KR830004929A - Reinforcement materials for drilling printed circuit boards - Google Patents

Reinforcement materials for drilling printed circuit boards Download PDF

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Publication number
KR830004929A
KR830004929A KR1019810000133A KR810000133A KR830004929A KR 830004929 A KR830004929 A KR 830004929A KR 1019810000133 A KR1019810000133 A KR 1019810000133A KR 810000133 A KR810000133 A KR 810000133A KR 830004929 A KR830004929 A KR 830004929A
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KR
South Korea
Prior art keywords
sheets
core member
sheet
printed circuit
node portions
Prior art date
Application number
KR1019810000133A
Other languages
Korean (ko)
Other versions
KR840002168B1 (en
Inventor
피·블록 제임스
Original Assignee
린우드 에이·채프맨
엘코아 라미네이팅 컴패니 오브 어메리카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린우드 에이·채프맨, 엘코아 라미네이팅 컴패니 오브 어메리카 filed Critical 린우드 에이·채프맨
Priority to KR1019810000133A priority Critical patent/KR840002168B1/en
Publication of KR830004929A publication Critical patent/KR830004929A/en
Application granted granted Critical
Publication of KR840002168B1 publication Critical patent/KR840002168B1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214Back-up or entry material, e.g. for mechanical drilling

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)

Abstract

내용 없음No content

Description

프린트 된 회로기판을 드릴링하는데 쓰이는 보강재료Reinforcement materials for drilling printed circuit boards

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 보강재료를 도시하는 사시도, 제2도는 제1도의 2-2선을 따라 취한 횡단면도, 제3도는 제2도의 3-3선을 따라 취한 횡단면도, 제4도는 공작물을 드릴링하는데 보강재료의 사용을 도시한 입면도, 제5도는 본 발명의 보강재료의 제작을 도시하는 개략도.1 is a perspective view showing the reinforcing material of the present invention, FIG. 2 is a cross sectional view taken along line 2-2 of FIG. 1, FIG. 3 is a cross sectional view taken along line 3-3 of FIG. 2, and FIG. An elevation view showing the use of the reinforcing material, and FIG. 5 is a schematic view showing the fabrication of the reinforcing material of the present invention.

Claims (10)

프린트된 회로기판을 드릴링하는 방법에 있어서, 회로기판밑에 개방된 코어부재의 한쪽에 부착된 적어도 하나의 시트를 갖는 개방된 코어부재로 구성된 보강재료를 위치시키며, 또 드릴이 코어부재의 면적에서는 멈추도록 상기 보강판의 상기 한시트와 프린트된 회로 기판을 드릴링하는 것을 포함하는 것.A method of drilling a printed circuit board, the method comprising: positioning a reinforcing material consisting of an open core member having at least one sheet attached to one side of an open core member under the circuit board, and the drill stops at the area of the core member. Drilling the sheet and the printed circuit board of the reinforcement plate. 청구범위 1항의 방법에서, 코어부재가 끼워진 사이에서 한쌍의 상기 시트가 서로 마주보는 것.In the method of claim 1, a pair of said sheets face each other between the core members fitted. 청구범위 2항의 방법에서 보강판 시트들과 코어재료는 모두 금속재료인 것.In the method of claim 2 the reinforcement sheet sheets and the core material are both metallic materials. 청구범위 3항의 방법에 있어서 코어부재가 노드부분들은 시트들의 마주보는 가장자리들 사이에 각자 대체로 평형으로 되고, 마주보는 시트들을 바라보는 마주보는 노드 부분들도 파도치는 형태를 갖는 것.The method of claim 3 wherein the core member node portions are generally balanced between opposite edges of the sheets, and the opposite node portions facing the facing sheets also have a wavy shape. 청구범위 4항의 방법에 있어서, 노드부분들이 대체로 사인파인 것.The method of claim 4 wherein the node portions are generally sinusoidal. 청구범위 5항의 방법에 있어서, 시트들과 상기 코어부재의 재료는 약 0.005인치의 두께이며, 보강판의 전반적인 두께가 약 0.063인치되는 것.The method of claim 5 wherein the sheet and the core member material is about 0.005 inches thick and the overall thickness of the reinforcement plate is about 0.063 inches. 청구범위 2항의 방법에 있어서, 프린트된 회로와 드릴을 냉각하고 커팅을 제거하도록 코어부재를 통해 공기흐름을 제공하는 단계로 포함하는 것.The method of claim 2 comprising providing airflow through the core member to cool the printed circuit and the drill and to remove the cut. 프린트된 회로기판을 드릴링하는데 쓰이는 보강재료에 있어서, 각자 마주보는 관계에 있는 알루미늄 박판의 첫번째 및 두번째 유사시트들과, 상기 시트들 사이에 끼워진 코어부재, 상기 코어부재는 마주보는 첫번째 및 두번째 시트들을 바라보는 마주보는 노드 부분들로 된 물결치는 형태로 상기 첫번째 및 두번째에 유사한 알루미늄 박판의 네번째 시트로부터 형성되며, 노드 부분들은 상기 첫번째 및 두번째 시트들의 가장 자리들 사이에서도 대체로 평행선으로 되는, 로 구성되는 것.In the reinforcing material used to drill printed circuit boards, the first and second similar sheets of aluminum sheet, which face each other, a core member sandwiched between the sheets, the core member may be arranged to face opposite first and second sheets. Formed from a fourth sheet of aluminum sheet similar to the first and second in a waved form of facing opposite node portions, the node portions being substantially parallel between the edges of the first and second sheets. that. 청구범위 8항의 재료에 있어서, 코어부재가 사인파인 것.The material of claim 8, wherein the core member is a sine wave. 청구범위 9항의 재료에 있어서, 상기 시트들의 모든 두께가 약 0.007인치이고 상기 보강재료 전체의 두께가 약 0.093인치인 것.The material of claim 9 wherein all of the sheets have a thickness of about 0.007 inches and a total thickness of the reinforcing material is about 0.093 inches. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019810000133A 1981-01-19 1981-01-19 Bookup material for use in dilling printed circuit boards KR840002168B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019810000133A KR840002168B1 (en) 1981-01-19 1981-01-19 Bookup material for use in dilling printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019810000133A KR840002168B1 (en) 1981-01-19 1981-01-19 Bookup material for use in dilling printed circuit boards

Publications (2)

Publication Number Publication Date
KR830004929A true KR830004929A (en) 1983-07-20
KR840002168B1 KR840002168B1 (en) 1984-11-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810000133A KR840002168B1 (en) 1981-01-19 1981-01-19 Bookup material for use in dilling printed circuit boards

Country Status (1)

Country Link
KR (1) KR840002168B1 (en)

Also Published As

Publication number Publication date
KR840002168B1 (en) 1984-11-26

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