KR20240041770A - Lens assembly and electronic device including the same - Google Patents

Abstract

According to an embodiment of the present disclosure, a lens assembly and/or an electronic device including the same includes a first lens array including a plurality of lenses aligned along a first optical axis direction, the plurality of lenses on the first optical axis, and a first image sensor aligned and arranged to receive light focused through the first lens array, a second lens array including a plurality of other lenses aligned along a second optical axis direction different from the first optical axis, An optical member configured to refract or reflect light focused through a second lens array at least once and guide it in a direction different from the second optical axis, and a light focused by the second lens array and refracted or reflected by the optical member. It may include a second image sensor arranged to receive the light. In one embodiment, the optical member may be configured to refract or reflect light focused through the second lens array, thereby making the light incident on the second image sensor via a path that intersects the first optical axis. In addition, various embodiments may be possible.

Description

Lens assembly and electronic device including same {LENS ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME}

Embodiment(s) of the present disclosure relate to a lens assembly, for example, a lens assembly including a plurality of lens arrays, and an electronic device including the same.

Optical devices, such as cameras capable of taking images or video, have been widely used, and recently, digital cameras with solid-state image sensors such as charge coupled device (CCD) or complementary metal-oxide semiconductor (CMOS) have been used. Video cameras have become common. Optical devices employing solid-state image sensors (CCD or CMOS) are gradually replacing film-type optical devices because they are easier to store, copy, and move images than film-type optical devices.

Recently, two or more selected from a plurality of optical devices, for example, a macro camera, a telephoto camera, and/or a wide-angle camera, are mounted on a single electronic device to improve the quality of captured images and to provide various visual effects to the captured images. It was possible to grant it. For example, it is possible to acquire subject images through a plurality of cameras with different optical characteristics and synthesize them to obtain high-quality captured images. As multiple optical devices (e.g. cameras) are mounted to acquire high-quality captured images, electronic devices such as mobile communication terminals and smart phones are gradually replacing electronic devices specialized for shooting functions such as digital compact cameras, and in the future It is expected that it can replace high-performance cameras such as single-lens reflex cameras (e.g. DSLR, digital single-lens reflex camera).

The above information may be provided as background technology for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may apply as prior art with respect to the present disclosure.

According to one embodiment of the present disclosure, a lens assembly includes a first lens array including a plurality of lenses aligned along a first optical axis direction, the plurality of lenses aligned on the first optical axis, and the first lens array A first image sensor arranged to receive light focused through a second lens array, a second lens array including a plurality of other lenses aligned along a second optical axis direction different from the first optical axis, and focused through the second lens array. An optical member configured to refract or reflect light at least once and guide it in a direction different from the second optical axis, and a second lens array arranged to receive the light focused by the second lens array and refracted or reflected by the optical member. 2 May include an image sensor. In one embodiment, the optical member may be configured to refract or reflect light focused through the second lens array, thereby making the light incident on the second image sensor via a path that intersects the first optical axis.

According to an embodiment of the present disclosure, an electronic device may include a lens assembly and a processor configured to acquire an image of a subject using the lens assembly. In one embodiment, the lens assembly includes a first lens array including a plurality of lenses aligned along a first optical axis direction, aligned with the plurality of lenses on the first optical axis and focused through the first lens array. A first image sensor arranged to receive light, a second lens array including a plurality of other lenses aligned along a second optical axis direction different from the first optical axis, and the light focused through the second lens array at least An optical member configured to refract or reflect once and guide the light in a direction different from the second optical axis, and a second image sensor arranged to receive light focused by the second lens array and refracted or reflected by the optical member. may include. In one embodiment, the optical member may be configured to refract or reflect light focused through the second lens array, thereby making the light incident on the second image sensor via a path that intersects the first optical axis.

The above-described or other aspects, configurations and/or advantages of the embodiment(s) of the present disclosure may become clearer through the following detailed description with reference to the accompanying drawings.
1 is a block diagram showing an electronic device in a network environment, according to an embodiment of the present disclosure.
Figure 2 is a block diagram illustrating a camera module according to an embodiment of the present disclosure.
Figure 3 is a perspective view showing the front of an electronic device according to an embodiment of the present disclosure.
FIG. 4 is a perspective view showing the rear of the electronic device shown in FIG. 3 according to an embodiment of the present disclosure.
Figure 5 is a diagram showing a lens assembly according to an embodiment of the present disclosure.
FIG. 6 is a diagram illustrating the arrangement of the first lens array and the first image sensor of FIG. 5 according to an embodiment of the present disclosure.
FIG. 7 is a graph showing spherical aberration of the first lens array of FIG. 6 according to an embodiment of the present disclosure.
FIG. 8 is a graph showing astigmatism of the first lens array of FIG. 6 according to an embodiment of the present disclosure.
FIG. 9 is a graph showing the distortion rate of the first lens array of FIG. 6 according to an embodiment of the present disclosure.
FIG. 10 is a diagram illustrating the arrangement of the second lens array and the second image sensor of FIG. 5 according to an embodiment of the present disclosure.
FIG. 11 is a graph showing spherical aberration of the second lens array of FIG. 10 according to an embodiment of the present disclosure.
FIG. 12 is a graph showing astigmatism of the second lens array of FIG. 10 according to an embodiment of the present disclosure.
FIG. 13 is a graph showing the distortion rate of the second lens array of FIG. 10 according to an embodiment of the present disclosure.
Figure 14 is a diagram showing a lens assembly according to an embodiment of the present disclosure.
Throughout the accompanying drawings, like parts, components and/or structures may be assigned similar reference numbers.

One miniaturized electronic device includes a standard camera, a wide-angle (or ultra-wide-angle) camera, a macro camera, and/or a telephoto camera, thereby acquiring multiple images of one subject and combining them to obtain a high-quality image. You can. Cameras or lens assemblies may be classified according to their angle of view (or focal length) as standard cameras, wide-angle (or ultra-wide) cameras, macro cameras, and/or telephoto cameras. As portable electronic devices such as smartphones are equipped with displays large enough to provide a screen of sufficient size, portability can be secured by reducing the thickness or weight of the electronic device. A telephoto camera may have a relatively large focal length compared to a standard camera or wide-angle camera, and may be implemented with a folded structure that refracts or reflects the path of light. For example, by including an optical member that refracts or reflects the path of light, the lens assembly can provide good telephoto performance even in miniaturized electronic devices. However, in a reality where the thickness is gradually decreasing in securing the portability of electronic devices, it may be difficult to mount a plurality of lens assemblies on one electronic device.

Embodiment(s) of the present disclosure are intended to solve at least the above-mentioned problems and/or disadvantages and provide at least the advantages described later, and include a lens assembly including a plurality of lens arrays aligned on different optical axes and/or such An electronic device including a lens assembly can be provided.

Embodiment(s) of the present disclosure may provide a lens assembly that includes a plurality of lens arrays and can be easily miniaturized, and/or an electronic device including such a lens assembly.

The technical challenges sought to be achieved in this document are not limited to the technical challenges mentioned above, and other technical challenges not mentioned can be clearly understood by those skilled in the art of this document from the description below. There will be.

The following description in conjunction with the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and corresponding content. The example embodiments disclosed in the following description include numerous specific details to aid understanding, but are considered to be one of a variety of example embodiments. Accordingly, a person skilled in the art will understand that various changes and modifications to the various implementations described in this document can be made without departing from the scope and technical spirit of the disclosure. Additionally, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to a referential meaning and may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be clear to those skilled in the art that the following description of various implementations of disclosures is provided for illustrative purposes and not for the purpose of limiting the scope of rights and disclosures stipulating equivalents.

Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" shall be understood to include plural meanings. Thus, for example, “component surface” may be understood to include one or more of the surfaces of the component.

1 is a block diagram of an electronic device 101 in a network environment 100, according to an embodiment of the present disclosure. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In one embodiment, at least one of these components (eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101. In one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 is a main processor 121 (e.g., a central processing unit or an application processor), or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit). (NPU; neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g. : Sound can be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 to an external electronic device (eg, the electronic device 102) directly or wirelessly. According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). It can support the establishment of and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It can communicate with external electronic devices through telecommunication networks such as cellular networks, 5G networks, next-generation communication networks, the Internet, or computer networks (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to one embodiment, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a block diagram 200 illustrating a camera module 280 (eg, camera module 180 of FIG. 1 ) according to one embodiment of the present disclosure. Referring to FIG. 2, the camera module 280 includes a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., buffer memory), or an image signal processor. It may include (260). In one embodiment, lens assembly 210 may include an image sensor 230. The lens assembly 210 may collect light emitted from a subject that is the target of image capture. Lens assembly 210 may include one or more lenses. According to one embodiment, the camera module 280 may include a plurality of lens assemblies 210. In this case, the camera module 280 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 have the same lens properties (e.g., angle of view, focal length, autofocus, F-number, or optical zoom), or at least one lens assembly has different It may have one or more lens properties that are different from the lens properties of the lens assembly. The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 220 may include one or more light emitting diodes (eg, red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to one embodiment, the image sensor 230 is one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having different properties or a plurality of image sensors having different properties. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 moves at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to the movement of the camera module 280 or the electronic device 201 including the same. The operation characteristics of the image sensor 230 can be controlled (e.g., adjusting read-out timing, etc.). This allows to compensate for at least some of the negative effects of the movement on the image being captured. According to one embodiment, the image stabilizer 240 uses a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 280 to stabilize the camera module 280 or an electronic device (e.g. : Such movement of the electronic device 101 in FIG. 1 can be detected. According to one embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may at least temporarily store at least a portion of the image acquired through the image sensor 230 for the next image processing task. For example, when image acquisition is delayed due to the shutter or when multiple images are acquired at high speed, the acquired original image (e.g., Bayer-patterned image or high-resolution image) is stored in the memory 250. , the corresponding copy image (e.g., low resolution image) may be previewed through the display module 160 of FIG. 1. Thereafter, when a specified condition is satisfied (eg, user input or system command), at least a portion of the original image stored in the memory 250 may be obtained and processed, for example, by the image signal processor 260. According to one embodiment, the memory 250 may be configured as at least a part of a memory (eg, memory 130 of FIG. 1) or as a separate memory that operates independently.

The image signal processor 260 may perform one or more image processes on an image acquired through the image sensor 230 or an image stored in the memory 250. The one or more image processes may include, for example, depth map creation, three-dimensional modeling, panorama creation, feature point extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring). may include blurring, sharpening, or softening. Additionally or alternatively, the image signal processor 260 may include at least one of the components included in the camera module 280 (e.g., an image sensor). (230)) may perform control (e.g., exposure time control, read-out timing control, etc.). The image processed by the image signal processor 260 is stored back in the memory 250 for further processing. or may be provided as an external component of the camera module 280 (e.g., memory 130, display module 160, electronic device 102, electronic device 104, or server 108 of FIG. 1). According to one embodiment, the image signal processor 260 may be configured as at least a part of a processor (e.g., the processor 120 of FIG. 1), or may be configured as a separate processor that operates independently of the processor 120. When the image signal processor 260 is configured as a separate processor from the processor 120, at least one image processed by the image signal processor 260 is displayed as is or after additional image processing by the processor 120. It may be displayed through module 160.

According to one embodiment, an electronic device (eg, the electronic device 101 of FIG. 1) may include a plurality of camera modules 280, each with different properties or functions. In this case, for example, at least one of the plurality of camera modules 280 may be a wide-angle camera and at least another one may be a telephoto camera. Similarly, at least one of the plurality of camera modules 280 may be a front camera, and at least another one may be a rear camera.

Electronic devices according to the embodiment(s) of the present disclosure may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The embodiment(s) of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In this document: “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”. Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are software (e.g., a program) that includes one or more instructions stored in a storage medium (e.g., internal memory or external memory) that can be read by a machine (e.g., an electronic device). It can be implemented as: For example, a processor (eg, processor) of a device (eg, electronic device) may call at least one instruction among one or more instructions stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or via an application store (e.g. Play Store ^TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately arranged in other components. . According to embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

FIG. 3 is a perspective view showing the front of an electronic device 300 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment of the present disclosure. FIG. 4 is a perspective view showing the rear of the electronic device 300 shown in FIG. 3 according to an embodiment of the present disclosure.

Referring to FIGS. 3 and 4, the electronic device 300 (e.g., the electronic device 101 of FIG. 1) according to one embodiment has a first side (or front) 310A, a second side (or back), and ) (310B), and a housing (310) including a side (310C) surrounding the space between the first surface (310A) and the second surface (310B). In one embodiment (not shown), housing 310 may refer to a structure that forms some of the first side 310A, second side 310B, and side surface 310C of FIG. 3 . According to one embodiment, the first surface 310A may be formed at least in part by a substantially transparent front plate 302 (eg, a glass plate including various coating layers, or a polymer plate). In one embodiment, the front plate 302 may be coupled to the housing 310 to form an internal space together with the housing 310. In one embodiment, 'internal space' may mean an internal space of the housing 310 that accommodates at least a portion of the display 301, which will be described later, or the display module 160 of FIG. 1.

According to one embodiment, the second surface 310B may be formed by a substantially opaque rear plate 311. The back plate 311 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The side 310C combines with the front plate 302 and the back plate 311 and may be formed by a side bezel structure (or “side member”) 318 comprising metal and/or polymer. In one embodiment, the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, a metallic material such as aluminum).

In the illustrated embodiment, the front plate 302 has two first regions 310D that are curved and extend seamlessly from the first surface 310A toward the rear plate 311. It can be included at both ends of the long edge of (302). In the illustrated embodiment (see FIG. 4), the rear plate 311 is curved from the second surface 310B toward the front plate 302 to form two second regions 310E that extend seamlessly and have long edges. It can be included at both ends. In one embodiment, the front plate 302 (or the back plate 311) may include only one of the first areas 310D (or the second areas 310E). In one embodiment, some of the first areas 310D or the second areas 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 300, the side bezel structure 318 is a side (e.g., a side that does not include the first area 310D or the second area 310E). The side where the connector hole 308 is formed) has a first thickness (or width), and the side including the first area 310D or the second area 310E (e.g., the side where the key input device 317 is disposed) has a first thickness (or width). The side surface may have a second thickness that is thinner than the first thickness.

According to one embodiment, the electronic device 300 includes a display 301, audio modules 303, 307, and 314, sensor modules 304, 316, and 319, and camera modules 305, 312, and 313 (e.g., It may include at least one of the camera modules 180 and 280 of FIG. 1 or 2, a key input device 317, a light emitting element 306, and a connector hole 308 or 309. In one embodiment, the electronic device 300 may omit at least one of the components (eg, the key input device 317 or the light emitting device 306) or may additionally include another component.

The display 301 (e.g., display module 160 of FIG. 1) may be visually exposed, for example, through a significant portion of the front plate 302. In one embodiment, at least a portion of the display 301 may be visually exposed through the front plate 302 forming the first surface 310A and the first area 310D of the side surface 310C. there is. In one embodiment, the edges of the display 301 may be formed to be substantially the same as the adjacent outer shape of the front plate 302. In one embodiment (not shown), in order to expand the area to which the display 301 is visually exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be formed to be substantially the same.

In one embodiment (not shown), a recess or opening is formed in a portion of the screen display area (e.g., active area) or an area outside the screen display area (e.g., inactive area) of the display 301, An audio module 314 (e.g., audio module 170 in FIG. 1), a sensor module 304 (e.g., sensor module 176 in FIG. 1), and a camera module aligned with the recess or the opening. It may include at least one of (305) and a light emitting device (306). In one embodiment (not shown), an audio module 314, a sensor module 304, a camera module 305 (e.g., under display camera (UDC)), and a fingerprint are located on the back of the screen display area of the display 301. It may include at least one of a sensor 316 and a light emitting device 306. In one embodiment (not shown), the display 301 is coupled to or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. can be placed. In one embodiment, at least a portion of the sensor modules 304, 319, and/or at least a portion of the key input device 317 are located in the first regions 310D and/or the second regions 310E. can be placed in the field.

The audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314. A microphone for acquiring external sound may be placed inside the microphone hole 303, and in one embodiment, a plurality of microphones may be placed to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for calls. In one embodiment, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (e.g., piezo speaker).

The sensor modules 304, 316, and 319 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 300 or the external environmental state. The sensor modules 304, 316, 319 may include, for example, a first sensor module 304 (e.g., a proximity sensor) and/or a second sensor module (e.g., a proximity sensor) disposed on the first side 310A of the housing 310. (not shown) (e.g., fingerprint sensor), and/or a third sensor module 319 (e.g., HRM sensor) and/or fourth sensor module 316 disposed on the second side 310B of the housing 310. ) (e.g., a fingerprint sensor) may be included. The fingerprint sensor may be disposed on the first side 310A (eg, display 301) as well as the second side 310B of the housing 310. The electronic device 300 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor.

The camera modules 305, 312, and 313 include a first camera device 305 disposed on the first side 310A of the electronic device 300, and a second camera device 312 disposed on the second side 310B. ) and/or a flash 313. The camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 300.

The key input device 317 may be disposed on the side 310C of the housing 310. In one embodiment, the electronic device 300 may not include some or all of the key input devices 317 mentioned above, and the key input devices 317 that are not included may include soft keys, etc. on the display 301. It can be implemented in different forms. In one embodiment, the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310.

For example, the light emitting device 306 may be disposed on the first side 310A of the housing 310. For example, the light emitting device 306 may provide status information of the electronic device 300 in the form of light. In one embodiment, the light emitting device 306 may provide a light source that is linked to the operation of the camera module 305, for example. The light emitting device 306 may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 308 and 309 are a first connector hole 308 that can accommodate a connector (for example, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. and a second connector hole (eg, earphone jack) 309 that can accommodate a connector for transmitting and receiving audio signals.

Figure 5 is a diagram showing a lens assembly according to an embodiment of the present disclosure.

Referring to Figure 5, the lens assembly 400 (e.g., the camera module 180, 280, 305, 312, 313 of Figures 1 to 4 or the lens assembly 210 of Figure 2) is, for example, A lens assembly implementing the camera modules 180, 280, 305, 312, and 313 of FIGS. 1 to 4, comprising a plurality of lens arrays (LA1, LA2), a plurality of image sensors (I1, I2), and an optical member ( OM) may be included. A plurality of image sensors (I1, I2) may receive incident light through different paths, and may be connected to an electronic device (e.g., the electronic devices 101, 102, 104, and 300 of FIGS. 1, 3, or 4). Alternatively, a processor (e.g., processor 120 of FIG. 1 or image signal processor 260 of FIG. 2) may acquire a subject image based on light received by the plurality of image sensors I1 and I2. In one embodiment, light incident on different paths may at least partially overlap or intersect within the lens assembly 400. “The inside of the lens assembly” may refer to the inside of the optical member (OM), for example. In an embodiment described later, “the incident path or traveling path of light intersects” refers to the area or space where the light focused by the first lens array (LA1) among the plurality of lens arrays (LA1, LA2) travels. This may refer to the fact that the light focused by the second lens array LA2 among the plurality of lens arrays LA1 and LA2 overlaps at least partially with the area or space through which it travels.

According to one embodiment, the first lens array LA1 includes a plurality of lenses (e.g., 5 elements) aligned along the direction of the first optical axis O1 (e.g., the lenses L11, L12, L13, L14 of FIG. 6, L15)) may be included. For example, the first optical axis O1 may be substantially parallel to the Z-axis direction of FIG. 3 or 4. In one embodiment, the first lens array LA1 may focus or align incident light along the direction of the first optical axis O1 and guide it to the first image sensor I1. For example, the first image sensor I1 is aligned with the first lens array LA1 (e.g., a plurality of lenses L11, L12, L13, L14, L15) on the first optical axis O1, thereby It may be arranged to receive light focused through the lens array LA1. The first lens array LA1 will be discussed again below with reference to FIGS. 6 to 9 .

According to one embodiment, the second lens array LA2 includes a plurality of (e.g., 5) different lenses aligned along a direction of the second optical axis (O2) different from the first optical axis (O1) (e.g., FIG. 10 It may include lenses (L21, L22, L23, L24, L25). For example, the second optical axis O2 may be substantially parallel to the Z-axis direction of FIG. 3 or FIG. 4 . For example, the second optical axis O2 may be disposed at a specified distance from the first optical axis O1 and may be substantially parallel to the first optical axis O1. In one embodiment, the second lens array LA2 may focus or align incident light along the direction of the second optical axis O2. As will be described later, light focused or aligned through the second lens array LA2 may be guided to the second image sensor I2 by the optical member OM. For example, the second image sensor I2 is focused through the second lens array LA2 (e.g., a plurality of different lenses L21, L22, L23, L24, L25) and then attached to the optical member OM. It can be arranged to receive light reflected or refracted by. The second lens array LA2 will be discussed again below with reference to FIGS. 10 to 13.

According to one embodiment, the optical member OM may be configured to refract or reflect light focused through the second lens array LA2 at least once and guide it in a direction different from the second optical axis O2. . For example, the second image sensor I2 may receive light incident on the second optical axis O2 or in a direction that is inclined with respect to the second optical axis O2. In the illustrated embodiment, the optical member OM may have a structure including two reflective surfaces RF1 and RF2, and the optical axis (e.g., third optical axis O3) of the second image sensor I2 may be substantially It can be arranged parallel to the second optical axis O2. For example, the optical member OM of FIG. 5 may receive light incident through the second lens array LA2, refract it twice or reflect it twice, and guide it to the second image sensor I2. In one embodiment, the second lens array LA2 includes a path provided by the optical member OM in implementing a focal distance (e.g., back focal length or effective focal length) to the second image sensor I2. By doing so, it can function as a telephoto lens.

According to one embodiment, the optical member OM refracts or reflects incident light at least once, thereby increasing the degree of freedom in designing the optical path or the shape of the lens assembly 400. For example, the lens assembly 400 may be designed to have a structure and shape that matches the internal structure of a miniaturized electronic device while securing telescopic performance by including an optical member (OM). In one embodiment, the optical member OM may be selectively designed according to the structure of the lens assembly 400. For example, in one embodiment, the optical member OM may have a triangular pillar shape. In one embodiment, the optical member OM may have a trapezoidal pillar shape. The shape of the optical member OM is not limited to the structure shown in this disclosure. For example, if the optical member OM reflects, refracts, or transmits light, the optical member OM may have a structure other than a triangular pillar or a trapezoidal pillar. In one embodiment, various types of optical members OM may be arranged. For example, the optical member OM may be arranged as a prism. For example, the optical member OM may be arranged as a mirror. For example, the optical member OM can include a substantially transparent material. For example, the optical member OM may be manufactured using glass.

According to one embodiment, in the illustrated embodiment, the optical member OM includes an entrance face IF (or an incident area), a first reflection surface RF1, a second reflection surface RF2 and/or an exit surface. (OF) (or emission area) may be included. The incident surface IF may be understood as, for example, an area facing the second lens array LA2 on the second optical axis O2 as one side of the optical member OM. For example, the emission surface OF may be understood as another side of the optical member OM and an area facing the second image sensor I2 on the third optical axis O3. The first reflective surface (RF1) and the second reflective surface (RF2) can implement an optical path from the incident surface (IF) to the output surface (OF). For example, the light incident through the second lens array (LA2) is refracted or reflected by the first reflecting surface (RF1) and then refracted or reflected by the second reflecting surface (RF2) to form an emission surface (OF). ) or may be guided to the second image sensor I2. In the detailed description below, the optical path from the first reflective surface RF1 to the second reflective surface RF2 will be referred to as the 'path of refracted light OP'. In one embodiment, the path OP of the refracted light is from the first reflective surface RF1 to the second image sensor I2 and/or from the first reflective surface RF1 via the second reflective surface RF2. Thus, it can be understood as an optical path leading to the second image sensor I2.

According to one embodiment, in a structure in which the optical member (OM) refracts or reflects the incident light twice and guides it to the second image sensor (I2), the first lens array (LA2) and the second lens array (LA2) may be arranged side by side with each other on one side of the optical member OM. In a structure in which the first lens array LA1 and the second lens array LA2 are arranged in parallel, the first optical axis O1 and the second optical axis O2 may be substantially parallel. In one embodiment, in a structure in which the optical member OM refracts or reflects the incident light twice and guides it to the second image sensor I2, the first image sensor I1 and the second image sensor I2 They may be arranged side by side with each other on one side of the optical member OM. In a structure in which the first image sensor I1 and the second image sensor I2 are arranged in parallel, the third optical axis O3 may be substantially parallel to the first optical axis O1 or the second optical axis O3. . However, the embodiment(s) of the present disclosure are not limited to this, and the shape of the optical member OM (e.g., the number and arrangement structure of the reflective surfaces RF1 and RF2(s)), and/or the lens assembly 400 Depending on the internal structure of the electronic device (e.g., the electronic device 101, 102, 104, 300 of FIGS. 1, 3, or 4) to be disposed, the lens arrays LA1, LA2 and the image sensors I1, I2 )'s arrangement can be changed in various ways. In one embodiment, in the arrangement of the lens arrays LA1 and LA2 and the image sensors I1 and I2 with respect to the optical member OM, the lens arrays LA1 and LA2 emit light from substantially the same direction. It can be arranged to receive.

According to one embodiment, a portion of the optical member OM may be disposed between the first lens array LA1 and the first image sensor I1. For example, light focused by the first lens array LA1 may pass through a portion of the optical member OM and be incident on the first image sensor I1. In one embodiment, the path OP of the refracted light may at least partially intersect the first optical axis O1. For example, light reflected or refracted by the first reflective surface RF1 may intersect the first optical axis O1 and proceed toward the second reflective surface RF2 or the second image sensor I2. In one embodiment, the area or space through which the refracted light passes, or the point where the refracted light intersects the first optical axis O1 may be substantially inside the optical member OM. For example, when the optical member OM has a transparent polygonal pillar shape, the path OP of the refracted light may substantially intersect the first optical axis O1 inside the optical member.

As described above, the lens assembly 400 can substantially implement two cameras by including a plurality of lens arrays (LA1, LF2) and a plurality of image sensors (I1, I2). According to one embodiment, the optical paths implemented by the different lens arrays LA1 and LA2 are arranged to at least partially overlap within the lens assembly 400 (e.g., the inside of the optical member OM), so that the lens The assembly 400 can substantially implement two cameras that can be placed in a smaller space than two independent cameras. For example, the lens assembly 400 according to the embodiment(s) of the present disclosure may contribute to miniaturization of electronic devices and improvement of optical performance of electronic devices.

According to one embodiment, in a structure in which a portion of the optical member OM is disposed between the first lens array LA1 and the first image sensor I1, the first lens array LA1 and the first image sensor I1 ) (eg, the rear focal length or effective focal length of the first lens array LA1) may be smaller than the rear focal length or effective focal length of the second lens array LA2. In one embodiment, the rear focal length or effective focal length of the first lens array LA1 may be greater than the focal length of a standard camera or a wide-angle camera. For example, the first lens array LA1 implements a lower magnification than the second lens array LA2, but may function as a telephoto lens with a higher magnification than a standard camera or a wide-angle camera. In one embodiment, when the second lens array LA2 implements telephoto performance of approximately 5 to approximately 10 times, the first lens array LA1 may implement telephoto performance of approximately 3 to approximately 4 times.

In the preceding detailed description or the following detailed description, reference numbers for the lenses of the first lens array LA1 may be written as 'L1n' with the natural number 'n'. The natural number 'n' may be assigned according to the order in which the lenses are arranged from the lens furthest from the first image sensor I1 toward the first image sensor I1. For example, 'L11' may be the first lens disposed furthest from the first image sensor I1 among the lenses L11, L12, L13, L14, and L15 of the first lens array LA1, and ' L15' may be the fifth lens disposed closest to the first image sensor I1 among the lenses L11, L12, L13, L14, and L15 of the first lens array LA1. In one embodiment, reference numbers for the lenses L21, L22, L23, L24, and L25 of the second lens array LA2 may be written as 'L2n' by writing the natural number 'n' together. The natural number 'n' may be assigned according to the order in which the lenses are arranged from the lens furthest from the second image sensor I2 toward the second image sensor I2. For example, 'L21' may be the first lens disposed furthest from the second image sensor I2 among the lenses L21, L22, L23, L24, and L25 of the second lens array LA2, and ' L25' may be the fifth lens disposed closest to the second image sensor I2 among the lenses L21, L22, L23, L24, and L25 of the second lens array LA2. In one embodiment, the lens surfaces of the first lens array LA1 or the second lens array LA2 may be described as 'S1n' or 'S2n'. When referring to [Table 1] or [Table 5] regarding the lens data described later, the surface on which the data regarding the refractive index is written is generally the surface of each lens (L11, L12, L13, L14, L15, L21, L22, L23, L24, It is the object-side surface of L25), and the surface on which data on the refractive index is omitted is generally the sensor-side surface of each lens (L11, L12, L13, L14, L15, L21, L22, L23, L24, L25). You will understand. In [Table 1] or [Table 5] described later, 'S112' and 'S212' are one side of the optical member OM, for example, a side facing one of the lens arrays LA1 and LA2, and ' S113' and 'S213' may be the other side of the optical member OM and may be, for example, a side facing one of the image sensors I1 and I2. In [Table 1] or [Table 5], 'S114', 'S214', 'S115', and 'S215' may be examples of the faces of the infrared cut filters F1 and F2.

FIG. 6 is a diagram illustrating the arrangement of the first lens array LA1 and the first image sensor I1 of FIG. 5 according to an embodiment of the present disclosure. FIG. 7 is a graph showing spherical aberration of the first lens array LA1 of FIG. 6 according to an embodiment of the present disclosure. FIG. 8 is a graph showing astigmatism of the first lens array LA1 of FIG. 6 according to an embodiment of the present disclosure. FIG. 9 is a graph showing the distortion rate of the first lens array LA1 of FIG. 6 according to an embodiment of the present disclosure.

Figure 7 is a graph showing the spherical aberration of the first lens array LA1 in the lens assembly 400 according to an embodiment of the present disclosure, where the horizontal axis represents the coefficient of longitudinal spherical aberration, and the vertical axis represents the optical axis (e.g., the first lens array LA1). 1 The distance from the optical axis (O1) is normalized, and the change in longitudinal spherical aberration according to the wavelength of light is shown. Longitudinal spherical aberration, for example, has wavelengths of 656.3000 (NM, nanometer) (e.g. red), 587.6000 (NM) (e.g. yellow), 546.1000 (NM), 486.1000 (NM) (e.g. blue). , respectively, for light of 435.8000 (NM). Figure 8 is a graph showing astigmatism of the first lens array LA1 in the lens assembly 400 according to an embodiment of the present disclosure, for light with a wavelength of 546.1000 (NM), and ' It illustrates a sagittal plane, and 'Y' illustrates a tangential plane. FIG. 9 is a graph showing the distortion rate of the first lens array LA1 in the lens assembly 400 according to an embodiment of the present disclosure, and is shown for light with a wavelength of 546.1000 (NM).

Referring to FIGS. 6 to 9 , in the lens assembly 400 according to an embodiment of the present disclosure, the first lens array LA1 includes a plurality of (e.g., at least 5) lenses L11, L12, L13, and L14. , L15), and may focus the incident light and guide it to the first image sensor I1 (e.g., the imaging plane (img) or the image sensor 230 of FIG. 2). In one embodiment, light focused by the first lens array LA1 may pass through a portion of the optical member OM and be incident on the first image sensor I1 along the first optical axis O1 direction. The first image sensor I1 receives light incident through a stop (e.g., a lens surface indicated as 'S16') and/or focused through the lenses L11, L12, L13, L14, and L15. It may include an imaging surface (img) that receives at least part of the image. In one embodiment, the aperture (Stop), the lenses (L11, L12, L13, L14, L15), and/or the first image sensor (I1) may be substantially aligned on the first optical axis (O1). “Aligned on the first optical axis (O1)” means that light incident on the imaging surface (img) of the first image sensor (I1) from the aperture or lens (L11, L12, L13, L14, L15) is transmitted. It may be understood that the area or the imaging surface (img) of the first image sensor I1 is aligned with the first optical axis O1.

According to one embodiment, the first lens array LA1 may further include a first infrared cut-off filter F1. The first infrared cut-off filter F1 is, for example, between the first lens array LA1 (e.g., the fifth lens L15) and the optical member OM, or between the optical member OM and the first image sensor ( It can be placed between I1). The first infrared blocking filter F1 may block light (eg, infrared rays) in a wavelength band that is not visible to the user's naked eye but is detected by the film or the first image sensor I1. In one embodiment, depending on the purpose of the first lens array (LA1) or the electronic device (e.g., the electronic device (101, 102, 104, 300) of FIGS. 1, 3, or 4), the first infrared cut-off filter (F1) ) can be replaced with a bandpass filter that transmits infrared rays and blocks visible light. For example, when the first lens array (LA1) or the first image sensor (I1) provides the function of detecting infrared rays, the first infrared cut filter (F1) can be replaced with a bandpass filter that transmits infrared rays. there is.

According to one embodiment, the first infrared cut-off filter F1 and/or the first image sensor I1 may be described as a separate configuration from the first lens array LA1 and/or the lens assembly 400. For example, the first infrared cut-off filter (F1) and/or the first image sensor (I1) may be an electronic device (e.g., the electronic devices 101, 102, 104, 300 of FIG. 1 or 4) or an optical device ( Example: It may be mounted on the camera module (180, 280) of FIG. 1 or FIG. 2, and the first lens array (LA1) may be connected to the first infrared cut-off filter (F1) and/or the first infrared cut-off filter (F1) at the first optical axis (O1). It may be mounted on an electronic or optical device in alignment with the image sensor I1. In one embodiment, at least one of the lenses L11, L12, L13, L14, and L15 may reciprocate along the direction of the first optical axis O1, and may be used in an electronic device (e.g., the electronic device of FIG. 1 or FIG. 4). (101, 102, 104, 300)) or the processor 120 of FIG. 1 controls focus by reciprocating at least one of the lenses (L11, L12, L13, L14, L15) in the direction of the first optical axis (O1). Focal distance adjustment can be performed. In one embodiment, the lens assembly 400 may be disposed as one of the camera modules 305, 312, and 313 of FIG. 3 or 4.

According to one embodiment, the lenses (L11, L12, L13, L14, and L15) include a first lens (L1) sequentially arranged toward the first image sensor (I1) along the first optical axis (O1) direction, It may include a second lens (L2), a third lens (L3), a fourth lens (L4), and/or a fifth lens (L5). For example, the lenses L11, L12, L13, L14, and L15 may include an object side and an image sensor side, respectively. In the following detailed description, for brevity of the drawings, reference numbers in the drawings may be omitted for some of the object side surface(s) and image sensor side surface(s) of the lenses L11, L12, L13, L14, and L15. . As mentioned earlier, reference numbers for lens surfaces omitted from the drawings can be easily understood through the [tables] described below regarding lens data.

According to one embodiment, the first lens array LA1 may have an effective focal length of approximately 9.059 mm, an F-number of approximately 2.964, an angle of view of approximately 48.2 degrees, and/or an overall lens length of approximately 12.00 mm. In the first lens array LA1, the 'lens total length' refers to, for example, from the object-side surface S12 of the object-side first lens L11 to the imaging surface img of the first image sensor I1. The reaching distance may be a distance measured from the first optical axis O1. In one embodiment, the first lens array LA1 may be manufactured with the specifications illustrated in Table 1 below.

lens surface
(Surf) radius of curvature
(radius) thickness
(Thick) Effective focal length
(EFL) refractive index
(nd) Abesu
(vd) obj infinity infinity S11 infinity 0.00000 S12* 3.01078 1.06584 4.287 1.55763 44.96 S13* -10.39191 0.10297 S14* -3.90826 0.23000 -2.684 1.55690 40.48 S15* 2.49489 0.30253 S16(sto)* 1.75955 1.17809 2.646 1.54410 56.09 S17* -6.18822 0.18818 S18* -3.65781 0.19000 -3.128 1.57247 34.31 S19* 3.62421 0.08081 S110* 2.46737 0.44797 10.288 1.59999 28.76 S111* 3.80840 1.10000 S112 infinity 6.00000 infinity 1.67528 51.61 S113 infinity 0.50000 S114 infinity 0.31000 infinity 1.51680 64.17 S115 infinity img infinity

In [Table 1], as mentioned above, in the reference numbers indicating the lens surface, 'S1' exemplifies the lens surface in the first lens array LA1, and the natural number 'n' written in conjunction with 'S1' ' may exemplify the lens surfaces of the lenses L11, L12, L13, L14, and L15. For example, 'S12' may illustrate the object-side surface of the first lens L11, and 'S110' may illustrate the object-side surface of the fifth lens L15. In one embodiment, the first lens array (LA1) may include an aperture disposed on the object-side surface (S16) of the third lens (L13), and is shown in [Table 1] listing lens data and/or described below. In [Table 5], 'sto' may be written on the surface where the aperture is placed (e.g., the object-side surface (S16) of the third lens (L13)). In one embodiment, when '*' is added to the reference number for a lens surface, the corresponding lens surface may be aspherical. In [Table 1], 'S112' may be a part of the surface of the optical member (OM) facing the first lens array (LA2), and 'S113' may be a part of the surface of the optical member (OM) facing the first image sensor (I1). ) may be another part of the surface, and 'S114' may be the object-side surface of the first infrared cut-off filter (F1).

[Table 2], [Table 3], and [Table 4] below describe the aspherical coefficients of the lenses (L11, L12, L13, L14, and L15), and the definition of aspheric surface is the following [Equation 1] It can be calculated through

In [Equation 1], 'z' is the distance from the vertex of the lens in the direction of the optical axis (e.g., the first optical axis (O1)), and 'y' is the distance in the direction perpendicular to the first optical axis (O1). , 'c'' is the reciprocal of the radius of curvature at the vertex of the lens, 'k' is the Conic constant, 'A', 'B', 'C', 'D', 'E', 'F' , 'G', 'H', 'J', 'K', 'L', 'M', 'N', and 'O' may each mean an aspheric coefficient.

lens surface
(Surf) S12 S13 S14 S15 radius of curvature
(radius) 3.01078E+00 -1.03919E+01 -3.90826E+00 2.49489E+00 k(Conic) -8.65178E-01 -1.00000E+00 -1.08240E+01 -1.15644E+00 A(4th) 8.63603E-04 2.42047E-03 -5.68789E-03 -5.69325E-02 B(6th) 2.39519E-03 -8.40749E-03 3.74022E-02 8.94207E-02 C(8th) -4.72289E-03 2.62802E-02 -3.38041E-02 -8.77435E-02 D(10th) 5.09513E-03 -3.10290E-02 1.71851E-02 8.51895E-02 E(12th) -3.83794E-03 2.37734E-02 -5.69567E-03 -1.66873E-01 F(14th) 2.03108E-03 -1.36554E-02 1.27536E-03 3.26971E-01 G(16th) -7.57286E-04 6.03035E-03 -1.94912E-04 -4.35628E-01 H(18th) 1.97352E-04 -1.99867E-03 2.02841E-05 3.87812E-01 J(20th) -3.56081E-05 4.81815E-04 -1.41168E-06 -2.34476E-01 K(22nd) 4.39332E-06 -8.21299E-05 6.28165E-08 9.64668E-02 L(24th) -3.61910E-07 9.57885E-06 -1.61542E-09 -2.65272E-02 M(26th) 1.89527E-08 -7.24728E-07 1.82666E-11 4.65597E-03 N(28th) -5.68071E-10 3.19933E-08 0.00000E+00 -4.70871E-04 O(30th) 7.37825E-12 -6.24961E-10 0.00000E+00 2.08547E-05

lens surface
(Surf) S16 S17 S18 radius of curvature
(radius) 1.75955E+00 -6.18822E+00 -3.65781E+00 k(Conic) -8.29533E-01 -1.00000E+00 -1.03565E+00 A(4th) -4.99312E-02 2.41701E-02 -4.15441E-02 B(6th) 8.54733E-02 -2.20571E-01 3.96578E-01 C(8th) -2.52896E-01 1.41594E+00 -3.55391E+00 D(10th) 6.39225E-01 -6.38009E+00 2.19197E+01 E(12th) -1.08998E+00 1.98530E+01 -9.00103E+01 F(14th) 1.26742E+00 -4.34819E+01 2.55119E+02 G(16th) -1.03086E+00 6.83266E+01 -5.13676E+02 H(18th) 5.95701E-01 -7.77685E+01 7.46294E+02 J(20th) -2.45417E-01 6.40556E+01 -7.84831E+02 K(22nd) 7.14113E-02 -3.76939E+01 5.91680E+02 L(24th) -1.43070E-02 1.53905E+01 -3.11567E+02 M(26th) 1.87439E-03 -4.12103E+00 1.08754E+02 N(28th) -1.44351E-04 6.46099E-01 -2.25985E+01 O(30th) 4.94962E-06 -4.44657E-02 2.11512E+00

lens surface
(Surf) S19 S110 S111 radius of curvature
(radius) 3.62421E+00 2.46737E+00 3.80840E+00 k(Conic) 6.60176E-01 -1.00000E+00 -9.33191E-01 A(4th) -1.69155E-01 -1.38569E-01 -1.02443E-03 B(6th) 4.09046E-01 2.07270E-01 -1.13422E-02 C(8th) -6.31551E-01 -1.96519E-01 5.51620E-03 D(10th) 6.81815E-01 -6.03154E-02 1.73793E-04 E(12th) -4.35359E-01 5.15700E-01 0.00000E+00 F(14th) 1.11341E-01 -7.98167E-01 0.00000E+00 G(16th) 4.87419E-02 7.02290E-01 0.00000E+00 H(18th) -5.68974E-02 -4.04074E-01 0.00000E+00 J(20th) 2.53549E-02 1.58454E-01 0.00000E+00 K(22nd) -6.73111E-03 -4.26894E-02 0.00000E+00 L(24th) 1.14072E-03 7.78398E-03 0.00000E+00 M(26th) -1.21522E-04 -9.19020E-04 0.00000E+00 N(28th) 7.44469E-06 6.34953E-05 0.00000E+00 O(30th) -2.00597E-07 -1.95220E-06 0.00000E+00

FIG. 10 is a diagram illustrating the arrangement of the second lens array LA2 and the second image sensor I2 of FIG. 5 according to an embodiment of the present disclosure. FIG. 11 is a graph showing spherical aberration of the second lens array LA2 of FIG. 10 according to an embodiment of the present disclosure. FIG. 12 is a graph showing astigmatism of the second lens array LA2 of FIG. 10 according to an embodiment of the present disclosure. FIG. 13 is a graph showing the distortion rate of the second lens array LA2 of FIG. 10 according to an embodiment of the present disclosure.

In the configuration of the second lens array LA2 illustrated in FIGS. 10 to 13, the arrangement of the lenses L21, L22, L23, L24, L25 and the second infrared cut-off filter F2 is the first lens array ( Since it may be similar to the configuration of LA1), some of its detailed description may be omitted. Configurations omitted in the description of the second lens array LA2 in FIGS. 10 to 13 can be understood with reference to the configuration of the first lens array LA1. According to one embodiment, the lens assembly 400 includes an optical member (OM) disposed between the second lens array (LA2) and the second image sensor (I2), thereby focusing the lens through the second lens array (LA2). We have previously seen that the light can be reflected or refracted at least once. Note that FIG. 10 illustrates the path along which light travels inside the optical member OM in a straight line and schematically illustrates the positions of the reflecting surfaces RF1 and RF2(s).

According to one embodiment, the second lens array LA2 may have an effective focal length of approximately 22.601 mm, an F-number of approximately 2.898, an angle of view of approximately 20.9 degrees, and/or an overall lens length of approximately 29.537 mm. In the second lens array LA2, the 'lens total length' means, for example, from the object side surface S22 of the first lens L21 on the object side to the imaging surface img of the second image sensor I2. The distance may be a distance measured along the second optical axis (O2) - the refracted light traveling path (OP) - the third optical axis (O3). In one embodiment, the second lens array LA2 may be manufactured with the specifications shown in Table 5 below, and may have aspheric coefficients shown in Table 6 and Table 7.

lens surface
(Surf) radius of curvature
(radius) thickness
(Thick) Effective focal length
(EFL) refractive index
(nd) Abesu
(vd) obj infinity infinity S21 infinity 0.00000 S22* 5.64319 2.59360 7.548 1.55002 50.54 S23* -13.37092 0.55197 S24* -37.28117 0.42175 -5.979 1.59602 28.23 S25* 3.99364 0.44505 S26(sto) 5.04217 1.08873 10.753 1.66900 19.28 S27* 14.96769 0.26616 S28 26.65017 0.32003 -7.478 1.61313 25.2 S29* 3.92526 0.49625 S210* 7.67027 0.82365 12.689 1.54410 56.09 S211* -69.44964 0.11000 S212 infinity 22.0000 infinity 1.67528 51.61 S213 infinity 0.11000 S214 infinity 0.21000 infinity 1.51680 64.17 S215 infinity 0.08001 img infinity 0.02

lens surface
(Surf) S22 S23 S24 S25 radius of curvature
(radius) 5.64319E+00 -1.33709E+01 -3.72812E+01 3.99364E+00 k(Conic) -4.85877E-01 -1.00000E+00 -1.00000E+00 3.28631E-01 A(4th) 1.44187E-04 1.07980E-03 1.55947E-04 1.01598E-03 B(6th) 4.37342E-04 -6.64366E-07 -2.06673E-05 2.86957E-03 C(8th) -4.00334E-04 1.08558E-04 -8.24869E-06 -5.33918E-03 D(10th) 2.23131E-04 -9.08646E-05 -1.10580E-06 4.73781E-03 E(12th) -8.25253E-05 3.27484E-05 7.09138E-07 -2.64501E-03 F(14th) 2.11540E-05 -6.43622E-06 -8.87671E-08 1.00444E-03 G(16th) -3.85539E-06 6.47784E-07 4.65572E-09 -2.69736E-04 H(18th) 5.06408E-07 -2.96997E-09 -9.06529E-11 5.19685E-05 J(20th) -4.80592E-08 -8.43633E-09 0.00000E+00 -7.15847E-06 K(22nd) 3.26404E-09 1.22413E-09 0.00000E+00 6.90728E-07 L(24th) -1.54656E-10 -9.18990E-11 0.00000E+00 -4.47165E-08 M(26th) 4.85476E-12 4.05904E-12 0.00000E+00 1.78568E-09 N(28th) -9.07299E-14 -1.00212E-13 0.00000E+00 -3.66386E-11 O(30th) 7.64321E-16 1.07298E-15 0.00000E+00 2.17927E-13

lens surface
(Surf) S27 S29 S210 S211 radius of curvature
(radius) 1.49677E+01 3.92526E+00 7.67027E+00 -6.94496E+01 k(Conic) 1.92461E+01 -3.52203E-01 4.78110E+00 -1.00000E+00 A(4th) 1.26912E-03 -1.11782E-02 -9.18586E-03 -2.61497E-03 B(6th) -1.09439E-02 2.29504E-02 1.74755E-02 6.57392E-03 C(8th) 1.93704E-02 -3.77103E-02 -2.36470E-02 -7.91908E-03 D(10th) -1.88211E-02 3.66576E-02 2.05740E-02 6.07384E-03 E(12th) 1.19441E-02 -2.37944E-02 -1.25339E-02 -3.10869E-03 F(14th) -5.30451E-03 1.09109E-02 5.56704E-03 1.08579E-03 G(16th) 1.70457E-03 -3.63913E-03 -1.84400E-03 -2.61885E-04 H(18th) -4.01995E-04 8.94577E-04 4.59277E-04 4.35468E-05 J(20th) 6.96147E-05 -1.62142E-04 -8.55968E-05 -4.89625E-06 K(22nd) -8.74529E-06 2.14027E-05 1.17281E-05 3.55130E-07 L(24th) 7.74913E-07 -1.99977E-06 -1.14284E-06 -1.49829E-08 M(26th) -4.58872E-08 1.25243E-07 7.47254E-08 2.79071E-10 N(28th) 1.62866E-09 -4.71291E-09 -2.93141E-09 0.00000E+00 O(30th) -2.61885E-11 8.04980E-11 5.20383E-11 0.00000E+00

According to one embodiment, the above-described electronic device (e.g., the electronic device 101, 102, 104, 300 of FIGS. 1, 3, or 4), a camera module (e.g., the camera module of FIGS. 1 to 4) 180, 280, 305, 312, 313), a processor (e.g., processor 120 of FIG. 1), and/or a lens assembly (e.g., lens assembly 210, 400 of FIGS. 2, 5, 10, 14) , 500)) is at least one of the lenses (L11, L12, L13, L14, L15) of the first lens array (LA1) and/or the lenses (L21, L22, L23, L24, At least one of the optical axis (L25) may be reciprocated along the optical axis (e.g., the first optical axis O1 or the second optical axis O2 in FIG. 5). For example, at least one of the lenses (L11, L12, L13, L14, L15) of the first lens array (LA1) and/or the lenses (L21, L22, L23, L24, L25) of the second lens array (LA2) ), at least one of which reciprocates along the direction of the optical axis (e.g., the first optical axis O1 or the second optical axis O2 in FIG. 5), thereby performing a focal distance adjustment or focus adjustment operation. According to one embodiment, the above-described electronic devices (101, 102, 104, 300), camera modules (180, 280, 305, 312, 313), processor 120, and/or lens assemblies (210, 400, 500) is at least one of the lenses (L11, L12, L13, L14, L15) of the first lens array (LA1) and/or of the lenses (L21, L22, L23, L24, L25) of the second lens array (LA2) At least one may be moved horizontally in a plane substantially perpendicular to the optical axis (eg, the first optical axis O1 or the second optical axis O2 in FIG. 5). For example, at least one of the lenses (L11, L12, L13, L14, L15) of the first lens array (LA1) and/or the lenses (L21, L22, L23, L24, L25) of the second lens array (LA2) ), at least one of which moves horizontally in a plane substantially perpendicular to the optical axis (e.g., the first optical axis O1 or the second optical axis O2 in FIG. 5), thereby performing a hand shake correction operation. In one embodiment, the hand shake correction operation may be implemented, for example, by horizontal movement of the image sensors or rotation (or tilt) operation of the optical member.

Figure 14 is a diagram showing a lens assembly according to an embodiment of the present disclosure.

The lens assembly 500 of FIG. 14 may be generally similar to the preceding embodiment, and may be slightly different in the configuration of the optical member OM. In describing the lens assembly 500 of the present embodiment, reference numbers in the drawings for components that can be easily understood through the lens assembly 400 of the preceding embodiment are assigned the same as or omitted as those of the preceding embodiment, and detailed descriptions thereof are provided. It may also be omitted.

Referring to FIG. 14, the lens assembly 500 and/or the optical member OM differs from the preceding embodiment in that one reflective surface RF1 is disposed between the incident surface IF and the output surface OF. You can. For example, the optical member OM may reflect or refract the light focused by the second lens array LA2 once and guide it to the emission surface OF or the second image sensor I2. Inside the optical member OM, the path OP of the refracted light may at least partially overlap or intersect the first optical axis O1. For example, by including a plurality of lens arrays LA1 and LA2 implementing different optical paths, the lens assembly 500 can substantially implement two cameras. In one embodiment, the optical paths implemented by the plurality of lens arrays LA1 and LA2 overlap at least partially, so that the lens assembly 500 can be easily miniaturized while substantially implementing two cameras.

According to one embodiment, the optical axis of the second image sensor I2 (eg, the third optical axis O3 in FIG. 5) may be aligned in a direction that substantially coincides with the path OP of the refracted light. In a structure where the optical member (OM) provides a one-time reflection or refraction structure and the first lens array (LA1) and the second lens array (LA2) are arranged to receive light from substantially the same direction, the second image sensor (I2) may be disposed to face the optical member (OM) (eg, output surface (OF)) on a side different from the first image sensor (I1).

According to one embodiment(s) of the present disclosure, a lens assembly (e.g., the lens assemblies 400 and 500 of FIG. 5 or FIG. 14) includes a plurality of lens arrays (e.g., FIG. 5 or by including the first lens array (LA1) and the second lens array (LA2) of Figure 14, more information related to the subject image can be obtained while miniaturizing. In one embodiment, a plurality of lens arrays The paths of light incident through (LA1, LA2) are arranged to at least partially overlap, thereby making it easier to miniaturize the lens assemblies 400 and 500. For example, a lens according to an embodiment of the present disclosure. The assemblies 400 and 500 and/or electronic devices including them (e.g., the electronic devices 101, 102, 104, and 300 of FIGS. 1, 3, or 4) can obtain high-quality subject images while being miniaturized. there is.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

As described above, according to an embodiment of the present disclosure, a lens assembly (e.g., the lens assemblies 400 and 500 of FIG. 5 or 14) has a first optical axis (e.g., the first optical axis of FIG. 5 or 14). (O1)) A first lens array (e.g., FIG. 5, 6, or 14) including a plurality of lenses (e.g., the lenses (L11, L12, L13, L14, L15) of FIG. 6) aligned along the direction. a first lens array (LA1)), a first image sensor aligned with the plurality of lenses on the first optical axis and arranged to receive light focused through the first lens array (e.g., FIG. 5, FIG. 6, or a first image sensor (I1) in FIG. 14), and a plurality of other lenses (e.g., aligned along a direction of a second optical axis different from the first optical axis (e.g., the second optical axis (O2) in FIG. 5 or FIG. 14)). A second lens array (e.g., the second lens array LA2 of FIG. 5, FIG. 10 or FIG. 14) including the lenses (L21, L22, L23, L24, L25) of FIG. 10, the second lens array An optical member (e.g., the optical member (OM) of FIGS. 5, 6, 10, or 14) configured to refract or reflect the light focused at least once and guide it in a direction different from the second optical axis, and Includes a second image sensor (e.g., the second image sensor I2 in FIGS. 5, 10, or 14) arranged to receive light focused by the second lens array and refracted or reflected by the optical member. can do. In one embodiment, the optical member refracts or reflects light focused through the second lens array to pass through a path that intersects the first optical axis (e.g., the path (OP) of the refracted light in FIG. 5 or FIG. 14). It may be configured to make incident light to the second image sensor.

According to one embodiment, the first lens array and the second lens array may be arranged parallel to each other on one side of the optical member.

According to one embodiment, the first lens array and the second lens array may be arranged so that the first optical axis and the second optical axis are parallel to each other.

According to one embodiment, the optical member includes an incident surface disposed to face the second lens array on the second optical axis (e.g., the incident surface (IF) of Figure 5 or Figure 14), the second image sensor, and An emitting surface arranged to face each other (e.g., the output surface (OF) in Figure 5 or Figure 14), and a first reflecting surface that reflects or refracts light incident on the incident surface and guides it to the emitting surface (e.g., Figure 5). Alternatively, it may include a reflective surface (RF1) in FIG. 14). In one embodiment, the first reflective surface may be configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.

According to one embodiment, the second image sensor may be disposed to face the emission surface on a third optical axis that intersects the second optical axis (eg, the path of refracted light (OP) in FIG. 14).

According to one embodiment, the optical member has an incident surface disposed to face the second lens array on the second optical axis (e.g., the incident surface (IF) in FIG. 5) and is disposed to face the second image sensor. an emission surface (e.g., the emission surface (OF) in FIG. 5), a first reflection surface that reflects or refracts light incident on the incident surface (e.g., the first reflection surface (RF1) in FIG. 5), and the first reflection surface (RF1) in FIG. 5. 1. It may include a second reflective surface (eg, the second reflective surface RF2 in FIG. 5) that reflects or refracts the light reflected or refracted by the reflective surface and guides it to the emission surface. In one embodiment, the first reflective surface may be configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.

According to one embodiment, the second image sensor may be disposed to face the emission surface on a third optical axis (eg, third optical axis O3 in FIG. 5) parallel to the second optical axis.

According to one embodiment, the second image sensor may be arranged side by side with the first image sensor on the other side of the optical member.

According to one embodiment, at least one of the lenses of the first lens array may be configured to reciprocate along the first optical axis direction.

According to one embodiment, at least one of the lenses of the second lens array may be configured to reciprocate along the second optical axis direction.

According to an embodiment of the present disclosure, an electronic device (e.g., the electronic device 101, 102, 104, 300 of FIGS. 1, 3, or 4) includes a lens assembly (e.g., the lens assembly of FIG. 5 or 14). (400, 500)), and a processor (eg, processor 120 of FIG. 1 or image signal processor 260 of FIG. 2) configured to acquire an image of a subject using the lens assembly. In one embodiment, the lens assembly includes a plurality of lenses (e.g., lenses L11, L12, L13 in FIG. 6) aligned along a first optical axis (e.g., the first optical axis O1 in FIG. 5 or FIG. 14). , L14, L15) (e.g., the first lens array LA1 of FIG. 5, FIG. 6, or FIG. 14), aligned with the plurality of lenses on the first optical axis and the first lens array (LA1) of FIG. A first image sensor disposed to receive light focused through a lens array (e.g., the first image sensor I1 in Figures 5, 6, or 14), and a second optical axis different from the first optical axis (e.g., A second lens array (e.g., the lenses (L21, L22, L23, L24, L25) of FIG. 10) aligned along the direction of the second optical axis (O2) of FIG. 5 or FIG. 14. Example: the second lens array (LA2) of Figure 5, Figure 10 or Figure 14), configured to refract or reflect light focused through the second lens array at least once and guide it in a direction different from the second optical axis An optical member (e.g., the optical member (OM) of FIGS. 5, 6, 10, or 14), and a second lens array arranged to receive light focused by the second lens array and refracted or reflected by the optical member. It may include two image sensors (e.g., the second image sensor I2 in FIG. 5, FIG. 10, or FIG. 14). In one embodiment, the optical member refracts or reflects light focused through the second lens array to pass through a path that intersects the first optical axis (e.g., the path (OP) of the refracted light in FIG. 5 or FIG. 14). Thus, it may be configured to cause incident light to the second image sensor.

According to one embodiment, the first lens array and the second lens array may be arranged parallel to each other on one side of the optical member.

According to one embodiment, the first lens array and the second lens array may be arranged so that the first optical axis and the second optical axis are parallel to each other.

According to one embodiment, the optical member includes an incident surface disposed to face the second lens array on the second optical axis (e.g., the incident surface (IF) of Figure 5 or Figure 14), the second image sensor, and An emitting surface arranged to face each other (e.g., the output surface (OF) in Figure 5 or Figure 14), and a first reflecting surface that reflects or refracts light incident on the incident surface and guides it to the emitting surface (e.g., Figure 5). Alternatively, it may include a reflective surface (RF1) in FIG. 14). The first reflective surface may be configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.

According to one embodiment, the second image sensor may be disposed to face the emission surface on a third optical axis that intersects the second optical axis (eg, the path of refracted light (OP) in FIG. 14).

According to one embodiment, the optical member has an incident surface disposed to face the second lens array on the second optical axis (e.g., the incident surface (IF) in FIG. 5) and is disposed to face the second image sensor. an emission surface (e.g., the emission surface (OF) in FIG. 5), a first reflection surface that reflects or refracts light incident on the incident surface (e.g., the first reflection surface (RF1) in FIG. 5), and the first reflection surface (RF1) in FIG. 5. 1. It may include a second reflective surface (eg, the second reflective surface RF2 in FIG. 5) that reflects or refracts the light reflected or refracted by the reflective surface and guides it to the emission surface. In one embodiment, the first reflective surface may be configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.

According to one embodiment, the second image sensor may be disposed to face the emission surface on a third optical axis (eg, third optical axis O3 in FIG. 5) parallel to the second optical axis.

According to one embodiment, the second image sensor may be arranged side by side with the first image sensor on the other side of the optical member.

According to one embodiment, the processor may be set to perform focal length adjustment or focus adjustment by reciprocating at least one of the lenses of the first lens array along the first optical axis direction.

According to one embodiment, the processor may be set to perform focal length adjustment or focus adjustment by reciprocating at least one of the lenses of the second lens array along the second optical axis direction.

Although the present disclosure has been described by way of example with respect to one embodiment, it should be understood that the one embodiment is for illustrative purposes rather than limiting the present document. It will be apparent to those skilled in the art that various changes may be made in the format and detailed structure of the present disclosure, including the appended claims and their equivalents, without departing from the overall scope of the present disclosure. For example, in the embodiment(s) of the present disclosure, a configuration in which the lens assembly(s) includes one first lens array is illustrated, but a plurality of lens assembly(s) may be included in one lens assembly depending on the specifications of the electronic device or optical member. A first lens array and/or a plurality of first image sensors may be disposed.

101, 102, 104, 300: Electronic device 120: Processor
180, 280, 305, 312, 313: Camera module
210, 400, 500: Lens assembly 230: Image sensor
260: Image signal processor I1: First image sensor
I2: Second image sensor LA1: First lens array
LA2: Second lens array F1: First infrared cut filter
F2: Second infrared cut filter OM: Optical member
L11, L12, L13, L14, L15, L21, L22, L23, L24, L25: Lens(s)

Claims (20)

In the lens assembly (400; 500),
A first lens array (LA1) including a plurality of lenses (L11, L12, L13, L14, L15) aligned along the first optical axis (O1) direction;
a first image sensor (I1) aligned with the plurality of lenses on the first optical axis and arranged to receive light focused through the first lens array;
a second lens array (LA2) including a plurality of different lenses (L21, L22, L23, L24, L25) aligned along a second optical axis (O2) direction different from the first optical axis;
an optical member (OM) configured to refract or reflect light focused through the second lens array at least once and guide it in a direction different from the second optical axis; and
A second image sensor (I2) arranged to receive light focused by the second lens array and refracted or reflected by the optical member,
The optical member is configured to refract or reflect light focused through the second lens array, thereby making the light incident on the second image sensor via a path intersecting the first optical axis.
The lens assembly of claim 1, wherein the first lens array and the second lens array are arranged parallel to each other on one side of the optical member.
The lens assembly according to any one of claims 1 to 2, wherein the first lens array and the second lens array are arranged such that the first optical axis and the second optical axis are parallel to each other.
The method according to any one of claims 1 to 3, wherein the optical member,
an incident surface (IF) disposed to face the second lens array on the second optical axis;
an emission surface (OF) disposed to face the second image sensor; and
It includes a first reflecting surface (RF1) that reflects or refracts light incident on the incident surface and guides it to the emission surface,
The first reflective surface reflects or refracts light incident on the incident surface and guides it to a path that intersects the first optical axis.
The lens assembly of claim 4, wherein the second image sensor is disposed to face the emission surface on a third optical axis (O3) that intersects the second optical axis.
The method according to any one of claims 1 to 3, wherein the optical member,
an incident surface (IF) disposed to face the second lens array on the second optical axis;
an emission surface (OF) disposed to face the second image sensor;
a first reflective surface (RF1) that reflects or refracts light incident on the incident surface; and
It includes a second reflection surface (RF2) that reflects or refracts the light reflected or refracted by the first reflection surface and guides it to the emission surface,
The first reflective surface reflects or refracts light incident on the incident surface and guides it to a path that intersects the first optical axis.
The lens assembly of claim 6, wherein the second image sensor is disposed to face the emission surface on a third optical axis parallel to the second optical axis.
The lens assembly of any one of claims 6 to 7, wherein the second image sensor is arranged in parallel with the first image sensor on the other side of the optical member.
The lens assembly of any one of claims 1 to 8, wherein at least one of the lenses of the first lens array is configured to reciprocate along the first optical axis direction.
The lens assembly of any one of claims 1 to 9, wherein at least one of the lenses of the second lens array is configured to reciprocate along the second optical axis direction.
In the electronic device (101, 102, 104; 300),
lens assembly (400, 500); and
It includes a processor (120; 260) configured to acquire an image of a subject using the lens assembly,
The lens assembly is,
A first lens array (LA1) including a plurality of lenses (L11, L12, L13, L14, L15) aligned along the first optical axis (O1) direction;
a first image sensor (I1) aligned with the plurality of lenses on the first optical axis and arranged to receive light focused through the first lens array;
a second lens array (LA2) including a plurality of different lenses (L21, L22, L23, L24, L25) aligned along a second optical axis direction different from the first optical axis;
an optical member (OM) configured to refract or reflect light focused through the second lens array at least once and guide it in a direction different from the second optical axis; and
A second image sensor (I2) arranged to receive light focused by the second lens array and refracted or reflected by the optical member,
The optical member is configured to refract or reflect light focused through the second lens array, thereby making the light incident on the second image sensor via a path intersecting the first optical axis.
The electronic device of claim 11, wherein the first lens array and the second lens array are arranged parallel to each other on one side of the optical member.
The electronic device according to any one of claims 11 to 12, wherein the first lens array and the second lens array are arranged so that the first optical axis and the second optical axis are parallel to each other.
The method according to any one of claims 11 to 13, wherein the optical member,
an incident surface (IF) disposed to face the second lens array on the second optical axis;
an emission surface (OF) disposed to face the second image sensor; and
It includes a first reflecting surface (RF1) that reflects or refracts light incident on the incident surface and guides it to the emission surface,
The first reflective surface is configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.
The electronic device of claim 14, wherein the second image sensor is disposed to face the emission surface on a third optical axis (O3) that intersects the second optical axis.
The method according to any one of claims 11 to 13, wherein the optical member,
an incident surface (IF) disposed to face the second lens array on the second optical axis;
an emission surface (OF) disposed to face the second image sensor;
a first reflective surface (RF1) that reflects or refracts light incident on the incident surface; and
It includes a second reflection surface (RF2) that reflects or refracts the light reflected or refracted by the first reflection surface and guides it to the emission surface,
The first reflective surface is configured to reflect or refract light incident on the incident surface and guide it to a path that intersects the first optical axis.
The electronic device of claim 16, wherein the second image sensor is disposed to face the emission surface on a third optical axis parallel to the second optical axis.
The electronic device of any one of claims 16 to 17, wherein the second image sensor is arranged in parallel with the first image sensor on the other side of the optical member.
The electronic device of any one of claims 11 to 18, wherein the processor is set to perform focal length adjustment or focus adjustment by reciprocating at least one of the lenses of the first lens array along the first optical axis direction. Device.
The electronic device of any one of claims 11 to 19, wherein the processor is set to perform focal length adjustment or focus adjustment by reciprocating at least one of the lenses of the second lens array along the second optical axis direction. Device.

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