KR880700482A - Electrical circuit device - Google Patents
Electrical circuit deviceInfo
- Publication number
- KR880700482A KR880700482A KR860700951A KR860700951A KR880700482A KR 880700482 A KR880700482 A KR 880700482A KR 860700951 A KR860700951 A KR 860700951A KR 860700951 A KR860700951 A KR 860700951A KR 880700482 A KR880700482 A KR 880700482A
- Authority
- KR
- South Korea
- Prior art keywords
- circuit device
- electrical circuit
- electrical
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Conductors (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72898785A | 1985-04-30 | 1985-04-30 | |
US06/728,956 US4659872A (en) | 1985-04-30 | 1985-04-30 | Flexible flat multiconductor cable |
PCT/US1986/000639 WO1986006551A1 (en) | 1985-04-30 | 1986-03-31 | Flexible electrical jumper cable and assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880700482A true KR880700482A (en) | 1988-03-15 |
Family
ID=27111780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR860700951A KR880700482A (en) | 1985-04-30 | 1986-12-29 | Electrical circuit device |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0221924A1 (en) |
JP (1) | JP2524138B2 (en) |
KR (1) | KR880700482A (en) |
WO (1) | WO1986006551A1 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6377284U (en) * | 1986-11-10 | 1988-05-23 | ||
JP2629490B2 (en) * | 1991-07-12 | 1997-07-09 | 日立化成工業株式会社 | Anisotropic conductive adhesive |
US5484648A (en) * | 1993-08-11 | 1996-01-16 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector and method for the preparation thereof |
GB2280993B (en) * | 1993-08-12 | 1997-05-14 | Shinetsu Polymer Co | Heat-sealable connector and method for the preparation thereof |
EP0951161A1 (en) * | 1998-04-16 | 1999-10-20 | Koninklijke Philips Electronics N.V. | Contact device for connecting a liquid crystal display to a printed circuit board |
US6522715B2 (en) * | 2000-12-29 | 2003-02-18 | Ge Medical Systems Global Technology Company Llc | High density flex interconnect for CT detectors |
US6840796B2 (en) * | 2003-06-06 | 2005-01-11 | Sony Ericsson Mobile Communications Ab | Portable electronic devices with a flexible connection between internal electronics and an auxiliary connection |
US7439962B2 (en) | 2005-06-01 | 2008-10-21 | Synaptics Incorporated | Touch pad with flexible substrate |
WO2013106773A2 (en) | 2012-01-12 | 2013-07-18 | Synaptics Incorporated | Single layer capacitive imaging sensors |
US9542023B2 (en) | 2013-08-07 | 2017-01-10 | Synaptics Incorporated | Capacitive sensing using matrix electrodes driven by routing traces disposed in a source line layer |
US9298325B2 (en) | 2013-09-30 | 2016-03-29 | Synaptics Incorporated | Processing system for a capacitive sensing device |
US20150091842A1 (en) | 2013-09-30 | 2015-04-02 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US10042489B2 (en) | 2013-09-30 | 2018-08-07 | Synaptics Incorporated | Matrix sensor for image touch sensing |
US9459367B2 (en) | 2013-10-02 | 2016-10-04 | Synaptics Incorporated | Capacitive sensor driving technique that enables hybrid sensing or equalization |
US9274662B2 (en) | 2013-10-18 | 2016-03-01 | Synaptics Incorporated | Sensor matrix pad for performing multiple capacitive sensing techniques |
US9495046B2 (en) | 2013-10-23 | 2016-11-15 | Synaptics Incorporated | Parasitic capacitance filter for single-layer capacitive imaging sensors |
US9081457B2 (en) | 2013-10-30 | 2015-07-14 | Synaptics Incorporated | Single-layer muti-touch capacitive imaging sensor |
US9798429B2 (en) | 2014-02-28 | 2017-10-24 | Synaptics Incorporated | Guard electrodes in a sensing stack |
US10133421B2 (en) | 2014-04-02 | 2018-11-20 | Synaptics Incorporated | Display stackups for matrix sensor |
US9927832B2 (en) | 2014-04-25 | 2018-03-27 | Synaptics Incorporated | Input device having a reduced border region |
US9690397B2 (en) | 2014-05-20 | 2017-06-27 | Synaptics Incorporated | System and method for detecting an active pen with a matrix sensor |
US10175827B2 (en) | 2014-12-23 | 2019-01-08 | Synaptics Incorporated | Detecting an active pen using a capacitive sensing device |
US10990148B2 (en) | 2015-01-05 | 2021-04-27 | Synaptics Incorporated | Central receiver for performing capacitive sensing |
US9939972B2 (en) | 2015-04-06 | 2018-04-10 | Synaptics Incorporated | Matrix sensor with via routing |
US9720541B2 (en) | 2015-06-30 | 2017-08-01 | Synaptics Incorporated | Arrangement of sensor pads and display driver pads for input device |
US9715304B2 (en) | 2015-06-30 | 2017-07-25 | Synaptics Incorporated | Regular via pattern for sensor-based input device |
US10095948B2 (en) | 2015-06-30 | 2018-10-09 | Synaptics Incorporated | Modulation scheme for fingerprint sensing |
CN205028263U (en) | 2015-09-07 | 2016-02-10 | 辛纳普蒂克斯公司 | Capacitance sensor |
US10037112B2 (en) | 2015-09-30 | 2018-07-31 | Synaptics Incorporated | Sensing an active device'S transmission using timing interleaved with display updates |
US10067587B2 (en) | 2015-12-29 | 2018-09-04 | Synaptics Incorporated | Routing conductors in an integrated display device and sensing device |
CN106933400B (en) | 2015-12-31 | 2021-10-29 | 辛纳普蒂克斯公司 | Single layer sensor pattern and sensing method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51134666A (en) * | 1975-05-16 | 1976-11-22 | Seiko Epson Corp | Electric clock |
JPS56149782A (en) * | 1980-04-22 | 1981-11-19 | Fujitsu Ltd | Method of connecting conductive pattern |
US4413257A (en) * | 1981-07-13 | 1983-11-01 | Beckman Instruments, Inc. | Conductive particle lead termination for an electro-optic display |
JPS60140685A (en) * | 1983-12-28 | 1985-07-25 | 日本写真印刷株式会社 | Filmlike electrode connector and method of producing same |
-
1986
- 1986-03-31 WO PCT/US1986/000639 patent/WO1986006551A1/en not_active Application Discontinuation
- 1986-03-31 JP JP61502023A patent/JP2524138B2/en not_active Expired - Lifetime
- 1986-03-31 EP EP86902620A patent/EP0221924A1/en not_active Ceased
- 1986-12-29 KR KR860700951A patent/KR880700482A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO1986006551A1 (en) | 1986-11-06 |
JPS62502715A (en) | 1987-10-15 |
EP0221924A1 (en) | 1987-05-20 |
JP2524138B2 (en) | 1996-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |