KR20240039568A - Electronic device including speaker module - Google Patents

Abstract

An electronic device according to an embodiment of the present disclosure includes a housing, a camera module disposed in the housing, a sound output module disposed in the housing and spaced apart from the camera module, a first sound hole located in the front of the electronic device, A second sound hole including a dummy hole disposed adjacent to the sound output module and at least partially closed, a connection hole spaced further apart from the sound output module than the dummy hole, and located on a side of the electronic device. , a sound outlet formed in the housing, through which the sound generated by the sound output module is output and connected to the first sound hole and the second sound hole, and the sound outlet along the extension direction of the first sound hole and the second sound hole. It is formed in the housing and may include a sound guide unit connecting the sound outlet, the first sound hole, and the second sound hole.

Description

Electronic device including a sound output module {ELECTRONIC DEVICE INCLUDING SPEAKER MODULE}

Various embodiments disclosed in this document relate to an electronic device including an audio output module. For example, it could be about an audio output module that functions as a speaker and receiver.

An audio output module for reproducing sound may be included in the electronic device. As more and more content is played through electronic devices, users' interest in sound performance is also increasing.

Meanwhile, an acoustic hole for radiating sound output from the speaker module to the outside of the electronic device can be designed at a location aligned with the center of the electronic device, taking design factors into consideration.

The electronic device may include an audio output module that outputs sound. Considering the electronic component mounting structure inside the electronic device, one sound output module can output the receiver sound and the speaker sound. The receiver sound is the sound received when a user makes a call, and the speaker sound may be a sound generated according to the operation of an application such as a video or game. In this structure, the receiver hole through which the receiver sound is emitted and the speaker hole through which the speaker sound is emitted may be formed separately. The receiver hole may be located on the front of the electronic device to facilitate the user's conversation when making a call. The speaker hole may be located on the top side and/or bottom side of the electronic device in consideration of aesthetics and stereo performance.

Meanwhile, the receiver hall and speaker hall can be connected to the sound output module through one passage. In this case, the call sound generated from the audio output module is emitted not only through the receiver hole but also through the speaker hole, which may cause a problem with the user's privacy.

According to an embodiment of the present disclosure, the phenomenon in which call sounds generated from an audio output module are emitted through a speaker hole can be improved.

An electronic device according to an embodiment of the present disclosure includes a housing, a camera module disposed in the housing, a sound output module disposed in the housing and spaced apart from the camera module, a first sound hole located in the front of the electronic device, A second sound hole including a dummy hole disposed adjacent to the sound output module and at least partially closed, a connection hole spaced further apart from the sound output module than the dummy hole, and located on a side of the electronic device. , a sound outlet formed in the housing, through which the sound generated by the sound output module is output and connected to the first sound hole and the second sound hole, and the sound outlet along the extension direction of the first sound hole and the second sound hole. It is formed in the housing and may include a sound guide unit connecting the sound outlet, the first sound hole, and the second sound hole.

The sound radiation structure of an electronic device according to an embodiment of the present disclosure includes a sound output module disposed in the housing while being spaced apart from a camera module disposed in the housing of the electronic device, and a first sound hole located in the front of the electronic device. , a dummy hole adjacent to the sound output module and at least partially closed, a connection hole spaced apart from the sound output module than the dummy hole, and a second sound hole located on a side of the electronic device. , a sound outlet formed in the housing, through which the sound generated by the sound output module is output and connected to the first sound hole and the second sound hole, and the sound outlet along the extension direction of the first sound hole and the second sound hole. It is formed in the housing and may include a sound guide portion connecting the sound outlet, the first sound hole, and the second sound hole.

According to various embodiments disclosed in this document, when making a call, the sound generated by the sound output module can be reduced through a speaker hole other than the receiver hole.

Additionally, when the speaker function is used depending on the execution of the application, the sound generated from the sound output module may be radiated through the receiver hole and the speaker hole. Accordingly, speaker radiation performance can be improved.

In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components .
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components .
1 is a block diagram of an electronic device in a network environment, according to various embodiments.
FIG. 2A is a perspective view of the front of an electronic device according to embodiments disclosed in this document.
FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to embodiments disclosed in this document.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment disclosed in this document.
FIG. 4 is a diagram illustrating a portion of an electronic device according to an embodiment disclosed in this document.
FIG. 5A is a view of the housing of an electronic device according to an embodiment disclosed in this document as viewed from the front of the electronic device.
FIG. 5B is a view of the housing of an electronic device according to an embodiment disclosed in this document as viewed from the rear of the electronic device.
FIG. 6A is a plan view of the top of the housing according to an embodiment disclosed in this document as seen from the front of the electronic device.
FIG. 6B is an enlarged view of the first sound hole viewed from the front of the electronic device, according to an embodiment disclosed in this document.
FIG. 6C is a view of the second sound hole viewed from the top of the electronic device, according to an embodiment disclosed in this document.
Figure 7 is an enlarged view of the sound guide unit viewed from the front of the electronic device, according to an embodiment disclosed in this document.
Figure 8a is a perspective view of a shielding member that shields a portion of the second sound hole according to an embodiment disclosed in this document.
Figure 8b is a diagram of a state in which a shielding member is disposed on the sound guide portion, according to an embodiment disclosed in this document.
FIG. 9A is a cross-sectional view of the electronic device of FIG. 6A cut along line AA.
FIG. 9B is a cross-sectional view of the electronic device of FIG. 6A cut along line BB.
FIGS. 10A and 10B are front and rear views of an unfolded stage of an electronic device according to an embodiment of the present disclosure.
FIGS. 11A and 11B are front and rear views of the folded state of an electronic device according to an embodiment of the present disclosure.
Figure 12 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
FIG. 13 is a diagram for explaining speaker performance of an audio output module according to an embodiment disclosed in this document.

In the following description, various embodiments of the present document are described with reference to the accompanying drawings. The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments.

In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise.

As used herein, “A or B,” “at least one of A and B,” “or at least one of B,” “A, B, or C,” “at least one of A, B, and C,” and “B,” or at least one of C" may each include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or operations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a auxiliary processor 123, the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

Battery 189 may supply power to at least one component of electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data rate. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, connected to the plurality of antennas by the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2A is a front perspective view of the electronic device 200 according to various embodiments disclosed in this document. FIG. 2B is a rear perspective view of the electronic device 200 of FIG. 2A according to various embodiments disclosed in this document.

The electronic device 200 of FIGS. 2A and 2B may be at least partially similar to the electronic device 101 of FIG. 1 or may include other embodiments of the electronic device.

2A and 2B, the electronic device 200 according to one embodiment includes a first side (or front) 210A, a second side (or back) 210B, and a first side 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B. In another embodiment (not shown), housing 210 may refer to a structure that forms part of first side 210A, second side 210B, and side surface 210C. According to one embodiment, the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 210B may be formed by a substantially opaque back plate 211. The back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be. The side 210C combines with the front plate 202 and the back plate 211 and may be formed by a side bezel structure (or “side member”) 218 comprising metal and/or polymer. In some embodiments, the back plate 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, a metallic material such as aluminum).

In the illustrated embodiment, the front plate 202 has a first region 210D that extends seamlessly by bending from the first surface 210A toward the rear plate, along the long edge of the front plate. edge) can be included at both ends. In the illustrated embodiment (see FIG. 2B), the rear plate 211 may include second regions 210E at both ends of long edges that are curved and seamlessly extended from the second surface 210B toward the front plate. there is. In some embodiments, the front plate 202 or the rear plate 211 may include only one of the first area 210D or the second area 210E. In some embodiments, the front plate 202 may not include the first area and the second area, but may only include a flat plane disposed parallel to the second surface 210B. In the above embodiments, when viewed from the side of the electronic device, the side bezel structure 218 has a first thickness (on the side that does not include the first area 210D or the second area 210E) or width), and may have a second thickness thinner than the first thickness on the side including the first or second area.

According to one embodiment, the electronic device 200 includes a display 201, an input device 203, a sound hole 207, 214, a sensor module 204, 219, a camera module 212, 213, and a key input. It may include at least one of a device 217, an indicator (not shown), and a connector 208. In some embodiments, the electronic device 200 may omit at least one of the components (eg, the key input device 217 or an indicator) or may additionally include another component.

Display 201 may be exposed, for example, through a significant portion of front plate 202 . In some embodiments, at least a portion of the display 201 may be exposed through the front plate 202 that forms the first surface 210A and the first area 210D of the side surface 210C. The display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first area 210D and/or the second area 210E. can be placed.

The input device 203 may include a microphone. In some embodiments, the input device 203 may include a plurality of microphones arranged to detect the direction of sound. The sound holes 207 and 214 may be connected to speakers. In some embodiments, the microphone, speakers, and connector 208 are disposed in the space of the electronic device 200 and may be exposed to the external environment through at least one acoustic hole 207 and 214 formed in the housing 210. there is. In some embodiments, the acoustic holes 207 and 214 formed in the housing 210 may be commonly used for microphones and speakers. In some embodiments, the sound output device may include a speaker (eg, piezo speaker) that operates without the hole formed in the housing 210.

The sensor modules 204 and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state. The sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of the housing 210. ) (eg, fingerprint sensor), and/or a third sensor module 219 (eg, HRM sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on the first surface 210A of the housing 210. A fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed below the display 201 on the first side 210A. The electronic device 200 includes sensor modules not shown, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 204.

The camera modules 212 and 213 include a first camera device (not shown) disposed on the first side 210A of the electronic device 200, and a second camera device 212 disposed on the second side 210B. , and/or a flash 213. The camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device 200.

The key input device 217 may be disposed on the side 210C of the housing 210. In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the key input devices 217 not included may include soft keys, etc. on the display 201. It can be implemented in different forms. In another embodiment, the key input device 217 may be implemented using a pressure sensor included in the display 201.

The indicator may be placed, for example, on the first side 210A of the housing 210. For example, the indicator may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source linked to the operation of the camera module 212. Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.

The connector hole 208 is a first connector hole 208 that can accommodate a connector (for example, a USB connector or an interface connector port module (IF module)) for transmitting and receiving power and/or data with an external electronic device. And/or may include a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals to and from an external electronic device.

Some camera modules among the camera modules 212, some sensor modules 204 among the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201. For example, the camera module, sensor module 204 or indicator may come into contact with the external environment in the internal space of the electronic device 200 through an opening or transparent area 205 perforated up to the front plate 202 of the display 201. It can be arranged so that According to one embodiment, the camera hole 205 where the display 201 and the camera module face each other may be formed as a transparent area with a certain transmittance as part of the area displaying content. According to one embodiment, the transparent area may be formed to have a transmittance ranging from about 5% to about 20%. This transmission area may include an area overlapping with an effective area (eg, field of view area) of the camera module through which light for generating an image is formed by the image sensor. For example, the transparent area of the display 201 may include an area with a lower density of pixels than the surrounding area. For example, a transparent area can replace the opening. For example, the camera module may include an under display camera (UDC). In another embodiment, some sensor modules 204 may be arranged to perform their functions in the internal space of the electronic device without being visually exposed through the front plate 202. For example, in this case, the area of the display 201 facing the sensor module may not need a perforated opening.

3 is an exploded perspective view of an electronic device according to various embodiments disclosed in this document.

The electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 101 of FIG. 1 and/or the electronic device 200 of FIG. 2A or may include other embodiments of the electronic device.

Referring to FIG. 3, the electronic device 300 (e.g., the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2) has a side member 310 (e.g., the side bezel structure 218 of FIG. 2A). )), support member 311 (e.g., bracket or support structure), front cover 320 (e.g., front plate 202 in FIG. 2A), display 330 (e.g., display 201 in FIG. 2A) , at least one substrate 341, 342 (e.g., printed circuit board (PCB), flexible PCB (FPCB), or rigid-flexible PCB (R-FPCB)), a battery 350, and at least one additional support member ( 361, 362) (e.g., rear case), an antenna 370, and a rear cover 380 (e.g., rear plate 211 in FIG. 2). In some embodiments, the electronic device 300 may omit at least one of the components (e.g., the support member 311 or at least one additional support member 361 or 362) or additionally include another component. You can. At least one of the components of the electronic device 300 may be the same as, or similar to, or overlap with at least one of the components of the electronic device 101 of FIG. 1 or the electronic device 200 of FIG. 2A. Description may be omitted.

According to various embodiments, the side member 310 includes a first surface 3101 facing in a first direction (e.g., z-axis direction), a second surface 3102 facing in a direction opposite to the first surface 3101, and It may include a side surface 3103 surrounding the space between the first surface 3101 and the second surface 3102 (eg, the internal space 4001 in FIG. 4). According to one embodiment, at least a portion of the side surface 3103 may form the exterior of the electronic device. According to one embodiment, the support member 311 may be arranged to extend from the side member 310 toward the internal space of the electronic device 300 (eg, the internal space 4001 in FIG. 4 ). In some embodiments, support member 311 may be disposed separately from side member 310. According to one embodiment, the side member 310 and/or the support member 311 may be formed of, for example, a metallic material and/or a non-metallic material (e.g., polymer). According to one embodiment, the support member 311 may support at least a portion of the display 330 through the first surface 3101 and supports at least one substrate 341 and 342 through the second surface 3102. and/or may be arranged to support at least a portion of the battery 350. According to one embodiment, the at least one substrate 341 and 342 is a first substrate 341 (e.g., main substrate) disposed on one side of the battery 350 in the internal space of the electronic device 300. and a second substrate 342 (eg, sub-substrate) disposed on the other side. According to one embodiment, the first substrate 341 and/or the second substrate 342 may include a processor, memory, and/or an interface. According to one embodiment, the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory. According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. For example, the interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. According to one embodiment, the battery 350 is a device for supplying power to at least one component of the electronic device 300, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or fuel. It may include a battery. At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the at least one substrate 341 or 342. According to one embodiment, the battery 350 may be arranged to be embedded in the electronic device 300. In some embodiments, the battery 350 may be disposed to be detachable from the electronic device 300.

According to various embodiments, the antenna 370 may be disposed between the rear cover 380 and the battery 350. According to one embodiment, the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, an antenna may be formed by some or a combination of the side member 310 and/or the support member 311. In some embodiments, the electronic device 300 may further include a digitizer for detecting an external electronic pen.

FIG. 4 is a diagram illustrating a portion of an electronic device according to an embodiment disclosed in this document. FIG. 5A is a view of the housing of an electronic device according to an embodiment disclosed in this document as viewed from the front of the electronic device. FIG. 5B is a view of the housing of an electronic device according to an embodiment disclosed in this document as viewed from the rear of the electronic device. FIG. 6A is a plan view of the top of the housing according to an embodiment disclosed in this document as seen from the front of the electronic device. FIG. 6B is an enlarged view of the first sound hole viewed from the front of the electronic device, according to an embodiment disclosed in this document. FIG. 6C is a view of the second sound hole viewed from the top of the electronic device, according to an embodiment disclosed in this document.

In one embodiment disclosed in this document, the electronic device 400 shown in FIG. 4 is the electronic device 101 shown in FIG. 1, the electronic device 200 shown in FIGS. 2A and 2B, and/or the electronic device 200 shown in FIG. 3. This may be an example of the electronic device 300. The electronic device 400 described below is described based on the bar-shaped electronic device shown in FIGS. 2A, 2B, and 3, but in some embodiments, the electronic device 400 may be a foldable electronic device. It may be part of a device, a slideable electronic device, a stretchable electronic device, and/or a rollable electronic device. In addition, the same member numbers are used for all components that are the same or similar to those described in FIGS. 1, 2A, 2B, and 3, except when indicated separately.

In one embodiment, the electronic device 400 supports various appliances and electrical objects that make up the electronic device 400, and at least a portion of the electronic device 400 supports the exterior of the electronic device 400 (e.g., the side bezel structure 218 in FIG. 2A). It may include a housing assembly constituting a. Here, electrical objects can be understood as a general term for components that transmit or receive electrical signals. The housing assembly may be comprised of a single component, or may be constructed by combining multiple components. For example, the housing assembly may be a support structure 412 disposed within the housing 410.

In one embodiment, the housing assembly (e.g., support structure 412) may be formed from a variety of materials. When the housing 410 assembly is composed of a plurality of components, each component may be formed of different materials. The housing assembly may be made of various materials, such as synthetic resin materials, metal materials, and composite materials.

In one embodiment, a support structure 412 that supports various instruments and electronic components may be disposed in the housing 410. In one embodiment, the support structure 412 may support at least one of the audio output module 450 and the camera module 440. In one embodiment, the support structure 412 may include a groove that accommodates at least one of the audio output module 450 and the camera module 440. In one embodiment, support structure 412 may be formed separately from housing 410 and assembled to housing 410 . In some embodiments, the support structure 412 may be formed integrally with the housing 410 to define an internal space of the housing 410. In one embodiment, the support structure 412 may form a sound guide unit 550 that connects the sound output module 450 and the first sound hole 510 and the second sound hole 520. For example, the sound guide unit 550 may be a space formed through the support structure 410 and the side frame 411 that constitutes the side exterior of the housing 410.

In one embodiment, at least a portion of the housing 410 may constitute the exterior of the electronic device 400. The housing 410 may include a portion that supports the display module 430 of the electronic device 400.

In one embodiment, housing 410 may be formed of various materials. For example, it may be formed of a metallic material and/or a non-metallic material. Here, the metallic material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium, and the non-metallic material may include synthetic resin, ceramic, and/or engineering plastic. Additionally, the housing 410 may be formed in various ways, such as injection or die casting.

In one embodiment, referring to FIGS. 4 and 5A, the lens unit 441 of the camera module 440 (e.g., the camera module 180 of FIG. 1) is aligned in the width direction of the housing 410 (e.g., FIG. 5a). The camera module 440 may be arranged to be aligned with the center of the X-axis direction. Referring to FIG. 4 , the display module 430 may include a camera hole 431 facing the lens unit 441 of the camera module 440. The camera hole 431 may be a portion through which external light passes through the camera module 440 and enters the lens unit 441 of the camera module 440. At least a portion of the portion corresponding to the camera hole 431 may be transparent.

According to one embodiment, as shown in FIGS. 5A and 5B, an audio output module 450 may be disposed in the housing 410 of the electronic device 400. In one embodiment, referring to FIGS. 5A and 5B, the sound output module 450 may be disposed at the top of the housing 410 (eg, a portion located in the +Y direction with respect to FIG. 5A). In one embodiment, the sound output module 450 may refer to a component that outputs sound according to commands from the processor 120 when an application is executed. In one embodiment, the sound output module 450 may include a speaker that outputs sound and/or a receiver that outputs call sounds when an application is running. In one embodiment, the sound output module 450 may output a receiver sound, which is a call sound, when making a call, and may output a speaker sound when operating an application such as a video or game. Hereinafter, for convenience of explanation, the sound output from the sound output module 450 according to the operation of the call application is generally referred to as 'receiver sound', such as the speaker mode used during video, games, and calls, and is generally referred to as the sound output module when the speaker function is activated. The sound output at (450) is described as a 'speaker sound'.

Referring to FIG. 5B, in various embodiments disclosed in this document, the sound output module 450 (e.g., the sound output module 155 of FIG. 1) of the electronic device 400 is oriented in a first direction with respect to the camera module 440. (e.g., -X direction in FIGS. 5B and 6A). When the lens unit 441 of the camera module 440 is arranged to be aligned with the center of the width direction of the housing 410, the sound output module 450 may be arranged eccentrically with respect to the center of the width direction of the housing 410. .

Referring to FIGS. 4 and 6B , the electronic device 400 has a first sound hole 510 (e.g., the sound hole in FIG. 2A (e.g., the sound hole in FIG. 2A 214, 207)). The first sound hole 510 may include a slit-shaped groove located between the housing 410 and the display module 430. For example, the first sound hole 510 may be a slit-shaped hole located between the display module 430 and the side frame 411 of the housing 410. The slit-shaped first sound hole 510 may be formed to extend in a predetermined direction (eg, the X-axis direction in FIG. 4). For example, the plurality of holes constituting the first sound hole 510 may be arranged in a direction parallel to the width direction of the electronic device 400. In some embodiments, at least a portion of the housing 410 and the display module 430 may be concave to form the slit-shaped first sound hole 510. In some cases, the slit-shaped first sound hole 510 may be provided by a step formed between the housing 410 and the display module 430. In another embodiment, the first sound hole 510 may be formed in the display module 430. For example, the first sound hole 510 may be formed at the top of the display module 430 so that the sound output from the sound output module 450 can be emitted to the outside of the electronic device 400.

In one embodiment, the center of the first sound hole 510 in the width direction (eg, the X-axis direction in FIG. 4) may be positioned to be aligned with the camera hole 431. In other words, the first sound hole 510 may be formed symmetrically with respect to the camera hole 431. Since the camera hole 431 may be aligned with the center of the housing 410, the first sound hole 510 aligned with the camera hole 431 may be formed aligned with the center of the housing 410.

In one embodiment, a foreign matter prevention member including a mesh may be disposed in the first sound hole 510 to prevent external foreign matter from entering through the first sound hole 510. The foreign matter prevention member may be disposed at the entrance of the first sound hole 510 or inside the first sound hole 510.

According to one embodiment, as shown in FIGS. 6A and 6C, the electronic device 400 has a second sound hole 520 ( Example: It may include sound holes 214 and 207 in FIG. 2A. The second sound hole 520 may include a plurality of holes formed on the side of the housing 410 (for example, the sound hole 207 in FIG. 2A). The plurality of holes of the second sound hole 520 may be arranged in a direction parallel to the width direction of the electronic device 400 (eg, the X-axis direction with respect to FIG. 6C). In one embodiment, the second sound hole 520 is arranged to surround the side of the housing 410 to form the side frame 411 that constitutes the exterior of the electronic device 400 (e.g., the side bezel structure 218 in FIG. 2A )) can be formed. For example, the second sound hole 520 may be located in the side frame 411 with a plurality of holes extending in the width direction of the electronic device 400 (e.g., the X-axis direction in FIG. 4). . In one embodiment, the center of the second sound hole 520 in the width direction may be positioned to be aligned with the camera hole 431. In other words, the second sound hole 520 may be formed symmetrically with respect to the camera hole 431. Since the camera hole 431 may be aligned with the center of the housing 410, the second sound hole 520 aligned with the camera hole 431 may be formed aligned with the center of the housing 410. A foreign matter prevention member including a mesh may be disposed in the second sound hole 520 to prevent external foreign matter from entering through the second sound hole 520. The foreign matter prevention member may be disposed at the entrance of the second sound hole 520 or inside the second sound hole 520.

In one embodiment, a plurality of sound output modules 450 may be disposed in the housing 410 of the electronic device 400. For example, the audio output module will be placed at the top (e.g., the part facing the +Y direction based on FIG. 3) and the bottom (e.g., the part facing the -Y direction based on FIG. 3) of the housing 410, respectively. You can. As described above, the sound output from the sound output module 450 located at the top of the housing 410 may be radiated through the first sound hole 510 and the second sound hole 520. The sound output from the sound output module 450 located at the bottom of the housing 410 may be radiated through a third sound hole (eg, sound hole 207 in FIG. 2A). In one embodiment, the third sound hole 207 may be formed in the side frame 411 that constitutes the side exterior of the electronic device 400. For example, referring to FIG. 2A , the third sound hole 207 may be formed in the side frame 411 to be located on the bottom side of the electronic device 400. A plurality of holes constituting the third sound hole 207 may be formed in the side frame 411 in a direction parallel to the width direction of the electronic device 400 (e.g., the X-axis direction with respect to FIG. 4). In one embodiment, the third sound hole 207 is a second sound hole with respect to a straight line in the width direction of the electronic device 400 (e.g., the It can be positioned symmetrically with (520). In this case, the center of the third sound hole 207 may be aligned with the camera hole 431 like the second sound hole 520. For example, the third sound hole 207 may be symmetrical with respect to a straight line in the longitudinal direction of the electronic device 400 (eg, Y-axis direction with respect to FIG. 4 ) passing through the camera hole 431 . In some embodiments, the center of the third sound hole 207 may be aligned with the center of the housing 410 in the width direction (eg, the X-axis direction with respect to FIG. 4 ).

In one embodiment, referring to FIG. 6A, the second sound hole 520 may include a dummy hole 521 and a connection hole 522. In one embodiment, the dummy hole 521 may be located adjacent to the sound output module 450 among the second sound holes 520. The connection hole 522 may be arranged to be spaced further apart from the sound output module 450 than the dummy hole 521. For example, the dummy hole 521 and the sound output module 450 are connected to the virtual first axis (e.g., Y axis based on FIG. 6A) passing between the connection hole 522 and the dummy hole 521. It may be located in a first direction (e.g., -X direction based on FIG. 6A). The connection hole 522 may be located in a second direction (eg, +X direction with respect to FIG. 6A) that is opposite to the first direction with respect to the first axis.

In one embodiment, referring to FIGS. 6A, 6B, and 6C, the connection hole 522 is a hole or a hole so that the sound output from the sound output module 450 can be emitted to the outside of the electronic device 400. It may be in the form of an opening. On the other hand, the dummy hole 521 is formed in the shape of a concave groove, so the inside and outside of the electronic device 400 may not communicate with each other. In one embodiment, the dummy hole 521 is formed in the shape of an opening rather than a concave groove and can be closed by a separate device (eg, the shielding member 610 in FIG. 8A). In this structure, the hole of the second sound hole 520 includes a hole formed to communicate with the inside and outside of the electronic device 400, and a portion of the hole may be shielded through the shielding member 610. Accordingly, the sound output from the sound output module 450 may be emitted to the outside of the electronic device 400 through holes other than the hole (eg, dummy hole 521) shielded through the shielding member 610.

Figure 7 is an enlarged view of the sound guide unit viewed from the front of the electronic device, according to an embodiment disclosed in this document. Figure 8a is a perspective view of a shielding member that shields a portion of the second sound hole according to an embodiment disclosed in this document. Figure 8b is a diagram of a state in which a shielding member is disposed on the sound guide portion, according to an embodiment disclosed in this document.

According to various embodiments disclosed in this document, sound radiated from the speaker module 450 may be emitted outside the electronic device 400 through a sound guide formed or provided in the housing 410 or the housing assembly. Here, “acoustic guide unit (channel)” may mean a passage that guides the transmission of sound (sound waves). For example, the sound guide part may mean a physical space. The sound guide unit may include a space filled with a medium capable of transmitting sound waves (eg, air). Hereinafter, the sound being transmitted through the acoustic guide unit may mean that the sound is transmitted through a specific space.

According to one embodiment, as shown in FIG. 7 , the electronic device 400 may include an acoustic outlet 540 through which sound generated by the acoustic output module 450 passes. In one embodiment, referring to FIG. 9A, which will be described later, the sound outlet 540 may be a path extending obliquely with respect to the Y axis of FIG. 9A. In one embodiment, the sound outlet 540 may be formed in an area of the housing 410 located adjacent to a portion of the sound output module 450 from which sound is emitted. Alternatively, the sound outlet 540 may be a space formed in a portion of the support member 412 that supports the sound output module 450.

In one embodiment, referring to FIG. 9A , which will be described later, the electronic device 400 may include a sealing member 630. The sealing member 630 may be disposed on the sound path connected to the sound outlet 450 to prevent foreign substances external to the electronic device 400 from flowing into the sound output module 450 through the sound outlet 540. . The sealing member 630 may include an adhesive member so that it can be fixed to another device, and may include a mesh structure that can transmit sound but block foreign substances.

According to one embodiment, as shown in FIG. 7, the electronic device 400 includes a sound guide unit 550 connecting the first sound hole 510 and the second sound hole 520 and the sound output module 450. ) may include. The receiver sound and speaker sound output from the sound output module 450 may be transmitted to the first sound hole 510 and/or the second sound hole 520 through the sound guide unit 550. In one embodiment, the sound guide unit 550 may extend from the sound outlet 540 to connect the first sound hole 510 and the second sound hole 520 with the sound outlet 540. In one embodiment, the sound guide unit 550 may be formed in the housing 410 so that the sound output from the sound output module 450 is transmitted to the first sound hole 510 and the second sound hole 520. . In some embodiments, the sound guide unit 550 may be a space formed by a plurality of fixtures constituting the housing 410. For example, the sound guide unit 550 may be a space formed through the support structure 410 and the side frame 411 that constitutes the side exterior of the housing 410.

In one embodiment, as described above, the second sound hole 520 may substantially include a connection hole 522 through which the sound output from the sound output module 450 is emitted to the outside of the electronic device 400. . The sound guide unit 550 may connect the connection hole 522 of the second sound hole 520 and the sound output module 450. Additionally, the sound guide unit 550 may connect the first sound hole 510 and the sound output module 450. Therefore, when speaker sound is generated from the sound output module 450 according to the operation of the application, it may be radiated through the first sound hole 510 and the second sound hole 520.

According to one embodiment, the first sound hole 510 and the second sound hole 520 may be connected to the sound output module 450 through the sound guide part 550. In this structure, when a receiver sound is generated from the sound output module 450, the receiver sound may be emitted outside the electronic device 400 not only through the first sound hole 510 but also through the second sound hole 520. In this case, the user's call sound may be transmitted to others and the user's privacy may be violated. According to an embodiment disclosed in this document, the second sound hole 520 may shield the sound output module 450 and adjacent holes. For example, the second sound hole 520 uses the hole adjacent to the sound output module 450 as the dummy hole 521, and is relatively spaced apart from the sound output module 450, excluding the dummy hole 521. The connecting hole 522 can be used. As described above, the second sound hole 520 includes a dummy hole 521 and a camera module 440 located in a first direction (e.g., -X direction based on FIG. 6A) with respect to the camera module 440. It may include a connection hole 522 located in a second direction (e.g., +X direction with respect to FIG. 6A). The dummy hole 521 may be a shielded hole that blocks the inside and outside of the electronic device 400. The connection hole 522 connects the inside and outside of the electronic device 400, and may be a hole through which the sound output from the sound output module 450 is radiated among the second sound holes 450.

According to one embodiment, the dummy hole 521 may have a closed interior. For example, the dummy hole 521 may be formed in a concave groove shape so that the inside and outside of the electronic device 400 do not communicate with each other.

According to one embodiment, the dummy hole 521 is formed in the shape of an opening rather than a concave groove and can be closed by a separate device (eg, the shielding member 610 in FIG. 8A). In this structure, the hole of the second sound hole 520 includes a hole formed to communicate with the inside and outside of the electronic device 400, and a portion of the hole may be shielded through the shielding member 610. In one embodiment, referring to FIGS. 8A and 8B, the shielding member 610 may be disposed on the sound guide unit 550 to shield the dummy hole 521. In one embodiment, the shielding member 610 may be located in the sound guide unit 550 adjacent to the sound outlet 540 through which the sound output from the sound output module 450 comes. In one embodiment, referring to FIG. 8A , the shielding member 610 may include a shielding portion 611 that closes the dummy hole 521 and an opening 612 . The shielding member 610 may be disposed on the sound guide unit 550 so that the shielding unit 611 faces the dummy hole 521. In one embodiment, the opening 612 may connect the acoustic outlet 540 and the acoustic guide unit 550. For example, the receiver sound or speaker sound generated from the sound output module 450 passes through the sound outlet 540 - the opening 612 of the shielding member 610 - the sound guide part 550 in the order of the first sound hole. It may be emitted to (510) and/or the second sound hole (520).

According to an embodiment of the present disclosure, the dummy hole 521 of the second sound hole 520 may be formed in various ways. For example, in one embodiment, the dummy hole 521 may be formed in a concave groove shape so that the inside and outside of the electronic device 400 do not communicate with each other. In some embodiments, the dummy hole 521 is formed in the form of an opening rather than a concave groove and may be closed by a separate device (eg, the shielding member 610 in FIG. 8A). In this case, the receiver sound output from the sound output module 450 may be emitted to the outside of the electronic device 400 through the first sound hole 510. For example, the first sound hole 510 may be located closer to the sound output module 450 than the second sound hole 520. Since the receiver sound is a sound heard when the user holds the electronic device 400 and places the first sound hole 510 close to the ear, it may have a relatively lower sound intensity (decibel, db) than the speaker sound. In this case, the receiver sound passes through the first sound hole 510 before reaching the connection hole 522 of the second sound hole 520, which is relatively further away from the sound output module 450 than the first sound hole 510. It can be released through For example, the receiver sound generated from the sound output module 450 may be emitted to the outside of the electronic device 400 through the first sound hole 510 via the sound outlet 540 - sound guide unit 550. there is. Accordingly, as the receiver sound emitted through the second sound hole 520 is reduced, the user's privacy problem can be improved.

In comparison, speaker sound is used in cases such as activating speaker mode in video, game, and call operations, and may require a relatively higher sound intensity than the receiver sound. In this case, the speaker sound may be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520 as the sound intensity is higher than the receiver sound. Therefore, the speaker sound generated from the sound output module 450 passes through the sound outlet 540 - the sound guide unit 550 and passes through the first sound hole 510 and the second sound hole 520 to the electronic device 400. ) may be released to the outside. Meanwhile, when the shielding member 610 is disposed on the sound guide unit 550, the sound movement path may be narrowed, thereby reducing sound performance. According to an embodiment disclosed in this document, the speaker sound generated from the sound output module 450 is emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520. Performance can be improved.

According to one embodiment, the shielding member 610 may be formed of various materials. For example, it may be formed of an elastic material, a metallic material, or a non-metallic material. Elastic materials may be formed of materials such as rubber and urethane. Metal materials may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and non-metal materials may include synthetic resins, ceramics, and engineering plastics. Additionally, the shielding member 610 may be formed in various ways, such as injection or die casting.

Although not shown in the drawings, in one embodiment, the shielding member 610 may be a part of a device that constitutes the housing 410 of the electronic device 400. For example, the shielding member 610 may be a part of the rear case (eg, the second support member 360 in FIG. 3) disposed toward the rear of the housing 410. A portion of the rear case disposed on the back of the housing 410 may extend to the dummy hole 521 to close the dummy hole 521. In some embodiments, the shielding member 610 may be a concept referring to a portion of the housing 410 that closes the dummy hole 521. In addition, the dummy hole 521 formed in the side member 411 of the housing 410 is closed through a separate device (e.g., a shielding member 610) disposed inside the housing 410 or constitutes the housing 410. The dummy hole 521 can be closed in a variety of ways within the scope of a person skilled in the art, such as closing the dummy hole 521 by extending a device.

FIG. 9A is a cross-sectional view of the electronic device of FIG. 6A cut along line A-A. FIG. 9B is a cross-sectional view of the electronic device of FIG. 6A cut along line B-B.

According to one embodiment, as shown in FIGS. 9A and 9B, the front surface of the housing 410 (e.g., the side facing the -Z direction based on FIG. 9A) of the housing 410 (e.g., FIG. 9A) It may include a penetrating portion 560 formed toward the side facing the +Z direction based on . In one embodiment, the penetrating portion 560 may be part of the acoustic guide portion 550. The penetrating portion 560 may be a passage through which a processing tool used to form the acoustic guide portion 550 is inserted into the housing 410. The sound guide portion 550 is a space formed by processing the housing 410 in the width direction of the electronic device 400 (e.g., the You can.

According to one embodiment, as shown in FIGS. 9A and 9B, a soundproofing member 570 covering the penetrating portion 560 may be disposed on the rear surface of the housing 410. The soundproofing member 570 may block the sound output from the sound output module 450 from being emitted to the outside of the electronic device 400 through the penetration part 560. In one embodiment, the soundproofing member 570 may be formed of a metal material such as SUS (stainless use steel) or aluminum (AL) or a non-metallic material such as rubber, urethane, or silicon to shield the penetration portion 560. .

According to one embodiment, the size of the plurality of holes constituting the first sound hole 510 and the second sound hole 520 is adjusted to allow the sound to be emitted through the first sound hole 510 and the second sound hole 520. The sound bandwidth can be adjusted. In one embodiment, the first sound hole 510 is a hole formed on the front of the electronic device 400, and its size may be limited in consideration of aesthetic factors. For example, as the width of the plurality of holes constituting the first sound hole 510 (e.g., the length in the Y-axis direction based on FIG. 6B) increases, the degree to which the holes are visible to the user from the front of the electronic device 400 increases. As a result, aesthetics may be reduced. According to an embodiment of the present disclosure, the width of the hole constituting the first sound hole 510 (e.g., the length in the X-axis direction based on FIG. 6B) can be adjusted in consideration of aesthetic factors. For example, the width of the hole forming the first sound hole 510 may be substantially the same as the width of the hole forming the second sound hole 520. In some embodiments, the width of the hole forming the first sound hole 510 may be wider or narrower than the width of the hole forming the second sound hole 520. Therefore, the width of the holes constituting the first sound hole 510 and the second sound hole 520 can be adjusted to emit sound in a desired range.

According to one embodiment, when the size of the holes constituting the first sound hole 510 or the second sound hole 520 is different, distortion may occur in the resonant frequency radiated through the sound holes 510 and 520. . For example, when the width of the hole constituting the first sound hole 510 is increased, the volume of the sound path including the sound holes 510 and 520 and the sound guide portion 550 increases, thereby reducing the resonance frequency. You can. That is, distortion may occur in the resonance frequency of the sound generated from the sound output module 450. Accordingly, sound of the desired bandwidth may not be output through the acoustic holes 510 and 520. In one embodiment, a dummy member 620 may be disposed in the sound guide unit 550. The dummy member 620 may be a member with a certain volume made of a material such as rubber or urethane. In one embodiment, the dummy member 620 may be disposed in a portion of the penetrating portion 560. As the dummy member 620 is disposed, the volume of the sound path including the sound holes 510 and 520 and the sound guide unit 550 may be reduced. Accordingly, the increase in the volume of the sound path due to the expansion of the width of the first sound hole 510 can be at least partially offset. Accordingly, distortion of the sound resonance frequency generated in the sound output module 450 can be prevented. Accordingly, the sound output from the sound output module 450 can be emitted through the first sound hole 510 and the second sound hole 520 at a set bandwidth.

In the above description, it was explained that when the hole width of the first sound hole 510 is expanded, sound distortion generated from the sound output module 450 may occur. Even if the width or width of the hole constituting the second sound hole 520 is expanded, the same sound distortion may occur. In this case, the expansion of the volume of the second sound hole 520 can be offset through the dummy member 620 disposed in the sound guide unit 550.

FIGS. 10A and 10B are front and rear views of an unfolded stage of an electronic device according to an embodiment of the present disclosure. FIGS. 11A and 11B are front and rear views of the folded state of an electronic device according to an embodiment of the present disclosure.

The following may be a description of an electronic device of an embodiment different from the electronic device 400 shown in FIGS. 2A to 5B. For example, the electronic device 700 shown in FIGS. 10A to 12 may be a foldable electronic device in which the first housing 710 and the second housing 720 are folded or unfolded. Hereinafter, the same member numbers will be used for all components that are the same or similar to those described in the previous drawings, except where they are indicated separately.

Referring to FIGS. 10A to 11B, the electronic device 700 is configured to fold the folding axis A through a hinge device (e.g., the hinge device 820 of FIG. 12) (e.g., a hinge module) so that the electronic device 700 can be folded relative to each other. A pair of housings 710 and 720 (e.g., a foldable housing structure) that are rotatably coupled to each other as a reference, and a first display (730) disposed through the pair of housings (710 and 720) (e.g., a flexible housing structure. (flexible display, foldable display, or main display) and/or a second display 800 (eg, sub-display) disposed through the second housing 720. According to one embodiment, at least a portion of the hinge device (e.g., the hinge device 820 in FIG. 12) is disposed so as not to be visible from the outside through the first housing 710 and the second housing 720, and in the unfolded state, It can be arranged to be invisible from the outside through the hinge housing 810 that covers the foldable portion. In this document, the side on which the first display 730 is placed can be defined as the front of the electronic device 700, and the side opposite to the front can be defined as the back of the electronic device 700. Additionally, the surface surrounding the space between the front and back may be defined as the side of the electronic device 700.

According to one embodiment, a pair of housings 710 and 720 includes a first housing 710 and a second housing arranged to be foldable relative to each other through a hinge device (e.g., the hinge device 820 of FIG. 12). It may include a housing 720. According to one embodiment, the pair of housings 710 and 720 is not limited to the shape and combination shown in FIGS. 10A to 11B, and may be implemented by combining and/or combining other shapes or parts. According to one embodiment, the first housing 710 and the second housing 720 are disposed on both sides of the folding axis (A) and may have an overall symmetrical shape with respect to the folding axis (A). According to some embodiments, the first housing 710 and the second housing 720 may be folded asymmetrically with respect to the folding axis A. According to one embodiment, the first housing 710 and the second housing 720 determine whether the electronic device 700 is in an unfolded state, a folded state, or an intermediate state. Depending on the presence or absence, the angle or distance between them may vary.

According to one embodiment, the first housing 710 is connected to a hinge device (e.g., the hinge device 820 of FIG. 12) in the unfolded state of the electronic device 700 and faces the front of the electronic device 700. A first surface 711 arranged to It may include a first side member 713 that surrounds at least a portion of it. According to one embodiment, the second housing 720 is connected to a hinge device (e.g., the hinge device 820 of FIG. 12) when the electronic device 700 is unfolded, and faces the front of the electronic device 700. a third surface 721 arranged to It may include a second side member 723 that surrounds at least a portion of it. According to one embodiment, the first side 711 faces substantially the same direction as the third side 721 in the unfolded state, and may at least partially face the third side 721 in the folded state. . According to one embodiment, the electronic device 700 may include a recess 201 formed to accommodate the first display 730 through structural coupling of the first housing 710 and the second housing 720. there is. According to one embodiment, the recess 201 may have substantially the same size as the first display 730.

According to one embodiment, the hinge housing 810 (e.g., a hinge cover) is disposed between the first housing 710 and the second housing 720, and includes a hinge device (e.g., a hinge device) disposed on the hinge housing 810. It may be arranged to cover a portion (eg, at least one hinge module) of the hinge device 820 of FIG. 12 . According to one embodiment, the hinge housing 810 is covered by a portion of the first housing 710 and the second housing 720, depending on the unfolded state, the folded state, or the intermediate state of the electronic device 700. It may be exposed to the outside. For example, when the electronic device 700 is in an unfolded state, at least a portion of the hinge housing 810 may be covered by the first housing 710 and the second housing 720 and may not be substantially exposed. According to one embodiment, when the electronic device 700 is in a folded state, at least a portion of the hinge housing 810 may be exposed to the outside between the first housing 710 and the second housing 720. According to one embodiment, when the first housing 710 and the second housing 720 are in an intermediate state where they are folded with a certain angle, the hinge housing 810 is connected to the first housing 710 and the second housing 720. It may be at least partially exposed to the outside of the electronic device 700 between the second housing 720 . For example, the area of the hinge housing 810 exposed to the outside may be smaller than when it is fully folded. According to one embodiment, the hinge housing 810 may include a curved surface.

According to one embodiment, when the electronic device 700 is in an unfolded state (e.g., the state of FIGS. 10A and 10B), the first housing 710 and the second housing 720 form an angle of about 180 degrees, and The first area 730a, the second area 730b, and the folding area 730c of one display 730 form the same plane and may be arranged to face substantially the same direction (eg, z-axis direction). In another embodiment, when the electronic device 700 is in an unfolded state, the first housing 710 rotates at an angle of about 360 degrees with respect to the second housing 720 to form the second side 712 and the fourth side 722. ) can also be folded in the opposite direction so that they face each other (out folding method).

According to one embodiment, when the electronic device 700 is in a folded state (e.g., the state of FIGS. 11A and 11B), the first surface 711 of the first housing 710 and the first surface of the second housing 720 The three sides 721 may be arranged to face each other. In this case, the first area 730a and the second area 730b of the first display 730 form a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding area 730c, They may also be arranged to face each other. According to one embodiment, at least a portion of the folding area 730c may be transformed into a curved shape with a predetermined curvature. According to one embodiment, when the electronic device 700 is in an intermediate state, the first housing 710 and the second housing 720 may be disposed at a certain angle to each other. In this case, the first area 730a and the second area 730b of the first display 730 may form an angle that is larger than that in the folded state and smaller than that in the unfolded state, and the curvature of the folding area 730c is similar to that in the folded state. It can be smaller than the case and can be larger than the expanded state. In some embodiments, the first housing 710 and the second housing 720 can be stopped at a specified folding angle between the folded state and the unfolded state through a hinge device (e.g., hinge device 820 in FIG. 12). Any angle can be formed (free stop function). In some embodiments, the first housing 710 and the second housing 720 are unfolded or folded in an unfolding or folding direction based on a specified inflection angle through a hinge device (e.g., the hinge device 820 of FIG. 12). Therefore, it can be operated continuously while being pressurized.

According to one embodiment, the electronic device 700 includes at least one display 730 or 800, an input device 715, and an audio output device disposed in the first housing 710 and/or the second housing 720. Includes at least one of (727, 728), sensor module (717a, 717b, 726), camera module (716a, 716b, 725), key input device (719), indicator (not shown), or connector port (729) can do. In some embodiments, the electronic device 700 may omit at least one of the components or may additionally include at least one other component.

According to one embodiment, at least one display 730 or 800 is connected from the first side 711 of the first housing 710 to the second housing through a hinge device (e.g., the hinge device 820 of FIG. 12). Through the first display 730 (e.g., display module 730) disposed to be supported by the third side 721 of 720 and the fourth side 722 in the internal space of the second housing 720. It may include a second display 800 that is at least partially visible from the outside. In some embodiments, the second display 800 may be arranged to be visible from the outside through the second surface 712 in the internal space of the first housing 710. According to one embodiment, the first display 730 can be mainly used in the unfolded state of the electronic device 700, and the second display 800 can be mainly used in the folded state of the electronic device 700. According to one embodiment, in the intermediate state, the electronic device 700 displays the first display 730 and/or the second display 800 based on the folding angle of the first housing 710 and the second housing 720. ) can be controlled to enable use.

According to one embodiment, the first display 730 may be disposed in an accommodation space formed by a pair of housings 710 and 720. For example, the first display 700 may be placed in a recess 201 formed by a pair of housings 710 and 720 and, in the unfolded state, may be displayed on the front of the electronic device 700. It can be arranged to occupy substantially most of the. According to one embodiment, the first display 730 may include a display module 730 in which at least some areas can be transformed into a flat or curved surface. According to one embodiment, the first display 730 includes a first area 730a facing the first housing 710, a second area 730b facing the second housing 720, and a first area 730a. ) and the second area 730b, and may include a folding area 730c facing a hinge device (eg, the hinge device 820 of FIG. 12). According to one embodiment, the area division of the first display 730 is only an exemplary physical division by a pair of housings 710 and 720 and a hinge device (e.g., the hinge device 820 of FIG. 12), but is not actually Through a pair of housings 710 and 720 and a hinge device (e.g., the hinge device 820 of FIG. 12), the first display 730 can be displayed as a seamless, single entire screen. According to one embodiment, the first area 730a and the second area 730b may have an overall symmetrical shape or a partially asymmetrical shape with respect to the folding area 730c.

According to one embodiment, the electronic device 700 has a first rear cover 740 disposed on the second side 712 of the first housing 710 and a fourth side 722 of the second housing 720. It may include a second rear cover 750 disposed. In some embodiments, at least a portion of the first rear cover 740 may be formed integrally with the first side member 713. In some embodiments, at least a portion of the second rear cover 750 may be formed integrally with the second side member 723. According to one embodiment, at least one of the first rear cover 740 and the second rear cover 750 is a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. It can be formed as a plate. According to one embodiment, the first rear cover 740 is made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any of the foregoing materials. It can be formed by an opaque plate, such as a combination of at least the two. According to one embodiment, the second rear cover 750 may be formed through a substantially transparent plate, for example, glass or polymer. Accordingly, the second display 800 can be arranged in the inner space of the second housing 720 so that it can be seen from the outside through the second rear cover 750.

According to one embodiment, the input device 715 may include a microphone. In some embodiments, input device 715 may include a plurality of microphones arranged to detect the direction of sound. According to one embodiment, the sound output devices 727 and 728 may include speakers. According to one embodiment, the sound output devices 727 and 728 include a call receiver 727 disposed through the fourth side 722 of the second housing 720 and the second side of the second housing 720. It may include an external speaker 728 disposed through at least a portion of the member 723. In some embodiments, the input device 715, audio output devices 727, 728, and connector 729 are disposed in spaces of the first housing 710 and/or the second housing 720, and It may be exposed to the external environment through at least one hole formed in 710 and/or the second housing 720. In some embodiments, the holes formed in the first housing 710 and/or the second housing 720 may be commonly used for the input device 715 and the audio output devices 727 and 728. In some embodiments, the sound output devices 727 and 728 may include speakers (e.g., piezo speakers) that operate without the holes formed in the first housing 710 and/or the second housing 720. there is.

According to one embodiment, the camera modules 716a, 716b, and 725 include a first camera module 716a disposed on the first surface 711 of the first housing 710, and a second camera module 716a disposed on the first surface 711 of the first housing 710. It may include a second camera module 716b disposed on the surface 712 and/or a third camera module 725 disposed on the fourth surface 722 of the second housing 720. According to one embodiment, the electronic device 700 may include a flash 718 disposed near the second camera module 716b. According to one embodiment, the flash 718 may include, for example, a light emitting diode or a xenon lamp. According to one embodiment, the camera modules 716a, 716b, and 725 may include one or more lenses, an image sensor, and/or an image signal processor. In some embodiments, at least one of the camera modules 716a, 716b, and 725 includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and includes a first housing 710 and/ Alternatively, they may be placed together on one side of the second housing 720.

According to one embodiment, the sensor modules 717a, 717b, and 726 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 700 or the external environmental state. According to one embodiment, the sensor modules 717a, 717b, and 726 include a first sensor module 717a disposed on the first surface 711 of the first housing 710, and a second sensor module 717a disposed on the first surface 711 of the first housing 710. It may include a second sensor module 717b disposed on the surface 712 and/or a third sensor module 726 disposed on the fourth surface 722 of the second housing 720. In some embodiments, the sensor modules 717a, 717b, and 726 may include a gesture sensor, a grip sensor, a color sensor, an infrared (IR) sensor, an illumination sensor, an ultrasonic sensor, an iris recognition sensor, or a distance detection sensor (e.g., a time-of-flight sensor). of flight sensor or LiDAR (light detection and ranging).

According to one embodiment, the electronic device 700 may further include at least one of a sensor module not shown, for example, an air pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a fingerprint recognition sensor. there is. In some embodiments, the fingerprint recognition sensor may be disposed through at least one of the first side member 713 of the first housing 710 and/or the second side member 723 of the second housing 720. It may be possible.

According to one embodiment, the key input device 719 may be disposed to be exposed to the outside through the first side member 713 of the first housing 710. In some embodiments, the key input device 719 may be disposed to be exposed to the outside through the second side member 723 of the second housing 720. In some embodiments, the electronic device 700 may not include some or all of the key input devices 719, and the key input devices 719 that are not included may be displayed on at least one display 730 or 800. It can be implemented in other forms, such as soft keys. In another embodiment, the key input device 719 may be implemented using a pressure sensor included in at least one display 730 or 800.

According to one embodiment, the connector port 729 may include a connector (eg, a USB connector or an interface connector port module (IF module)) for transmitting and receiving power and/or data to and from an external electronic device. In some embodiments, the connector port 729 performs a function for transmitting and receiving audio signals with an external electronic device, or further includes a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals. You may.

According to one embodiment, at least one camera module (716a, 725) among the camera modules (716a, 716b, 725), at least one sensor module (717a, 726) among the sensor modules (717a, 717b, 726), and /Or the indicator may be arranged to be exposed through at least one display (730, 800). For example, at least one camera module (716a, 725), at least one sensor module (717a, 726), and/or an indicator are displayed in the inner space of at least one housing (710, 720) and at least one display (730, 800). ), an opening or transparent area disposed below the active area (display area) and perforated up to the cover member (e.g., the window layer (not shown) of the first display 730 and/or the second rear cover 750) It can be placed so that it can come into contact with the external environment. According to one embodiment, the area where at least one display (730, 800) and at least one camera module (716a, 725) face each other may be formed as a transparent area with a certain transmittance as part of the area that displays content. . According to one embodiment, the transparent area may be formed to have a transmittance ranging from about 5% to about 20%. This transmission area may include an area overlapping with an effective area (eg, field of view area) of at least one camera module 716a or 725 through which light for generating an image is formed by an image sensor. For example, the transparent area of the displays 730 and 800 may include an area with a lower pixel density than the surrounding area. For example, a transparent area can replace an opening. For example, at least one camera module 716a or 725 may include an under display camera (UDC) or an under panel camera (UPC). In another embodiment, some camera modules or sensor modules 717a and 726 may be arranged to perform their function without being visually exposed through the display. For example, the area facing the camera modules 716a, 725 and/or sensor modules 717a, 726 disposed below the displays 730, 800 (e.g., display panel) is an under display camera (UDC) structure, Perforated openings may be unnecessary.

FIG. 12 is an exploded perspective view of an electronic device 700 according to various embodiments of the present disclosure.

Referring to FIG. 12, the electronic device 700 includes a first display 730 (e.g., display module 730), a second display 800, a hinge device 820, and a pair of support members 761. , 762), at least one substrate 270 (e.g., printed circuit board (PCB)), first housing 710, second housing 720, first rear cover 740, and/or It may include a second rear cover 750.

According to one embodiment, the first display 730 is disposed below the display panel 930 (e.g., flexible display panel), the support plate 950 disposed below the display panel 930, and the support plate 950. It may include a pair of reinforcement plates (961, 962). According to one embodiment, the display panel 930 includes a first panel area 930a corresponding to the first area of the first display 730 (e.g., the first area 730a in FIG. 10A), and a first panel area. A second panel area 930b extending from 930a and corresponding to the second area of the first display 730 (e.g., the second area 730b in FIG. 10A), the first panel area 930a, and the second panel area 930a It may connect the two panel areas 930b and include a folding area of the first display 730 (e.g., a third panel area 930c corresponding to the folding area 730c in FIG. 10A). According to one embodiment, the support plate 950 is disposed between the display panel 930 and a pair of support members 761 and 762, and defines the first panel area 930a and the second panel area 930b. It may be formed to have a material and shape to provide a planar support structure for the third panel area 930c and a bendable structure to help with flexibility. According to one embodiment, the support plate 950 may be formed of a conductive material (eg, metal) or a non-conductive material (eg, polymer or fiber reinforced plastics (FRP)). According to one embodiment, the pair of reinforcement plates 961 and 962 is between the support plate 950 and the pair of support members 761 and 762, between the first panel area 930a and the third panel. A first reinforcement plate 961 disposed to correspond to at least a portion of the region 930c and a second reinforcement plate 962 disposed to correspond to at least a portion of the second panel region 930b and the third panel region 930c. may include. According to one embodiment, the pair of reinforcement plates 961 and 962 are made of a metal material (eg, SUS), thereby helping to strengthen the ground connection structure and rigidity of the first display 730.

According to one embodiment, the second display 800 may be disposed in the space between the second housing 720 and the second rear cover 750. According to one embodiment, the second display 800 may be visible from the outside through substantially the entire area of the second rear cover 750 in the space between the second housing 720 and the second rear cover 750. can be placed.

According to one embodiment, at least a portion of the first support member 761 may be foldably coupled to the second support member 762 through the hinge device 820. According to one embodiment, the electronic device 700 includes at least one wiring member disposed from at least a portion of the first support member 761 across the hinge device 820 to a portion of the second support member 762. 780) (e.g., flexible printed circuit board (FPCB)). According to one embodiment, the first support member 761 may be arranged to extend from the first side member 713 or to be structurally coupled to the first side member 713. According to one embodiment, the electronic device 700 may include a first space (e.g., first space 7101 in FIG. 10A) provided through the first support member 761 and the first rear cover 740. there is. According to one embodiment, the first housing 710 (e.g., first housing structure) may be constructed through a combination of a first side member 713, a first support member 761, and a first rear cover 740. You can. According to one embodiment, the second support member 762 may be arranged to extend from the second side member 723 or to be structurally coupled to the second side member 723. According to one embodiment, the electronic device 700 may include a second space (e.g., the second space 7201 in FIG. 10A) provided through the second support member 762 and the second rear cover 750. there is. According to one embodiment, the second housing 720 (e.g., second housing structure) may be constructed through a combination of the second side member 723, the second support member 762, and the second rear cover 750. You can. According to one embodiment, at least one wiring member 780 and/or at least a portion of the hinge device 820 may be arranged to be supported by at least a portion of a pair of support members 761 and 762. According to one embodiment, at least one wiring member 780 may be disposed in a direction (eg, x-axis direction) crossing the first support member 761 and the second support member 762. According to one embodiment, the at least one wiring member 780 may be disposed in a direction (e.g., x-axis direction) substantially perpendicular to the folding axis (e.g., y-axis or folding axis A in FIG. 10A). .

According to one embodiment, the at least one substrate 270 may include a first substrate 771 disposed in the first space 7101 and a second substrate 772 disposed in the second space 7201. there is. According to one embodiment, the first substrate 771 and the second substrate 772 may include a plurality of electronic components arranged to implement various functions of the electronic device 700. According to one embodiment, the first substrate 771 and the second substrate 772 may be electrically connected through at least one wiring member 780. In one embodiment, a camera module 782 may be disposed on the first substrate 771.

According to one embodiment, the electronic device 700 may include at least one battery 791 and 792. According to one embodiment, at least one battery 791, 792 is disposed in the first space 7101 of the first housing 710, and the first battery 791 is electrically connected to the first substrate 771 and It is disposed in the second space 7201 of the second housing 720 and may include a second battery electrically connected to the second substrate 772. According to one embodiment, the first support member 761 and the second support member 762 may further include at least one swelling hole for the first battery 791 and the second battery 792.

According to one embodiment, the first housing 710 may include a first rotation support surface 714, and the second housing 720 may include a second rotation support surface corresponding to the first rotation support surface 714. It may include (724). According to one embodiment, the first rotation support surface 714 and the second rotation support surface 724 may include a curved surface corresponding to (naturally connected to) the curved outer surface of the hinge housing 810. According to one embodiment, the first rotation support surface 714 and the second rotation support surface 724 cover the hinge housing 810 when the electronic device 700 is in an unfolded state, thereby protecting the hinge housing 810. It may not be exposed to the rear of the electronic device 700, or only a portion of it may be exposed. According to one embodiment, when the electronic device 700 is in a folded state, the first rotation support surface 714 and the second rotation support surface 724 rotate along the outer surface of the hinge housing 810 to form the hinge housing. At least part of 810 may be exposed to the rear of the electronic device 700.

According to one embodiment, the electronic device 700 may include at least one antenna 776 disposed in the first space 7201. According to one embodiment, at least one antenna 776 may be disposed on the first battery 791 and the first rear cover 740 in the first space 7201. According to one embodiment, the at least one antenna 776 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. According to one embodiment, at least one antenna 776 may, for example, perform short-distance communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna structure is formed by at least a portion of the first side member 713 or the second side member 723 and/or a portion of the first support member 761 and the second support member 762 or a combination thereof. can be formed.

According to one embodiment, the electronic device 700 includes at least one electronic component assembly 774, 775 and/or additional support members 763 disposed in the first space 7101 and/or the second space 7201. , 773) may be further included. For example, at least one electronic component assembly may include an interface connector port assembly 774 or a speaker assembly 775.

According to one embodiment, the electronic device 100 includes a first waterproof structure (WP1) disposed between the first reinforcement plate 961 and the first support member 761 and a second reinforcement plate ( 962) and a second waterproof structure (WP2) disposed between the second support member 762. According to one embodiment, the first waterproof structure (WP1) is formed so that at least one first waterproof space (9811, 9812, 9813) is formed between the first reinforcement plate (961) and the first support member (761). It may include a first waterproof member 981 disposed. According to one embodiment, the second waterproof structure (WP2) is a second waterproof structure disposed so that at least one second waterproof space 9821 is formed between the second reinforcement plate 962 and the second support member 762. Member 982 (e.g., the 2-1 waterproof member 982), the third waterproof member 983 (e.g., the 2-2 waterproof member 983), and the fourth waterproof member 984 (e.g., the third waterproof member 984) 2-3 waterproof members 984) may be included. According to one embodiment, the fourth waterproof member 984 may be arranged to connect the stepped and spaced spaces of the second waterproof member 982 and the third waterproof member 983.

According to one embodiment, the at least one first waterproof space 9811 is an electronic component disposed between the first reinforcement plate 961 and the first support member 762 through the first waterproof member 981. Example: A wiring structure for connecting the first digitizer panel 471 in FIG. 4 to the first space 7101, using a connection member (e.g., the first connection member 4711 in FIG. 6, FPCB (flexible printed circuit board) )) can be arranged to accommodate a through path. According to one embodiment, at least one second waterproof space 9821 is formed through the second waterproof member 982, the third waterproof member 983, and the fourth waterproof member 984, and the second reinforcement plate 962. ) and the second support member 762 as a wiring structure for connecting the electronic component (e.g., the second digitizer panel 472 in FIG. 4) to the second space 7201, and the connection member (e.g., FIG. It may be arranged to accommodate the through path of the second connecting member 4721 of 6). According to one embodiment, the at least one first waterproof space 9812, 9813 is an area corresponding to at least one electronic component (eg, a camera module or sensor module) arranged to be supported by the first support member 761. can be accepted. According to one embodiment, at least one second waterproof space 9821 may accommodate at least a portion of a bending portion (eg, the bending portion 432 in FIG. 4) that is folded toward the back of the first display 730. For example, at least one second waterproof space 9821 extends from the display panel of the first display 730 (e.g., the display panel 930 in FIG. 4) and includes at least a portion of the bending portion 432 that is folded to the rear. It can be arranged to surround. Accordingly, the control circuit (e.g., the control circuit 4321a of FIG. 4) and a plurality of electrical elements (not shown) disposed in the bending portion 432 are disposed in at least one second waterproof space 9821, It can be protected from external moisture and/or foreign substances.

The electronic device 700 according to an exemplary embodiment of the present disclosure includes at least one waterproof member 981, 982, 983, and 984, a first support member 761 of the first housing 710, and a first reinforcement plate ( 961) and/or between the second support member 762 and the second reinforcement plate 962 of the second housing 720, thereby comprising at least one waterproof structure (WP1, WP2), ), when the first display 730 is separated from the housings 710 and 720 for maintenance, damage to the first display through the waterproof member can be reduced, and at least one waterproof member 981, Since 982, 983, and 984 are arranged to avoid the back of the first display 730, external visibility is improved and can help ensure surface quality.

According to one embodiment, the structure shown in FIGS. 4 to 9B may be a configuration or structure applied to the electronic device 700. In one embodiment, the structure or configuration described through FIGS. 4 to 9B may be a configuration or structure applied to at least one of the first housing 710 and/or the second housing 720 of the electronic device 700. . For example, the electronic device 400 of FIG. 4 may be a configuration of the electronic device 700 of FIGS. 11A to 13 that is folded or unfolded. Accordingly, description of the first sound hole 510, the second sound hole 520, the sound output module 450, the sound outlet 540, and the sound guide unit 550 described through FIGS. 4 to 9b may be equally applied to the electronic device 700 of FIGS. 11A to 13.

FIG. 13 is a diagram for explaining speaker performance of an audio output module according to an embodiment disclosed in this document. In one embodiment, referring to FIG. 13, the speaker performance of the sound output module 450 disclosed in this document can be confirmed. The first graph 1001 shows the speaker performance of the sound output module 450 disclosed in this document. The second graph 1002 shows the speaker performance of an electronic device in which a speaker module (not shown) used for the speaker function and a receiver module (not shown) used for the receiver function are separately arranged. The electronic device corresponding to the second graph 1002 includes a speaker hole through which the speaker sound emitted from the speaker module is emitted outside the electronic device, and includes a receiver hole through which the receiver sound emitted from the receiver module is emitted outside the electronic device. can do. The speaker module and speaker hall and the receiver module and receiver hall can be connected through separate conduits.

In one embodiment, speaker sound generated from the sound output module 450 may be emitted to the outside of the electronic device 400 through the first sound hole 510 and the second sound hole 520. As sound is emitted to the outside of the electronic device 400 through a plurality of paths (eg, the first sound hole 510 and the second sound hole 520), the stereo performance of the speaker may be improved.

Meanwhile, according to an embodiment of the present disclosure, the width of the plurality of holes constituting the first sound hole 510 may be expanded. As the width of the hole constituting the first sound hole 510 increases, the intensity of sound radiated through the first sound hole 510 may increase. The increase in the volume of the sound path due to the expansion of the width of the first sound hole 510 can be offset through the above-described dummy member 620.

As described above, in the electronic device 400 according to an embodiment of the present disclosure, the speaker sound generated by the sound output module 450 is transmitted electronically through the first sound hole 510 and the second sound hole 520. It can be emitted to the outside of the device 400, and speaker performance can be improved by expanding the width of the first sound hole 510. Accordingly, the speaker performance 1001 of the audio output module 510 that emits the speaker sound and the receiver sound of the present disclosure may be similar to the speaker performance 1002 of the audio output module 510 that emits only the speaker sound. Accordingly, the electronic device 400 of the present disclosure can replace a plurality of sound output modules through the sound output module 450 that performs a plurality of functions, and thus the mounting structure of the electronic device 400 can be improved. there is.

According to an embodiment of the present disclosure, an electronic device 400 (e.g., the electronic device 101 shown in FIG. 1, the electronic device 200 shown in FIGS. 2A and 2B, and/or the electronic device shown in FIG. 3 Device 300) includes a housing 410, a camera module 440 disposed in the housing (e.g., camera module 180 in FIG. 1), and an audio output module disposed in the housing and spaced apart from the camera module ( 450) (e.g., the sound output module 155 of FIG. 1), a first sound hole 510 located on the front of the electronic device (e.g., the sound holes 214 and 207 of FIG. 2a, the sound output module A second second device including a dummy hole 521 disposed adjacently and at least partially closed, a connection hole 522 spaced apart from the dummy hole with respect to the audio output module, and located on a side of the electronic device. A sound hole 520 (e.g., the sound holes 214 and 207 of FIG. 2A) is formed in the housing, outputs sound generated by the sound output module, and is connected to the first sound hole and the second sound hole. An outlet 540 and a sound guide portion 550 formed in the housing along the extension direction of the first sound hole and the second sound hole, and connecting the sound outlet with the first sound hole and the second sound hole. may include.

In addition, at least a portion of the sound output module and the dummy hole are connected to a virtual first axis (e.g., the first axis shown in FIG. 6A or the Y axis based on FIG. 6A) passing between the dummy hole and the connection hole. is located in a first direction (e.g., -X direction based on FIG. 6A), and the connection hole is located in a second direction (e.g., + direction).

In addition, the connection hole of the second sound hole may include a hole connecting the outside and the inside of the electronic device, and the dummy hole of the second sound hole may include a groove concavely formed on a side of the housing. You can.

In addition, it may further include a shielding member 610 that closes the dummy hole of the second sound hole.

Additionally, the shielding member may include a shielding portion 611 that closes the dummy hole and an opening 612 connecting the sound outlet and the sound guide portion.

Additionally, at least a portion of the frame 411 constitutes the side exterior of the electronic device and may include a side frame 411 in which the second sound hole is formed.

Additionally, the sound guide unit may be a space formed through the support member 412 disposed in the housing and the side frame.

Additionally, the plurality of holes constituting the first sound hole and the second sound hole may be formed to have substantially the same width.

In addition, it may further include a penetrating part 560 formed on the back of the housing toward the front of the housing and connected to the sound guide part, and a soundproofing member 570 covering the penetrating part on the back of the housing.

Additionally, the sound guide part may be formed such that a processing tool inserted through the penetration part extends from the housing in the width direction of the electronic device.

In addition, it may further include a dummy member 620 disposed in at least a portion of the through portion to reduce the volume of the sound guide portion.

In addition, it further includes a display module 430 disposed in the housing, wherein the display module includes a camera hole 431 through which light is incident on the lens of the camera module, and at the center of the second sound hole. may be aligned with the camera hole.

In addition, it may further include a display module 430 disposed in the housing, and the first sound hole may include a hole formed in the shape of a slit between the display module and the housing.

Additionally, the first sound hole and the second sound hole may include a plurality of holes, and the plurality of holes may be arranged in a direction parallel to the width direction of the electronic device.

An electronic device 400 according to an embodiment of the present disclosure (e.g., the electronic device 101 shown in FIG. 1, the electronic device 200 shown in FIGS. 2A and 2B, and/or the electronic device shown in FIG. 3 The sound radiation structure of (300) is a sound output module ( 450) (e.g., the sound output module 155 of FIG. 1), a first sound hole 510 located on the front of the electronic device (e.g., the sound holes 214 and 207 of FIG. 2a, the sound output module A second sound hole 520 including an adjacent and at least partially closed dummy hole 521 and a connection hole 522 spaced apart from the dummy hole with respect to the sound output module, and located on a side of the electronic device, A sound outlet 540 formed in the housing, through which the sound generated by the sound output module is output and connected to the first sound hole and the second sound hole, and the extension direction of the first sound hole and the second sound hole Accordingly, it may include a sound guide portion 550 that is formed in the housing and connects the sound outlet, the first sound hole, and the second sound hole.

In addition, at least a portion of the sound output module and the dummy hole are connected to a virtual first axis (e.g., the first axis shown in FIG. 6A or the Y axis based on FIG. 6A) passing between the dummy hole and the connection hole. may be located in a first direction, and the connection hole may be located in a second direction opposite to the first direction with respect to the first axis.

In addition, the connection hole of the second sound hole may include a hole connecting the outside and inside of the electronic device, and the dummy hole of the second sound hole may include a groove concavely formed on a side of the housing. You can.

In addition, it may further include a shielding member 610 that closes the dummy hole of the second sound hole.

Additionally, the shielding member may include a shielding portion 611 that closes the dummy hole and an opening 612 connecting the sound outlet and the sound guide portion.

In addition, at least a portion of the electronic device constitutes a side exterior and includes a side frame 411 in which the second sound hole is formed, and the sound guide unit includes a support member 412 disposed in the housing and the side frame. It may be a space formed through.

Additionally, the plurality of holes constituting the first sound hole and the second sound hole may be formed to have substantially the same width.

In addition, a penetrating part 560 formed on the back of the housing toward the front of the housing and connected to the sound guide part, a sound insulation member 570 covering the penetrating part on the back of the housing, and disposed in at least a portion of the penetrating part. It may further include a dummy member 620 that reduces the volume of the sound guide unit.

According to various embodiments disclosed in this document, when making a call, the sound emitted from the sound output module 450 through the second sound hole 520 in addition to the first sound hole 510 can be reduced. In addition, when the speaker function is used according to the execution of the application, the sound generated by the sound output module 450 may be radiated through the first sound hole 510 and the second sound hole 520. Accordingly, speaker radiation performance can be improved.

400: Electronic device 410: Housing
450: sound output module 510: first sound hole
520: second sound hall 550: sound guide unit
610: Shielding member 620: Dummy member

Claims (20)

In the electronic device 400,
housing 410;
A camera module 440 disposed in the housing;
an audio output module 450 disposed in the housing and spaced apart from the camera module;
A first sound hole 510 located at the front of the electronic device;
A dummy hole 521 disposed adjacent to the sound output module and at least partially closed, and a connection hole 522 spaced apart from the sound output module by the dummy hole, and a side surface of the electronic device. A second sound hall 520 located at;
a sound outlet 540 formed in the housing to output sound generated by the sound output module and connected to the first sound hole and the second sound hole; and
An electronic device comprising: a sound guide portion 550 formed in the housing along the extension direction of the first sound hole and the second sound hole and connecting the sound outlet with the first sound hole and the second sound hole; Device.
According to paragraph 1,
At least a portion of the sound output module and the dummy hole are located in a first direction with respect to a virtual first axis passing between the dummy hole and the connection hole, and the connection hole is located in the first direction with respect to the first axis. An electronic device located in a second, opposite direction.
According to paragraph 1,
The connection hole of the second sound hole is,
Includes a hole connecting the outside and inside of the electronic device,
The dummy hole of the second sound hole is,
An electronic device including a concave groove formed on a side of the housing.
According to paragraph 1,
The electronic device further includes a shielding member 610 that closes the dummy hole of the second sound hole.
According to clause 4,
The shielding member is,
An electronic device including a shielding part 611 that closes the dummy hole and an opening 612 connecting the sound outlet and the sound guide part.
According to paragraph 1,
An electronic device including a side frame 411, at least a portion of which constitutes a side exterior of the electronic device, and in which the second sound hole is formed.
According to clause 6,
The sound guide unit,
An electronic device that is a space formed through a support member 412 disposed in the housing and the side frame.
According to paragraph 1,
The plurality of holes constituting the first sound hole and the second sound hole are,
Electronic devices formed of substantially equal width.
According to paragraph 1,
a penetrating portion 560 formed from the rear of the housing toward the front of the housing and connected to the sound guide portion; and
The electronic device further includes a soundproofing member 570 covering the penetration portion on the rear surface of the housing.
According to clause 9,
The sound guide unit,
An electronic device formed by a processing tool inserted through the penetration portion extending from the housing in a width direction of the electronic device.
According to clause 9,
The electronic device further includes a dummy member 620 disposed in at least a portion of the through portion to reduce the volume of the sound guide portion.
According to paragraph 1,
It further includes a display module 430 disposed in the housing,
The display module is,
It includes a camera hole 431 through which light enters the lens of the camera module,
An electronic device wherein the center of the second sound hole is aligned with the camera hole.
According to paragraph 1,
It further includes a display module 430 disposed in the housing,
The first sound hall is,
An electronic device including a hole formed in the form of a slit between the display module and the housing.
According to paragraph 1,
The first sound hole and the second sound hole are,
Contains a plurality of halls,
The plurality of holes are,
An electronic device arranged in a direction parallel to the width direction of the electronic device.
In the sound radiation structure of the electronic device 400,
an audio output module 450 disposed in the housing and spaced apart from the camera module 440 disposed in the housing 410 of the electronic device;
A first sound hole 510 located in the front of the electronic device;
A second sound device including a dummy hole 521 adjacent to the sound output module and at least partially closed, a connection hole 522 spaced apart from the sound output module than the dummy hole, and located on a side of the electronic device. Hall (520);
a sound outlet 540 formed in the housing to output sound generated by the sound output module and connected to the first sound hole and the second sound hole; and
Sound radiation comprising; a sound guide portion 550 formed in the housing along the extension direction of the first sound hole and the second sound hole and connecting the sound outlet with the first sound hole and the second sound hole; struct.
According to clause 15,
At least a portion of the sound output module and the dummy hole are located in a first direction with respect to a virtual first axis passing between the dummy hole and the connection hole, and the connection hole is located in the first direction with respect to the first axis. A negative radiating structure located in a second, opposite direction.
According to clause 15,
The connection hole of the second sound hole is,
Includes a hole connecting the outside and inside of the electronic device,
The dummy hole of the second sound hole is,
A sound radiation structure including a concave groove formed on a side of the housing.
According to clause 15,
It further includes a shielding member 610 that closes the dummy hole of the second sound hole,
The shielding member is,
A sound radiation structure comprising a shielding part 611 that closes the dummy hole and an opening 612 connecting the sound outlet and the sound guide part.
According to clause 15,
At least a portion constitutes a side exterior of the electronic device and includes a side frame 411 in which the second sound hole is formed,
The sound guide unit,
A sound radiation structure that is a space formed through a support member 412 disposed in the housing and the side frame.
According to clause 15,
a penetrating portion 560 formed from the rear of the housing toward the front of the housing and connected to the sound guide portion;
a soundproofing member 570 covering the penetration portion on the rear surface of the housing; and
A sound radiating structure further comprising a dummy member 620 disposed in at least a portion of the penetrating portion to reduce the volume of the sound guide portion.

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