KR880003779Y1 - Lead frame magazine for i.c. - Google Patents

Lead frame magazine for i.c. Download PDF

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Publication number
KR880003779Y1
KR880003779Y1 KR2019860003441U KR860003441U KR880003779Y1 KR 880003779 Y1 KR880003779 Y1 KR 880003779Y1 KR 2019860003441 U KR2019860003441 U KR 2019860003441U KR 860003441 U KR860003441 U KR 860003441U KR 880003779 Y1 KR880003779 Y1 KR 880003779Y1
Authority
KR
South Korea
Prior art keywords
lead frame
magazine
cap
frame magazine
rear plates
Prior art date
Application number
KR2019860003441U
Other languages
Korean (ko)
Other versions
KR870015446U (en
Inventor
정문술
Original Assignee
정문술
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정문술 filed Critical 정문술
Priority to KR2019860003441U priority Critical patent/KR880003779Y1/en
Publication of KR870015446U publication Critical patent/KR870015446U/en
Application granted granted Critical
Publication of KR880003779Y1 publication Critical patent/KR880003779Y1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음.No content.

Description

집적회로 리드프레임 매거진Integrated Circuit Leadframe Magazine

제1도는 본 고안의 분해사시도.1 is an exploded perspective view of the present invention.

제2도는 본 고안의 일부 횡단면도.2 is a partial cross-sectional view of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 전판 2 : 후판1: front plate 2: thick plate

5 : 삽입요홈 2 : 복착캡5: insertion groove 2: cap

본 고안은 집적회로(IC)의 제조시 각 공정간에 리드프레임(Lead Frame)을 이송시키기 위한 매거진(Magazine)에 관한 것으로, 특히 출원인의 선등록 고안의 실용신안등록 제3044호(공고번호85-2823)를 개량하여 포장시의 부피를 축소시킬 수 있도록 한것이다.The present invention relates to a magazine (Magazine) for transferring a lead frame between each process in the manufacture of integrated circuits (IC), in particular, the utility model registration No. 3044 (Notification 85- 2823) is designed to reduce the volume of packaging.

출원인의 선등록 고안인 실용신안등록 제30444호의 리드프레임 매거진은 전, 후판의 양측 표면에 상, 하로 관통된 장홈을 형성하고 복잡캡에는 삽입턱을 형성하여 장홈에 삽입턱을 끼우면 복착캡에 의해 전, 후판의 양측 개방부가 폐쇄되면서 매거진 내에 끼워진 리드프레임이 이탈되거나 쏟아지지 않도록 구성되어 있으나, 이러한 선등록 고안은 전,후판에 복착캡을 결합한 상태에서 복착캡에 형성된 삽입턱 부분이 전,후판의 외측으로 돌출되므로 매거진의 전체 부피가 커지고 따라서 포장이나 운반시 포장용적이 커지게 되는 결점이 있었다.The lead frame magazine of Utility Model Registration No. 30444, which is a pre-registered design of the applicant, forms long grooves penetrated up and down on both surfaces of the front and rear plates, and an insertion jaw is formed in the complex cap to insert the insertion jaw into the long groove by the cap. Both sides of the front and rear plates are closed so that the lead frame fitted in the magazine is not separated or spilled. However, this pre-registration design allows the insertion jaw portion formed on the cap to be attached to the front and rear plates in front and rear plates. Protruding outward, the total volume of the magazine was increased, and thus the packaging volume was increased during packaging or transportation.

본고안은 종래의 이와같은 결점을 개선하기 위한 것으로 이를 첨부된 도면에 의해 더욱 상세히 설명하면 다음과 같다.The present invention is to improve such a deficiency of the prior art described in more detail by the accompanying drawings as follows.

전, 후판(1)(2)과 상, 하판을 압출 또는 사출에 의해 일체로 성형함과 함께 전판(1)과 후판(2)의 내측벽에 서로 대향된 다수의 요홈(3) 및 돌턱(4)을 형성하고 각 돌턱(4)의 양측 단부에는 경사면(4a)을 형성한 것에 있어서, 전, 후판(1)(2)에 형성된 경사면(4a)의 내측에 수직상으로 관통된 삽입요홈(5)을 형성하여 이 삽입요홈(5)에 ㄱ자 상으로 절곡된 복착캡(6)을 삽입하여서 된것으로 도면중 미설명 부호 7은 요홈(5)에 끼워진 리드 프레임이다.The front and rear plates 1, 2 and the upper and lower plates are integrally formed by extrusion or injection, and a plurality of grooves 3 and protrusions facing each other on the inner wall of the front plate 1 and the rear plate 2 4) and an inclined surface 4a formed at both ends of each of the projections 4, the insertion recess penetrating vertically inside the inclined surface 4a formed on the front and rear plates 1, 2 ( 5) is formed by inserting the bent cap (6) bent in the A-shape in the insertion groove (5), reference numeral 7 in the drawing is a lead frame fitted in the groove (5).

이와같이 구성된 본 고안은 리드프레임(7)의 이탈방지를 위한 복착캡(6)이 전, 후판(1)(2)의 내측면에 형성된 삽입요홈(5)에 끼워져 전, 후판(1)(2)의 표면으로 돌출되지 않으므로 복착캡이 표면으로 돌출하던 종래의 것에 비해 매거진 전체의 부피가 축소되고 따라서 단위상자 내에 보다 많은 양의 매거진을 포장할 수 있게 되어 포장 및 운송비를 절감할 수 있게 되며 종래의 것에 비해 외관상으로도 양호해 지는등 효과가 있다.According to the present invention, the capping cap 6 for the separation of the lead frame 7 is inserted into the insertion recess 5 formed on the inner side of the front and rear plates 1 and 2. Since the cap does not protrude to the surface, the entire volume of the magazine is reduced compared to the conventional cap that protrudes to the surface, and thus more magazines can be packed in the unit box, thereby reducing packaging and transportation costs. Compared with, it is also effective in appearance.

Claims (1)

전판(1)과 후판(2)의 내측벽에 서로 대향된 다수의 요홈(3)과 돌턱(4)을 형성하고 각 돌턱(4)의 양측 단부에는 경사면(4a)을 형성한 것에 있어서, 전, 후판(1)(2)의 내측벽 양측에 수직으로 관통된 삽입요홈(5)을 형성하고 이 삽입요홈(5)에 ㄱ자상으로 절곡된 복잡캡(6)을 삽입하여서 된 집적회로 리드프레임 매거진.In the formation of a plurality of grooves 3 and protrusions 4 opposed to each other on the inner walls of the front plate 1 and the rear plate 2 and the inclined surfaces 4a at both ends of each of the protrusions 4, The integrated circuit lead frame is formed by forming an insertion groove 5 vertically penetrated on both sides of the inner wall of the rear plate 1 and 2 and inserting a complex cap 6 bent in an A shape into the insertion groove 5. magazine.
KR2019860003441U 1986-03-21 1986-03-21 Lead frame magazine for i.c. KR880003779Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019860003441U KR880003779Y1 (en) 1986-03-21 1986-03-21 Lead frame magazine for i.c.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019860003441U KR880003779Y1 (en) 1986-03-21 1986-03-21 Lead frame magazine for i.c.

Publications (2)

Publication Number Publication Date
KR870015446U KR870015446U (en) 1987-10-26
KR880003779Y1 true KR880003779Y1 (en) 1988-10-20

Family

ID=19249766

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019860003441U KR880003779Y1 (en) 1986-03-21 1986-03-21 Lead frame magazine for i.c.

Country Status (1)

Country Link
KR (1) KR880003779Y1 (en)

Also Published As

Publication number Publication date
KR870015446U (en) 1987-10-26

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