KR860000491B1 - Polyamide composition - Google Patents

Polyamide composition Download PDF

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KR860000491B1
KR860000491B1 KR1019830006355A KR830006355A KR860000491B1 KR 860000491 B1 KR860000491 B1 KR 860000491B1 KR 1019830006355 A KR1019830006355 A KR 1019830006355A KR 830006355 A KR830006355 A KR 830006355A KR 860000491 B1 KR860000491 B1 KR 860000491B1
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polyamide
additive
dispersant
hydrocarbon
mold
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KR850004972A (en
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김영덕
김재경
박경남
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동양나이론주식회사
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/11Esters; Ether-esters of acyclic polycarboxylic acids

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Abstract

Polyamide compn. having improved physical properties was prepd. from polyamide chips by blending with 0.01 - 5 wt.% salt of higher fatty acid as an additive and dispersant having chemical formula RCH2-(- OCH2CH2-)n-O-CO-R' in the amt. of 1 - 10 wt.% of the additive; where R = C16-20 hydrocarbon; R' = C12-18 hydrocarbon; and n = 5 - 25, integer.

Description

폴리아마이드 조성물Polyamide composition

본 발명은 폴리 아마이드 수지를 사용하여 성형품을 제조함에 있어서 고화속도를 빠르게 하고 금형으로부터의 이형성을 증가시키고 성형품에 발생하는 불량현상을 감소시켜서 물성을 향상시키기 위하여 첨가제와 함께 첨가제의 분산을 향상시키는 신규한 분산제를 첨가시킨을 특징으로 하는 폴리 아마이드 조성물에 관한 것이다.The present invention improves the dispersion of additives together with additives to improve physical properties by increasing the rate of solidification, increasing mold release from molds, and reducing defects in molded articles in manufacturing molded articles using polyamide resins. A polyamide composition is characterized by the addition of one dispersant.

폴리 아마이드 수지를 사용하여, 사출 성형 방볍으로 성형품을 제조할때 통상의 폴리 아마이드 수지로는 성현품의 성형시간 즉 사이클타임(Cycle time)이 길고, 금형으로 부터의 이형성이 저하하고, 성형후 제품 표면에 불량현상이 발생하여 생산성을 저하시키며, 조작한 제품이 만들어지는 등의 폐단이 있었다.When using a polyamide resin to manufacture a molded article by injection molding method, a conventional polyamide resin has a long molding time, that is, a cycle time, a releasability from a mold, and a surface of a product after molding. There was a defect such as the occurrence of defects in the product, lowering the productivity, and making the manufactured product.

사출형성에 있어서 사이클타임은 사출기 실린더 내의 재료충진시간, 금형의 캐비티(Cavity)내부로의 사출시간, 금형내에서 재료의 고화시간, 성형품의 이형을 위한 금형의 개폐시간의 합으 로 나타내어지는데, 여기서 금형의 개폐시간은 사출 성형기의 기계적 성능으로 그 한계가 주어지며 재료 충진 시간과 사출 시간은 사출성형기의 기계적 성능과 재료의 성질에 관계되며, 고화시간은 재료의 성질에 의존된다. 따라서 사이클타임을 단축시켜 생산성 향상을 고려하고자 할때 이를 좌우하는 요인은 성형물 재료의 고화시간의 단축에 있다.In injection molding, the cycle time is expressed as the sum of the material filling time in the cylinder of the injection machine, the injection time into the cavity of the mold, the solidification time of the material in the mold, and the opening and closing time of the mold for mold release. The opening and closing time of the mold is limited by the mechanical performance of the injection molding machine, the material filling time and the injection time are related to the mechanical performance of the injection molding machine and the properties of the material, and the solidification time depends on the properties of the material. Therefore, when considering the productivity improvement by shortening the cycle time, the factor that influences this is the shortening of the solidification time of the molding material.

금형으로 부터의 성형품의 이형은 성형품의 복잡도, 크기, 두께등의 요인과 재료의 성질에 관계되는 것으로 특히 복잡한 모양이나 두께가 얇은 제품의 경우 이 형성이 저하한다. 또 성형물에 발생하는 불량현상에는 충전부족, 싱크마아크(Sink Mark), 뒤로 굽은 상태(Warpage), 보이드(Void(등이 있다.Mold release from molds is related to factors such as the complexity, size, and thickness of the molded article and the properties of the material, especially in the case of complex shapes or thin products. In addition, defects occurring in moldings include insufficient filling, sink marks, warpage, voids, and the like.

종래에는 상기한 결점을 보완하기 위하여, 금형에 이형제를 스프레이(Spray)하여 준다거나, 고급 지발산 또는 염, 고급알콜, 고급 에스테르등을 첨가하는 방법에 제안되었으나 이경우 이형제의 표출 및 이로인한 표면불량 첨가제의 미분산등의 불량으로 인하여 제품의 품위가 손상되고 성형물의 물성열화, 치수안정성의 저하등을 가져왔다.Conventionally, in order to make up for the above drawbacks, it has been proposed to spray a mold release agent to a mold, or to add a high-fat Jibal acid or a salt, a higher alcohol, a higher ester, etc. Due to the poor dispersion of additives, the quality of the product is damaged, resulting in deterioration of the physical properties of the molded product and deterioration of dimensional stability.

금형에서 폴리 아마이드 사출 성형품의 고화시간을 단축시키기 위하여 폴리 아마이드 에 조핵제를 첨가하여 사출 성형품의 결정화 속도를 증가시킴으로써 사출 성형 싸이클 타임을 단축하여 생산성을 향상시키는 것은 공지의 사실이다.In order to shorten the solidification time of the polyamide injection molded article in the mold, it is known to increase the productivity by reducing the injection molding cycle time by adding a nucleating agent to the polyamide to increase the crystallization rate of the injection molded article.

이와같이 고화속도를 증가시키고 또한 이형성을 증가시키는 첨가제로서는 미합중국 특허 2856373호에 스테아린산소다의 사용방법이 기술되어 있으며, 일본 공개특허 소 55-149346호에서는 고급지방족 비스아마이드 화합물을 또한 일본 공개특허 소 57-5752호에서는 변성 에틸렌 코폴리머와 비스 아마이드를 사용하는 것을 기술하고 있다.As such additives that increase the rate of solidification and increase releasability, US Pat. No. 2856373 discloses the use of soda stearate. In Japanese Patent Laid-Open No. 55-149346, a higher aliphatic bisamide compound is also disclosed in Japanese Patent Laid-Open No. 57-149346. 5752 describes the use of modified ethylene copolymers and bisamides.

이러한 첨가제를 첨가하는 방법에는 폴리머 중합시 첨가하는 방법, 용융상태의 폴리머에 첨가하는 방법, 드라이브 랜딩(Dty Blending)하는 방법 및 마스터 배치(Master Batah)방법등이 있다.The method of adding such an additive includes a method of adding the polymer during polymerization, a method of adding to a polymer in a molten state, a drive blending method, a master batch method, and the like.

종래에 상기한 방법들을 사용하여 첨가제를 첨가하는 경우, 많은 경우에 있어서 첨가제의 분산이 균열하지 못하여 제품의 품질이 일정치 못하고 제품의 품위를 저하기키는 등의 폐단이 있었다. 이러한 폐단을 보완하기 위하여 본 발명 출원인의 한국 특허공고 82-1166호에서는 폴리 아마이드 칩에 첨가제로써 공지의 인산염 및 무기분말과 고급 지방산염을 혼합 사용할때 신규한 분산제를 첨가하는 방법을 제안한 바 있으며, 이제 본 발명에서는 고급 지방산염을 단독 사용하는 경우에 그 분산 및 이형성을 보다 개선하기 위하여 신규한 분산제를 첨가제에 대하여 1 내지 10중량% 첨가함으로써 폴리 아마이드 의 사출 성형에 있어서 용융흐름을 증가시켜 이 형성의 향상 및 표면불량의 방지를 도모하였으며 또한 기계적물성을 증가시켜 소기의 목적을 달성하였다.In the case of adding the additive by using the above-described methods in the past, in many cases, the dispersion of the additive did not crack, so that the quality of the product was not constant and the quality of the product was reduced. In order to make up for the shortcomings, Korean Patent Publication No. 82-1166 of the present applicant has proposed a method of adding a novel dispersant when mixing a known phosphate, inorganic powder and a higher fatty acid salt as an additive to a polyamide chip. Now, in the present invention, when the higher fatty acid salt is used alone, in order to further improve its dispersion and releasability, a new dispersant is added in an amount of 1 to 10% by weight based on the additive to increase the melt flow in the injection molding of polyamide. In order to improve the efficiency and prevent surface defects, the mechanical properties were also increased to achieve the desired purpose.

본 발명을 상세히 설명하면 스테아린산 소다, 스테아린산 칼슘, 스테알니산 아연, 스테아린산 알루미늄등의 고급 지방산염중의 1종을 0.01 내지 5중량%, 일반식(I)의 구조식을 가는When explaining the present invention in detail, 0.01 to 5% by weight of one of the higher fatty acid salts such as soda stearate, calcium stearate, zinc stearate, aluminum stearate, and the structural formula of general formula (I)

Figure kpo00001
Figure kpo00001

상기식에서, R : 탄소수 16 내지 20의 탄화수소 R' : 탄소수 12 내지 18의 탄화수소 n : 5내지 25의 정수이다.Wherein R is a hydrocarbon having 16 to 20 carbon atoms, R 'is a hydrocarbon having 12 to 18 carbon atoms, and n is an integer of 5 to 25.

분선재를 첨가제에 대하여 1 내지 50중량%로 하여 폴리 아마이드 수지에 드라이브 랜딩하여 첨가한 결과 사출 성형시 싸이클 타임이 단축되고 불량현상의 발현의 저하되었을 뿐만아니라 첨가제의 균일한 분산으로 표면이 양호하며, 기계적 물성의 균일성이 증가하였다.As a result of drive landing of polyamide resin with 1 to 50% by weight of additives, the cycle time is shortened during injection molding, and the appearance of defects is reduced, and the surface is good due to the uniform dispersion of additives. , The uniformity of mechanical properties is increased.

이하에 실시예를 중심으로 본 발명을 설명한다.Below, this invention is demonstrated centering on an Example.

[실시예 1, 비교예 1-2]Example 1, Comparative Example 1-2

통상의 방법으로 중합한 상대점도 2.7의 폴리 아마이드 -6,100kg에 스테아린산 칼슘150g, 일반식(1)의 분산제를 10g을 첨가하여 브랜딩한 후 용융압출하여 펠렛트를 만든 다음 이를 사용하여 60×150×10(mm)크기의 평판을 사출 성형하였다. 사출 조건은 실린다온도 230 내지 260℃, 금형온도는 80 내지 100℃로 하였다. 또한 빗금형을g이용하여 이형성을 평가하였다. 분산제를 첨가하지 않은 경우와 또는 전연 첨가하지 않은것과 대비한 실험 결과는 표-1과 같으며 성형품의 상태는 육안관측 하였다,150 g of calcium stearate and 10 g of a dispersant of the general formula (1) are added to a polyamide -6,100 kg of a relative viscosity 2.7 polymerized by a conventional method, followed by branding with melt extrusion to make pellets. A 10 (mm) size plate was injection molded. The injection conditions were a temperature of 230 to 260 ° C and a mold temperature of 80 to 100 ° C. In addition, the release property was evaluated by using a g die. The results of the experiments compared to the case where no dispersant was added or the case where no dispersant was added are shown in Table-1, and the state of the molded product was visually observed.

[표 1]TABLE 1

Figure kpo00002
Figure kpo00002

[실시예 2-3, 비교예 3-4]Example 2-3, Comparative Example 3-4

통상의 방법으로 중합한 상대점도 2.6의 폴리 아마이드 -6,100kg에 표-2와 같이 첨가제와 분산제의 양을 달리하여 실시예 1과 동일하게 평가하였다.The relative viscosity polymerized by the conventional method was evaluated in the same manner as in Example 1 by varying the amounts of the additive and the dispersant in the polyamide -6,100 kg of 2.6, as shown in Table-2.

[표 2]TABLE 2

Figure kpo00003
Figure kpo00003

Claims (1)

폴리 아마이드 칩에 공지의 고급 지방산염을 첨가제 로사용하는 방법에 있어서; 상기 고급 지방산염 첨가제를 0.01 내지 5중량%, 일반식(I)의 분산제를 첨가제의 량에 대하여 1 내지 10중량% 첨가시키는 것을 특징으로 한 폴리 아마이드 조성물.A method of using a known higher fatty acid salt as an additive in a polyamide chip; 0.01 to 5% by weight of the higher fatty acid additives, and 1 to 10% by weight of the dispersant of the general formula (I) based on the amount of the additive, polyamide composition.
Figure kpo00004
Figure kpo00004
여기에서 R : 탄소수 16 내지 20의 탄화수소 R' : 탄소수 12 내지 18의 탄화수소 n : 5 내지 25의 정수이다.Wherein R is a hydrocarbon having 16 to 20 carbon atoms, R 'is a hydrocarbon having 12 to 18 carbon atoms, and an integer of 5 to 25.
KR1019830006355A 1983-12-31 1983-12-31 Polyamide composition KR860000491B1 (en)

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