KR20240108989A - Smart ring and manufacturing method for smart ring - Google Patents

Abstract

A smart ring and a method of manufacturing the smart ring are disclosed. The smart ring of the present invention has the ring shape of a smart ring and includes an outer cover part 100 that accommodates a sensor/communication module, and a sensor module that is accommodated in the outer cover part 100 and detects the biological signals of the smart ring user. A sensor/communication module 200, an inner molded part 300 having a hole of a preset shape into which the smart ring user's finger is inserted, the outer cover part 100, and a sensor/communication module 200 are combined to form a ring-shaped outer cover part and a sensor/communication module combination, and the inner surface molding part 300 fills the entire inner area of the ring-shaped combination with a molding member and then is placed in the center of the filled molding member. It is characterized in that it is formed by cutting and processing holes of a preset shape.

Description

Smart ring and manufacturing method of smart ring {SMART RING AND MANUFACTURING METHOD FOR SMART RING}

The present invention relates to a smart ring, and more specifically, to a smart ring that measures various activities or conditions of the body using a sensor module and a method of manufacturing the smart ring.

People in modern society are more interested in their health than ever as average lifespan increases. This interest is breaking the stereotype that you should only see a doctor when you are sick, and is leading to the invention of devices that can help you manage your health on a regular basis.

The above-mentioned devices, commonly called wearable devices, are devices that emphasize portability and can be freely worn on the body like clothes, watches, or glasses. These wearable devices include smart glasses, smart watches, and ring-shaped wearable devices. etc.

Among these, US Patent US9861314B2, which is a prior art related to ring-shaped wearable devices, discloses “Wearable electronic devices and manufacturing methods thereof.”

This prior art provides a molded body of a moldable ceramic material including at least one cavity having a depth disposed on an inner side, an outer side, and an inner side, and an electronic device disposed within the cavity and having a thickness less than the depth of the cavity. A method of manufacturing a smart ring is disclosed in which a coating of an epoxy material is formed along the inner surface of the smart ring to cover the electronic components and cavities on the inner surface of the body molded using the molding device and molding method of the prior art. there is.

A smart ring manufactured according to a prior art manufacturing method using the above-described prior art molding system implements a predetermined inner shape and size of the smart ring according to the fixed shape and size of the inner surface of the already molded body.

Accordingly, in the case of the structure and smart ring manufacturing method of the prior art, including the manufacturing method of the prior art, the circuit components may be changed or relocated, or a protrusion such as a sensor may be formed on the inner side of the smart ring. If the position needs to be changed, or if the inner shape and size of the smart ring need to be changed according to other design intentions, the molding device required to create a new body with a different inner shape and size is required. Each molded part, such as a mold, and its settings must be prepared in multiple quantities according to different inner shapes and sizes. Accordingly, the structure of the smart ring and the manufacturing method of the smart ring in the prior art, including the manufacturing method in the prior art, have a problem in meeting various requirements regarding the inner shape and size of the smart ring.

In addition, in order to implement smart rings with inner surfaces of various shapes and sizes using the structure and smart ring manufacturing method of the prior art, including the manufacturing method of the prior art, the number of facilities such as molds and coating devices increases proportionally. And, because additional time is required for individual settings, the development and production time and cost of smart rings of various shapes and sizes increase.

Furthermore, when an epoxy material molding is formed along the inner surface of a smart ring using a conventional smart ring manufacturing method including a prior art manufacturing method and a molding device used therefor, the surface condition of the molded portion on the inner surface of the molding device As the transparency of the inner surface of the smart ring is determined, there is a limit to transparency control, and a separate polishing process is required to make the surface of the product beautiful. Accordingly, the quality of the product deteriorates or the production process becomes complicated and inefficient.

Furthermore, when molding of epoxy material is formed along the inner surface of the smart ring using the conventional molding device and molding method as shown in FIG. 11, the area of the epoxy injection portion, which usually serves as an outlet for bubbles generated in the injected epoxy, Because these bubbles are small, it takes a long time to remove them or they cannot be sufficiently removed, which causes the quality of the product to deteriorate.

US registered patent US9861314B2 (2018. 01. 09.)

Therefore, the present invention solves the problems of the prior art and provides a new smart ring that meets various needs regarding the inner shape and size of the smart ring and reduces the development and manufacturing time and cost of smart rings of various shapes and sizes. Accordingly, a manufacturing method is provided.

In addition, depending on the embodiment, it is easy to adjust the overall transparency of the inner surface of the smart ring and the transparency of a portion of the inner surface, thereby improving the quality of products related to transparency and streamlining the production process. To provide a ring and a manufacturing method therefor.

In addition, depending on the embodiment, it is easy to adjust the overall transparency of the inner surface of the smart ring and the transparency of a portion of the inner surface, so the signal or light required for the sensor module to detect the biological signal of the smart ring user only by surface treatment of the inner surface. The purpose is to provide a smart ring with a new structure and a manufacturing method that can improve the accuracy of bio-signal detection of the sensor module and streamline the related production process by enabling precise processing of the part that passes through.

Furthermore, depending on the embodiment, the purpose is to provide a smart ring with a new structure that shortens the removal time and enables sufficient removal of air bubbles included in the molding when forming the inner surface of the smart ring, and to provide a manufacturing method for the same. .

In one aspect, the present invention relates to a smart ring. The outer cover part 100 has the ring shape of a smart ring and accommodates a sensor/communication module, and is accommodated in the outer cover part 100 to detect the smart ring user's biological signals. A sensor/communication module 200 including a sensor module, an inner molded portion 300 having a hole of a preset shape into which the smart ring user's finger is inserted, the outer cover portion 100, and the sensor/ The communication module 200 is combined to form a ring-shaped outer cover part and a sensor/communication module combination, and the inner surface molding part 300 is filled with a molding member in the entire inner area of the ring-shaped combination body, and then filled. It is characterized in that it is formed by cutting a hole of a preset shape in the center of the molding member.

Preferably, the outer cover portion 100 includes an outer cover body 110 having a ring shape, an upper flange 120 provided at the upper end of the outer cover body 110, and the outer cover body 110. It includes a lower flange 130 provided at the lower end, and forms a ring-shaped receiving space surrounded by the outer cover body 110, the upper flange 120, and the inner surface of the lower flange 130, and the ring-shaped The sensor/communication module 200 is accommodated and combined in the space.

Here, the sensor/communication module 200 is manufactured in a ring shape corresponding to the ring-shaped receiving space surrounding the inner surfaces of the upper flange 120 and the lower flange 130, and the outer cover body 110 ) and the upper flange 120 and the lower flange 130 are preferably accommodated and combined in a ring-shaped space surrounding the inner surface.

In addition, here, the sensor/communication module 200 includes a base body 211 having a semicircular shape, one side of which is coupled to the base body 211, and the other side of which includes a plurality of PCB assemblies 215a, 215b, and 215c. A connecting portion 212 that has a semicircular shape but is thinner than the base body 211, a plurality of PCB assemblies 215a, 215b, and 215c, one side of which is coupled to the connecting portion 212, and a PCB assembly 215a, It is preferable to include a bending member 216 connecting between 215b and 215c, and a connecting member having one side coupled to the base body 211 and the other side coupled to a plurality of PCB assemblies 215a, 215b, and 215c.

Also, preferably, the outer cover part 100 includes a position guide 140 that guides the outer cover part 100 to be placed in a set position of the molding device 400.

Furthermore, preferably, the molding member forming the inner side molding portion 300 is a hardened transparent thermosetting plastic.

Here, the entire or part of the wall of the hole created by cutting and processing the inner surface of the inner surface molding part 300 has a sensing window, which is a part through which the signal or light required for the sensor module to detect the biological signal of the smart ring user passes through. (330) is preferably formed.

Here, the sensing window 330 is preferably a part whose transparency is improved by a clear coating layer at a corresponding position of the sensor module on the inner surface of the inner surface molded part 300.

Also, preferably, the sensor module includes a photoplethysmography sensor, and the sensing window 330 is cleared at a position corresponding to the position of the light emitting unit and the light receiving unit of the photoplethysmography sensor as the corresponding position of the sensor module. It is a transparent or translucent part that is coated and has improved transparency.

In another aspect, the present invention relates to a method of manufacturing a smart ring, which includes an outer cover part processing process (S110) of manufacturing the outer cover part 100 that has the ring shape of a smart ring and accommodates a sensor/communication module; A sensor/communication module manufacturing process (S120) for manufacturing a sensor/communication module 200 including a sensor module that detects biological signals of a smart ring user; An outer cover part and sensor/communication module combination manufacturing process for accommodating the sensor/communication module 200 inside the ring shape of the outer cover part 100 to form a ring-shaped outer cover part and sensor/communication module combination. (S200); An inner surface molding part processing process (S300) for creating an inner surface molding part 300 having a hole of a preset shape into which the smart ring user's finger is inserted inside the ring-shaped outer cover part and the sensor/communication module combination (S300) ; And a clear coating process (S400) of performing clear coating on the inner surface of the inner surface molding part 300 to form a clear coating layer. Including, the inner surface molding part processing process (S300) includes the ring-shaped assembly. After filling the entire inner area of the molding member, a hole of a preset shape is cut in the center of the filled molding member to create the inner side molding portion 300.

Preferably, the inner surface molding part processing process (S300) involves injecting and curing a molding member into the entire inner region of the ring-shaped combination of the outer cover part and the sensor/communication module, and injecting/curing the molding member to remove the molding device. Process, a horizontal cutting process of cutting a molding member protrusion protruding from at least one of the upper or lower surfaces of a ring-shaped combination of a sensor/communication module filled with a hardened molding member throughout the inner region, and molding the entire inner region without a protrusion. It includes a vertical cutting process of machining a hole of a preset shape in the center of the filled molding member of the ring-shaped combination of the sensor/communication module.

Also preferably, the molding member of the inner side molding part 300 is made of transparent thermosetting plastic, and the clear coating process (S400) is performed so that the transparency is adjusted on the entire or part of the inner side of the inner side molding part 300. Clear coating is performed to form a sensing window 330, which is a transparent or translucent part through which the position corresponding part of the sensor module passes signals or light necessary to detect biological signals.

According to the present invention as described above, a new structure of a smart ring and smart ring that satisfies various demands regarding the inner shape and size of the smart ring and reduces the development and manufacturing time and cost of smart rings of various shapes and sizes. Manufacturing methods can be provided.

According to the new structure of the smart ring and the manufacturing method of the smart ring of the present invention, the entire inner ring area of the combination of the ring-shaped outer cover portion 100 and the sensor/communication module 200 is filled with a molding member, and then the filled molding is performed. Since the inner molding part 300 is created by machining a hole of a preset shape in the center of the member, the inner shape and shape of various smart rings can be formed through the inner molding part processing process including a simple cutting process without changing the molding device. It has the effect of enabling implementation of any size.

In addition, according to the new structure of the smart ring and the smart ring manufacturing method of the present invention, it is easy to control the overall transparency of the inner surface of the smart ring and the transparency of a portion of the inner surface, thereby improving the quality of products related to transparency. , has the effect of streamlining the production process.

Depending on the embodiment, the sensor module emits signals or light necessary to detect the biometric signals of the smart ring user by improving the transparency of the entire or partial inner surface of the smart ring through surface treatment of the inner surface, such as clear coating. It is possible to precisely process the part through which it passes, which has the effect of improving the accuracy of the sensor module's detection of biological signals and streamlining the related production process.

In addition, depending on the embodiment, it is possible to precisely adjust transparency and the area to which transparency control is applied by adjusting the composition of the clear coating liquid and masking to improve transparency.

Figure 1 is a perspective view showing a smart ring according to an embodiment of the present invention.
Figure 2 is a perspective view showing a smart ring of another embodiment of the present invention.
Figure 3 is an exploded perspective view of a smart ring according to an embodiment of the present invention.
Figure 4 is a flowchart of a method for manufacturing a smart ring according to an embodiment of the present invention.
Figure 5 is a diagram for explaining an embodiment of the inner molding part processing process (S300) of the present invention.
Figure 7 is a diagram for explaining an embodiment of the clear coating process (S400) of the present invention.
Figure 8 is a diagram for explaining another embodiment of the clear coating process (S400) of the present invention.
Figure 8 is a perspective view schematically showing a molding device used for manufacturing smart rings in embodiments of the present invention.
Figure 9 is an exploded perspective view of the molding device of Figure 8.
Figure 10 is a cross-sectional view of the molding device of Figure 9;
Figure 11 is a diagram of a molding device in the prior art.

Hereinafter, specific details for carrying out the present invention will be described based on examples with reference to the drawings. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different from one another but are not necessarily mutually exclusive. For example, specific shapes, structures and characteristics described herein with respect to one embodiment may be implemented in other embodiments without departing from the spirit and scope of the invention. Additionally, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Accordingly, the detailed description that follows is not intended to be taken in a limiting sense, and the scope of the invention is limited only by the appended claims, together with all equivalents to what those claims assert if properly described. Similar reference numbers in the drawings refer to identical or similar functions across various aspects.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, in order to enable those skilled in the art to easily practice the present invention, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a perspective view showing a smart ring according to an embodiment of the present invention, Figure 2 is a perspective view showing a smart ring according to another embodiment of the present invention, and Figure 3 is an exploded perspective view of a smart ring according to an embodiment of the present invention.

Referring to Figures 1 to 3, the smart ring 1 of the present invention has the ring shape of a smart ring and includes an outer cover part 100 that accommodates a sensor/communication module, and a sensor module that detects the biological signals of the smart ring wearer. A sensor/communication module 200 including a ring-shaped outer cover portion 100, and an inner surface having a hole of a preset shape into which the smart ring user's finger is inserted inside the combination of the sensor/communication module 200. The molding unit 300 has a basic configuration.

The outer cover part 100 and the sensor/communication module 200 are combined to form a ring-shaped outer cover part and sensor/communication module combination, and the inner surface molding part 300 is an inner surface of the ring-shaped combination body. After filling the entire area with a molding member, it is formed by cutting a hole of a preset shape in the center of the filled molding member.

The molding member forming the inner side molding portion 300 may be made of a hardened, transparent thermosetting plastic material.

A sensing window is formed on the inner surface of the inner molding part 300 through which the sensor module 214 passes signals or light necessary to detect the smart ring user's biological signals. The sensing window 330 is a part whose transparency is improved by a clear coating layer at a corresponding position of the sensor module on the inner surface of the inner surface molding part 300.

The sensor module includes a photoplethysmography sensor, and the sensing window 330 is a transparent position corresponding to the sensor module, and the position corresponding to the light emitting unit and the light receiving unit of the photoplethysmography sensor is clear-coated to improve transparency. Or it may be a translucent part.

In the case of the embodiment of Figure 1, the entire inner surface molding part 300 is transparent to form a sensing window 330, and the embodiment of Figure 2 is an embodiment of the sensor module (on the inner surface of the inner surface forming part 300). This is an embodiment in which only the position corresponding portion of 214) is transparent to form the sensing window 330.

In this embodiment, the outer cover portion 100 may be made of a metal material including titanium or medical stainless steel.

However, depending on the embodiment, it is not limited to metal materials and may be manufactured from various materials such as ceramic, plastic, and wood, and an appropriate known processing method may be selected and used depending on the material.

Referring to FIG. 3, the outer cover part 100 includes an outer cover body 110 having a ring shape, an upper flange 120 provided at the upper end of the outer cover body 110, and the outer cover body 110. It includes a lower flange 130 provided at the lower end. Processed to form a ring-shaped receiving space surrounding the outer cover body 110 and the inner surfaces of the upper flange 120 and lower flange 130, and the sensor/communication module 200 is accommodated in the ring-shaped space. and are combined.

In this embodiment, the outer cover part 100 further includes a position guide 140 that guides the molding device 400 to be placed in a set position, which will be described later. The position guide 140 of the outer cover part 100 guides the outer cover body 110 to be placed in the set position of the molding device 400, thereby improving process accuracy and efficiency in the inner molding part processing process. Product quality can be improved by improving and reducing the defect rate.

A sensor/communication module 200 is manufactured including a sensor module that detects the biological signals of the smart ring user. In this embodiment, a plurality of PCB assemblies are installed with electronic circuits such as the sensor module 214, battery, and other communication modules. It is manufactured by connecting (215a, 215b, 215c) with a bending member (156).

In this embodiment, the sensor module 214 includes a photoplethysmography sensor and can measure blood flow information of the wearer of the smart ring, and can measure biometric information such as heart rate and oxygen saturation through blood flow information. there is.

Referring to FIG. 4, the detailed configuration of the sensor/communication module 200 manufactured in this embodiment may be comprised of a sensing/communication unit 210 and an attachment unit 220, and may further include a bracket unit 230. You can.

As shown in FIG. 4, the sensor/communication module 200 can be accommodated and combined at once in a ring-shaped space surrounding the outer cover body 110 and the inner surface of the upper flange 120 and lower flange 130. may be manufactured in a ring shape corresponding to the ring-shaped receiving space surrounding the inner surfaces of the upper flange 120 and the lower flange 130. In the sensor/communication module manufacturing process (S120) of the component preparation process (100), each component part described later is combined to produce a ring shape that can be accommodated in the ring-shaped accommodation space.

To this end, the sensing/communication unit 210 has a base body 211 having a semicircular shape, one side of which is coupled to the base body 211, and the other side of which is coupled with a plurality of PCB assemblies 215a, 215b, and 215c. A connection portion 212 that is thinner than the base body 211, a plurality of PCB assemblies 215a, 215b, and 215c on one side of which are coupled to the connection portion 212, and a connection between the PCB assemblies 215a, 215b, and 215c. It includes a bending member 216 that connects and a connecting member on one side of which is coupled to the base body 211 and on the other side of which is coupled to a plurality of PCB assemblies (215a, 215b, 215c), and a plurality of PCB assemblies (215a, In 215b and 215c), a sensor module 214, a battery, a communication module and other necessary electronic circuits are disposed. In this embodiment, the sensor module 214 is installed on the central PCB assembly 215b and includes a photoplethysmography sensor that uses light to measure heart rate or oxygen saturation in body parts through which arteries pass, such as fingertips.

In this embodiment, it further includes a bracket part 230 coupled to the connection part 212 and the connection member 213, and the bracket part 230 includes a plurality of PCB assemblies 215 and a sensor module 214 installed thereto, It protects the battery and communication module and allows multiple PCB assemblies (215a, 215b, 215c) to be installed in the correct location.

As shown in FIG. 3, the attachment portion 220 of the sensor/communication module 200 is attached to the inner wall of the sensing/communication portion 210 and attaches the sensor module 214 of the plurality of PCB assemblies 215, the battery, An inner attachment member 221 that protects the communication module and other required electronic circuits, and a first attachment member that is coupled to the connection portion 212 and couples the third body 233 of the bracket portion 230 to the connection portion 212 ( 222) and a second attachment member 223 that is attached to the outer wall of the base body 211 and attaches the base body 211 to the inner wall of the outer cover body 110, and is coupled to the area of the connection member 213. It includes a third attachment member 224 that attaches the second body 232 of the bracket portion 230 to the area of the connection member 213.

The bracket part 230 of the sensor/communication module 200 is attached to the sensing/communication unit 210 by the above-mentioned attachment part 220 and attaches the sensor module 214, battery, and communication of the plurality of PCB assemblies 215. It can protect modules and other required electronic circuits.

In this embodiment, the bracket portion 230 is provided at a position corresponding to a plurality of PCB assemblies 215, as shown in FIG. 3, and the central first PCB assembly 215b on which the sensor module 214 is installed is A first body 231 having a first hole 231a disposed inside, a second body 232 having a second hole 232a inside which a right second PCB assembly 215a is disposed, and a left side The third PCB assembly 215c includes a third body 233 having a third hole 233a disposed therein.

In this embodiment, the overall outer wall shape of the bracket portion 230 may have a semicircular shape, as shown in FIG. 3.

The sensor/communication module 200 is accommodated inside the ring shape of the machined outer cover portion 100 to form a ring-shaped combination. In this embodiment, the accommodated sensor/communication module 200 is a sensor/communication module. It is attached and fixed to the inner wall of the outer cover body 110 through the second attachment member 223 of the attachment portion 220 of the module 200, forming an outer cover portion and a sensor/communication module combination.

As shown in FIG. 3, the position guide 140 may be formed in a flat area on the outer wall of the outer cover body 110, and depending on the embodiment, may be formed in the form of a groove or protrusion in addition to the flat area.

In the present invention, the inner surface molding part 300 is formed by filling the entire inner area of the ring-shaped combination of the outer cover part and the sensor/communication module with a molding member, and then forming a hole of a preset shape in the center of the filled molding member. It is formed in a new way by cutting and processing.

The inner side molding part 300 is manufactured by molding a transparent material molding member in which a coated transparent or translucent part can be created by increasing transparency by performing clear coating after molding.

Transparent thermosetting plastic, such as transparent hard epoxy, can be used as a transparent molding member.

The inner side molding part 300 has a ring shape including an inner side molding part body 310 having an inner vertical surface and a rounded portion 320 with rounded upper and lower ends by the inner molding part processing process (S300) described later. It is formed on the inside of the outer cover part and the sensor/communication module combination.

The sensing window 330 is a part through which the signal or light required for the sensor module to detect the smart ring user's biological signal is formed on the inner surface of the inner molded part 300 according to the clear coating process (S400) described later. It can be created as .

Hereinafter, the manufacturing method of the smart ring of the embodiments of the present invention described above will be described.

Figure 4 is a flowchart of a method of manufacturing a smart ring according to an embodiment of the present invention, Figure 5 is a diagram illustrating an embodiment of the inner molding part processing process 300 of the present invention, and Figure 7 is a sensing window of the present invention. FIG. 8 is a diagram for explaining one embodiment of the forming process 400, and FIG. 8 is a diagram for explaining another embodiment of the sensing window forming process 400 of the present invention.

Referring to Figure 4, the manufacturing method of a smart ring according to an embodiment of the present invention includes a parts preparation process (100) including an outer cover part processing process (S110) and a sensor/communication module manufacturing process (S120), an outer cover It is performed including the part and sensor/communication module combination manufacturing process (S200), the inner side molding part processing process (S300), and the clear coating process (S400). Once the clear coating process (S400) is completed, a typical finishing process (S500) such as impurity removal and polishing is performed to complete the manufacturing method of the smart ring (1) of the present invention.

In the outer cover portion processing process (S110) of the component preparation process (100), the outer cover portion (100) that accommodates the sensor/communication module is manufactured by processing the ring shape of a smart ring. In this embodiment, the outer cover portion 100 may be made of a metal material including titanium or medical stainless steel.

However, depending on the embodiment, it is not limited to metal materials and may be manufactured from various materials such as ceramic, plastic, and wood, and an appropriate known processing method may be selected and used depending on the material.

In the sensor/communication module manufacturing process (S120) of the component preparation process (100), a sensor/communication module (200) including a sensor module that detects the biological signals of the smart ring user is manufactured. In this embodiment, the sensor module ( 214) and a plurality of PCB assemblies (215a, 215b, 215c) on which electronic circuits such as batteries and other communication modules are installed are manufactured by connecting them with a bending member (156).

As shown in FIG. 3, the sensor/communication module 200 can be accommodated and combined at once in a ring-shaped space surrounding the outer cover body 110 and the inner surfaces of the upper flange 120 and lower flange 130. may be manufactured in a ring shape corresponding to the ring-shaped receiving space surrounding the inner surfaces of the upper flange 120 and the lower flange 130. In the sensor/communication module manufacturing process (S120) of the component preparation process (100), each component is combined to produce a ring shape that can be accommodated in the ring-shaped accommodation space.

In the outer cover part and sensor/communication module combination manufacturing process (S200), the sensor/communication module 200 is accommodated inside the ring shape of the processed outer cover part 100 to form a ring-shaped combination body, In this embodiment, the accommodated sensor/communication module 200 is attached and fixed to the inner wall of the outer cover body 110 through the second attachment member 223 of the attachment portion 220 of the sensor/communication module 200.

The inner side forming part processing process (S300) creates an inner side forming part 300 having a hole of a preset shape into which the smart ring user's finger is inserted inside the ring-shaped combination body.

In the present invention, the inner surface molding part processing process (S300) is performed by filling the entire inner area of the ring-shaped combination of the outer cover part and the sensor / communication module with a molding member, and then forming a preset shape at the center of the filled molding member. A new method is used to create the inner side forming part 300 by cutting the hole.

The inner side molding part 300 is manufactured by molding a transparent material molding member in which a coated transparent or translucent part can be created by increasing transparency by performing clear coating after molding.

Transparent thermosetting plastic, such as transparent hard epoxy, can be used as a transparent molding member.

Figure 5 is a diagram for explaining an embodiment of the inner molding part processing process (S300) of the present invention.

Referring to Figure 5, the inner molding part processing process (S300) of this embodiment is a ring-shaped combination of the outer cover part and the sensor/communication module using the molding device of the embodiment of the present invention of Figures 8 to 10. It includes a molding member injection/curing process of injecting and curing the molding member into the entire inner region and removing the molding device.

When the molding member injection/curing process is performed, a ring-shaped combination of the sensor/communication module is obtained in which the entire inner region is filled with the cured molding member as shown in FIG. 5(a), and then the entire inner region is filled with the cured molding member. A horizontal cutting process is performed to cut the molding member protrusion protruding from at least one of the upper or lower surfaces of the ring-shaped combination of the sensor/communication module filled with the molding member.

As a result of performing the horizontal cutting process, a ring-shaped combination of sensor/communication module is obtained in which the entire inner region without protrusions is filled with a hardened molding member, as shown in FIG. 5(b).

Next, a vertical cutting process is performed to machine a hole of a preset shape in the center of the filled molding member of the ring-shaped combination of the sensor/communication module in which the entire inner area without protrusions is filled with the molding member.

As a result of performing the vertical cutting process, an inner surface forming body 310 having an inner vertical surface is formed as shown in FIG. 5(c).

Next, a rounding part processing process is performed to form a rounded part 320 by rounding at least one of the upper and lower parts of the molded part body 310.

As a result of performing the rounding part processing process, the inner surface forming part 300 consisting of the forming part body 310 and the rounding part 320 is formed, as shown in FIG. 5(d).

The horizontal cutting process, vertical cutting process, and rounding process may be performed through CNC machining.

The clear coating process (S400) is a process of forming a clear coating layer by performing clear coating on the inner surface of the inner molded part 300.

The sensor module corresponding part of the inner surface of the inner surface molding part 300, whose transparency has been improved through the clear coating process (S400), is the part through which the signal or light required for the sensor module to detect the smart ring user's biological signal passes. It can be formed as a sensing window.

In this embodiment, the molding member of the inner side molding part 300 is made of transparent thermosetting plastic, and the clear coating process (S400) is a clear coating with adjusted transparency on the entire or part of the inner side of the inner side molding part 300. By performing this, the position corresponding part of the sensor module can form a sensing window 330, which is a transparent or translucent part that passes signals or light necessary for detecting biological signals.

Through the clear coating process (S400), the inner surface of the inner molded part 300, that is, all or part of the wall surface of the hole created by cutting, can be processed to allow transmission of signals or light. In the case of this embodiment, a clear coating layer is formed on the entire or part of the inner surface of the inner surface molding part 300, which is the machined cut surface of the molding member made of hardened transparent material, to improve transparency, thereby preventing the transmission of signals or light transmitted and received from the sensor module. possible and forms a part optimized for signal or light transmission.

In the case of the present invention, a clear coating with controlled transparency is performed on the entire or part of the inner surface of the inner surface molding part 300, so that the location of the sensor module, that is, when a photoplethysmography sensor is included, the photoplethysmography sensor emits light. The positions corresponding to the positions of the light receiving part and the light receiving part are clear coated to create a transparent or translucent part with increased transparency as the sensing window 330.

The present invention makes it possible to control the area to which the clear coating is applied by selectively performing masking on areas where clear coating will not be performed before clear coating, thereby easily performing clear coating on the desired location and range to increase transparency. The coated transparent or translucent portion may create a sensing window 330.

In addition, since it is possible to adjust the transparency of the clear-coated portion by adjusting the type and mixing ratio of various known clear coating solutions, it is possible to create a transparent or translucent sensing window 330 with transparency optimized for the characteristics of the sensor module. there is.

FIG. 6 is a diagram for explaining an embodiment of the clear coating process (S400) of the present invention, and FIG. 7 is a diagram for explaining another embodiment of the clear coating process (S400) of the present invention.

The clear coating process (S400) is a masking process of attaching a masking member to the part of the smart ring to be processed that will not be clear coated, and applying a primer coating solution to the inner surface of the inner molding part 300 to be clear coated. It includes a primer coating process to form a primer layer, a process to form a clear coating layer by applying a clear coating solution with controlled transparency to the dried primer layer, and a drying and masking removal process to dry the clear coating layer and remove the masking member. , the area to be clear coated can be adjusted by adjusting the scope and form of masking for each embodiment.

The clear coating process (S400) of the embodiment of FIG. 6 performs a clear coating with adjusted transparency on the entire inner surface of the inner molded part 300 to produce signals or light necessary for the position corresponding part of the sensor module to detect biological signals. A sensing window 330 is formed, which is a transparent or semi-transparent portion that allows light to pass through. Through this embodiment, the sensing window 330 of the embodiment of FIG. 1 is formed.

Referring to FIG. 6, the clear coating process (S400) of this embodiment is a masking process, clear coating, of attaching a masking member to the outer cover portion, which is the part of the smart ring to be processed in FIG. 6(a) that will not be clear coated. A primer coating process of forming a primer layer by applying a primer coating solution to the entire inner surface of the inner surface molding part 300, that is, the surface of the molding part body 310 and the rounding part 320, and the dried primer layer has transparency. It is performed including a process of forming a clear coating layer by applying a controlled clear coating solution, drying the clear coating layer, and a drying and masking removal process of removing the masking member.

Through this, as shown in FIG. 6(e), a portion corresponding to the position of the sensor module among the entire inner surface of the inner molded part 300, which is made transparent or translucent by clear coating, is formed as a sensing window 330.

In the case of FIG. 7, the clear coating process (S400) performs clear coating with adjusted transparency limited to the portion corresponding to the position of the sensor module of the inner molded part 300, so that the corresponding portion of the clear-coated sensor module detects biological signals. A sensing window 330 is formed, which is a part that passes the signal or light necessary for processing. Through this embodiment, the sensing window 330 of the embodiment of FIG. 2 is formed.

Referring to FIG. 7, the sensing window forming process 400 of this embodiment is a sensor of the outer cover part and the inner surface molding part 300, which are the parts of the smart ring to be processed in FIG. 7(a) that will not be clear coated. A masking process of attaching a masking member to the part excluding the position corresponding part of the module, a primer coating process of forming a primer layer by applying a primer coating liquid to the surface of the inner molded part 300 to be clear coated, and a primer coating process of forming a primer layer on the dried primer layer. It is performed including a process of forming a clear coating layer by applying a clear coating solution with adjusted transparency, drying the clear coating layer, and removing the masking member, and a drying and masking removal process.

Through this, as shown in FIG. 7(e), only the portion corresponding to the position of the sensor module of the inner molded part 300 that is made transparent or translucent by clear coating is formed as the sensing window 330.

In this example, various paints can be used as a primer coating, and in this example, the product name Eureka PRIMER #152 or UVILUX PRIMER #100-3 (NY) can be used.

For clear coating, in order to control transparency, the mixing ratio of glossy paint and matte paint can be adjusted to make it completely transparent by setting the ratio of glossy paint to matte paint to 10:0, or the ratio of glossy paint to matte paint can be set to 5:5. It is possible to achieve the desired level of transparency, such as making it translucent.

In this example, the glossy paint is HNP-UTT #3003(P) CLEAR, whose main ingredient is Acryl polyol resin, HNP-UVT #6011 CLEAR, whose main ingredient is Modified Acrylic Oligomers, or Ubichem CVM890SH Top Coat Gloss, whose main ingredient is a reactive monomer. (Improved) is used selectively, and as a matte paint, product name HNP-UTT #3003(P) MATT, whose main ingredient is acryl polyol resin, or product name HNP-UTT #3003(P) CLEAR, whose main ingredient is acryl polyol resin, can be optionally used. there is.

Before the masking process, static electricity is neutralized using ions on the static electricity charged on the outer cover part 100, that is, a method of dissipating the accumulated static electricity using ions is performed to remove dust on the surface of the outer cover part 100. Foreign substances such as etc. can be removed.

In order to perform the molding member injection/curing process of the inner surface molding part processing process (S300) of the new smart ring manufacturing method of the present invention described above, an embodiment of the present invention described later, which is different from the conventional molding device of FIG. 11, is required. An example molding device has been developed and used.

FIG. 8 is a perspective view schematically showing a molding device used for manufacturing smart rings in embodiments of the present invention, 9 is an exploded perspective view of the molding device of FIG. 8, and FIG. 10 is a cross-sectional view of the molding device of FIG. 9.

8 to 10, the molding device 400 used in the inner surface molding part processing process (S300) of the smart ring manufacturing method of the present invention includes an outer lower frame 410 and an outer lower frame 410. ) is coupled to the upper part of the inner lower frame 420 and the upper part of the inner lower frame 420 into which the lower region of the combination of the outer cover part 100 and the sensor/communication module 200 is inserted and coupled. The upper region of the combination of the outer cover part 100 and the sensor/communication module 200 is inserted and coupled to the inner upper frame 430, which serves as an injection passage of the molding member, and the upper part of the inner upper frame 430. It includes an outer upper frame 440 that is disposed and secures the dorsal upper frame so that it does not open or separate.

A first position guide protrusion 423 is provided on the same vertical line as the position guide 140 and the two position guide protrusions 434 on the outer wall of the inner lower frame 420, and the outer wall of the inner upper frame 430 A second position guide protrusion 434 is provided on the same vertical line as the position guide 140 and the first position guide protrusion 423, and in the molding member injection/curing process, the outer cover part 100 and the inner lower part are provided. It guides the coupling position of the frame 420 and the inner upper frame 430.

Referring to FIGS. 8 to 10, the outer lower frame 410 is provided with an outer lower groove 411 on the upper surface, as shown in FIG. 9, and the inner lower groove 411 is provided in this outer lower groove 411. The inner lower flange 421 of the frame 420 may be fitted and coupled. As a result, the inner lower frame 420 can be fixed without opening or separating during molding work.

In this embodiment, the outer lower frame 410 may be made of a material including steel, stainless steel, or plastic, and this may also be applied to the inner lower frame 420.

The inner lower frame 420 is fitted and coupled to the outer lower groove 411 of the outer lower frame 410 and can support the lower area of the combination of the outer cover portion 100 and the sensor/communication module 200. .

In this embodiment, an inner lower flange 421 is provided at the lower part of the inner lower frame 420, as shown in FIGS. 9 and 10, and this inner lower flange 421 is located in the outer lower groove 411. It can be fitted and joined in a detachable manner.

In addition, in this embodiment, an inner groove 422 is provided on the upper surface of the inner lower frame 420, as shown in FIGS. 9 and 10, and the outer cover portion 100 and the inner groove 422 are provided in this inner groove 422. The lower area of the combination of the sensor/communication module 200 may be fitted and coupled.

Furthermore, in this embodiment, a first position guide protrusion 423 may be provided on the outer wall of the inner lower frame 420, as shown in FIG. 9. In this embodiment, the first position guide protrusion 423 is, as shown in FIG. 9, the position guide 140 of the outer cover part 100 and the second position guide protrusion of the inner upper frame 430 ( It is provided on the same vertical line as 434) to conveniently guide the coupling position of the outer cover portion 100 and the inner upper frame 430.

And in this embodiment, the inner lower frame 420 is in close contact with the surface of the outer lower frame 410 to prevent the resin from flowing over and contaminating the outer lower frame 410 when the molding member containing transparent hard epoxy is injected and the molding member It may be made of a material containing silicon to facilitate separation from the outer lower frame 410 after hardening. In this embodiment, silicon may have a hardness of 60 to 70 degrees.

The inner upper frame 430 supports the upper area of the combination of the outer cover part 100 and the sensor/communication module 200 and can inject a molding member into the outer cover part 100.

In this embodiment, the inner upper frame 430, as shown in FIGS. 9 and 10, is provided on the injection post 431 provided at the upper portion and provided as an injection passage of the molding member, and on the inner wall of the injection post 431. An injection position protrusion 432 that guides the upper injection height of the molding member filled into the injection post 431, and an outer upper groove 441 of the outer upper frame 440 provided at the lower part of the inner upper frame 430. The inner upper flanges 433 and 120 are fitted and coupled to the inner upper frame 430 and are provided on the outer wall of the inner upper frame 430 and are provided on the same vertical line as the position guide 140 and the first position guide protrusion 423. It includes a second position guide protrusion 434 that conveniently guides the engagement position of 430.

In this embodiment, the injection post 431 is provided with an injection hole 431a, as shown in FIGS. 9 and 10, and the sensor/communication module 200 is connected to the molding member through the injection hole 431a. It can be injected into the combined outer cover part 100 and hardened. Additionally, in this embodiment, a post guide 431b is provided on the outer wall of the injection post 431, as shown in FIG. 9, and this post guide 431b includes a second position guide protrusion 434, a position guide ( 140), and may be provided on the same vertical line as the first position guide protrusion 423.

As shown in FIG. 9, the outer upper frame 440 is detachably fitted and coupled to the inner upper flange 433 through the outer upper groove 441 so that the inner upper frame 430 is not opened or opened during molding work. Separation can be prevented.

Compared to the molding device of the prior art shown in FIG. 11, the molding device 400 of the present embodiment as described above has a wide injection hole 431a in the inner frame structure that progresses through the entire molding, increasing the external exposure area of the molding member. Since it can be made wider, it provides a large area for air bubbles to escape when removing air bubbles that occur due to the use of the material of the molding member, so it is easy to discharge air bubbles, and the conventional technology has a small injection hole, which is exposed to the outside. Air bubbles can be removed quickly and more efficiently compared to molding devices with a small area. Accordingly, work efficiency can be improved and product quality related to transparency can be improved.

The molding member injection/curing process of the inner surface molding part processing process (S300) uses the molding device 400 of the above embodiment to first apply epoxy to the inside of the combination of the outer cover part 100 and the sensor/communication module 200. It can be cured after injecting the molding member containing the epoxy, and when the epoxy is cured, each component part of the molding device 400 is removed, and the cured epoxy molding shown in (a) of FIG. 5 is filled with the outer side as the molding member. A combination of the cover part 100 and the sensor/communication module 200 can be obtained. Next, the inner side forming part processing process (S300) is completed through the inner side forming part processing process described in relation to FIGS. 4 and 5.

As such, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the present invention. Accordingly, such modifications or variations should be considered to fall within the scope of the claims of the present invention.

1: Smart ring
100: outer cover part 110: outer cover body
120: upper flange 130: lower flange
140: Position guide 200: Sensor/communication module
210: Sensor/communication unit 211: Base body
212: connection part 213: connection member
214: Photoplethysmography sensor 215: PCB assembly
216: Battery 220: Attachment
221: inner attachment member 222: first attachment member
223: second attachment member 224: third attachment member
230: bracket part 231: first body
231a: first hole 232: second body
232a: second hole 233: third body
233a: Third hole 300: Inner side molding part
310: Molding part body 320: Rounding part
330: first coating portion 340: second coating portion
400: Molding device 410: Outer lower frame
411: outer lower groove 420: inner lower frame
421: inner lower flange 422: inner groove
423: First position guide protrusion 430: Inner upper frame
431: injection post 431a: injection hole
431b: Post guide 432: Injection position projection
433: inner upper flange 434: second position guide protrusion
440: outer upper frame 441: outer upper groove

Claims (12)

In smart rings,
An outer cover portion (100) that has the ring shape of a smart ring and accommodates a sensor/communication module,
A sensor/communication module 200 that is accommodated in the outer cover portion 100 and includes a sensor module that detects the biological signals of the smart ring user,
Including an inner surface molding part 300 having a hole of a preset shape into which the smart ring user's finger is inserted,
The outer cover part 100 and the sensor/communication module 200 are combined to form a ring-shaped outer cover part and sensor/communication module combination, and the inner surface molding part 300 is an inner surface of the ring-shaped combination body. A smart ring characterized in that it is formed by filling the entire area with a molding member and then cutting a hole of a preset shape in the center of the filled molding member. In claim 1,
The outer cover portion 100 includes an outer cover body 110 having a ring shape, an upper flange 120 provided at the upper end of the outer cover body 110, and an upper flange 120 provided at the lower end of the outer cover body 110. It includes a lower flange 130 and forms a ring-shaped receiving space surrounded by the outer cover body 110, the upper flange 120, and the inner surface of the lower flange 130, and the ring-shaped space includes a sensor/ A smart ring characterized in that the communication module 200 is accommodated and combined. In claim 2,
The sensor/communication module 200 is manufactured in a ring shape corresponding to a ring-shaped receiving space surrounding the inner surfaces of the upper flange 120 and the lower flange 130 and is connected to the outer cover body 110 and the outer cover body 110. A smart ring characterized in that it is accommodated and coupled to a ring-shaped space surrounding the inner surfaces of the upper flange 120 and the lower flange 130. In claim 3,
The sensor/communication module 200 includes a base body 211 having a semicircular shape, one side of which is coupled to the base body 211, and the other side of which is coupled with a plurality of PCB assemblies 215a, 215b, and 215c. It has a connection portion 212 that is thinner than the base body 211, a plurality of PCB assemblies (215a, 215b, 215c) one side of which is coupled to the connection portion 212, and a PCB assembly (215a, 215b, 215c) A smart ring, characterized in that it includes a bending member 216 connecting the two and a connecting member on one side of which is coupled to the base body 211 and on the other side of which is coupled to a plurality of PCB assemblies (215a, 215b, 215c). In claim 1,
The outer cover portion 100 is a smart ring characterized in that it includes a position guide 140 that guides the outer cover portion 100 to be placed in a set position of the molding device 400. In claim 1,
A smart ring, characterized in that the molding member forming the inner side molding portion 300 is a hardened transparent thermosetting plastic. In claim 6,
All or part of the wall of the hole created by cutting the inner surface of the inner surface molding part 300 is provided with a sensing window (330), which is a part through which the signal or light required for the sensor module to detect the biological signal of the smart ring user passes through. ) A smart ring characterized in that it is formed. In claim 7,
The sensing window 330 is a smart ring, characterized in that the transparency is improved by a clear coating layer at the corresponding position of the sensor module on the inner surface of the inner surface molding part 300. In claim 7 or claim 8,
The sensor module includes a photoplethysmography sensor, and the sensing window 330 is a transparent position corresponding to the sensor module, and the position corresponding to the position of the light emitting unit and the light receiving unit of the photoplethysmography sensor is clear-coated to improve transparency. Or a smart ring characterized by a translucent part. In the method of manufacturing a smart ring,
An outer cover part processing process (S110) of manufacturing the outer cover part 100 that accommodates the sensor/communication module with the ring shape of a smart ring;
A sensor/communication module manufacturing process (S120) for manufacturing a sensor/communication module 200 including a sensor module that detects biological signals of a smart ring user;
An outer cover part and sensor/communication module combination manufacturing process for accommodating the sensor/communication module 200 inside the ring shape of the outer cover part 100 to form a ring-shaped outer cover part and sensor/communication module combination. (S200);
An inner surface molding part processing process (S300) for creating an inner surface molding part 300 having a hole of a preset shape into which the smart ring user's finger is inserted inside the ring-shaped outer cover part and the sensor/communication module combination (S300) ; and
Including a clear coating process (S400) of performing clear coating on the inner surface of the inner surface molding part 300 to form a clear coating layer,
The inner surface forming part processing process (S300) is performed by filling the entire inner area of the ring-shaped assembly with a molding member and then cutting a hole of a preset shape in the center of the filled molding member to form the inner surface forming part 300. A method of manufacturing a smart ring, characterized in that producing a. In claim 10,
The inner side molding part processing process (S300) is,
A molding member injection/curing process of injecting and curing a molding member into the entire inner area of the ring-shaped combination of the outer cover portion and the sensor/communication module and removing the molding device,
A horizontal cutting process of cutting a molding member protrusion protruding from at least one of the upper or lower surfaces of a ring-shaped combination of a sensor/communication module filled with a hardened molding member throughout the inner region, and
A method of manufacturing a smart ring comprising a vertical cutting process of machining a hole of a preset shape in the center of a molding member filled with a ring-shaped combination of a sensor/communication module filled with a molding member throughout the inner region without protrusions. In claim 10,
The molding member of the inner molding part 300 is made of transparent thermosetting plastic, and the clear coating process (S400) performs a clear coating with controlled transparency on the entire inner surface of the inner molding part 300 to form a sensor module. A method of manufacturing a smart ring, characterized in that the position corresponding part forms a sensing window 330, which is a transparent or translucent part that passes the signal or light required to detect the biological signal.

Images