및 탕도를 통해 성형부로 반도체 피복용 합성용액을 압입되게 함에 따라 원하는 형상의 피복 성형이 되는데, 이때 상하금형의 압접면에 눈에 보이지 않는 미세한 틈이 부분적으로 발생되어 압입된 피복용 합성용액이 그틈 사이로 유출되면서 불규칙하게 피복 성형되기 때문에 이를 제거해야 되는 불편이 있을 뿐 아니라 심한 경우 불량제품이 되는 폐단이 있다.In the conventional method in which the upper mold is mounted to be operated up and down by a press to the upper portion of the lower mold mounted on the substrate, the molding operation is performed through the tap and the tap in the state in which the upper and lower molds are pressed. As the composite solution for semiconductor coating is press-fitted into the molding part, coating molding of a desired shape is performed. In this case, invisible minute gaps are partially generated on the upper and lower mold press surfaces, and the press-fitting coating solution is irregularly leaked between the gaps. Not only is there a inconvenience to remove the coating because it is molded in a very bad way, there is a disadvantage that becomes a bad product in severe cases.
본 고안은 이러한 종래의 불편을 시정 보완하여 안출한 것으로 프레스에 굳게 붙임한 고정판상에 고정편으로금형판을 부착할시에 상하판 사이의 다수곳으로 지지봉을 형성하되 이의 중앙부상에 판스프링을 끼워 설치한 것인바, 기판에 장착된 하부금형상으로 상부 금형을 가압하는 과정에서 국부적으로 가해지는 과대한 압력에 의해 발생되는 금형판의 균열 및 휨을력을 흡수하면서 균일한 상태로 상하금형을 가압되게하여 상하금형이 정확하게 압접될 수 있도록 한 것으로 첨부 도면에 의거하여 구조를 상세히 설명하면 다음과 같다.The present invention has been made to compensate for the inconvenience of the prior art to form a support rod in the many places between the upper and lower plates when attaching the mold plate to the fixing piece on the fixed plate firmly attached to the press but the plate spring on the center Pressing the upper and lower molds in a uniform state while absorbing the cracks and warpage of the mold plate caused by the excessive pressure applied locally in the process of pressing the upper mold to the lower mold mounted on the substrate. The upper and lower molds to be accurately pressed in accordance with the accompanying drawings to explain the structure in detail as follows.
고정판(5)에 고정편(7)로 상부금형(8)이 장착된 금형판(6)의 전후면을 굳게 붙임하되 이의 저면부의 금형판(9)에 하부금형(8')를 장착한 것에 있어서, 고정판(5)와 금형판(6)사이의 다수곳으로 지지봉(4)(4')를 형성하되 상하지지봉(4)(4')가 맞닿는 위치에 판스프링(1)을 중앙으로 상하로 보호판(2)(2')가 끼워진 캡(3)을 삽입하여된 것으로 도면중 미설명 부호 10은 유도핀, 10'는 삽입공이다.The front and rear surfaces of the mold plate 6, on which the upper mold 8 is mounted, are fixed to the fixing plate 5, and the lower mold 8 'is mounted on the mold plate 9 of the bottom portion thereof. The support rods 4 and 4 'are formed in a number of places between the fixed plate 5 and the mold plate 6, but the upper and lower plate springs 1 are centered at the position where the upper and lower supporting rods 4 and 4' abut. By inserting the cap (3) is inserted into the protective plate (2) (2 ') as shown in the figure, reference numeral 10 is a guide pin, 10' is an insertion hole.
상술한 바와 같은 본 고안의 사용상태 및 작용 효과에 있어서, 상부금형(8)이 장착된 금형판(6)은 고정편(7)을 통해 고정판(5)에 굳게 붙임되고 이는 상하동작되는 프레스(도시하지 아니하였음)에 고정설치되므로, 저면의 기판에 하부금형(8')가 장착된 금형판(9)를 굳게 붙임한 상태에서 기체를 구동시키게 되면 공지한 바와 같이 유도핀(10)이 삽입공(10')에 끼이면서 상부의 금형(8)이 하부금형(8')면에 압접된다.In the state of use and operation and effect of the present invention as described above, the mold plate 6 on which the upper mold 8 is mounted is firmly attached to the fixing plate 5 through the fixing piece 7, which is pressed up and down ( (Not shown), when the gas is driven while the mold plate 9 with the lower mold 8 'mounted on the bottom substrate is firmly attached, the guide pin 10 is inserted as is known. The upper mold 8 is pressed against the lower mold 8 'surface while being caught in the ball 10'.
이때 하부금형(8')면 상으로 가해지는 압력은 상하금형면(8)(8')의 간극을 극소화하기 위해 과대한 하중으로 가압되는 상태이므로 상부금형(8)이 장착된 금형판(6)과 고정판(5)를 고정편(7)로 굳게 붙임하였다하더라도 이들 각 부분에 걸리게되는 과대한 하중에 의해 각부분, 특히 고정판(5)와 금형판(6)사이에 미세한 상태의 휨 및 비틀림 응력이 발생된다.At this time, the pressure applied to the lower mold 8 'surface is pressurized with an excessive load to minimize the gap between the upper and lower mold surfaces 8 and 8'. ) And the fixing plate 5 are firmly attached to the fixing piece 7, and due to the excessive load applied to each of these parts, the fine bending and twisting of each part, in particular, between the fixing plate 5 and the mold plate 6 Stress is generated.
그러므로 고정판(5)과 금형판(6)사이의 다수곳에 지지봉(4)(4')를 형성하여 이들이 서로 맞닿게되면 중간부위에 판스프링(1) 및 보호판(2)(2')이 끼워진 캡(3)을 삽입함에 따라 전기한 바와 같이 고정편(7)이 굳게붙임된 부위상으로만 국부적으로 가해지게한 막대한 하중을 균일한 상태로 분산되게하여 가압되게하고 가압동작시에는 제3도의 점선도에서와 같이 단면이형으로 된 판스프링(1)의 탄발작용으로 가압시 발생되는 강한 충격을 흡수되도록하여 반도체 금형등 초정밀 제품의 수명연장은 물론 정확한 상태로 성형작업을 할 수 있게한다.Therefore, the supporting rods 4 and 4 'are formed in many places between the fixed plate 5 and the mold plate 6, and when they come into contact with each other, the plate spring 1 and the protective plate 2 and 2' are fitted in the middle portion. As the cap 3 is inserted, the enormous load that is locally applied only on the portion to which the fixing piece 7 is firmly attached as described above is distributed in a uniform state so that it is pressurized, As shown in the dotted line By absorbing the strong impact generated during pressurization due to the elasticity of the leaf spring (1) of the mold, it is possible to extend the life of ultra-precision products such as semiconductor molds and to perform molding work in an accurate state.
이때 판스프링(1)의 상하로 끼운 보호판(2)(2')는 판스프링(1)의 재질보다 비교적 강도가 낮은 재질로 구성되는 지지봉(4)(4')가 판스프링(1)에 직접 접촉됨에 따라 발생되는 마모를 방지하여 처음 사용할때의 기능이 오랜동안 지속되게 한다.At this time, the protective plate (2) (2 ') inserted into the upper and lower sides of the leaf spring (1) has a support rod (4) (4') made of a material having a relatively lower strength than the leaf spring (1) of the leaf spring (1) It prevents abrasion caused by direct contact, so that the function of the first use is long lasting.
이와 같은 본 고안은 상하금형을 균일한 상태로 정확하게 압접되게 함에 따라 성형품의 질을 향상시키게 될 뿐 아니라 가압작동중 접촉되는 금형면에 발생되는 충격을 완충되게하여 값이 고가인 금형의 수명을 보전할 수 있게한 효과적인 고안이다.The present invention not only improves the quality of the molded product by accurately pressing the upper and lower molds in a uniform state, but also buffers the impact generated on the mold surface contacted during press operation to preserve the lifetime of the expensive mold. It is an effective design that makes it possible.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870005012U KR890007992Y1 (en) | 1987-04-10 | 1987-04-10 | Molding apparatus for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019870005012U KR890007992Y1 (en) | 1987-04-10 | 1987-04-10 | Molding apparatus for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR880020590U KR880020590U (en) | 1988-11-30 |
| KR890007992Y1 true KR890007992Y1 (en) | 1989-11-18 |
Family
ID=19261535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019870005012U KR890007992Y1 (en) | 1987-04-10 | 1987-04-10 | Molding apparatus for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR890007992Y1 (en) |
-
1987
- 1987-04-10 KR KR2019870005012U patent/KR890007992Y1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR880020590U (en) | 1988-11-30 |
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