KR880005622U - 방열판 설치용 패드 - Google Patents

방열판 설치용 패드

Info

Publication number
KR880005622U
KR880005622U KR2019860013260U KR860013260U KR880005622U KR 880005622 U KR880005622 U KR 880005622U KR 2019860013260 U KR2019860013260 U KR 2019860013260U KR 860013260 U KR860013260 U KR 860013260U KR 880005622 U KR880005622 U KR 880005622U
Authority
KR
South Korea
Prior art keywords
heat sink
mounting pad
sink mounting
pad
heat
Prior art date
Application number
KR2019860013260U
Other languages
English (en)
Other versions
KR890005042Y1 (ko
Inventor
최용한
Original Assignee
대우전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대우전자주식회사 filed Critical 대우전자주식회사
Priority to KR2019860013260U priority Critical patent/KR890005042Y1/ko
Publication of KR880005622U publication Critical patent/KR880005622U/ko
Application granted granted Critical
Publication of KR890005042Y1 publication Critical patent/KR890005042Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR2019860013260U 1986-08-30 1986-08-30 방열판 설치용 패드 KR890005042Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019860013260U KR890005042Y1 (ko) 1986-08-30 1986-08-30 방열판 설치용 패드

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019860013260U KR890005042Y1 (ko) 1986-08-30 1986-08-30 방열판 설치용 패드

Publications (2)

Publication Number Publication Date
KR880005622U true KR880005622U (ko) 1988-05-12
KR890005042Y1 KR890005042Y1 (ko) 1989-07-29

Family

ID=19255326

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860013260U KR890005042Y1 (ko) 1986-08-30 1986-08-30 방열판 설치용 패드

Country Status (1)

Country Link
KR (1) KR890005042Y1 (ko)

Also Published As

Publication number Publication date
KR890005042Y1 (ko) 1989-07-29

Similar Documents

Publication Publication Date Title
GB2195051B (en) Heat sink clip assembly
GB2193839B (en) Heat sink clip assembly
GB8711364D0 (en) Heat dissipation
GB8703778D0 (en) Bonded clip & heat sink
KR880700902A (ko) 설치대
IT1223513B (it) Radiatore
KR880005622U (ko) 방열판 설치용 패드
KR880006993U (ko) 방열판
KR900014005U (ko) 회로 소자용 방열판(Heat Sink)
KR930006379U (ko) 칩 실장장치
ES1003243Y (es) Sumidero
GB2197983B (en) Heat sink
BR6601273U (pt) Absorvente
KR880006646U (ko) 온풍기의 캐비넷 방열장치
KR840007953U (ko) 방열판의 고정장치
KR850010354U (ko) 컴퓨터의 방열팬 고정장치
IT207887Z2 (it) Coprifondo per lavandini
KR880004056U (ko) 싱크대용 오물대 지지구
KR880013652U (ko) 방열플레이트를 부착한 방열판 구조
GB8608189D0 (en) Heat sink
GB8612203D0 (en) Heat sink
GB8608190D0 (en) Heat sink
KR890023407U (ko) 방열유니트
GB8608188D0 (en) Heat sink assembly
KR890007738U (ko) 트랜지스터 방열판

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19980624

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee