KR20240074941A - Air cooling heat sink for UV LED curing machine - Google Patents

Air cooling heat sink for UV LED curing machine Download PDF

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Publication number
KR20240074941A
KR20240074941A KR1020220151619A KR20220151619A KR20240074941A KR 20240074941 A KR20240074941 A KR 20240074941A KR 1020220151619 A KR1020220151619 A KR 1020220151619A KR 20220151619 A KR20220151619 A KR 20220151619A KR 20240074941 A KR20240074941 A KR 20240074941A
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heat dissipation
refrigerant circulation
circulation pipe
installation groove
led
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KR1020220151619A
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Korean (ko)
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차상희
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차상희
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Publication of KR20240074941A publication Critical patent/KR20240074941A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
    • B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
    • B41F23/0403—Drying webs
    • B41F23/0406—Drying webs by radiation
    • B41F23/0409—Ultraviolet dryers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
    • B41J11/00214—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation using UV radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/403—Lighting for industrial, commercial, recreational or military use for machines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 UV LED 경화기용 복합식 히트싱크에 관한 것으로, 좀더 상세하게 설명하자면, 제1면(10a)에는 관체설치홈(11)이 구비되어 있고 제2면(10b)에는 방열핀(12)이 돌출되어 있는 방열부재(10)과, 상기 관체설치홈(11) 속에 매립되는 원형 냉매순환관(20)을 포함하여 구성되고, 상기 냉매순환관(20)에는 상기 제1면(10a)과 동일한 평면을 갖는 밀착평면(21)이 구비되어 있으며, 상기 밀착평면(21)이 방열부재(10)에 설치되는 UV LED의 저면에 직접 밀착하도록 구성된 UV LED 경화기용 복합식 히트싱크에 관한 것이다.The present invention relates to a composite heat sink for a UV LED curing machine. To be described in more detail, the first surface (10a) is provided with a tube installation groove (11), and the second surface (10b) has a heat dissipation fin (12) protruding. It is composed of a heat dissipation member (10) and a circular refrigerant circulation pipe (20) embedded in the pipe installation groove (11), and the refrigerant circulation pipe (20) has the same plane as the first surface (10a). It relates to a composite heat sink for a UV LED curing machine, which is provided with a close contact plane 21 and is configured to directly contact the bottom surface of the UV LED installed on the heat dissipation member 10.

Description

UV LED 경화기용 복합식 히트싱크{Air cooling heat sink for UV LED curing machine}Complex heat sink for UV LED curing machine {Air cooling heat sink for UV LED curing machine}

본 발명은 UV LED 경화기용 복합식 히트싱크에 관한 것으로, 좀더 상세하게 설명하자면, 제1면(10a)에는 관체설치홈(11)이 구비되어 있고 제2면(10b)에는 방열핀(12)이 돌출되어 있는 방열부재(10)과, 상기 관체설치홈(11) 속에 매립되는 원형 냉매순환관(20)을 포함하여 구성되고, 상기 냉매순환관(20)에는 상기 제1면(10a)과 동일한 평면을 갖는 밀착평면(21)이 구비되어 있으며, 상기 밀착평면(21)이 방열부재(10)에 설치되는 UV LED의 저면에 직접 밀착하도록 구성된 UV LED 경화기용 복합식 히트싱크에 관한 것이다.The present invention relates to a composite heat sink for a UV LED curing machine. To be described in more detail, the first surface (10a) is provided with a tube installation groove (11), and the second surface (10b) has a heat dissipation fin (12) protruding. It is composed of a heat dissipation member (10) and a circular refrigerant circulation pipe (20) embedded in the pipe installation groove (11), and the refrigerant circulation pipe (20) has the same plane as the first surface (10a). It relates to a composite heat sink for a UV LED curing machine, which is provided with a close contact plane 21 and is configured to directly contact the bottom surface of the UV LED installed on the heat dissipation member 10.

UV(ultraviolet) 경화기는 광 개시제가 포함되어 있는 자외선 경화형 수지를 경화시키는 기기로서, 각종 산업 분야에서 접착, 도포, 인쇄 공정 등을 수행하는데 널리 사용되고 있다. UV LED 경화기는 자외선 광원으로 LED를 사용하는 것으로, 통상적인 UV 램프를 사용하는 경우에 비하여 장비의 규모를 축소하고 전력 소모량을 절감 할 수 있는 장점이 있다. A UV (ultraviolet) curing machine is a device that cures an ultraviolet curable resin containing a photoinitiator, and is widely used in various industrial fields to perform adhesion, coating, and printing processes. The UV LED curing machine uses LED as an ultraviolet light source and has the advantage of reducing the size of the equipment and reducing power consumption compared to using a typical UV lamp.

UV LED 경화기에 있어서 광원인 LED에서 발생하는 열은 UV LED의 수명과 광량을 저하시키는 부정적인 영향을 미친다. 그래서 종래에도 UV LED에서 발생하는 열을 효율적으로 냉각시켜 주는 냉각장치, 즉 히트싱크(heat sink)가 구비된 UV LED 경화기들이 다양하게 제안되어 있다.In a UV LED curing machine, the heat generated from the LED, which is the light source, has a negative effect by reducing the lifespan and light intensity of the UV LED. Therefore, various UV LED curing machines equipped with a cooling device, that is, a heat sink, that efficiently cools the heat generated from the UV LED have been proposed.

예를 들면, 등록특허 제10-1623299호(2016년 05월16일)에는 자외선 경화형 수지로 코팅된 제품을 UV LED로 경화하는 대면적 코팅용 UV LED 경화장치에 있어서, LED 모듈이 설치된 히트싱크와, 상기 히트싱크를 둘러싸는 수냉자켓, 그리고 냉각수 순환경로가 구비된 방열기로 이루어진 냉각수단이 개시되어 있다.For example, Registered Patent No. 10-1623299 (May 16, 2016) discloses a UV LED curing device for large-area coating that cures products coated with UV curable resin with UV LED, including a heat sink with an LED module installed. A cooling means is disclosed that includes a water cooling jacket surrounding the heat sink, and a radiator provided with a cooling water circulation path.

그리고 등록특허 제10-1723130호(2017년 03월29일)에는 디스플레이 패널의 합착 공정에 이용되는 자외선 경화장치에 있어서, 다수의 LED를 갖는 발광부의 후면에 부착되는 금속블록과, 상기 금속블록을 따라 냉매를 순환시키는 냉각관을 포함하여 구성되는 냉각모듈이 개시되어 있다.And in Registration Patent No. 10-1723130 (March 29, 2017), an ultraviolet curing device used in the bonding process of a display panel includes a metal block attached to the back of a light emitting unit having a plurality of LEDs, and the metal block. Accordingly, a cooling module including a cooling pipe for circulating refrigerant is disclosed.

또한, 등록특허 제10-2016288호(2019년 08월23일)에는 UV LED를 이용한 인쇄용 UV잉크 경화장치에 있어서, 인쇄물이 통과하는 제1 케이스 및 제2 케이스와, 상기 제1 케이스 내에서 인쇄물을 향해 UV광을 조사하는 UV LED 기판과, 상기 UV LED 기판에서 발생하는 열을 방출시키는 방열판과, 상기 방열판을 통해 공기를 순환시키는 방열 냉각팬을 포함하여 구성되는 UV 잉크 경화장치가 개시되어 있다.In addition, Registered Patent No. 10-2016288 (August 23, 2019) discloses a UV ink curing device for printing using UV LED, including a first case and a second case through which printed matter passes, and printed matter within the first case. A UV ink curing device comprising a UV LED substrate that irradiates UV light toward the UV LED substrate, a heat sink that dissipates heat generated from the UV LED substrate, and a heat dissipation cooling fan that circulates air through the heat sink is disclosed. .

마지막으로 등록특허 제10-2402027호(2022년 05월20일)에는 통상적인 UV 인쇄장치에 장착되어 방열 구조를 개선함으로써, 인쇄물의 변형과 인쇄 품질의 저하를 방지할 수 있는 LED UV 경화기가 개시되어 있다. 첨부 도 1은 상기 LED UV 경화기의 경화모듈을 나타낸 것으로, 인쇄물 상부에 배치되는 제1 모듈(A)과, 인쇄물 하부에 배치되는 제2 모듈(B)을 포함한다.Lastly, Registered Patent No. 10-2402027 (May 20, 2022) discloses an LED UV curing device that is mounted on a typical UV printing device and can prevent deformation of printed matter and deterioration of printing quality by improving the heat dissipation structure. It is done. Attached Figure 1 shows the curing module of the LED UV curing machine, and includes a first module (A) disposed on top of the printed matter and a second module (B) disposed below the printed matter.

상기 제1 모듈(A)은 인쇄물의 표면에 UV광을 조사하는 것으로, 하우징(A1), 광 조사유닛(A2), 반사판(A3), 확산판(A4) 및 방열부(A5)로 구성된다. 상기 방열부(A5)는 히트싱크(A51), 방열팬(A52) 및 히트파이프(A53)를 포함하고, 상기 히트싱크(A51)는 방열 플레이트(A511)와 방열핀(A512)을 포함하여 구성된다. The first module (A) radiates UV light to the surface of the printed matter and is composed of a housing (A1), a light irradiation unit (A2), a reflector (A3), a diffuser (A4), and a heat dissipation unit (A5). . The heat dissipation unit (A5) includes a heat sink (A51), a heat dissipation fan (A52), and a heat pipe (A53), and the heat sink (A51) includes a heat dissipation plate (A511) and a heat dissipation fin (A512). .

본 발명에 따른 히트싱크는 첨부 도 1의 LED UV 경화기에서 방열부(A5)에 대응할 수 있다. 도 1에서 기타 미설명 도면부호에 대한 설명은 생략한다.The heat sink according to the present invention can correspond to the heat dissipation portion (A5) in the LED UV curing machine of attached FIG. 1. Descriptions of other non-illustrated reference numerals in FIG. 1 are omitted.

등록특허 제10-1623299호(2016년 05월16일)Registered Patent No. 10-1623299 (May 16, 2016) 등록특허 제10-1723130호(2017년 03월29일)Registered Patent No. 10-1723130 (March 29, 2017) 등록특허 제10-2016288호(2019년 08월23일)Registered Patent No. 10-2016288 (August 23, 2019) 등록특허 제10-2402027호(2022년 05월20일)Registered Patent No. 10-2402027 (May 20, 2022)

일반적으로 UV LED 경화기에 사용되는 히트싱크는 공랭식과 수냉식 및 복합식으로 구분할 수 있다. 수냉식이나 복합식은 공랭식에 비해 상대적으로 냉각 효과가 우수하지만 전체적인 구조가 복잡하여 UV LED 경화기와 같은 소형장비에는 적용하기가 어려운 한계가 있다. In general, heat sinks used in UV LED curing machines can be divided into air-cooled, water-cooled, and combined types. Water-cooled or combined types have relatively better cooling effects than air-cooled types, but their overall structure is complex, making them difficult to apply to small equipment such as UV LED curing machines.

이에 본 발명의 목적은 UV LED 경화기용 냉각장치로 사용하기에 매우 적합하고, 특히 종래의 복합식에 비해 냉각효율이 우수한 새로운 구조의 복합식 히트싱크를 제공하는 것이다. Accordingly, the purpose of the present invention is to provide a composite heat sink with a new structure that is very suitable for use as a cooling device for a UV LED curing machine and has particularly excellent cooling efficiency compared to the conventional composite heat sink.

본 발명에 따른 UV LED 경화기용 복합식 히트싱크는,The composite heat sink for UV LED curing machine according to the present invention,

다수개의 UV LED가 부착되는 제1면(10a)에는 길이방향을 따라 관체설치홈(11)이 구비되어 있고, 제2면(10b)에는 상기 관체설치홈(11)을 따라 방열핀(12)이 돌출되어 금속 재질의 방열부재(10)과;The first surface (10a), where a plurality of UV LEDs are attached, is provided with a tube installation groove (11) along the longitudinal direction, and the second surface (10b) has a heat dissipation fin (12) along the tube installation groove (11). A protruding heat dissipation member 10 made of metal;

상기 방열부재(10)의 관체설치홈(11) 속에 매립된 상태에서 냉각용액을 순환시키는 것으로, 상기 관체설치홈(11) 밖으로 노출되는 밀착평면(21)을 갖는 원형 냉매순환관(20); 을 포함하여 구성되고, A circular refrigerant circulation pipe (20) that circulates a cooling solution while embedded in the tube installation groove (11) of the heat dissipation member (10) and has a close contact plane (21) exposed outside the tube installation groove (11); It is composed including,

상기 냉매순환관(20)에 구비된 밀착평면(21)은 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 이루며, 상기 방열부재(10)에 설치되는 UV LED의 저면에 직접 밀착되는 것을 특징으로 한다.The close contact plane 21 provided in the refrigerant circulation pipe 20 forms the same plane as the first surface 10a of the heat radiating member 10, and is directly attached to the bottom of the UV LED installed on the heat radiating member 10. It is characterized by close adhesion.

상기 냉매순환관(20)의 밀착평면(21)은 단면이 원형인 금속관체의 원주 일부를 평평하게 눌러준 다음, 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 갖도록 연마하여서 된 것임을 특징으로 한다.The contact surface 21 of the refrigerant circulation pipe 20 is formed by pressing a portion of the circumference of a metal pipe with a circular cross-section flat and then grinding it to have the same plane as the first surface 10a of the heat dissipation member 10. It is characterized by being made.

상기 방열부재(10)의 관체설치홈(11)은 상면이 개방된 사각형 홈이고, 상기 관체설치홈(11)의 내부에는 상기 냉매순환관(20)을 접착 및 고정시키는 열전도성 접착제(30)가 채워져 있는 것을 특징으로 한다. The tube installation groove 11 of the heat dissipation member 10 is a square groove with an open upper surface, and the inside of the tube installation groove 11 is a thermally conductive adhesive 30 for adhering and fixing the refrigerant circulation pipe 20. It is characterized by being filled.

본 발명에 따른 UV LED 경화기용 복합식 히트싱크는, 방열부재(10)의 관체설치홈(11) 속에 매설되어 있는 냉매순환관(20)이 상기 관체설치홈(11) 밖으로 노출되는 밀착평면(21)을 가지며, 상기 밀착평면(21)이 UV LED의 저면에 직접 밀착되는 구조를 갖기 때문에 종래의 복합식 히트싱크에 비해 구조가 간편하고 냉각효율이 우수한 효과가 있다. The composite heat sink for a UV LED curing machine according to the present invention has a contact plane (21) in which the refrigerant circulation pipe (20) buried in the tube installation groove (11) of the heat dissipation member (10) is exposed outside the tube installation groove (11). ), and because the contact plane 21 has a structure in which the contact plane 21 is directly adhered to the bottom of the UV LED, the structure is simple and the cooling efficiency is excellent compared to the conventional composite heat sink.

도 1은 종래의 LED UV 경화기의 구조를 예시한 도면,
도 2는 본 발명의 일 실시예에 따른 복합식 히트싱크의 사시도,
도 3은 상기 도 2의 A-A’선 단면도,
도 4는 상기 도 2에서 방열부재(10)의 단면도이다. 1 is a diagram illustrating the structure of a conventional LED UV curing machine;
Figure 2 is a perspective view of a composite heat sink according to an embodiment of the present invention;
Figure 3 is a cross-sectional view taken along line A-A' of Figure 2;
FIG. 4 is a cross-sectional view of the heat dissipation member 10 in FIG. 2.

이하, 첨부한 도면을 이용하여 본 발명을 상세하게 설명한다. 다만, 첨부 도면은 본 발명의 바람직한 실시예를 예시한 것이므로 이들 실시예에 의해서 본 발명의 권리범위가 제한되는 것은 아니다. 또한 본 발명을 실시하는데 꼭 필요한 구성이라 하더라도 종래기술에 소개되어 있거나, 통상의 기술자가 공지기술로부터 용이하게 실시할 수 있는 사항에 대해서는 구체적인 설명을 생략한다.Hereinafter, the present invention will be described in detail using the attached drawings. However, since the accompanying drawings illustrate preferred embodiments of the present invention, the scope of the present invention is not limited by these embodiments. In addition, even if the configuration is essential for carrying out the present invention, detailed description will be omitted for matters that are introduced in the prior art or that can be easily implemented by a person skilled in the art from the known technology.

본 발명에 따른 UV LED 경화기용 히트싱크는 첨부한 도 2 및 도 3에서 보는 바와 같이, 방열부재(10)과 냉매순환관(20)을 포함하여 구성된다. As shown in Figures 2 and 3, the heat sink for a UV LED curing machine according to the present invention includes a heat dissipation member 10 and a refrigerant circulation pipe 20.

먼저 방열부재(10)은 금속 재질의 장방형 판체 형상으로서, 서로 반대쪽을 바라보는 제1면(10a)과 제2면(10b)을 가지며, 상기 제1면(10a)에는 길이방향을 따라 다수개의 UV LED(도면에는 나타내지 않았음)가 부착되는 구조를 갖는다. 상기 방열부재(10)의 바람직한 재질은 알루미늄이다.First, the heat dissipation member 10 has a rectangular plate shape made of metal and has a first surface (10a) and a second surface (10b) facing opposite sides, and the first surface (10a) has a plurality of plates along the longitudinal direction. It has a structure where a UV LED (not shown in the drawing) is attached. A preferred material for the heat dissipation member 10 is aluminum.

상기 방열부재(10)의 제1면(10a)에는 길이방향을 따라 나란히 관체설치홈(11)이 구비되어 있다. 상기 관체설치홈(11)은 도 4와 같이 상면이 개방된 사각형 홈인 것이 바람직하지만, 단면 형상이 반원형이거나 다각형인 홈이라도 무방하다.The first surface 10a of the heat dissipation member 10 is provided with tube installation grooves 11 along the longitudinal direction. The tube installation groove 11 is preferably a rectangular groove with an open upper surface as shown in FIG. 4, but may also be a groove with a semicircular or polygonal cross-sectional shape.

상기 제1면(10a)의 반대쪽에 배치되는 제2면(10b)에는 상기 관체설치홈(11)을 따라 겹겹이 방열핀(12)이 돌출되어 있다. 상기 방열핀(12)은 방열부재(10)의 표면적을 증가시켜서 공기 중으로 열을 효과적으로 방출하는 기능을 하는 것으로, 제2면(10b)에 대하여 수직으로 돌출되어 있는 것이 바람직하다. 상기 방열핀(12)의 측면에는 통상적인 냉각팬(도면에는 나타내지 않았음)이 배치될 수 있다.On the second surface 10b disposed opposite to the first surface 10a, heat dissipation fins 12 are protruded in layers along the tube installation groove 11. The heat dissipation fin 12 functions to effectively radiate heat into the air by increasing the surface area of the heat dissipation member 10, and is preferably protruded vertically with respect to the second surface 10b. A typical cooling fan (not shown in the drawing) may be placed on the side of the heat dissipation fin 12.

상기 방열부재(10)에 부착되는 UV LED는 예컨대 315~400nm 정도의 파장 범위에서 개당 약 200W 정도의 출력으로 자외선 광을 방출하는 LED를 사용할 수 있다. 이러한 UV LED는 COB 타입이나 팩키지 타입으로서, 통상적인 고정나사를 이용하여 제1면(10a)에 부착할 수 있다. 이를 위해서 방열부재(10)의 제1면(10a)에는 나사공(13)이 나란히 구비되어 있다.The UV LED attached to the heat dissipation member 10 may be, for example, an LED that emits ultraviolet light with an output of about 200 W in a wavelength range of about 315 to 400 nm. These UV LEDs are COB type or package type, and can be attached to the first surface 10a using conventional fixing screws. For this purpose, screw holes 13 are provided side by side on the first surface 10a of the heat dissipation member 10.

다음으로 상기 냉매순환관(20)은 상기 방열부재(10)의 관체설치홈(11) 속에 매립되는 것으로, 냉매공급관(20a)과 냉매회수관(20b)으로 구성될 수 있다. 상기 방열부재(10)에 설치되는 냉매순환관(20)의 개수와 직경은 상기 관체설치홈(11)의 개수와 직경에 대응한다.Next, the refrigerant circulation pipe 20 is embedded in the pipe installation groove 11 of the heat dissipation member 10, and may be composed of a refrigerant supply pipe 20a and a refrigerant recovery pipe 20b. The number and diameter of the refrigerant circulation pipes (20) installed in the heat dissipation member (10) correspond to the number and diameter of the pipe installation grooves (11).

첨부 도면에서는 상기 방열부재(10)에 냉매순환관(20) 2줄이 나란히 배치된 구조를 예시하였으나, 상기 방열부재(10)에는 필요에 따라 4줄 또는 6줄의 냉매순환관(20)이 배치될 수도 있다. 상기 냉매순환관(20)의 개수는 짝수인 것이 바람직하지만 반드시 이에 국한되는 것은 아니다. In the attached drawing, a structure in which two rows of refrigerant circulation pipes 20 are arranged side by side in the heat dissipation member 10 is illustrated, but the heat dissipation member 10 has 4 or 6 rows of refrigerant circulation pipes 20 as necessary. It may be deployed. The number of refrigerant circulation pipes 20 is preferably an even number, but is not necessarily limited thereto.

상기 냉매순환관(20)은 열전도성이 우수한 원형 금속관, 예컨대 구리 재질의 원형 관체로 이루어질 수 있다. 그리고 상기 냉매순환관(20) 내부를 순환하는 냉매로는 예컨대 물을 사용할 수 있다.The refrigerant circulation pipe 20 may be made of a circular metal pipe with excellent thermal conductivity, for example, a circular pipe made of copper. And, for example, water can be used as the refrigerant circulating inside the refrigerant circulation pipe 20.

상기 냉매순환관(20)의 한쪽 단부에는 통상적인 냉매공급장치(도면에는 나타내지 않았음)가 설치될 수 있다. 상기 냉매공급장치는 냉매회수관(20b)으로 회수되는 냉매를 냉각시켜서 다시 냉매공급관(20a)으로 공급하는 기능을 한다. A typical refrigerant supply device (not shown in the drawing) may be installed at one end of the refrigerant circulation pipe 20. The refrigerant supply device functions to cool the refrigerant recovered through the refrigerant recovery pipe (20b) and supply it back to the refrigerant supply pipe (20a).

본 발명의 특징은, 상기 냉매순환관(20)이 길이방향을 따라 상기 관체설치홈(11)의 상면 개방부로 노출되는 성형 밀착평면(21)를 갖는다는 것이다. 상기 밀착평면(21)은 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 이루며, 나아가 상기 방열부재(10)에 설치되는 UV LED의 저면에 직접 밀착된다.A feature of the present invention is that the refrigerant circulation pipe 20 has a molded contact plane 21 exposed to the upper surface opening of the pipe body installation groove 11 along the longitudinal direction. The contact plane 21 forms the same plane as the first surface 10a of the heat dissipation member 10, and further comes into direct contact with the bottom surface of the UV LED installed on the heat dissipation member 10.

상기 냉매순환관(20)의 밀착평면(21)은 단면이 원형인 금속관체를 프레스 등으로 눌러서 길이방향을 따라 원주 일부를 평평하게 한 다음, 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 갖도록 연마하여서 가공할 수 있다.The contact surface 21 of the refrigerant circulation pipe 20 is formed by pressing a metal pipe with a circular cross-section with a press or the like to flatten a portion of the circumference along the longitudinal direction, and then forming the first surface 10a of the heat dissipation member 10. It can be processed by grinding to have the same plane.

상기 밀착평면(21)은 냉매순환관(20)을 통과하는 냉매의 냉기를 상기 UV LED로 직접 전달하여 UV LED를 효과적으로 냉각시키는 기능을 한다. 상기 밀착평면(21)의 폭(W)은 냉매순환관(20) 직경(D)의 0.5~0.8배인 것이 바람직하다.The contact plane 21 functions to effectively cool the UV LED by transferring the cold air of the refrigerant passing through the refrigerant circulation pipe 20 directly to the UV LED. The width (W) of the contact plane (21) is preferably 0.5 to 0.8 times the diameter (D) of the refrigerant circulation pipe (20).

상기 밀착평면(21)의 폭(W)이 냉매순환관(20) 직경(D)의 0.5배 미만이면, 충분한 방열효과를 기대할 수 없고, 반대로 0.8배 이상이면 밀착평면(21)을 가공하는 과정에서 냉매순환관(20)이 손상 또는 변형될 우려가 있어서 바람직하지 않다.If the width (W) of the contact plane (21) is less than 0.5 times the diameter (D) of the refrigerant circulation pipe (20), sufficient heat dissipation effect cannot be expected, and if it is more than 0.8 times, the process of processing the contact plane (21) This is not desirable because there is a risk that the refrigerant circulation pipe 20 may be damaged or deformed.

한편, 상기 방열부재(10)의 관체설치홈(11) 내부에는 상기 냉매순환관(20)을 접착 및 고정시켜 주는 열전도성 접착제(30)가 채워져 있는 것이 바람직하다. 이러한 열전도성 접착제(30)로는 상용화 되어 있는 통상적인 열전도성 접착제를 사용할 수 있다.Meanwhile, it is preferable that the inside of the tube installation groove 11 of the heat dissipation member 10 is filled with a thermally conductive adhesive 30 that adheres and fixes the refrigerant circulation pipe 20. As this thermally conductive adhesive 30, a commercially available conventional thermally conductive adhesive can be used.

상기 열전도성 접착제(30)는 방열부재(10)와 냉매순환관(20) 사이의 공간을 채워서 방열부재(10)와 냉매순환관(20)를 물리적으로 일체화시켜주고, 나아가 방열부재(10)의 냉각효과를 향상시켜 주는 기능을 한다.The thermally conductive adhesive 30 fills the space between the heat dissipation member 10 and the refrigerant circulation pipe 20 to physically integrate the heat dissipation member 10 and the refrigerant circulation pipe 20, and furthermore, the heat dissipation member 10 It has the function of improving the cooling effect.

본 발명에 따른 히트싱크의 제조방법은, 먼저 냉매순환관(20)로 사용할 원형 금속관체의 원주 일부를 압착 및 연마하여 밀착평면(21)을 가공한 다음, 상기 열전도성 접착제(30)를 이용하여 방열부재(10)의 관체설치홈(11)에 상기 냉매순환관(20)를 접착 고정시킬 수 있다. The method of manufacturing a heat sink according to the present invention is to first process a contact surface (21) by pressing and polishing a portion of the circumference of a circular metal tube to be used as the refrigerant circulation pipe (20), and then using the thermally conductive adhesive (30). In this way, the refrigerant circulation pipe 20 can be adhesively fixed to the pipe installation groove 11 of the heat dissipation member 10.

그러나 이 경우에는, 상기 밀착평면(21)이 방열부재(10)의 제1면(10a)과 동일한 평면을 이루지 못하고 각도가 비틀어질 우려가 있고, 이렇게 되면 상기 밀착평면(21)이 UV LED의 저면에 완전히 밀착되지 못할 우려가 있다.However, in this case, the contact plane 21 does not form the same plane as the first surface 10a of the heat dissipation member 10 and there is a risk that the angle may be distorted, and in this case, the contact plane 21 of the UV LED There is a risk that it may not fully adhere to the bottom surface.

따라서 먼저 원형 금속관체의 원주 일부를 프레스 등으로 살짝 눌러서 밀착평면(21)을 형성한 다음, 이를 방열부재(10)의 관체설치홈(11)에 넣고 열전도성 접착제(30)로 고정시킨 상태에서 상기 밀착평면(21)이 방열부재(10)의 제1면(10a)과 동일한 평면을 형성하도록 연마 가공하는 것이 바람직하다.Therefore, first, lightly press a part of the circumference of the circular metal tube with a press, etc. to form a close contact surface (21), then insert it into the tube installation groove (11) of the heat dissipation member (10) and fix it with a thermally conductive adhesive (30). It is preferable that the contact plane 21 is polished to form the same plane as the first surface 10a of the heat dissipation member 10.

이와 같은 방법으로 밀착평면(21)을 가공할 때, 방열부재(10) 밖으로 노출되어 있는 냉매순환관(20)이 과다하게 연마되지 않도록 하기 위하여 방열부재(10) 밖으로 노출되어 있는 냉매순환관(20)을 방열부재(10) 쪽으로 살짝 구부린 상태에서 연마작업을 실시하는 것이 바람직하다. When processing the contact plane 21 in this way, in order to prevent the refrigerant circulation pipe 20 exposed outside the heat dissipation member 10 from being excessively polished, the refrigerant circulation pipe exposed outside the heat dissipation member 10 ( It is desirable to carry out the polishing work while slightly bending 20) toward the heat dissipation member 10.

(10,10a,10b) 방열부재 (11) 관체설치홈
(12) 방열핀 (13) 나사공
(20,20a,20b) 냉매순환관 (21) 밀착평면
(30) 열전도성 접착제 (D) 냉매순환관(20)의 직경
(W) 밀착평면(21)의 폭(10,10a,10b) Heat dissipation member (11) Pipe installation groove
(12) Heat dissipation fin (13) Thread hole
(20,20a,20b) Refrigerant circulation pipe (21) Adhesion plane
(30) Thermal conductive adhesive (D) Diameter of refrigerant circulation pipe (20)
(W) Width of contact plane (21)

Claims (4)

다수개의 UV LED가 부착되는 제1면(10a)에는 길이방향을 따라 관체설치홈(11)이 구비되어 있고, 제2면(10b)에는 상기 관체설치홈(11)을 따라 방열핀(12)이 돌출되어 금속 재질의 방열부재(10)과;
상기 방열부재(10)의 관체설치홈(11) 속에 매립된 상태에서 냉각용액을 순환시키는 것으로, 상기 관체설치홈(11) 밖으로 노출되는 밀착평면(21)을 갖는 원형 냉매순환관(20); 을 포함하여 구성되고,
상기 냉매순환관(20)에 구비된 밀착평면(21)은 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 이루며, 상기 방열부재(10)에 설치되는 UV LED의 저면에 직접 밀착되는 것을 특징으로 하는, UV LED 경화기용 복합식 히트싱크
The first surface (10a), where a plurality of UV LEDs are attached, is provided with a tube installation groove (11) along the longitudinal direction, and the second surface (10b) has a heat dissipation fin (12) along the tube installation groove (11). A protruding heat dissipation member 10 made of metal;
A circular refrigerant circulation pipe (20) that circulates a cooling solution while embedded in the tube installation groove (11) of the heat dissipation member (10) and has a close contact plane (21) exposed outside the tube installation groove (11); It is composed including,
The close contact plane 21 provided in the refrigerant circulation pipe 20 forms the same plane as the first surface 10a of the heat radiating member 10, and is directly attached to the bottom of the UV LED installed on the heat radiating member 10. Complex heat sink for UV LED curing machine, characterized by close contact
 제1항에 있어서, 상기 냉매순환관(20)의 밀착평면(21)은 단면이 원형인 금속관체의 원주 일부를 평평하게 눌러준 다음, 상기 방열부재(10)의 제1면(10a)과 동일한 평면을 갖도록 연마하여서 된 것임을 특징으로 하는, UV LED 경화기용 복합식 히트싱크
The method of claim 1, wherein the contact plane (21) of the refrigerant circulation pipe (20) is formed by flatly pressing a portion of the circumference of a metal pipe having a circular cross-section, and then forming the first surface (10a) of the heat dissipation member (10). A composite heat sink for a UV LED curing machine, characterized in that it is polished to have the same plane.
 제1항 또는 제2항에 있어서, 상기 냉매순환관(20)의 밀착평면(21)은 폭(W)이 상기 냉매순환관(20) 직경(D)의 0.5~0.8배인 것을 특징으로 하는, UV LED 경화기용 복합식 히트싱크
The method of claim 1 or 2, wherein the width (W) of the contact surface (21) of the refrigerant circulation pipe (20) is 0.5 to 0.8 times the diameter (D) of the refrigerant circulation pipe (20), Complex heat sink for UV LED curing machine
 제1항에 있어서, 상기 방열부재(10)의 관체설치홈(11)은 상면이 개방된 사각형 홈이고, 상기 관체설치홈(11)의 내부에는 상기 냉매순환관(20)을 접착 및 고정시키는 열전도성 접착제(30)가 채워져 있는 것을 특징으로 하는, UV LED 경화기용 복합식 히트싱크The method of claim 1, wherein the tube installation groove (11) of the heat dissipation member (10) is a square groove with an open upper surface, and the refrigerant circulation pipe (20) is adhered and fixed to the inside of the tube installation groove (11). Composite heat sink for UV LED curing machine, characterized in that it is filled with thermally conductive adhesive (30)
KR1020220151619A 2022-11-14 2022-11-14 Air cooling heat sink for UV LED curing machine KR20240074941A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101623299B1 (en) 2015-02-24 2016-05-20 (주)엘라이트 UV LED curing apparatus for large suface coating
KR101723130B1 (en) 2017-01-13 2017-04-05 (주)리트젠 Device for uv curing
KR102016288B1 (en) 2019-07-26 2019-08-29 노도환 Printing UV ink curing system using UV LED
KR102402027B1 (en) 2021-12-09 2022-05-26 주식회사 유브이플러스 LED UV Curing Machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101623299B1 (en) 2015-02-24 2016-05-20 (주)엘라이트 UV LED curing apparatus for large suface coating
KR101723130B1 (en) 2017-01-13 2017-04-05 (주)리트젠 Device for uv curing
KR102016288B1 (en) 2019-07-26 2019-08-29 노도환 Printing UV ink curing system using UV LED
KR102402027B1 (en) 2021-12-09 2022-05-26 주식회사 유브이플러스 LED UV Curing Machine

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