KR20240067753A - Coating type high temperature electrostatic chuck - Google Patents

Abstract

The present disclosure relates to a coating-type high-temperature electrostatic chuck, and the technical problem to be solved is to provide a coating-type high-temperature electrostatic chuck on a surface for chucking a wafer or glass. To this end, the present disclosure includes a base member having a heating line provided in the upper region and a cooling line provided in the lower region; and a support member consisting of a first dielectric layer coated on the base member, an electrode layer provided on the first dielectric layer, and a second dielectric layer coated on the first dielectric layer and the electrode layer, wherein the base member A first heat blocking area that improves heat uniformity of the support member and includes a plurality of first cavities arranged in a horizontal direction between the heating line and the cooling line and a first partition provided between the plurality of first cavities. Additionally, a coating type high temperature electrostatic chuck is provided.

Description

Coating type high temperature electrostatic chuck}

This disclosure relates to a coating type high temperature electrostatic chuck.

Recently, the display industry, including semiconductor devices, LCD, OLED, and FPD industries, is experiencing rapid development. Because this pace of development means higher integration of semiconductor memories and larger areas of display devices, the equipment that manufactures them is also required to be highly functional and large-area.

Generally, an electrostatic chuck is used to fix a wafer or glass panel in a certain position inside a vacuum chamber of semiconductor and/or display manufacturing equipment. Conventionally, a vacuum adsorption method is used to fix a substrate. However, recently, most electrostatic chucks play the role of adsorbing and holding wafers or glass panels by the electrostatic force generated inside them. In other words, the electrostatic chuck is configured to generate static electricity in the electrode layer to fix the substrate in a horizontal state. As the size of the semiconductor wafer or display glass panel increases, the size and area of the electrostatic chuck also increase.

Meanwhile, an electrostatic chuck may be equipped with both a heating line and a cooling line, but there was a problem of low heat uniformity on the chuck surface due to mismatch between the heating line and the cooling line. For example, since the temperature of the chuck surface is approximately 480°C to 560°C depending on the region, there was a problem of quality differences between regions in temperature-sensitive deposition and/or etching processes.

The above-described information disclosed in the background technology of this invention is only for improving understanding of the background of the present invention, and therefore may include information that does not constitute prior art.

The problem to be solved according to the present disclosure is to provide a coating-type high-temperature electrostatic chuck on the surface for chucking a wafer or glass.

A coating-type high-temperature electrostatic chuck according to the present disclosure includes a base member having a heating line provided in an upper region and a cooling line provided in a lower region; and a support member consisting of a first dielectric layer coated on the base member, an electrode layer provided on the first dielectric layer, and a second dielectric layer coated on the first dielectric layer and the electrode layer, wherein the base member A first heat blocking area that improves heat uniformity of the support member and includes a plurality of first cavities arranged in a horizontal direction between the heating line and the cooling line and a first partition provided between the plurality of first cavities. Includes more.

In some examples, the first cavity is filled with an insulating material or metal-ceramic composite (MMC), or the first cavity is coated with YSZ (Yttria-stabilized zirconia) or Al ₂ TiO ₅ on the upper or lower surface, or Alternatively, YSZ or Al ₂ TiO ₅ plates may be combined.

In some examples, the vertical line of the first partition and the vertical line of the heating line may be spaced apart.

In some examples, a vertical line of the first partition wall and a vertical line of the heating line may coincide.

In some examples, the first cavity may be provided between the cooling line and the heating line, and may also be provided between the cooling lines.

In some examples, the thickness of the first heat blocking area may be 1% to 30% of the thickness of the base member.

In some examples, the base member further includes a second heat blocking area, wherein the second heat blocking area includes a plurality of second cavities arranged in a horizontal direction between the first heat blocking area and the cooling line and the plurality of second cavities. and a second partition wall provided between the second cavities, wherein the second cavity is filled with an insulating material or metal-ceramic composite (MMC), or the second cavity is filled with YSZ (Yttria-stabilized material) on the upper or lower surface. zirconia) or Al ₂ TiO ₅ may be coated, or YSZ or Al ₂ TiO ₅ plates may be combined.

In some examples, the vertical line of the second partition wall and the vertical line of the first partition wall may be spaced apart.

In some examples, the vertical line of the second partition wall and the vertical line of the first partition wall may coincide.

In some examples, the thickness of the second heat blocking area may be 1% to 30% of the thickness of the base member.

In some examples, the first dielectric layer may be provided by being directly coated on the base member using an atmospheric pressure plasma spray method.

In some examples, the second dielectric layer may be provided by being directly coated on the electrode layer and the first dielectric layer using an atmospheric pressure plasma spray method.

A coating-type high-temperature electrostatic chuck according to the present disclosure includes a base member having a heating line provided in an upper region and a cooling line provided in a lower region; and a support member consisting of a first dielectric layer coated on the base member, an electrode layer provided on the first dielectric layer, and a second dielectric layer coated on the first dielectric layer and the electrode layer, wherein the electrode layer is made of titanium. Alternatively, it may contain titanium tungsten.

The present disclosure further provides a heat blocking area (e.g., consisting of a plurality of cavities and partitions) between the lower area having a cooling line and the upper area having a heating line in the base member, so that the support member above the heating line is further provided. It is possible to provide a high-temperature electrostatic chuck that can improve thermal uniformity and save energy consumed in maintaining the set temperature of the lower and upper regions.

Additionally, the present disclosure can provide a large-area coated type high-temperature electrostatic chuck that does not bend even in a high-temperature environment and has excellent flatness. In some examples, the present disclosure provides structures and/or materials for the base member and the support member such that the standard deviation for the coefficient of thermal expansion between the base member and the support member ranges from approximately 0.01% to approximately 10%, thereby providing a temperature range of approximately 150°C. In a high temperature environment of about 800°C, the base member and the support member do not bend similarly to a bimetal, and thus a large-area coated type high-temperature electrostatic chuck with excellent flatness can be provided.

1 is a cross-sectional view showing an exemplary coating-type high-temperature electrostatic chuck according to the present disclosure.
2A to 2D are schematic diagrams showing a method of manufacturing an exemplary coating-type high-temperature electrostatic chuck according to the present disclosure.
3 is a cross-sectional view showing another exemplary coating type high temperature electrostatic chuck according to the present disclosure.
FIG. 4 is a table showing thermal analysis images, etc. of a comparative example and an exemplary coating-type high-temperature electrostatic chuck according to the present disclosure.
Figure 5 is a cross-sectional view showing an exemplary coating type high temperature electrostatic chuck according to the present disclosure.
Figure 6 is a cross-sectional view showing an exemplary coating type high temperature electrostatic chuck according to the present disclosure.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The present disclosure is provided to more completely explain the present invention to those skilled in the art, and the following examples may be modified in various other forms, and the scope of the present invention is limited to the following examples. It is not limited. Rather, these embodiments are provided to make the disclosure more faithful and complete, and to fully convey the spirit of the invention to those skilled in the art.

In addition, in the drawings below, the thickness and size of each layer are exaggerated for convenience and clarity of explanation, and the same symbols refer to the same elements in the drawings. As used herein, the term “and/or” includes any one and all combinations of one or more of the listed items. In addition, the meaning of "connected" in this specification refers not only to the case where member A and member B are directly connected, but also to the case where member C is interposed between member A and member B to indirectly connect member A and member B. do.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, the singular forms include the plural forms unless the context clearly indicates otherwise. Additionally, when used herein, “comprise, include,” and/or “comprising, including” refer to mentioned features, numbers, steps, operations, members, elements, and/or groups thereof. It specifies presence and does not exclude the presence or addition of one or more other shapes, numbers, movements, members, elements and/or groups.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers and/or parts, these members, parts, regions, layers and/or parts are limited by these terms. It is obvious that this cannot be done. These terms are used only to distinguish one member, component, region, layer or section from another region, layer or section. Accordingly, a first member, component, region, layer or portion described below may refer to a second member, component, region, layer or portion without departing from the teachings of the present invention.

Space-related terms such as “beneath,” “below,” “lower,” “above,” and “upper” are used to refer to an element or feature shown in a drawing. It can be used to facilitate understanding of other elements or features. These space-related terms are for easy understanding of the present invention according to various process states or usage states of the present invention, and are not intended to limit the present invention. For example, if an element or feature in a drawing is turned over, an element or feature described as “bottom” or “below” becomes “top” or “above.” Therefore, “below” is a concept encompassing “top” or “below.”

In the example shown in FIG. 1 , an exemplary coating type high temperature electrostatic chuck 100 according to the present disclosure may include a base member 110 and a support member 120 .

The base member 110 may include a lower region 112 and an upper region 114 provided on the lower region 112. In some examples, a plurality of cooling lines 111 may be provided in the lower area 112 with a predetermined pitch, and heating lines 113 may be provided in the upper area 114 with a predetermined pitch. A cooling medium flows through the cooling line 111 to cool the lower region 112 of the base member 110 to a predetermined temperature, and current flows through the heating line 113 to cool the upper region 114 of the base member 110. Can be heated to a predetermined temperature. In some examples, the heating line 113 may be made of a nickel-chromium heating wire and an insulator surrounding it. Although the cooling line 111 and the heating line 113 are shown as multiple in the cross-sectional state of FIG. 1, in a substantially flat state, they may be provided in the form of a single vortex or spiral.

In some examples, base member 110 may be provided from pure titanium or titanium alloy. For pure titanium and/or titanium alloy, the thermal expansion coefficient (unit: m/m℃) may be approximately 7 x 10 ^-6 to approximately 11 x 10 ^-6 , and for aluminum, the thermal expansion coefficient may be 23 x 10. It could be ^-6 .

The support member 120 may be provided directly without a bonding layer on the base. In some examples, support member 120 may include a first dielectric layer 121, an electrode layer 123, and a second dielectric layer 122. The first dielectric layer 121 may be provided by coating directly on the base member 110 without a bonding layer. The electrode layer 123 may be provided on the first dielectric layer 121. The second dielectric layer 122 may be provided by being coated on the first dielectric layer 121 and the electrode layer 123.

In some examples, the first dielectric layer 121 may be provided by being directly coated on the base member 110 using an atmospheric pressure plasma spray method. In some examples, the second dielectric layer 122 may be coated directly on the electrode layer 123 and the first dielectric layer 121 using an atmospheric pressure plasma spray method. In some examples, in addition to the atmospheric pressure plasma spray method, aerosol deposition, arc spray, high-velocity oxyfuel spray, cold spray, or flame spray may be used.

In some examples, at least one of the first and second dielectric layers 121 and 122 may be made of ceramic. In some examples, at least one of the first and second dielectric layers 121 and 122 is zirconia (ZrO2), beryllium oxide (BeO), aluminum oxide (Al2O3), aluminum nitride (AlN), silicon carbide (SiC), or silicon nitride (Si3N4). Alternatively, it may include aluminum titanate (Al2TiO5). In some examples, at least one of the first and second dielectric layers 121 and 122 may include yttrium oxide (Y2O3) or yttrium oxide (YOF).

In some examples, the coefficient of thermal expansion of zirconia is approximately 11 x 10 ^-6 . In some examples, the coefficient of thermal expansion of beryllium oxide is approximately 8 x 10 ^-6 . In some examples, the coefficient of thermal expansion of aluminum oxide is approximately 7.3 x 10 ^-6 . In some examples, the coefficient of thermal expansion of aluminum nitride is approximately 4.4 x 10 ^-6 . In some examples, the coefficient of thermal expansion of silicon carbide is approximately 3.7 x 10 ^-6 . In some examples, the coefficient of thermal expansion of aluminum nitride is approximately 3.4 x 10 ^-6 . In some examples, the coefficient of thermal expansion of aluminum titanate is approximately 1 x 10 ^-6 . In some examples, the coefficient of thermal expansion of yttrium oxide and yttrium bicarbonate is from approximately 10 to approximately 10.5 x 10 ^-6 .

In some examples, the electrode layer 123 may include titanium (Ti), titanium tungsten (TiW), or a conductive ceramic containing titanium. In some examples, the electrode layer 123 may be provided with titanium and/or titanium tungsten on the first dielectric layer 121 in various ways, such as sputtering, electroless plating, or electrolytic plating. In some examples, the electrode layer 123 is provided with a conductive ceramic containing titanium on the first dielectric layer 121 in a manner such as spraying or coating to ensure compatibility with the first dielectric layer 121 and the second dielectric layer 122. It can be improved.

In some examples, the base member 110 and/or support member 120 may be provided in a substantially square shape when viewed from the top when used for display glass or approximately circular when viewed from the top when used as a semiconductor wafer. It can be provided in the form

In some examples, when an electrostatic chuck is used for display manufacturing, the length of one side of the support member 120 may be approximately 400 mm to approximately 3500 mm. In some examples, when the electrostatic chuck is used for semiconductor manufacturing, the diameter of support member 120 may be approximately 100 mm to approximately 400 mm.

In some examples, electrostatic chucks may be used in a temperature range of approximately 150°C to approximately 800°C. In some examples, the standard deviation of the coefficient of thermal expansion between base member 110 and support member 120 may be approximately 0.01% to approximately 10%. Therefore, in the range of approximately 150°C to approximately 800°C, which is the operating temperature of the electrostatic chuck, the bending phenomenon due to the difference in thermal expansion coefficient between the base member 110 and the support member 120 can be minimized, and thus electrostatic discharge in a high temperature environment. Excellent flatness of the chuck can be maintained.

In some examples, when the base member 110 is provided as pure titanium (CTE: 8.6) and the first and second dielectric layers 121 and 122 constituting the support member 120 are provided as beryllium oxide (CTE: 8), The standard deviation of CTE may be approximately 0.4%. In some examples, when the base member 110 is provided as pure titanium (CTE: 8.6) and the first and second dielectric layers 121 and 122 constituting the support member 120 are provided as aluminum oxide (CTE: 7.3), The standard deviation of CTE may be approximately 0.9%.

In some examples, when the base member 110 is provided as a titanium alloy (CTE: 9.4) and the first and second dielectric layers 121 and 122 constituting the support member 120 are provided as beryllium oxide (CTE: 8), The standard deviation of CTE may be approximately 1%. In some examples, when the base member 110 is provided as titanium alloy (CTE: 9.4) and the first and second dielectric layers 121 and 122 constituting the support member 120 are provided as aluminum oxide (CTE: 7.3), The standard deviation of CTE may be approximately 1.5%.

In some examples, when the base member 110 is provided as titanium alloy (CTE: 9.4) and the first and second dielectric layers 121 and 122 constituting the support member 120 are provided as yttrium oxide (CTE: 10), The standard deviation of CTE may be approximately 1.9%.

In this way, even if the electrostatic chuck according to the present disclosure is used in a high temperature environment of approximately 150°C to approximately 800°C, the standard deviation of the thermal expansion coefficient between the base member 110 and the support member 120 is less than approximately 2%. , bending phenomenon rarely occurs and excellent flatness can be maintained.

As in the prior art, when the base member 110 is made of aluminum (CTE: 23) and the first and second dielectric layers 121 and 122 constituting the support member 120 are made of aluminum oxide (CTE: 7.3), the CTE of The standard deviation is approximately 11%. In this case, when the electrostatic chuck is used in the above-described high-temperature environment, a large bending phenomenon occurs due to the difference in CTE between the base member 110 and the support member 120, and thus the flatness deteriorates, resulting in glass for displays or wafers for semiconductors. The electrostatic chuck cannot be fixed with strong force.

Meanwhile, in the exemplary coating-type high-temperature electrostatic chuck 100 according to the present disclosure, the base member 110 may further include a first heat blocking area 130 that improves heat uniformity of the support member 120. In some examples, a thermal barrier region may include or be referred to as an isolation region, blocking region, isolation region, or isolation region.

As described above, the base member 110 is provided with a plurality of cooling lines 111 in the lower region 112 and a plurality of heating lines 113 in the upper region 114. The cooling lines 111 A first heat blocking area 130 may be additionally provided between the heating line 113 and the heating line 113.

In examples, the first heat blocking area 130 may be provided parallel to the cooling line 111 and the heating line 113. In some examples, the first heat blocking area 130 may include a plurality of first cavities 131 arranged in a horizontal direction and a first partition wall 132 interposed between the plurality of first cavities 131. . Although the first heat blocking area 130 is shown as a plurality of first cavities 131 and a plurality of first partitions 132 in the cross-sectional state of FIG. 1, in a substantially planar state, there is only one first cavity 131. And one first partition 132 may be provided in a swirl or spiral shape.

In some examples, the first partition 132 may connect the cooling line 111 and the heating line 113 indirectly (see this disclosure (1)) or directly (see this disclosure (2)). In some examples, the first partition 132 may also be provided parallel to the cooling line 111 and the heating line 113.

For example, as shown in this disclosure (1), the vertical line of the first partition 132 and the vertical line of the heating line 113 (and/or cooling line 111) may be spaced apart from each other. In other words, the position of the first partition 132 and the position of the heating line 113 (and/or the cooling line 111) do not overlap in the vertical direction, and accordingly, the heating line 113 and the cooling line 111 ) The distance between each other is as far as possible.

For example, if eight cooling lines 111 are provided and seven heating lines 113 are also provided, seven first partition walls 132 connecting the cooling lines 111 and the heating lines 113 will also be provided. You can. In some examples, the number of first cavities 131 that are components of the first heat blocking area 130 may be equal to the number of first partition walls 132 .

For example, as shown in this disclosure (2), the vertical line of the first partition 132 and the vertical line of the heating line 113 (and/or cooling line 111) may coincide with each other. Explained differently, the position of the first partition 132 and the position of the heating line 113 (and/or cooling line 111) may overlap in the vertical direction, and accordingly, the heating line 113 and the cooling line ( 111) The distance between each other is as close as possible.

For example, if seven cooling lines 111 are provided and seven heating lines 113 are also provided, seven first partition walls 132 connecting the cooling lines 111 and the heating lines 113 will also be provided. You can. In some examples, the number of first cavities 131 that are components of the first heat blocking area 130 may be one more than the number of first partitions 132 .

In some examples, the thickness of the first heat blocking area 130 (or first cavity 131 and/or first partition 132) is approximately 1% to approximately 30% of the total thickness of the base member 110. You can. If the thickness of the first heat blocking region 130 is less than approximately 1%, the heat blocking effect is weak and a lot of energy is required to maintain each set temperature of the lower region 112 and the upper region 114. If the thickness of the first heat blocking area 130 is thicker than approximately 30%, the heat blocking effect is excellent, but the thickness of the base member 110 increases, which may increase the overall system thickness and weight.

In this way, the present disclosure provides a heat shielding area 130 (for example, For example, by further providing a plurality of first cavities 131 and partition walls 132, the heat uniformity of the support member 120 on the heating line 113 can be improved. In addition, energy consumed to maintain the set temperature of the lower region 112 and the upper region 114 can be reduced.

2A to 2D are schematic diagrams showing a method of manufacturing an exemplary coating-type high-temperature electrostatic chuck 100 according to the present disclosure.

FIG. 2A illustrates the initial stages of manufacturing an exemplary coating-type high-temperature electrostatic chuck 100 according to the present disclosure. A plurality of cooling lines 111 are provided in the lower area 112, a plurality of heating lines 113 are provided in the upper area 114, and a first heating line is provided between the cooling line 111 and the heating line 113. A base member 110 provided with a heat blocking area 130 may be provided. In some examples, base member 110 may be provided from pure titanium or titanium alloy.

FIG. 2B illustrates a later stage of manufacturing an exemplary coated type high temperature electrostatic chuck 100 according to the present disclosure. The first dielectric layer 121 may be directly coated on the base member 110. In some examples, aluminum oxide powder may be coated on the base member 110 using an atmospheric pressure plasma spray method. Accordingly, there is no bonding layer between the base member 110 and the first dielectric layer 121, and the first dielectric layer 121 can be provided directly on the base member 110. In the drawing, an unexplained reference numeral 150 is a powder spray nozzle.

FIG. 2C illustrates a later stage of manufacturing an exemplary coated type high temperature electrostatic chuck 100 according to the present disclosure. An electrode layer 123 may be provided on the first dielectric layer 121. The electrode layer 123 may also be provided by a plating method or the various spray methods described above. The electrode layer 123 may include tungsten (W) and/or titanium (Ti).

FIG. 2D illustrates a later stage of manufacturing an exemplary coated type high temperature electrostatic chuck 100 according to the present disclosure. The second dielectric layer 122 may be directly coated on the first dielectric layer 121 and the electrode layer 123. In some examples, aluminum oxide powder may be coated on the first dielectric layer 121 and the electrode layer 123 using an atmospheric pressure plasma spray method. Here, the first dielectric layer 121, the electrode layer 123, and the second dielectric layer 122 may be defined or referred to as the support member 120.

In this way, the base member 110 includes titanium and the support member 120 includes aluminum oxide, so that the standard deviation of the thermal expansion coefficient of the base member 110 and the support member 120 is less than approximately 2%. Therefore, even when the electrostatic chuck is used in a high temperature environment of approximately 150°C to approximately 800°C, bending of the base member 110 and the support member 120 rarely occurs and excellent flatness is maintained. Therefore, the fixing force of the glass or wafer by the electrostatic chuck can be maintained excellently.

In addition, a first heat blocking area 130 (for example, consisting of a plurality of first cavities 131 and a partition 132) is further provided on the base member 110, thereby providing support on the heating line 113. The heat uniformity of the member 120 can be improved, and the energy consumed to maintain the set temperature of the lower region 112 and the upper region 114 of the base member 110 can be reduced.

In some examples, lower region 112 may be maintained at a temperature of approximately 60°C due to cooling lines 111 and upper region 114 may be maintained at a temperature of approximately 600°C due to heating lines 113. . However, if the lower region 112 and the upper region 114 are directly connected, heat energy is exchanged between them, so more energy is input to maintain the set temperature of the lower region 112 and the upper region 114, respectively. Needs to be.

However, as described above, when the heat blocking area 130 is interposed between the cooling line 111 and the heating line 113, the flow of heat energy is blocked between the cooling line 111 and the heating line 113. , less energy can be input to maintain the set temperatures of the lower region 112 and the upper region 114, respectively.

In some examples, the first heat blocking area 130 may include the first cavity 131 and the first partition 132 as described above. In some examples, an insulating material (e.g., airgel, perlite, foamed glass, mineral wool, glass wool, etc.) filled in the first cavity 131 or a metal-ceramic composite (MMC: Metal Matrix Composite) may be further included. In some examples, the upper and/or lower surfaces of the first cavity 131 may be coated with Yttria-stabilized zirconia (YSZ), Al ₂ TiO ₅ , which has low thermal conductivity, or a YSZ or Al ₂ TiO ₅ plate may be combined.

Figure 3 is a cross-sectional view showing another exemplary coating type high temperature electrostatic chuck 200 according to the present disclosure.

In the example shown in FIG. 3 , another exemplary coating type high temperature electrostatic chuck 200 according to the present disclosure may further include a second heat blocking region 230 . In some examples, the second heat blocking area 230 may be provided on the base member 110 and may be provided in a horizontal direction between the first heat blocking area 130 and the cooling line 111. In some examples, the second heat blocking area 230 also includes a plurality of second cavities 231 and a plurality of second partition walls 232 in the horizontal direction between the first heat blocking area 130 and the cooling line 111. This can be provided and implemented. In some examples, an insulating material (e.g., airgel, perlite, foamed glass, mineral wool, glass wool, etc.) filled in the second cavity 231 or a metal-ceramic composite (MMC: Metal Matrix Composite) may be further included. In some examples, Yttria-stabilized zirconia (YSZ), which has low thermal conductivity, may be coated on the upper and/or lower surfaces of the second cavity 231, or YSZ or Al ₂ TiO ₅ plates may be combined. In some examples, the second partition 232 may also connect the first heat blocking area 130 and the cooling line 111 indirectly or directly.

In some examples, the second heat blocking area 230 may be provided parallel to the first heat blocking area 130 and the cooling line 111. In some examples, although the second heat blocking area 230 is shown as a plurality of second cavities 231 and a plurality of second partitions 232 in the cross-sectional state of FIG. 3, in a substantially planar state, it has one second heat blocking region 230. The cavity 231 and one second partition wall 232 may be provided in a swirl or spiral shape.

In some examples, the vertical line of the second partition wall 232 and the vertical line of the first partition wall 132 may be spaced apart from each other. In other words, the positions of the second partition wall 232 and the first partition wall 131 do not overlap in the vertical direction, and thus the distance between the heating line 113 and the cooling line 111 is as far as possible. .

In some examples, the vertical line of the second partition wall 232 and the vertical line of the first partition wall 132 may coincide with each other. In other words, the position of the second partition 232 and the position of the first partition 131 overlap in the vertical direction, and accordingly, the distance between the heating line 113 and the cooling line 111 becomes as close as possible.

In some examples, the first row blocking area 130 and the second row blocking area 230 may be provided alternately in a parallel horizontal direction when viewed in cross section. In some examples, the first barrier rib 132 and the second barrier rib 232 may be provided alternately in parallel horizontal directions when viewed in cross section. Accordingly, the length of the first and second partition walls 132 and 232 provided between the cooling line 111 and the heating line 113 becomes relatively long.

In some examples, the thickness of the second heat blocking area 230 may be approximately 1% to approximately 30% of the total thickness of the base member 110. If the thickness of the second heat blocking area 230 is less than approximately 1%, the heat blocking effect is weak and a lot of energy is required to maintain each set temperature of the lower area 112 and the upper area 114. If the thickness of the second heat blocking area 230 is thicker than approximately 30%, the heat blocking effect is excellent, but the overall system thickness may increase by increasing the overall thickness of the base member 110.

In some examples, the thickness of the first and second row blocking areas 130 and 230 may be approximately 1% to approximately 30% of the total thickness of the base member 110. If the thickness of the first and second heat blocking regions 130 and 230 is less than approximately 1%, the heat blocking effect is weak and a lot of energy is required to maintain the respective set temperatures of the lower region 112 and the upper region 114. If the thickness of the first and second heat blocking areas 130 and 230 is thicker than approximately 30%, the heat blocking effect is excellent, but the overall system thickness may increase by increasing the overall thickness of the base member 110.

FIG. 4 is a table showing thermal analysis images, etc. of a comparative example and an exemplary coating-type high-temperature electrostatic chuck according to the present disclosure. In FIG. 4, the comparative example is a case where there is no heat blocking area, and the present disclosure (1) is a case where the vertical line positions of the first partition 132 and the heating line 113 are spaced apart as described above, and the present disclosure (2) ) is a case where the vertical line positions of the first partition 132 and the heating line 113 match (or overlap).

As shown in FIG. 4, in the case of the comparative example, it can be seen from the thermal analysis image and surface heat distribution image that the thermal uniformity is low. For example, the surface temperature deviation is approximately 82°C. In the case of this disclosure (1), it can be seen from the thermal analysis image and surface heat distribution image that the thermal uniformity is relatively excellent. For example, the surface temperature deviation is approximately 24°C. In the case of this disclosure (2), it can be seen from the thermal analysis image and surface heat distribution image that the thermal uniformity is very excellent. For example, the surface temperature deviation is approximately 3°C.

Figure 5 is a cross-sectional view showing an exemplary coating type high temperature electrostatic chuck 300 according to the present disclosure. As shown in FIG. 5, in another exemplary bonding type high-temperature electrostatic chuck 300 according to the present disclosure, the heat blocking area 331 is approximately T in the horizontal direction between the cooling line 111 and the heating line 113. A plurality of them may be provided in the shape of a ruler, and in particular, the heat blocking area 331 may be arranged not only in the area between the cooling line 111 and the heating line 113 but also between the cooling lines 111. In other words, a plurality of partition walls 332 may be provided in a horizontal direction between the cooling line 111 and the heating line 113, and may also be disposed between the cooling lines 111.

Figure 6 is a cross-sectional view showing an exemplary coating type high temperature electrostatic chuck 400 according to the present disclosure. As shown in FIG. 6, another exemplary bonding type high temperature electrostatic chuck 400 according to the present disclosure, in particular, the base member 110 has a cooling line 111 (lower region or cooling region 112) and a heating It may include a heat shielding region 430 interposed between the lines 113 (upper region or heating region 114) and an insulating material 440 having a thermal conductivity of less than approximately 10 coupled to the heat shielding region 430. . In some examples, the insulating material 440 may include Yttria-stabilized zirconia (YSZ) filler or Al ₂ TiO ₅ filler or a YSZ plate or Al ₂ TiO ₅ plate filled in the cavity 431 . In some examples, the thickness of the heat insulating material 440 may be smaller than the height of the heat blocking area 430, so that approximately the upper and lower areas of the heat blocking area 430 may remain in the form of a cavity.

What has been described above is only one example for carrying out the coating-type high-temperature electrostatic chuck according to the present invention, and the present invention is not limited to the above-described embodiment, and as claimed in the following patent claims, the present invention Without departing from the gist, anyone with ordinary knowledge in the field to which the invention pertains will say that the technical spirit of the present invention exists to the extent that various modifications can be made.

100.200,300; Coated type high temperature electrostatic chuck
110; base member 111; cooling line
112; subarea 113; heating line
114; upper area 120; support member
121; first dielectric layer 122; second dielectric layer
123; electrode layer 130; First heat blocking area
131; first cavity 132; 1st bulkhead
150; spray nozzle 230; Second row blocking area
231; second cavity 232; 2nd bulkhead

Claims (13)

a base member having a heating line provided in an upper area and a cooling line provided in a lower area; and
A support member comprising a first dielectric layer coated on the base member, an electrode layer provided on the first dielectric layer, and a second dielectric layer coated on the first dielectric layer and the electrode layer,
The base member consists of a plurality of first cavities arranged in a horizontal direction between the heating line and the cooling line and a first partition provided between the plurality of first cavities to improve heat uniformity of the support member. A coated type high temperature electrostatic chuck further comprising a heat blocking area. According to claim 1,
The first cavity is filled with an insulating material or metal-ceramic composite (MMC), or the first cavity is coated with YSZ (Yttria-stabilized zirconia) or Al ₂ TiO ₅ on the upper or lower surface, or YSZ or Al Coated type high temperature electrostatic chuck with ₂ TiO ₅ plates combined. According to claim 1,
A coating-type high-temperature electrostatic chuck in which the vertical line of the first partition wall and the vertical line of the heating line are spaced apart. According to claim 1,
A coating-type high-temperature electrostatic chuck, wherein the vertical line of the first partition and the vertical line of the heating line coincide. According to claim 1,
The first cavity is provided between the cooling line and the heating line, and is also provided between the cooling lines. According to claim 1,
A coating-type high-temperature electrostatic chuck wherein the thickness of the first heat blocking area is 1% to 30% of the thickness of the base member. According to claim 1,
The base member further includes a second heat blocking area,
The second heat blocking area includes a plurality of second cavities arranged in a horizontal direction between the first heat blocking area and the cooling line and a second partition provided between the plurality of second cavities,
The second cavity is filled with an insulating material or metal-ceramic composite (MMC) inside, or the second cavity is coated with YSZ (Yttria-stabilized zirconia) or Al ₂ TiO ₅ on the upper or lower surface, or YSZ or Al Coated type high temperature electrostatic chuck with ₂ TiO ₅ plates combined. According to claim 7,
A coating-type high-temperature electrostatic chuck, wherein the vertical line of the second partition wall and the vertical line of the first partition wall are spaced apart. According to claim 7,
A coating-type high-temperature electrostatic chuck, wherein the vertical line of the second barrier wall and the vertical line of the first barrier wall coincide. According to claim 7,
A coating-type high-temperature electrostatic chuck wherein the thickness of the second heat blocking area is 1% to 30% of the thickness of the base member. According to claim 1,
A coating-type high-temperature electrostatic chuck, wherein the first dielectric layer is provided by being directly coated on the base member using an atmospheric pressure plasma spray method. According to claim 1,
A coating-type high-temperature electrostatic chuck, wherein the second dielectric layer is provided by being directly coated on the electrode layer and the first dielectric layer using an atmospheric pressure plasma spray method. a base member having a heating line provided in an upper area and a cooling line provided in a lower area; and
A support member comprising a first dielectric layer coated on the base member, an electrode layer provided on the first dielectric layer, and a second dielectric layer coated on the first dielectric layer and the electrode layer,
A coating-type high-temperature electrostatic chuck, wherein the electrode layer includes titanium or titanium tungsten.