KR870011822A - Waterproofing Method of Printed Circuit Board (PCB) - Google Patents

Waterproofing Method of Printed Circuit Board (PCB) Download PDF

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Publication number
KR870011822A
KR870011822A KR1019860003743A KR860003743A KR870011822A KR 870011822 A KR870011822 A KR 870011822A KR 1019860003743 A KR1019860003743 A KR 1019860003743A KR 860003743 A KR860003743 A KR 860003743A KR 870011822 A KR870011822 A KR 870011822A
Authority
KR
South Korea
Prior art keywords
pcb
circuit board
printed circuit
waterproofing method
solution
Prior art date
Application number
KR1019860003743A
Other languages
Korean (ko)
Other versions
KR890003306B1 (en
Inventor
남상선
Original Assignee
대우전자 주식회사
김용원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대우전자 주식회사, 김용원 filed Critical 대우전자 주식회사
Priority to KR1019860003743A priority Critical patent/KR890003306B1/en
Publication of KR870011822A publication Critical patent/KR870011822A/en
Application granted granted Critical
Publication of KR890003306B1 publication Critical patent/KR890003306B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Abstract

내용 없음No content

Description

인쇄회로 기판(PCB)의 방수처리 방법Waterproofing Method of Printed Circuit Board (PCB)

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의하여 방수처리된 인쇄회로 기판의 한 예시 단면도.1 is a cross-sectional view of an example of a printed circuit board waterproofed according to the present invention.

제2도는 종래 방법에 의해 방수처리된 인쇄회로 기판의 예시 단면도.2 is an exemplary cross-sectional view of a printed circuit board waterproofed by a conventional method.

Claims (1)

우레탄배니쉬 용액에 부품이 조립된 PCB전체를 담가 도포하고, TR,IC 고압부등의 부품은 에폭시수지로 국부 몰딩한 다음, PCB저면을 폴리우레탄으로 도포한 뒤, 마지막으로 PCB전체를 다시 우레탄배니쉬 용액에 담가서 되는 것을 특징으로 하는 인쇄회로 기판(PCB)의 방수처리 방법.Immerse and apply the entire PCB assembled with urethane varnish solution, and parts such as TR and IC high pressure parts are locally molded with epoxy resin, and then the bottom of the PCB is coated with polyurethane, and finally the entire PCB is urethane varnish again. Waterproofing method of a printed circuit board (PCB) characterized in that it is immersed in a solution. ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is to be disclosed based on the initial application.
KR1019860003743A 1986-05-14 1986-05-14 Water proofing method for pcb KR890003306B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019860003743A KR890003306B1 (en) 1986-05-14 1986-05-14 Water proofing method for pcb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019860003743A KR890003306B1 (en) 1986-05-14 1986-05-14 Water proofing method for pcb

Publications (2)

Publication Number Publication Date
KR870011822A true KR870011822A (en) 1987-12-26
KR890003306B1 KR890003306B1 (en) 1989-09-06

Family

ID=19249942

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860003743A KR890003306B1 (en) 1986-05-14 1986-05-14 Water proofing method for pcb

Country Status (1)

Country Link
KR (1) KR890003306B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101346828B1 (en) * 2013-08-06 2014-01-03 주식회사 디에스피 A method of waterproof treatment printed circuit boards, printed circuit boards and lighting instruments using the same.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101346828B1 (en) * 2013-08-06 2014-01-03 주식회사 디에스피 A method of waterproof treatment printed circuit boards, printed circuit boards and lighting instruments using the same.

Also Published As

Publication number Publication date
KR890003306B1 (en) 1989-09-06

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