KR20240036987A - Camera device and optical instrument including the same - Google Patents

Abstract

The embodiment includes a fixing part including a cover member including a top plate and a side plate connected to the top plate, a holder disposed within the cover member, a first circuit board disposed on the holder, and an image sensor electrically connected to the first circuit board. A support part coupled to the movable part and the holder and supporting the movable part with respect to the fixed part, the holder including a side part, a corner part, and a stopper protruding from the outer surface of the side part of the holder toward the side plate of the cover member; , the stopper is disposed closer to the center of the side part of the holder than to the corner part of the holder.

Description

{CAMERA DEVICE AND OPTICAL INSTRUMENT INCLUDING THE SAME}

Embodiments relate to a camera device and an optical device including the same.

It is difficult to apply the voice coil motor (VCM) technology used in existing general camera devices to camera devices for ultra-small size and low power consumption, and related research has been actively conducted.

Demand and production of electronic products such as smartphones and cell phones equipped with cameras are increasing. Cameras for mobile phones are trending towards higher resolution and miniaturization, and actuators are also becoming smaller, larger in diameter, and multi-functional accordingly. In order to implement a high-resolution mobile phone camera, additional functions such as improved mobile phone camera performance and auto focusing, improved shutter shake, and zoom function are required.

The embodiment provides a camera device that can prevent damage or destruction of the OIS moving part due to impact or collision and an optical device including the same.

A camera device according to an embodiment includes a fixing part including a cover member including an upper plate and a side plate connected to the upper plate; a moving unit including a holder disposed within the cover member, a first circuit board disposed on the holder, and an image sensor electrically connected to the first circuit board; and a support part coupled to the holder and supporting the movable part with respect to the fixed part, wherein the holder has side and corner parts, and a stopper protruding from an outer surface of the side of the holder toward the side plate of the cover member. It includes, and the stopper is disposed closer to the center of the side portion of the holder than to the corner portion of the holder. At least a portion of the stopper may pass through the support portion.

The shortest distance between the stopper and the side plate of the cover member may be smaller than the shortest distance between the outer surface of the side portion of the holder and the side plate of the cover member.

The shortest distance between the stopper and the side plate of the cover member may be smaller than the shortest distance between the outer surface of the corner portion of the holder and the side plate of the cover member.

The holder may include a protrusion to which a portion of the support part is coupled, and the stopper may include a first stopper protruding from an outer surface of the protrusion of the holder. The support part is connected to the first circuit board and includes a connection part coupled to the protrusion of the holder, and the first stopper may pass through the connection part.

The holder includes a protrusion to which a portion of the support part is coupled and protrudes in the optical axis direction, and the stopper includes a first stopper located on one side of the protrusion of the holder and a second stopper located on the other side of the protrusion of the holder. may include.

The fixing part includes a base disposed below the cover member and a second circuit board coupled to the base, and the stopper includes a second stopper protruding from the outer surface of the side of the holder toward the base. can do.

The base includes a protrusion to which a portion of the support part engages, the holder includes a groove corresponding to the protrusion of the base and recessed from the outer surface of the side of the holder, and the second stopper is provided in the holder. It may protrude from the bottom surface of the groove toward the protrusion of the base.

The distance between the second stopper and the protrusion of the base may be smaller than the distance between the outer surface of the side portion of the holder and the side plate of the cover member.

When the center of the side of the holder is assumed to be a point that is 50% of the total length of the side of the holder, the stopper may be disposed in an area between 35% and 65% of the length of the side of the holder.

A camera device according to another embodiment includes a fixing part including a cover member; a moving unit including a holder and an image sensor disposed within the cover member; and a support part coupled to the holder and supporting the movable part with respect to the fixed part, wherein the holder moves in a first direction parallel to the optical axis from the outer surface of the first side of the holder toward the first side plate of the cover member. and a first stopper protruding in a second direction perpendicular to the holder, wherein the first stopper may protrude relative to the support portion coupled to the holder.

The holder includes a second stopper that protrudes in a direction opposite to the first stopper from the outer surface of the second side of the holder toward the second side plate of the cover member, and the second stopper is coupled to the holder. It may protrude based on the support portion. The support portion may include a first hole through which a portion of the first stopper passes and a second hole through which the second stopper passes.

The holder includes a third stopper protruding from an outer surface of a third side of the holder in a third direction perpendicular to the first direction and the second direction; and a fourth stopper protruding from an outer surface of the fourth side of the holder in a direction opposite to the third stopper.

The holder includes a first groove formed on an outer surface of the third side of the holder and a second groove formed on an outer surface of the fourth side of the holder, and the third stopper is located in the first groove. It protrudes from the bottom surface, and the fourth stopper may protrude from the bottom surface of the second groove.

Each of the third stopper and the fourth stopper may be located inside the support part.

The protruding length of the third stopper may be smaller than the distance from the outer surface of the third side of the holder to the bottom surface of the first groove, and the protruding length of the fourth stopper may be smaller than the distance from the outer surface of the third side of the holder to the bottom surface of the first groove. It may be smaller than the distance from the outer surface to the bottom surface of the second groove.

The base includes a first protrusion that faces the first groove of the holder and engages a portion of the support portion, and a second protrusion that faces the second groove of the holder and engages another portion of the support portion, The third stopper may face the first protrusion of the base and the fourth stopper may face the second protrusion of the base.

An actuator according to an embodiment includes a fixing part including a cover member including an upper plate and a side plate connected to the upper plate; a moving part including a holder disposed within the cover member and a first circuit board disposed on the holder; and a support part coupled to the holder and supporting the movable part with respect to the fixed part, wherein the holder has side and corner parts, and a stopper protruding from an outer surface of the side of the holder toward the side plate of the cover member. It includes, and the stopper is disposed closer to the center of the side portion of the holder than to the corner portion of the holder.

The embodiment can reduce the gap between the OIS moving part and the fixed part required for OIS operation.

In the embodiment, by reducing the gap, an impact reduction effect can be obtained, thereby preventing damage or breakage of the OIS moving part due to impact or collision.

1 is a perspective view of a camera device according to an embodiment.
Figure 2 is a perspective view of the camera device with the cover member removed.
Figure 3 is an exploded perspective view of the camera device of Figure 1.
FIG. 4A is a cross-sectional view of the camera device in the AB direction of FIG. 1.
FIG. 4B is a cross-sectional view of the camera device in the CD direction of FIG. 1.
FIG. 4C is a cross-sectional view of the camera device in the EF direction of FIG. 1.
Figure 5 is an exploded perspective view of the AF driving unit of Figure 3.
Figure 6 is a perspective view of a bobbin, a sensing magnet, a balancing magnet, a first coil, a circuit board, a first position sensor, and a capacitor.
Figure 7a is a perspective view of the bobbin, housing, circuit board, upper elastic member, sensing magnet, and balancing magnet.
Figure 7b is a perspective view with wires added to Figure 7a.
Figure 8 is a bottom perspective view of the housing, bobbin, lower elastic member, magnet, and circuit board.
Figure 9 is a perspective view of the image sensor unit.
FIG. 10A is a first exploded perspective view of the image sensor unit of FIG. 9 .
FIG. 10B is a second exploded perspective view of the image sensor unit of FIG. 9 .
FIG. 11 is a bottom perspective view of the holder, terminal portion, first substrate portion, support substrate, base, and second substrate portion of FIG. 10A.
Figure 12a is a perspective view of the holder.
Figure 12b is a top view of the holder, the first substrate portion, the image sensor, the second coil, and the OIS position sensor.
Figure 13 is a rear perspective view of the holder and the first substrate portion.
Figure 14 is a perspective view of the base, terminal portion, and wire.
Figure 15 is a bottom view of the first substrate portion, the support substrate, and the heat dissipation member.
Figure 16 is a perspective view of the first substrate portion, the support substrate, and the heat dissipation member.
Figure 17a is a first perspective view of a support substrate coupled to a holder and a base.
Figure 17b is a second perspective view of the support substrate coupled to the holder and the base.
FIG. 17C is a view with the support substrate removed from FIG. 17A.
FIG. 17D is a view with the support substrate removed from FIG. 17B.
Figure 18a is for explaining the movement of the OIS moving part in the X-axis direction.
Figure 18b is for explaining the movement of the OIS moving part in the y-axis direction.
Figure 18c is for explaining the clockwise rotation of the OIS moving part when driving in 4 channels.
Figure 18d is for explaining the counterclockwise rotation of the OIS moving part when driving in 4 channels.
Figure 19a shows an example of the magnet of Figure 5.
Figure 19b shows another example of the magnet of Figure 5.
FIG. 20A shows an example of the arrangement of the first to third areas, the extension area, the AF moving part and the OIS moving part, and the control part of the second substrate part.
FIG. 20B shows a simplified cross-sectional view of the lens module, the first substrate portion, the image sensor, the second substrate portion, and the heat dissipation member.
Figure 21 shows a block diagram of the configuration of the control unit and first to third sensors.
Figure 22 shows a plan view of the holder, base, and cover member.
FIG. 23A is an enlarged view of the first dotted line portion of FIG. 22.
FIG. 23B is an enlarged view of the second dotted line portion of FIG. 22.
Figure 24 is a cross-sectional view of the image sensing unit and the cover member in a direction perpendicular to the optical axis.
Figure 25 is a perspective view of a camera device according to another embodiment.
FIG. 26 is a perspective view of the holder of the camera device shown in FIG. 25.
Figure 27 is a perspective view of a holder according to another embodiment.
28A shows a perspective view of an optical device according to an embodiment.
Figure 28b shows a perspective view of an optical device according to another embodiment.
Figure 29 shows a configuration diagram of the optical device shown in Figures 28A and 28B.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention have meanings that can be generally understood by those skilled in the art to which the present invention pertains, unless specifically defined and described. It can be interpreted as, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as “at least one (or more than one) of A, B, and C,” it can be combined with A, B, and C. It may contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, that component is not only directly connected, coupled or connected to that other component, but also is connected to that component. It may also include cases where other components are 'connected', 'coupled', or 'connected' by another component between them. In addition, when described as being formed or disposed "on top or bottom" of each component, top or bottom refers not only to cases where two components are in direct contact with each other, but also to one component. This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it can include not only the upward direction but also the downward direction based on one component.

Hereinafter, the AF driving unit may be replaced with a lens driving device, lens driving unit, VCM (Voice Coil Motor), actuator, or lens moving device, and the term "coil" hereinafter refers to a coil unit ( coil unit), and the term “elastic member” can be expressed as an elastic unit, or a spring.

Additionally, in the following description, “terminal” may be replaced with a pad, an electrode, a conductive layer, or a bonding portion.

In the following description, “substrate unit”, “printed circuit board”, “circuit board”, or “substrate” may be used interchangeably or interchangeably.

For convenience of explanation, the camera device according to the embodiment is described using a Cartesian coordinate system (x, y, z), but it can also be described using another coordinate system, and the embodiment is not limited to this. In each drawing, the x-axis and y-axis refer to directions perpendicular to the z-axis, which is the optical axis direction. The z-axis direction, which is the optical axis (OA) direction, is called the 'first direction', and the x-axis direction is called the 'second direction.' and the y-axis direction may be referred to as the 'third direction'. Also, for example, the x-axis direction can be expressed as 'one of the first horizontal direction and the second horizontal direction', and the y-axis direction can be expressed as 'the other one of the first horizontal direction and the second horizontal direction'.

Also, for example, the optical axis may be the optical axis of a lens mounted on the lens barrel. Or, for example, the optical axis may be an axis perpendicular to the imaging area of the image sensor and passing through the center of the imaging area.

The first direction may be perpendicular to the imaging area of the image sensor. Also, for example, the optical axis direction may be parallel to the optical axis.

A camera device according to an embodiment may perform an 'autofocusing function'. Here, the auto focusing function refers to automatically focusing the image of the subject onto the image sensor surface.

Hereinafter, the camera device may be alternatively expressed as “camera module”, “camera assembly”, “camera unit”, “camera”, “imaging device”, or “lens shift device”.

Additionally, the camera device according to the embodiment may perform an 'image shake correction function'. Here, the hand shake correction function refers to a feature that prevents the outline of the captured image from being clearly formed due to vibration caused by the user's hand shake when shooting a still image.

FIG. 1 is a perspective view of the camera device 10 according to an embodiment, FIG. 2 is a perspective view of the camera device 10 with the cover member 300 removed, and FIG. 3 is an exploded perspective view of the camera device 10 of FIG. 1. , FIG. 4A is a cross-sectional view of the camera device 10 in the AB direction of FIG. 1, FIG. 4B is a cross-sectional view of the camera device 10 in the CD direction of FIG. 1, and FIG. 4C is a cross-sectional view of the camera device 10 in the direction CD of FIG. 1. It is a cross-sectional view in the EF direction, Figure 5 is an exploded perspective view of the AF driving unit 100 of Figure 3, and Figure 6 shows the bobbin 110, the sensing magnet 180, the balancing magnet 185, the first coil 120, and the circuit. A perspective view of the substrate 190, the first position sensor 170, and the capacitor 195, and Figure 7 shows the bobbin 110, the housing 140, the circuit board 190, the upper elastic member 150, and the sensing magnet. 8 is a perspective view of the housing 140, the bobbin 110, the lower elastic member 160, the magnet 130, and the circuit board 190.

Referring to FIGS. 1 to 8 , the camera device 10 may include an AF driver 100 and an image sensor unit 350. The AF driving unit 100 may include an AF moving unit. The image sensor unit 350 may include an “OIS driver”.

The OIS driving unit may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other one of the AF moving unit and the OIS moving unit may be a second moving unit.

The AF driving unit 100 may be alternatively expressed as a “lens moving unit” or a “lens driving device.” Alternatively, the AF driving unit 100 may be expressed as “first moving unit (or second moving unit)” or “first actuator (or second actuator)”.

The OIS driving unit can be expressed as a “sensor moving unit” or a “sensor moving device” instead. Alternatively, the OIS driving unit may be expressed as “second moving unit (or first moving unit)” or “second actuator (or first actuator)” instead.

The camera device 10 may further include at least one of a cover member 300 and a lens module 400. The cover member 300 and the base 210, which will be described later, may form a case.

An “actuator” according to an embodiment may include at least one of an AF driver and an OIS driver. For example, the actuator according to the embodiment may not include at least one of the lens module 400 and the image sensor 810 in the camera device 10. For example, the actuator according to the embodiment may include at least one of the components of the camera device 10, but omit the lens module 400 and the image sensor 810.

The AF driver 100 is coupled to the lens module 400, moves the lens module in the direction of the optical axis (OA) or in a direction parallel to the optical axis, and operates the auto-focusing function of the camera device 10 by the AF driver 100. It can be done.

The image sensor unit 350 may be expressed as an “image sensor moving unit”, “image sensor shift unit”, “sensor moving unit”, or “sensor shift unit”. Alternatively, the image sensor unit 350 may be alternatively expressed as a second moving unit (or first moving unit), or a “second actuator (or first actuator).”

The image sensor unit 350 may include an image sensor 810. For example, the image sensor unit 350 may include an OIS moving unit including the image sensor 810. For example, the image sensor unit 350 may move the OIS moving unit (eg, the image sensor 810) in a direction perpendicular to the optical axis. Additionally, the image sensor unit 350 may tilt or rotate (or roll) the OIS moving unit (e.g., the image sensor 810) with respect to the optical axis or with the optical axis as the rotation axis. . The image sensor unit 350 may perform an image stabilization function of the camera device 10.

For example, the image sensor 810 may include an imaging area for detecting light that has passed through the lens module 400. Here, the imaging area can be expressed as an effective area, a light-receiving area, an active area, or a pixel area. For example, the imaging area of the image sensor 810 is an area where light passing through the filter 610 is incident and an image included in the light is formed, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

Referring to Figures 5 and 6, the AF driver 100 can move the lens module 400 in the optical axis direction. For example, the AF driver 100 may move the bobbin 110 in the optical axis direction. For example, the AF driver 100 may include a bobbin 110, a first coil 120, a magnet 130, and a housing 140. The AF driver 100 may further include an upper elastic member 150 and a lower elastic member 160.

Additionally, the AF driver 100 may further include a first position sensor 170, a circuit board 190, and a sensing magnet 180 for AF feedback driving. Additionally, the AF driver 100 may further include at least one of a balancing magnet 185 and a capacitor 195.

The bobbin 110 may be disposed inside the housing 140 and moves in the optical axis (OA) direction or a first direction (e.g., Z-axis direction) by electromagnetic interaction between the first coil 120 and the magnet 130. can be moved to

The bobbin 110 may be combined with the lens module 400 or may have an opening for mounting the lens module 400. For example, the opening of the bobbin 110 may be a through hole penetrating the bobbin 110 in the optical axis direction, and the shape of the opening of the bobbin 110 may be circular, elliptical, or polygonal, but is not limited thereto. .

The lens module 400 may include at least one lens or/and a lens barrel. For example, the lens module 400 may include one or more lenses and a lens barrel that accommodates one or more lenses. However, the configuration of the lens module is not limited to the lens barrel, and any holder structure that can support one or more lenses is possible.

For example, the lens module 400 may be screw-coupled with the bobbin 110 as an example. Alternatively, for example, the lens module 400 may be coupled to the bobbin 110 using an adhesive (not shown). Meanwhile, light passing through the lens module 400 may pass through the filter 610 and be irradiated to the image sensor 810.

The bobbin 110 may include at least one protrusion 111A and 111B provided on the outer surface. For example, at least one of the protrusions 111A and 111B may protrude in a direction parallel to a straight line perpendicular to the optical axis OA, but is not limited thereto. For example, the bobbin 110 may include two protrusions 111A and 111B located on opposite sides of each other.

The protrusions 111A and 111B of the bobbin 110 correspond to the grooves 25A and 25B of the housing 140, and may be inserted or disposed within the grooves 25A and 25B of the housing 140, and the bobbin 110 Rotation beyond a certain range around this optical axis can be suppressed or prevented.

The bobbin 110 may include a protrusion 146A that protrudes in a direction perpendicular to the optical axis. For example, the protrusion 146A of the bobbin 110 may be disposed at a corner of the bobbin. The housing 140 may include a groove 146B that corresponds to, opposes, or overlaps the protrusion 146A of the bobbin 110. The protrusion 146A of the bobbin 110 serves as a stopper to allow the bobbin 110 to move within a defined range in the optical axis direction (e.g., the direction from the upper elastic member 150 to the lower elastic member 160). You can.

A first escape groove 112a may be provided on the upper surface of the bobbin 110 to avoid spatial interference with the first frame connection portion 153 of the upper elastic member 150. Additionally, a second escape groove 112b may be provided on the lower surface of the bobbin 110 to avoid spatial interference with the second frame connection portion 163 of the lower elastic member 160.

The bobbin 110 may include a first coupling portion 116a to be coupled and fixed to the upper elastic member 150. For example, the first coupling portion 116a of the bobbin 110 may have a protrusion shape, but is not limited thereto, and may have a flat or groove shape in other embodiments. Additionally, the bobbin 110 may include a second coupling portion 116b to be coupled and fixed to the lower elastic member 160. For example, the second coupling portion 116b may have a protrusion shape, but is not limited thereto, and may have a flat or groove shape in other embodiments.

Referring to FIG. 5 , a groove 105 in which the first coil 120 is seated, inserted, or placed may be provided on the outer surface of the bobbin 110. For example, the groove 105 of the bobbin 110 may have a shape that matches the shape of the first coil 120 or a closed curve shape (eg, a ring shape).

Additionally, the bobbin 110 may be provided with a first seating groove 26a into which the sensing magnet 180 is seated, inserted, fixed, or disposed. Additionally, a second seating groove 26b may be provided on the outer surface of the bobbin 110 into which the balancing magnet 185 is seated, inserted, fixed, or disposed.

For example, the first and second seating grooves 26A and 26B of the bobbin 110 may be formed on outer surfaces of the bobbin 110 that face each other. For example, the first seating groove 26A may be formed on the first protrusion 111A of the bobbin 110, and the second seating groove 26B may be formed on the second protrusion 111B of the bobbin 110. there is.

Referring to FIGS. 5 and 7 , a damper 48 may be disposed between the bobbin 110 and the upper elastic member 150. For example, the damper 48 may be disposed between the bobbin 110 and the first frame connection portion 153 of the upper elastic member 150, and may be in contact with, coupled with, or attached to both.

For example, the upper elastic member 150 may include an extension (or protrusion) 155 extending from the first frame connection portion 153. The extension portion 155 may be spaced apart from each of the outer frame 152 and the inner frame 151. Additionally, the extension portion 155 may be spaced apart from one end of the first frame connection portion 153 connected to the inner frame 151 and the other end of the first frame connection portion 153 connected to the outer frame 152. The extension portion 155 may extend onto the upper surface of the bobbin 110. For example, a portion (or end) of the extension portion 155 may be disposed on the guide portion 104A of the bobbin 110 and may overlap the guide portion 104A in the optical axis direction.

The damper 48 may be disposed between the guide portion 104A of the bobbin 110 and the extension portion 155 of the upper elastic member 150, and may be in contact with, coupled with, or attached to both. The damper 48 may serve to buffer or absorb vibration of the bobbin 110 by contacting or being attached to the extension portion 155 and the bobbin 110. For example, damper 48 may be formed of a damping member (eg, silicone).

For example, the guide portion 104A of the bobbin 110 may include a protrusion that protrudes upward from the escape portion 112a of the bobbin 110. Also, for example, the guide portion 104A of the bobbin 110 may include a groove for receiving or placing the damper 48.

The first coil 120 is disposed on or coupled to the bobbin 110. For example, the first coil 120 may be disposed or coupled to the outer surface of the bobbin 110. For example, the first coil 120 may wrap the outer surface of the bobbin 110 in a direction rotating around the optical axis OA, but is not limited to this.

The first coil 120 may be wound directly on the outer surface of the bobbin 110, but is not limited to this. According to another embodiment, the first coil 120 is wound on the bobbin 110 using a coil ring. It may be wound or provided as an angled ring-shaped coil block.

Power or a driving signal may be provided to the first coil 120. The power or driving signal provided to the first coil 120 may be a direct current signal or an alternating current signal, or may include a direct current signal and an alternating current signal, and may be in the form of voltage or current.

The first coil 120 may form electromagnetic force through electromagnetic interaction with the magnet 130 when a driving signal (e.g., driving current) is supplied, and the bobbin 110 may be moved in the direction of the optical axis (OA) by the formed electromagnetic force. This can be moved.

In the initial position of the AF movable unit, the bobbin 110 can be moved in the upward or downward direction, which is referred to as bidirectional driving of the AF movable unit. Alternatively, in the initial position of the AF movable unit, the bobbin 110 may be moved in an upward direction, which is referred to as unidirectional driving of the AF movable unit.

At the initial position of the AF movable unit, the first coil 120 may be arranged to correspond to or overlap the magnet 130 disposed in the housing 140 in a direction perpendicular to the optical axis OA and parallel to the straight line passing through the optical axis. there is.

For example, the AF movable unit may include a bobbin 110 and components coupled to the bobbin 110 (e.g., a first coil 120, a sensing magnet 180, and balancing magnets 180 and 185. Also, AF The movable part may further include a lens module 400.

And the initial position of the AF movable part is the initial position of the AF movable part in a state where power is not applied to the first coil 120, or the upper and lower elastic members 150 and 160 are elastically deformed only by the weight of the AF movable part. It may be the position where the movable part is placed. In addition, the initial position of the bobbin 110 is the position at which the AF movable part is placed when gravity acts in the direction from the bobbin 110 to the base 210, or, conversely, when gravity acts in the direction from the base 210 to the bobbin 110. It can be.

The sensing magnet (180) can provide a magnetic field for the first position sensor (170) to detect, and the balancing magnet (185) cancels out the magnetic field influence of the sensing magnet (180), and the sensing magnet (180) It can play a role in balancing weight.

The sensing magnet 180 may be expressed as “sensor magnet” or “second magnet” instead. The sensing magnet 180 may be placed on the bobbin 110 or coupled to the bobbin 110. The sensing magnet 180 may be arranged to face the first position sensor 170. The balancing magnet 185 may be disposed on the bobbin 110 or coupled to the bobbin 110. For example, the balancing magnet 185 may be placed on the opposite side of the sensing magnet 180.

For example, each of the sensing magnets and balancing magnets 180 and 185 may be a unipolar magnetizing magnet having one N pole and one S pole, but is not limited thereto. In another embodiment, each of the sensing magnets and balancing magnets 180 and 185 may be a bipolar magnetization magnet or a four-pole magnet including two N poles and two S poles.

The sensing magnet 180 can move in the optical axis direction together with the bobbin 110, and the first position sensor 170 can detect the magnetic field strength or magnetic force of the sensing magnet 180 moving in the optical axis direction. An output signal can be output according to the results.

For example, the intensity or magnetic force of the magnetic field detected by the first position sensor 170 may change depending on the displacement of the bobbin 110 in the optical axis direction, and the first position sensor 170 is proportional to the intensity of the detected magnetic field. An output signal can be output, and displacement of the bobbin 110 in the optical axis direction can be detected using the output signal of the first position sensor 170.

The housing 140 is disposed inside the cover member 300. For example, the housing 140 may be placed on the image sensor unit 350.

The housing 140 can accommodate the bobbin 110 inside and support the magnet 130, the first position sensor 170, and the circuit board 190.

Referring to FIGS. 5, 7, and 8, the housing 140 may have an overall hollow pillar shape. For example, the housing 140 may have a polygonal (eg, square or octagonal) or circular opening, and the opening of the housing 140 may be in the form of a through hole that penetrates the housing 140 in the optical axis direction.

The housing 140 may include sides that correspond to or oppose the side plate 302 of the cover member 300 and corners that correspond to or oppose the corners of the cover member 300 .

In order to prevent the cover member 300 from colliding directly with the inner surface of the upper plate 301, the housing 140 may include a stopper 145 provided at the top, upper surface, or top.

Referring to FIG. 5, the housing 140 may include a mounting groove 14A (or groove) for accommodating the circuit board 190. The mounting groove 14A may have a shape that matches the shape of the circuit board 190.

Referring to FIGS. 7A and 7B , the housing 140 may include protrusions 44A and 44B surrounding at least one of the circuit board 190 and the support board 310. For example, the protrusions 44A and 44B may be disposed or formed on the outer surface of the housing 140. For example, the protrusions 44A and 44B may be disposed or formed on the outer surface of the side of the housing 140. The protrusions 44A and 44B may alternatively be expressed as a “protection portion,” a “support portion,” an “extension portion,” or a guide portion.

The protrusions 44A and 44B of the housing 140 may surround at least a portion of the circuit board 190 and at least a portion of the support substrate 310 . For example, the housing 140 may include a first protrusion 44A disposed on a first side of the housing and a second protrusion 44B disposed on a second side of the housing 140. The first protrusion 44A and the second protrusion 44B may be located on opposite sides of the optical axis OA or the bobbin 110. In other embodiments, the second protrusion 44B may be omitted.

For example, the circuit board 190 may be disposed within the first protrusion 44A. For example, the mounting groove 14A may be formed on the first protrusion 44A.

For example, the first protrusion 44A and the second protrusion 44B each have a first portion 47A connected to the upper surface of the housing 140, and a first portion 47A connected to the side of the housing 140. It may include a spaced apart second portion 47B. For example, the first portion 47A of the first protrusion 44A may be connected to the upper surface of the first side of the housing 140, and the first portion 47A of the second protrusion 44B may be connected to the upper surface of the first side of the housing 140. It may be connected to the upper surface of the second side. For example, the first part 47A may protrude from the upper surface of the housing 140 in the optical axis direction or in the inner direction of the upper plate 301 of the cover member 300.

For example, at least a portion of the circuit board 190 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A. Also, for example, at least a portion of the support substrate 310 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A.

The housing 140 may include an opening to expose the terminals B1 to B4 of the terminal portion 95 of the circuit board 190, and the opening may be formed on a side of the housing 140.

Each of the first protrusion 44A and the second protrusion 44B of the housing 140 may include a third portion 37C extending from the second portion 47B. For example, the third portion 37C extends from the lower or lower end of the second portion 47B in a direction parallel to the outer surface of the first side (or second side) of the housing 140 (e.g., in the second horizontal direction). It may extend or protrude.

For example, the third part 37C may include a 3-1 part extending from one end of the second part 47B and a 3-2 part extending from the other end of the second part, and the 3-1 The portion and the third-2 portion may extend or protrude in opposite directions.

An adhesive or a sealing member may be disposed between the protrusions 44A and 44B of the housing 140 and the cover member 300. For example, an adhesive (or sealing member) may be disposed between the protrusions 44A and 44B of the housing 140 and the side plate 302 of the cover member 300 and may couple the two. The protrusions 44A and 44B can increase the coupling area with the side plate of the cover member 300 and can stably couple the housing 140 and the cover member 300 without interference from the support substrate 310.

At least one first coupling portion 143 coupled to the first outer frame 152 of the upper elastic member 150 may be provided on the top, top, or upper surface of the housing 140. A second coupling portion coupled to and fixed to the second outer frame 162 of the lower elastic member 160 may be provided on the lower, lower, or lower surface of the housing 140. For example, each of the first and second coupling portions of the housing 140 may be flat, protruded, or groove-shaped.

A hole 147, which is a path through which the wire 220 passes, may be formed at a corner of the housing 140. The hole 147 may be a through hole that passes through the housing 140 in the optical axis direction. In another embodiment, the hole may be recessed from the outer surface of the corner portion of the housing 140, and at least a portion of the hole may be open to the outer surface of the corner portion. The number of holes 147 in the housing 140 may be equal to the number of support members.

The magnet 130 may be placed, coupled, or fixed to the housing 140, which is a fixed part. For example, the magnet 130 may be placed, coupled, or fixed to the side of the housing 140. The magnet 130 may include an AF driving magnet 71A for AF driving. Additionally, the magnet 130 may include an OIS driving magnet 71B for OIS driving. Hereinafter, the driving magnet 71A for AF may be expressed as one of the first magnet and the second magnet, and the driving magnet 71B for OIS may be expressed as the other one of the first magnet and the second magnet.

In another embodiment, the magnet 130 may be placed, coupled, or fixed to a corner of the housing.

For example, the magnet 130 may include a plurality of magnet units. For example, the magnet 130 may include first to fourth magnet units 130-1 to 130-4 disposed in the housing 140. In another embodiment, the magnet 130 may include two or more magnet units.

The magnet 130 may be disposed on at least one of the sides or corners of the housing 140. For example, at least a portion of the magnet 130 may be disposed on the side or corner of the housing 140. Or, for example, at least a part of the magnet 130 may be placed on the side of the housing 140, and the remaining part may be placed at a corner of the housing 140.

For example, each of the magnet units 130-1 to 130-4 may include a first portion disposed at a corresponding one of the four corners of the housing 130. Additionally, each of the magnet units 130-1 to 130-4 may include a second part disposed on one side of the housing 140 adjacent to one of the corners of the housing 140.

For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be located on opposite sides of the housing 140 in the first horizontal direction (eg, Y-axis direction). For example, the second magnet unit 130-2 and the fourth magnet unit 130-4 may be located on opposite sides of the housing 140 in the second horizontal direction (eg, X-axis direction).

For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be arranged side by side in a second horizontal direction (e.g., X-axis direction), and the second magnet unit 130-2 and the fourth magnet unit 130-4 may be arranged side by side in the first horizontal direction (eg, Y-axis direction).

At the initial position of the AF movable unit, the magnet 130 is perpendicular to the optical axis OA and is disposed in the housing 140 so that at least a portion overlaps the first coil 120 in a direction parallel to a straight line passing through the optical axis OA. You can.

The magnet 130 may include a single-pole magnetized magnet or a two-pole magnet including one N-pole region and one S-pole region. In another embodiment, the magnet 130 may include a bipolar magnetization magnet or a four-pole magnet including two N-pole regions and two S-pole regions. In another embodiment, the magnet 130 may include a unipolar magnetization magnet and a bipolar magnetization magnet.

For example, the magnet 130 may include an AF magnet (or AF driving magnet) for performing an AF operation and an OIS magnet (or OIS driving magnet) for performing an OIS operation. In another embodiment, for example, the magnet 130 may be a common magnet for performing AF operations and OIS operations.

Figure 19a shows an example of the magnet 130 of Figure 5.

Referring to FIG. 19A, the magnet 130 may include a first magnet 71A, which is an AF magnet, and two magnets 71B, which are OIS magnets disposed below the first magnet 71A.

The first magnet 71A may be a two-pole magnet including one N-pole area and one S-pole area. For example, the first magnet 71A and the N-pole area and S-pole area may be arranged to face or oppose each other in a direction perpendicular to the optical axis. In another embodiment, the first magnet 71A may be a four-pole magnet including two N-pole regions and two S-pole regions.

The first magnet 71A may include a plurality of magnet units 71A1 to 71A4. As described above, each of the plurality of magnet units 71A1 to 71A4 may be a two-pole magnet or a four-pole magnet. For example, the magnet units 71A1 to 71A4 may have the same size and shape. For example, the first two diagonally opposite magnet units 71A1 and 71A3 may have the same size and shape, and the second diagonally opposite magnet units 71A2 and 71A4 may have the same size and shape. It can have the shape of

In another embodiment, the size and shape of the two magnet units 71A1 and 71A3 may be different from those of the remaining two magnet units 71A2 and 71A4. For example, the length of the long side of each of the two magnet units 71A1 and 71A3 may be greater than the length of the long side of each of the remaining two magnet units 71A2 and 71A4. For example, the length of the short side of each of the two magnet units 71A1 and 71A3 may be the same as the length of the short side of each of the remaining two magnet units 71A2 and 71A4.

The second magnet 71B may be a four-pole magnet including two N-pole regions and two S-pole regions. For example, the second magnet 71B includes a first magnet portion 30A, a second magnet portion 30B, and a partition wall 30C disposed between the first magnet portion 30A and the second magnet portion 30B. It can be included. At this time, the barrier wall 30C may be a non-magnetic material, air, etc., and the barrier wall may be expressed as a “neutral zone” or a “neutral zone.” In another embodiment, the second magnet 71B may be a two-pole magnet including one N-pole area and one S-pole area.

For example, the first magnet portion 30A and the second magnet portion 30B may be spaced apart from each other in a direction perpendicular to the first direction (or optical axis direction). For example, the first magnet portion 30A may include a first N-pole region and a first S-pole region that oppose or face each other in the optical axis direction. The second magnet portion 30B may include a second N-pole region and a second S-pole region that oppose or face each other in the optical axis direction. In addition, the first N-pole area (or first S-pole area) of the first magnet unit 30A and the second S-pole area (or second N-pole area) of the second magnet unit 30B are aligned in a direction perpendicular to the optical axis. They can face each other or face each other.

The second magnet 71B may include a plurality of magnet units 71B1 to 71B4. Each of the plurality of magnet units 71B1 to 71B4 may be a four-pole magnet, as described above. In another embodiment, each of the magnet units 71B1 to 71B4 may be a two-pole magnet. In the optical axis direction, each of the magnet units 71B1 to 71B4 may face or overlap with a corresponding one of the second coil units 230-1 to 230-4.

For example, the magnet units 71B1 to 71B4 may have the same size and shape. For example, the first two diagonally opposite magnet units 71B1 and 71B3 may have the same size and shape, and the second diagonally opposite magnet units 71B2 and 71B4 may have the same size and shape. It can have the shape of

In another embodiment, the size and shape of the two magnet units 71B1 and 71B3 may be different from those of the remaining two magnet units 71B2 and 71B4. For example, the length of the long side of each of the two magnet units 71B1 and 71B3 may be greater than the length of the long side of each of the remaining two magnet units 71B2 and 71B4. For example, the length of the short side of each of the two magnet units 71B1 and 71B3 may be the same as the length of the short side of each of the remaining two magnet units 71B2 and 71B4.

The second magnet 71B may be placed below the first magnet 71A. The second magnet 71B may be disposed on the lower surface of the first magnet 71A. For example, the upper surface of the second magnet 71B may be in contact with the lower surface of the first magnet 71A, or may be fixed or coupled to the lower surface of the first magnet 71A by adhesive. For example, at least a portion of the first magnet 71A may overlap with at least a portion of the second magnet 71B in the first direction (or the optical axis direction).

In another embodiment, the second magnet may be spaced apart from the first magnet. At this time, a portion of the housing 140 may be disposed between the first magnet and the second magnet. Alternatively, in another embodiment, a partition wall or yoke may be disposed between the first and second magnets that are spaced apart. At this time, the description of the partition wall 30C may be applied or analogously applied to the partition wall.

For example, the length T2 of the second magnet 71B in the optical axis direction may be shorter than the length T1 of the first magnet 71A in the optical axis direction (T2<T1). In other embodiments, T2 may be greater than or equal to T1.

Additionally, the length L2 of the long side of the second magnet 71B may be less than or equal to the length L1 of the long side of the first magnet 71A (L2≤L1). In other embodiments, L2 may be larger than L1.

Additionally, the width W2 (or the length of the short side) of the second magnet 71B may be less than or equal to the width W1 (or the length of the short side) of the first magnet 71A (W2≤W1). In another embodiment, W2 may be larger than W1.

At the initial position of the AF moving unit, the first coil 120 may face or overlap the first magnet 71A in a direction perpendicular to the first direction (or optical axis direction). In FIG. 19A, the N-pole area of the first magnet 71A may be arranged to face the first coil 120, or the N-pole area may be located closer to the first coil 120 than the S-pole area, but in another embodiment It can also be arranged in the opposite way.

For example, at least a portion of the first magnet 130 may overlap with at least a portion of the second coil 230 in the first direction (or optical axis direction) from the initial position of the OIS moving unit. For example, at least a portion of the second magnet 71B may overlap with at least a portion of the second coil 230 in the first direction (or optical axis direction) from the initial position of the OIS moving unit.

The long side length (L2) of the second magnet 71B may be greater than the long side length (L3) of the second coil 230 (L2>L3). In another embodiment, the length of the long side of the second magnet 71B may be smaller than or equal to the length of the long side of the second coil 230.

The width W2 (or the length of the short side) of the second magnet 71B may be greater than the length L4 of the short side of the second coil 230 (W2>L4). In another embodiment, the length of the long side of the second magnet 71B may be smaller than or equal to the length of the long side of the second coil 230.

For example, the length of the long side of each of the two magnet units 71B1 and 71B3 of the second magnet 71B is longer than the length of the long side of each of the coil units 230-1 and 230-3 of the second coil 230. It can be small. In another embodiment, the length of the long side of each of the two magnet units 71B1 and 71B3 may be equal to or greater than the length of the long side of each of the coil units 230-1 and 230-3.

In addition, the length of the long side of each of the remaining two magnet units 71B2 and 71B4 of the second magnet 71B is longer than the length of the long side of each of the coil units 230-2 and 230-4 of the second coil 230. It can be big. In another embodiment, the length of the long side of each of the magnet units 71B2 and 71B4 may be equal to or smaller than the length of the long side of each of the coil units 230-2 and 230-4 of the second coil 230.

For example, the length of the short side of each of the first to fourth magnet units 71B1 to 71B4 of the second magnet 71B is the length of the first to fourth coil units 230-1 to 230- of the second coil 230. 4) It may be smaller than the length of each short side. In another embodiment, the length of the short side of each of the first to fourth magnet units 71B1 to 71B4 may be longer than the length of the short side of each of the first to fourth coil units 230-1 to 230-4.

Figure 19b shows another embodiment of the magnet 130 of Figure 5.

Referring to FIG. 19B, the second magnet 71BB of FIG. 19B may be a two-pole magnet including one N-pole region and one S-pole region. The description of the lengths T2, L2, and W2 of the second magnet 71B in FIG. 19A can be applied or analogously applied to the second magnet 71BB in FIG. 19B.

The circuit board 190 may be placed in the housing 140, and the first position sensor 170 may be placed or mounted on the circuit board 190 and electrically connected to the circuit board 190. For example, the circuit board 190 may be placed in the mounting groove 14A of the housing 140, and the terminals 95 of the circuit board 190 may be exposed to the outside of the housing 140.

The circuit board 190 may be provided with a terminal portion 95 (or terminal unit) including a plurality of terminals B1 to B4 for electrical connection to an external terminal or external device. A plurality of terminals B1 to B4 of the circuit board 1900 may be electrically connected to the first position sensor 170.

The first position sensor 170 may be disposed in the housing 140 or/and the circuit board 190. For example, the first position sensor 170 may be disposed on the first side of the circuit board 190, and the plurality of terminals B1 to B4 may be disposed on the second side of the circuit board 190. Here, the second side of the circuit board 190 may be the opposite side of the first side of the circuit board 190. For example, the first side of the circuit board 190 may be either the bobbin 110 or one side of the circuit board 190 facing the sensing magnet 180. For example, the circuit board 190 may be a printed circuit board, or FPCB.

The first position sensor 170 may be electrically connected to the circuit board 190. For example, the first position sensor 170 may be electrically connected to the first to fourth terminals B1 to B4 of the circuit board 190. For example, the circuit board 190 may include a circuit pattern or wiring (not shown) for electrically connecting the first to fourth terminals B1 to B4 and the first position sensor 170.

For example, at the initial position of the AF movable unit, the first position sensor 170 is perpendicular to the optical axis OA, and at least a portion of the first position sensor 170 faces or overlaps the sensing magnet 180 in a direction parallel to a straight line passing through the optical axis OA. You can. In another embodiment, the first position sensor may not face or overlap the sensing magnet at the initial position of the AF movable unit.

The first position sensor 170 serves to detect the movement, displacement, or position of the bobbin 110 in the optical axis direction. That is, the first position sensor 170 can detect the magnetic field or the strength of the magnetic field of the sensing magnet 180 mounted on the bobbin 110 according to the movement of the bobbin 110, and output an output signal according to the detected result. In addition, the movement, displacement, or position of the bobbin 110 in the optical axis direction can be detected using the output of the first position sensor 170.

The first position sensor 170 may be a driver IC including a Hall sensor and a driver. The first position sensor 170 sends a driving signal to the first to fourth terminals and the first coil 120 for transmitting and receiving data to the outside using data communication using a protocol, for example, I2C communication. It may include fifth and sixth terminals for direct provision.

For example, each of the first to fourth terminals of the first position sensor 170 is electrically connected to a corresponding one of the first to fourth terminals B1 to B4 of the circuit board 190 by solder or conductive adhesive. It can be connected to .

Also, for example, the fifth and sixth terminals of the first position sensor 170 may be electrically connected to the first coil 120. For example, the first position sensor 170 may be electrically connected to the first coil 120 through at least one of the upper elastic member 150 and the lower elastic member 160, and may send a driving signal to the first coil 120. can be provided.

For example, a part of the first upper elastic unit 150-1 may be connected to one end of the first coil 120, and another part of the first upper elastic unit 150-1 may be electrically connected to the circuit board 190. can be connected A portion of the second upper elastic unit 150-2 may be connected to the other end of the first coil 120, and another portion of the second upper elastic unit 150-2 may be electrically connected to the circuit board 190. there is. The circuit board 190 includes a first pad 5A that is electrically connected to another part of the first upper elastic unit 150-1 and a first pad 5A that is electrically connected to another part of the second upper elastic unit 150-2. It may include 2 pads 5B. Each of the fifth and sixth terminals of the first position sensor 170 may be electrically connected to a corresponding one of the first and second pads 5A and 5B of the circuit board 190.

In another embodiment, the first coil 120 may be electrically connected to the circuit board 190 and the fifth and sixth terminals of the first position sensor 170 by two lower elastic members.

For example, in an embodiment in which the first position sensor 170 is a driver IC, the first and second terminals B1 and B2 of the circuit board 190 may be power terminals for providing power, and the third terminal ( B3) may be a terminal for transmitting and receiving a clock signal, and the fourth terminal (B4) may be a terminal for transmitting and receiving a data signal.

In another embodiment, the first position sensor 170 may be a Hall sensor. At this time, the first position sensor 170 may include two input terminals for providing a driving signal or power and two output terminals for outputting a sensing voltage (or output voltage). For example, a driving signal may be provided to the first position sensor 170 through the first and second terminals B1 and B2 of the circuit board 190, and the output of the first position sensor 170 may be output to the third and can be output to the outside through the fourth terminals B3 and B4. Additionally, it may be electrically connected to the circuit board 190 of the first coil 120. Additionally, the circuit board 190 may further include two terminals separate from the first to fourth terminals B1 to B4, and a driving signal from the outside may be transmitted to the first coil 120 through the two separate terminals. can be provided.

For example, the ground terminal of the power terminal of the first position sensor 170 may be electrically connected to the cover member 300.

The capacitor 195 may be disposed or mounted on the first side of the circuit board 190. The capacitor 195 may be in the form of a chip, and in this case, the chip may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195. The capacitor 195 may also be alternatively expressed as a “capacitive element” or a condenser.

The capacitor 195 may be electrically connected in parallel to the first and second terminals B1 and B2 of the circuit board 190 to provide power (or a driving signal) to the first position sensor 170 from the outside. . Alternatively, the capacitor 195 may be electrically connected in parallel to terminals of the first position sensor 170, which is electrically connected to the first and second terminals B1 and B2 of the circuit board 190.

The capacitor 195 is electrically connected in parallel to the first and second terminals B1 and B2 of the circuit board 190, and thus includes power signals (GND, VDD) provided to the first position sensor 170 from the outside. It can serve as a smoothing circuit that removes ripple components, thereby providing a stable and constant power signal to the first position sensor 170.

In another embodiment, the sensing magnet 180 may be placed in the housing 140, and the first position sensor 170 may be placed in the bobbin 110. In other embodiments, the balancing magnet 185 may be omitted.

The upper elastic member 150 and the lower elastic member 160 may be combined with the bobbin 110 and the housing 140. For example, the upper elastic member 150 may be coupled to the upper, upper, or upper surface of the bobbin 110 and the upper, upper, or upper surface of the housing 140, and the lower elastic member 160 may be coupled to the upper, upper, or upper surface of the bobbin 110. It may be coupled to the lower, lower, or lower surface of the housing 140. The upper elastic member 150 and the lower elastic member 160 may elastically support the bobbin 110 with respect to the housing 140.

The upper elastic member 150 may include a plurality of upper elastic units (eg, 150-1 to 150-4) that are electrically separated from each other or spaced apart from each other. The lower elastic member 160 is implemented as a single elastic unit, but in another embodiment, it may include a plurality of lower elastic units that are electrically separated from each other or spaced apart from each other. In another embodiment, at least one of the upper elastic member and the lower elastic member may be implemented as a single unit or a single configuration.

The upper elastic member 150 is a first inner frame 151 coupled or fixed to the top, upper surface, or top of the bobbin 110, and a second inner frame 151 coupled or fixed to the top, upper surface, or top of the housing 140. It may further include a frame 152 and a first frame connection portion 153 connecting the first inner frame 151 and the first outer frame 152. Additionally, the upper elastic member 150 may include the extension portion 155 described above.

The lower elastic member 160 is a second inner frame 161 coupled or fixed to the lower, lower, or lower end of the bobbin 110, and a second outer frame 161 coupled or fixed to the lower, lower, or lower end of the housing 140. It may include a frame 162 and a second frame connection portion 163 that connects the second inner frame 161 and the second outer frame 162 to each other. The inner frame can be expressed by replacing it with an inner part, the outer frame can be expressed by replacing it with an outer part, and the frame connection part can be expressed by replacing it with a connection part.

Each of the first and second frame connectors 153 and 163 may be bent or curved at least once to form a pattern of a certain shape.

Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material, for example, a metal material. Additionally, each of the upper elastic member 150 and the lower elastic member 160 may be formed of an elastic member, such as a leaf spring.

Referring to FIGS. 5, 7A, and 7B, for example, the second outer frame 152 of the first upper elastic unit 150-1 is coupled to the first pad 5A of the circuit board 190 or is electrically connected to the first pad 5A of the circuit board 190. It may include a first bonding portion 4A connected to, and the second outer frame 152 of the second upper elastic unit 150-2 is electrically connected to the second pad 5B of the circuit board 190. It may include a connected second bonding portion 4B.

In another embodiment, at least one of the upper elastic member 150 or the lower elastic member 160 may include two elastic members. For example, each of the two elastic members of the upper elastic member 150 and the lower elastic member 160 may be coupled or electrically connected to the corresponding one of the first and second pads of the circuit board 190. and the first coil 120 may be electrically connected to two elastic members.

The first outer frame 152 of the upper elastic member 150 includes a first coupling portion 510 coupled to the housing 140, a second coupling portion 520 coupled to the wire 220, and a first coupling portion. It may include a connecting portion 530 connecting the 510 and the second coupling portion 520. The first coupling portion 510 may include a through hole or hole for being coupled to the first coupling portion 143 of the housing 140. The second coupling portion 520 may include a through hole or hole for being coupled to the wire 220. For example, the second coupling portion 520 may be coupled to the wire 220 using a conductive adhesive or solder. For example, the connecting portion 530 may include a bent portion that is bent at least once or a curved portion that is bent at least once, but is not limited thereto, and may have a straight shape in another embodiment.

FIG. 9 is a perspective view of the image sensor unit 350, FIG. 10A is a first separated perspective view of the image sensor unit 350 of FIG. 9, and FIG. 10B is a second separated perspective view of the image sensor unit 350 of FIG. 9. , FIG. 11 shows the holder 270, terminal portion 37, first substrate portion 255, support substrate 310, heat dissipation member 280, base 210, and second substrate portion 800 of FIG. 10A. It is a bottom perspective view, Figure 12a is a perspective view of the holder, and Figure 12b is a holder 270. It is a top view of the first substrate 255, the image sensor 810, the second coil 230, and the OIS position sensor 240, and Figure 13 is a rear perspective view of the holder 270 and the first substrate 255. 14 is a perspective view of the base 210, the terminal portion 37, and the wire 220, and FIG. 15 is a bottom view of the first substrate portion 255, the support substrate 310, and the heat dissipation member 280. , FIG. 16 is a perspective view of the first substrate 255, the support substrate 310, and the heat dissipation member 280, and FIG. 17A is a first view of the support substrate 310 coupled to the holder 270 and the base 210. It is a perspective view, and FIG. 17B is a second perspective view of the support substrate 310 coupled to the holder 270 and the base 210, FIG. 17C is a view with the support substrate 310 removed from FIG. 17A, and FIG. 17D is a view of FIG. 17B. This is a view with the support substrate 310 removed.

Referring to FIGS. 9 to 17D , the image sensor unit 350 may include a fixed unit and an OIS moving unit disposed to be spaced apart from the fixed unit. The image sensor unit 350 may include a support part connecting the fixed part and the OIS moving part.

For example, the support portion may include a support substrate 310 . Or, for example, the support portion may be the support substrate 310. In another embodiment, the support member may be an elastic member, such as a leaf spring or suspension wire, instead of the support substrate 310.

The fixed part may be a fixed part of the camera device 10 that does not move during OIS operation. For example, the fixing part may include a second substrate part 800. For example, the fixing part may include a component that is coupled to the second substrate part 800. The term substrate unit 255 or 800 may be alternatively expressed as “substrate” or “circuit board.”

For example, the fixing part may include a base 210 coupled to the second substrate 800. For example, the fixing unit may include the housing 140 of the AF driver and components disposed on the housing 140, for example, a magnet 130, a first position sensor 170, and a circuit board 180. Additionally, the fixing part may include a cover member 300 coupled to the base 210. The OIS moving unit may be disposed inside the cover member 300. For example, the cover member 300 can accommodate the moving part and the support substrate 310.

The OIS moving unit may include an image sensor 810. The OIS moving unit may further include a first substrate 255 that is spaced apart from the second substrate 800 and is electrically connected to the second substrate 800 . Also, for example, the OIS moving unit includes a component disposed on the first substrate portion 255, for example, at least one of a heat dissipation member 280, a holder 270, a second coil 230, and a second position sensor 240. can do. The holder 270 may also be alternatively expressed as a “spacing member.” In another embodiment, the holder 270 may be omitted and the second coil 230 may be disposed on the first substrate 255, for example, the first circuit board 250.

For example, the camera device 10 includes a fixed part, a moving part including a first heat radiator 280 disposed on the fixed part, and an image sensor 810 disposed on the first heat radiating body 280, and the moving part includes an optical axis. It may include a support portion (for example, 310) that supports movement in a direction perpendicular to the direction. The support part (eg, 310) may be connected between the moving part and the fixed part.

The moving portion may include a first substrate portion 255 on which the image sensor 810 is disposed, and the fixed portion may include a second substrate portion 800 disposed spaced apart from the first substrate portion 255, The support portion may connect the first substrate portion 255 and the second substrate portion 800.

The support portion includes a conductive layer 93-1, a first insulating layer 94-1 disposed below the conductive layer 93-1, and a second insulating layer 94- disposed on the conductive layer 93-1. 2) may be included. In the support portion, a portion of the first insulating layer 94-1 may not be disposed, thereby exposing a portion of the conductive layer 93-1.

The first substrate 255 includes a first circuit board 250 connected to the support part, a second circuit board 260 electrically connected to the image sensor 810, and a first circuit board 250 and a second circuit. It may include solder 901 that electrically connects the substrate 260.

The camera device 10 may include an elastic member 220 (hereinafter referred to as a “wire”) to elastically support the OIS moving part with respect to the fixed part. The elastic member 220 may be in the form of a wire or spring.

For example, one end of the wire 220 may be coupled to the upper elastic member 150 (or housing 140), and the other end of the wire 220 may be coupled to the holder 270. For example, one end of the wire 220 may be coupled to the first outer frame 152 (eg, the second coupling portion 520) of the upper elastic member 150 using solder or a conductive adhesive. For example, the other end of the wire 220 may be coupled to the terminal portion 37 using solder or a conductive adhesive, and the terminal portion 37 may be placed on or coupled to the holder 270 .

Referring to FIGS. 7A and 7B , a damper DA may be disposed between one end of the wire 220 passing through the hole 147 of the housing 140 and the hole 147 of the housing 140. For example, at least a portion of the damper DA may be disposed in the hole 147 of the housing 140, and may be coupled to or attached to at least a portion of the wire 220 and the housing 140.

For example, the wire 220 may be arranged parallel to the optical axis. For example, the wire 220 may be placed at a corner of the housing 140 or/and a corner of the holder 270. For example, the wire 220 may include four wires 220-1 to 220-4. Each of the four wires 220-1 to 220-4 may be disposed at a corresponding one of the four corners of the housing 140 and/or the four corners of the holder 270.

Referring to FIGS. 10A and 10B , a hole 271 may be formed in the holder 270 through which at least a portion of the wire 220 passes. For example, a hole 271 through which the other end of the wire 220 passes may be formed at a corner of the holder 270. For example, a hole 271 may be formed at each of the four corners of the holder 270. For example, the hole 271 may be a through hole that penetrates the holder 270 in the optical axis direction, but in other embodiments, it may be in the form of an escape groove.

For example, the terminal portion 27 may be disposed on or coupled to the upper or lower surface of the holder 270. For example, the terminal portion 27 may be disposed or coupled to the lower surface of a corner of the holder 270. A groove 28A for placing the terminal portion 37 may be formed in the holder 270. For example, the groove 28A may be formed on the lower surface of the corner of the holder 270.

For example, the terminal portion 27 may include at least one hole 81A for coupling to the holder 270. The terminal portion 37 and the holder 270 may be coupled to each other by adhesive or heat fusion. For example, the hole 81A may be a hole through which adhesive is injected.

Additionally, the terminal portion 37 may include a hole 171A into which the other end of the wire 220 is inserted or coupled. For example, the holes 81A and 171A may be through holes.

For example, the terminal portion 37 may include a body 81 coupled to the holder 270. The body 81 may include a coupling portion 171 coupled to the wire 220. The coupling portion 171 may include a hole 171A coupled to the wire 220. The coupling portion 171 may be coupled to the wire 220 using solder or conductive adhesive. For example, the other end of the wire 220 that passes through the hole 171A of the coupling portion 171 may be coupled to the lower or lower surface of the coupling portion 171 using solder or a conductive adhesive.

The terminal portion 37 may include a connection portion 172 that connects the body 81 and the coupling portion 171. The width of the connection portion 172 may be smaller than the width of the body 81. Also, for example, the width of the connecting portion 152 may be smaller than the width (or diameter) of the coupling portion 171.

For example, the terminal portion 37 may include an extension portion (not shown) extending from the body 81. The extension portion of the terminal portion 37 may be bent and extended downward from the body 81. For example, the extension portion of the terminal portion 37 may extend toward the hole 59 of the base 210. The extension of the terminal portion may be expressed as a “bent portion” instead.

For example, the terminal unit 37 may include four terminals 37A to 37D corresponding to four wires 220-1 to 220-4. Each of the terminals 37A to 37D may be disposed at a corresponding one of the corners of the holder 270 and may be coupled to a corresponding one of the wires 220-1 to 220-4. The description of FIG. 10A may be applied or applied mutatis mutandis to the structure of each of the terminals 37A to 37D. The terminal portion 37 may be formed of a conductive material, for example, metal. In another embodiment, the terminal portion 37 may be omitted, and the wire 220 may be directly coupled to the holder 270.

Referring to FIG. 14, a damper 49 or an adhesive may be disposed between the terminal portion 37 and the base 210, and the damper 49 contacts, couples, or attaches to the terminal portion 37 and the base 210. It can be. For example, the base 210 may include a hole 59 (or groove) formed at a position corresponding to or opposing the terminal portion 37. For example, the hole 59 (or groove) may be formed at a corner of the base 210.

For example, the damper 49 may be disposed within the hole 59 of the base 210. Alternatively, at least a portion of the extension portion (not shown) of the terminal portion 37 may be disposed in the hole 59 of the base 210, and the damper 49 may be in contact with, coupled to, or attached to the extension portion of the terminal portion 59. You can. The damper may serve to absorb or alleviate the vibration of the OIS moving part, thereby preventing or suppressing oscillation of the OIS moving part when the OIS is driven. In another embodiment, the extension part of the terminal part 37 may be omitted, and the camera device 10 may not include the damper 49 of FIG. 14.

The support substrate 310 may support the OIS moving unit with respect to the fixed unit so that the OIS moving unit can move in a direction perpendicular to the optical axis, or tilt or rotate the OIS moving unit around the optical axis within a preset range.

For example, one end of the support substrate 310 may be connected or coupled to the first substrate portion 255, and the other end of the support substrate 310 may be connected or coupled to the second substrate portion 800. You can.

The holder 270 may be placed below the AF driving unit. For example, the holder 270 may be made of a non-conductive member. For example, the holder 270 may be made of an injection material that is easy to shape through an injection process. Additionally, the holder 270 may be formed of an insulating material. Also, for example, the holder 270 may be made of resin or plastic.

Referring to FIGS. 10A to 10B and FIG. 12A , the holder 270 may include an upper surface, a lower surface opposite to the upper surface, and a side (eg, outer surface) connecting the upper surface and the lower surface. For example, the lower surface of the holder 270 may face or face the second substrate portion 800 .

The holder 270 may support the first substrate 255 and be coupled to the first substrate 266. For example, the first substrate portion 255 may be disposed below the holder 270. For example, the bottom, bottom, or bottom of the holder 270 may be coupled to the top, top, or top of the first substrate portion 255. For example, the holder 270 may be coupled to the first substrate portion 255 using an adhesive. For example, in another embodiment, the first substrate portion 255 may be disposed above the holder 270.

The holder 270 may accommodate or support the second coil 230. The holder 270 may support the second coil 230 so that the second coil 230 is disposed to be spaced apart from the first substrate portion 255 . For example, at least a portion of the holder 270 may be disposed between the second coil 230 and the first substrate 255.

For example, the holder 270 may include an accommodating part 39 for placing or receiving the second coil 230. For example, the accommodating part 39 may be in the shape of a groove. For example, the receiving portion 39 may be a groove recessed from the upper surface of the holder 270. For example, the holder 270 may include grooves 39A to 39D corresponding to the coil units 230-1 to 230-4 of the second coil 230. Each of the coil units 230-1 to 230-4 may be placed in a corresponding one of the grooves 39A to 39D of the holder 270.

The holder 270 may include an opening 70 corresponding to one area of the first substrate portion 255 . For example, the opening 70 of the holder 270 may be a through hole that penetrates the holder 270 in the optical axis direction. For example, the opening 70 of the holder 270 may correspond to, oppose, or overlap the image sensor 810 in the optical axis direction.

The shape of the opening 70 of the holder 270 when viewed from above may be polygonal, for example, square, circular or oval, but is not limited thereto and may be implemented in various shapes.

For example, the opening 70 of the holder 270 is shaped to expose the image sensor 810, a portion of the top surface of the first circuit board 250, a portion of the top surface of the second circuit board 260, and elements, or You can have any size. For example, the area of the opening 70 of the holder 270 may be larger than the area of the image sensor 810 and may be larger than the area of the opening 250A of the first circuit board 250.

Referring to FIGS. 11 and 12A , the holder 270 may include holes 41A, 41B, and 41C corresponding to the second position sensor 240. For example, the holder 270 may include holes 41A, 41B, and 41C formed at positions corresponding to each of the first to third sensors 240A, 240B, and 240C of the second position sensor 240. .

For example, the holes 41A, 41B, and 41C may be placed adjacent to the corners of the holder 270. The holder 270 may include a dummy hole 41D formed adjacent to a corner of the holder 270 that does not correspond to the second position sensor 240. The dummy hole 41D may be formed to balance the weight of the OIS moving part when the OIS is driven. The dummy hole 41D may be a through hole. In another embodiment, the dummy hole 41D may not be formed. The holes 41A, 41B, and 41C may be through holes that penetrate the holder 270 in the optical axis direction. In other embodiments, the holes 41A, 41B, and 41C of the holder 270 may be omitted.

At least one coupling protrusion 51 may be formed on the upper surface of the holder 270 to be coupled to the second coil 230. For example, the coupling protrusion 51 may be inserted, placed, or coupled to the hollow of the coil unit of the second coil 230.

The coupling protrusion 51 may protrude from the upper surface of the holder 270 in an upward direction or in a direction toward the AF driving unit. For example, the coupling protrusion 51 may protrude from the bottom surface of the receiving portion 39. For example, the coupling protrusion 51 may be formed adjacent to each of the holes 41A to 41D of the holder 270.

For example, two coupling protrusions 51A and 51B may be placed or arranged to correspond to one hole 41A, 41B, 41C and 41D of the holder 270. For example, the holes 41A, 41B, 41C, and 41D of the holder 270 may be located between the two coupling protrusions 51A and 51B.

Holder 270 may include at least one protrusion 27A, 27B. The protrusions 27A and 27B may protrude from the upper surface of the holder 270. For example, the protrusions 27A and 27B may protrude from the outer surface of the holder 270 toward the optical axis or upward.

For example, the holder 270 may include two protrusions 27A and 27B that face or overlap in the second horizontal direction (eg, X-axis direction).

Referring to FIG. 12A , for example, the holder 270 may include a plurality of sides 57A to 57D (or side plates). Additionally, the holder 270 may include a plurality of corner portions CR1 to CR4 or corners.

For example, each corner of the holder 270 may include each corner of the holder 270. At this time, the corner of the holder 270 may be a corner where two adjacent outer surfaces of the holder 270 meet each other. For example, each corner of the holder 270 may be an area located outside the hole 271 of the holder 270. For example, each corner of the holder 270 may be an area closer to each corner of the holder 270 than the first position of the holder 270. For example, the first location may be a central point located between the center (or center) of each side 57A to 57D of the holder 270 and each corner of the holder 270.

For example, the first protrusion 27A may be formed on the first side 57A of the holder 270, and the second protrusion 27B may be formed on the second side 57B of the holder 270. For example, the protrusions 27A and 27B may be disposed or located at the center of the side (or side plate) of the holder 270.

Holder 270 may include a groove 341a. The groove 341a may be an adhesive receiving groove. The groove 341a may be formed on the outer surface of the protrusions 27A and 27B of the holder 270. The groove 341a may be formed on the upper surface of the protrusions 27A and 27B of the holder 270. The groove 341a may be formed from the top to the bottom of the protrusions 27A and 27B of the holder 270. An adhesive for adhering the support substrate 310 to the holder 270 may be disposed in the groove 341a. The groove 341a may include a plurality of grooves. For example, the groove 341a may extend in the optical axis direction. In another embodiment, the groove of the holder 270 may extend in a direction perpendicular to the optical axis.

The first substrate portion 255 may include a first circuit board 250 and a second circuit board 260 that are electrically connected to each other. The second circuit board 260 may be alternatively expressed as a “sensor board.” In another embodiment, the heat dissipation member 280 may be included in the first substrate portion 255.

The first substrate portion 255 may be disposed on the lower surface of the holder 270. For example, the first substrate portion 255 may be coupled to the lower surface of the holder 270. For example, the first circuit board 250 may be placed on and/or coupled to the lower surface of the holder 270. For example, the first surface of the first circuit board 250 may be coupled or attached to the lower surface of the holder 270 by an adhesive member.

At this time, the first surface of the first circuit board 250 may face or oppose the AF driver and may be a surface on which the second position sensor 240 is disposed. Additionally, the second side of the first circuit board 250 may be the opposite side of the first side of the first circuit board 250.

The first circuit board 250 may be alternatively expressed as a sensor board, main board, main circuit board, sensor circuit board, or mobile circuit board. In all embodiments, the first circuit board 250 may be replaced with “second substrate” or “second circuit board,” and the second circuit board 260 may be replaced with “first substrate” or “first circuit board.” It can also be expressed by replacing it with “circuit board.”

The first circuit board 250 includes a second position sensor (240: 240A, 240B) for detecting movement of the OIS moving part in a direction perpendicular to the optical axis direction and/or rotation, tilting, or rolling of the OIS moving part based on the optical axis. , 240C) can be placed. Additionally, a control unit 830 and/or a picture element (eg, a capacitor) may be disposed on the first circuit board 250.

The first circuit board 250 may include first terminals E1 to E8 to be electrically connected to the second coil 230. Here, the first terminals E1 to E8 may be alternatively expressed as “first pads” or “first bonding parts.” The first terminals E1 to E8 of the first circuit board 250 may be placed or arranged on the first surface 60A of the first circuit board 250. For example, the first circuit board 250 may be a printed circuit board or a flexible printed circuit board (FPCB).

The first circuit board 250 may include an opening 250A corresponding to or opposing the openings of the lens module 400 and the bobbin 110. For example, the opening 250A of the first circuit board 250 may be a through hole or a hollow penetrating the first circuit board 250 in the optical axis direction, and may be formed in the center of the first circuit board 250. .

When viewed from above, the shape of the first circuit board 250, for example, the outer circumference shape, may match or correspond to that of the holder 270, for example, a square shape. Additionally, when viewed from above, the shape of the opening 250A of the first circuit board 250 may be polygonal, for example, square, or circular or oval. For example, the opening 250A of the first circuit board 250 may open or expose the image sensor 810 and/or the opening 260A of the second circuit board 260.

Additionally, the first circuit board 250 may include at least one terminal 251 to be electrically connected to the second circuit board 260. Here, the terminal 251 of the first circuit board 250 may be expressed as a “pad” or a “bonding part” instead. The terminal 251 of the first circuit board 250 may be placed or arranged on the lower surface of the first circuit board 250.

For example, there may be a plurality of terminals 251, and the plurality of terminals 251 are arranged in a direction parallel to one side in the area between the opening 250A of the first circuit board 250 and one side. can be arranged. For example, the plurality of terminals 251 may be arranged to surround the opening 250A.

The second circuit board 260 may be disposed below the first circuit board 250 . The second circuit board 260 may be electrically connected to the image sensor 810.

When viewed from above, the second circuit board 260 may be polygonal (eg, rectangular, square, or rectangular), but is not limited thereto, and may be circular or oval in other embodiments.

For example, the area of the outer peripheral surface of the square-shaped second circuit board 260 may be larger than the area of the opening 250A of the first circuit board 250. For example, the lower side of the opening 250A of the first circuit board 250 may be shielded or blocked by the second circuit board 260.

For example, when viewed from the top or bottom, the outer surface (or side) of the second circuit board 260 is the outer surface (or side) of the first circuit board 250 and the opening (or side) of the first circuit board 250. 250A).

For example, the second circuit board 260 may include an opening 250A of the first circuit board 250 and/or an opening 260A corresponding to the image sensor 810. The opening 260A of the second circuit board 260 may be a hole or a hollow penetrating the second circuit board 260 in the optical axis direction, and may be formed in the center of the second circuit board 260.

For example, the opening 260A of the second circuit board 260 may open or expose the image sensor 810. For example, the image sensor 810 may be disposed within the opening 260A of the second circuit board 260 and may be electrically connected to the second circuit board 260. For example, the image sensor 810 may be electrically connected to the second circuit board 260 through a wire.

In another embodiment, the opening 260A may not be formed in the second circuit board 260, and the image sensor 810 may be disposed on the upper surface of the second circuit board 260.

In another embodiment, the heat dissipation member 280 may be omitted, and in an embodiment in which the heat dissipation member 280 is omitted, the image sensor 810 may not have an opening 260A formed in the second circuit board 260. , the image sensor 810 may be disposed on the upper surface of the second circuit board 260.

For example, in an embodiment in which the heat dissipation member 280 is omitted, the image sensor 810 may be disposed on the upper surface of a single board in which the first and second circuit boards are integrally formed.

The second circuit board 260 may include at least one terminal 261 that is electrically connected to at least one terminal 251 of the first circuit board 250. For example, the number of terminals 261 of the second circuit board 260 may be plural.

For example, at least one terminal 261 of the second circuit board 260 may be formed on the side or outer surface of the second circuit board 260 connecting the upper and lower surfaces of the second circuit board 260. The upper surface of the second circuit board 260 may be a surface facing the first circuit board 250, and the lower surface of the second circuit board 260 may be a surface opposite to the upper surface of the second circuit board 250. For example, the terminal 261 may be in the form of a groove recessed from the side of the second circuit board 260. Or, for example, the terminal 261 may be in the form of a semicircular or semielliptical via formed on the side of the second circuit board 260. In another embodiment, at least one terminal of the second circuit board 260 that is electrically connected to the second terminal 251 of the first circuit board 250 may be formed on the upper surface of the second circuit board 260. .

For example, the terminal 261 of the second circuit board 260 may be coupled to the terminal 251 of the first circuit board 250 by solder 901 (see FIG. 11) or a conductive adhesive member. In Figure 13, only one solder 901 is shown in the enlarged dotted line portion connecting any one terminal of the second circuit board 260 and any one terminal 251 of the first circuit board. Solder may be provided to join the other terminal of 260 and the corresponding terminal of the first circuit board 250.

For example, the first and second circuit boards 250 and 260 may be printed circuit boards or FPCBs. Additionally, at least one of the first and second circuit boards 250 and 260 may be an organic substrate or a ceramic substrate.

The heat dissipation member 280 may be disposed or coupled to the first substrate portion 255 . For example, the heat dissipation member 280 may be disposed or coupled to the second circuit board 260. For example, the heat dissipation member 280 may be disposed below the second circuit board 260. For example, the heat dissipation member 280 may be coupled or fixed to the lower surface of the second circuit board 260. For example, at least a portion of the upper surface of the heat dissipation member 280 may be coupled or fixed to the lower surface of the second circuit board 260 using an adhesive.

The term “heat dissipation member” may be alternatively expressed as “heat dissipation sheet”, “heat dissipation tape”, “heat dissipation layer”, “heat dissipation film”, “heat dissipation plate”, “heat dissipation plate”, or “heat dissipation body”.

In another embodiment, the heat dissipation member 280 may be included in the first substrate portion 255, and the image sensor 810 may be disposed on the first substrate portion 255.

The opening 260A of the second circuit board 260 may open or expose at least a portion of the heat dissipation member 280. The image sensor 810 may be disposed, attached, or coupled to at least a portion of the heat dissipation member 280 exposed by the opening 260A. For example, the image sensor 810 may be fixed, attached, or coupled to the heat dissipation member 280 using an adhesive. For example, the image sensor 810 may be disposed on the first substrate 255.

For example, at least one area of the upper surface of the heat dissipating member 280 may be exposed by the opening 260A, and the image sensor 810 may be exposed to at least one area of the upper surface of the heat dissipating member 280 exposed by the opening 260A. It may be placed, attached, or coupled to a surface.

In another embodiment, the second circuit board 260 may include a groove formed on the lower surface to accommodate or place the heat dissipation member 280.

In another embodiment, the opening 260A may not be formed in the second circuit board 260, and the heat dissipation member 280 may be fixed, attached, or coupled to the lower surface of the second circuit board 260. In another embodiment, the heat dissipation member 280 may be omitted.

For example, the heat dissipation member 280 may be a plate-shaped member with a preset thickness and hardness. Additionally, the heat dissipation member 280 can improve the heat dissipation effect by dissipating heat generated from the heat source of the first substrate portion 255 to the outside. At this time, the heat source of the first substrate 255 is an electronic device (or circuit element) disposed on the first substrate 255, for example, the image sensor 810, the control unit 830, and the second position sensor 240. , or/and may be a capacitor.

For example, the heat dissipation member 280 may include at least one of a metal material with high thermal conductivity and high heat dissipation efficiency, for example, SUS, aluminum, nickel, phosphorus, bronze, or copper.

Additionally, the heat dissipation member 280 can stably support the image sensor 810 and serve as a reinforcing material to prevent the image sensor 810 from being damaged by external impact or contact.

In other implementations, the heat dissipation member 280 may be formed of a heat dissipation member with high thermal conductivity, for example, heat dissipation epoxy, heat dissipation plastic (eg, polyimide), or heat dissipation synthetic resin.

For example, in embodiments of the present invention, the term "heat dissipation member" may be used as "heat sink", "heatsink", "heat sink", "heat dissipation sheet", plate, metal plate, reinforcement, or stiffener. It can also be expressed alternatively.

In order to improve the heat dissipation effect, the heat dissipation member 280 may include a preset pattern including at least one groove or at least one unevenness. For example, grooves or irregularities having a preset pattern may be formed on the lower surface of the heat dissipation member 280.

For example, a preset pattern may include a plurality of grooves formed at preset intervals. For example, the preset pattern may have a stripe shape. In another embodiment, the preset pattern may have a net shape or a mesh shape. In another embodiment, the preset pattern may have a shape including dots that are spaced apart from each other. For example, the shape of the dot may be circular, oval, or polygonal (eg, square).

In another embodiment, the preset pattern may be formed on at least one of the top, bottom, or outer surface of the heat dissipation member 280. In another embodiment, the heat dissipation member may include holes or through-holes instead of grooves or convexities. Since the heat dissipation member 280 moves together with the OIS moving part, it may be spaced apart from the fixed part, for example, the second substrate part 800. The heat dissipation member 280 may include at least one escape groove 281 (see FIG. 10A) to avoid spatial interference with the solder 901.

In FIG. 13, the first circuit board 250 and the second circuit board 260 are electrically coupled by solder 901, but in another embodiment, the first circuit board and the second circuit board are integrated into one circuit board. It can also be implemented as:

The second coil 230 may be disposed or coupled to the OIS moving part. For example, the second coil 230 may be placed on the holder 270. The second coil 230 may be disposed on the upper surface of the holder 270. The second coil 230 may be placed below the magnet 130.

The second coil 230 may be coupled to the holder 270. For example, the second coil 230 may be coupled or attached to the upper surface of the holder 270. For example, the second coil 230 may be coupled to the coupling protrusion 51 of the holder 270. The second coil 230 can move the OIS moving part by interaction with the magnet 130.

For example, the second coil 230 may correspond to, face, or overlap the magnet 130 disposed on the fixing unit in the direction of the optical axis (OA). In another embodiment, the fixing unit may include an OIS-only magnet that is separate from the magnet of the AF driving unit, and the second coil may correspond to, face, or overlap the OIS-only magnet. At this time, the number of magnets for OIS may be equal to the number of coil units included in the second coil 230.

In another embodiment, it may be placed on the fixed part of the second coil 230, and the OIS magnet 71B of the magnet 130 may be placed on the OIS moving part. At this time, the second coil 230 may be electrically connected to the support substrate 310 and/or the second substrate portion 800 through a conductive member.

For example, the second coil 230 may include a plurality of coil units 230-1 to 230-4. For example, the second coil 230 may include four coil units 230-1 to 230-4 disposed at four corners of the holder 270. For example, at least a portion of each of the coil units 230-1 to 230-4 may be disposed at a corresponding one of the corners of the holder 270. A portion of each of the coil units 230-1 to 230-4 may be disposed on a side adjacent to a corresponding one of the corners of the holder 270.

Each of the coil units 230-1 to 230-4 may be in the form of a coil block having a closed curve or ring shape. For example, each coil unit may have a hollow or hole. For example, the coil units may be formed as a Fine Pattern (FP) coil, a wound coil, or a coil block. For example, the hollow or hole of the coil units 230-1 to 230-4 may be inserted into or coupled to the protrusion 51 of the holder 270.

In another embodiment, the second coil 230 may be disposed on the first circuit board 250 or may be combined with the first circuit board 250.

The second coil 230 may be electrically connected to the first circuit board 250. For example, the first coil unit 230-1 may be electrically connected to the two terminals E1 and E2 of the first circuit board 250, and the second coil unit 230-2 may be connected to the first circuit board 250. It can be electrically connected to the other two terminals (E3, E4) of the first circuit board 250, and the third coil unit 230-3 is connected to the other two terminals (E5, E6) of the first circuit board 250. may be electrically connected to , and the fourth coil unit 230 - 4 may be electrically connected to another two terminals E7 and E8 of the first circuit board 250 .

Power or a driving signal may be provided to the first to fourth coil units 230-1 to 230-4 through the first circuit board 250. The power or driving signal provided to the second coil 230 may be a direct current signal or an alternating current signal, or may include a direct current signal and an alternating current signal, and may be in the form of a current or voltage.

By the interaction of the first to fourth magnet units 130-1 to 130-4 and the first to fourth coil units 230-1 to 230-4, the OIS moving unit moves in the first horizontal direction or the second It may move in a horizontal direction or may be rolled relative to the optical axis.

For example, current may be applied independently to at least three of the four coil units 230-1 to 230-4. In another embodiment, current may be applied independently to at least two of the four coil units 230-1 to 230-4.

For example, a separate and independent driving signal, for example, a driving current, may be provided to each of the four coil units 230-1 to 230-4.

The control units 830 and 780 may supply at least one drive signal to at least one of the first to fourth coil units 230-1 to 230-4, and control the at least one drive signal to operate the OIS moving unit It can be moved in the axial direction and/or Y-axis direction, or the OIS moving part can be rotated within a preset angle range around the optical axis. Hereinafter, the “control unit” may be at least one of the control unit 830 of the camera device 10 or the control unit 780 of the optical device 200A.

When driving the second coil 230 through three channels, three independent driving signals may be supplied to the second coil 230. For example, among the four coil units, two coil units (e.g., 230-2 and 230-4, or 230-1 and 230-3) facing each other diagonally may be connected in series, and two coil units connected in series One driving signal may be provided to each of the four coil units, and an independent driving signal may be provided to each of the remaining two coil units among the four coil units.

Alternatively, when driving the second coil 230 through 4 channels, independent driving signals may be provided to each of the four separate coil units 230-1 to 230-4.

Figure 18a is for explaining the movement of the OIS moving part in the X-axis direction, and Figure 18b is for explaining the movement of the OIS moving part in the y-axis direction.

The N pole and S pole of each of the first and third magnet units 71B1 and 71B3 facing each other in the first diagonal direction may be arranged to face each other in the first horizontal direction (eg, Y-axis direction). In addition, the N pole and S pole of each of the second and fourth magnet units 71B2 and 71B4 facing each other in the second diagonal direction perpendicular to the first diagonal direction are aligned with each other in the second horizontal direction (e.g., X-axis direction). They can be arranged to face each other.

That is, the direction in which the N and S poles of the first magnet unit 71B1 face each other may be the same or parallel to the direction in which the N and S poles of the third magnet unit 71B3 face each other. Additionally, the direction in which the N and S poles of the second magnet unit 71B2 face each other may be the same as or parallel to the direction in which the N and S poles of the fourth magnet unit 71B3 face each other.

In another embodiment in which the second magnet 71B is a two-pole magnet, the N pole of each of the first to fourth magnet units 71B1 to 71B4 is located inside the boundary line (or boundary surface) between the N pole and the S pole. It can be done, and the S pole can be located on the outside. In another embodiment, the S pole of each of the first to fourth magnet units 71B1 to 71B4 may be located on the inside and the N pole may be located on the outside based on the boundary line between the N pole and the S pole. The boundary line (or boundary surface) is a substantially non-magnetic part that separates the N and S poles and may be a part with little polarity.

Referring to FIG. 18A, the first electromagnetic force (Fx1) (or Fx3) and the fourth coil unit (230-4) and the first electromagnetic force (Fx1) (or Fx3) due to interaction between the second coil unit (230-2) and the second magnet unit (71B2) The OIS moving unit may move or shift in the X-axis direction by the second electromagnetic force (Fx2) (or Fx4) caused by the interaction between the four magnet units (71B4). For example, the directions of the first electromagnetic force (Fx1) (or Fx3) and the second electromagnetic force (Fx2) (or Fx4) may be in the same direction.

Referring to FIG. 18B, the third electromagnetic force Fy1 (or Fy3) and the third coil unit 230-3 and the third electromagnetic force Fy1 (or Fy3) due to the interaction between the first coil unit 230-1 and the first magnet unit 71B1. The OIS moving unit may move or shift in the y-axis direction by the fourth electromagnetic force (Fy2) (or Fy4) caused by the interaction between the three magnet units (71B3). For example, the directions of the third electromagnetic force (Fy1) (or Fy3) and the fourth electromagnetic force (Fy2) (or Fy4) may be in the same direction.

Figure 18c is for explaining clockwise rotation of the OIS moving part during 4-channel driving, and Figure 18d is for explaining counterclockwise rotation of the OIS moving part during 4-channel driving.

Referring to Figure 18c, the first electromagnetic force (FR1) due to the interaction between the first coil unit (230-1) and the first magnet unit (71B1), the second coil unit (230-2) and the second magnet unit ( 71B2), the second electromagnetic force (FR2) due to the interaction between the third coil unit (230-3) and the third magnet unit (71B3), and the fourth coil unit (230). -4) and the fourth electromagnetic force (FR4) resulting from the interaction between the fourth magnet unit (71B4), the OIS moving unit can rotate, tilt, or roll clockwise around the optical axis or around the optical axis as the axis.

Also, referring to FIG. 18D, the first electromagnetic force FL1 caused by the interaction between the first coil unit 230-1 and the first magnet unit 71B1, the second coil unit 230-2 and the second magnet unit The second electromagnetic force (FL2) due to the interaction between (71B2), the third electromagnetic force (FL3) due to the interaction between the third coil unit (230-3) and the third magnet unit (71B3), and the fourth coil unit ( 230-4) and the fourth magnet unit 71B4, the fourth electromagnetic force (FL4) causes the OIS moving part to rotate, tilt, or roll counterclockwise around the optical axis or with the optical axis as the axis. there is.

For example, the direction of the first electromagnetic force FR1 (or FL1) and the direction of the third electromagnetic force FR3 (or FL3) may be opposite to each other. Also, for example, the direction of the second electromagnetic force FR2 (or FL2) and the direction of the fourth electromagnetic force FR4 (or FL4) may be opposite to each other. Also, for example, the direction of the first electromagnetic force RF1 (or FL1) and the direction of the second electromagnetic force FR2 (or FL2) may be perpendicular to each other.

In the case of 3-channel driving, a driving signal may not be provided to two coil units connected in series (e.g., 130-1 and 130-3, or 130-2 and 130-4), and as a result, two coil units connected in series Electromagnetic force may not be generated by the coil units. For example, in the case of 3-channel driving, FR2 and FR4 may be omitted in FIG. 18C and FR1 and FR3 may exist. Alternatively, in the case of 3-channel driving, R2 and FR4 may exist and FR1 and FR3 may be omitted in FIG. 18C. Additionally, in the case of 3-channel driving, FL2 and FL4 may be omitted in FIG. 18D and FL1 and FL3 may exist. Alternatively, in the case of 3-channel driving, FL2 and FL4 may exist and FL1 and FL3 may be omitted in FIG. 18D.

Compared to the 3-channel drive, according to the 4-channel drive of FIGS. 18C and 18D, the electromagnetic force for rotation of the OIS moving part can be improved, and thus the first to fourth coil units 230-1 to 230-4 ) can be reduced, thereby reducing power consumption.

In the embodiment of FIG. 2, OIS drive for hand shake correction is performed using the second magnet 71B and the second coil 230, but in another embodiment, OIS drive for hand shake correction is performed using a shape memory alloy member. It can also be done. For example, the shape memory alloy member may be coupled to the fixed part and the OIS moving part, and may be electrically connected to the first substrate part 255. The control units 830 and 780 may supply a driving signal to the shape memory alloy member, and may move the OIS moving part in a direction perpendicular to the optical axis by the shape memory alloy member, or rotate, tilt, or rotate the OIS moving part around the optical axis. It can be rolled.

In another embodiment, OIS driving is performed using the second magnet 71B and the second coil 230, and the camera device 10 is installed between the base 210 and the holder 270 to support the OIS moving part. It may include a disposed ball member (not shown). At this time, the ball member uses friction or/and rolling force between the base 210 and the holder 270 to move the OIS so that the OIS moving part can move in a direction perpendicular to the optical axis or rotate, tilt, or roll based on the optical axis. Wealth can be supported. For example, in an embodiment, a ball member may be disposed in the hole 59 of the base 210, and the ball member may contact the base 210 and the holder 270, respectively. In another embodiment, the ball member may be provided, and the terminal portion 37 and the wire 220 may be omitted.

The second position sensor 240 may be disposed, coupled, or mounted on the first surface (eg, top surface) of the first circuit board 250. The second position sensor 240 may detect movement or displacement of the OIS moving part in a direction perpendicular to the optical axis direction, for example, a shift or movement of the OIS moving part in a direction perpendicular to the optical axis direction. Additionally, the second position sensor 240 may detect rotation, rolling, or tilting of the OIS moving part within a preset range based on or about the optical axis. The first position sensor 170 may be expressed as an “AF position sensor”, and the second position sensor 240 may be expressed as an “OIS position sensor.”

The second position sensor 240 may face or overlap the magnet 130 in the optical axis direction. For example, the second position sensor 240 may face or overlap the second magnet 71B in the optical axis direction. For example, the second position sensor 240 corresponds to or overlaps three or more of the four magnet units (71B1 to 71B4) of the second magnet (71B) in the optical axis direction in order to detect the movement of the OIS moving part. May include sensors.

For example, the second position sensor 240 may be placed below the second coil 230.

For example, the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. For example, the sensing element of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. The sensing element may be a part that senses a magnetic field.

For example, the center of the second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. For example, the center of the second position sensor 240 may be the spatial center in the x-axis and y-axis directions in the xy coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be the spatial center in the x-axis, y-axis, and z-axis directions.

In another embodiment, at least a portion of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis.

For example, the second position sensor 240 may overlap the holes 41A to 41C of the holder 270 in the optical axis direction. Also, for example, the second position sensor 240 may overlap the hollow of the second coil 230 in the optical axis direction. Also, for example, the holes 41A to 41C of the holder 270 may at least partially overlap the hollow of the second coil 230 in the optical axis direction.

For example, at least a portion of the second position sensor 240 may have an optical axis direction, for example, the center of the second position sensor 240 may not overlap with the second coil 230 .

For example, the second position sensor 240 may include a first sensor 240A, a second sensor 240B, and a third sensor 240C that are arranged to be spaced apart from each other.

For example, each of the first to third sensors 240A, 240B, and 240C may be a Hall sensor. In another embodiment, each of the first to third sensors 240A, 240B, and 240C may be a driver IC including a Hall sensor and a driver. The description of the first position sensor 170 may be applied or inferred from the first to third sensors 240A, 240B, and 240C. For example, each of the first to third sensors 240A2, 240B, and 240C may be a displacement detection sensor whose output voltage changes depending on the position (or relationship) with the corresponding magnet unit.

Each of the first sensor 240, the second sensor 240B, and the third sensor 240C may be electrically connected to the first circuit board 250.

The second position sensor 240 may be disposed under the hollow portion of the second coil 230. In another embodiment, the second position sensor 240 may be disposed outside the second coil 230 when viewed in the optical axis direction or from above.

The second position sensor 240 may not overlap the second coil 230 in a direction perpendicular to the optical axis. For example, the second position sensor 240 may overlap the holder 270 in a direction perpendicular to the optical axis.

For example, the first sensor 240A may be placed below the hollow portion of the first coil unit 230-1. The first sensor 240A may be placed in a corresponding hole 41A among the holes 41A to 41C of the holder 270. The second sensor 240B may be disposed below the hollow portion of the second coil unit 230-2. The second sensor 240B may be disposed in a corresponding hole 41B among the holes 41A to 41C of the holder 270. The third sensor 240C may be disposed below the hollow portion of the third coil unit 230-3. The third sensor 240C may be disposed in another corresponding hole 41C among the holes 41A to 41C of the holder 270.

For example, each of the first to third sensors 240A, 240B, and 240C may not overlap the corresponding coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240A, 240B, and 240C may overlap the holder 270 in a direction perpendicular to the optical axis.

By arranging the first to third sensors 240A, 240B, and 240C in a direction perpendicular to the optical axis so as not to overlap the OIS coil 230, the output of the OIS position sensor 240 is transmitted to the magnetic field of the OIS coil 230. The influence of this can be reduced, and as a result, accurate OIS feedback drive can be performed and reliability of OIS operation can be secured.

The second position sensor 240 may face, correspond to, or overlap the magnet 130 in the optical axis direction. For example, at the initial position of the OIS moving unit, at least a portion of the first sensor 240A may overlap the first magnet unit 71B1 of the second magnet 71B in the optical axis direction. The first sensor 240A may output a first output signal (eg, a first output voltage) according to the result of detecting the magnetic field of the first magnet unit 71B1.

For example, at the initial position of the OIS moving unit, at least a portion of the second sensor 240B may overlap the second magnet unit 71B2 of the second magnet 71B in the optical axis direction, and the magnetic field of the second magnet unit 71B2 A second output signal (eg, a second output voltage) may be output according to the detection result.

Also, for example, at the initial position of the OIS moving unit, at least a portion of the third sensor 240C may overlap with the third magnet unit 71B3 of the second magnet 71B in the optical axis direction, and the third magnet unit 71B3 may overlap with the third magnet unit 71B3 of the second magnet 71B. A third output signal (eg, third output voltage) may be output according to the result of detecting the magnetic field.

The initial position of the OIS moving part is the initial position of the OIS moving part in a state where no power or driving signal is applied to the second coil 230 from the control unit 820, 780, or is elastic only by the weight of the OIS moving part by the support substrate. As it is deformed, it may be the position where the OIS moving part is placed. In addition, the initial position of the OIS moving unit may be a position where the OIS moving unit is placed when gravity acts in the direction from the first substrate unit 255 to the second substrate unit 800, or when gravity acts in the opposite direction.

In order to improve the linearity of the relationship between the output of the second position sensor 250 compared to the displacement of the OIS moving part, each sensor unit (240A, 240B, 240C) within the stroke range of the OIS moving part has a corresponding magnet unit (71B1, 71B2, 71B3) and may overlap in the optical axis direction.

For example, the control units 830 and 780 use at least one of the first output voltage of the first sensor 240A, the second output voltage of the second sensor 240B, and the third output voltage of the third sensor 240C. Thus, the rolling of the OIS moving part can be controlled. For example, the controllers 830 and 780 may control the rolling of the OIS moving unit using the first output voltage and the third output voltage.

For example, the control units 830 and 780 use at least one of the first to third output voltages to move the OIS moving unit in the first horizontal direction (e.g., y-axis direction) or the second horizontal direction (e.g., x-axis direction). The movement or displacement of can be controlled or adjusted. For example, the control units 830 and 780 may control or adjust the movement or displacement of the OIS moving unit in the first horizontal direction (e.g., y-axis direction) using the first output voltage of the first sensor 240A, and the second The movement or displacement of the OIS moving part in the second horizontal direction can be controlled or adjusted using the second output voltage of the sensor 240B.

For example, each of the first to third sensors 240A, 240B, and 240C may be a Hall sensor. In another embodiment, each of the first to third sensors may be a driver IC including a Hall sensor. In another embodiment, each of the first and second sensors 240A and 240B may be a Hall sensor, and the third sensor 240C may be a Tunnel MagnetoResistance (TMR) sensor. At this time, the Tunnel MagnetoResistance (TMR) sensor may be a TMR Magnetic Angle Sensor.

In another embodiment, each of the first to third sensors 240A, 240B, and 240C may be a Tunnel MagnetoResistance (TMR) sensor. At this time, the TMR sensor may be a TMR linear magnetic field sensor whose output is linear according to the displacement (or stroke) of the OIS moving part.

The base 210 may be disposed below the first substrate portion 255 . The base 210 may be spaced apart from the first substrate portion 255 . The base 210 may have a polygonal shape, for example, a square shape, which matches or corresponds to the cover member 300 or the first substrate portion 255 .

For example, the base 210 may include an opening 210A corresponding to or opposing the first substrate portion 255 . The opening 210A of the base 210 may be a through hole that penetrates the base 210 in the optical axis direction. In other embodiments, the base may not have an opening.

For example, the base 210 may be coupled to the side plate 302 of the cover member 300. The side or outer surface of the base 210 may include a step 211 (see FIG. 14) on which adhesive can be applied when bonded to the side plate 302 of the cover member 300. At this time, the step 211 may guide the side plate 302 of the cover member 300 coupled to the upper side. The step 211 of the base 210 and the lower end of the side plate 302 of the cover member 300 may be adhered or fixed with an adhesive or the like.

The base 210 may include at least one protrusion 216A and 216B protruding from the top surface. For example, the protrusions 216A and 216B may protrude upward from the outer surface of the base 210. For example, the base 210 may include two protrusions 216A and 216B that face or overlap each other in the first horizontal direction (eg, Y-axis direction).

For example, the base 210 may include four sides (or side plates), and protrusions 216A and 216B may be formed on two of the four sides. For example, the protrusions 216A and 216B may be disposed or located at the center of the side (or side plate) of the base 210.

Base 210 may include a groove 341b. The groove 341b may be an adhesive receiving groove. The groove 341b may be formed on the outer surface of the protrusions 216A and 216B of the base 210. The groove 341b may be formed on the upper surface of the protrusions 216A and 216B of the base 210. The groove 341b may be formed from the top to the bottom of the protrusions 216A and 216B of the base 210. An adhesive for adhering the support substrate 310 to the base 210 may be disposed in the groove 341b. The groove 341b may include a plurality of grooves. For example, the groove 341b may extend in the optical axis direction. In another embodiment, the grooves formed in the protrusions 216A and 216B of the base 210 may extend in a direction perpendicular to the optical axis.

The second substrate portion 800 may be disposed below the base 210 . For example, the second substrate unit 800 may be arranged to be spaced apart from the OIS moving unit, for example, the first substrate unit 255 and the heat dissipation member 280 in the optical axis direction.

For example, the second substrate portion 800 may be disposed below the base 210. The second substrate portion 800 may be coupled to the base 210 . For example, the second substrate portion 800 may be coupled to the lower surface of the base 210.

The second substrate unit 800 may serve to provide a signal from the outside to the image sensor unit 350 or output a signal transmitted from the image sensor unit 350 to the outside.

The second substrate unit 800 has a first area 801 (or first substrate) corresponding to, facing, or overlapping the AF driver 100 or the image sensor 810 in the optical axis direction, and a connector 804 is disposed. It may include a second area 802 (or a second substrate) and a third area 803 (or a third substrate) connecting the first area 801 and the second area 802. The connector 804 is electrically connected to the second area 802 of the second substrate 800 and may be provided with a port for electrical connection with an external device (e.g., optical device 200A). there is. The opening 210A of the base 210 may be closed or closed by the first area 801 of the second substrate portion 800.

The first area 801 of the second substrate 800 may correspond to, oppose, or overlap at least one of the cover member 300 and the base 210 in the optical axis direction. For example, the first area 801 may overlap the top plate 301 and the side plate 302 of the cover member 300 in the optical axis direction.

Each of the first region 801 and the second region 802 of the second substrate portion 800 may include a rigid substrate. The third region 803 may include a flexible substrate. Additionally, each of the first region 801 and the third region 802 may further include a flexible substrate.

In another embodiment, at least one of the first to third regions 801 to 803 of the circuit board 800 may include at least one of a rigid substrate and a flexible substrate.

The second substrate unit 800 may be disposed behind the first substrate unit 255 . For example, the first substrate unit 255 may be disposed between the AF driving unit 100 and the second substrate unit 800. In another embodiment, the second substrate unit may be disposed between the AF driving unit and the first substrate unit.

When viewed from above, the first area 801 of the second substrate 800 may have a polygonal (e.g., square, square, or rectangular) shape, but is not limited thereto, and may have a circular shape in other embodiments. It may be.

FIG. 20A shows an embodiment of the arrangement of the first to third areas 801 to 803, the extension area 808, the AF moving unit and the OIS moving unit, and the control unit 830 of the second substrate unit 800. indicates.

Referring to FIG. 20A, the first area 801 may include four sides 85A to 85D (or sides). For example, the first area 801 includes first and second sides 85A and 85B that face each other or are located on opposite sides in a second horizontal direction (e.g., X-axis direction), and a first horizontal direction (e.g., It may include third and fourth side parts 85C and 85D that face each other in the Y-axis direction or are located on opposite sides.

The second area 802 may be disposed adjacent to the first side 85A of the first area 801, and the third area 803 may be connected to the first side 85A of the first area 801. You can. For example, the third area 803 may extend from the first area 801 and be connected to one side of the second area 802 opposite the first side 85A.

The second substrate 800 may include a plurality of terminals 800B corresponding to the terminals 311 of the support substrate 310. A plurality of terminals 800B may be formed in the first area 801 of the second substrate portion 800. For example, the second substrate portion 800 has first terminals arranged or spaced apart in the second horizontal direction (e.g., X-axis direction) of the first area 801 along the side of the third side portion 85C ( 800B1) and second terminals 800B2 arranged or spaced apart in a second horizontal direction along the side of the fourth side 85D of the first area 801.

For example, the plurality of terminals 800B may be formed on the first surface (e.g., top surface) of the second substrate portion 800 (e.g., first area 801) facing the first substrate portion 255. there is.

For example, the control unit 830 may be disposed in an extension area extending from one of the third and fourth sides 85C and 85D of the first area 801 of the second substrate unit 800. In another embodiment, the control unit may be disposed in an extension area extending from the side of the first area 801 of the second substrate 800 where a plurality of terminals are formed.

A coupling hole (not shown) may be formed in the first area 801, and a coupling protrusion (not shown) may be formed in the base 210 for engaging with the coupling hole of the first area 801.

The camera device 10 may further include a heat dissipation member 380 disposed, coupled to, or fixed to the second substrate portion 800 . For example, the heat dissipation member 380 may be disposed, coupled, or fixed to the upper surface of the first region 801 of the second substrate portion 800. In other embodiments, the heat dissipation member 380 may be omitted.

The camera device 10 may further include a third heat dissipation member (not shown) disposed, coupled, or fixed to the second surface (eg, bottom) of the second substrate 800.

For example, the heat dissipation member 380 may be a plate-shaped member with a preset thickness and hardness. Additionally, the heat dissipation member 380 may face or overlap the heat dissipation member 280 in the optical axis direction.

In FIG. 20A, the control unit 830 is disposed or coupled to the upper surface of the extension area 808, but in other embodiments, the control unit may be disposed or coupled to the lower surface of the extension area 808.

In FIG. 20A, the control unit 830 is disposed in the extended area 808 of the second substrate unit 800 located outside the cover member 300, but in another embodiment, the control unit is located outside the base 210. 2 It may be disposed in the first area of the substrate unit 800.

In another embodiment, the control unit may be placed or mounted on the second circuit board 260, which is a sensor board. For example, in another embodiment, the control unit may be disposed or mounted on the upper surface of the second circuit board 260. Since the heat dissipation member 280 is disposed or coupled to the lower surface of the second circuit board 260, when the control unit is disposed on the second circuit board 260, the heat generated by the control unit is easily dissipated by the heat dissipation member 280. Since it can be released easily, heat dissipation efficiency and heat dissipation performance can be improved.

FIG. 20B shows a simplified cross-sectional view of the lens module 400, the first substrate 255, the image sensor 810, and the second substrate 800.

Referring to FIG. 20B , the image sensor 810 may be disposed within the opening 260A (or hole) of the second circuit board 260 and may be coupled to the heat dissipation member 280.

For example, the heat dissipation member 280 includes a body 37A disposed below the second circuit board 260 and a protrusion 37B that protrudes from the body 37A and is disposed in the opening 260A of the second circuit board 260. (or a protruding area) may be included.

The image sensor 810 may be placed, coupled, or fixed on the protrusion 37B. For example, the image sensor 810 may be disposed, coupled, or attached to the upper surface of the protrusion 37B. For example, the top surface of the protrusion 37B may be located lower than the top surface of the second circuit board 260. In another embodiment, the top surface of the protrusion 37B may be located at the same height as the top surface of the second circuit board 260.

The heat dissipation member 380 may be disposed on the first surface 801A (or top surface) of the first area 801 of the second substrate portion 800 facing the heat dissipation member 280 in the optical axis direction.

The separation distance G1 (or gap) in the optical axis direction between the first substrate unit 255 and the second substrate unit 800 may be 0.05 [mm] to 0.7 [mm]. For example, the separation distance G1 may be the distance between the lower surface of the heat dissipating member 280 and the upper surface of the heat dissipating member 380.

In another embodiment, G1 may be 0.15 [mm] to 0.5 [mm]. In another implementation, G1 may be 0.15 [mm] to 0.3 [mm]. In another embodiment, G1 may be 0.2 [mm] to 0.3 [mm].

The second substrate portion 800 may include a first conductive layer 93 that is exposed to the first surface 801A and is in contact with the heat dissipation member 380, for example, the lower surface of the heat dissipation member 380. For example, the first conductive layer 93 may be heat-sealed to the lower surface of the heat dissipation member 380 or may be joined using a conductive adhesive, such as solder. Also, for example, the first conductive layer 93 may be electrically connected to the heat dissipation member 380.

The second substrate 800 is connected to the first conductive layer 93 and has a second surface 801B of the second substrate 800 that is opposite to the first surface 801A of the second substrate 800. It may include a second conductive layer 92A exposed from (or the lower surface). For example, the second conductive layer 92A may be electrically connected to the ground of the second substrate portion 800.

The first conductive layer 93 may be in the form of a via that passes through at least a portion of the second substrate portion 800. For example, the first conductive layer 93 may include a first via 93A that penetrates the second substrate 800 and is open or exposed to the second surface 801B of the second substrate 800. . In addition, the first conductive layer 93 may have one end in contact with the lower surface of the heat dissipation member 380, and the other end may include a second via 93B that is in contact with, bonded to, or connected to the second conductive layer 92A. You can.

In FIG. 20B, the second conductive layer 92A may be disposed in, coupled to, or attached to a groove formed on the second surface 801B of the second substrate portion 800-1. In another embodiment, the second conductive layer may be disposed, combined, or attached to the second surface 801B of the second substrate portion 800, which is a flat surface without grooves.

The first conductive layer 93 and the second conductive layer 92A may serve as a heat dissipation pattern or a heat dissipation pad for dissipating heat of the second substrate portion 800. That is, since the first conductive layer 93 and the second conductive layer 92A are simply for heat dissipation purposes, they are not electrically connected to other wiring of the second substrate 800 except the ground of the second substrate 800. It may not be possible. At this time, other wires may be electronic elements (or circuit elements) such as the control units 830 and 780 and the image sensor 810, or wires electrically connected to the support substrate 310.

The second conductive layer 92A may be electrically connected to the cover member 300 (eg, side plate 302) through solder, conductive adhesive, or conductive tape. Alternatively, in another embodiment, the second conductive layer 92A connected to the ground of the second substrate 800 and the cover member 300 may be electrically connected by a bracket. The bracket may be a device that accommodates or stores the camera device in order to protect the camera device. For example, the bracket may be made of a conductive member. By electrically connecting the ground and heat dissipation member 380 of the second substrate 800 and the cover member 300, the camera device 10 can be protected from static electricity and heat dissipation efficiency can be improved.

In another embodiment, at least one of the first conductive layer and the second conductive layer of the second substrate portion 800 may be applied or analogously applied to the second circuit board 260. For example, the second circuit board 260 according to another embodiment may include at least one third conductive layer in contact with the heat dissipation member 280, and at least a portion of the third conductive layer is formed on the second circuit board 260. ) can be exposed from.

Since the heat dissipation member 380 is disposed on the first surface of the second substrate portion 800, the separation distance from the heat dissipation member 280 can be reduced, thereby improving heat dissipation efficiency.

The heat emitted from the heat dissipation member 280 may be transferred to the heat dissipation member 380 through convection or radiation, and the transferred heat may be emitted to the outside through the heat dissipation member 380, thereby providing a heat dissipation effect. It can be improved. Since the upper surface of the heat dissipating member 380 and the lower surface of the heat dissipating member 280 are arranged to face or overlap each other in the optical axis direction, heat can be well transferred from the heat dissipating member 280 to the heat dissipating member 380.

For example, the heat dissipation member 280 and the heat dissipation member 380 may be formed of the same material. In another embodiment, the heat dissipation member 280 and the heat dissipation member 380 may be formed of different materials. For example, the thermal conductivity of the heat dissipation member 280 may be applied to or inferred from the heat dissipation member 380.

Additionally, the heat dissipation member 380 can stably support the second substrate portion 800 and serve as a reinforcing material that prevents the second substrate portion 800 from being damaged due to impact or contact from the outside.

In other implementations, the heat dissipation member 380 may be formed of a heat dissipation member with high thermal conductivity, for example, heat dissipation epoxy, heat dissipation plastic, or heat dissipation synthetic resin.

The heat dissipation member 380 may include at least one groove or at least one unevenness to improve the heat dissipation effect. For example, grooves or irregularities having a preset pattern may be formed on at least one of the upper or lower surface of the heat dissipation member 380.

In another embodiment, the heat dissipation member 380 may include a hole or through hole instead of a groove. For example, the heat dissipation member 380 according to another embodiment may include a plurality of through holes. The description of the preset pattern of the heat dissipation member 280 may be applied or applied mutatis mutandis to the heat dissipation member 380.

A camera device according to another embodiment may include a heat dissipation member disposed below the second substrate portion 800, and in this case, the material of the heat dissipation member is applied or inferred from the description of the material of the heat dissipation member 280 or 380. It can be applied.

The support substrate 310 can support the OIS moving portion so that the OIS moving portion moves in a direction perpendicular to the optical axis with respect to the fixed portion, and can electrically connect the first substrate portion 255 and the second substrate portion 800. .

The support substrate 310 can be expressed as a “support member,” “connection substrate,” or “connection unit.” Alternatively, the support substrate 310 can be expressed as an “interposer.” Alternatively, the “interposer” may include the first circuit board 250 and the support board 310 formed integrally.

In another embodiment, instead of the support substrate 310, a support portion having one end connected to a moving part, for example, the first substrate portion 255 and the other end connected to a fixed portion, for example, the second substrate portion 800, may be provided. It may be possible. For example, the support may include at least one of a leaf spring or a suspension wire. For example, the support portion may electrically connect the first substrate portion 255 and the second substrate portion 800.

The support substrate 310 may include or be a flexible substrate. For example, the support substrate 310 may include a flexible printed circuit board (FPCB). The support substrate 310 may be flexible at least in part. The first circuit board 250 and the support board 310 may be connected to each other.

Referring to FIG. 16 , for example, the support substrate 310 may include a connection portion 320 connected to the first circuit board 250 . For example, the first circuit board 250 and the support substrate 310 may be formed integrally. In another embodiment, the first circuit board 250 and the support board 310 may be configured separately rather than integrated, and may be connected to each other and electrically by a connection portion 320. Alternatively, in another embodiment, the connection portion 320 may be formed integrally with at least one of the support substrate 310 or the first circuit board 250.

Additionally, the support substrate 310 may be electrically connected to the first circuit board 250. The support substrate 310 may be electrically connected to the second substrate portion 800. For example, one end of the support substrate 310 may be connected to or coupled to the first substrate portion 255 (eg, the second circuit board 260). Additionally, the other end of the support substrate 310 may be connected or coupled to the second substrate portion 800.

The support substrate 310 may support the OIS moving unit with respect to the fixed unit. Additionally, the support substrate 310 may guide the movement of the OIS moving unit. The support substrate 310 may guide the OIS moving unit to move in a direction perpendicular to the optical axis direction. The support substrate 310 may guide the OIS moving unit to rotate, tilt, or roll around the optical axis. The support substrate 310 may restrict movement of the OIS moving unit in the optical axis direction.

A part of the support substrate 310 may be coupled, attached, or fixed to the base 210, which is a fixed part, and another part of the support substrate 310 may be coupled, attached, or fixed to the holder 270, which is an OIS moving part. there is.

For example, a portion of the bodies 86 and 87 of the support substrate 310 may be coupled to the base 210, which is a fixed portion (e.g., protrusions 216A and 216B), and other portions of the bodies 86 and 87 may be connected to the OIS. It may be combined with the holder 270, which is a moving part (eg, protrusions 27A and 27B).

The connection portion 320 of the support substrate 310 may be connected to the first substrate portion 255 (eg, the first circuit board 250) and may be electrically connected. The extension portions 7A to 7D of the support substrate 310 may be coupled to the second substrate portion 800 (eg, terminals 800B) and may be electrically connected.

For example, the support substrate 310 may include a circuit member and an elastic portion coupled to the circuit member. The elastic part is for elastically supporting the OIS moving part and may be implemented as an elastic body, for example, a spring. The elastic portion may contain metal or be made of an elastic material. The circuit member is for electrically connecting the first circuit board 250 and the second substrate portion 800, and may be a flexible substrate or may include at least one of a flexible substrate and a rigid substrate. For example, the circuit member may be an FPCB.

For example, the support substrate 310 is connected to the first substrate 255 (e.g., the first circuit board 250) and is electrically connected to the first substrate 255 (e.g., the first circuit board 250). It may include at least one connection part (320A, 320B) connected to.

Additionally, the support substrate 310 may include at least one extension portion 7A to 7D connected to the second substrate portion 800 and electrically connected to the second substrate portion 800, and at least one extension portion 7A to 7D. (7A to 7D) may include a plurality of terminals 311.

For example, the support substrate 310 may be arranged to surround the OIS moving unit, for example, the first substrate unit 255. For example, the support substrate 310 may be arranged to surround the four sides (33A to 33D, see FIG. 16) or the outer surfaces of the first circuit board 250.

For example, the support substrate 310 in the direction of the optical axis may not overlap with the OIS moving part, for example, the first substrate part 255, and at least a portion of the support substrate 310 in the direction perpendicular to the optical axis may be part of the OIS moving part. , for example, may overlap with the first substrate portion 255.

For example, the support substrate 310 may include a plurality of support substrates that are separated or spaced apart from each other. In another embodiment, the support substrate 310 may be formed in a single shape.

The support substrate 310 may include bodies 86 and 87. For example, the bodies 86 and 87 may be arranged to surround the OIS moving part, for example, the first substrate part 255. For example, the bodies 86 and 87 in the direction of the optical axis may not overlap with the OIS moving part, for example, the first substrate 255, and at least a portion of the bodies 86 and 87 in the direction perpendicular to the optical axis may be aligned with the OIS. It may overlap with a moving part, for example, the first substrate part 255.

For example, the bodies 86 and 87 may have a flat plate shape in the optical axis direction or in a direction parallel to the optical axis direction. For example, when viewed from above, the outer shape of the bodies 86 and 87 may have a polygonal shape, for example, a square shape or a circular shape.

For example, the bodies 86 and 87 may include a plurality of parts that are separated or spaced apart from each other. In another embodiment, the body may be formed as a single shape.

Additionally, the support substrate 310 may include an extension portion extending from the bodies 86 and 87 and coupled to the second substrate portion 800. For example, the extension portion of the support substrate 310 may extend toward the second substrate portion 800 , and one end of the extension portion of the support substrate 310 may be coupled to the second substrate portion 800 . One end of the extension portion of the support substrate 310 may be provided with a plurality of terminals to be electrically connected to the second substrate portion 800 using solder or conductive adhesive. For example, the extension part of the support substrate 310 may be alternatively expressed as a “terminal part,” a “protrusion part,” or a leg member.

The extension portions 7A to 7D may extend from the bodies 86 and 87 toward the first substrate portion 800. For example, the extension portions 7A to 7D may extend from the bodies 86 and 87 in the first direction. Additionally, the extension portions 7A to 7D may extend in the second horizontal direction (X-axis direction).

The two extension parts 7D and 7B may be left and right symmetrical when the two extension parts 7D and 7B are viewed from the front. For example, the two extension parts 7D and 7B may be left and right symmetrical to each other based on a straight line that is parallel to the optical axis and passes through the midpoint between the two extension parts 7D and 7B.

The other two extension parts 7A and 7C may be left and right symmetrical when the two extension parts 7A and 7C are viewed from the front. For example, the other two extension parts 7A and 7C may be left and right symmetrical to each other based on a straight line that is parallel to the optical axis and passes through the midpoint between the two other extension parts 7A and 7C.

The extension portion 7D extends in a direction different from the extension direction of the first extension portion 45A (or first portion) and the first extension portion extending from the body 86, 87 in a direction toward the second substrate portion 800. It may include a second extension portion 45B (or second portion). For example, the first extension 45A may extend in the optical axis direction, and the second extension 45B may extend in a direction perpendicular to the optical axis.

For example, the first extension part may extend in a first direction (eg, Z-axis direction). For example, the second extension portion 45B may extend in a second horizontal direction (eg, X-axis direction). For example, the second extension portion 45B may extend in the left or right direction based on one end or the center line of the bodies 86 and 87. Here, the center line may be an imaginary straight line passing through the midpoint between two adjacent extensions (eg, 7D and 7D, or 7A and 7C).

For example, the second extension portion 45B may extend left or right from the first extension portion 45A. When viewed from the front, the overall shape of the extension portion 7D may be in the form of an letter (“└”) or a form (“┘”) that is left and right symmetrical to the letter (“└”).

The length of the extension portion 7D in the horizontal direction may be greater than the length of the extension portion 7D in the vertical direction. This is to easily place or arrange the terminals in the second horizontal direction.

Each of the extension parts 7A to 7D may include a plurality of terminals 311 (see FIG. 16). For example, the plurality of terminals 311 may be disposed below or at the bottom of the extension portions 7A to 7D. For example, the plurality of terminals 311 may be arranged to contact the lower or lower surfaces of the extension portions 7A to 7D. For example, the plurality of terminals 311 may be arranged or arranged to be spaced apart in the second horizontal direction (eg, X-axis direction).

For example, the extension parts 7A to 7D of the support substrate 310 may be fixed or coupled to a fixing part (eg, base 210). For example, when the OIS moving unit moves or moves, the bodies 86 and 87 of the support substrate 310 may move, and the extension portions 7A to 7D of the support substrate 310 may be fixed and do not move.

For example, the support substrate 310 may include a first support substrate 310-1 and a second support substrate 310-2 that are spaced apart from each other. The first and second support substrates 310-1 and 310-2 may be formed left and right symmetrically. In another embodiment, the first support substrate 310-1 and the second support substrate 310-2 may be one substrate formed integrally. In another embodiment, the support substrate 310 may include three or more support substrates.

For example, the first and second support substrates 310-1 and 310-2 may be arranged to surround the four sides 33A to 33D of the first circuit board 250.

For example, the first support substrate 310-1 may include a first body 86 and at least one extension portion 7A, 7B extending from the first body 86. At least one extension portion 7A, 7B of the first support substrate 310-1 may include a plurality of terminals 311.

The second support substrate 310-2 may include a second body 87 and at least one extension portion 7C and 7D extending from the second body 87. At least one extension portion 7C or 7D of the second support substrate 310-2 may include a plurality of terminals 311.

The first circuit board 250 has a first side 33A and a second side 33B located on opposite sides of each other, and a third side 33B located between the first side 33A and the second side 33B and located on opposite sides of each other. It may include a side portion 33C and a fourth side portion 33D.

For example, the first connection portion 320A may connect the first body 86 and the first side portion 33A of the first circuit board 250. The second connection portion 320B may connect the second body 87 and the second side portion 33B of the first circuit board 250.

The first body 86 includes a first portion 6A corresponding to or opposing the first side 33A of the first circuit board 250, and a portion of the third side 33C of the first circuit board 250 ( It may include a second part 6B corresponding to (or one side), and a third part 6C corresponding to a part (or one side) of the fourth side 33D of the first circuit board 250. In addition, the first body 86 has a first bent portion 6D and a first portion 6A that connect one end of the first portion 6A and the second portion 6B and are bent from one end of the first portion 6A. ) and may include a second bent portion 6E that connects the other end of the third portion 6C and is bent from the other end of the first portion 6A. For example, the first body 86 may have a 'ㄷ' shape.

For example, the first support substrate 310-1 may include an extension portion 7A and an extension portion 7B. For example, the extension portion 7A may be connected to one side of the first body 86, and the extension portion 7B may be connected to the other side of the first body 86.

For example, the extension portion 7A may extend or protrude from the second portion 6B of the first body 86 toward the second substrate portion 800, and the extension portion 7B may extend from the second portion 6B of the first body 86. It may extend or protrude from the third portion 6C toward the second substrate portion 800. The extension portion 7B may be located on the opposite side of the extension portion 7A with the first substrate portion 255 (eg, first circuit board 250) interposed therebetween.

For example, the first connection portion 320A may connect the first portion 6A of the first body 86 and the first side portion 33A of the first circuit board 250. The first connection portion 320A may include a bent portion. For example, the first connection part 320A may connect the central area of the first portion 6A of the first body 86 and the central area of the first side 33A of the first circuit board 250.

The second body 87 includes a first portion 9A corresponding to or opposing the second side 33B of the first circuit board 250, and another portion of the third side 33C of the first circuit board 250. a second part 9B corresponding to or facing (or the other side), and a third part 9C corresponding to or opposing the other part (or the other side) of the fourth side 33D of the first circuit board 250. It can be included. In addition, the second body 87 has a first bent portion 9D and a first portion 9A that connect one end of the first portion 9A and the second portion 9B and are bent from one end of the first portion 9A. ) and may include a second bent portion 9E that connects the other end of the third portion 9C and is bent from the other end of the first portion 9A. For example, the second body 87 may have a 'ㄷ' shape. Also, for example, the second body 87 may have a symmetrical shape with the first body 86 with respect to the optical axis. For example, the second body 87 may be symmetrical to the first body 86 with respect to the optical axis.

For example, the second support substrate 310-2 may include an extension portion 7C and an extension portion 7D. For example, the extension portion 7C may be connected to one side of the second body 87, and the extension portion 7D may be connected to the other side of the second body 86.

The extension portion 7C may extend or protrude from the second portion 9B of the second body 87 toward the second substrate portion 800, and the extension portion 7D may extend from the second portion 9B of the second body 87. It may extend or protrude from the third portion 9C toward the second substrate portion 800. The extension portion 7D may be located on the opposite side of the extension portion 7C with the first substrate portion 255 (eg, first circuit board 250) interposed therebetween.

For example, when the extension portions 7A and 7C are viewed from the front, the extension portions 7A and 7C may be left and right symmetrical. In another embodiment, the extension portions 7A and 7C may not be left-right symmetrical.

Also, for example, when the extension portion 7B and the extension portion 7D are viewed from the front, the extension portion 7B and the extension portion 7D may be left and right symmetrical. In another embodiment, the extension portion 7B and the extension portion 7D may not be left-right symmetrical.

For example, the second connection portion 320B may connect the first portion 9A of the second body 87 and the second side portion 33B of the first circuit board 250. The second connection portion 320B may include a bent portion. For example, the second connection portion 320B may connect the central region of the first portion 9A of the second body 87 and the central region of the second side portion 33B of the first circuit board 250.

Referring to FIG. 16, the terminal portions (e.g., 7A, 7C) of the support substrate 310 are electrically connected to the terminals B1 to B4 of the terminal portion 95 of the circuit board 190 of the AF driver 100. Terminals (P1 to P4) may be formed. The terminals B1 to B4 of the terminal portion 95 of the circuit board 190 and the terminals P1 to P4 of the extension portions 7A and 7C of the support substrate 310 are electrically connected by solder or conductive adhesive. You can. That is, the circuit board 190 of the AF driver 100 may be electrically connected to the second substrate 800 through the support substrate 310.

Referring to FIG. 16, the support substrate 310 may include a conductive layer 93-1. Additionally, the support substrate 310 may include a first insulating layer 94-1 disposed on one side (or first side) or one side of the conductive layer 93-1. Additionally, the support substrate 310 may include a second insulating layer 94-2 disposed on the other side (or second side) or the other side of the conductive layer 93-1. For example, in another embodiment, the support substrate 310 may include at least one of a first insulating layer 94-1 and a second insulating layer 94-2. The support substrate 310 may include a protective layer 96 disposed on the first insulating layer 94-1. For example, protective layer 96 may be an EMI member (eg, EMI tape). Or, for example, the protective layer 96 may be a heat dissipation member, for example, graphite. Or, for example, the protective layer 96 may be made of an elastic material. Or, for example, the protective layer 96 may be a conductive member. Or, for example, the protective layer 96 may be an insulating member.

FIG. 17A is a first perspective view of the support substrate 310 coupled to the holder 270 and the base 210, and FIG. 17B is a second perspective view of the support substrate 310 coupled to the holder 270 and the base 210. am.

17A and 17B, the holder 270 has first to fourth sides 64A to 64D corresponding to or opposing the first to fourth sides 33A to 33D of the first circuit board 250. , see FIG. 18a).

The first and second sides 64A and 64B of the holder 270 may face each other or be disposed on opposite sides of each other in a second horizontal direction (eg, X-axis direction). Additionally, the third and fourth sides 64C and 64D of the holder 270 may face each other or be disposed on opposite sides of each other in the first horizontal direction (eg, Y-axis direction).

At least a portion of the support substrate 310 may be attached or coupled to the holder 270 . For example, at least one connection portion 320A, 320B of the support substrate 310 may be coupled to at least one of the first to fourth sides 64A to 54D of the holder 270 by an adhesive. For example, the first connection portion 320A may be coupled, attached, or fixed to the first side 64A of the holder 270 using adhesive, and the second connection portion 320B may be connected to the second side 64A of the holder 270. It may be coupled to, attached to, or secured to (64B).

A first protrusion 27A may be formed on the first side 64A of the holder 270, and a second protrusion 27B may be formed on the second side 64B of the holder 270.

The support substrate 310 may be coupled to, attached to, or fixed to the protrusions 27A and 27B of the holder 270. The support substrate 310 may be coupled to, attached to, or fixed to the outer surface (or inner surface) of the protrusions 27A and 27B of the holder 270.

For example, a portion of the support substrate 310 may be coupled to, attached to, or fixed to the first protrusion 27A and the second protrusion 27B of the holder 270. The bodies 86 and 87 of the support substrate 310 may be coupled to, attached to, or fixed to the first and second protrusions 27A and 27B of the holder 270.

For example, the first support substrate 310-1 may be coupled to, attached to, or fixed to the first protrusion 27A, and the second support substrate 310-2 may be coupled to, attached to, or fixed to the second protrusion 27B. Or it can be fixed. For example, the first portion 6A of the first body 86 may be coupled, attached, or fixed to the outer surface (or inner surface) of the first protrusion 27A, and the first portion 6A of the second body 87 may be coupled, attached, or fixed to the outer surface (or inner surface) of the first protrusion 27A. Portion 9A may be coupled, attached, or fixed to the outer surface (or inner surface) of the second protrusion 27B.

The base 210 may include first to fourth sides 65A to 65D (see FIG. 14) corresponding to or opposing the first to fourth sides 33A to 33D of the first circuit board 250. You can. Additionally, the first to fourth sides 65A to 65D of the base 210 may correspond to or oppose the first to fourth sides 64A to 64D of the holder 270.

The first and second sides 65A and 65B of the base 210 may face each other or be disposed on opposite sides of each other in a first horizontal direction (eg, Y-axis direction). Additionally, the third and fourth sides 65C and 65D of the base 210 may face each other or be disposed on opposite sides of each other in the second horizontal direction (eg, X-axis direction).

At least a portion of the support substrate 310 may be coupled to, attached to, or fixed to the base 210 . For example, the bodies 86 and 87 of the support substrate 310 may be coupled to the base 210 with an adhesive. For example, the extension portions 7A to 7D of the support substrate 310 may be coupled to, attached to, or fixed to the protrusions 216A and 216B of the base 210. Also, for example, a portion of the bodies 86 and 87 of the support substrate 310 connected to the extension portions 7A to 7D may be coupled to the base 210.

The base 210 may include receiving portions 46A and 46B to be coupled to or attached to at least a portion of the support substrate 310. The receiving portions 46A and 46B may have a groove shape. The receiving portions 46A and 46B may be grooves recessed from the outer surface of the side of the base 210.

For example, the base 210 has extension parts 7A and 7C disposed, and a first groove 46A formed on the third side 65C of the base 210 to be coupled to the extension parts 7A and 7C. It can be included. For example, the base 210 has extension parts 7B and 7D, and a second groove 46B formed on the fourth side 65D of the base 210 to be coupled to the extension parts 7B and 7D. The grooves 46A and 46B may be recessed from the outer surfaces of the side portions 65C and 65D of the base 210.

For example, the depth of the grooves 46A and 46B of the base 210 may be greater than or equal to the thickness of the extension portions 7A to 7D of the support substrate 310. This is to prevent the extension parts 7A to 7D from protruding out of the grooves 46A and 46B and to prevent spatial interference between the extension parts 7A to 7D and the side plate 302 of the cover member 300. This is because spatial interference between the extension parts 7A to 7D and the side plate 302 of the cover member 300 may limit the movement of the OIS moving part.

For example, the outer surface of the protrusion 216A may be disposed closer to the optical axis OA than the outer surface of the third side 65C of the base 210. Also, for example, the outer surface of the protrusion 216B may be disposed closer to the optical axis OA than the outer surface of the fourth side 65D of the base 210.

For example, the outer surface of the protrusion 216A (or 216B) may be located inside the outer surface of the third side 65C (or fourth side 65D) of the base 210. For example, a step may exist in the first horizontal direction (e.g., Y-axis direction) between the outer surface of the protrusion 216A (or 216B) and the third side 65C (or fourth side 65D) of the base 210. You can.

For example, the upper sides of the grooves 46A and 46B of the base 210 may be open to the upper surface of the base 210. Also, for example, the lower sides of the grooves 46A and 46B of the base 210 may be open to the lower surface of the base 210.

For example, at least a portion of the support substrate 310 may be coupled to, attached to, or fixed to the protrusions 216A and 216B formed on the base 210. For example, the support substrate 310 may be coupled to, attached to, or fixed to the outer surface (or inner surface) of the protrusions 216A and 216B of the base 210. A first protrusion 216A may be formed on the third side 65C of the base 210, and a second protrusion 216B may be formed on the fourth side 65D of the base 210.

For example, the bodies 86 and 87 of the support substrate 310 may be coupled to, attached to, or fixed to the first and second protrusions 216A and 216B of the base 210.

For example, one end (e.g., the second portion 6B) of the first support substrate 310-1 may be coupled, attached, or fixed to one area of the first protrusion 216A of the base 210, and the first The other end (eg, third portion 6C) of the support substrate 310-1 may be coupled, attached, or fixed to one area of the second protrusion 216B of the base 210.

For example, one end (e.g., the second portion 9B) of the second support substrate 310-2 may be coupled to, attached to, or fixed to another area of the first protrusion 216A of the base 210. 2 The other end (eg, third portion 9C) of the support substrate 310-2 may be coupled to, attached to, or fixed to another area of the second protrusion 216B of the base 210.

A first coupling area 69A may be formed between the first body 86 of the first support substrate 310-1 and the first protrusion 27A of the holder 270, and the second support substrate 310- A second coupling area 69B may be formed between the second body 87 of 2) and the second protrusion 27B of the holder 270.

Additionally, a third coupling area 59A may be formed between one end of each of the first and second support substrates 310-1 and 310-2 and the first protrusion 216A of the base 210. A fourth coupling region 59B may be formed between the other ends of each of the first and second support substrates 310-1 and 310-2 and the second protrusion 216B of the base 210.

By the support substrate 310 and the first to fourth coupling regions 69A, 69B, 59A, and 59B, the OIS moving part can be elastically supported with respect to the fixed part. The terminals 311 of the support substrate 310 may be coupled to the terminals 800B of the second substrate 800 by solder 902 (see FIGS. 17A and 17B) or conductive adhesive and may be electrically connected. You can.

For example, in other embodiments, the support member may be an elastic member that does not include a substrate, such as a spring, wire, shape memory alloy, or ball member. For example, when the support member is formed of a wire, a plurality of wires may be disposed on at least one of the corners and sides of the base 210 or the second substrate 800, and the first substrate 255 (For example, the second circuit board 260) and the second board part 800 (or the base 210) may be connected to each other. For example, one end of each of the plurality of wires may be coupled to the first substrate 255 (e.g., the second circuit board 260), and the other end of each of the plurality of wires may be coupled to the second substrate 800 (or It may be coupled to the base 210).

The image sensor unit 350 may include at least one of a controller 830, a memory 512, and a capacitor 514.

The control unit 830 may be arranged to be spaced apart from the first substrate unit 255 . For example, the control unit 83 may be disposed on the second substrate unit 800.

The memory 512 may be disposed on either the first substrate 255 or the second substrate 800. For example, the memory 512 may be disposed or mounted in the first area 801 of the second substrate 800. For example, the memory 512 may be spatially avoided or spaced apart from the heat dissipation member 380. For example, the heat dissipation member 380 may include an escape groove or opening to avoid spatial interference with the memory 512, and the memory 512 may be disposed within the escape groove or opening of the heat dissipation member 380. The capacitor 514 may be disposed on at least one of the first substrate 255 and the second substrate 800.

The memory 512 provides a second position sensor 240 corresponding to the output of the second position sensor 240 according to the displacement (or stroke) of the OIS moving part in a direction perpendicular to the optical axis (e.g., X-axis direction or Y-axis direction) for OIS feedback driving. 1 Data values (or code values) can be stored. In addition, the memory 512 corresponds to the output of the first position sensor 170 according to the displacement (or stroke) of the bobbin 110 in the first direction (e.g., optical axis direction or Z-axis direction) for AF feedback driving. The second data value (or code value) can be stored.

For example, each of the first and second data values may be stored in the memory 512 in the form of a lookup table. Alternatively, each of the first and second data values may be stored in the memory 512 in the form of a mathematical equation or algorithm. Additionally, the memory 512 may store mathematics, algorithms, or programs for the operation of the control unit 830. For example, the memory 512 may be a non-volatile memory, for example, Electrically Erasable Programmable Read-Only Memory (EEPROM).

The control unit 830 may be located outside the cover member 300 or may be disposed in an area of the second substrate 800 outside the cover member 300.

Referring to FIG. 20A , the second substrate portion 800 may be connected to the first region 801 and may include an extension region 808 extending from the first region 801 . The extension area 808 may extend from the first side 85A of the first area 801 . For example, the extended area 808 may protrude from the outer surface of the first side 85A of the first area. For example, the extension area 808 may extend or protrude in the second horizontal direction (eg, X-axis direction).

The extended area 808 may be located outside of the cover member 300 or may be located outside the cover member 300 .

The extended region 808 may alternatively be expressed as a “fourth region,” “protruding region,” “extension,” or “protrusion.” The area 808 extending in the optical axis direction does not overlap with the AF moving part and the OIS moving part. For example, the extension area 808 may extend in the same direction as the third area 803 (eg, the second horizontal direction).

The control unit 830 may be disposed in the extended area 808 of the second substrate unit 800. For example, the control unit 830 may be disposed or mounted on the upper surface of the extended area 808 of the second substrate unit 800. In another embodiment, the control unit 830 may be disposed or mounted on the lower surface of the extension area 808. For example, the control unit 830 may not overlap the cover member 300 in the optical axis direction. Also, for example, the extended area 808 may not overlap the cover member 800 in the optical axis direction. For example, the area of the top surface of the extension area 808 may be larger than or equal to the area of the bottom surface of the control unit 830.

Since the extended area 808 and the third area 803 are connected to the first side 85A of the second substrate 800, the area occupied by the camera device 10 in the direction perpendicular to the optical axis can be reduced. . Because of this, the embodiment can minimize an increase in the size of the camera device 10 due to the extended area 808.

In another embodiment, the extended area may be connected to any one of the second to fourth sides 85B, 85C, and 85D of the first area 801 of the second substrate 800, and the first area 801 It may protrude from any one of the second to fourth sides 85B, 85C, and 85D.

The control unit 830 may be located outside the cover member 300 or outside the cover member 300. For example, the control unit 830 may be located outside the space formed by the cover member 300, the base 210, and the first area 801 of the second substrate unit 800.

For example, the control unit 830 does not overlap the lens module 400, the AF moving unit, the OIS moving unit, and the first area 801 of the second substrate unit 255 in the optical axis direction. At least one capacitor 514 may be disposed or mounted on the upper surface of the extension area 808.

In a sensor shift camera device in which the image sensor moves for image stabilization, the OIS moving part including the image sensor and the first substrate part is arranged to be spaced apart from the fixed part including the second board part, so the heat generated from the OIS moving part is dissipated. It may be vulnerable to being released externally through the government. Additionally, in a sensor shift camera device, the AF driver and the OIS driver may be trapped in a cover member to prevent foreign matter defects, and as a result, it may not be easy for heat to be released out of the camera device.

The image sensor, the second coil, and the control unit may correspond to a heat source. Here, the “control unit” may be a driver IC that controls AF driving or/and OIS driving.

The camera device 10 may include a heat dissipation member 870 disposed, coupled, or attached to the extended area 808 to improve the heat dissipation effect. Heat dissipation member 870 may contact extended area 808 . For example, heat dissipation member 870 may be disposed below extended area 808. For example, the heat dissipation member 870 may be disposed, coupled, or fixed to the lower surface of the extended area 808. The heat dissipation member 870 may be a plate-shaped member, and the description of the material of the heat dissipation member 280 may be applied or analogously applied to the heat dissipation member 870. At least a portion of the heat dissipation member 870 may overlap the control unit 830 in the optical axis direction.

The camera device 10 may include a cover can 405 disposed in the extension area 808 and accommodating the control unit 830 inside to protect the control unit 830 from external shock. The cover can 405 may include a top plate 405A and a side plate 405B connected to the top plate 405A and extending from the top plate 405A toward the extension area 808.

The cover can 405 may be placed, coupled, or fixed to the upper surface of the extension area 808. For example, the lower, lower, or lower surface of the side plate 405B of the cover can 405 may be coupled, attached, or fixed to the upper surface of the extended area 808.

Since the cover can 405 accommodates the control unit 830 inside, heat generated from the control unit 830 can be prevented from being emitted to the outside of the cover can 405 and transferred to the image sensor. Descriptions of the material of the heat dissipation member 280 or the material of the cover member 300 may be applied or analogously applied to the cover can 405.

The camera device 10 may further include a heat dissipation layer 860 disposed in the control unit 830. The heat dissipation layer 860 may cover the surface of the control unit 830. For example, the heat dissipation layer 860 may be arranged to surround the surface of the control unit 830. For example, the heat dissipation layer 860 may contact and surround the top and side surfaces of the control unit 830. The heat dissipation layer 860 may be formed of heat dissipation plastic or heat dissipation resin, for example, heat dissipation epoxy. The heat dissipation layer 860 can improve the heat dissipation efficiency and heat dissipation performance of the control unit 830.

In another embodiment, the heat dissipation layer may be disposed on at least one of the top and side surfaces of the control unit 830. For example, the heat dissipation layer may expose at least a portion of the control unit 830.

The control unit 830 may be electrically connected to the second position sensor 240. The control unit 830 uses the output signal received from the sensors 240A, 240B, and 240C of the second position sensor 240 and the first data value stored in the memory 512 to provide information to the second coil 230. The driving signal can be adjusted or controlled, and feedback OIS operation can be performed.

Additionally, the control unit 830 may be electrically connected to the first position sensor 170. For example, when the first position sensor 170 is implemented as a Hall sensor alone, the first position sensor 170 may be electrically connected to the control unit 830. At this time, the control unit 830 may control the driving signal provided to the first coil 120 using the output signal of the first position sensor 170 and the second data value stored in the memory 512, and through this Feedback auto focusing operation can be performed.

The control unit 830 may be implemented in the form of a driver IC, but is not limited thereto. For example, the control unit 830 may be electrically connected to the terminals 800B of the second substrate unit 800.

The control unit 830 may control a first position sensor implemented solely as a Hall sensor and/or a second position sensor implemented solely as a Hall sensor. For example, the control unit 830 may supply a driving signal to a first position sensor implemented solely as a Hall sensor and/or a second position sensor implemented solely as a Hall sensor, and may supply an output signal of the first position sensor and/or a second position sensor implemented solely as a Hall sensor. The output signal of the position sensor can be received.

In another embodiment, the first position sensor may be implemented as a Hall sensor alone, and the second position sensor may be in the form of a driver IC including a Hall sensor. In this case, the control unit 830 may be electrically connected to the first position sensor, A driving signal may be supplied to the first position sensor, and an output signal may be received from the first position sensor.

For example, the control unit 830 may include a driving driver for driving at least one of the first position sensor and the second position sensor.

The image sensor unit 350 may further include a motion sensor (not shown) disposed on either the first substrate 255 or the second substrate 800. The motion sensor may be electrically connected to the control unit 830. The motion sensor may output rotational angular velocity information resulting from the movement of the camera device 10. For example, the motion sensor may be implemented as a 2-axis or 3-axis gyro sensor, or an angular velocity sensor. For example, the motion sensor may output information about the amount of movement in the X-axis direction, the amount of movement in the Y-axis direction, and the amount of rotation due to the movement of the camera device 10.

In another embodiment, the motion sensor may be omitted from the camera device 10, and if the motion sensor is omitted from the camera device, the camera device 10 may be configured to detect the camera device 10 from the motion sensor provided in the optical device 200A. ) can receive location information based on the movement of the device.

The image sensor unit 350 may further include a filter 610 disposed between the lens module 400 and the image sensor 810. Additionally, the image sensor unit 350 may further include a filter holder 600 for placing, seating, or receiving a filter. The filter holder 600 may be alternatively expressed as a “sensor base.”

The filter 610 may block or allow light in a specific frequency band passing through the lens barrel 400 to pass through the image sensor 810 . For example, the filter 610 may be an infrared blocking filter. For example, the filter 610 may be arranged parallel to the x-y plane perpendicular to the optical axis OA. The filter 610 may be placed below the lens module 400.

The filter holder 600 may be placed below the AF driver 100. For example, the filter holder 600 may be placed on the first substrate portion 255 . For example, the filter holder 600 may be disposed on the upper surface of the second circuit board 260 of the first substrate portion 255.

The filter holder 600 may be coupled to an area of the second circuit board 260 around the image sensor 810 with an adhesive and may be exposed through the opening 250A of the first circuit board 250. . For example, the opening 250A of the first circuit board 250 may expose the filter holder 600 disposed on the second circuit board 260 and the filter 610 disposed on the filter holder 600. The filter holder 600 may have an opening 61A formed at a portion where the filter 610 is mounted or disposed to allow light passing through the filter 610 to enter the image sensor 810. The opening 61A of the filter holder 600 may be in the form of a through hole that penetrates the filter holder 600 in the optical axis direction. For example, the opening 61A of the filter holder 600 may pass through the center of the filter holder 600 and may be arranged to correspond to or face the image sensor 810.

The filter holder 600 may be recessed from the upper surface and may be provided with a seating portion 500 on which the filter 610 is seated, and the filter 610 may be placed, seated, or mounted on the seating portion 500. The seating portion 500 may be formed to surround the opening 61A. In another embodiment, the seating portion of the filter holder may be in the form of a protrusion protruding from the upper surface of the filter.

The image sensor unit 350 may further include an adhesive disposed between the filter 610 and the seating unit 500, and the filter 610 may be coupled or attached to the filter holder 600 by the adhesive.

In another embodiment, the filter holder may be coupled to the holder 270 or to the AF driver 100.

Referring to FIG. 3, the cover member 300 may be in the form of a box with an open bottom and including a top plate 301 and a side plate 302, and the lower part of the side plate 302 of the cover member 300 is a base ( 210) can be combined. The shape of the upper plate 301 of the cover member 300 may be polygonal, for example, square or octagonal. For example, the side plate 302 may include four side plates 302A to 302D connected to each other. An opening 303 may be formed in the upper plate 301 of the cover member 300 to expose the lens of the lens module 400 coupled to the bobbin 110 to external light.

Referring to FIGS. 1 and 3 , the side plate 302 of the cover member 300 has a groove 304 for exposing the terminal 95 of the circuit board 190 and the corresponding terminal 800B of the second substrate portion. can be formed.

For example, the cover member 300 may be made of a metal material. For example, the cover member 300 may be formed of SUS (Steel Use Stainless) (eg, SUS 4 series). Additionally, the cover member 300 may be formed of cold rolled steel plate (Steel Plate Cold Commercial, SPC). For example, the cover member 300 may be made of SUS material containing more than 50 percent ([%]) of Fe. Also, for example, an anti-oxidation metal, for example, nickel, may be plated on the surface of the cover member 300 to prevent oxidation. Also, for example, in another embodiment, the cover member 300 may be formed of a magnetic material or a magnetic metal material.

In another embodiment, the cover member 300 may be formed of an injection molded material, for example, plastic or resin. Additionally, the cover member 300 may be made of an insulating material or a material that blocks electromagnetic waves.

The cover member 300 and the base 210 can accommodate the AF driving unit 100 and the OIS moving unit, protect the AF driving unit 100 and the OIS moving unit from external impact, and prevent foreign substances from entering from the outside. It can be prevented.

For example, at the initial position of the OIS moving unit, the outer surface of the holder 270 may be spaced apart from the inner surface of the base 210 by a preset distance. Also, for example, at the initial position of the OIS moving unit, the lower surfaces of the holder 270 and the first substrate unit 255 may be spaced apart from the base 210 by a preset distance.

The control unit 830 may supply at least one drive signal to at least one of the first to fourth coil units 230-1 to 230-4, and controls the at least one drive signal to move the OIS moving unit in the X-axis direction. Alternatively, it may be moved in the Y-axis direction, or the OIS moving unit may be rotated, tilted, or rolled within a preset angle range around the optical axis.

FIG. 21 shows a block diagram of the configuration of the control unit 830 and the first to third sensors 240A, 240B, and 240C. The control unit 830 may perform communication, for example, I2C communication, of exchanging data with a host using a clock signal (SCL) and a data signal (SDA). For example, the host may be the control unit 780 of the optical device 200A.

The control unit 830 may be electrically connected to the second coil 230. The control unit 830 may include a driving unit 510 for providing a driving signal for driving the first to fourth coil units 230-1 to 230-4. For example, the driver 510 may include an H bridge circuit or H bridge driver that can change the polarity of the driving signal. At this time, the driving signal may be a PWM signal to reduce current consumption, and the driving frequency of the PWM signal may be 20 [KHz] or more, which is outside the audible frequency range. In another embodiment, the driving signal may be a direct current signal.

Each of the first to third sensors 240A to 240C may include two input terminals and two output terminals. The control unit 830 may supply power or a driving signal to two input terminals of each of the first to third sensors 240A to 240C. For example, one of the two input terminals of the first to third sensors 240A to 240C may be commonly connected to each other. For example, the two input terminals may be a (+) input terminal and a (-) input terminal (eg, a ground terminal).

For example, the control unit 830 receives the first output voltage of the first sensor 240A, the second output voltage of the second sensor 240B, and the third output voltage of the third sensor 240C, and The movement (or displacement) of the OIS moving unit in the X-axis direction or Y-axis direction can be controlled using the first to third output voltages. Additionally, the control unit 830 may control rotation, tilting, or rolling based on the optical axis of the OIS moving unit using the received first to third output voltages.

In addition, the control unit 830 receives the output voltage output from the two output terminals of each of the first to third sensors 240A to 240C, and provides a data value according to the result of analog-to-digital conversion of the received output voltage, It may include an analog-to-digital converter 530 that outputs a digital value or code value. The control unit 830 uses the data values output from the analog-to-digital converter 530 to move the OIS moving part in the X-axis or Y-axis direction (or rotate, tilt, or Rolling can be controlled.

The temperature sensor 540 can measure the ambient temperature (e.g., the temperature of the first to third sensors 240A, 240B, and 240C) and output a temperature detection signal Ts according to the measured result. there is. For example, the temperature sensor 540 may be a thermistor.

The resistance value of the resistor included in the temperature sensor 540 may change depending on the ambient temperature, and as a result, the value of the temperature detection signal Ts may change depending on the ambient temperature. Through calibration, a mathematical equation or lookup table regarding the correlation between the ambient temperature and the temperature detection signal (Ts) may be stored in the memory or the control unit (830, 780).

Since the output values of the first to third sensors 240A, 240B, and 240C are also affected by temperature, in order to drive accurate and reliable OIS feedback, the first to third sensors 240A, 240B must be adjusted according to the ambient temperature. , 240C) output values need to be compensated.

To this end, for example, the controllers 830 and 780 use the ambient temperature measured by the temperature sensor 540 and a temperature compensation algorithm or compensation equation to determine the output values of each of the first to third sensors 240A, 240B, and 240C. (or data value related to output) can be compensated. The temperature compensation algorithm or compensation equation may be stored in the control unit 830 or 780 or memory.

The camera device may further include a fourth sensor 240D corresponding to or opposing the fourth magnet unit 130-4 in the optical axis direction. The fourth sensor 240D may be disposed on the first substrate 255 (eg, first circuit board 250). For example, the fourth sensor 240D may be disposed adjacent to a corner of the first circuit board 250 where the first to third sensors 240A to 240C are not disposed. The description of the arrangement relationship between the first sensor 240A and the first coil unit 230-1 may be applied or expressed to the arrangement between the fourth sensor 240D and the fourth coil unit 230-4.

For example, the fourth sensor 240D may be positioned diagonally opposite the second sensor 240B. For example, the output voltage of the fourth sensor 240D may be used to detect the X-axis movement or Y-axis movement of the OIS moving part.

In another embodiment, the fourth sensor 240D may represent the first position sensor 170 of the AF driver 100.

The control unit 830 connects the first position sensor 170, the second coil 230, and the second position sensor 240 through the second substrate 800, the support substrate 310, and the first substrate 255. ) may be electrically connected to at least one of the

In another embodiment, the control unit 830 may be disposed on the first substrate unit 255. For example, in another embodiment, the control unit 830 may be disposed on the first circuit board 250.

FIG. 22 shows a top view of the holder 270, the base 210, and the cover member 300, FIG. 23A is an enlarged view of the first dotted portion 11A of FIG. 22, and FIG. 23B is a second dotted view of FIG. 22. This is an enlarged view of the dotted line portion 11B, and Figure 24 is a cross-sectional view of the image sensing unit 350 and the cover member 300 in a direction perpendicular to the optical axis.

22 to 24, the holder 270 may include grooves 91-1, 91-2 or depressions that correspond to, oppose, or overlap the receiving portions 46A and 46B of the base 210. there is. The grooves 91-1 and 91-2 may be recessed from the outer surfaces of the side portions 57C and 57D of the holder 270.

For example, the holder 270 may include a first groove 91-1 recessed from the third side 57C and a second groove 91-2 recessed from the fourth side.

Referring to FIG. 12A, for example, the first groove 91-1 has a bottom surface 91A having a step with the outer surface of the third side 57C of the holder 270, and the bottom surface 91A and the third side. It may include a side (91B) disposed between the outer surfaces of (57C). For example, the bottom surface 91A may be located closer to the optical axis OA than the outer surface of the third side 57C. For example, the second groove 91-2 is a bottom surface 91C having a step with the outer surface of the fourth side 57D of the holder 270, and an outer surface of the bottom surface 91C and the fourth side 57D. It may include a side (91D) disposed between. For example, the bottom surface 91C may be located closer to the optical axis OA than the outer surface of the fourth side 57D.

For example, the distance between the bottom surface 91A or 91C of the holder 270 and the outer surface of the side part 57C or 57D of the holder 270 is the bottom surface of the groove 46A or 46B of the base 210 and the base 210. ) may be greater than or equal to the distance between the outer surfaces of the In other embodiments, the former may be smaller than the latter.

For example, the first groove 91-1 of the holder 270 may correspond to, face, or overlap the first groove 46A of the base 210, and the second groove 91-2 of the holder 270 ) may correspond to, face, or overlap the second groove 46B of the base 210. The reason the first and second grooves 91-1 and 91-2 of the holder 270 are formed is to avoid spatial interference with the first and second grooves 46A and 46B of the base 210. This is to secure space for movement of the OIS moving part in a direction perpendicular to the optical axis or rolling of the moving part according to the OIS drive.

For example, the length L21 of the holder 270 in the second horizontal direction (eg, X-axis direction) may be greater than the length L22 of the holder 270 in the first horizontal direction (eg, Y-axis direction). there is. For example, L21 may be the distance from the outer surface of the first side 57A of the holder 270 to the outer surface of the second side 57B, and L22 may be the distance from the outer surface of the third side 57C of the holder 270. It may be the distance from the side to the outer surface of the fourth side 57D.

In another embodiment, L21 and L22 may be the same. Additionally, the length of the image sensor 810 in the second horizontal direction (eg, X-axis direction) may be greater than the length of the image sensor 810 in the first horizontal direction (eg, Y-axis direction). In another embodiment, the length of the image sensor 810 in the second horizontal direction (e.g., X-axis direction) and the length of the image sensor 810 in the first horizontal direction (e.g., Y-axis direction) may be the same or smaller. there is.

The holder 260 may include a stopper 55 (or a protrusion) that protrudes in a direction perpendicular to the optical axis. In another embodiment, the stopper 55 may be expressed as a “protrusion” or a “protrusion” instead.

For example, the stopper 55 may protrude from the outer surface of the holder 260. For example, the stopper 55 may protrude from the sides 57A to 57D of the holder 260. For example, the stopper 55 may protrude from the outer surface of the side portions 57A to 57D of the holder 260. For example, the holder 260 may include stoppers 55A and 55B that protrude toward the side plate 302 of the cover member 300. For example, the stoppers 55A and 55B may protrude toward the inner surface of the side plate 302 of the cover member 300. For example, the holder 270 may include stoppers 55C and 55D that protrude toward the protrusions 216A and 216B of the base 210. For example, the stoppers 55C and 55D may protrude toward the inner surfaces of the protrusions 216A and 216B of the base 210. The holder 270 may include at least one of the stoppers 55A to 55D.

For example, the stopper 55 may include a first stopper 55A protruding from the first side 57A of the holder 270. For example, the first stopper 55A may protrude from the second side 57B of the holder 270 in a direction toward the first side 57A.

For example, the stopper 55 may include a second stopper 55B protruding from the second side 57B of the holder 270. For example, the second stopper 55B may protrude from the first side 57A of the holder 270 in a direction toward the second side 57B. The first stopper 55A and the second stopper 55B may protrude or extend in opposite directions.

For example, the first stopper 55A may be disposed adjacent to the first protrusion 27A of the holder 270, and the second stopper 55B may be disposed adjacent to the second protrusion 27B of the holder 270. It can be. For example, the first stopper 55A may be disposed below the first protrusion 27A of the holder 270. For example, the second stopper 55B may be disposed below the second protrusion 27B of the holder 270.

For example, the stoppers 55A to 55D may be disposed closer to the center or central area of the side portions 57A to 57D of the holder 270 than to the corner portions CR1 to CR4 of the holder 270.

For example, the first stopper 55A may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the first side 57A of the holder 270. For example, the first stopper 55A may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the first protrusion 27A of the holder 270.

For example, the second stopper 55B may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the second side 57B of the holder 270. For example, the second stopper 55B may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the second protrusion 27B of the holder 270.

For example, the center of the first side 57A (or second side 57B) of the holder 270 may be referred to as a point that is 50% of the total length of the first side 57A (or second side 57B). When, the first stopper 55A (or the second stopper 55B) may be disposed in an area between 10% and 90% of the total length of the first side 57A (or the second side 57B). . Or, for example, the first stopper 55A (or second stopper 55B) is an area between 25% and 75% of the length of the first side 57A (or second side 57B) of the holder 27. can be placed within. Or, for example, the first stopper 55A (or second stopper 55B) is an area between 35% and 65% of the length of the first side 57A (or second side 57B) of the holder 27. It may also be placed within.

In another embodiment, the entire first stopper 55A (or second stopper 55B) is located within an area between 35% and 65% of the first side 57A (or second side 57B) of the holder 27. More than 50% of the length D11 may be disposed.

12A and 22, each of the first stopper 55A and the second stopper 55B illustrates one stopper, but in another embodiment, each of the first stopper and the second stopper may include a plurality of stoppers spaced apart from each other. It may be possible. In another embodiment, the support substrate 310 may include a plurality of holes or through holes corresponding to a plurality of stoppers, and the plurality of holes may be formed in the connection portion 320 of the support substrate 310, Each of the plurality of stoppers may protrude from the support substrate 310 by passing through a corresponding one of the plurality of holes of the support substrate 310 .

Referring to FIG. 22, the first stopper 55A may protrude toward the first side plate 302A of the cover member 300, and the second stopper 55B may protrude toward the second side plate 302B of the cover member 300. ) may protrude toward. In the initial position of the OIS moving part, the stoppers 55A and 55B may be spaced apart from the side plates 302A and 302B of the cover member 300. This is to perform OIS operation through movement of the OIS moving part.

Referring to FIGS. 17A and 17B , at least a portion of the stoppers 55A and 55B may penetrate at least a portion of the support substrate 310 . For example, the stoppers 55A and 55B may protrude in a direction perpendicular to the optical axis OA based on the support substrate 310. For example, the stoppers 55A and 55B may penetrate at least a portion of the connection portion 320 of the support substrate 310. For example, the connection portion 320 of the support substrate 310 may include an opening 320-1 through which at least a portion of the stoppers 55A and 55B pass. For example, the opening 320-1 may be a hole, a through hole, or a through hole.

Since the opening 320-1 of the connection portion 320 of the support substrate 310 is coupled to the stoppers 55A and 55B of the holder 270, the stoppers 55A and 55B are connected to the support substrate 310 and the holder 270. ) can serve as a guide for the combination. In another embodiment, the stoppers 55A and 55B may be expressed as “protrusions” or “guide protrusions” instead.

For example, the ends or distal ends of the stoppers 55A and 55B may be located closer to the side plate 302 of the cover member 300 than the support substrate 310 (or the holder 270).

Referring to FIG. 23A, for example, the distance d2 between the stoppers 55A, 55B and the side plate 302A of the cover member 300 is the distance between the support substrate 310 (or the holder 270 and the cover member 300). It may be smaller than the distance d1 between the side plates 302A (d2<d3).

For example, d2 may be the shortest distance between the stoppers 55A and 55B and the side plate 302A of the cover member 300. For example, d3 may be the shortest distance between the support substrate 310 (or the holder 270 and the side plate 302A of the cover member 300).

For example, the protruding length d1 of the stoppers 55A and 55B protruding from the outer surfaces of the side portions 57A to 57D of the holder 270 is between the stoppers 55A and 55B and the side plate 302A of the cover member 300. may be greater than the distance (d2) (d1>d2). Since d1>d2, the stoppers 55A and 55B can stably protect the holder 270 from external shock.

Also, for example, the protruding length of the stoppers 55A and 55b with respect to the bodies 86 and 87 of the support substrate 310 may be greater than d2. In another embodiment, the protrusion length of the stoppers 55A and 55B may be equal to or smaller than the distance d2 between the stoppers 55A and 55B and the side plate 302A of the cover member 300.

For example, the distance d2 between the stoppers 55A, 55B and the side plate 302A of the cover member 300 is the distance between the side portions 57A to 57D of the holder 270 and the side plate 302A of the cover member 300. It may be smaller than the distance (d3) (d2<d3).

For example, d2 may be the distance between the ends of the stoppers 55A and 55B and the inner surface of the side plate 302A of the cover member 300.

For example, d3 is between the side portions 57A to 57D (or the outer surface of the side portions 57A to 57D) of the holder 270 and the side plate 302 (or the inner surface of the side plate 302) of the cover member 300. It could be the distance. For example, d3 represents the corner portions CR1 to CR4 (or the outer surfaces of the corner portions CR1 to CR4) of the holder 270 and the side plate 302 of the cover member 300 (or the inner surface of the side plate 302). It could be the distance between them. For example, d3 may mean the shortest distance.

For example, the distance between the side portions 57A to 57D (or the outer surface of the side portions 57A to 57D) of the holder 270 and the side plate 302 (or the inner surface of the side plate 302) of the cover member 300 and The distance between the corner portions (CR1 to CR4) (or the outer surface of the corner portions (CR1 to CR4)) of the holder 270 and the side plate 302 (or the inner surface of the side plate 302) of the cover member 300 is the same. can do. In other embodiments, the former may be smaller than the latter. In another embodiment, the former may be greater than the latter.

The length D11 of the stoppers 55A, 55B in the first horizontal direction (e.g., Y-axis direction) or in a direction parallel to the outer surface of the side portions 57A, 57B is in the first horizontal direction (e.g., Y-axis direction). Alternatively, it may be smaller than the length D12 of the protrusions 27A and 27B of the holder 270 in a direction parallel to the outer surface of the side portions 57A and 57B (D11<D12). In another embodiment, D11 may be the same as D12.

D11 may be 10% to 50% or less of the length L22 of the holder 270 in the first horizontal direction (eg, Y-axis direction) or in a direction parallel to the outer surface of the side portions 57A and 57B. In another embodiment, D11 may be 10% to 30% or less of L22. In another embodiment, D11 may be less than 13% to 20% of L22. If D11 is less than 10% of L22, the stoppers 55A, 55B cannot stably protect the holder 270 due to external impact, which may cause breakage or damage to the holder 270 due to external impact. Additionally, if D11 exceeds 50% of L22, it may be difficult to avoid spatial interference with other configurations, such as the support substrate 310, the degree of freedom in designing the camera device may be reduced, and the weight of the moving part may increase. This may increase power consumption.

The description of FIG. 23A can be applied or inferred to both the first stopper 55A and the second stopper 55B.

Referring to FIGS. 22 and 23B , for example, the stopper 55 may include a third stopper 55C protruding from the third side 57C of the holder 270. For example, the third stopper 55C may protrude from the fourth side 57D of the holder 270 in a direction toward the third side 57C.

For example, the stopper 55 may include a fourth stopper 55D protruding from the fourth side 57D of the holder 270. For example, the fourth stopper 54D may protrude from the third side 57C of the holder 270 in a direction toward the fourth side 57D. The third stopper 55C and the fourth stopper 55D may protrude or extend in opposite directions.

For example, the third stopper 55C may be placed in the first groove 91-1 of the holder 270. The fourth stopper 55D may be disposed in the second groove 91-2 of the holder 270. For example, the third stopper 55C may protrude from the bottom surface 91A of the first groove 91-1 of the holder 270. For example, the fourth stopper 55D may protrude from the bottom surface of the second groove 91-2 of the holder 270.

For example, the third stopper 55C may not protrude from the outer surface of the third side 57C of the holder 270. For example, the third stopper 55C may not protrude out of the first groove 91-1 of the holder 270. For example, the fourth stopper 55D may not protrude from the outer surface of the fourth side 57D of the holder 270. For example, the fourth stopper 55D may not protrude out of the second groove 91-2 of the holder 270.

For example, the protruding length d11 of the third stopper 55C may be smaller than the distance from the outer surface of the third side 57C of the holder 270 to the bottom surface 91A of the first groove 91-1. there is. For example, the protruding length d11 of the fourth stopper 55D may be smaller than the distance from the outer surface of the fourth side of the holder 270 to the bottom surface 91C of the second groove 91-2.

For example, the third stopper 55C may be arranged to correspond to, oppose, or overlap the first protrusion 216A of the base 210 in a direction perpendicular to the optical axis, for example, in the first horizontal direction (e.g., Y-axis direction). You can. For example, the fourth stopper 55D may be arranged to correspond to, oppose, or overlap the second protrusion 216B of the base 210 in a direction perpendicular to the optical axis, for example, in the first horizontal direction (e.g., Y-axis direction). You can.

For example, the third stopper 55C may be disposed in a position corresponding to, opposing, or overlapping the center or central area of the third side 57C of the holder 270, and the fourth stopper 55D may be disposed in the center or central area of the third side 57C of the holder 270. ) may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the fourth side 57D.

For example, the third stopper 55C may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the bottom surface 91A of the first groove 91-1 of the holder 270, and the fourth stopper 55C The stopper 55D may be disposed at a position corresponding to, opposing, or overlapping the center or central area of the bottom surface 91C of the second groove 91-2 of the holder 270.

For example, assuming that the center of the third side 57C (or fourth side 57D) of the holder 270 is a point that is 50% of the third side 57C (or fourth side 57D), The third stopper 55C (or fourth stopper 55D) may be disposed within an area between 10% and 90% of the third side 57C (or fourth side 57D). Or, for example, the third stopper 55C (or fourth stopper 55D) is disposed in an area between 25% and 75% of the third side 57C (or fourth side 57D) of the holder 27. It can be. Or, for example, the third stopper 55C (or fourth stopper 55D) is disposed in an area between 35% and 65% of the third side 57C (or fourth side 57D) of the holder 27. It could be.

In another embodiment, the entire third stopper 55C (or fourth stopper 55D) is located within an area between 35% and 65% of the third side 57C (or fourth side 57D) of the holder 27. More than 50% of the length D21 may be disposed.

12A and 22, each of the third stopper 55C and the fourth stopper 55D illustrates one stopper, but in another embodiment, each of the third and fourth stoppers of the holder includes a plurality of stoppers spaced apart from each other. It may also be included.

Referring to FIG. 22, the third stopper 55C may protrude toward the first side plate 302C of the cover member 300, and the fourth stopper 55D may protrude toward the fourth side plate 302B of the cover member 300. ) may protrude toward.

In the initial position of the OIS moving part, the stoppers 55C and 55D may be spaced apart from the base 210. For example, in the initial position of the OIS moving part, the stoppers 55C and 55D may be spaced apart from the protrusions 216A and 216B of the base 210. This is to perform OIS operation through movement of the OIS moving part.

For example, the ends or distal ends of the stoppers 55C and 55D are closer to the protrusions 216A and 216B of the base 210 than the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 of the holder 270. can be located For example, the ends or distal ends of the stoppers 55C and 55D are closer to the side plate 302C or 302D of the cover member 300 than to the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 of the holder 270. It can be located close by.

Referring to FIG. 23B, for example, the distance d12 between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210 is the bottom of the grooves 91-1 and 91-2 of the holder 270. It may be smaller than the distance d13 between the surface 91C and the protrusions 216A and 216B of the base 210 (d12<d13).

For example, d12 may be the shortest distance between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210. For example, d13 may be the shortest distance between the bottom surface 91C of the grooves 91-1 and 91-2 of the holder 270 and the protrusions 216A and 216B of the base 210.

For example, the protrusion length d11 of the stoppers 55C and 55D protruding from the bottom surfaces 91A and 91C of the grooves 91-1 and 91-2 of the holder 270 is equal to the distance between the stoppers 55A and 55B and the base ( 210) may be greater than the distance d12 between the protrusions 216A and 216B (d11>d12). Since d11>d12, the stoppers 55C and 55D can stably protect the holder 270 from external shock. In another embodiment, the protrusion length of the stoppers 55C and 55D may be equal to or smaller than the distance d12 between the stoppers 55C and 55D and the protrusions 216A and 216B of the base 210.

Referring to FIG. 24, when viewed from above, the stoppers 55C and 55D may be located closer to the optical axis than the support substrate 310. For example, when viewed from above, the ends of the stoppers 55C and 55D may be located inside the bodies 86 and 87 of the support substrate 310.

For example, the distance d12 between the stoppers 55C, 55D and the protrusions 216A, 216B of the base 210 is the bottom surface 91A, 91B of the grooves 91-1, 91-2 of the holder 270. It may be smaller than the distance d13 between the protrusions 216A and 216B of the base 210 (d12<d13).

For example, d12 may be the distance between the ends of the stoppers 55C and 55D and the inner surfaces of the protrusions 216A and 216B of the base 210.

For example, d13 refers to the bottom surfaces 91A, 91C of the grooves 91-1, 91-2 of the holder 270 and the inner surfaces of the protrusions 216A, 216B (or the protrusions 216A, 216B) of the base 210. ) can be the distance between,

The distance d5 between the side surfaces 91B and 91D of the grooves 91-1 and 91-2 of the holder 270 and the protrusions 216A and 216B of the base 210 may be equal to or greater than d13. In another embodiment, d5 may be smaller than d13.

For example, the distance d14 between the side portions 57C and 57D of the holder 270 (or the outer surfaces of the side portions 57C and 57D) and the side plates 302C and 302D of the cover member 300 may be equal to d13. there is. In another embodiment, d13 may be smaller than d14. In another embodiment, d13 may be greater than d14. For example, d14 may be the shortest distance between the side portions 57C and 57D of the holder 270 (or the outer surfaces of the side portions 57C and 57D) and the side plates 302C and 302D of the cover member 300.

Referring to FIG. 22, the length L31 of the grooves 91-1 and 91-2 of the holder 270 in a direction parallel to the side portions 57C and 57D of the holder is the side portions 57C and 57D of the holder 270. It may be larger than the length L32 of the receiving portions 46A and 46B of the base 210 in a direction parallel to the outer surface of the base 57D (L31>L32).

For example, when viewed from above, at least a portion of the receiving portions 46A and 46B of the base 210 may be located within the grooves 91-1 and 91-2 of the holder 270 at the initial position of the OIS moving portion.

For example, when viewed from above, the receiving portion of the base 210 is parallel to the outer surface of the side portions 57C and 57D of the holder 270 at the initial position of the OIS moving portion, or in the second horizontal direction (X-axis direction). At least a portion of (46A, 46B) may overlap the grooves (91-1, 91-2) of the holder (270).

The length D21 of the stoppers 55C, 55D in the second horizontal direction (e.g., X-axis direction) or in a direction parallel to the outer surface of the side portions 57C, 57D of the holder 270 is , X-axis direction) or in a direction parallel to the outer surface of the side portions 57C and 57D of the holder 270, it may be smaller than the length D22 of the grooves 91-1 and 91-2 of the holder 270 ( D21<D22). In another embodiment, D21 may be the same as D22.

D21 may be 8% to 50% or less of the length L21 of the holder 270 in the second horizontal direction (eg, X-axis direction) or in a direction parallel to the outer surface of the side portions 57C and 57D. In other embodiments, D21 may be 10% to 25% or less of L21. In another embodiment, D21 may be 10% to 20% or less of L21. If D21 is less than 8% of L21, the stoppers 55C, 55D cannot stably protect the holder 270 due to external impact, which may cause breakage or damage to the holder 270 due to external impact. Additionally, if D21 exceeds 50% of L21, the degree of freedom in designing the camera device may be reduced, and the weight of the moving part may increase, resulting in increased power consumption.

The description of FIG. 23B can be applied or inferred to both the third stopper 55C and the fourth stopper 55D.

The distance d2 between the stoppers 55A, 55B of the holder 270 and the side plates 302A, 302B of the cover member 300 is the distance between the stoppers 55C, 55D of the holder 270 and the side plates of the cover member 300. It may be different from the distance (d4) between (302C, 302D).

For example, the distance d2 between the stoppers 55A and 55B of the holder 270 and the side plates 302A and 302B of the cover member 300 is the distance between the stoppers 55C and 55D of the holder 270 and the cover member 300. may be smaller than the distance (d4) between the side plates 302C and 302D (d2<d4). In another embodiment, d2 may be equal to or greater than d4.

For example, the shape of the stopper 55 may be polyhedral, semicircular, or semielliptical. For example, the shape of the stopper 55 viewed from above may be trapezoidal. In another embodiment, the shape of the stopper 55 viewed from above may be square.

For example, the stopper (eg, 55A to 55D) may include a portion whose length decreases as it moves toward the protruding direction. For example, the length of the stopper (eg, 55A to 55D) may be a length in a direction parallel to the outer surface of the side (eg, 57A) of the holder 270.

FIG. 25 is a perspective view of the camera device 10-1 according to another embodiment, and FIG. 26 is a perspective view of the holder 270-1 of the camera device 10-1 shown in FIG. 25.

The first and second stoppers 55A1 and 55A2 of the holder 270-1 according to the embodiment of FIGS. 25 and 26 may have different positions and shapes from the stopper 55A of FIG. 12A.

For example, the holder 270-1 may include stoppers 55A and 55B formed on at least one of one side and the other side of the protrusions 27A and 27B. For example, the stoppers 55A1 and 55A2 may be disposed on both sides of the protrusions 27A and 27B to spatially avoid the connection portion 320 of the support substrate 310. The stoppers 55A1 and 55A2 of the holder 270-1 in FIG. 25 may not penetrate the support substrate 310.

For example, the holder 270-1 may include a first stopper 55A1 (or “first protrusion”) located on one side of the connection portion 320 of the support substrate 310 and protruding relative to the connection portion 320. there is. For example, the holder 270-1 may include a second stopper 55A2 (or “second protrusion”) located on one side of the connection portion 320 of the support substrate 310 and protruding relative to the connection portion 320. there is.

For example, at least one of the first and second stoppers 55A1 and 55A2 may be in contact with the protrusions 27A and 27B of the holder 270-1. In another embodiment, at least one of the first and second stoppers 55A1 and 55A2 may be spaced apart from the protrusions 27A and 27B of the holder 270-1.

The description of the first and second stoppers 55A and 55B of FIGS. 12A and 22 to 24 may be applied or analogously applied to the stoppers 55A1 and 55A2 of FIGS. 25 and 26.

In order to move the OIS moving part in a direction perpendicular to the optical axis or to roll the OIS moving part around the optical axis, a space or gap is required between the OIS moving part and the fixed part (eg, cover member and base).

The holder of the OIS moving part or the components connected to the holder (circuit board, OIS coil, position sensor) of the camera device may be damaged or damaged by impact. Such damage or damage may deteriorate the performance of the camera device or cause malfunction of the camera device. can cause

The embodiment includes a stopper 55 to prevent damage to the holder of the OIS moving part or a component coupled to the holder due to external impact. The stopper 55 according to the embodiment may be located in the center or central area of the side portions 57A to 57D of the holder 270.

In the camera device 10 according to the embodiment, the distance (d13, d14) between the holder 270 (or support substrate 310) and the side plate 302 of the cover member 300 is the X-axis (or It may be a sum of the movement distance of the Y axis), the movement distance when rolling the OIS moving part, and other processing and assembly offsets.

For example, the OIS moving distance during a shifting operation in the The movement distance in the Y-axis direction) may be 0.02 [mm], and other processing and assembly offsets may be 0.1 [mm].

Figure 27 is a perspective view of the holder 270A according to another embodiment.

Referring to FIG. 27, a holder 270A according to another embodiment (hereinafter referred to as a 'comparative example') includes stoppers 1051 and 1052 disposed adjacent to the corner regions (CR1 to CR4) of the holder 270A. can do.

The stoppers 1051 and 1052 may be disposed closer to the corner areas CR1 to CR4 of the holder 270A than to the center of the side of the holder 270A. For example, at least a portion of the stoppers 1052 and 1051 may be disposed in a corner area of the holder 270A. Also, for example, the stoppers 1051 and 1052 may be disposed in contact with or adjacent to the corner area of the holder 270A.

In a comparative example, the OIS moving distance during a shift operation in the and other processing and assembly offsets may be 0.1 [mm].

When comparing the embodiment and the comparative example, in the embodiment, the stopper 55 is disposed in the central area of the side of the holder 270 and is disposed closer to the center of the holder 270 than the corner portion of the holder 270. For this reason, during the rolling operation of the OIS moving part for 1 degree correction, the moving distance of the OIS moving part of the embodiment may be smaller than that of the comparative example. Therefore, in the embodiments of FIGS. 22 to 26, when the OIS moving part rolls for 1 degree correction, the moving distance of the OIS moving part can be reduced to 0.14 [mm]. That is, the embodiment is different from the comparative example in that the separation distance (hereinafter referred to as "gap") between the OIS moving part (e.g., the holder 270 or the support substrate 310) and the side plate of the fixing part (e.g., the cover member 300) required for OIS operation is different from that of the comparative example. (referred to as “gap” or “air gap”) can be reduced.

As described above, in the embodiment, the gap (or air gap) between the OIS moving part (e.g., the holder 270 or the support substrate 310) required for OIS operation and the side plate of the fixed part (e.g., the cover member 300) ) can be reduced.

According to the drop experiment of the camera device, the fixed parts of the camera device, such as the cover member and the base, first stop by collision with the impact surface (e.g., the ground or floor), and the OIS moving part falls further by the gap (or air gap). After doing so, it collides with the fixed part of the camera device.

Compared with the comparative example, in the embodiment, by reducing the gap (or air gap), an impact reduction effect of about 20% can be obtained, which results in damage or damage to the OIS moving part of the camera device 10 due to impact or collision. Damage can be prevented.

In addition, the camera device according to the embodiment forms an image of an object in space by using the characteristics of light, such as reflection, refraction, absorption, interference, and diffraction, and aims to increase the visual power of the eye or record the image by a lens. It may be included in an optical instrument for the purpose of reproduction, optical measurement, or image propagation or transmission. For example, optical devices according to embodiments include mobile phones, mobile phones, smart phones, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), and PMPs (Portable Multimedia Players). ), navigation, etc., but is not limited to this and any device for taking videos or photos is possible.

FIG. 28A shows a perspective view of an optical device 200A according to an embodiment, FIG. 28B shows a perspective view of an optical device 200X according to another embodiment, and FIG. 29 shows a perspective view of an optical device 200A shown in FIGS. 28A and 28B. ) shows the configuration diagram.

For example, the embodiment of FIG. 28A may be a front camera of the optical device 200A in which the lens module 400 of the camera module 200 is disposed to face the front of the body 850. The embodiment of FIG. 28B may be a rear camera in which the lens module 400 of the camera module 200 is disposed to face the rear of the body 850 of the optical device 200A. Figure 28b shows an example in which two rear cameras are arranged, but in another embodiment, one or more rear cameras may be arranged.

In another embodiment, the optical device 200A according to the embodiment may correspond to a front camera and a rear camera of the optical device 200A.

28A, 28B, and 29, the optical device 200A includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, and an input/output unit 750. ), a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 has a bar shape, but is not limited to this, and can be a slide type, folder type, swing type, or swivel type in which two or more sub-bodies are combined to enable relative movement. It can be of various structures, such as type.

The body 850 may include a case (casing, housing, cover, etc.) that forms the exterior. For example, the body 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal may be built into the space formed between the front case 851 and the rear case 852.

The wireless communication unit 710 may be configured to include one or more modules that enable wireless communication between the optical device 200A and a wireless communication system or between the optical device 200A and the network where the optical device 200A is located. For example, the wireless communication unit 710 may be configured to include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-range communication module 714, and a location information module 715. there is.

The A/V (Audio/Video) input unit 720 is for inputting audio or video signals and may include a camera 721 and a microphone 722.

The camera 721 may include a camera device according to an embodiment.

The sensing unit 740 detects the optical device 200A, such as the open/closed state of the optical device 200A, the location of the optical device 200A, the presence or absence of user contact, the orientation of the optical device 200A, and the acceleration/deceleration of the optical device 200A. ) can detect the current state of the optical device 200A and generate a sensing signal to control the operation of the optical device 200A. For example, if the optical device 200A is in the form of a slide phone, it can sense whether the slide phone is opened or closed. In addition, it is responsible for sensing functions related to whether the power supply unit 790 supplies power and whether the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to vision, hearing, or tactile sensation. The input/output unit 750 may generate input data for controlling the operation of the optical device 200A, and may also display information processed by the optical device 200A.

The input/output unit 750 may include a key pad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The key pad unit 730 can generate input data through key pad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a three-dimensional display. It may include at least one display (3D display).

The audio output module 752 outputs audio data received from the wireless communication unit 710 in call signal reception, call mode, recording mode, voice recognition mode, or broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 can convert the change in capacitance that occurs due to the user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and controlling the control unit 780 and stores input/output data (e.g., phone book, messages, audio, still images, photos, videos, etc.). It can be stored temporarily. For example, the memory unit 760 may store images captured by the camera 721, such as photos or videos. For example, the memory unit 760 may store software, algorithms, or mathematical equations for correcting hand shake described above.

The interface unit 770 serves as a passage connecting an external device connected to the optical device 200A. The interface unit 770 receives data from an external device, receives power and transmits it to each component inside the optical device 200A, or transmits data inside the optical device 200A to an external device. For example, the interface unit 770 includes a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port for connecting a device equipped with an identification module, and audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 may control the overall operation of the optical device 200A. For example, the control unit 780 may perform related control and processing for voice calls, data communications, video calls, etc.

The control unit 780 may be equipped with a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The control unit 780 can perform pattern recognition processing to recognize handwriting or drawing input on the touch screen as text and images, respectively.

The power supply unit 790 can receive external power or internal power under the control of the control unit 780 and supply power necessary for the operation of each component.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified and implemented in other embodiments. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

Claims (20)

A fixing portion including a cover member including an upper plate and a side plate connected to the upper plate;
a moving unit including a holder disposed within the cover member, a first circuit board disposed on the holder, and an image sensor electrically connected to the first circuit board; and
A support part coupled to the holder and supporting the moving part with respect to the fixed part,
The holder includes a side portion, a corner portion, and a stopper protruding from an outer surface of the side portion of the holder toward the side plate of the cover member,
The stopper is disposed closer to the center of the side of the holder than to the corner of the holder. According to paragraph 1,
A camera device wherein at least a portion of the stopper passes through the support portion. According to paragraph 1,
The camera device wherein the shortest distance between the stopper and the side plate of the cover member is smaller than the shortest distance between the outer surface of the side portion of the holder and the side plate of the cover member. According to paragraph 1,
The camera device wherein the shortest distance between the stopper and the side plate of the cover member is smaller than the shortest distance between the outer surface of the corner portion of the holder and the side plate of the cover member. According to paragraph 3,
The holder includes a protrusion to which a portion of the support part is coupled,
The stopper includes a first stopper protruding from an outer surface of the protrusion of the holder. According to clause 5,
The support part is connected to the first circuit board and includes a connection part coupled to the protrusion of the holder,
The first stopper is a camera device that passes through the connection part. According to paragraph 1,
The holder is coupled to a portion of the support and includes a protrusion protruding in the optical axis direction,
The stopper includes a first stopper located on one side of the protrusion of the holder and a second stopper located on the other side of the protrusion of the holder. According to paragraph 1,
The fixing part,
A base disposed below the cover member: and
Comprising a second circuit board coupled to the base,
The stopper includes a second stopper protruding from the outer surface of the side portion of the holder toward the base. According to clause 8,
The base includes a protrusion to which a portion of the support part is coupled,
The holder includes a groove corresponding to the protrusion of the base and recessed from the outer surface of the side of the holder,
The second stopper is a camera device that protrudes from the bottom surface of the groove of the holder toward the protrusion of the base. According to clause 9,
The camera device wherein the distance between the second stopper and the protrusion of the base is smaller than the distance between the outer surface of the side portion of the holder and the side plate of the cover member. According to paragraph 1,
When the center of the side of the holder is assumed to be a point that is 50% of the total length of the side of the holder, the stopper is disposed in an area between 35% and 65% of the length of the side of the holder. A fixing portion including a cover member;
a moving unit including a holder and an image sensor disposed within the cover member; and
A support part coupled to the holder and supporting the moving part with respect to the fixed part,
The holder includes a first stopper that protrudes from the outer surface of the first side of the holder toward the first side plate of the cover member in a second direction perpendicular to the first direction parallel to the optical axis,
The first stopper is a camera device that protrudes relative to the support portion coupled to the holder. According to clause 12,
The holder includes a second stopper that protrudes in a direction opposite to the first stopper from an outer surface of the second side of the holder toward the second side plate of the cover member,
The second stopper is a camera device that protrudes relative to the support portion coupled to the holder. According to clause 13,
The support portion includes a first hole through which a portion of the first stopper passes and a second hole through which the second stopper passes. According to clause 12,
The holder is,
a third stopper protruding from the outer surface of the third side of the holder in a third direction perpendicular to the first direction and the second direction; and
A camera device including a fourth stopper protruding from an outer surface of the fourth side of the holder in a direction opposite to the third stopper. According to clause 15,
The holder includes a first groove formed on an outer surface of the third side of the holder and a second groove formed on an outer surface of the fourth side of the holder,
The third stopper protrudes from the bottom of the first groove and the fourth stopper protrudes from the bottom of the second groove. According to clause 15,
Each of the third stopper and the fourth stopper is located inside the support portion. According to clause 16,
The protrusion length of the third stopper is smaller than the distance from the outer surface of the third side of the holder to the bottom surface of the first groove,
The camera device wherein the protrusion length of the fourth stopper is smaller than the distance from the outer surface of the fourth side of the holder to the bottom surface of the second groove. According to clause 16,
The base includes a first protrusion that faces the first groove of the holder and engages a portion of the support portion, and a second protrusion that faces the second groove of the holder and engages another portion of the support portion,
The third stopper faces the first protrusion of the base and the fourth stopper faces the second protrusion of the base. A fixing portion including a cover member including an upper plate and a side plate connected to the upper plate;
a moving part including a holder disposed within the cover member and a first circuit board disposed on the holder; and
A support part coupled to the holder and supporting the moving part with respect to the fixed part,
The holder includes a side portion, a corner portion, and a stopper protruding from an outer surface of the side portion of the holder toward the side plate of the cover member,
The stopper is an actuator disposed closer to the center of the side of the holder than to the corner of the holder.

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