KR20240078251A - Radar sensor module case and electronic device including the same - Google Patents

Abstract

An electronic device according to various embodiments of the present invention includes a display panel, a frame arranged to surround an edge of the display panel, a rear cover covering the back of the display panel, and disposed between the display panel and the rear cover. Includes a radar sensor module case, wherein the radar sensor module case includes a first support member, a first side member with a portion coupled to a first end of the first support member, and a second end of the first support member. a second side member, one portion of which is coupled to the first side member, a first end coupled to another portion of the first side member, a second end coupled to another portion of the second side member, and spaced apart from the first support member. a second support member disposed, a radio wave collection member disposed on the first side of the second support member, a radiation guide member disposed on the second side of the second support member, and a second support member disposed on the inner surface of the first side member. a printed circuit board having a first end coupled, a second end coupled to an inner surface of the second side member, and disposed between the first support member and the second support member, and the printed circuit board and the radio wave collection device. It is disposed between members and includes a radar sensor module electrically connected to the printed circuit board, and the radiation guide member may be configured to be exposed to the outside of the frame. Various other embodiments may be possible.

Description

Radar sensor module case and electronic device including the radar sensor module case {RADAR SENSOR MODULE CASE AND ELECTRONIC DEVICE INCLUDING THE SAME}

Various embodiments of the present invention relate to a radar sensor module case and an electronic device including the radar sensor module case.

The use of electronic devices such as televisions or closed circuit televisions (CCTVs) is increasing, and various functions are being provided to electronic devices.

The electronic device may detect the movement of an object (eg, an object and/or a person) existing in front of the electronic device using a radar sensor.

The radar sensor radiates radio waves to an object in front of the electronic device and receives reflected waves reflected from the object to identify the object or detect the location and/or moving speed of the object.

The electronic device (eg, television) may include a screen (eg, display panel) and a metal frame (eg, bezel) surrounding an edge of the screen.

The electronic device (eg, television) may include a radar sensor module to detect objects (eg, objects and/or people) existing in front.

The electronic device (eg, television) may have, for example, a radar sensor module placed on the back of the electronic device to reduce exposure of other electronic components to the outside.

For example, when the radar sensor module is placed on the back of the electronic device, at least a portion of the radar sensor may be obscured by the metal frame of the electronic device. If at least a portion of the radar sensor is obscured by a metal frame, the radar sensor may not be able to identify objects (e.g., objects and/or people) present in front of the electronic device (e.g., television), or may be unable to determine the location and/or location of the objects. Or, the speed of movement may not be detected.

Various embodiments of the present invention include a radar sensor module case capable of transmitting and/or receiving radio waves (e.g., radar signals) in front of an electronic device using a radar sensor module, and the radar sensor module case. An electronic device that can be provided can be provided.

The technical problem to be achieved in the present disclosure is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

An electronic device including a radar sensor module case according to an embodiment of the present invention includes a display panel, a frame arranged to surround an edge of the display panel, a rear cover covering the back of the display panel, and the display panel and It may include a radar sensor module case disposed between the rear covers. According to one embodiment, the radar sensor module case includes a first support member, a first side member with a portion coupled to the first end of the first support member, and a portion with a second end of the first support member. This coupled second side member, the first end is coupled to another part of the first side member, the second end is coupled to the other part of the second side member, and is arranged to be spaced apart from the first support member. It may include a second support member. According to one embodiment, the radar sensor module case may include a radio wave collection member disposed on the first side of the second support member, and a radiation guide member disposed on the second side of the second support member. . According to one embodiment, the radar sensor module case has a first end coupled to the inner surface of the first side member, a second end coupled to the inner surface of the second side member, and the first support member. and a printed circuit board disposed between the second support members. According to one embodiment, the radar sensor module case is disposed between the printed circuit board and the radio wave collection member and includes a radar sensor module electrically connected to the printed circuit board, and the radiation guide member is of the frame. It may be configured to be exposed to the outside.

According to various embodiments of the present invention, the radiation performance of the radar sensor in front of the electronic device can be improved by transmitting and/or receiving radio waves in front of the electronic device using a radar sensor module.

According to various embodiments of the present invention, the electronic device (e.g., : It is possible to identify objects (e.g. objects and/or people) that exist in front of a television, and detect the position and/or moving speed of the object.

In addition, various effects that can be directly or indirectly identified through this document may be provided.

In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.
1 is a block diagram of an electronic device in a network environment according to various embodiments of the present invention.
Figure 2a is a perspective view schematically showing a radar sensor module case according to an embodiment of the present invention.
FIG. 2B is a diagram schematically showing a cross section of the radar sensor module case disclosed in FIG. 2A according to an embodiment of the present invention.
Figure 3a is a perspective view schematically showing the arrangement of a printed circuit board and a radar sensor module in a radar sensor module case according to an embodiment of the present invention.
FIG. 3B is a diagram schematically showing a cross section of the radar sensor module case disclosed in FIG. 3A on which a printed circuit board and a radar sensor module are disposed according to an embodiment of the present invention.
FIG. 4A is a diagram schematically showing a state in which a radar sensor module case is placed in an electronic device according to an embodiment of the present invention.
FIG. 4B is a diagram schematically showing a cross section taken along portion C-C' in FIG. 4A where a radar sensor module case according to an embodiment of the present invention is disposed in an electronic device.
FIG. 5A is a diagram schematically showing the electric field for a radar sensor module case according to a comparative example.
Figure 5b is a diagram schematically showing the electric field for the sensor module case according to an embodiment of the present invention.
FIG. 6A is a diagram schematically showing a radiation pattern for a radar sensor module case according to a comparative example.
FIG. 6B is a diagram schematically showing a radiation pattern when a radio wave collection member is disposed in a sensor module case according to an embodiment of the present invention.
FIG. 6C is a diagram schematically showing a radiation pattern when a radio wave collection member and a radiation guide member are disposed in a sensor module case according to an embodiment of the present invention.
Figure 7a is a diagram schematically showing the radiation performance of the radar sensor module case according to a comparative example.
Figure 7b is a diagram schematically showing the radiation performance of the sensor module case according to an embodiment of the present invention.

FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present invention.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smart phones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Figure 2a is a perspective view schematically showing a radar sensor module case according to an embodiment of the present invention. FIG. 2B is a diagram schematically showing a cross section of the radar sensor module case disclosed in FIG. 2A according to an embodiment of the present invention.

In one embodiment, FIG. 2B shows a portion of the radar sensor module case 200 shown in FIG. 2A according to an embodiment of the present invention being cut along the vertical axis (e.g., z-axis direction and -z-axis direction), - It may be a cross-sectional view viewed from the y-axis direction.

2A and 2B, the radar sensor module case 200 includes a first support member 210, a first side member 220, a second side member 230, a second support member 240, It may include a third support member 250, a radio wave collection member 260, and/or a radiation guide member 270.

According to one embodiment, the radar sensor module case 200 may be formed of a dielectric. The radar sensor module case 200 may be formed of a non-conductive material. For example, the radar sensor module case 200 may be made of a plastic material such as polycarbonate (PC) and/or acrylonitrile butadiene styrene (ABS).

According to one embodiment, the first support member 210 may be disposed at the rear (eg, -x-axis direction) of the radar sensor module case 200. The first support member 210 may form the rear surface (eg, -x-axis direction) of the radar sensor module case 200.

According to one embodiment, the first side member 220 may be disposed on one side (eg, -y-axis direction) of the radar sensor module case 200. A portion (eg, -x-axis direction) of the first side member 220 may be coupled to the first end (eg, -y-axis direction) of the first support member 210.

According to various embodiments, the first side member 220 may include a 1-1 side 221 and a 1-2 side 222. The 1-1 side 221 may be disposed at the top of the first support member 210 (eg, in the z-axis direction). For example, a portion of the 1-1 side 221 (e.g., -x-axis direction) is located at the top (e.g., z-axis) of the first end (e.g., -y-axis direction) of the first support member 210. direction) can be combined. The 1-2 side surface 222 may be disposed below the first support member 210 (eg, -z-axis direction). For example, a portion of the 1-2 side 222 (-x-axis direction) is located below the first end (e.g., -y-axis direction) of the first support member 210 (e.g., -z-axis direction). ) can be combined.

According to one embodiment, the 1-1 side 221 and the 1-2 side 222 of the first side member 220 may be configured to be separate. According to various embodiments, the 1-1 side 221 and the 1-2 side 222 of the first side member 220 may be integrally coupled.

According to one embodiment, the second side member 230 may be disposed on one side (e.g., -y-axis direction) of the radar sensor module case 200 and the other side (e.g., y-axis direction) opposite to the other side (e.g., -y-axis direction). . Another part (eg, -x-axis direction) of the second side member 230 may be coupled to the second end (eg, y-axis direction) of the first support member 210.

According to various embodiments, the second side member 230 may include a 2-1 side 231 and a 2-2 side 232. The 2-1 side 231 may be disposed at the top of the first support member 210 (eg, in the z-axis direction). For example, a portion (-x-axis direction) of the 2-1 side 231 is located on the top (e.g., z-axis direction) of the second end (e.g., y-axis direction) of the first support member 210. can be combined The 2-2 side surface 232 may be disposed below the first support member 210 (eg, -z-axis direction). For example, a portion of the 2-2 side 232 (e.g., -x-axis direction) is located below the second end (e.g., y-axis direction) of the first support member 210 (e.g., -z-axis direction). direction) can be combined.

According to one embodiment, the 2-1 side 231 and the 2-2 side 232 of the second side member 230 may be configured to be separate. According to various embodiments, the 2-1 side 231 and the 2-2 side 232 of the second side member 230 may be integrally coupled.

According to one embodiment, the second support member 240 may be disposed in front of the radar sensor module case 200 (eg, in the x-axis direction). The second support member 240 may form the front (eg, x-axis direction) of the radar sensor module case 200. The first end (e.g., -y-axis direction) of the second support member 240 is connected to another portion (e.g., x-axis direction) of the first side member 220 (e.g., 1-2 side 222). can be combined The second end (e.g., in the y-axis direction) of the second support member 240 is coupled to another portion (e.g., in the x-axis direction) of the second side member 230 (e.g., the 2-2 side 232). It can be.

According to various embodiments, the second support member 240 may be arranged to be spaced apart from the first support member 210. A receiving hole 245 (e.g., receiving space) may be formed between the first support member 210, the first side member 220, the second side member 230, and the second support member 240. .

According to one embodiment, the third support member 250 may be disposed in the lower direction (eg, -z-axis direction) of the radar sensor module case 200. The third support member 250 may form the bottom surface (eg, -z-axis direction, bottom surface) of the radar sensor module case 200. The third support member 250 is an inner surface (e.g., x-axis direction) of the lower portion (e.g., -z-axis direction) of the first support member 210, and the first side member 220 (e.g., 1-2 The inner surface (e.g., y-axis direction) of the lower portion (e.g., -z-axis direction) of the side 222), the lower portion (e.g., of the second side member 230) (e.g., the 2-2 side 232). It may be coupled to the inner surface (e.g., -y-axis direction) of the second support member 240 (e.g., -z-axis direction) and the inner surface (e.g., -x-axis direction) of the lower portion (e.g., -z-axis direction) of the second support member 240. .

According to one embodiment, the radio wave collection member 260 may be disposed on the first surface (eg, -x-axis direction, inner surface) of the second support member 240. The radio wave collection member 260 may be disposed in the receiving hole 245 between the first support member 210 and the second support member 240. The radio wave collection member 260 may be arranged to be spaced apart from the first support member 210 . The radio wave collection member 260 may include a first waveguide used as a transmission and reception path for radio waves. For example, the radio wave collection member 260 may include a spherical waveguide structure formed by processing a dielectric.

According to one embodiment, the radiation guide member 270 may be disposed on the second surface (eg, x-axis direction, outer surface) of the second support member 240. The radiation guide member 270 may be disposed at a lower portion (eg, -z-axis direction) of the second surface (eg, x-axis direction, outer surface) of the second support member 240. The radiation guide member 270 may be disposed to face the third support member 250 with the second support member 240 interposed therebetween. The radiation guide member 270 may include a second waveguide used as a transmission and reception path for radio waves. For example, the radiation guide member 270 may include a spherical waveguide structure formed by processing a dielectric.

Figure 3a is a perspective view schematically showing a configuration in which a printed circuit board and a radar sensor module are arranged in a radar sensor module case according to an embodiment of the present invention. FIG. 3B is a diagram schematically showing a cross section of the radar sensor module case disclosed in FIG. 3A on which a printed circuit board and a radar sensor module are disposed according to an embodiment of the present invention.

In one embodiment, FIG. 3B shows a portion of the radar sensor module case 200 shown in FIG. 3A according to an embodiment of the present invention being cut along the vertical axis (e.g., z-axis direction and -z-axis direction), - It may be a cross-sectional view viewed from the y-axis direction.

According to various embodiments, the radar sensor module case 200 disclosed below may include embodiments of the radar sensor module case 200 disclosed in FIGS. 2A and 2B. In the description of the radar sensor module case 200 disclosed below, the same reference numbers are assigned to components that are substantially the same as the embodiments disclosed in FIGS. 2A and 2B, and redundant description of their functions can be omitted. .

Referring to FIGS. 3A and 3B , the radar sensor module case 200 may include a printed circuit board 310 and a radar sensor module 320. The radar sensor module case 200 may accommodate and protect at least a portion of the printed circuit board 310 and the radar sensor module 320 in the receiving hole 245 (eg, receiving space).

According to one embodiment, the printed circuit board 310 has a receiving hole formed between the first support member 210, the first side member 220, the second side member 230, and the second support member 240. It may be placed in (245) (e.g., a receiving space). The first end (eg, -y-axis direction) of the printed circuit board 310 may be coupled to the inner surface (eg, y-axis direction) of the first side member 220. The second end (eg, y-axis direction) of the printed circuit board 310 may be coupled to the inner surface (eg, -y-axis direction) of the second side member 230. The printed circuit board 310 may be disposed between the first support member 210 and the second support member 240 . The printed circuit board 310 may be spaced apart from the first support member 210 . The printed circuit board 310 may be spaced apart from the second support member 240 . For example, the printed circuit board 310 may be spaced apart from the radio wave collection member 260 disposed on the first surface (eg, -x-axis direction, inner surface) of the second support member 240. At least a portion of the printed circuit board 310 may be protected from external impact by the first support member 210, the first side member 220, the second side member 230, and the second support member 240. there is.

According to various embodiments, the printed circuit board 310 includes, for example, the processor 120, memory 130, sensor module 176, interface 177, connection terminal 178, and power shown in FIG. 1. A management module 188, communication module 190, and/or antenna module 197 may be deployed. For example, the printed circuit board 310 may include a structure in which a plurality of printed circuit boards (PCBs) are stacked. The printed circuit board 310 may include a plurality of via holes. The printed circuit board 310 may include an interposer structure. The printed circuit board 310 may include a dielectric substrate. The printed circuit board 310 may be implemented in the form of a flexible printed circuit board (FPCB) and/or a rigid printed circuit board (PCB). For example, the first side (eg, x-axis direction) of the printed circuit board 310 may include a printed circuit pattern, and the second side (eg, -x-axis direction) may include a ground layer. The ground layer disposed on the second side (e.g., -x-axis direction) of the printed circuit board 310 allows radio waves (e.g., radar signals) emitted through the radar sensor module 320 to pass through the radio wave collection member 260. It can be arranged to radiate towards. The ground layer may be formed of a conductive material.

According to one embodiment, the radar sensor module 320 may be disposed on the first side (eg, x-axis direction) of the printed circuit board 310. The radar sensor module 320 may be electrically connected to the printed circuit board 310. For example, the radar sensor module 320 may be electrically connected to the processor 120 and/or the communication module 190 disposed on the printed circuit board 310. The radar sensor module 320 may be disposed between the printed circuit board 310 and the radio wave collection member 260. The radar sensor module 320 may be spaced apart from the radio wave collection member 260.

According to one embodiment, the radar sensor module 320 may include a transmitting antenna 321 and a receiving antenna 322. The radar sensor module 320 may include at least one transmitting antenna 321 and at least one receiving antenna 322. For example, the radar sensor module 320 may include one transmitting antenna 321 and three receiving antennas 322. The number of transmitting antennas 321 and receiving antennas 322 is not limited to the above-described example, and may be formed in various numbers. The radar sensor module 320 may transmit and/or receive radio waves (e.g., radar signals) in front of the radar sensor module case 200 (e.g., in the x-axis direction). For example, the radar sensor module 320 may radiate radio waves (e.g., radar signals) to an object present in front (e.g., x-axis direction) of the radar sensor module case 200 through the transmission antenna 321. there is. For example, the radar sensor module 320 may receive a reflected wave reflected from an object through the receiving antenna 322. For example, the radar sensor module 320 may transmit and/or receive radio waves (eg, radar signals) having a center frequency band of about 60 GHz. The radar sensor module 320 identifies objects (e.g., objects and/or people) existing in front (e.g., x-axis direction) of the radar sensor module case 200, and detects the location and/or moving speed of the object. can do.

According to one embodiment, the radio wave collection member 260 (eg, first waveguide) may be disposed on the first surface (eg, -x-axis direction, inner surface) of the second support member 240. The radio wave collection member 260 may be disposed at a position corresponding to the radar sensor module 320. The radio wave collection member 260 may collect radio waves emitted from the radar sensor module 320. The size of the radio wave collection member 260 may be determined based on the size of the radar sensor module 320. For example, the radio wave collection member 260 may be formed to have an area that is substantially the same as that of the radar sensor module 320, or may be smaller or larger. The radio wave collection member 260 may be formed in a hexahedral shape to collect radio waves emitted from the radar sensor module 320. The radio wave collection member 260 does not have a multi-stage or curved shape and may be formed in a flat shape.

According to one embodiment, the radiation guide member 270 (eg, second waveguide) may be disposed on the second surface (eg, x-axis direction, outer surface) of the second support member 240. The radiation guide member 270 may be disposed at a position corresponding to the radio wave collection member 260. The radiation guide member 270 may guide radio waves collected through the radio wave collection member 260 to be radiated to an object present in front of the radar sensor module case 200 (eg, in the x-axis direction). The radiation guide member 270 may receive radio waves reflected from an object and transmit the received radio waves to the radar sensor module 320 through the radio wave collection member 260. The size of the radiation guide member 270 may be determined based on the center frequency (eg, about 60 GHz) of the radar sensor module 320. For example, the radiation guide member 270 may be formed to have a length of about 1λ (e.g., about 5 mm) relative to the center frequency (e.g., about 60 GHz) of the radar sensor module 320.

FIG. 4A is a diagram schematically showing a state in which a radar sensor module case is placed in an electronic device according to an embodiment of the present invention. FIG. 4B is a diagram schematically showing a cross section along portion C-C' in FIG. 4A where a radar sensor module case according to an embodiment of the present invention is disposed in an electronic device.

Referring to FIGS. 4A and 4B , the radar sensor module case 200 may be placed at the rear (eg, -x-axis direction, rear) of the electronic device 400 (eg, television). The radar sensor module case 200 may be disposed substantially perpendicular (e.g., z-axis direction and -z-axis direction) to the rear (e.g., -x-axis direction, back) of the electronic device 400 (e.g., television). there is. The electronic device 400 may include a display panel 410, a frame 420 (eg, a housing), and/or a rear cover 430.

According to one embodiment, the display panel 410 may include the display module 160 shown in FIG. 1. The frame 420 may surround the edge of the display panel 410. The rear cover 430 may cover the rear (eg, -x-axis direction) of the display panel 410. The rear cover 430 may protect the radar sensor module case 200 disposed at the rear (eg, -x-axis direction, back) of the display panel 410.

According to one embodiment, the radar sensor module case 200 may be disposed between the display panel 410 and the rear cover 430. A portion of the radar sensor module case 200 may be exposed to the outside of the electronic device 400. For example, the radiation guide member 270 of the radar sensor module case 200 may be exposed to the outside of the frame 420. The radiation guide member 270 is an object in which radio waves (e.g., radar signals) radiated through the radar sensor module 320 and the radio wave collection member 260 exist in front (e.g., in the x-axis direction) of the electronic device 400. It can be guided to radiate to .

According to various embodiments, the radar sensor module case 200 is perpendicular (e.g., in the z-axis direction and -z-axis direction) to the rear (e.g., -x-axis direction, back) of the electronic device 400 (e.g., television). It may not be placed properly. For example, the radar sensor module case 200 is inclined toward the rear (e.g., -x-axis direction, back) of the electronic device 400 (e.g., television), or is substantially horizontal (e.g., in the x-axis direction and -x It may also be arranged axially. The radar sensor module case 200 may be arranged in various shapes or directions at the rear (eg, -x-axis direction, back) of the electronic device 400 (eg, television). For example, the radar sensor module case 200 is placed at the rear (e.g. -x-axis direction, rear) of the electronic device 400, but is inclined between the x-axis direction and the z-axis direction with respect to the electronic device 400. It may be positioned, inclined between the -x-axis direction and the z-axis direction, or may be arranged substantially horizontal to the -x-axis direction and the -x-axis direction.

FIG. 5A is a diagram schematically showing the electric field for a radar sensor module case according to a comparative example. Figure 5b is a diagram schematically showing the electric field for the sensor module case according to an embodiment of the present invention.

In one embodiment, the radar sensor module case 510 according to the comparative example may not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention.

Referring to FIG. 5A, in the electronic device 520 including the radar sensor module case 510 according to the comparative example, an electric field is formed between the front (e.g., x-axis direction) and downward (e.g., -z-axis direction). You can check that it happens. For example, in the electronic device 520 including the radar sensor module case 510 according to the comparative example, the electric field is not formed forward (e.g., in the x-axis direction) but downward (e.g., in the -z-axis direction). can also be formed.

Referring to FIG. 5B, the radar sensor module case 200 according to an embodiment of the present invention may include a radio wave collection member 260 and a radiation guide member 270. A portion of the radiation guide member 270 is exposed to the outside of the electronic device 400, and radio waves (e.g., radar signals) radiated through the radar sensor module 320 and the radio wave collection member 260 are transmitted to the electronic device 400. It can be guided to radiate forward (e.g., in the x-axis direction). The electronic device 400 including the radar sensor module case 200 according to an embodiment of the present invention can confirm that an electric field is formed toward the front (eg, x-axis direction).

FIG. 6A is a diagram schematically showing a radiation pattern for a radar sensor module case according to a comparative example. FIG. 6B is a diagram schematically showing a radiation pattern when a radio wave collection member is disposed in a sensor module case according to an embodiment of the present invention. FIG. 6C is a diagram schematically showing a radiation pattern when a radio wave collection member and a radiation guide member are disposed in a sensor module case according to an embodiment of the present invention.

In one embodiment, the radar sensor module case 510 according to the comparative example may not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention.

Referring to FIG. 6A, the radar sensor module case according to a comparative example that does not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention is forward (e.g., x-axis direction). It can be seen that a radiation pattern is formed between and downward (e.g., -z-axis direction). For example, it can be confirmed that the radar sensor module case according to the comparative example has a large amount of radiation in the range of about -20° to -80°.

Referring to FIG. 6B, the radar sensor module case 200 according to an embodiment of the present invention may include a radio wave collection member 260. When the radar sensor module case 200 includes the radio wave collection member 260, the radiation pattern is substantially forward (e.g., between the x-axis direction and the z-axis direction and between the x-axis direction and the -z-axis direction). You can see that it is forming towards. For example, compared to FIG. 6A according to a comparative example that does not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention, the radar sensor module case 200 has a radio wave collection member. When (260) is included, it can be seen that the amount of radiation increases over a wider range between the x-axis and -z-axis. For example, when the radar sensor module case 200 includes the radio wave collection member 260, it can be confirmed that the amount of radiation is greater in the range of about 0° to -90° compared to FIG. 6A.

Referring to FIG. 6C, the radar sensor module case 200 according to an embodiment of the present invention may include a radio wave collection member 260 and a radiation guide member 270. Compared to FIG. 6A according to a comparative example that does not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention, the radar sensor module case 200 includes the radio wave collection member 260 and When the radiation guide member 270 is included, it can be seen that the radiation amount increases over a wider range in the x-axis direction between the z-axis and -z-axis. For example, when the radar sensor module case 200 includes a radio wave collection member 260 and a radiation guide member 270, it can be confirmed that the amount of radiation is large in the range of about 60° to -90° compared to Figure 6a. there is. When the radar sensor module case 200 includes a radio wave collection member 260 and a radiation guide member 270, radio waves radiated through the radar sensor module 320 are transmitted to the front of the electronic device 400 (e.g., in the x-axis direction). ), the radiation performance of the radar sensor module 320 can be improved.

Figure 7a is a diagram schematically showing the radiation performance of the radar sensor module case according to a comparative example. Figure 7b is a diagram schematically showing the radiation performance of the sensor module case according to an embodiment of the present invention.

In one embodiment, the radar sensor module case according to the comparative example may not include the radio wave collection member 260 and the radiation guide member 270 according to an embodiment of the present invention.

Referring to FIG. 7A, the radar sensor module case according to the comparative example may have a recognition distance to the front of the electronic device (e.g., x-axis direction) of about 3 m, and a recognition range of about 30° to -30°.

Referring to FIG. 7B, the radar sensor module case 200 according to an embodiment of the present invention may include a radio wave collection member 260 and a radiation guide member 270. When the radar sensor module case 200 includes a radio wave collection member 260 and a radiation guide member 270, the recognition distance to the front (e.g., x-axis direction) of the electronic device 400 is about 5.5 m, and the recognition distance is about 5.5 m. It can be seen that the range is approximately 45° to -45°. The radar sensor module case 200 according to an embodiment of the present invention may have a wider recognition distance and recognition range than the comparative embodiment.

The electronic device 400 including the radar sensor module case 200 according to an embodiment of the present invention includes a radio wave collection member 260 disposed in front of the radar sensor module 320 (e.g., in the x-axis direction), and By using the radiation guide member 270 to transmit and/or receive radio waves (e.g., radar signals) to the front (e.g., x-axis direction) of the electronic device 400, the front of the electronic device 400 Objects (e.g., objects and/or people) present in the device can be identified, and the location and/or moving speed of the object can be detected.

The electronic device 400 according to an embodiment of the present invention includes a display panel 410, a frame 420 arranged to surround an edge of the display panel 410, and a rear surface of the display panel 410. It may include a rear cover 430, and a radar sensor module case 200 disposed between the display panel 410 and the rear cover 430. According to one embodiment, the radar sensor module case 200 includes a first support member 210, a first side member 220, a portion of which is coupled to the first end of the first support member 210, A second side member 230, one part of which is coupled to the second end of the first support member 210, the first end of which is coupled to the other part of the first side member 220, and the second side member A second end is coupled to another part of 230, and a second support member 240 is disposed to be spaced apart from the first support member 210, and is disposed on the first side of the second support member 240. A radio wave collection member 260, a radiation guide member 270 disposed on the second surface of the second support member 240, a first end coupled to the inner surface of the first side member 220, and the first end 2 A printed circuit board 310 having a second end coupled to the inner surface of the side member 220 and disposed between the first support member 210 and the second support member 240, and the printed circuit board ( 310) and a radar sensor module 320 disposed between the radio wave collection member 260 and electrically connected to the printed circuit board 310, and the radiation guide member 270 of the frame 420 It may be configured to be exposed to the outside.

According to one embodiment, the radar sensor module case 200 may be formed of a non-conductive material.

According to one embodiment, the radar sensor module case 200 includes the first support member 210, the first side member 220, the second side member 230, and the second support member 240. ) may be formed between the receiving holes 245.

According to one embodiment, the radar sensor module case 200 includes a third support member coupled to the lower inner surface of the first support member 210 and the lower inner surface of the second support member 240. 250) may be further included.

According to one embodiment, the radar sensor module 320 may include at least one transmitting antenna 321 and at least one receiving antenna 322.

According to one embodiment, the radio wave collection member 260 may include a first waveguide that collects radio waves for the radar sensor module 320.

According to one embodiment, the radiation guide member 270 may include a second waveguide that guides radio waves radiated through the radar sensor module 320 and the radio wave collection member 260 in one direction.

According to one embodiment, the first side of the printed circuit board 310 may include a printed circuit pattern, and the second side may include a ground layer.

According to one embodiment, the radio wave collection member 260 may be formed to have an area that is substantially the same as, or smaller or larger than, the radar sensor module 320.

According to one embodiment, the radiation guide member 270 may be configured to have a size determined based on the center frequency of the radar sensor module 320.

Although the present invention has been described above according to various embodiments of the present invention, changes and modifications made by those skilled in the art without departing from the technical spirit of the present invention do not fall within the scope of the present invention. Of course.

200: radar sensor module case 210: first support member
220: first side member 230: second side member
240: second support member 245: receiving hole
250: third support member 260: radio wave collection member
270: Radiation guide member 310: Printed circuit board
320: radar sensor module 400: electronic device

Claims (20)

In the electronic device 400,
display panel 410;
a frame 420 arranged to surround an edge of the display panel 410;
A rear cover 430 covering the back of the display panel 410; and
It includes a radar sensor module case 200 disposed between the display panel 410 and the rear cover 430,
The radar sensor module case 200,
first support member 210;
A first side member 220, a portion of which is coupled to the first end of the first support member 210;
a second side member 230, a portion of which is coupled to the second end of the first support member 210;
A first end is coupled to another part of the first side member 220, a second end is coupled to another part of the second side member 230, and is spaced apart from the first support member 210. a second support member 240;
a radio wave collection member 260 disposed on the first side of the second support member 240;
a radiation guide member 270 disposed on a second surface of the second support member 240;
A first end is coupled to the inner surface of the first side member 220, and a second end is coupled to the inner surface of the second side member 220, and the first support member 210 and the second a printed circuit board 310 disposed between support members 240; and
It includes a radar sensor module 320 disposed between the printed circuit board 310 and the radio wave collection member 260 and electrically connected to the printed circuit board 310,
The radiation guide member 270 is configured to be exposed to the outside of the frame 420. According to clause 1,
The radar sensor module case 200 is an electronic device made of a non-conductive material. According to claim 1 or 2,
An electronic device in which a receiving hole 245 is formed between the first support member 210, the first side member 220, the second side member 230, and the second support member 240. According to claim 1 or 2,
The electronic device further includes a third support member (250) coupled to a lower inner surface of the first support member (210) and a lower inner surface of the second support member (240). According to claim 1 or 2,
The radar sensor module 320 is an electronic device including at least one transmitting antenna 321 and at least one receiving antenna 322. According to claim 1 or 5,
The radio wave collection member 260 is an electronic device including a first waveguide that collects radio waves for the radar sensor module 320. According to clause 6,
The radiation guide member 270 is an electronic device including a second waveguide that guides radio waves radiated through the radar sensor module 320 and the radio wave collection member 260 in one direction. According to claim 1 or 2,
An electronic device wherein a first side of the printed circuit board 310 includes a printed circuit pattern, and a second side includes a ground layer. According to claim 1 or 2,
The radio wave collection member 260 is formed to have an area that is substantially the same as, smaller, or larger than that of the radar sensor module 320. According to claim 1 or 2,
The radiation guide member 270 is an electronic device configured to have a size determined based on the center frequency of the radar sensor module 320. In the radar sensor module case 200,
first support member 210;
A first side member 220, a portion of which is coupled to the first end of the first support member 210;
a second side member 230, a portion of which is coupled to the second end of the first support member 210;
A first end is coupled to another part of the first side member 220, a second end is coupled to another part of the second side member 230, and is spaced apart from the first support member 210. a second support member 240;
a radio wave collection member 260 disposed on the first side of the second support member 240;
a radiation guide member 270 disposed on a second surface of the second support member 240;
A first end is coupled to the inner surface of the first side member 220, and a second end is coupled to the inner surface of the second side member 220, and the first support member 210 and the second a printed circuit board 310 disposed between support members 240; and
It includes a radar sensor module 320 disposed between the printed circuit board 310 and the radio wave collection member 260 and electrically connected to the printed circuit board 310,
The radiation guide member 270 is a radar sensor module case configured to be exposed to the outside of the electronic device 400. According to clause 11,
The radar sensor module case 200 is a radar sensor module case formed of a non-conductive material. The method of claim 11 or 12,
A radar sensor module case in which a receiving hole 245 is formed between the first support member 210, the first side member 220, the second side member 230, and the second support member 240. The method of claim 11 or 12,
The radar sensor module case further includes a third support member 250 coupled to a lower inner surface of the first support member 210 and a lower inner surface of the second support member 240. The method of claim 11 or 12,
The radar sensor module 320 is a radar sensor module case including at least one transmitting antenna 321 and at least one receiving antenna 322. According to claim 11 or 15,
The radio wave collection member 260 is a radar sensor module case including a first waveguide that collects radio waves for the radar sensor module 320. According to clause 16,
The radiation guide member 270 is a radar sensor module case including a second waveguide that guides radio waves radiated through the radar sensor module 320 and the radio wave collection member 260 in one direction. The method of claim 11 or 12,
A radar sensor module case wherein the first side of the printed circuit board 310 includes a printed circuit pattern, and the second side includes a ground layer. The method of claim 11 or 12,
The radio wave collection member 260 is a radar sensor module case formed to have an area substantially the same as, smaller or larger than that of the radar sensor module 320. The method of claim 11 or 12,
The radiation guide member 270 is a radar sensor module case configured to have a size determined based on the center frequency of the radar sensor module 320.

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