KR20240037119A - Electronic device including heat dissipation member - Google Patents

Abstract

An electronic device according to an embodiment of the present disclosure includes a housing including a first side on which a keyboard is disposed, a second side located opposite the first side and including an inlet opening through which external air flows, and at least one A printed circuit board on which electronic components are placed, disposed between the first and second sides, extending along the longitudinal direction of the housing, a heat dissipation member that receives heat generated from the electronic components, and external air flows in through the heat dissipation member. It includes a cooling unit for cooling, and the heat dissipation member is a first area where the printed circuit board is disposed, and is positioned at one end and the other end of the first area to be spaced apart in the longitudinal direction and the height direction of the electronic device, and includes two cooling units where the cooling unit is disposed. It includes a second area and a connection area connecting the first area and the second area, and the printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member.

Description

Electronic device including a heat dissipation member {ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION MEMBER}

One embodiment of the present disclosure relates to an electronic device including a heat dissipation member.

The cooling structure of an electronic device (eg, a laptop PC) may include a heat plate, a heat pipe, a cooling fin, and/or a cooling fan.

The heat plate can directly contact the heat source and transfer the heat generated from the heat source to the hip pipe. The heat pipe can transfer the received heat to the point where the cooling fins are located. The cooling fan can cool the heat reaching the cooling fins by blowing air in a direction toward the cooling fins.

As electronic devices (e.g. laptop PCs) become thinner, the thickness of the cooling fan included in the cooling structure may also become thinner. When the thickness of the cooling fan becomes thinner, the cooling fan may rotate at a faster speed to satisfy cooling performance. As the rotation speed of the cooling fan increases, the noise generated from the cooling fan may increase to a level that does not meet predetermined reliability standards.

Accordingly, in electronic devices where the space in which internal components are placed is narrow due to thinness, a cooling structure that can cool internal heat with low noise may be needed.

An electronic device according to an embodiment of the present disclosure may include a housing, a printed circuit board, a heat dissipation member, and/or a cooling unit.

The housing according to an embodiment of the present disclosure may include a first surface on which a keyboard is disposed, and a second surface located opposite the first surface and including an inlet opening through which external air flows.

At least one electronic component according to an embodiment of the present disclosure may be disposed on a printed circuit board.

The heat dissipation member according to an embodiment of the present disclosure is disposed between the first and second surfaces, extends along the longitudinal direction of the housing, and can receive heat generated from the electronic component.

The cooling unit according to an embodiment of the present disclosure allows external air flowing in from the inlet opening to cool the heat dissipation member.

The heat dissipation member according to an embodiment of the present disclosure includes a first region where a printed circuit board is disposed, two cooling units located at one end and the other end of the first region at a distance from each other in the width direction and the height direction of the electronic device, and a cooling unit being disposed. It may include a second area and a connection area connecting the first area and the second area.

The printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member according to an embodiment of the present disclosure.

A printed circuit board heat dissipation structure according to an embodiment of the present disclosure may include a printed circuit board on which at least one electronic component is disposed, a heat dissipation member that receives heat generated from the electronic component, and a cooling unit that cools the heat dissipation member.

The heat dissipation member of the printed circuit board heat dissipation structure according to an embodiment of the present disclosure includes a first region where the printed circuit board is disposed, and one end and the other end of the first region are spaced apart in the width and height directions of the printed circuit board heat dissipation structure. They are located on each other and may include two second areas where the cooling unit is disposed and a connection area connecting the first area and the second area.

In the printed circuit board heat dissipation structure according to an embodiment of the present disclosure, the printed circuit board and the cooling unit may be located on opposite sides of the heat dissipation member.

An electronic device including a heat dissipation member according to an embodiment of the present disclosure can provide a low-noise cooling structure that can be placed in a thin electronic device.

The heat dissipation member according to an embodiment of the present disclosure may be applied to an electronic device having a thin thickness in which the printed circuit board and the cooling unit are arranged in different directions with respect to the heat dissipation member.

1 is a block diagram of an electronic device in a network environment according to one embodiment.
Figure 2 is a perspective view of an electronic device according to an embodiment of the present disclosure.
3 is a conceptual diagram illustrating an electronic device according to an embodiment of the present disclosure.
Figure 4 is a conceptual diagram showing a heat dissipation member according to an embodiment of the present disclosure.
5A and 5B are diagrams showing an electronic device according to an embodiment of the present disclosure.
FIGS. 6A, 6B, and 6C are diagrams showing a housing, a printed circuit board, a heat dissipation member, and a cooling unit according to an embodiment of the present disclosure.
7A and 7B are diagrams showing a heat dissipation member and a cooling unit according to an embodiment of the present disclosure.
FIGS. 8A, 8B, and 8C are diagrams showing a heat dissipation member disposed in an electronic device according to an embodiment of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100, according to one embodiment. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or operations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit or processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit (NPU) : neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device 101 includes a main processor 121 and a auxiliary processor 123, the auxiliary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Figure 2 is a perspective view of an electronic device 200 according to an embodiment of the present disclosure.

According to an embodiment of the present disclosure, the electronic device 101 (see FIG. 1) may include an electronic device 200 in the form of a laptop PC, as shown in FIG. 2. The electronic device 200 may include a first housing 210 and a second housing 220 that can be folded to face each other. For example, the first housing 210 and the second housing 220 may be folded to face each other based on the folding axis of the electronic device 200 (eg, M-M axis shown in FIG. 2).

In one embodiment, the electronic device 200 includes a keyboard 240 disposed in the first housing 210 and a display module 230 disposed in the second housing 220 (e.g., the display module 160 of FIG. 1). ) can be folded to face each other.

In one embodiment, the first housing 210 and the second housing 220 are disposed on both sides about the folding axis (e.g., M-M axis shown in FIG. 2) of the electronic device 200, and are positioned on the folding axis. It may have an overall symmetrical shape.

In one embodiment, the first housing 210 and the second housing 220 may have an asymmetric shape with respect to the folding axis of the electronic device 200. The angle formed by the first housing 210 and the second housing 220 or their angles depending on whether the electronic device 200 is in an unfolded state, a folded state, or an intermediate state. The distance between them may vary.

Referring to FIG. 2, the first housing 210 according to one embodiment has a first surface 210A, a second surface 210B, and a space between the first surface 210A and the second surface 210B. It may include a surrounding side 210C. The first surface 210A and the second surface 210B of the first housing 210 may be formed to be parallel.

In one embodiment, the side 210C of the first housing 210 may be manufactured separately from the first side 210A of the first housing 210 and the second side 210B of the first housing 210, , It may be coupled to at least one of the first surface 210A of the first housing 210 and the second surface 210B of the first housing 210. For example, each segmented portion of the first surface 210A, the second surface 210B, and the side surface 210C of the first housing 210 can be bonded in various ways (e.g., bonded through adhesive, bonded through welding, can be connected by bolt connection).

In one embodiment, the side 210C of the first housing 210 may be formed integrally with the first side 210A or the second side 210B of the first housing 210. The second housing 220 may have the same configuration as the first housing 210.

According to one embodiment, various connector ports (not shown) may be formed on the side surface 210C of the first housing 210. The connector port may include a connector port (eg, a USB connector port) for transmitting and receiving power and/or data to and from an external electronic device.

In one embodiment, the connector port may perform the function of transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., ear jack hole) for performing the function of transmitting and receiving audio signals. .

According to one embodiment, an opening (not shown) through which air inside the electronic device 300 can be discharged to the outside may be formed in the side surface 210C of the first housing 210.

In one embodiment, the first housing 210 and the second housing 220 may be formed of various materials. For example, it may be formed of a metallic material and/or a non-metallic material. Here, the metallic material may include an alloy of aluminum, stainless steel (STS, SUS), iron, magnesium, and/or titanium, and the non-metallic material may include synthetic resin, ceramic, and/or engineering plastic.

In one embodiment, the first housing 210 and the second housing 220 may be manufactured in various ways. For example, the first housing 210 and the second housing 220 may be formed by methods such as injection or die casting.

The shapes, materials, and forming methods of the first housing 210 and the second housing 220 shown in FIG. 2 described above are merely examples and may be changed in various ways within the scope of those skilled in the art. You can.

FIG. 3 is a conceptual diagram illustrating an electronic device 300 according to an embodiment of the present disclosure.

In one embodiment, the electronic device 300 may refer to the electronic device 200 shown in FIG. 2 or may include at least a portion of the electronic device 200.

In describing the electronic device 300 according to an embodiment of the present disclosure, the length direction of the electronic device 300 may refer to the x-axis direction, and the height direction of the electronic device 300 may refer to the z-axis direction. there is.

The electronic device 300 according to an embodiment of the present disclosure includes a housing 310, a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, an electronic component 360, a fixing member 370, and /Or may include a keyboard 380.

In one embodiment, the housing 310 may refer to the first housing 210 shown in FIG. 2 or may include at least a portion of the first housing 210 . The keyboard 380 may refer to the keyboard 240 shown in FIG. 2 or may include at least a portion of the keyboard 240.

In one embodiment, housing 310 may include a first side 310a and/or a second side 310b. The second side 310b may be located on the opposite side of the first side 310a. A printed circuit board 320, a heat dissipation member 330, a cooling unit 340, an electronic component 360, and/or a fixing member ( 370) can be deployed.

In one embodiment, the keyboard 380 may be placed on the first side 310a of the housing 310. For example, the keyboard 380 may be arranged in the positive z-axis direction with respect to the first surface 310a.

In one embodiment, the keyboard 380 may include at least a portion of a thermally conductive material to dissipate heat generated from the heat dissipation member 330. For example, the keyboard 380 may include a base plate (not shown) made of aluminum to disperse heat generated from the heat dissipation member 330. Other components included in the keyboard 380 (eg, a rubber dome) may have an insulating function and serve to reduce heat transfer inside the keyboard 380.

In one embodiment, the housing 310 may include an inlet opening 311 at least in part. For example, an inlet opening 311 may be formed in the second surface 310b of the housing 310. The inlet opening 311 extends in the longitudinal direction (e.g., x-axis direction) and width direction (e.g., directions perpendicular to the x-axis and z-axis) of the electronic device 300 on the second side 310b of the housing 310. It can be placed at intervals accordingly.

In one embodiment, the heat dissipation member 330 may be formed to extend along the longitudinal direction (eg, x-axis direction) of the electronic device 300.

In one embodiment, the heat dissipation member 330 may include a first area 331, a second area 332, and/or a connection area 333. The first area 331 may be an area including the center of the heat dissipation member 330 in the x-axis direction.

In one embodiment, the second area 332 may be located at one end and the other end of the first area 331, respectively. For example, at one end of the first area 331, a second area 332 is located spaced apart in the negative x-axis direction, and at the other end of the first area 331, a second area 332 is located spaced apart in the positive x-axis direction. The remaining second area 332 may be located.

In one embodiment, the connection area 333 may be an area that connects the first area 331 and the second area 332.

In one embodiment, at least a portion of the heat dissipation member 330 may be bent and extended along the height direction (eg, z-axis direction) of the electronic device 300. For example, the heat dissipation member 330 extends from the second area 332 to the connection area 333 and may be at least partially bent in the z-axis direction. The heat dissipation member 330 extends from the connection area 333 to the first area 331 and may be bent in the x-axis direction.

In one embodiment, two second areas 332 may be arranged in symmetrical positions with respect to the first area 331 . For example, with respect to the first area 331, one second area 332 may be positioned at a distance from the first area 331 in the positive z-axis direction and the positive x-axis direction. Based on the first area 331, the remaining second area 332 may be positioned at a distance from the first area 331 in the positive z-axis direction and the negative x-axis direction.

In one embodiment, the first area 331 may be located closer to the second surface 310b of the housing 310 than the second area 332. For example, based on the height direction (e.g., z-axis direction) of the electronic device 300, between the location where the second area 332 is located and the location where the second surface 310b of the housing 310 is located. The first area 331 may be placed in .

In one embodiment, the connection area 333 may be connected to the first area 331 at one end and to the second area 332 at the other end. Since the first area 331 is located closer to the second surface 310b of the housing 310 than the second area 332, one end of the connection area 333 is closer to the housing ( It may be located closer to the second side 310b of 310).

In one embodiment, the electronic component 360 may be disposed on one side of the printed circuit board 320. For example, the electronic component 360 may be disposed on the side of the printed circuit board 320 that faces the heat dissipation member 330 (eg, the side that faces the negative z-axis direction).

In one embodiment, the electronic component 360 may be a component that generates heat during the operation of the electronic device 300. For example, the electronic component 360 may be a central processing unit that performs calculations when the electronic device 300 is operated.

In one embodiment, the printed circuit board 320 and the electronic component 360 may be disposed in a position that overlaps the first region 331 of the heat dissipation member 330. For example, the printed circuit board 320 and the electronic component 360 may be located in the positive z-axis direction with respect to the first area 331 of the heat dissipation member 330. The heat dissipation member 330 may receive heat generated from the electronic component 360.

In one embodiment, the printed circuit board 320 and the electronic component 360 may be fixed to the first region 331 of the heat dissipation member 330 through a fixing member 370. For example, the fixing member 370 is disposed in the first area 331 of the heat dissipation member 330 to fix the positions of the printed circuit board 320 and the electronic component 360 with respect to the first area 331. can play a role.

In one embodiment, the cooling unit 340 may be disposed in the second area 332 of the heat dissipation member 330. For example, the cooling unit 340 may be disposed on the side of the second area 332 of the heat dissipation member 330 facing the negative z-axis direction.

In one embodiment, the printed circuit board 320 and the cooling unit 340 may be located in opposite directions with respect to the heat dissipation member 330. For example, the printed circuit board 320 may be located in the positive z-axis direction with respect to the heat dissipation member 330, and the cooling unit 340 may be located in the negative z-axis direction with respect to the heat dissipation member 330. can be located

In one embodiment, the cooling unit 340 may include at least a portion of the cooling unit opening 341 through which external air (IN-AIR) can be introduced. In FIG. 3 , the cooling unit 340 is shown as including one cooling unit opening 341, but this is an example and the cooling unit 340 may include a plurality of cooling unit openings 341.

In one embodiment, the cooling unit opening 341 of the cooling unit 340 and the inlet opening 311 of the housing 310 may be formed in the same direction with respect to the heat dissipation member 330. For example, the cooling unit opening 341 is located in a direction (e.g., negative z-axis direction) toward the second surface 310b of the housing 310 based on the second area 332 of the heat dissipation member 330. An inlet opening 311 may be located.

In one embodiment, external air (IN-AIR) may be introduced into the electronic device 300 through the inlet opening 311 formed on the second surface 310b of the housing 310. External air (IN-AIR) introduced into the electronic device 300 may be introduced into the cooling unit 340 through the cooling unit opening 341 of the cooling unit 340.

In one embodiment, the cooling unit opening 341 of the cooling unit 340 and the inlet opening 311 of the housing 310 may be arranged to be spaced apart in the height direction (e.g., z-axis direction) of the electronic device 300. You can. For example, the cooling unit opening 341 of the cooling unit 340 may be positioned at a distance from the inlet opening 311 of the housing 310 in the positive z-axis direction. Since the cooling unit opening 341 and the inlet opening 311 are positioned spaced apart in the height direction (e.g., z-axis direction) of the electronic device 300, external air (IN-AIR) cools through the inlet opening 311. It may be easy to flow into the secondary opening 341.

In one embodiment, the cooling unit 340 may include a thermoelectric device and/or a cooling fan. The cooling device included in the cooling unit 340 according to one embodiment may produce relatively small noise generated from the device itself compared to other cooling devices. The cooling device included in the cooling unit 340 discharges external air (IN-AIR) introduced into the electronic device 300 through the inlet opening 311 to the outside of the electronic device 300 to cool the heat radiation member 330 and the heat dissipation member 330. The electronic device 300 can be cooled.

In one embodiment, the cooling unit 340 may include a thermoelectric device. The thermoelectric device can cool the electronic device 300 by absorbing heat energy emitted as electrons move on one side and emitting it on the other side. A thermoelectric device may produce relatively smaller noise compared to other cooling devices (e.g., cooling fans).

In one embodiment, the cooling unit 340 may include a cooling fan. The cooling fan included in the cooling unit 340 may be compact so that it can be placed in the electronic device 300 having a thin thickness.

Although it has been described that the cooling unit 340 may include a thermoelectric element device and/or a cooling fan, this is an example, and the cooling device included in the cooling unit 340 may not be limited thereto.

Figure 4 is a conceptual diagram showing a heat dissipation member 330 according to an embodiment of the present disclosure.

In describing the heat dissipation member 330 according to an embodiment of the present disclosure, the longitudinal direction of the heat dissipation member 330 refers to the direction in which the heat dissipation member 330 is formed to be relatively long, and the width direction of the heat dissipation member 330 may refer to the direction in which the heat dissipation member 330 is formed to be relatively short.

The heat dissipation member 330 according to an embodiment of the present disclosure may include a first area 331, a second area 332, and/or a connection area 333. The second area 332 may be located at one end and the other end of the first area 331 . The connection area 333 may be an area that connects the first area 331 and the second area 332.

In one embodiment, the electronic component 360 may be located in one direction of the first area 331. Heat generated from the electronic component 360 may be transferred to the first region 331 of the heat dissipation member 330. Heat generated from the electronic component 360 may be transferred to the second area 332 through the first area 331 and the connection area 333.

In one embodiment, the cooling unit 340 may be disposed on the heat dissipation member 330. For example, two cooling units 340 may be disposed in each of the two second areas 332 included in the heat dissipation member 330.

In FIG. 4, two cooling units 340 are shown as being disposed in the second area 332 of the heat dissipation member 330, however, this is an example, and the number and arrangement of the cooling units 340 are not limited thereto. It may not be possible. For example, only one cooling unit 340 may be disposed in one of the two second areas 332 .

In one embodiment, the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330. The cooling unit 340 may be in contact with the second region 332 of the heat dissipation member 330 to cool the heat of the heat dissipation member 330.

In one embodiment, one surface of the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330. For example, the entire surface of the cooling unit 340 may be in contact with the second area 332 to cool the heat of the heat dissipation member 330.

In one embodiment, the area where the cooling unit 340 is in contact with the second area 332 of the heat dissipation member 330 may be substantially equal to the area of one surface of the second area 332. For example, the area of the surface of the second area 332 facing the cooling unit 340 may be substantially equal to the area of the surface of the cooling unit 340 in contact with the second area 332. .

In one embodiment, the cooling unit 340 may include a cooling unit opening 341. For example, the cooling unit 340 may include a plurality of cooling unit openings 341 through which external air (IN-AIR) can flow. A plurality of cooling unit openings 341 may be arranged on one side of the cooling unit 340 at predetermined intervals from each other.

In one embodiment, external air (IN-AIR) may be introduced into the cooling unit 340 through the opening 341 of the cooling unit 340. External air (IN-AIR) may serve to cool the heat of the heat dissipation member 330.

In one embodiment, the cooling unit 340 supplies exhaust air (OUT-AIR) to the outside of the cooling unit 340 through a cooling device (e.g., a thermoelectric device, a cooling fan, and/or a piezo device) included therein. can be discharged. For example, the cooling unit 340 may discharge exhaust air (OUT-AIR) in a direction toward the side (210c, see FIG. 5b) of the housing 310 (see FIG. 5b). Exhaust air (OUT-AIR) may be air that receives heat from the heat dissipation member 330 and has a higher temperature than external air (IN-AIR).

FIGS. 5A and 5B are diagrams showing an electronic device 300 according to an embodiment of the present disclosure.

FIG. 5A is an exploded perspective view of an electronic device 300 according to an embodiment of the present disclosure.

FIG. 5B is a perspective view of an electronic device 300 according to an embodiment of the present disclosure. FIG. 5B is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, the cooling unit 340, and/or the fixing member 370 are disposed inside the housing 310.

Referring to FIG. 5B, a portion of the housing 310 is shown in a transparent state, but this is an example to show the components disposed inside the housing 310, and the shape of the housing 310 may not be limited thereto. there is.

5A and 5B, the electronic device 300 according to an embodiment of the present disclosure includes a housing 310, a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, and a bracket 350. ), electronic components 360, and/or fixing members 370.

In describing the electronic device 300 according to an embodiment of the present disclosure, the first direction may refer to the negative z-axis direction, and the second direction may refer to the positive z-axis direction.

In one embodiment, housing 310 may include a first side 310a and/or a second side 310b. The first surface 310a may be located in a second direction based on the second surface 310b.

In one embodiment, the first side 310a of the housing 310 and the second side 310b of the housing 310 may include a plate shape extending along the longitudinal and width directions of the electronic device 300. there is.

In one embodiment, a printed circuit board 320, a heat dissipation member 330, a cooling unit 340, a bracket 350, and an electronic device are provided between the first side 310a and the second side 310b of the housing 310. Component 360 and/or fixation member 370 may be disposed.

In one embodiment, a printed circuit board 320 may be disposed on the first side 310a of the housing 310. For example, the printed circuit board 320 may be disposed in a first direction (eg, negative z-axis direction) with respect to the first surface 310a of the housing 310.

In one embodiment, the electronic component 360 may be disposed on one side of the printed circuit board 320. For example, the electronic component 360 may be disposed on a side of the printed circuit board 320 that faces the first direction.

In one embodiment, a plurality of printed circuit boards 320 may be disposed on the first surface 310a of the housing 310. An installation space 320a in which the printed circuit board 320 is not disposed may be formed between the plurality of printed circuit boards 320 .

In one embodiment, the installation space 320a is formed in one printed circuit board 320 even in an area where the printed circuit board 320 is not disposed (e.g., a groove or opening formed inside the printed circuit board 320). It could be.

In one embodiment, the bracket 350 may include a shape that surrounds at least a portion of the heat dissipation member 330. For example, the bracket 350 may have a shape surrounding the second area 332 (see FIG. 4) of the heat dissipation member 330. The second region 332 (see FIG. 4) of the heat dissipation member 330 may be placed on the bracket 350 and then fixed, thereby fixing the position of the heat dissipation member 330.

Referring to FIG. 5A, the bracket 350 is a rectangle extending in the length direction (e.g., x-axis direction) and width direction (e.g., y-axis direction) of the electronic device 300 so that the heat dissipation member 330 can be disposed. Although it is shown as including a cross-section, this is an example, and the shape included in the bracket 350 may not be limited to this.

In one embodiment, the bracket 350 may include various shapes so that at least a portion of the heat dissipation member 330 can be disposed. For example, when a part of the heat dissipation member 330 has a polygonal shape rather than a square, the bracket 350 has a square shape corresponding to a part of the heat dissipation member 330 so that the part of the heat dissipation member 330 can be placed. It may also contain non-polygonal shapes.

In one embodiment, the bracket 350 may be located on the opposite side of the cooling unit 340 with respect to the heat dissipation member 330. For example, based on the heat dissipation member 330, the bracket 350 may be disposed in a direction toward the first surface 310a of the housing 310, and the cooling unit 340 may be disposed on the first surface 310a of the housing 310. It may be placed in a direction facing the second surface 310b.

In one embodiment, the bracket 350 may serve to fix the positions of the heat dissipation member 330 and the cooling unit 340. Additionally, the bracket 350 may serve to fix the position of the heat dissipation member 330 so that it is spaced apart from the first surface 310a of the housing 310.

In one embodiment, when the electronic device 300 includes the bracket 350 and the heat dissipation member 330 is disposed to be spaced apart from the first surface 310a of the housing 310, the heat of the heat dissipation member 330 Direct transmission to the first surface 310a of this housing 310 can be prevented. Since the heat of the heat dissipation member 330 is prevented from being directly transferred to the first surface 310a of the housing 310, the user of the electronic device 300 can use the keyboard placed on the first surface 310a of the housing 310. (380, see FIG. 3) may be easy to use.

In one embodiment, the bracket 350 may be disposed in the installation space 320a formed between a plurality of printed circuit boards 320 and/or in the installation space 320a formed inside one printed circuit board 320. You can.

In one embodiment, at least a portion of the heat dissipation member 330 may be disposed on the bracket 350 and at least a portion may be disposed on the printed circuit board 320 . For example, a portion of the heat dissipation member 330 (e.g., one end and the other end of the heat dissipation member 330) may be disposed in a first direction (e.g., negative z-axis direction) with respect to the bracket 350. there is.

Referring to FIGS. 5A and 5B , a portion of the heat dissipation member 330 may be disposed in a first direction (eg, negative z-axis direction) with respect to the printed circuit board 320 . For example, a portion of the heat dissipation member 330 may be disposed in the first direction at a position overlapping the printed circuit board 320 and the electronic component 360 disposed on the printed circuit board 320. The heat dissipation member 330 may receive heat generated from the printed circuit board 320 and the electronic component 360.

In one embodiment, the fixing member 370 may be disposed on the heat dissipation member 330. For example, the fixing member 370 may be disposed in a second direction (eg, positive z-axis direction) with respect to the heat dissipation member 330 . The fixing member 370 may be disposed in a first direction with respect to the electronic component 360 disposed on the printed circuit board 320. The fixing member 370 is in contact with the electronic component 360 and can fix the positions of the electronic component 360 and the printed circuit board 320 with respect to the heat dissipation member 330.

In one embodiment, the cooling unit 340 may be disposed in a first direction with respect to the heat dissipation member 330. The heat dissipation member 330 may be in contact with the cooling unit 340 at least partially. For example, the heat dissipation member 330 has one end (e.g., the distal end facing the negative x-axis direction in the heat dissipation member 330) and the other end (e.g., the positive x-axis direction in the heat dissipation member 330). The distal end facing the x-axis direction may be in contact with the cooling unit 340. The cooling unit 340 may serve to cool the heat of the heat dissipation member 330.

In one embodiment, the second surface 310b of the housing 310 may be located in a first direction with respect to the heat dissipation member 330 and the cooling unit 340. The second surface 310b of the housing 310 may be formed in a shape corresponding to the first surface 310b of the housing 310. For example, the first side 310a and the second side 310b of the housing 310 are aligned along the length direction (e.g., x-axis direction) and width direction (e.g., y-axis direction) of the electronic device 300. It may extend by substantially the same length.

In one embodiment, the second surface 310b of the housing 310 may be coupled at least in part to the first surface 310b of the housing 310.

In one embodiment, the second side 310b of the housing 310 may include an inlet opening 311. External air (IN-AIR) may flow into the cooling unit 340 inside the electronic device 300 through the inlet opening 311.

In one embodiment, the housing 310 may include a side surface 310c surrounding the space between the first surface 310a and the second surface 310b. The side 310c of the housing 310 may include a discharge opening 312 at least in part.

In one embodiment, the side 310c of the housing 310 where the discharge opening 312 is disposed may be a side 310c located relatively close to the cooling unit 340 among the side surfaces 310c of the housing 310. . For example, the discharge opening 312 may be formed on the side 310c of the housing 310 facing the positive y-axis direction with respect to the electronic device 300.

In one embodiment, the exhaust air (OUT-AIR) discharged from the cooling unit 340 may be discharged to the outside of the electronic device 300 through the exhaust opening 312 formed on the side 310c of the housing 310. .

FIGS. 6A, 6B, and 6C are diagrams showing the housing 310, the printed circuit board 320, the heat dissipation member 330, and the cooling unit 340 according to an embodiment of the present disclosure.

FIG. 6A is a diagram showing the printed circuit board 320 disposed in the housing 310.

FIG. 6B is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, and/or the bracket 350 are disposed in the housing 310.

FIG. 6C is a diagram showing a state in which the printed circuit board 320, the heat dissipation member 330, the bracket 350, and/or the cooling unit 340 are disposed in the housing 310.

The housing 310 shown in FIGS. 6A, 6B, and 6C may refer to the first side 310a of the housing 310 shown in FIGS. 5A and 5B.

Referring to FIG. 6A , the printed circuit board 320 may be placed on one side of the housing 310 . Figure 6a shows two printed circuit boards 320 disposed on one side of the housing 310, but this is an example and the number of printed circuit boards 320 disposed on the housing 310 is not limited to this. You can. For example, two or more printed circuit boards 320 may be placed in the housing 310, or one printed circuit board 320 may be placed in the housing 310.

Referring to FIG. 6A, an installation space 320a may be formed in an area where the printed circuit board 320 is not disposed. For example, the printed circuit board 320 is not disposed to cover the entire one side of the housing 310, but is disposed to cover only a portion of one side of the housing 310, so an area in which the printed circuit board 320 is not disposed. An installation space 320a may be formed in . The installation space 320a may be a space where the bracket 350 and a portion of the heat dissipation member 330 are disposed.

Referring to FIG. 6B, in one embodiment, the bracket 350 may be placed in the installation space 320a. The bracket 350 is disposed in the installation space 320a and at least a portion of it may be fixed to the housing 310.

Referring to FIG. 6B , the heat dissipation member 330 may be formed to extend in the length direction (e.g., x-axis direction) and the width direction (e.g., y-axis direction) of the electronic device 300. For example, the heat dissipation member 330 may extend in the longitudinal and width directions of the electronic device 300 so that at least a portion of the heat dissipation member 330 overlaps the electronic component 360 .

Referring to FIGS. 6A and 6B , the heat dissipation member 330 may extend toward the installation space 320a around the position where the electronic component 360 is disposed. For example, the heat dissipation member 330 may be formed to extend in the negative x-axis direction and the positive x-axis direction toward the installation space 320a based on the x-axis direction position where the electronic component 360 is disposed. .

In one embodiment, a portion of the heat dissipation member 330 (eg, the second area 332 (see FIG. 4)) may be disposed on the bracket 350. A portion of the heat dissipation member 330 may be placed on the bracket 350 and the position of the entire heat dissipation member 330 may be fixed.

Referring to FIGS. 6A and 6B , a portion of the heat dissipation member 330 (eg, the first area 331 (see FIG. 4 )) may be disposed at a position overlapping the printed circuit board 320 . For example, a portion of the heat dissipation member 330 may be disposed in a position overlapping with the printed circuit board 320 and the electronic component 360 disposed on the printed circuit board 320.

Referring to FIG. 6B, a fixing member 370 may be disposed on at least a portion of the heat dissipation member 330. The fixing member 370 may be disposed on the side of the heat dissipation member 330 that faces the printed circuit board 320.

Referring to FIGS. 6A and 6B , the fixing member 370 may be disposed at a position overlapping the electronic component 360 . The fixing member 370 may be in contact with the electronic component 360. The fixing member 370 may serve to fix the relative positions of the electronic component 360 and the heat dissipation member 330. The electronic component 360 and the heat dissipation member 330 are disposed with the fixing member 370 therebetween, and their relative positions may be fixed. The position of the electronic component 360 is fixed through the fixing member 370, and heat generated from the electronic component 360 can be more easily transferred to the heat dissipation member 330.

Referring to FIG. 6C, the cooling unit 340 may be disposed in a portion of the heat dissipation member 330 (e.g., the second area 332 (see FIG. 4)). For example, the cooling unit 340 may be disposed on a portion of the heat dissipation member 330 disposed on the bracket 350. The cooling unit 340 may be disposed on the opposite side of the heat dissipation member 330 from the side on which the bracket 350 is disposed.

Referring to FIG. 6C, the cooling unit 340 may include a cooling unit opening 341 at least in part. External air (IN-AIR, see FIG. 4) may flow into the cooling unit 340 through the cooling unit opening 341. A plurality of cooling unit openings 341 may be arranged at intervals in the length direction (eg, x-axis direction) and width direction (eg, y-axis direction) of the electronic device 300.

7A and 7B are diagrams showing a heat dissipation member 330 and a cooling unit 340 according to an embodiment of the present disclosure.

FIG. 7A is a diagram illustrating the heat dissipation member 330 viewed from a direction perpendicular to the longitudinal direction (e.g., x-axis direction) and the width direction (e.g., y-axis direction) of the electronic device 300.

FIG. 7B is a diagram illustrating the heat dissipation member 330 viewed from a direction perpendicular to the longitudinal direction (e.g., x-axis direction) and the height direction (e.g., z-axis direction) of the electronic device 300.

Referring to FIGS. 7A and 7B , the heat dissipation member 330 may be formed to extend in the longitudinal and width directions of the electronic device 300. The heat dissipation member 330 may include a plate shape having a predetermined thickness in the height direction of the electronic device 300.

In one embodiment, the heat dissipation member 330 may include a first area 331, a second area 332, and/or a connection area 333. The first area 331 may be an area where the fixing member 370 is disposed. The second area 332 may be an area where the cooling unit 340 is disposed.

Referring to FIG. 7A, the heat dissipation member 330 according to one embodiment may include a coupling region 3321 at least in part. The coupling area 3321 may be an area where the heat dissipation member 330 and the bracket 350 (see FIG. 5A) are coupled to each other.

Referring to FIG. 7A, the heat dissipation member 330 according to one embodiment may include a plurality of coupling regions 3321. A plurality of coupling regions 3321 may be formed in the second region 332 of the heat dissipation member 330 where the cooling unit 340 is disposed. Referring to FIG. 7B, the heat dissipation member 330 is shown as including eight coupling regions 3321. However, this is an example, and the number of coupling regions 3321 included in the heat dissipation member 330 is not limited to this. It may not be possible.

Referring to FIG. 7B, the two second regions 332 may be arranged in a symmetrical manner with respect to the first region 331. For example, with respect to the first area 331, two second areas 332 may be arranged symmetrically in the positive x-axis direction and the negative x-axis direction.

In FIG. 7B, the two second areas 332 are shown as arranged symmetrically with respect to the first area 331. However, this is an example, and the two second areas 332 may be arranged in an asymmetric form. You can. For example, the second area 332 located in the positive x-axis direction with respect to the first area 331 is connected to the second area 332 located in the negative x-axis direction with respect to the first area 331. Compared to this, the electronic device 300 may be formed longer or shorter in the longitudinal direction (eg, x-direction).

Referring to FIGS. 5A, 6A, and 7B, one electronic component 360 is located at the center of the first region 331 of the heat dissipation member 330 (e.g., the center in the x-axis direction with respect to the first region 331). ), but this is an example, and the number and arrangement of the electronic components 360 may not be limited thereto. For example, a plurality of electronic components 360 may be disposed on the printed circuit board 320 to transfer heat to the heat dissipation member 330.

In one embodiment, the shape of the heat dissipation member 330 may vary depending on the number and/or arrangement of the electronic components 360 (see FIG. 5A). Depending on the number and/or arrangement of the electronic components 360 (see FIG. 5A), the two second regions 332 may be arranged asymmetrically with respect to the first region 331. For example, if a plurality of electronic components 360 (see FIG. 5A) are disposed relatively close to one end of the first region 331 (e.g., the end of the first region 331 in the positive x-axis direction), the first The second area 332 is connected to one end of the area 331, and the cooling unit 340 disposed in the second area 332 is connected to the second area 332 and the other end of the first area 331. Compared to the portion 340, the electronic device 300 may be formed to be longer in the longitudinal direction (e.g., x-axis direction) and width direction (e.g., y-axis direction).

In one embodiment, the first area 331 and the second area 332 may be arranged to be spaced apart in the height direction (eg, z-axis direction) of the electronic device 300. The second area 332 may be located at a distance from the first area 331 in the positive z-axis direction.

In one embodiment, the connection area 333 may be an area that connects the first area 331 and the second area 332. For example, the connection area 333 may be connected to the first area 331 at one end and to the second area 332 at the other end.

In one embodiment, the fixing member 370 and the cooling unit 340 may be disposed on opposite sides of the heat dissipation member 330. For example, the fixing member 370 may be disposed in the positive z-axis direction with respect to the heat dissipation member 330, and the cooling unit 340 may be disposed in the negative z-axis direction with respect to the heat dissipation member 330. there is.

Referring to FIG. 7B, one surface of the cooling unit 340 according to one embodiment is aligned with one surface of the first area 331 of the heat dissipation member 330 and the height direction (e.g., z-axis direction) of the electronic device 300. It can be placed in the same position as a reference. For example, the first area 331 of the heat dissipation member 330 is disposed at a position spaced apart from the second area 332 in the negative z-axis direction, and the cooling unit disposed in the second area 332 ( The thickness of 340 (e.g., the length of the cooling unit 340 in the z-axis direction) may be substantially equal to the distance between the first area 331 and the second area 332. The cooling unit 340 is disposed in the second area 332, and the side of the cooling unit 340 facing the negative z-axis direction and the side of the first area 331 facing the negative z-axis direction are z. The axial positions may be arranged substantially on the same plane. One surface of the cooling unit 340 and one surface of the first area 331 are disposed on substantially the same plane, so that the heat dissipation member 330 and the cooling unit 340 are disposed inside the electronic device 300 having a thin thickness. It can be easy.

Referring to FIG. 7B , the connection area 333 may extend along a direction inclined by the connection inclination angle AG1 with respect to the first area 331 and the second area 332 . For example, the connection area 333 is formed by extending in a direction inclined by the connection inclination angle AG1 toward the positive z-axis direction based on the direction in which the first area 331 extends (e.g., x-axis direction). It can be. Alternatively, the connection area 333 may be formed to extend in a direction inclined by the connection inclination angle AG1 toward the negative z-axis direction based on the direction in which the second area 332 extends (e.g., x-axis direction). .

In one embodiment, the connection inclination angle AG1 may be formed within a predetermined angle range. For example, the connection inclination angle AG1 may be formed within a range of approximately 7 degrees to 15 degrees. Since the connection inclination angle AG1 is formed within a predetermined angle range, it may be advantageous for the heat dissipation member 330 to be placed in an electronic device having a thin thickness (eg, a slim laptop).

In FIG. 7B, the connection area 333 is shown to extend in a straight line along a direction inclined by the connection inclination angle AG1 with respect to the first area 331 and the second area 332, but this is an example. The form in which the connection area 333 extends may not be limited to this. The connection area 333 may not extend in a straight line between the first area 331 and the second area 332, but may extend including a curve at least in part. For example, the connection area 333 may include a curved surface with a predetermined radius of curvature, or may include a shape that is curved at least in part.

In one embodiment, the thickness t of the heat dissipation member 330 may be formed within a predetermined length range. For example, the thickness t of the heat dissipation member 330 may be approximately 0.7 mm to 1.2 mm. The thickness (t) of the heat dissipation member 330 may refer to the length over which the heat dissipation member 330 extends in the height direction (eg, z-axis direction) of the electronic device 300.

In one embodiment, the thickness t of the first region 331, the second region 332, and the extended region 333 of the heat dissipation member 330 may be formed to have substantially the same length. For example, the thickness (t) of the first region 331, the second region 332, and the extended region 333 may all have substantially the same value within the range of approximately 0.7 mm to 1.2 mm.

In the heat dissipation member 330 according to one embodiment, the thickness of the extended area 333 may be different from the thickness of the remaining areas excluding the extended area 333. For example, the thickness t of the extended region 333 may be formed to have a length different from the thickness t of the first region 331 and the second region 332 . The thickness t of the extended region 333 may be longer or shorter than the thickness t of the first region 331 and the second region 332 .

FIGS. 8A, 8B, and 8C are diagrams showing a heat dissipation member 330 disposed in the electronic device 300 according to an embodiment of the present disclosure.

FIG. 8A is a diagram showing cross-section lines A-A' and cross-section lines B-B' in the electronic device 300.

FIG. 8B is a diagram showing the electronic device 300 viewed along the cross-sectional line A-A' shown in FIG. 8A. For example, FIG. 8B is a cross-sectional view of the electronic device 300 of FIG. 8A by cutting it along the A-A' cross-section line parallel to the longitudinal direction (e.g., x-axis direction) of the electronic device 300. It can be.

FIG. 8C is a diagram showing the electronic device 300 viewed along the section line B-B' shown in FIG. 8A. For example, FIG. 8C is a cross-sectional view of the electronic device 300 of FIG. 8A by cutting it along the B-B' cross-section line parallel to the width direction (e.g., y-axis direction) of the electronic device 300. It can be.

Referring to FIGS. 8A and 8B , the electronic device 300 according to an embodiment of the present disclosure may include a housing 310 and/or a keyboard 380. The keyboard 380 may be placed on the first side 310a of the housing 310.

Referring to FIGS. 8B and 8C , the housing 310 may include a first side 310a and/or a second side 310b. The second surface 310b may be positioned at a distance from the first surface 310a in the height direction (eg, z-axis direction) of the electronic device 300.

Referring to FIGS. 8B and 8C, a heat dissipation member 330, a cooling unit 340, a printed circuit board 320, and/or Electronic components 360 may be disposed. For example, the printed circuit board 320, the heat dissipation member 330, the cooling unit 340, and/or the electronic component 360 are located in the positive z-axis direction based on the second side 310b of the housing 310. This can be placed.

In one embodiment, the printed circuit board 320 and the cooling unit 340 may be located in different directions with respect to the heat dissipation member 330. For example, based on the heat dissipation member 330, the printed circuit board 320 may be located in the positive z-axis direction, and the cooling unit 340 may be located in the negative z-axis direction.

In one embodiment, the printed circuit board 320 and the cooling unit 340 may be disposed in different areas of the heat dissipation member 330. For example, the printed circuit board 320 may be disposed in a position overlapping the first area 331 of the heat dissipation member 330. The cooling unit 340 may be disposed in a position overlapping with the second area 332 of the heat dissipation member 330.

In one embodiment, the longitudinal end of the electronic device 300 may mean an end of the electronic device 300 that faces the longitudinal direction of the electronic device 300. For example, the longitudinal end of the electronic device 300 may mean an end of the electronic device 300 that faces the positive x-axis direction or the negative x-axis direction with respect to the electronic device 300.

In one embodiment, the end of the electronic device 300 in the width direction may refer to the end of the electronic device 300 facing the width direction of the electronic device 300. For example, the end of the electronic device 300 in the width direction may mean an end of the electronic device 300 that faces the positive y-axis direction or the negative y-axis direction with respect to the electronic device 300.

Referring to FIG. 8B , the heat dissipation member 330 may be disposed at a distance from the longitudinal end of the electronic device 300. For example, the heat dissipation member 330 may be disposed at a distance in the negative x-axis direction from the end facing the positive x-axis direction in the electronic device 300.

Referring to FIG. 8C , the heat dissipation member 330 may be disposed at a distance from the end of the electronic device 300 in the width direction. For example, the heat dissipation member 330 may be disposed at a distance in the negative y-axis direction from the end facing the positive y-axis direction in the electronic device 300.

In one embodiment, internal components of the electronic device 300 excluding the heat dissipation member 330 may be disposed between the heat dissipation member 330 and the end of the electronic device 300. For example, referring to FIG. 8B, based on the longitudinal direction (e.g., x-axis direction) of the electronic device 300, there is at least a distance between the longitudinal end of the electronic device 300 and the point where the parallel member 330 is disposed. One or more printed circuit boards 320 may be placed.

The electronic device 300 according to an embodiment of the present disclosure may include a housing 310, a printed circuit board 320, a heat dissipation member 330, and/or a cooling unit 340.

In one embodiment, the housing 310 has a first surface 310a on which the keyboard 380 is disposed, is located on the opposite side of the first surface 310a, and has an inlet opening through which external air (IN-AIR) flows in. It may include a second side 310b including 311).

In one embodiment, at least one electronic component 360 may be disposed on the printed circuit board 320 .

In one embodiment, the heat dissipation member 330 is disposed between the first surface 310a and the second surface 310b, extends along the longitudinal direction of the housing 310, and generates heat in the electronic component 360. The heat can be transferred.

In one embodiment, the cooling unit 340 may cool the heat dissipation member 330 by allowing external air (IN-AIR) to flow into the cooling unit 340.

In one embodiment, the heat dissipation member 330 is spaced apart from the first area 331, where the printed circuit board is disposed, at one end and the other end of the first area 331 in the longitudinal and height directions of the electronic device 300. They are located apart from each other and may include two second areas 332 where the cooling unit 340 is disposed and a connection area connecting the first area 331 and the second area 332.

In one embodiment, the printed circuit board 320 and the cooling unit 340 may be located on opposite sides of the heat dissipation member 330.

In one embodiment, the housing 310 may further include a side 310c that surrounds the space between the first side 310a and the second side 310b and includes a discharge opening 312.

In one embodiment, outside air (IN-AIR) flows into the electronic device 300 through the inlet opening 311 of the second side 310b and enters the electronic device 300 through the outlet opening 312 of the side 310c. (300) Can be discharged to the outside.

In one embodiment, the connection area 333 may be formed to extend along a direction inclined by the connection inclination angle AG1 based on the direction in which the first area 331 extends.

In one embodiment, the connection inclination angle AG1 may range from 7 degrees to 15 degrees.

In one embodiment, the heat dissipation member 330 may be formed such that the first region 331 and the second region 332 have the same thickness.

In one embodiment, the electronic device 300 may further include a bracket 350 disposed on the first surface 310a of the housing 310 and fixing the heat dissipation member 330 to the electronic device 300. there is.

In one embodiment, the second region 332 of the heat dissipation member 330 may be placed and fixed to the bracket 350.

In one embodiment, the electronic device 300 includes a plurality of printed circuit boards 320, and the bracket 350 may be disposed in the installation space 320a formed between the plurality of printed circuit boards 320. there is.

In one embodiment, the position of the heat dissipation member 330 is fixed by the bracket 350 and may be arranged to be spaced apart from the first surface 310a of the housing 310.

In one embodiment, the cooling unit 340 may include a cooling unit opening 341 through which external air (IN-AIR) flows.

In one embodiment, the inlet opening 311 of the second surface 310b of the housing 310 and the cooling unit opening 341 of the cooling unit 340 are positioned spaced apart in the height direction of the electronic device 300. You can.

In one embodiment, the first area 331 of the heat dissipation member 330 may be located closer to the second surface 310b of the housing 310 than the second area 332.

In one embodiment, at least a portion of one surface of the first area 331 and one surface of the cooling unit 340 may be disposed at the same position based on the height direction of the electronic device 300.

In one embodiment, the electronic component 360 may be disposed in a position that overlaps at least a portion of the first area 331 of the heat dissipation member 330.

In one embodiment, the electronic device 300 may further include a fixing member 370 disposed in the first area 331 of the heat dissipation member 330.

In one embodiment, the fixing member 370 may fix the electronic component 360 so that its position does not change with respect to the first area 331 of the heat dissipation member 330.

In one embodiment, the cooling unit 340 may allow external air (IN-AIR) to flow into the electronic device 300 through the inlet opening 311.

In one embodiment, the cooling unit 340 may discharge external air (IN-AIR) to the outside of the electronic device 300 through the discharge opening 312 on the side 310c.

In one embodiment, the cooling unit 340 and one entire surface of the cooling unit 340 may be in contact with the second area 332 of the heat dissipation member 330.

In one embodiment, the printed circuit board heat dissipation structure includes a printed circuit board 320 on which at least one electronic component 360 is disposed, a heat dissipation member 330 that receives heat generated from the electronic component 360, and a heat dissipation member. It may include a cooling unit 340 that cools 330 .

In one embodiment, the heat dissipation member 330 of the printed circuit board heat dissipation structure includes a first area 331 where the printed circuit board 320 is disposed, and a printed circuit board heat dissipation structure at one end and the other end of the first area 331. are positioned at a distance from each other in the longitudinal and height directions, two second areas 332 where the cooling unit 340 is disposed, and a connection area 333 connecting the first area 331 and the second area 332. ) may include.

In one embodiment, in the printed circuit board heat dissipation structure, the printed circuit board 320 and the cooling unit 340 may be located on opposite sides of the heat dissipation member 330.

An electronic device according to an embodiment of the present disclosure may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the above-mentioned devices.

An embodiment of the present disclosure and the terms used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. In the present disclosure, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

One embodiment of the present disclosure is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

The method according to an embodiment of the present disclosure may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to one embodiment, each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components. . According to one embodiment, one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to one embodiment, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In the electronic device 300,
It includes a first surface 310a on which the keyboard 380 is placed, and a second surface 310b located on the opposite side of the first surface and including an inlet opening 311 through which external air (IN-AIR) flows. housing 310;
a printed circuit board 320 on which at least one electronic component 360 is disposed;
a heat dissipation member 330 disposed between the first surface and the second surface, extending along the longitudinal direction of the housing, and receiving heat generated from the electronic component; and
It includes a cooling unit 340 through which the external air flows and cools the heat dissipation member,
The heat dissipation member is,
a first area 331 where the printed circuit board is disposed;
two second regions 332 located at one end and the other end of the first region at a distance from each other in the longitudinal and height directions of the electronic device and in which the cooling unit is disposed; and
It includes a connection area 333 connecting the first area and the second area,
An electronic device wherein the printed circuit board and the cooling unit are located on opposite sides of the heat dissipation member. According to clause 1,
The housing is,
It further includes a side (310c) surrounding the space between the first side and the second side and including a discharge opening (312),
The external air flowing into the electronic device through the inlet opening on the second side is discharged outside the electronic device through the outlet opening on the side. According to clause 1,
The connection area is,
An electronic device formed by extending along a direction inclined by a connection inclination angle AG1 based on the direction in which the first region extends. According to clause 3,
An electronic device in which the connection inclination angle is formed from 7 degrees to 15 degrees. According to clause 1,
The heat dissipation member is,
An electronic device in which the first region and the second region have the same thickness (t). According to clause 1,
It is disposed on the first side of the housing and further includes a bracket 350 that secures the heat dissipation member to the electronic device,
The second region of the heat dissipation member is disposed and fixed to the bracket. According to clause 6,
It includes a plurality of printed circuit boards,
The bracket is an electronic device disposed in an installation space (320a) formed between the plurality of printed circuit boards. According to clause 6,
The heat dissipation member is,
An electronic device whose position is fixed by the bracket and arranged to be spaced apart from the first surface of the housing. According to clause 1,
The cooling unit,
It includes a cooling opening 341 through which the external air flows,
An electronic device wherein the inlet opening of the second side of the housing and the cooling unit opening of the cooling unit are spaced apart in the height direction of the electronic device. According to clause 1,
The first area of the heat dissipation member is located closer to the second surface of the housing than the second area,
An electronic device wherein one surface of the first area and at least a portion of one surface of the cooling unit are disposed at the same position based on the height direction of the electronic device. According to clause 1,
The electronic components are,
An electronic device disposed in a position overlapping with at least a portion of the first area of the heat dissipation member. According to claim 11,
It further includes a fixing member 370 disposed in a first area of the heat dissipation member,
The fixing member is,
An electronic device that fixes the electronic component so that its position does not change with respect to the first area of the heat dissipation member. According to clause 2,
The cooling unit,
An electronic device that allows the outside air to be introduced into the electronic device through the inlet opening, and the outside air is discharged outside the electronic device through the discharge opening on the side. According to clause 1,
The cooling unit,
An electronic device in which the entire surface of the cooling unit is in contact with the second area of the heat dissipation member. In the printed circuit board heat dissipation structure,
a printed circuit board 320 on which at least one electronic component 360 is disposed;
A heat dissipation member 330 that receives heat generated from the electronic component; and
It includes a cooling unit 340 that cools the heat radiation member,
The heat dissipation member is,
a first area 331 where the printed circuit board is disposed;
two second regions 332 located at one end and the other end of the first region 331 at a distance from each other in the longitudinal and height directions of the printed circuit board heat dissipation structure and in which the cooling unit is disposed; and
It includes a connection area 333 connecting the first area and the second area,
A printed circuit board heat dissipation structure in which the printed circuit board and the cooling unit are located on opposite sides of the heat dissipation member. According to clause 15,
The connection area is,
A printed circuit board heat dissipation structure formed by extending along a direction inclined by a connection inclination angle AG1 based on the direction in which the first region extends. According to clause 15,
The heat dissipation member is,
A printed circuit board heat dissipation structure wherein the first region and the second region have the same thickness (t). According to clause 15,
The electronic components are,
A printed circuit board heat dissipation structure disposed in a position overlapping with at least a portion of the first area of the heat dissipation member. According to clause 15,
It further includes a fixing member 370 disposed in a first area of the heat dissipation member,
The fixing member is,
A printed circuit board heat dissipation structure that fixes the electronic component so that its position does not change with respect to the first area of the heat dissipation member. According to clause 15,
The cooling unit,
A printed circuit board heat dissipation structure in which the entire surface of the cooling unit is in contact with the second area of the heat dissipation member.

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