KR870004094A - Electrically conductive composition - Google Patents
Electrically conductive composition Download PDFInfo
- Publication number
- KR870004094A KR870004094A KR860009040A KR860009040A KR870004094A KR 870004094 A KR870004094 A KR 870004094A KR 860009040 A KR860009040 A KR 860009040A KR 860009040 A KR860009040 A KR 860009040A KR 870004094 A KR870004094 A KR 870004094A
- Authority
- KR
- South Korea
- Prior art keywords
- oxide
- composition
- filler
- metal
- nitride
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60-241098 | 1985-10-28 | ||
JP241098 | 1985-10-28 | ||
JP60241098A JPS62100577A (en) | 1985-10-28 | 1985-10-28 | Heat-conductive composition |
Publications (2)
Publication Number | Publication Date |
---|---|
KR870004094A true KR870004094A (en) | 1987-05-07 |
KR920009540B1 KR920009540B1 (en) | 1992-10-19 |
Family
ID=17069258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019860009040A KR920009540B1 (en) | 1985-10-28 | 1986-10-28 | Electroconductive composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS62100577A (en) |
KR (1) | KR920009540B1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0689224B2 (en) * | 1987-09-11 | 1994-11-09 | ポリプラスチックス株式会社 | Low stress encapsulant |
JP2550797B2 (en) * | 1991-04-10 | 1996-11-06 | 東レ株式会社 | Liquid crystal polymer resin composition |
EP0944098B1 (en) * | 1998-03-19 | 2005-06-01 | Hitachi, Ltd. | Thermally conductive electrical insulating composition |
JP3834528B2 (en) | 2002-07-11 | 2006-10-18 | ポリマテック株式会社 | Method for producing thermally conductive polymer molded body |
JP2004051852A (en) | 2002-07-22 | 2004-02-19 | Polymatech Co Ltd | Thermally conductive polymer molding and its production method |
JP2008050555A (en) | 2006-07-24 | 2008-03-06 | Sumitomo Chemical Co Ltd | Thermoconductive resin composition and use thereof |
US8258209B2 (en) | 2007-09-12 | 2012-09-04 | Sumitomo Chemical Company, Limited | Insulating resin composition and application thereof |
JP2010065179A (en) * | 2008-09-12 | 2010-03-25 | Sumitomo Chemical Co Ltd | Liquid crystalline polyester resin composition and molded product formed by using the same |
MY156834A (en) * | 2009-09-30 | 2016-03-31 | Polyplastics Co | Liquid-crystalline polymer and molded articles |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
KR20120114048A (en) * | 2011-04-06 | 2012-10-16 | 삼성정밀화학 주식회사 | Thermally conductive polymer composite material and article including the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4581399A (en) * | 1982-09-30 | 1986-04-08 | Celanese Corporation | Method for the melt processing of thermotropic liquid crystal polymers |
-
1985
- 1985-10-28 JP JP60241098A patent/JPS62100577A/en active Granted
-
1986
- 1986-10-28 KR KR1019860009040A patent/KR920009540B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS62100577A (en) | 1987-05-11 |
KR920009540B1 (en) | 1992-10-19 |
JPH0571630B2 (en) | 1993-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19981009 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |