KR860004099A - Curing solution for epoxy resin - Google Patents

Curing solution for epoxy resin Download PDF

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Publication number
KR860004099A
KR860004099A KR1019840007226A KR840007226A KR860004099A KR 860004099 A KR860004099 A KR 860004099A KR 1019840007226 A KR1019840007226 A KR 1019840007226A KR 840007226 A KR840007226 A KR 840007226A KR 860004099 A KR860004099 A KR 860004099A
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KR
South Korea
Prior art keywords
curing solution
weight
curing
parts
epoxy resin
Prior art date
Application number
KR1019840007226A
Other languages
Korean (ko)
Inventor
폰 자이엘 조우킴
Original Assignee
하인리히 릭
에스카베 트로쉬트베르그 악틴엔 게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 하인리히 릭, 에스카베 트로쉬트베르그 악틴엔 게젤샤프트 filed Critical 하인리히 릭
Priority to KR1019840007226A priority Critical patent/KR860004099A/en
Publication of KR860004099A publication Critical patent/KR860004099A/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

내용 없음No content

Description

에폭시 수지용 경화용액Curing solution for epoxy resin

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (6)

a)50-90중량부의 디메틸포름아미드. b)5-50중량부의 저비점 케통 및/또는 알코올 c) a) 및 b)성분의 합을 100중량부로 할때, 5-32중량부의 디시안디아미드를 함유하는 에폭시수지용 경화용액.a) 50-90 parts by weight of dimethylformamide. b) 5-50 parts by weight of low boiling ketone and / or alcohol c) A curing solution for epoxy resins containing 5-32 parts by weight of dicyandiamide when the sum of the components a) and b) is 100 parts by weight. 제1항에 있어서, 저비점 케톤은 아세톤 및/또는 메틸에틸 케톤인 경화용액.The curing solution of claim 1, wherein the low boiling ketone is acetone and / or methylethyl ketone. 제1항 또는 2항에 있어서, 저비점 알코올은 메탄을 및/또는 에탄올 및/또는 1-메톡시-2-프로판올인 경화용액.The curing solution according to claim 1 or 2, wherein the low boiling alcohol is methane and / or ethanol and / or 1-methoxy-2-propanol. 상기의 항중 어느한 항에 잇어서, 디시안디아미드 함량에 기준하여 1-10중량%의 경화 촉진체를 함유하는 경화 용액.The curing solution according to any one of the preceding claims, containing 1 to 10% by weight of a curing accelerator based on the dicyandiamide content. 제4항에 있어서, 디시안디아미드 함량에 기준하여 2-5중량%의 경화촉진제를 함유하는 경화용액.The curing solution of claim 4 containing 2-5% by weight of a curing accelerator based on the dicyandiamide content. 제1항에 있어서 이제까지 기술되고 예시된 바와 같은 에폭시 수지용 경화용액.A curing solution for an epoxy resin as described and exemplified in claim 1. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019840007226A 1984-11-17 1984-11-17 Curing solution for epoxy resin KR860004099A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019840007226A KR860004099A (en) 1984-11-17 1984-11-17 Curing solution for epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019840007226A KR860004099A (en) 1984-11-17 1984-11-17 Curing solution for epoxy resin

Publications (1)

Publication Number Publication Date
KR860004099A true KR860004099A (en) 1986-06-18

Family

ID=55316622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007226A KR860004099A (en) 1984-11-17 1984-11-17 Curing solution for epoxy resin

Country Status (1)

Country Link
KR (1) KR860004099A (en)

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E601 Decision to refuse application