KR20240089776A - Ultrasonic systems and devices with improved acoustic properties - Google Patents

Abstract

Acoustic imaging artifacts produced by imaging systems and devices can be reduced or eliminated by including multisync media in the system or device. The multi-sync material may be disposed between the acoustically reflective component of the imaging system or device and the ultrasonic transducer of the imaging system or device. Incorporating a multi-sink medium that is thermally conductive and acoustically non-conductive can reduce acoustic imaging artifacts while maintaining or improving thermal management within imaging systems and devices.

Description

Ultrasound systems and devices with improved acoustic properties

Ultrasound imaging is a widely used technology in medical and non-destructive testing. Ultrasound systems and devices typically include an ultrasonic transducer capable of generating acoustic energy and transmitting it along the transmission axis to an acoustically heterogeneous target material and detecting the acoustic energy reflected from the target material to generate an image along the acoustic wave transmission axis. do. of the transmitted acoustic energy when the transmitted acoustic energy wave encounters an interface between a first portion of the target material having a first acoustic impedance (Z ₁ ) and a second portion of the target material having a second acoustic impedance (Z ₂ ) Partial or total reflection may occur. The reflection coefficient (R), which can be used to determine the amplitude of the reflected acoustic energy wave, can be calculated using equation 1:

However, the performance of ultrasound systems and devices can be negatively affected by acoustic noise sources within the immediate environment of the ultrasound probe transducer and/or the target material of the ultrasound scan. Reverberation artifacts may occur when ultrasonic energy waves reflect between two or more parallel acoustic reflectors. In some cases, the deleterious effects of reverberation artifacts in target materials containing parallel acoustic reflectors can be reduced by changing the angle at which acoustic waves are transmitted to the target material. However, this strategy can only be used when it is possible to change the angle of the ultrasonic transducer with respect to the parallel acoustic reflector. There has been a long-standing and unresolved need to address situations where echo artifacts arise from acoustic noise sources where the angle of incidence of transmitted ultrasonic waves does not easily change.

Ultrasound imaging artifacts resulting from sources external to the ultrasound scan target (e.g., target material), for example, may result in significant performance trade-offs and design compromises for which adjustments to the design of the ultrasound device or system to address these disturbances may occur. Because it can entail, it can cause unique problems. Described herein are systems, devices, and methods that can improve ultrasound scanning performance with respect to artifacts resulting from acoustic reflections within an ultrasound scanning device. In various aspects, systems, devices, and methods can reduce the impact of acoustic reflections on ultrasound scan quality while also overcoming conflicting design constraints related to thermal management constraints, cost constraints, and/or probe geometry constraints. You can. For example, some embodiments described herein may improve the acoustic isolation of an ultrasound transducer of an ultrasound system or device (e.g., from acoustically reflecting components of the ultrasound system or device) while simultaneously improving the acoustic isolation of the probe of the system or device. It includes a multisink medium (e.g., injectable multisink medium 400) that can improve heat conduction therein.

In various aspects, an imaging device includes: an integrated circuit board; A multi-sync medium in contact with an integrated circuit board; and one or more microelectromechanical (MEM) ultrasonic transducers coupled to the integrated circuit board. In some cases, the imaging device further includes a heat sink. In some cases, the heat sink includes metal. In some cases, the metal is aluminum. In some cases, multi-sink media is in contact with a heat sink. In some cases, a multi-sink medium is at least partially disposed between one or more MEM transducers and a heat sink. In some cases, the device further includes a housing coupled to an integrated circuit board. In some cases, multi-sink media is in contact with the housing. In some cases, the multisync medium is at least partially disposed between one or more MEM transducers and the housing. In some cases, multi-sink media is injectable. In some cases, the multisink media has a flow rate of at least 29 g/min. In some cases, the multisink media has a flow rate of at least 40 g/min. In some cases, the multi-sink media has a thermal conductivity of at least 1.5 Watts per meter-Kelvin (W/mK). In some cases, the multi-sink media has a thermal conductivity of at least 3.7 Watts per meter-Kelvin (W/mK). In some cases, the multi-sink media has a thermal conductivity of at least 6.4 Watts per meter-Kelvin (W/mK). In some cases, the multi-sink media has a thickness of at least 0.5 mm. In some cases, the multi-sink media has a thickness of at least 1.0 mm. In some cases, the multi-sink media has a thickness of at least 1.5 mm. In some cases, the imaging device further includes a backing material. In some cases, the backing material includes a backing laminate.

In further aspects, a method of manufacturing an imaging device includes: forming an internal cavity by coupling a first component of the imaging device to an integrated circuit board; Coupling one or more microelectromechanical (MEM) ultrasonic transducers to an integrated circuit board; and injecting the multi-sink medium into the internal cavity. In some cases, the first component includes an acoustically reflective material. In some cases, the first component is coupled directly to the integrated circuit board. In some cases, the first component is a heatsink. In some cases, the heat sink includes metal. In some cases, multi-sink media is in contact with a heat sink. In some cases, the first component includes a housing. In some cases, multi-sink media is in contact with the housing. In some cases, a multisync medium is at least partially disposed between one or more MEM transducers and the first component. In some cases, multi-sink media is injectable. In some cases, the multisink media has a flow rate of at least 29 g/min. In some cases, the multisink media has a flow rate of at least 40 g/min. In some cases, the multi-sink media has a thermal conductivity of at least 1.5 Watts per meter-Kelvin (W/mK). In some cases, the multi-sink media has a thermal conductivity of at least 3.7 Watts per meter-Kelvin (W/mK). In some cases, the multi-sink media has a thermal conductivity of at least 6.4 Watts per meter-Kelvin (W/mK). In some cases, the multisink media has a thickness of at least 0.5 mm after injection. In some cases, the multisink media has a thickness of at least 1.0 mm after injection. In some cases, the multisink media has a thickness of at least 1.5 mm after injection. In some cases, the method further includes bonding the backing material to the integrated circuit board. In some cases, the backing material includes a backing laminate. In some cases, a backing material is at least partially disposed between the first component and one or more MEM ultrasonic transducers.

A better understanding of the features and advantages of the subject matter will be obtained by reference to the following detailed description and accompanying drawings, which set forth exemplary embodiments:
1 shows a block diagram of an imaging device that may include multisync media, according to embodiments.
2 shows a schematic diagram of an imaging device that may include multisync media, according to embodiments.
Figure 3 shows a schematic diagram of internal components of an imaging device, according to embodiments.
Figure 4 shows a schematic diagram of an alternative configuration of internal components of an imaging device, according to embodiments.
Figure 5 shows a schematic diagram of a second alternative configuration of internal components of an imaging device, according to embodiments.
Figure 6 shows a schematic diagram of a third alternative configuration of internal components of an imaging device, according to embodiments.
FIG. 7A shows an ultrasonic scan of a test target material using an aluminum backing and no multi-sink media, according to embodiments.
FIG. 7B shows an ultrasound scan of the test target material of FIG. 7A using multi-sync media with the same scan settings, according to embodiments.
FIG. 7C shows an ultrasonic scan of the test target material of FIG. 7A using air backing and no multisync media with the same scan settings, according to embodiments.
FIG. 8A shows an ultrasound scan of a test target material using a multi-sink medium with a thickness of 0.5 millimeters, according to embodiments.
FIG. 8B shows an ultrasonic scan of the test target material of FIG. 8A using a multi-sync medium with 1.0 millimeter thickness with the same scan settings, according to embodiments.
FIG. 8C shows an ultrasonic scan of the test target material of FIG. 8A using air backing and no multi-sync media with the same scan settings, according to embodiments.
FIG. 9A shows an ultrasound scan of a test target material using a multi-sink medium 400 with a thickness of 0.5 millimeters, according to embodiments.
FIG. 9B shows an ultrasound scan of the test target material of FIG. 9A using a multi-sync medium with a 1.0 millimeter thickness with the same scan settings, according to embodiments.
FIG. 9C shows an ultrasonic scan of the test target material of FIG. 9A using air backing and no multi-sync media with the same scan settings, according to embodiments.
10 shows a block diagram of a computing system, according to embodiments.

Disclosed herein are systems, devices, and methods for improved acoustic and thermal management in ultrasound imaging applications. The geometries and materials that make up ultrasound imaging systems and devices can introduce a number of potentially conflicting design constraints, including thermal management and reduction of acoustic artifacts. Heat transfer from temperature-sensitive electronic components of an imaging system or device (e.g., the probe head of an ultrasound imaging system or device) is typically achieved in conventional devices by a thermally conductive metal heatsink that acts as a conduit for the heat generated by the electronic components. It is processed by integrating. Unfortunately, metal heatsinks allow ultrasonic energy (e.g., an ultrasound wave or pattern) generated by an ultrasound device's transducer (e.g., a transducer in an ultrasound probe head) to travel back through the body of the device and heat the metal. Acoustic artifacts, including reverberation artifacts, may be created due to reflections from the sink (and/or other components that can reflect ultrasonic energy) back to the device's detection transducer. On the other hand, many acoustically insulating materials, such as air, that may be present in the internal cavities or spaces of an imaging system or device do not conduct heat energy efficiently, resulting in heat-sensitive internals of the imaging system or device, such as processors and integrated circuits within the ultrasound probe head. Reduces the overall efficiency of heat conduction from the component. As described herein, a material (e.g., a silicone-based paste or putty containing ceramic particles) that can efficiently conduct thermal energy and simultaneously absorb or dissipate acoustic energy (e.g., ultrasonic energy) is used. Multi-sync media 400 may be integrated into imaging systems and devices to simultaneously improve thermal management and acoustic isolation of the imaging transducer. In many cases, multisink media 400, which may be used in the form of an injectable or moldable paste or putty, can easily fill irregularly shaped cavities, gaps, or spaces in an imaging system or device (e.g., an ultrasound probe head). heat flux (e.g. from electrical components, to metal heatsinks or housings that may not be easily fabricated to fill these cavities, gaps and spaces, in addition to the potential for creating acoustic artifacts) may enable closer and/or more complete contouring (e.g., acoustic isolation) of the acoustically reflective material.

As described herein, imaging system or device 100 includes hardware and/or software configured to transmit and/or receive ultrasound energy (e.g., in the form of an ultrasound waveform or group or pattern of ultrasound waves). can do. In many cases, an image of all or a portion of a target material (e.g., target tissue) is obtained by using ultrasound energy (e.g., For example, an ultrasound waveform or an ultrasound waveform pattern) may be generated by processing and/or analysis. In some cases, embodiments of the present disclosure may relate to imaging devices and systems, such as non-invasive ultrasound imaging devices and systems that include microelectromechanical system (MEM) ultrasound transducers. In some cases, an ultrasound transducer may include a MUT (e.g., a transducer unit (e.g., “pixel”) with a single diaphragm or membrane). In some cases, an ultrasound system or device includes a transducer element that may include a plurality of transducer units grouped to function together as one. In some cases, an ultrasonic transducer can convert received ultrasonic energy (e.g., a received ultrasonic waveform or pattern) into an electrical signal or pattern. In some cases, an ultrasound device or system may be configured to convert an electrical signal or pattern generated by a transducer from a received ultrasound waveform or pattern into an image of all or part of a target material.

As shown in FIG. 1 , imaging system or device 100 may include transducer 102 . Transducer 102 of imaging system or device 100 may include one or more transducer elements 104 (e.g., a plurality of transducer elements, e.g., arranged in an array). In some cases, transducer 102 of imaging system or device 100 may include a plurality of transducer elements 104. Transducer element 104 may include a plurality of transducer units, each of which may include a piezoelectric micromachined ultrasound transducer (pMUT) or a capacitive micromachined ultrasound transducer (cMUT). The pMUT or cMUT may operate based on photo-acoustic or ultrasonic principles, for example in imaging target materials. Transducer element 102 or a portion thereof (e.g., a transducer unit) may include biological tissue (e.g., human or animal bone, bloodstream, and/or organ(s)) and/or other material. Alternatively, it may be used to generate ultrasonic pressure waves (e.g., ultrasonic energy) that propagate through a target material, which may include a mass. Transducer element 102 or a portion thereof (e.g., a transducer unit) may be used to receive ultrasonic energy (e.g., reflected from a portion of a target material). In many cases, transducer element 102, or a portion thereof, may be configured to convert received ultrasonic energy into an electrical signal. In some cases, imaging system or device 100 transmits a signal (e.g., an ultrasound waveform or pattern) into a target material (e.g., a body or part thereof) and ) may receive a reflected signal (eg, an ultrasonic waveform or pattern). In some cases, an imaging system or device may be configured to simultaneously transmit and receive ultrasound energy (eg, including one or more ultrasound waveforms or patterns).

A transducer (or multiple transducers), such as a pMUT or cMUT, can be efficiently formed on substrate 260, for example, in a method utilizing a semiconductor wafer fabrication process. Compared to conventional transducers (e.g., traditional bulk piezoelectric (PZT) transducers), pMUT transducer elements and pixels can be fabricated on a semiconductor substrate 260 (e.g., an integrated circuit board). It is less bulky, less expensive to manufacture, can be less complex, and can have higher performance electronic/transducer interconnects than traditional PZT transducer substrates. In many cases, imaging systems and devices 100 that include a pMUT can enable greater flexibility in operating frequency and can produce higher quality images.

In some cases, substrate 260 (e.g., an integrated circuit substrate) may include a semiconductor wafer. In some cases, the semiconductor wafer may be 6 inches, 8 inches, 12 inches, 6 to 8 inches, 8 to 12 inches, 6 to 12 inches, less than 6 inches, or more than 12 inches in length. In some cases, semiconductor wafers may be manufactured by forming one or more silicon dioxide (SiO ₂ ) layers on a silicon substrate. Additional processing in the fabrication of semiconductor wafers may include, for example, the addition of metal layers or paths (e.g., including deposition or etching processes). In some cases, cavities may be etched into integrated circuit substrate 260.

Imaging system or device 100 may operate a transducer, form a transmitted ultrasound waveform or pattern, and/or receive ultrasound energy (e.g., reflected) (e.g., from a target material or portion thereof). It may include an application specific integrated circuit (ASIC) that may include an electronic device for processing an electronic signal generated by the transducer. In some cases, the ASIC may be configured to include one or more transmit drivers (e.g., the received ultrasonic energy (e.g., echo signal) that may have been received by the transducer after being reflected back from the object or material to be imaged). In some cases, the ASIC may include sensing circuitry for processing corresponding electrical energy, and/or other processing circuitry for controlling other operations associated with the functionality of the imaging system or device 100. ) (e.g., a semiconductor wafer, such as a semiconductor wafer integrated circuit substrate). In some cases, an ASIC may be formed on an imaging system or device (e.g., to reduce parasitic losses). For example, the ASIC may be located in proximity to a transducer (e.g., pMUT or cMUT) element or pixel of 100 (e.g., disposed within imaging system or device 100). For example, the ASIC may be located no more than 50 micrometers from the transducer element array) and may be coupled directly to the substrate 260 (e.g., a semiconductor wafer integrated circuit substrate) of the imaging system or device 100. In some cases, the ASIC is coupled directly to the same integrated circuit board 260 (eg, a semiconductor wafer substrate) to which the transducers of the imaging system or device 100 are directly coupled. Alternatively, the transducer of device 100 may in some cases be coupled to integrated circuit board 260 on which the ASIC is fabricated, such as using low temperature piezoelectric material sputtering and/or other low temperature processing compatible with the ASIC. , the ASIC is an integrated circuit board 260 that is directly coupled to the transducer of the imaging system or device 100, 200, 250 (e.g., via a stacked wafer-to-wafer interconnection). It is indirectly coupled to (for example, a semiconductor wafer substrate). For example, the ASIC may be directly coupled to a first integrated circuit board 260 that is indirectly coupled to the transducer (e.g., where the first integrated circuit board is directly coupled to the transducer) is directly coupled to (260)). In some cases, the ASIC (or integrated circuit substrate 260 coupled to the ASIC) is spatially separated from the transducer element or array (or semiconductor wafer substrate 260 coupled to the transducer element or array) by less than 100 micrometers. It can be. In some cases, the ASIC may have a similar or identical footprint compared to the pMUT transducer (e.g., containing a pMUT element). ASICs can be coupled to transducers through interconnects.

One or more transducers 104 (e.g., one or more transducer elements or pixels) of an imaging system or device 100, 200, 250 may be configured to operate at a particular frequency and bandwidth (or within a range of frequencies and within a range of bandwidths). It may be configured to transmit or receive an ultrasonic signal (e.g., ultrasonic energy in the form of an ultrasonic pressure wave or wave pattern). In some cases, transducer 104 (or array of transducer elements) includes, for example, a first center frequency (and a first bandwidth) and one or more additional center frequencies (with one or more corresponding additional bandwidths). may be configured to transmit or receive a signal (e.g., ultrasonic energy in the form of an ultrasonic pressure wave or wave pattern) at a plurality of frequencies and bandwidths. In some cases, transducer 104 (e.g., a transducer array, element, or pixel) has a frequency range of 0.1 megahertz (MHz) to 100 MHz (e.g., 0.1 MHz to 1.8 MHz, 1.8 MHz to 5.1 MHz, or 5.1 MHz). Ultrasonic signals may be emitted (e.g., transmitted) or received with a center frequency of greater than MHz. In some cases, an ultrasound signal (e.g., an ultrasound waveform, pattern, or pressure wave) is transmitted to one or more transducers (e.g., transducer elements (e.g., transducer elements) of the transducer array 102 using one or more transmission channels 108. 104) or a group of pixels) may be generated by driving a voltage pulse at a frequency to which one or more transducers respond. In many cases, this may cause an ultrasound waveform to be emitted (e.g., transmitted) from the transducer element 104 toward a target material, for example, when imaging of the target material or portion thereof is desired. In some cases, the ultrasonic waveform may include one or more ultrasonic pressure waves transmitted from one or more corresponding transducer elements of the imaging device, for example, where the pressure waves are transmitted simultaneously or substantially simultaneously. Ultrasonic energy (transmitted toward the target material, e.g., by a transducer, in the form of a wave or pattern, as described herein) is directed toward, into and/or toward the target material. Can move through matter. In many cases, all or part of the transmitted ultrasound energy may be reflected back to transducer 102. In many cases, ultrasonic energy reflected back to transducer 102 may be received by transducer 102, for example, from a target material or portion thereof. Ultrasonic energy received by the transducer 102 (e.g., after being reflected back to the transducer 102) is converted into electrical energy (e.g., an electrical signal) through the piezoelectric effect in the transducer 102. It can be. One or more receiving channels 110 may collect electrical energy generated by transducer 102 (e.g., as a result of converting ultrasonic energy to an electrical signal). In some cases, one or more receiving channels 110 may process electrical energy. In some cases, the electrical energy generated by transducer 102 (e.g., and collected by receive channel 110) may be processed, which may include, for example, generating an image that can be displayed. For, it may be transmitted to the computing system or device 112.

Imaging system or device 100, 200, 250 may include control circuitry 106, which may include a controller. The control circuit 106 of the imaging system or device 100, 200, 250 controls (e.g., operates) one or more transducer elements 102 or transducer units of the imaging system or device 100, 200, 250. ) can be configured to. In some cases, control circuitry 106 may be configured to receive ultrasonic energy (e.g., including ultrasonic pressure waves) reflected back to transducer element 104 and generate an electrical signal based on the received ultrasonic energy. It may be configured to actuate the deducer element 104. In some cases, the control circuitry 106 of the imaging system or device 100, 200, 250 may include one or more transmit channels 108 and one or more receive channels 110. In some cases, the control circuit may include beamforming circuitry. In some cases, the control circuit 106 may include an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a system-on-chip, a processor, memory (e.g., non-transitory memory and/or transient memory), and a voltage source. , a current source, one or more amplifiers (e.g., one or more operational amplifiers), one or more digital-to-analog converters, and/or one or more analog-to-digital converters. In some cases, transducer 104 may be coupled to one or more transmit driver circuits (e.g., in the transmit channel described herein) and/or low noise amplifiers (e.g., in the receive channel). In some cases, a transmit channel may include a transmit driver. In some cases, the receive channel may include one or more low noise amplifiers. In some cases, the transmit and receive channels each have multiplexing and address control circuitry, for example, to enable specific transducer elements and sets of transducer elements to be activated, deactivated, or put into low-power modes. may include.

As described herein, imaging system or device 100, 200, 250 may include computing system 112 (eg, computing device 112). In some cases, a computing system or device may include a processor, memory (e.g., non-transitory memory and/or transient memory), communication circuitry (e.g., wireless or wired communication ports and/or communication modules), a battery, and/or May include a display. Computing system or device 112 may be integrated with (e.g., coupled to) control circuitry 106 and/or one or more transducer elements, pixels, or arrays 102. In some cases, computing system or device 112 may be coupled to a single substrate 260 (e.g., a chip), for example, as a single system on a chip (SoC), or may be comprised of multiple devices disposed within the same housing. may include components (e.g., components described herein, such as control circuitry, transducers, and/or multisync media 400). In some cases, the computing system or device 112 of the imaging system or device 100, 200, 250 may be coupled to the control circuitry, transducer, and/or multisync medium 400, but may be physically separate (e.g. e.g., not located on the same chip or within the same housing).

In some cases, an imaging system or device may be configured to fire (e.g., from a transducer element) in a manner that controls power dissipation without exceeding the temperature limits of the imaging device while maintaining the required image quality. may be configured to transmit (transmission of an ultrasonic waveform toward, into, or through the target material). In some cases, the number or pattern of transmit and/or receive channels can be dynamically adjusted (e.g., by control circuitry 106), for example, to reduce power consumption and/or reduce the risk of overheating in the device. It can be controlled. In some cases, the number of transmit channels 108 and/or the number of receive channels 110 of an operating imaging system or device 100, 200, 250 is constant throughout operation of the imaging system or device 100, 200, 250. do. In some cases, the number of operational transmission channels is not constant throughout operation of the imaging system or device 100, 200, 250. For example, transducer elements 104 arranged in a two-dimensional spatial array having N columns and M rows (e.g., arranged in orthogonal rows and columns or in an asymmetric (or staggered) rectilinear array). An imaging system having up to (as many as) N transmit channels and/or receive channels, up to M transmit channels and at any time throughout or at any time during the operation of the transducer array of the imaging system or device (100, 200, 250). /or receive channels, up to N x M transmit channels and/or receive channels can be used. For example, a subset of transducer elements 104 may be used for a given ultrasound scan or portion of an ultrasound scan. In some cases, the transducer element may be coupled to both the transmit channel 108 and the receive channel 110. For example, the transducer element 104 may be configured to generate and transmit an ultrasonic pulse and then detect an echo of that pulse, for example, by converting the reflected ultrasonic energy into electrical energy. In some cases, multiple transducers 104 may be coupled to the same one or more transmit channels 108 and/or the same one or more receive channels 110. In some cases, each of the transducers 104 may be coupled to a different transmit channel 108 and/or a different receive channel 110. In some cases, some or all of the transducer elements 104 may be coupled to either the transmit channel 108 or the receive channel 110, but not both.

As described herein, an imaging system or device (100, 200, 250) may, for example, improve thermal management and/or reduce imaging artifacts (e.g., To reduce echo artifacts resulting from acoustic reflective components), a multisync medium 400 may be included (e.g., in systems and devices 100 with or without dynamic control of transmit and/or receive channels). You can.

2 is a schematic diagram of an imaging device 100, 200, 250 with selectively adjustable features, according to some embodiments. Imaging devices 200, 250 may be similar to imaging device 100 of FIG. 1, by way of example only. Imaging devices 100, 200, and 250 may include ultrasound medical probes.

As shown in Figure 2, the imaging system or device 100, 200, 250 or a portion thereof (e.g., a probe of the imaging system or device 100, 200, 250) may include, for example, a transducer ( 202) and a housing 231 (e.g., a handheld casing) that can accommodate an associated electronic device. In some cases, imaging system or device 100, 200, 250 or a portion thereof (e.g., a probe of imaging system or device 100, 200, 250) may be configured to, for example, as shown in FIG. , may include a battery 238 , for example, to power one or more components of the imaging system or device 100 , 200 , 250 or portions thereof. In some cases, the imaging system or device 100, 200, 250, or a portion thereof, is optionally positioned on a substrate 260 (e.g., a silicon wafer integrated circuit wafer), e.g., as shown in FIG. A portable imaging device capable of two-dimensional (2D) and/or three-dimensional (3D) imaging using pMUT transducer elements fabricated in (e.g., coupled to) a 2D array. there is. In some cases, one or more transducers (e.g., a transducer array) may be configured with an application specific integrated circuit (ASIC) that can help control parameters of transducer operation, for example, as described herein. circuit) 106 (e.g., directly or indirectly). Although not explicitly shown in FIG. 2, the imaging system or device 100, 200, 250, or a portion thereof (e.g., as shown in FIG. 2) may include multiple syncs. Multiple sinks may be placed within a housing, for example, a transducer (and/or ASIC, and/or substrate 260, such as integrated circuit board 260) and a heat sink, housing, or one or more additional components shown in FIG. It can be placed between one or more of:

As shown in FIG. 2 , imaging devices 100 , 200 , 250 may include one or more transducers 202 . In some cases, one or more transducers 202 may include, for example, an array of one or more transducer elements, where transducers 202 transmit ultrasonic energy (e.g., ultrasonic pressure waves) and /or may be configured to receive.

In some cases, the imaging device 100, 200, 250 may, for example, connect the transducer 202 to a target material (e.g., through which ultrasound energy is transmitted by the imaging device 100, 200, 250). It may include a coating layer 222 that serves as an impedance matching interface between the human body or other masses or tissues. In some cases, coating layer 222 may be or function as a lens, for example, when designed with a curvature that matches a desired focal length. In some cases, for example, to improve impedance matching at the interface of coating layer 222 and the surface of the target material, the user may contact the surface of the target material (e.g. For example, the gel can be applied to the skin of a living body. In some cases, impedance matching as described herein may occur at the interface of the coating layer 222 and the surface of the target material (e.g., during transmission into or reception of acoustic energy reflected from the target material). Conduction of acoustic energy can be improved and losses (e.g., amplitude) of acoustic energy can be reduced. Coating layer 222 may be a flat layer, for example, to maximize transmission of acoustic signals from transducer 202 (e.g., a flat transducer 202 array) to the body and vice versa. In some embodiments, coating layer 222 may have a thickness equal to one quarter (eg, 25%) of the wavelength of the acoustic pressure wave to be generated in transducer 202.

Imaging devices 100, 200, 250 may include control circuitry 106. Control circuitry 106 may include one or more processors to control one or more transducers 202, for example. In some cases, control circuitry 106 includes an application-specific integrated circuit (ASIC) or ASIC chip. In some cases, an ASIC or ASIC chip may include one or more processors. In some embodiments, control circuitry 106 may be coupled to one or more transducers 102, for example via a bump, for example in a stacked configuration. In some cases, the control circuitry may be configured to control the transmit channel 108 and/or receive channel, for example, based on a desire to test pixels for defects, change scanning modes, or adjust the operation of transducer 102. It may be configured to (e.g., selectively) operate and/or adjust the operation of 110. In some cases, imaging device 100, 200, 250 may include one or more processors 226, for example, to control one or more components of imaging device 100, 200, 250. One or more processors 226 (e.g., in conjunction with or independently of control circuitry 106) control the operation of one or more transducer elements (e.g., reflected ultrasound waves received by the transducer elements). process electrical signals (based on energy) and/or generate signals (e.g., to restore an image of a target material or portion thereof imaged by one or more processors of a computing device, such as computing device 112). It can be configured to do so. In some cases, one or more processors 226 may be configured to perform other processing functions associated with imaging devices 100, 200, 250. Processor(s) 226 may be embodied as any type of processor(s). For example, one or more processors 226 may include single or multiple core processor(s), single or multiple socket processor(s), digital signal processor(s), graphics processor(s), neural network computer engine(s), It may be embodied as an image processor(s), microcontroller(s), field programmable gate array (FPGA)(s), or other processor/control circuit(s).

Imaging devices 100, 200, 250 may include circuit(s) 228, which may include an Analog Front End (AFE) (e.g., for processing/conditioning signals). In some cases, analog front end 228 may be embodied as any circuit or circuits configured to interface with other components of the imaging device, such as control circuitry 106 and processor 226. For example, analog front end 228 may include, for example, one or more digital-to-analog converters, one or more analog-to-digital converters, and/or one or more amplifiers.

Imaging devices 100, 200, 250 may include multisync media 400 and/or (e.g., transducer 202), as illustrated, e.g., in FIGS. 3, 4, 5, and 6. It may include an acoustic absorber layer 230 (for absorbing acoustic energy generated by and propagating toward the circuit 228). The multi-sink media 400 (and in some cases, the acoustic absorber layer) can absorb ultrasonic energy emitted in a reverse direction (e.g., emitted by the transducer 202 in a direction away from the coating layer 222). which may otherwise be reflected and disrupt the quality of the image (e.g., through the creation of artifact(s) such as reverberation artifacts). For example, transducer(s) 202 (e.g., which may be mounted on substrate 260) may be in contact with multi-sync medium 400 (e.g., where multi-sync medium ( 400) includes all or part of the transducer array 202 and other components of the imaging device 100, 200, 250, such as the housing 231, heat sink 268, backing laminate, and/or acoustic absorber 230. is at least partially placed between all or some of the components). In some cases, transducer(s) 202 may be mounted on substrate 260 and coupled to acoustic absorber layer 230 (e.g., via one or more adhesive layers 262), optionally It has a backing laminate (e.g., a metal reflector, such as an aluminum backing laminate or a tungsten backing laminate, as shown in Figure 3).

As described herein, multisync medium 400 may have characteristics that are uniquely advantageous for inclusion in imaging systems and devices 100, 200, and 250. For example, the multi-sink medium 400 may be both thermally conductive and acoustically non-conductive (eg, absorptive or dissipative of ultrasonic energy). In many cases, an acoustically absorbing layer 230, which often does not exhibit good thermal conductivity, may be best used in imaging devices 100, 200, 250 in conjunction with one or more heatsinks 268, which are often acoustically reflective. Multisink medium 400 may also be deformable or flowable (e.g., injectable or moldable), which allows multisink medium 400 to form a cavity, gap, or shape within imaging device 100, 200, 250. fills the space 270, allowing for more extensive acoustic isolation of components behind the transducer 202 (e.g., disposed opposite to the coating layer 266 and/or the target material) and the imaging device. between the thermally sensitive component of (100, 200, 250) and an external component (e.g., housing 231) and/or a thermally conductive component that may be acoustically reflective (e.g., heat sink 268). Allows for a larger contact area (e.g. cross-sectional area for thermal flux). For example, multisink media 400 may include pads, laminates, or films that are not injectable, moldable, or flowable, for example, into cavities, gaps, or spaces 270 around the acoustic reflective component. This may make it possible to surround the acoustically reflective component of the imaging device 100, 200, 250 more completely than the acoustical absorber layer 230, which may not be possible. Although multisync media 400 is not explicitly shown in FIGS. 3, 5, or 6, imaging devices 100, 200 (e.g., as shown in FIGS. 3, 5, and 6) One or more cavities, gaps or spaces 270 of the multi-sync medium 400 (250) may be partially or completely filled with the multi-sync medium 400 and may produce any or all of the acoustic properties described herein or depicted in the drawings of this application. It is contemplated that absorber layer 230 and/or heat sink 268 may be replaced with multi-sink media 400.

In some cases, imaging devices 100, 200, 250 include multisync media 400 and acoustic absorber layer 230 (and optionally a backing laminate). 3 depicts an acoustic absorber layer 230 and a backing laminate 232 (e.g., an aluminum backing or a metal backing such as a tungsten reflector), but one or both of these components may be omitted (e.g., multiple sync medium 400), for example, wherein other components of imaging device 100, 200, 250 (e.g., multi-sink medium 400) may be replaced by a coating layer from transducer 202. Substantially prevents transmission of ultrasonic waves in a direction away from 222. For example, the imaging devices 100, 200, 250 may be configured as a multi-sync device without an acoustic absorber layer 230 and, optionally, without a backing laminate, as shown, for example, in FIGS. 4, 5, and 6. It may include a medium 400. In some cases, for example, using multisink media 400 instead of backing laminate 232 may simplify manufacturing and/or reduce component cost of imaging devices 100, 200, 250.

3 shows an embodiment of an imaging device 250 that includes a sound absorbing layer 230. As described herein, imaging device 250 may include a multisync medium 400, e.g., where the multisync medium is disposed within cavity 270 (e.g., cavity 270 ) and/or wherein the multi-sink media replaces one or more of the backing laminate 232, adhesive layer 262, and/or acoustic absorber layer 230. As shown in FIG. 3 , imaging device 250, which may be part of an ultrasound imaging system or device 100, 200 described herein, includes a coating layer 222, which may be or function as a lens. It can be included. As shown in FIG. 3 , coating layer 222 is coupled to the distal end of imaging device 250 as microelectromechanical (MEM) transducer(s) 202 that can be coupled (e.g., directly) to ASIC 106. It can be located closer to . ASIC 106, which may include control circuitry, may be coupled to substrate 260 (e.g., an integrated circuit board, such as a printed circuit board (PCB)). ASIC 106 may be part of or Can contain any electronic component. In some cases, components of imaging device 250 (e.g., coating layer 222, transducer 202, ASIC 106, and/or substrate 260) include one or more adhesive layers 262, an absorber layer, 230 and/or a backing laminate 232, which may include a reflector such as a tungsten reflector.

As shown in FIG. 4 , multisync medium 400 may be disposed within one or more cavities, gaps, or spaces 270 of imaging devices 100 , 200 , 250 . In some cases, multisync medium 400 may be connected to one or more cavities, gaps, or spaces 270 of imaging device 100, 200, 250 (e.g., cavity 270 shown in Figures 5 or 6). You can fill in all or part of it. In some cases, multi-sink media may be disposed between housing 231 and heat sink 268. In some cases, multisync media may contact housing 231 of imaging device 100, 200, 250. In some cases, multi-sink media may contact one or more heatsinks 268 of imaging devices 100, 200, 250. In some cases, multi-sink media 400 is disposed between one or more heat sinks 268 of imaging devices 100, 200, 250 and a substrate 260 (e.g., which may include a printed circuit board). It can be. In some cases, multisync medium 400 may contact substrate 260 of imaging device 100, 200, 250. Although not shown in contact in FIG. 4 , multisync media 400 may be connected to heatsink 268 and ASIC 106 (e.g., including control circuitry) of imaging devices 100, 200, 250. Alternatively, it may be placed between the housings 231. In some cases, multi-sync medium 400 may be used to connect transducers 202 (e.g., transducer arrays, elements, or pixels) and heatsinks 268 or housings 231 of imaging devices 100, 200, 250. It can be placed in between. In some embodiments, cavity 270 of imaging device 250 shown in FIG. 6 may be partially or completely filled with multisync media 400 and one or more acoustic absorber layers 230 and/or one or more adhesives. It is understood that layer 262 and/or one or more backing laminates may be in contact with multisink media 400.

3, 4, 5, and 6, according to various embodiments, heat sink 268 and/or housing may be placed on or directly coupled to the substrate of imaging device 250. . In some cases, such configurations may provide one or more cavities, gaps, or spaces 270 in which multi-sink media 400 may be placed. In some cases, such configurations allow heatsink 268 and/or substrate 260 to mechanically support one or more components of imaging device 250 (e.g., rather than multisink media 400). do.

In some cases, imaging devices 100, 200, 250 may transmit data, including control signals (e.g., via port 234 or a wireless transceiver) to an external device, e.g., a computing device. It may include a communication unit 232 for communicating with the device. Imaging devices 100, 200, 250, for example, may include memory 236 (e.g. For example, non-transitory memory) may be included. Memory 236 may be embodied as volatile or non-volatile memory or data storage (e.g., as described herein) capable of performing the functions described herein. In some cases, memory 236 may store various data and software that may be used during operation of imaging devices 100, 200, 250, such as operating systems, applications, programs, libraries and/or drivers.

In some cases, imaging device 100, 200, 250 may include a battery 238, for example, to provide power to one or more components of the imaging device, such as a transducer, processor, and/or memory. there is. Battery 238 may include a battery charging circuit, which may be a wireless or wired charging circuit. According to some embodiments, imaging devices 100, 200, 250 may include a gauge indicating battery charge consumed, which gauge may be used to configure the imaging device to optimize power management for improved battery life. Can be used to configure. Additionally or alternatively, according to some embodiments, imaging device 100, 200, 250 may be connected to an external power source (e.g., a plug to power the imaging device from an electrical wall outlet). Power can be supplied by

In various embodiments, imaging devices 100, 200, 250 may include different suitable form factors. In some embodiments, a portion of imaging device 100, 200, 250 that includes transducer 202 may extend outward from the remaining portion of imaging device 100, 200, 250. Imaging devices 100, 200, 250 may be used as convex array probes, micro-convex array probes, linear array probes, endovaginal probes, endorectal probes, surgical probes, or intraoperative probes. It may be embodied as any suitable ultrasound medical probe, such as an intraoperative probe.

7A-7C show a multi-sync medium 400 (e.g., between a transducer of an imaging system or device 100, 200, 250 and one or more additional components, such as a heat sink, metal backing, or housing). shows the effect of incorporating on scan quality and scan artifacts. Figure 7A shows a scan of a test target material (including a pin target, a wire target, and a cyst), where a metal backing (in this case an aluminum backing) is present in the test target material (e.g., ASIC and transducer). It is coupled to the integrated circuit board 260 of the imaging device 100, 200, 250 (e.g., via an adhesive) utilized (to provide maximum heat transfer from the electronic components). The scan shows significant reverberation artifacts; Washout makes test material targets or features indistinguishable. Figure 7b shows a scan of the same test target material using the same scan settings, where a multi-sink medium 400 is utilized between the electronic components (including the integrated circuit board 260) and an aluminum heatsink. The scan shows clear characterization of all targets and features in the test material with little or no echo artifacts. FIG. 7C shows an illustrative scan of the same test target material using the same scan settings, where an air backing is utilized between the electronic components (including integrated circuit board 260) and an aluminum heatsink. The scan shows clear characterization of all targets and features in the test material with little or no echo artifacts.

8A-8C illustrate multiple sink media of various thicknesses (e.g., between a transducer of an imaging system or device 100, 200, 250 and one or more additional components, such as a heat sink, metal backing, or housing). Shows the effect of incorporating 400 on scan quality and scan artifacts. FIG. 8A shows a test at a center frequency of 5.1 MHz using an imaging device 100 comprising a 0.5 mm thick multi-sink medium 400 disposed between the imaging device's integrated circuit board 260 and an aluminum heatsink. Shown are scans of target material (including pin targets, wire targets, and cysts). The scan shows clearly distinguishable test material targets and features with only slight reverberation artifact striation in the image. These results show a significant improvement over scan results without multisync media 400 (e.g., as shown in Figure 7A). Figure 8b shows a scan of the same test material using the same scan settings and instrument conditions except that the thickness of the multisync media 400 is 1.0 mm. The scan shows a significant improvement over the scan results shown in Figure 8A, with a clear characterization of all targets and features in the test material with little or no reverberation artifacts as a result of the increased thickness of the multi-sync medium 400. An image is obtained. FIG. 8C shows that the multisink medium 400 is replaced with an air backing (e.g., an air-filled gap between the transducer and the heatsink of the imaging device 100 instead of the gap filled with the multisink medium 400). Except it shows a scan of the same test material using the same scan settings and instrument conditions. The scan shows results similar to those shown in Figure 8b, with clear features of all targets and features in the test material evident in the image and little to no echo artifacts. Overall, these results show that multi-sync media 400 thicknesses of less than 0.5 mm are sufficient to improve ultrasound scan quality (e.g., reduce reverberation artifacts), and that multi-sync media thicknesses of as little as 1.0 mm are sufficient to improve ultrasound scan quality (e.g., reduce reverberation artifacts). It is shown that at a thickness of 400 the quality improves to ideal conditions (e.g., as a result of reduction of internal acoustic reflections and reverberation artifacts). These results demonstrate that a multi-sink media 400 thickness of 1.5 mm (e.g., +/-0.25 mm) is sufficient to attenuate or eliminate all echo artifacts from any scan condition in the mid-range or high center frequencies. implies that

9A-9C use scans with lower center frequencies to scan one or more components (e.g., a transducer, a heat sink, a metal backing, or housing) of an imaging system or device 100, 200, 250. The effect of incorporating multi-sink media 400 of various thicknesses (among additional components) is shown on scan quality and scan artifacts. FIG. 9A shows a test at a center frequency of 1.8 MHz using an imaging device 100 comprising a 0.5 mm thick multi-sink medium 400 disposed between the imaging device's integrated circuit board 260 and an aluminum heatsink. Shown are scans of target material (including pin targets, wire targets, and cysts). The scan shows clearly distinguishable test material targets and features with only slight echo artifact streaks in the image. These results show a significant improvement over scan results without multisync media 400 (e.g., as shown in Figure 7A). Figure 9b shows a scan of the same test material using the same scan settings and instrument conditions except that the thickness of the multisync media 400 is 1.0 mm. The scan shows a significant improvement over the scan results shown in Figure 9A, with a clear characterization of all targets and features in the test material with little or no reverberation artifacts as a result of the increased thickness of the multi-sync medium 400. An image is obtained. 9C illustrates that the multisink medium 400 is replaced with an air backing (e.g., an air-filled gap between the transducer and the heatsink of the imaging device 100 instead of the gap filled with the multisink medium 400). It shows a scan of the same test material, except that it uses the same scan settings and instrument conditions. The scan shows results similar to those shown in Figure 9b, with clear features of all targets and features in the test material evident in the image and little to no echo artifacts. Overall, these results show that a multi-sync media 400 thickness of less than 0.5 mm is sufficient to improve ultrasound scan quality (e.g., reduce reverberation artifacts), and a multi-sync media 400 thickness of at least 1.0 mm. shows that the quality improves to ideal conditions (e.g. as a result of reduction of internal acoustic reflections and reverberation artifacts). These results suggest that a multi-sync media 400 thickness of 1.5 mm (e.g., +/-0.25 mm) is sufficient to attenuate or eliminate all echo artifacts from any scan condition at low center frequencies. .

transducer

In some cases, the systems, devices, or methods described herein may include one or more piezoelectric micromachine ultrasound transducers (pMUTs). In some cases, the systems, devices, or methods described herein may include one or more capacitive micromachine ultrasonic transducers (cMUTs). A piezoelectric micromachine ultrasound transducer (pMUT) may be formed on a substrate 260, such as a semiconductor wafer (eg, printed circuit board (PCB)). A pMUT element constructed on a semiconductor substrate 260 can provide a smaller size profile than bulky conventional transducers with bulkier piezoelectric materials. In some cases, pMUTs may also be less expensive to manufacture and/or enable less complex, higher performance interconnections between the transducer and additional electronics of an ultrasound device or system.

A micromachine ultrasound transducer (MUT), which may include a pMUT and/or cMUT, is a diaphragm (e.g., a thin transducer attached to one or more portions of the interior of the imaging device (e.g., an ultrasound probe), e.g., at a membrane edge). In contrast, traditional bulk piezoelectric (PZT) elements typically consist of a single solid piece of material, for example, at appropriate intervals. Additionally, traditional PZT ultrasonic systems and devices can be expensive to manufacture because great precision is required to cut and mount the PZT or ceramic materials that make up the PZT ultrasonic systems and devices. The transducer impedance can be much higher compared to the impedance of the electronic device, which can have a negative impact on performance.

In some cases, one or more transducer elements 104 may be configured to transmit and/or receive signals of a particular frequency or bandwidth (e.g., where the bandwidth is associated with a center frequency). In some cases, one or more transducer elements may be further configured to transmit and/or receive signals of additional center frequencies and bandwidths. This multi-frequency transducer element 104 may be referred to as a multi-modal element 104 and, in some embodiments, may be used to extend the bandwidth of the imaging system or device 100. . The transducer element or pixel 104 emits (e.g., transmits) ultrasonic energy (e.g., an ultrasonic waveform, pattern, or pressure wave) at a suitable center frequency, e.g., 0.1 megahertz (MHz) to 100 MHz. and/or may be configured to receive. In some cases, transducer or pixel 104 has a frequency range of 0.1 MHz to 1 MHz, 0.1 MHz to 1.8 MHz, 0.1 MHz to 3.5 MHz, 0.1 MHz to 5.1 MHz, 0.1 MHz to 10 MHz, 0.1 MHz to 25 MHz, 0.1 MHz to 50 MHz, 0.1MHz to 100MHz, 1MHz to 1.8MHz, 1MHz to 3.5MHz, 1MHz to 5.1MHz, 1MHz to 10MHz, 1MHz to 25MHz, 1MHz to 50MHz, 1MHz to 100MHz, 1.8MHz to 3.5MHz, 1.8MHz to 5.1MHz, 1.8MHz to 10 MHz, 1.8 MHz to 25 MHz, 1.8 MHz to 50 MHz, 1.8 MHz to 100 MHz, 3.5 MHz to 5.1 MHz, 3.5 MHz to 10 MHz, 3.5 MHz to 25 MHz, 3.5 MHz to 50 MHz, 3.5 MHz to 100 MHz, 5.1 MHz to 10 MHz, 5.1 Configured to transmit or receive ultrasonic energy with a center frequency of MHz to 25 MHz, 5.1 MHz to 50 MHz, 5.1 MHz to 100 MHz, 10 MHz to 25 MHz, 10 MHz to 50 MHz, 10 MHz to 100 MHz, 25 MHz to 50 MHz, 25 MHz to 100 MHz, or 50 MHz to 100 MHz. It can be. In some cases, the transducer or pixel 104 may be configured to transmit or receive ultrasonic energy with a center frequency of 0.1 MHz, 1 MHz, 1.8 MHz, 3.5 MHz, 5.1 MHz, 10 MHz, 25 MHz, 50 MHz, or 100 MHz. In some cases, the transducer or pixel 104 may be configured to transmit or receive ultrasonic energy with a center frequency of at least 0.1 MHz, 1 MHz, 1.8 MHz, 3.5 MHz, 5.1 MHz, 10 MHz, 25 MHz, 50 MHz, or 100 MHz. . In some cases, the transducer or pixel 104 is configured to transmit or receive ultrasonic energy at a center frequency of at most 0.1 MHz, 1 MHz, 1.8 MHz, 3.5 MHz, 5.1 MHz, 10 MHz, 25 MHz, 50 MHz, or 100 MHz. It can be configured.

Multi-sync media (400)

An imaging device or system described herein (e.g., an ultrasound imaging device or system) may include a multi-sync medium 400. The multi-sink medium 400 may be acoustically nonconductive (eg, does not conduct ultrasonic energy). The multi-sync medium 400 may be acoustically nonreflective (eg, does not reflect ultrasonic energy). For example, in some embodiments, multisync medium 400 may partially or completely inhibit conduction and/or reflection of acoustic energy (e.g., ultrasonic energy). In some cases, multi-sync medium 400 may partially or completely absorb or dissipate acoustic energy (e.g., ultrasonic energy). Multi-sink media 400 may be thermally conductive. The multi-sink medium 400 may include a material that is both thermally conductive and acoustically non-conductive.

In many cases, multisync medium 400 may absorb some or all of the energy of an incident ultrasound waveform or pattern (eg, be acoustically non-conductive). For example, the multi-sync medium 400 may include a material that can reduce the energy of an incident ultrasound waveform or pattern. In many cases, multisync medium 400 may include a material that can absorb all or a portion of the incident acoustic energy produced by an ultrasonic transducer of an imaging device or system described herein. In some cases, multi-sync medium 400 may absorb acoustic energy (e.g., a portion of an imaging device or system) that is reflected toward a transducer of an imaging device or system, for example, from a material other than the target material or a portion thereof. between the ultrasonic transducer and acoustically reflective material, such as the housing 231, heatsink 268, and/or substrate 260 of the imaging device or system, to reduce transmission of acoustic energy reflected from the acoustically reflective material comprising is placed in In some cases, materials containing metals may be acoustically reflective. In some cases, multi-sink media 400 may be metal-free. In some cases, multi-sink media 400 may be free of metal oxides. For example, in some embodiments, multi-sink media 400 may not include metal particles (eg, aluminum particles).

The multi-sink medium 400 may include paste or putty. In some cases, multi-sync media 400 may include filler. In some cases, multi-sync media 400 may include tape, sheet, or film. In some cases, the multi-sync medium 400 may include a pad.

In some cases, multi-sink media 400 may include an elastomer. For example, the multi-sink medium 400 may include silicone elastomer or silicone-based elastomer. In some cases, silicone elastomers or silicone-based elastomers are characterized by desirable deformability properties (e.g., the ability to flow and/or pour or extrude at room temperature) and high thermal conductivity (e.g., which may result from the thermal conductivity of silicone). It can be combined with The multi-sync medium 400 may include a material capable of suppressing, at least partially, the propagation of ultrasonic energy. In some cases, multi-sink medium 400 may include a material capable of absorbing, at least partially, ultrasonic energy. For example, the multi-sink medium 400 may include a ceramic material. In some cases, the multi-sink medium 400 may include ceramic-filled silicone elastomer (or ceramic-filled silicone-based elastomer). In some cases, multi-sink media 400 may include particles dispersed within the bulk of multi-sink media 400. For example, the multi-sink medium 400 may include silicone elastomer containing ceramic particles. In some cases, the silicone-based elastomer containing ceramic particles may be a paste or putty.

In some cases, multisink media 400 may be deformable or flowable (e.g., at room temperature). The multisink medium 400, which is deformable or flowable at room temperature (e.g., injectable at room temperature), may be used to completely heat the heatsink of an imaging system or device (100, 200, 250). or within a cavity within a probe of an imaging device or system, such as a partially surrounding cavity. In some cases, multisync medium 400 may be implanted into a cavity, gap, or space 270 of an imaging system or device 100, 200, 250, or a portion thereof (e.g., where multisync medium 400 ) is in contact with the heat sink and/or printed circuit board). In some embodiments, multisync media 400 may be added to an imaging device or system or portion thereof (e.g., in contact with a heatsink and/or a printed circuit board of an imaging device or system probe). For example, multisink media 400 may be injectable (e.g., at room temperature) or moldable. In some cases, the multi-sink medium 400 may have a flow rate of 25 grams per minute (g/min) to 45 g/min. In some cases, multi-sink media 400 may have a flow rate of 25 g/min to 30 g/min, 25 g/min to 35 g/min, 25 g/min to 40 g/min, 25 g/min to 45 g/min, 30 g/min to 35 g/min. , 30 g/min to 40 g/min, 30 g/min to 45 g/min, 35 g/min to 40 g/min, 35 g/min to 45 g/min, or 40 g/min to 45 g/min. In some cases, multi-sink media 400 may have a flow rate of 25 g/min, 30 g/min, 35 g/min, 40 g/min, or 45 g/min. In some cases, the multi-sink medium 400 may have a flow rate of at least 25 g/min, at least 30 g/min, at least 35 g/min, at least 40 g/min, or at least 45 g/min. In some cases, multi-sink media 400 may have a flow rate of up to 30 g/min, up to 35 g/min, up to 40 g/min, or up to 45 g/min. In some cases, multisink media 400 has non-Newtonian viscosity (e.g., has shear thinning properties). In some cases, multisink media 400 has a time-dependent viscosity (e.g., has thixotropic properties). In some cases, the multi-sink media 400, which is or includes an elastomer, may be deformable or flowable. For example, in some embodiments, multisink media 400, which is an elastomer, may be injectable or moldable.

In some cases, the deformable or flowable (e.g., injectable or moldable) multisink medium 400 may be used as part of an imaging system or imaging device for which it would otherwise be difficult or potentially impossible to improve heat transfer. Heat transfer can be improved. For example, imaging systems and imaging devices or parts thereof (e.g., ultrasonic transducer probes), especially those that benefit from reduced or miniaturized overall dimensions (e.g., handheld ultrasonic transducer probe heads) heat transfer is often facilitated by a traditional heatsink (e.g., a metal heatsink such as an aluminum heatsink block), which is supported by other potentially heat-sensitive components of the imaging system or device. may be located on, attached to, in contact with, or proximate to but not in contact with, and may need to be manufactured separately to form a cavity, gap, or space (e.g., filled with air) in the imaging system or device or portion thereof. This may be possible or necessary. These cavities, gaps, or spaces (eg, if filled with a thermal insulator such as a gas, eg, air) can reduce heat transfer within the imaging system or imaging device. Traditional heatsinks (eg, metal heatsinks such as aluminum heatsink blocks) may not be easily fabricated to fill these cavities, gaps or spaces. Accordingly, the inclusion of a multi-sink medium 400, which may be molded, pressed, injected, deformed, or otherwise allowed to conform to all or part of a cavity, gap, or space of an imaging system or device, may provide a method for traditional heat transfer. It can improve heat transfer to areas of the imaging system and device that may not be occupied by components. In some cases, a multisink (eg, disposed within an imaging system or device or within a cavity, gap or space 270 thereof) may have a thickness of 0.5 (millimeter) mm to 2.0 mm. In some cases, multiple sinks (e.g., disposed within or within a cavity, gap or space 270 of an imaging system or device) have a thickness of 0.5 millimeters (mm) to 0.8 mm, 0.5 mm to 1.0 mm, 0.5 mm to 0.5 mm. 1.3mm, 0.5mm to 1.5mm, 0.5mm to 1.7mm, 0.5mm to 2mm, 0.8mm to 1.0mm, 0.8mm to 1.3mm, 0.8mm to 1.5mm, 0.8mm to 1.7mm, 0.8mm to 2mm, 1.0 mm to 1.3mm, 1.0mm to 1.5mm, 1.0mm to 1.7mm, 1.0mm to 2.0mm, 1.3mm to 1.5mm, 1.3mm to 1.7mm, 1.3mm to 2mm, 1.5mm to 1.7mm, 1.5mm to 2.0 mm, or may have a thickness of 1.7 mm to 2.0 mm. In some cases, the multisync (e.g., disposed within the imaging system or device or within a cavity, gap or space 270 thereof) may be 0.5 mm, 0.8 mm, 1.0 mm, 1.3 mm, 1.5 mm, 1.7 mm, Alternatively, it may have a thickness of 2.0mm. In some cases, the multisync (e.g., disposed within the imaging system or device or within a cavity, gap or space 270 thereof) has a width of at least 0.5 mm, at least 0.8 mm, at least 1.0 mm, at least 1.3 mm, or at least 1.5 mm. mm, at least 1.7 mm, or at least 2.0 mm. In some cases, multiple syncs (e.g., disposed within an imaging system or device or within a cavity, gap, or space 270 thereof) may be up to 0.8 mm, up to 1.0 mm, up to 1.3 mm, up to 1.5 mm, up to 1.7 mm. mm, or up to 2.0 mm thick. In some cases, when the multi-sync medium of the imaging system or device 100, 200, 250 has a thickness of at least 1.0 mm or at least 1.5 mm, reverberation artifacts can be completely eliminated from the ultrasound scan, and in some cases, are acceptable. The error is +/-0.25mm. In some cases, a method of manufacturing an imaging system or device (100, 200, 250) includes injecting multisync medium (400) to partially or completely fill one or more cavities, gaps, or spaces (270) of the imaging system or device. It may include the step of forming or molding. In some cases, the imaging system or device 100, 200, 250 may be provided with a fully captured edge (e.g., where a seepage of the multisync medium 400 when injected, for example) may be provided. To prevent this, the edges of one or more cavities, gaps or spaces 270 of the imaging system or device are sealed together when joined). In some cases, the imaging system or device (100, 200, 250) is equipped with a device (e.g., , one or more injection ports may be provided (through one or more heat sinks of the imaging system or device). In some cases, the injection port may be inserted through a side of the housing or heatsink (e.g., from the exterior side of the heatsink, so as not to disturb the bonding between the substrate 260 and the heatsink). (with the inner side of the heat sink open to a cavity, gap or space). In some cases, before the heat sink and substrate or housing and substrate are combined/bonded, for example, to entrap the multi-sink media 400 within a cavity, gap or space when the heat sink is bonded to the substrate. Multisync media 400 may be added to the imaging device or system.

In some cases, multisink media 400 may be thermally conductive. For example, the multi-sink medium 400 may have a thermal conductivity of 2 W/mK (Watts per meter-Kelvin) to 7 W/mK. In some cases, the multi-sync medium 400 has a power output of 2 W/mK to 2.3 W/mK, 2 W/mK to 2.5 W/mK, 2 W/mK to 3 W/mK, 2 W/mK to 3.7 W/mK, and 2 W/mK to 2 W/mK. 4W/mK, 2W/mK to 5W/mK, 2W/mK to 5.5W/mK, 2W/mK to 6W/mK, 2W/mK to 6.4W/mK, 2W/mK to 7W/mK, 2.3W/mK to 2.5W/mK, 2.3W/mK to 3W/mK, 2.3W/mK to 3.7W/mK, 2.3W/mK to 4W/mK, 2.3W/mK to 5W/mK, 2.3W/mK to 5.5W /mK, 2.3 W/mK to 6 W/mK, 2.3 W/mK to 6.4 W/mK, 2.3 W/mK to 7 W/mK, 2.5 W/mK to 3 W/mK, 2.5 W/mK to 3.7 W/mK, 2.5W/mK to 4W/mK, 2.5W/mK to 5W/mK, 2.5W/mK to 5.5W/mK, 2.5W/mK to 6W/mK, 2.5W/mK to 6.4W/mK, 2.5W/ mK to 7W/mK, 3W/mK to 3.7W/mK, 3W/mK to 4W/mK, 3W/mK to 5W/mK, 3W/mK to 5.5W/mK, 3W/mK to 6W/mK, 3W/ mK to 6.4W/mK, 3W/mK to 7W/mK, 3.7W/mK to 4W/mK, 3.7W/mK to 5W/mK, 3.7W/mK to 5.5W/mK, 3.7W/mK to 6W/ mK, 3.7W/mK to 6.4W/mK, 3.7W/mK to 7W/mK, 4W/mK to 5W/mK, 4W/mK to 5.5W/mK, 4W/mK to 6W/mK, 4W/mK to 6.4W/mK, 4W/mK to 7W/mK, 5W/mK to 5.5W/mK, 5W/mK to 6W/mK, 5W/mK to 6.4W/mK, 5W/mK to 7W/mK, 5.5W/ mK to 6W/mK, 5.5W/mK to 6.4W/mK, 5.5W/mK to 7W/mK, 6W/mK to 6.4W/mK, 6W/mK to 7W/mK, or 6.4W/mK to 7W/ It can have a thermal conductivity of mK. In some cases, the multisync medium 400 has 2W/mK, 2.3W/mK, 2.5W/mK, 3W/mK, 3.7W/mK, 4W/mK, 5W/mK, 5.5W/mK, 6W/mK. , may have a thermal conductivity of 6.4W/mK or 7W/mK. In some cases, multisync medium 400 has a power output of at least 2 W/mK, at least 2.3 W/mK, at least 2.5 W/mK, at least 3 W/mK, at least 3.7 W/mK, at least 4 W/mK, at least 5 W/mK, at least It may have a thermal conductivity of 5.5 W/mK, at least 6 W/mK, at least 6.4 W/mK, or at least 7.0 W/mK. In some cases, multi-sync media 400 can provide up to 2.3 W/mK, up to 2.5 W/mK, up to 3 W/mK, up to 3.7 W/mK, up to 4 W/mK, up to 5 W/mK, up to 5.5 W/mK, It can have a thermal conductivity of up to 6 W/mK, up to 6.4 W/mK, or up to 7 W/mK. In some cases, the choice of matrix material may determine whether the multisink media 400 is thermally conductive. In some cases, multisink media 400 may be thermally conductive when it includes a silicone elastomer or silicone-based elastomer. The thermally conductive multisink medium 400 can improve heat transfer in an imaging device or imaging system. For example, multisync medium 400 (e.g., in contact with a component of an imaging device or imaging system, such as an integrated circuit (e.g., ASIC), processor, and/or transducer element) may be configured to (e.g. , from one or more components that may generate heat (during operation) and/or may be sensitive to excessive heat (e.g., may overheat, experience reduced performance, and/or fail in the presence of excessive heat). It can help transfer heat. In some cases, multisink media 400 may facilitate heat transfer by contacting other thermally conductive components of the imaging system or imaging device, such as the heatsink and/or housing or casing of the imaging system or imaging device. You can. In some cases, a heat sink that is thermally conductive may be added to the imaging system or imaging device or portion thereof, for example, to improve heat transfer (e.g., from one or more thermally sensitive components of the imaging system or imaging device). It may be located, disposed, injected or deposited into a cavity, gap or space. In some cases, cavities, gaps, or spaces in an imaging system or device may result from the method used to manufacture the imaging system or device, or may electrically or disconnect a first component of the system or device from a second component of the system or device. May be included in the design of a system or device to assist in mechanical isolation. In some cases, a multisink that is located, disposed, injected or deposited into a cavity, gap or space of an imaging system or imaging device or portion thereof may contain components or materials that would otherwise be located in the cavity, gap or space (e.g. , a gas such as air), for example, where the replaced component or material has a lower thermal conductivity than the multi-sink medium 400. For example, filling cavities, gaps, or spaces of an imaging system or device with multisink media 400 can replace components or materials with low thermal conductivity (e.g., air) and reduce heat within the system or device. Transmission can be increased, which can reduce the risk of overheating or heat-related performance degradation of the imaging system or imaging device. In some cases, multisink media 400 is both thermally conductive (e.g., as described herein) and acoustically non-conductive (e.g., acoustically insulating) because it contains many thermally conductive materials (e.g. , aluminum heatsinks) may cause artifacts during ultrasonic scanning, for example, as a result of acoustic reflections arising due to the presence of ultrasonic reflection tendencies in thermally conductive materials.

Backing layer

The imaging system or device 100 described herein (e.g., ultrasound imaging system or device 100) may include a backing layer 232 (e.g., a backing laminate). In some cases, for example, a backing layer 232 (e.g., a backing laminate) comprising absorber layer 230 and/or multi-sink media 400 may be used to form, for example, an imaging system or device 100. ) may be added to the imaging system or device 100 (e.g., placed inside a probe of the imaging system or device 100) to reduce echo artifacts that may result from reflection of ultrasonic energy within the probe. In some cases, imaging system or device 100 may include multi-sync media 400 and backing layer 232. Backing layer 232 (eg, backing laminate) may include metal. For example, backing laminate 232 may include a tungsten reflector. In some cases, absorber layer 230, which in some cases may include a portion of backing layer 232, may include metal foam (eg, copper foam). In some cases, the backing layer (eg, backing laminate) may include an aluminum backing. In some cases, the backing layer (e.g., together with the components of the backing layer and/or one or more components of the imaging system or device 100, 200, 250, such as substrate 260 and/or heat sink 268) It may include one or more adhesive layers 262 for bonding to.

computing system

10, a computer system 1000 (e.g., computer system 1000) on which a set of instructions can be executed to cause a device to perform or execute any one or more of the aspects and/or methodologies for static code scheduling of the present disclosure. A block diagram depicting an example machine including a processing or computing system (e.g., a processing or computing system) is shown. The components in FIG. 10 are examples only and do not limit the scope of use or functionality of any hardware, software, embedded logic component, or combination of two or more such components to implement particular embodiments.

Computer system 1000 may include one or more processors 1001, memory 1003, and storage 1008 that communicate with each other and other components via bus 1040. Bus 1040 also includes a display 1032, one or more input devices 1033 (which may include, e.g., a keypad, keyboard, mouse, stylus, etc.), one or more output devices 1034, and one or more storage devices. (1035) and various tangible storage media (1036) can be linked. All of these elements may interface with bus 1040 directly or through one or more interfaces or adapters. For example, various tangible storage media 1036 may interface with bus 1040 via storage media interface 1026. Computer system 1000 includes one or more integrated circuits (ICs), printed circuit boards (PCBs), mobile handheld devices (e.g., mobile phones or PDAs), laptops or notebook computers, distributed computer systems, computing grids, or servers. It may have any suitable physical form, but is not limited thereto.

Computer system 1000 includes one or more processor(s) 1001 (e.g., a central processing unit (CPU), general purpose graphics processing unit (GPGPU), or quantum processing unit (QPU)) to perform functions. . Processor(s) 1001 optionally includes a cache memory unit 1002 for temporary local storage of instructions, data, or computer addresses. Processor(s) 101 are configured to assist in the execution of computer-readable instructions. Computer system 1000 may have processor(s) 1001 embodied in one or more tangible computer-readable storage media, such as memory 1003, storage 1008, storage devices 1035, and/or storage media 1036. As a result of executing non-transitory processor-executable instructions, the functionality of the components depicted in FIG. 10 may be provided. A computer-readable medium may store software implementing certain embodiments, and processor(s) 1001 may execute the software. Memory 1003 may be capable of reading software from one or more other computer-readable media (e.g., mass storage device(s) 1035, 1036) or from one or more other sources via a suitable interface, such as network interface 1020. there is. Software may cause processor(s) 1001 to perform one or more processes or one or more steps of one or more processes described or illustrated herein. Performing these processes or steps may include defining data structures stored in memory 1003 and modifying the data structures as directed by software.

Memory 1003 may include random access memory components (e.g., RAM 1004) (e.g., static RAM (SRAM), dynamic RAM (DRAM), ferroelectric random access memory (FRAM), phase change random access memory ( PRAM), etc.), read-only memory components (e.g., ROM 1005), and any combinations thereof. . The ROM 1005 may serve to transmit data and instructions unidirectionally to the processor(s) 1001, and the RAM 1004 may serve to transmit data and instructions bidirectionally to the processor(s) 1001. can do. ROM 1005 and RAM 1004 may include any suitable tangible computer-readable medium described below. In one example, a basic input/output system 1006 (BIOS) includes basic routines that help transfer information between elements within the computer system 1000, such as during start-up. It can be stored in (1003).

Stationary storage 1008 is bi-directionally coupled to processor(s) 1001, optionally via storage control device 1007. Non-stationary storage 1008 provides additional data storage capacity and may also include any suitable tangible computer-readable medium described herein. Storage 1008 may be used to store operating system 1009, executable file(s) 1010, data 1011, applications 1012 (application programs), etc. Storage 1008 may also include an optical disk drive, a solid-state memory device (eg, a flash-based system), or a combination of any of these. Information in storage 1008 may, where appropriate, be incorporated into memory 1003 as virtual memory.

In one example, storage device(s) 1035 may be removably interfaced with computer system 1000 (e.g., via an external port connector (not shown)) via storage device interface 1025. . In particular, storage device(s) 1035 and associated machine-readable media may provide non-volatile and/or volatile storage of machine-readable instructions, data structures, program modules and/or other data for computer system 1000. You can. In one example, software may reside, completely or partially, within a machine-readable medium of storage device(s) 1035. In another example, software may reside, completely or partially, within processor(s) 1001.

Bus 1040 connects various subsystems. References herein to a bus may, where appropriate, include one or more digital signal lines providing a common function. Bus 1040 may be any of several types of bus structures, including, but not limited to, memory buses, memory controllers, peripheral buses, local buses, and any combination thereof using any of a variety of bus architectures. By way of example and not limitation, these architectures include the Industry Standard Architecture (ISA) bus, Enhanced ISA (EISA) bus, Micro Channel Architecture (MCA) bus, Video Electronics Standards Association local bus (VLB), Peripheral Component Interconnect (PCI) bus, It includes a PCI-Express (PCI-X) bus, an Accelerated Graphics Port (AGP) bus, a HyperTransport (HTX) bus, a serial advanced technology attachment (SATA) bus, and combinations thereof.

Computer system 1000 may also include input device 1033. In one example, a user of computer system 1000 may input commands and/or other information into computer system 1000 through input device(s) 1033. Examples of input device(s) 1033 include alphanumeric input devices (e.g., keyboards), pointing devices (e.g., mice or touchpads), touchpads, touch screens, multi-touch screens, joysticks, styluses, and games. Including, but not limited to, pads, audio input devices (e.g., microphones, voice response systems, etc.), optical scanners, video or still image capture devices (e.g., cameras), and any combinations thereof. In some embodiments, the input device is Kinect, Leap Motion, etc. Input device(s) 1033 may be any of a variety of input interfaces 1023 (e.g., input It may be interfaced with the bus 1040 through an interface 1023).

In certain embodiments, when computer system 1000 is connected to network 1030, computer system 1000 can connect to other devices connected to network 1030, specifically mobile devices and enterprise systems, distributed computing systems, and cloud storage. It can communicate with systems, cloud computing systems, etc. Communications with computer system 1000 may be transmitted via network interface 1020. For example, network interface 1020 may receive incoming communications (e.g., a request or response from another device) in the form of one or more packets (e.g., Internet Protocol (IP) packets) from network 1030; Computer system 1000 may store incoming communications in memory 1003 for processing. Computer system 100 may similarly store outgoing communications in the form of one or more packets (e.g., a request or response to another device) in memory 1003 and forward them from network interface 1020 to network 1030. Processor(s) 1001 may access these communication packets stored in memory 1003 for processing.

Examples of network interfaces 1020 include, but are not limited to, network interface cards, modems, and any combinations thereof. Examples of networks 1030 or network segments 1030 include distributed computing systems, cloud computing systems, wide area networks (WANs) (e.g., the Internet, enterprise networks), local area networks (LANs) (e.g., office , a network associated with a building, campus, or other relatively small geographic space), a telephone network, a direct connection between two computing devices, a peer-to-peer network, and any combination thereof. A network, such as network 1030, may utilize wired and/or wireless communication modes. In general, any network topology can be used.

Information and data may be displayed via display 1032. Examples of displays 1032 include cathode ray tube (CRT), liquid crystal display (LCD), thin film transistor liquid crystal display (TFT-LCD), passive-matrix OLED (PMOLED), or active-matrix OLED (AMOLED) displays. Such as organic liquid crystal display (OLED), plasma display, and any combination thereof. Display 1032 may interface with other devices, such as processor(s) 1001, memory 1003, and fixed storage 1008, as well as input device(s) 1033 via bus 1040. Display 1032 is connected to bus 1040 through video interface 1022, and data transfer between display 1032 and bus 1040 can be controlled through graphics control 1021. In some embodiments, the display is a video projector. In some embodiments, the display is a head mounted display (HMD), such as a VR headset. In further embodiments, suitable VR headsets include, but are not limited to, HTC Vive, Oculus Rift, Samsung Gear VR, Microsoft HoloLens, Razer OSVR, FOVE VR, Zeiss VR One, Avegant Glyph, Freefly VR headsets, etc. . In still other embodiments, the display is a combination of devices such as those disclosed herein.

In addition to display 1032, computer system 1000 may include one or more other peripheral output devices 1034, including but not limited to audio speakers, printers, storage devices, and any combination thereof. These peripheral output devices may be connected to bus 1040 through output interface 1024. Examples of output interfaces 1024 include, but are not limited to, serial ports, parallel connections, USB ports, FIREWIRE ports, THUNDERBOLT ports, and any combination thereof.

Additionally or alternatively, computer system 1000 may be hardwired in circuitry, capable of operating instead of or in conjunction with software to execute one or more processes or one or more steps of one or more processes described or illustrated herein. Functionality can be provided as a result of logic that is otherwise specified. In this disclosure, reference to software may include logic, and reference to logic may include software. Moreover, reference to a computer-readable medium may include circuitry (e.g., IC) storing software for execution, circuitry embodying logic for execution, or both, as appropriate. This disclosure includes hardware, software, or any suitable combination of both.

Those skilled in the art will recognize that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of both. you will understand To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality.

Various example logical blocks, modules, and circuits described in connection with the embodiments disclosed herein include general-purpose processors, digital signal processors (DSPs), and application specific integrated circuits (ASICs) designed to perform the functions described herein. circuit), a field programmable gate array (FPGA), or other programmable logic device, individual gate or transistor logic, individual hardware components, or any combination thereof. A general-purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors combined with a DSP core, or any other such configuration.

The steps of the method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, as a software module executed by one or more processors, or a combination of the two. Software modules may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from and write information to the storage medium. Alternatively, a storage medium may be integrated into the processor. The processor and storage media may reside in an ASIC. ASIC may exist in the user terminal. Alternatively, the processor and storage medium may exist as separate components in the user terminal.

In accordance with the description herein, suitable computing devices include, but are not limited to, server computers, desktop computers, laptop computers, notebook computers, handheld computers, Internet devices, mobile smartphones, and tablet computers. Additionally, those skilled in the art will recognize that selected televisions, video players, and digital music players with optional computer network connections are suitable for use in the systems described herein. In various embodiments, suitable tablet computers include tablet computers with booklet configurations, slate configurations, and convertible configurations known to those skilled in the art.

In some embodiments, a computing device includes an operating system configured to perform executable instructions. An operating system is software, including programs and data, that manages the device's hardware, for example, and provides services for running applications. Those skilled in the art ^will recognize that suitable server operating systems ^include , but are not limited ^to , FreeBSD, OpenBSD, NetBSD ^{® ,} Linux ^, Apple ^® Mac OS You will recognize that it includes ^® . Those skilled in the art will recognize that suitable personal computer operating systems include, but are not limited to, UNIX-like, such as Microsoft ^® Windows ^® , Apple ^® Mac OS X ^® , UNIX ^® , and GNU/Linux ^® You will recognize that it includes an operating system. In some embodiments, the operating system is provided by cloud computing. Those skilled in the art will also know that suitable mobile smartphone operating systems include, but are not limited to, Nokia ^® Symbian ^® OS, Apple ^® iOS ^® , Research In Motion ^® BlackBerry OS ^® , Google ^® Android ^® , Microsoft ^® Windows It will be recognized that this includes Phone ^® OS, Microsoft ^® Windows Mobile ^® OS, Linux ^® , and Palm ^® WebOS ^® .

Application field

In some cases, the imaging system or device 100 described herein may be used for (e.g., non-invasive) medical imaging, lithotripsy, localized tissue heating for therapeutic intervention, and highly intensive focused ultrasound. ) (HIFU) can be used for flow measurements in surgery and/or non-medical applications in pipes (or speaker and microphone arrays). In some cases, an imaging system or device described herein determines the direction and/or velocity of fluid flow (e.g., blood flow) in an artery and/or vein, for example, using Doppler mode imaging. can be used to In some cases, the imaging system or device described herein can be used to measure tissue stiffness.

In some cases, the imaging system or device 100 described herein may be configured to perform one-dimensional imaging (eg, A-scan imaging). In some cases, the imaging system or device 100 described herein may be configured to perform two-dimensional imaging (eg, B-scan imaging). In some cases, the imaging system or device 100 described herein may be configured to perform three-dimensional imaging (eg, C-scan imaging). In some cases, the imaging system or device 100 described herein may be configured to perform Doppler imaging. In some cases, the imaging system or device 100 described herein can switch to (eg, between) different modes, including linear mode or sector mode. In some cases, imaging system or device 100 may be electronically configured under program control (eg, by a user).

In many cases, imaging system or device 100 (eg, probes of imaging system or device 100) may be portable. For example, imaging system or device 100 includes a handheld casing that can accommodate (e.g., housed within a housing) one or more transducer elements, pixels or arrays, ASICs, control circuitry, and/or computing devices. can do. In some cases, imaging system or device 100 may include a battery.

specific definition

Unless otherwise defined, all technical terms used in this specification have the same meaning as commonly understood by a person skilled in the art to which this subject matter belongs.

As used in this specification and the appended claims, the singular forms (“a, an,” and “the”) refer to plural referents (“a, an,” and “the”) unless the context clearly dictates otherwise. Includes plural references). Any reference to “or” herein is intended to encompass “and/or” unless otherwise stated.

References throughout this specification to “some embodiments,” “additional embodiments,” or “a specific embodiment” refer to at least one embodiment in which a particular feature, structure, or characteristic described in connection with that embodiment is present. means included in. Accordingly, the appearances of the phrases “in some embodiments” or “in further embodiments” or “in a particular embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Moreover, specific features, structures, or characteristics may be combined in any suitable way in one or more embodiments.

Although preferred embodiments of the subject matter have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, modifications, and substitutions will now occur to those skilled in the art without departing from the present subject matter. It should be understood that various alternatives to the embodiments of the subject matter described herein may be used in practicing the subject matter.

Claims (41)

As an imaging device,
integrated circuit board;
a multi-sync medium in contact with the integrated circuit board; and
One or more microelectromechanical (MEM) ultrasonic transducers coupled to the integrated circuit board.
Including, an imaging device. 2. The imaging device of claim 1, further comprising a heat sink. 3. The imaging device of claim 2, wherein the heat sink comprises metal. 4. The imaging device of claim 3, wherein the metal is aluminum. 5. The imaging device of any one of claims 2-4, wherein the multi-sink medium is in contact with the heat sink. 6. The imaging device of any preceding claim, wherein the multi-sink medium is at least partially disposed between the one or more MEM transducers and the heat sink. 7. The imaging device of any preceding claim, wherein the device further comprises a housing coupled to the integrated circuit board. 8. The imaging device of claim 7, wherein the multi-sync medium is in contact with the housing. 9. The imaging device of claim 7 or 8, wherein the multisync medium is at least partially disposed between the one or more MEM transducers and the housing. 10. The imaging device of any one of claims 1 to 9, wherein the multisync medium is injectable. 11. The imaging device of any one of claims 1 to 10, wherein the multi-sink media has a flow rate of at least 29 g/min. 12. The imaging device of claim 11, wherein the multi-sink media has a flow rate of at least 40 g/min. 13. The imaging device of any one of claims 1 to 12, wherein the multi-sync medium has a thermal conductivity of at least 1.5 Watts per meter-Kelvin (W/mK). The imaging device of claim 13, wherein the multi-sync medium has a thermal conductivity of at least 3.7 Watt per meter-Kelvin (W/mK). The imaging device of claim 13, wherein the multi-sync medium has a thermal conductivity of at least 6.4 Watts per meter-Kelvin (W/mK). 16. The imaging device of any one of claims 1 to 15, wherein the multi-sync medium has a thickness of at least 0.5 mm. 17. The imaging device of claim 16, wherein the multi-sync medium has a thickness of at least 1.0 mm. 18. The imaging device of claim 17, wherein the multi-sync medium has a thickness of at least 1.5 mm. 19. The imaging device of any preceding claim, further comprising a backing material. 20. The imaging device of claim 19, wherein the backing material comprises a backing laminate. A method of manufacturing an imaging device, comprising:
forming an internal cavity by coupling a first component of the imaging device to an integrated circuit board;
coupling one or more microelectromechanical (MEM) ultrasonic transducers to the integrated circuit board; and
Injecting a multi-sink medium into the internal cavity
A method of manufacturing an imaging device, comprising: 22. The method of claim 21, wherein the first component comprises an acoustically reflective material. 23. The method of claim 21 or 22, wherein the first component is coupled directly to the integrated circuit board. 24. The method of any one of claims 21-23, wherein the first component is a heat sink. 25. The method of claim 24, wherein the heat sink comprises metal. 26. The method of any one of claims 23-25, wherein the multisink media is in contact with the heatsink. 22. The method of claim 21, wherein the first component includes a housing. 28. The method of claim 27, wherein the multisync medium is in contact with the housing. 29. The method of any one of claims 21-28, wherein the multisync medium is at least partially disposed between the one or more MEM transducers and the first component. 30. The method of any one of claims 21-29, wherein the multisync medium is injectable. 31. The method of any one of claims 21-30, wherein the multisink media has a flow rate of at least 29 g/min. 32. The method of claim 31, wherein the multi-sink media has a flow rate of at least 40 g/min. 33. The method of any one of claims 21 to 32, wherein the multi-sink medium has a thermal conductivity of at least 1.5 Watts per meter-Kelvin (W/mK). 34. The method of claim 33, wherein the multi-sync medium has a thermal conductivity of at least 3.7 Watts per meter-Kelvin (W/mK). 34. The method of claim 33, wherein the multi-sink medium has a thermal conductivity of at least 6.4 Watts per meter-Kelvin (W/mK). 36. The method of any one of claims 21-35, wherein the multisink media has a thickness of at least 0.5 mm after injection. 37. The method of claim 36, wherein the multi-sink media has a thickness of at least 1.0 mm after implantation. 37. The method of claim 36, wherein the multi-sink media has a thickness of at least 1.5 mm after implantation. 39. The method of any one of claims 21-38, further comprising bonding a backing material to the integrated circuit board. 40. The method of claim 39, wherein the backing material comprises a backing laminate. 41. The method of claim 39 or 40, wherein the backing material is at least partially disposed between the first component and the one or more MEM ultrasonic transducers.