KR870000781Y1 - An inserting case of integrated circuit element - Google Patents

Abstract

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Description

Storage case of integrated circuit device

1 is a stereoscopic exploded view showing an embodiment of the present disclosure.

2 is an enlarged cross-sectional view of the embodiment.

3 is an enlarged cross sectional view of another embodiment.

* Explanation of symbols for main parts of the drawings

1: pipe-shaped case body 2: cap

3: integrated circuit element 11: both end openings

12: ceiling plate 13: side plate

14: base plate 15: seat plate

16: support plate of the seat plate 31: leg portion

131: stepped shoulder 132: conductive layer

P ₁ : transparent synthetic resin P ₁ : conductive synthetic resin

The present invention relates to a storage case of an integrated circuit device, in particular, the cross-section is inverted in the shape of the letter, the inner surface of the storage case is made of a conductive material made of a conductive material in contact with the integrated integrated circuit device ( The present invention relates to a housing case of an integrated circuit device capable of preventing damage to the integrated circuit device by a magnetic action.

In the case of a conventional storage case for storing integrated circuit devices, a case of mainly extruded aluminum light alloy or synthetic resin is used.

In the case of aluminum, it is an electric conductor (hereinafter referred to as a conductor), so it is suitable for storage of integrated circuit devices, etc., but because it is opaque, the integrated circuit device stored inside cannot be seen from the outside. It is necessary to provide a long flaw in the upper surface of the main body.

Through this flaw, foreign matter such as dust enters the inside of the case from the outside, and thus has various disadvantages such as adversely affecting the function or quality of the integrated circuit device stored inside the case.

On the other hand, in the case of the extrusion molded case, there is a drawback that the electrostatic action is likely to occur, so that the integrated integrated circuit device is damaged and destroyed by the power failure.

Means of applying an antistatic agent to the synthetic resin has been taken to remedy such defects, but the damage rate due to the electrostatic action is still high, especially during air transportation, because it cannot completely prevent the electrostatic action.

Therefore, various proposals have been made to improve the shortcomings of the case of a known integrated circuit device. For example, a housing case of an integrated circuit element in which a main body is formed of a conductive plastic, a transparent plastic on the upper surface, and a cylindrical case of inverted cross section (figure No. 53-134654). And a transparent insulating synthetic resin which is subjected to an antistatic treatment on the ceiling of the case invented by the present inventor, and the other part is a molded case in which the cross-sectional shape of the cross-sectional shape extruded into a single body by the conductive synthetic resin is approximately inverted. 55-45280).

However, since these cabinet cases are susceptible to displacement of integrated circuit elements due to vibration and inclination, it is necessary to configure the whole case with conductive resins in order to keep the legs always grounded. The disadvantage is that the manufacturing price is high.

An object of the present invention is to provide a housing case capable of keeping the circuit element in a good ground state at all times by limiting the case for storing the integrated circuit element and the contactable portion of the integrated circuit element and configuring a portion thereof with a conductive material. There is.

In order to achieve the above object, the storage case of the integrated circuit device of the present invention is made of an insulating plastic ceiling with antistatic treatment, both side plate portion, bottom plate portion, the seat portion on which the integrated circuit element is placed; The cross-sectional shape in which the support plate supporting the seat plate is extruded into a single body is composed of a plastic pipe body having an approximately inverted shape, and a cap sealing the openings at both ends of the body, and sealing the upper end surface of both side plate portions. As a result, the shoulder part of the circuit element is reduced and the leg part of the mounted circuit element is limited to the shoulder part that can be contacted with the case due to the vibration and inclination of the case. Simultaneous type of conductive material ensures that the integrated circuit elements stored in the case are always kept in good ground. It is characterized in that.

Referring to the present invention in detail based on the drawings as follows. First, Figure 1 is a three-dimensional exploded view showing an embodiment of a case of the integrated circuit device of the present invention, "1" is a pipe-shaped body.

In the openings 11 at both ends of the main body 1, a cap 2 that is strictly sealed is provided to be freely attached and detached. 2 is a detailed enlarged cross-sectional view of the storage case of FIG.

The pipe-shaped main body 1 is composed of a ceiling plate 12, a side plate 13, a bottom plate 14, a seat plate 15, and a seat plate support plate 16. On the upper side of the side plate 13, a stepped shoulder portion 131 is formed by enclosing a closed refraction.

A transparent synthetic resin (P ₁₎ the sum of each of the antistatic agent, the top plate holes and that at the same time, seat plate 15 and the shoulder portion 131 is carbon, powder or the like is also a conductive synthetic resin (P ₂₎ created by holhap the conductive material The parts other than the shoulder part 131 of the other part, that is, the support plate 16, the bottom plate 14, and the both side plates 13, are usually synthetic resins, and are formed into a single body by extrusion molding in one step.

According to the above configuration, several leg portions 31 of the integrated circuit device 3 can be packaged by being placed side by side on the seat plate 15 so as to be suspended in the space between the side plates 13 and the support plate 16. have.

And during transportation, for example, even if the case 1 is very painful, the integrated circuit element mounted on the seat plate 5 is in contact with the case body 1 is limited to only the shoulder portion 131 and the seat plate 15 ( See also the part of the ring connected in FIG. 2). The integrated circuit device 3 can be kept in good ground at all times. Since the ceiling plate portion 12 is formed of a synthetic resin subjected to a transparent antistatic treatment, it is possible to clearly see the packaging state of the integrated circuit device from the outside and to secure the best sealing property.

3 is another embodiment of the present invention, the shoulder portion 131 and the seat plate 15 in the drawings are not conductive plastics made by mixing a conductive material, and are formed of a general synthetic resin as the other part and a single body, and then the conductive material therein. As the conductive layer 122 is formed by coating on the side surface, the same functional effect as in the first embodiment can be obtained. Since the present invention is constructed and operated as described above, there is no possibility of damaging the integrated circuit device stored by the electrostatic action generated in the case, and it is possible to save a considerable amount of the use of expensive conductive material than the conventional case. It can reduce the price.

Claims (1)

The cross-sectional shape in which the insulating plastic ceiling plate portion, the side plate portion, the bottom plate portion, the seat plate on which the integrated circuit elements are mounted, and the support plate portion supporting the seat plate are extruded and formed into a single body are inverted. In the case of an integrated circuit device composed of a case body of a phosphor-plastic pipe shape and a cap closing the openings at both ends thereof, the upper part of both side plates is reduced to form a shoulder portion, and at least the surface of the shoulder part and the seat plate part. The conductive circuit is formed because the conductive material is contained in the integrated circuit, characterized in that the leg portion of the circuit element on which it is placed is limited to only the conductive portion by the shoulder part. Storage case of the device. The case of the integrated circuit device according to claim 1, wherein the conductive material is incorporated into the synthetic resin of the seat plate and / or the shoulder portion and formed into a single body by extrusion molding. The case of the integrated circuit device according to claim 1, wherein the above-mentioned conductive material is applied to the inner surface side of the seat plate portion and / or the shoulder portion. The storage case of the integrated circuit device according to claim 1, wherein the above-mentioned ceiling plate portion is formed of a transparent insulating resin which is subjected to an antistatic treatment. The storage case of the integrated circuit device according to claim 1, wherein the constant cap is formed of a conductive synthetic resin.