KR840005798A - Board Insulation Method - Google Patents

Board Insulation Method Download PDF

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Publication number
KR840005798A
KR840005798A KR1019830003208A KR830003208A KR840005798A KR 840005798 A KR840005798 A KR 840005798A KR 1019830003208 A KR1019830003208 A KR 1019830003208A KR 830003208 A KR830003208 A KR 830003208A KR 840005798 A KR840005798 A KR 840005798A
Authority
KR
South Korea
Prior art keywords
metal base
printed board
insulation method
hole
printed
Prior art date
Application number
KR1019830003208A
Other languages
Korean (ko)
Other versions
KR880002218B1 (en
Inventor
아끼오 야기
Original Assignee
폴리플라스틱스 가부시끼가이샤
고니시 히꼬이찌
폴리플라스틱스 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폴리플라스틱스 가부시끼가이샤, 고니시 히꼬이찌, 폴리플라스틱스 가부시기 가이샤 filed Critical 폴리플라스틱스 가부시끼가이샤
Publication of KR840005798A publication Critical patent/KR840005798A/en
Application granted granted Critical
Publication of KR880002218B1 publication Critical patent/KR880002218B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

내용 없음No content

Description

기판의 절연방법Board Insulation Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 플라스틱베이스프·린트기판의 단면도.1 is a cross-sectional view of a plastic base and lint substrate.

제2도는 금속베이스·프린트기판의 1예의 단면도.2 is a cross-sectional view of an example of a metal base printed board.

제12도는 각각 디프납땜의 다른예를 표시한 단면도.12 is a sectional view showing another example of deep soldering.

Claims (5)

금속기판위에 절연층을 개재시켜 프린트배선용 도전판을 장설하여 이루어진 금속베이스, 프린트기판에 있어서 이기판에 대하여 필요한 구멍을 설치하고 그 구멍의 내주면의 전면에 밀착하는 외주면을 가진 열가소성분자수지제의 절연체를 사출성형법에 의하여 부착하는 것을 특징으로 하는 금속베이스. 프린트기판의 절연방법.Insulator made of thermoplastic molecular resin having a metal base formed by installing an electrically conductive plate for printed wiring through an insulating layer on a metal substrate, and having an outer circumferential surface in contact with the front surface of the inner circumferential surface of the hole in a printed circuit board. Metal base, characterized in that for attaching by injection molding method. Insulation method of printed board. 제1항에 있어서, 열가소성 고분자수지제의 고분자 절연체가 그의 내부에 기판에 배치할 전자부품의 접속용단자를 통하게 하기 위한 관통구멍을 가진것을 특징으로 하는 금속베이스. 프린트기판의 절연방법.The metal base according to claim 1, wherein the polymer insulator made of a thermoplastic polymer resin has a through hole therein for allowing a connection terminal of an electronic component to be disposed on a substrate to pass therethrough. Insulation method of printed board. 제1항 또는 제2항에 있어서, 열가소성고분자수지제 절연체가 구멍의 전주 또는 수개소 또는 일부에서 계지된 것을 특징으로 하는 금속베이스, 프린트기판의 절연방법.3. The method for insulating a metal base or a printed board according to claim 1 or 2, wherein the thermoplastic polymer resin insulator is held at the electric pole, several places or a part of the hole. 제1항 내지 제3항중 어느 하나에 있어서, 사출성형시 금속베이스. 프린트기판의 주위에 밀착한 것을 특징으로 하는 금속베이스. 프린트기판의 절연방법.The metal base according to any one of claims 1 to 3, during injection molding. A metal base characterized by being in close contact with a periphery of a printed board. Insulation method of printed board. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019830003208A 1982-07-27 1983-07-14 Insolating method of printed circuits KR880002218B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP57-130645 1982-07-27
JP57130645A JPS5921094A (en) 1982-07-27 1982-07-27 Method of insulating substrate
JP130645 1982-07-27

Publications (2)

Publication Number Publication Date
KR840005798A true KR840005798A (en) 1984-11-15
KR880002218B1 KR880002218B1 (en) 1988-10-18

Family

ID=15039203

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830003208A KR880002218B1 (en) 1982-07-27 1983-07-14 Insolating method of printed circuits

Country Status (2)

Country Link
JP (1) JPS5921094A (en)
KR (1) KR880002218B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020104442A (en) * 2018-12-28 2020-07-09 株式会社マーレ フィルターシステムズ Junction structure and manufacturing method of junction structure

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576276B2 (en) * 1974-03-30 1982-02-04

Also Published As

Publication number Publication date
JPH0377680B2 (en) 1991-12-11
JPS5921094A (en) 1984-02-02
KR880002218B1 (en) 1988-10-18

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