KR840003547U - 방열판(heat sink)의 고정장치 - Google Patents

방열판(heat sink)의 고정장치

Info

Publication number
KR840003547U
KR840003547U KR2019820008825U KR820008825U KR840003547U KR 840003547 U KR840003547 U KR 840003547U KR 2019820008825 U KR2019820008825 U KR 2019820008825U KR 820008825 U KR820008825 U KR 820008825U KR 840003547 U KR840003547 U KR 840003547U
Authority
KR
South Korea
Prior art keywords
heat sink
fixing device
sink
fixing
heat
Prior art date
Application number
KR2019820008825U
Other languages
English (en)
Other versions
KR840001219Y1 (ko
Inventor
임환순
Original Assignee
삼성전자공업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자공업주식회사 filed Critical 삼성전자공업주식회사
Priority to KR2019820008825U priority Critical patent/KR840001219Y1/ko
Application granted granted Critical
Publication of KR840001219Y1 publication Critical patent/KR840001219Y1/ko
Publication of KR840003547U publication Critical patent/KR840003547U/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR2019820008825U 1982-11-05 1982-11-05 방열판(heat sink)의 고정장치 KR840001219Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019820008825U KR840001219Y1 (ko) 1982-11-05 1982-11-05 방열판(heat sink)의 고정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019820008825U KR840001219Y1 (ko) 1982-11-05 1982-11-05 방열판(heat sink)의 고정장치

Publications (2)

Publication Number Publication Date
KR840001219Y1 KR840001219Y1 (ko) 1984-07-10
KR840003547U true KR840003547U (ko) 1984-07-25

Family

ID=72147306

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019820008825U KR840001219Y1 (ko) 1982-11-05 1982-11-05 방열판(heat sink)의 고정장치

Country Status (1)

Country Link
KR (1) KR840001219Y1 (ko)

Also Published As

Publication number Publication date
KR840001219Y1 (ko) 1984-07-10

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Legal Events

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O032 Opposition [utility model]: request for opposition
O121 Withdrawal of opposition [utility model]
E701 Decision to grant or registration of patent right
O071 Decision to grant registration after opposition [utility model]: decision to grant registration
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19920626

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee