KR800000520B1 - Method for manufacturing electronics lead - Google Patents

Method for manufacturing electronics lead Download PDF

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Publication number
KR800000520B1
KR800000520B1 KR7900474A KR790000474A KR800000520B1 KR 800000520 B1 KR800000520 B1 KR 800000520B1 KR 7900474 A KR7900474 A KR 7900474A KR 790000474 A KR790000474 A KR 790000474A KR 800000520 B1 KR800000520 B1 KR 800000520B1
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South Korea
Prior art keywords
alloy
lead wire
lead
layer
copper
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KR7900474A
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Korean (ko)
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황성박
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황성박
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Details Of Resistors (AREA)

Abstract

A method of preventing the natural oxidization of the lead surface and developing the tensile stress is speciallized that a lead is coated with the Sn-Pb mixed alloy(50 to 50) around the lead(1) of cu or Cu alloy to increase the selfmalleability and coated afterwards with 100 % pure Sn(3) having 1-2 μm depth on the surface(2) to prevent from exposing an easily oxidizable Pb in the air.

Description

전자부품용 리드선 제조방법Manufacturing method of lead wire for electronic parts

제1도는 본 발명의 리드선 구성단면도.1 is a cross-sectional view of the lead wire configuration of the present invention.

제2도는 종래의 리드선 구성단면도.2 is a cross-sectional view of a conventional lead wire configuration.

본 발명은 저항소자 등과 같은 전자부품에 사용되는 리드선(load 端子) 제조방법에 관한 것으로, 특히 리드선 표면의 자연 산화현상을 방지하고 인장력이 매우 우수한 리드선을 제공하여 그 수명과 작업성을 향상시킬 수 있도록 한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing lead wires used in electronic parts such as resistors, and the like, in particular, to prevent natural oxidation of the surface of lead wires and to provide lead wires with excellent tensile strength, thereby improving their life and workability. It would be.

종래에는 제2도에 도시된 바와 같이 동선 주위에 Sn과 Pb를 6:4의 비율로 혼합한 Sn-Pb 합금을 동선의 외주벽에 피복하는 방법의 구성으로 각종 반도체소자에 사용되는 리드선을 제조하여 왔으나, 이와 같은 구성방법의 리드선을 Sn-Pb 합금의 산화성이 강한 Pb 성분이 그대로 대기 중에 노출되어 자연산화율이 매우 높았기 때문에 그 수명이 짧은 결함이 있었을 뿐만 아니라 리드선의 표면에 검은색의 산화막이 형성되게 되므로서 제품의 외관이 크게 손상되는 결함이 나타나게 되었고, 또한 상기와 같은 종래의 리드선의 표면 내열온도가 180℃ 이내로 매우 낮아 이를 저항소자 등과 같은 전자부품에 사용하여 소성 건조시키는 작업 중에 리드선이 건조열을 이겨내지 못하고 용절(溶切)되는 사례가 자주 발생하게 되므로서 저항소자 등과 같은 전자부품의 제조가 매우 까다로운 결함도 함께 지니게 되었다.Conventionally, as shown in FIG. 2, a lead wire used in various semiconductor devices is manufactured by a method of coating a Sn-Pb alloy containing Sn and Pb in a ratio of 6: 4 around a copper wire on the outer circumferential wall of the copper wire. However, the lead wire of such a constituent method was exposed to the air as the Pb component of the Sn-Pb alloy with high oxidizing property was exposed to the air as it was, so that there was not only a short lifetime but also a black oxide film on the surface of the lead wire. As a result of this, defects in which the appearance of the product is greatly damaged appear, and the surface heat temperature of the conventional lead wire is very low, within 180 ° C. Manufacturing of electronic parts, such as resistance elements, is often caused by the fact that they are often melted down without being able to withstand this drying heat. Also had a very tricky flaw.

본 발명은 상기와 같은 종래 리드선의 결함을 해소하기 위하여 동(copper) 또는 동합금(copper alloy)의 도선 외주면에 Sn과 Pb를 5:5로 혼합한 Sn-Pb 합금을 피막한 다음, 이의 전외주 표면에 두께 1-2μ정도로 순수한 100% Sn층을 재차 피막하여 Sn-Pb 합금의 산화성이 강한 Pb 성분이 대기 중에 노출되는 사례를 방지하여 내산화성을 한층 강화시켜 주므로서 리드선이 대기 중에서 자연산화되어 부식되는 사례를 제거하여 그 수명을 월등히 연장시킬 수 있음과 아울러, 5-5 비율의 Sn-Pb 합금 피막층 전외주표면에 Sn층을 재차 피막하여 리드선 자체의 강도가 변화됨이 없이 그 표면내열온도를 240℃까지 상승시켜 주므로서 저항소자 등과 같은 전자부품의 소성, 건조작업시나 프린트기판상에 리드선을 용착시키는 과정에서 리드선이 용절되는 등의 폐단이 전혀 발생하지 않아 제조 및 용접 중의 작업성을 현저히 향상시킬 수 있도록 한 것으로 이를 첨부한 도면 및 실시예에 따라 더욱 상술하면 다음과 같다.The present invention is coated with a Sn-Pb alloy mixed with Sn and Pb 5: 5 on the outer circumferential surface of copper or copper alloy in order to eliminate the defects of the conventional lead wire as described above, then By coating a 100% pure Sn layer with a thickness of 1-2μ on the surface again, the oxidation resistance Pb component of Sn-Pb alloy is prevented from being exposed to the air, which further enhances oxidation resistance. By eliminating the cases of corrosion, the service life can be prolonged, and the Sn-Pb alloy coating layer on the outer and outer peripheral surfaces of the 5-5 ratio is again coated with a Sn layer to maintain the surface heat resistance temperature without changing the strength of the lead wire itself. By raising the temperature to 240 ° C, no closed ends such as lead wires are melted during firing and drying of electronic parts such as resistance elements or during welding of lead wires on a printed board. Ah With further described according to the drawings and the embodiments to be attached to that one to be able to significantly improve the workability during production and welding as follows.

[실시예]EXAMPLE

동(copper) 또는 동합금(copper alloy)등의 도선(1) 외주 표면에 Sn과 Pb를 5:5 비율로 혼합한 Sn-Pb 합금층(2)을 도착 피막한 다음, Sn-Pb 합금층(2) 전외주 표면에 1-2μ의 두께의 100% Sn층(3)을 재차 피막하여서 본 발명의 리드선(4)을 제조하는 것이다.A Sn-Pb alloy layer 2 containing Sn and Pb in a 5: 5 ratio is deposited on the outer circumferential surface of the conductor 1 such as copper or copper alloy, and then Sn-Pb alloy layer ( 2) The lead wire 4 of this invention is manufactured by coating the 100% Sn layer 3 of 1-2 micrometer thickness again on the outer periphery surface.

이와 같은 실시예에 의한 본 발명은 동 또는 동 합금 등의 도선(1)의 굵기나 Sn-Pb 합금층(2)의 도착 피막두께는 리드선의 용량이나 용도에 따라 변화될 수 없는 것이나, 동 또는 동합금 등의 도선(1)의 외주면에 도착 피막하는 Sn-Pb 합금층(2)의 혼합비는 Sn:Pb를 5:5로 동량으로 하고, 이후 Sn-Pb 합금층(2) 전외주표면에는 도선(1)의 굵기에 관계없이 균일하게 1-2μ 두께의 100% Sn층(3)을 피막하여 본 발명을 완성하는 것이다.According to the present invention according to this embodiment, the thickness of the conductive wire 1, such as copper or copper alloy, or the thickness of the arrival film of the Sn-Pb alloy layer 2 cannot be changed depending on the capacity or use of the lead wire. The mixing ratio of the Sn-Pb alloy layer 2 to be coated on the outer circumferential surface of the conductive wire 1, such as copper alloy, is the same amount of Sn: Pb 5: 5, and then the conductive wire is formed on the outer circumferential surface of the Sn-Pb alloy layer 2 Irrespective of the thickness of (1), a 100% Sn layer 3 having a thickness of 1-2 µ is uniformly coated to complete the present invention.

이와 같은 구성방법의 본 발명은 동 또는 동합금 등의 도선(1) 외주표면에 Sn과 Pb를 5:5의 비율로 혼합한 Sn-Pb 합금층(2)을 1차로 도착 피막하여 리드선(4) 자체의 연성을 한층 부여하여 준 다음, 이에 다시 상기 Sn-Pb 합금층(2)의 산화성이 강한 Pb 성분이 대기 중에 노출되지 않게 1-2μ 두께의 100% Sn층(3)의 미세막을 재차 피복하여 Sn-Pb 합금층(2)의 Pb 성분과 대기와를 완전 차단시켜 주므로서 리드선(4)의 표면이 대기 중에서 용이하게 산화되는 현상을 완벽하게 제거할 수 있어 그 수명을 현저히 증가시켜 줄 뿐만 아니라, 종래의 것에 비하여 리드선(4) 표면의 내열온도를 1-2μ 두께의 100% Sn층(3)에 의하여 240℃까지 상승시켜 주므로서, 본 발명의 리드선(4)을 프린트 기판상에 용착시킬 때나 본 발명의 리드선을 사용한 저항소자 등과 같은 전자부품의 소성 건조작업시 리드선(4)이 용절되는 사례를 배제하여 주어 취급 및 용접 등의 작업을 한층 용이하게 행할 수 있기 때문에 작업능률을 한층 향상시킬 수 있는 특징을 지니는 리드선을 제공할 수 있는 것이다.According to the present invention of the above construction method, the Sn-Pb alloy layer 2 containing Sn and Pb in a ratio of 5: 5 on the outer circumferential surface of copper or copper alloy is first arrived and coated on the lead wire 4. After further providing its ductility, the microfilm of the 100% Sn layer 3 having a thickness of 1-2 µ is again coated so that the highly oxidizing Pb component of the Sn-Pb alloy layer 2 is not exposed to the air. By completely blocking the Pb component of the Sn-Pb alloy layer (2) and the atmosphere, the phenomenon that the surface of the lead wire (4) is easily oxidized in the air can be completely eliminated, not only increases the service life significantly However, compared with the conventional one, the heat resistance temperature of the surface of the lead wire 4 is increased to 240 ° C. by the 100% Sn layer 3 having a thickness of 1-2 μ, thereby welding the lead wire 4 of the present invention onto the printed board. Or plastic firing of electronic parts such as resistance elements using the lead wire of the present invention. When it in the lead wire (4) is given by Since the case is excluded yongjeol can be more easily carried out operations, such as handling and welding to provide a lead wire having a characteristic that may further improve the work efficiency.

Claims (1)

도면에 표시하고 본문에 상술한 바와 같이, 동 또는 동합금 등의 도선(1) 외주표면에 Sn과 Pb를 5:5의 비율로 혼합한 Sn-Pb 합금층(2)을 도착 피복한 다음, Sn-Pb 합금층(2) 전외주 표면에 1-2μ의 두께의 100% Sn층(3)을 재차 피복함을 특징으로 하는 전자부품용 리드선 제조방법.As shown in the drawings and described above in the text, the Sn-Pb alloy layer 2 containing Sn and Pb in a ratio of 5: 5 is coated on the outer circumferential surface of the conductive wire 1 such as copper or copper alloy, and then Sn -Pb alloy layer (2) A method for manufacturing a lead wire for an electronic component, characterized by re-coating a 100% Sn layer (3) having a thickness of 1-2 탆 on the entire outer circumferential surface.
KR7900474A 1979-02-15 1979-02-15 Method for manufacturing electronics lead KR800000520B1 (en)

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KR7900474A KR800000520B1 (en) 1979-02-15 1979-02-15 Method for manufacturing electronics lead

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KR7900474A KR800000520B1 (en) 1979-02-15 1979-02-15 Method for manufacturing electronics lead

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KR800000520B1 true KR800000520B1 (en) 1980-06-12

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