KR860004451U - 기판에 칩형태의 회로 부품을 자동으로 장착하기 위한 장치 - Google Patents

기판에 칩형태의 회로 부품을 자동으로 장착하기 위한 장치

Info

Publication number
KR860004451U
KR860004451U KR2019850012207U KR850012207U KR860004451U KR 860004451 U KR860004451 U KR 860004451U KR 2019850012207 U KR2019850012207 U KR 2019850012207U KR 850012207 U KR850012207 U KR 850012207U KR 860004451 U KR860004451 U KR 860004451U
Authority
KR
South Korea
Prior art keywords
chips
board
circuit components
mounting circuit
automatically mounting
Prior art date
Application number
KR2019850012207U
Other languages
English (en)
Other versions
KR900000288Y1 (ko
Inventor
히로시 야기
히사시 후지다
고오다로오 하리가네
Original Assignee
데이 데이 게이 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59199309A external-priority patent/JPS6177399A/ja
Priority claimed from JP60032481A external-priority patent/JPH0770862B2/ja
Application filed by 데이 데이 게이 가부시기가이샤 filed Critical 데이 데이 게이 가부시기가이샤
Publication of KR860004451U publication Critical patent/KR860004451U/ko
Application granted granted Critical
Publication of KR900000288Y1 publication Critical patent/KR900000288Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR2019850012207U 1984-09-24 1985-09-23 기판에 칩형태의 회로 부품을 자동으로 장착하기 위한 장치 KR900000288Y1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP59199309A JPS6177399A (ja) 1984-09-24 1984-09-24 チツプ部品の自動装着機
JP?59-199309 1984-09-24
JP60-32481~5 1985-02-19
JP60032481A JPH0770862B2 (ja) 1985-02-19 1985-02-19 電子部品装着機における駆動力断続制御機構

Publications (2)

Publication Number Publication Date
KR860004451U true KR860004451U (ko) 1986-05-01
KR900000288Y1 KR900000288Y1 (ko) 1990-01-30

Family

ID=26371067

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019850012207U KR900000288Y1 (ko) 1984-09-24 1985-09-23 기판에 칩형태의 회로 부품을 자동으로 장착하기 위한 장치

Country Status (1)

Country Link
KR (1) KR900000288Y1 (ko)

Also Published As

Publication number Publication date
KR900000288Y1 (ko) 1990-01-30

Similar Documents

Publication Publication Date Title
KR860005572A (ko) 전자 부품 장착 장치
NO176079C (no) Integrert kretskort
DE3275789D1 (en) Substrate for mounting integrated circuit chips
KR900008922A (ko) 전자부품의 자동장착장치
DE3481107D1 (de) Elektronische schaltungsanordnung.
FR2596231B1 (fr) Boitier pour circuits electroniques
GB2140716B (en) Mounting apparatus for chip type electronic parts on circuit boards
PT81580B (pt) Dispositivo para arrefecimento de placas de circuitos
FR2550012B1 (fr) Dispositif a circuits integres a semi-conducteurs
GB2099225B (en) Circuit board having encapsulated wiring on component side
KR850007157A (ko) 반도체 집적 회로장치
KR850008034A (ko) 회로기판 설치장치
FR2553542B1 (fr) Circuit integre a semi-conducteurs
KR860004568A (ko) 전자 및 전기부품을 기판상에 배치하기 위한 장치
KR850009744U (ko) 프린트 배선판에 전자회로부품을 자동으로 장착하는 장치
NO174410C (no) Pakkeoppbygging for elektroniske kretser
GB8511686D0 (en) Mounting electronic part on circuit board
GB8603291D0 (en) Fixing printed circuit board on worktable
DE3472332D1 (en) Mounting of semiconductor components on a circuit board
KR860000047U (ko) 기판위에 특정한 형태의 칩을 자동적으로 장착하는 장치
KR860004451U (ko) 기판에 칩형태의 회로 부품을 자동으로 장착하기 위한 장치
KR850000170A (ko) 칩형(chip Type) 전자부품 장착기
JPS57133696A (en) Device for mounting chip part on printed circuit board
NO865294D0 (no) Anordning for manuell traadinnlegging i elektroniske kretser.
DE3472358D1 (en) Device for mounting components on circuit boards

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20000112

Year of fee payment: 11

EXPY Expiration of term