KR880009064A - Polyimide for Heat Resistant Adhesives - Google Patents

Polyimide for Heat Resistant Adhesives Download PDF

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Publication number
KR880009064A
KR880009064A KR870000629A KR870000629A KR880009064A KR 880009064 A KR880009064 A KR 880009064A KR 870000629 A KR870000629 A KR 870000629A KR 870000629 A KR870000629 A KR 870000629A KR 880009064 A KR880009064 A KR 880009064A
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KR
South Korea
Prior art keywords
group
polyimide
general formula
repeating unit
carbonyl groups
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Application number
KR870000629A
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Korean (ko)
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KR910000867B1 (en
Inventor
쇼오지 다마이
사부로 가와시마
요시오 소노베
마사히로 오다
히데아끼 오이가와
아끼히로 야마구찌
Original Assignee
도쯔까 야스아끼
미쯔이도오아쯔가가꾸 가부시기가이샤
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Priority to KR1019870000629A priority Critical patent/KR910000867B1/en
Publication of KR880009064A publication Critical patent/KR880009064A/en
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Publication of KR910000867B1 publication Critical patent/KR910000867B1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/40Polyesters derived from ester-forming derivatives of polycarboxylic acids or of polyhydroxy compounds, other than from esters thereof
    • C08G63/44Polyamides; Polynitriles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Abstract

내용 없음.No content.

Description

내열성 접착제용 폴리이미드Polyimide for Heat Resistant Adhesives

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도 및 2도는 본 발명의 2가지 실시예에 의한 폴리이미드의 IR흡수 스펙트럼도.1 and 2 are IR absorption spectrum diagrams of polyimide according to two embodiments of the present invention.

Claims (9)

일반식General formula (식중, 벤젠고리에 있는 2개의 카르보닐기의 위치는 메타 또는 파라이고, R은 탄소수가 2이상인 지방족기, 시클로지방족기, 단일방향족기, 축합폴리방향족기 및 방향족기가 결합 또는 상호 연결된 비축합폴리방향족기로 이루어진 군에서 선택된 4가기이다)반복유닛을 가진 폴리이미드.(Wherein the positions of the two carbonyl groups in the benzene ring are meta or para, and R is a non-condensed polyaromatic having an aliphatic group, a cycloaliphatic group, a monoaromatic group, a condensed polyaromatic group and an aromatic group bonded or interconnected with two or more carbon atoms) Polyvalent) having a repeating unit. 제1항에 있어서, R은 일반식The compound of claim 1, wherein R is a general formula 4가기인 것을 특징으로 하는 폴리이미드.It is a tetravalent polyimide. 일반식General formula (식중, 벤젠고리에 있는 2개의 카르보닐기의 위치는 메타 또는 파라이고, R은 탄소수가 2이상인 지방족기, 시클로지방족기, 단일방향족기, 축합폴리방향족기 및 방향족기가 결합 또는 상호 연결된 비축합폴리방향족기로 이루어진 군에서 선택된 4기기이다)의 반복유닛을 가진 폴리이미드의 제조방법에 있어서, 유기용매 중에서 일반식(Wherein the positions of the two carbonyl groups in the benzene ring are meta or para, and R is a non-condensed polyaromatic having an aliphatic group, a cycloaliphatic group, a monoaromatic group, a condensed polyaromatic group and an aromatic group bonded or interconnected with two or more carbon atoms) In the method for producing a polyimide having a repeating unit of four devices selected from the group consisting of: (식중, 2개의 카르보닐기의 위치는 상기와 동일하다)의 디아민을 일반식Where the two carbonyl groups have the same positions as above) (식중, R은 상기 정의와 동일하다)의 테트라카르복실산 2무수물과 반응시키고, 얻어진 일반식General formula obtained by making it react with tetracarboxylic dianhydride of (wherein R is the same as the above definition). (식중, 2개의 카르보닐기의 위치화 R은 상기 정의와 동일하다)의 반복유닛을 가진 폴리아민산을 열적 또는 화학적으로 이미드와 하는 것을 특징으로 하는 폴리이미드의 제조방법.A method for producing a polyimide, wherein the polyamine acid having a repeating unit of (wherein R is identical to the above definition) of the two carbonyl groups is thermally or chemically imide. 제3항에 있어서, R은 일반식The compound of claim 3, wherein R is a general formula 의 4가기인 것을 특징으로 하는 폴리이미드의 제조방법.Method of producing a polyimide, characterized in that the four groups of. 일반식General formula (식중, 벤젠고리에 있는 2개의 카르보닐기의 위치는 메타 또는 파라이고, R은 탄소수가 2이상인 지방족기, 시클로지방족기, 단일방향족기, 축합폴리방향족기, 및 방향족기가 결합 또는 상호 연결된 비축합폴리방향족기로 이루어진 군에서 선택된 4가기이다)의 반복유닛을 가진 폴리이미드의 내열성 접착제.(Wherein, the positions of the two carbonyl groups in the benzene ring are meta or para, and R is a non-condensed poly having an aliphatic group, a cycloaliphatic group, a monoaromatic group, a condensed polyaromatic group, and an aromatic group bonded or interconnected with two or more carbon atoms). Heat-resistant adhesive of a polyimide having a repeating unit of a tetravalent group selected from the group consisting of aromatic groups). 제5항에 있어서, R은 일반식The compound of claim 5, wherein R is a general formula 4가기인 것을 특징으로 하는 내열성 접착제.Heat resistant adhesive characterized by the above-mentioned. 일반식General formula (식중, 벤젠고리에 있는 2개의 카르보닐기의 위치는 메타 또는 파라이고, R은 탄소수가 2이상인 지방족기, 시클로지방족기, 단일방향족기, 축합폴리방향족기, 및 방향족기가 결합 또는 상호 연결된 비축합폴리방향족기 이루어진 군에서 선택된 4가기이다)의 반복유닛을 가진 폴리이미드를 기판상에 도포하고, 상기 기판의 도포면을 다른 기판의 비처리면 또는 도포면과 중첩한 후에 상기 폴리이미드의 유리전이온도 이상으로 가압 가열하는 것을 특징으로 하는 접착방법.(Wherein, the positions of the two carbonyl groups in the benzene ring are meta or para, and R is a non-condensed poly having an aliphatic group, a cycloaliphatic group, a monoaromatic group, a condensed polyaromatic group, and an aromatic group bonded or interconnected with two or more carbon atoms). Polyimide having a repeating unit of a tetravalent group selected from the group consisting of aromatic groups) is applied onto a substrate, and the coated surface of the substrate is overlapped with an untreated surface or coated surface of another substrate, and then the glass transition temperature of the polyimide is Bonding method characterized in that the pressure heating. 제7항에 있어서, 폴리이미드는 이 폴리이미드이 전물질인 일반식8. The polyimide of claim 7, wherein the polyimide is a general formula wherein the polyimide is a whole material. 의 반복유닛을 가진 폴리아민산염을 기판상에 도포한 후에, 상기 폴리아미산을 이미드화하여 제조된 것을 특징으로 하는 접착방법.The polyamic acid salt having a repeating unit of is coated on a substrate, and then the polyamic acid is prepared by imidizing the adhesion method. 제7항 또는 제8항에 있어서, R은 일반식The compound according to claim 7 or 8, wherein R is a general formula 의 4가기인 것을 특징으로 하는 접착방법.Adhesion method characterized in that the four. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019870000629A 1987-01-27 1987-01-27 Process for the preparation of polymide for heat-resistant adhesive KR910000867B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019870000629A KR910000867B1 (en) 1987-01-27 1987-01-27 Process for the preparation of polymide for heat-resistant adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870000629A KR910000867B1 (en) 1987-01-27 1987-01-27 Process for the preparation of polymide for heat-resistant adhesive

Publications (2)

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KR880009064A true KR880009064A (en) 1988-09-14
KR910000867B1 KR910000867B1 (en) 1991-02-11

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI341859B (en) * 2003-05-09 2011-05-11 Mitsubishi Gas Chemical Co Adhesive and adhesive film

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