KR20240022022A - Appratus for fabricating display panel and fabricating method thereof - Google Patents

Abstract

A display panel manufacturing apparatus and its manufacturing method are provided. A display panel manufacturing apparatus includes a panel member and a lower support member disposed on the panel member, a lower support member supporting a light-emitting element and a bonding member including a stamp layer adhered on one surface of the light-emitting element, and a protective film disposed on the lower support member. , a protective film transfer unit that moves the protective film in one direction so as to contact the bonding member and in the other direction opposite to the one direction so as not to contact the bonding member, a laser transmission member disposed on the protective film and transmitting the laser, It includes an upper pressing member configured to press the laser transmission member in one direction, the pressing member pressing in one direction, and irradiating a laser to the bonding member through the laser transmission member and the protective film, so that the panel member and the bonding member are pressed and melted against each other. When bonding is achieved and the protective film moves in one direction, the stamp layer is adhered to the protective film, and when the protective film moves in the other direction, the stamp layer is detached from the light emitting device.

Description

Display panel manufacturing apparatus and manufacturing method thereof {APPRATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF}

The present invention relates to a display panel manufacturing apparatus and a manufacturing method thereof.

The importance of display devices is increasing with the development of multimedia. In response to this, various types of display devices such as Organic Light Emitting Display (OLED) and Liquid Crystal Display (LCD) are being used.

A device that displays images on a display device includes a display panel such as a light emitting display panel or a liquid crystal display panel. Among them, the light emitting display panel may include a light emitting diode (LED). The light emitting diode includes an organic light emitting diode using an organic material as a light emitting material, or an inorganic light emitting diode using an inorganic material as a light emitting material. .

When manufacturing a display panel using an inorganic light emitting diode as a light emitting diode, manufacturing devices for placing micro LEDs on the display panel substrate must be developed.

The problem to be solved by the present invention is to provide a display panel manufacturing device that can detach the stamp layer from the light emitting device by adhering the stamp layer of the member and the protective film, and simplifies the manufacturing process of the display panel. .

In addition, an object of the present invention is to provide a display panel manufacturing apparatus that can prevent contamination of the laser transmission member by preventing the flux of the bonding member from directly contacting the laser transmission member.

The problems of the present invention are not limited to the problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

An apparatus for manufacturing a display panel according to an embodiment for solving the above problem includes a panel member and a bonding member disposed on the panel member and including a light emitting element and a stamp layer adhered on one surface of the light emitting element. A lower support member, a protective film disposed on the lower support member, protection in which the protective film is moved in one direction so as to contact the bonding member, and is moved in another direction opposite to the one direction so as not to contact the bonding member. It includes a film transfer unit, a laser transmission member disposed on the protective film and transmitting a laser, an upper pressing member configured to press the laser transmission member in one direction, the pressing member pressing in the one direction, and the laser A laser is irradiated to the bonding member through the transmission member and the protective film to press and melt the panel member and the bonding member to each other, and when the protective film moves in the one direction, the stamp layer is applied to the protective film. When adhered to a film and the protective film moves in the other direction, the stamp layer is detached from the light emitting device.

The protective film may include a first adhesive layer and a first film layer disposed on the first adhesive layer.

The stamp layer includes a second adhesive layer and a second film layer disposed on the second adhesive layer, and one surface of the light emitting device may be adhesive to the second adhesive layer.

The adhesive force of the first adhesive layer may be greater than the adhesive force of the second adhesive layer.

The first film layer and the second film layer may be made of the same material.

The panel member includes an anode pad electrode and a cathode pad electrode, and one surface of the panel member may expose the anode pad electrode and the cathode pad electrode.

The light emitting device includes a first contact electrode and a second contact electrode, and the other surface of the light emitting device may expose the first contact electrode and the second contact electrode.

The bonding member may further include a joining member disposed between the anode pad electrode and the first contact electrode and between the cathode pad electrode and the second contact electrode.

The bonding member may further include flux that fills the outside of the joining member.

The protective film transfer unit includes a moving unit configured to move in the one direction and the other direction, a guide roller connected to the moving unit and supporting the protective film, and a first rolling part and a second rolling part around which the protective film is wound. It can be included.

A method of manufacturing a display panel according to an embodiment to solve the above problem includes disposing a panel member on a lower support member, a light emitting element on the panel member, and a stamp layer adhered on one surface of the light emitting element. arranging a bonding member, contacting a protective film on the bonding member, contacting a laser transmission member on the protective film, and pressing the bonding member in one direction, the laser transmission member and the protection irradiating a laser to the bonding member through a film, moving the laser penetrating member in another direction opposite to the one direction, moving the protective film in the other direction to separate the stamp layer from the light emitting device. It includes a desorption step.

The protective film may include a first adhesive layer and a first film layer disposed on the first adhesive layer.

The stamp layer includes a second adhesive layer and a second film layer disposed on the second adhesive layer, and one surface of the light emitting device may be adhesive to the second adhesive layer.

The adhesive force of the first adhesive layer may be greater than the adhesive force of the second adhesive layer.

In the step of moving the protective film in the other direction to detach the stamp layer from the light emitting device, the protective film and the stamp layer are adhered and can be moved as one piece in the other direction.

The panel member includes an anode pad electrode and a cathode pad electrode, and one surface of the panel member may expose the anode pad electrode and the cathode pad electrode.

The light emitting device includes a first contact electrode and a second contact electrode, and the other surface of the light emitting device may expose the first contact electrode and the second contact electrode.

The bonding member may further include a joining member disposed between the anode pad electrode and the first contact electrode and between the cathode pad electrode and the second contact electrode.

The bonding member may further include flux that fills the outside of the joining member.

The method may further include transferring the protective film to which the stamp layer is attached and placing a new protective film on the lower support member.

According to an apparatus and method for manufacturing a display panel according to an embodiment, a protective film is disposed between a laser transmission member and a bonding member, and the stamp layer of the bonding member and the protective film are adhered, thereby detaching the stamp layer from the light emitting device. can do. Accordingly, the manufacturing process of the display panel can be simplified.

Additionally, by disposing the protective film between the laser transmission member and the bonding member, the flux of the bonding member can be prevented from directly contacting the laser transmission member, thereby preventing contamination of the laser transmission member.

Effects according to the embodiments are not limited to the contents exemplified above, and further various effects are included in the present specification.

1 is a layout diagram showing a display device according to an exemplary embodiment.
FIG. 2 is an exemplary diagram showing an example of the pixel of FIG. 1 .
FIG. 3 is an exemplary diagram showing another example of the pixel of FIG. 1.
FIG. 4 is a cross-sectional view showing an example of a display panel cut along line A-A' of FIG. 2 .
Figure 5 is a cross-sectional view showing a display panel manufacturing apparatus according to an embodiment.
Figure 6 is a block diagram showing a display panel manufacturing apparatus according to an embodiment.
Figure 7 is a cross-sectional view showing a protective film according to one embodiment.
Figure 8 is a cross-sectional view showing a protective film and a bonding member according to an embodiment.
Figure 9 is a cross-sectional view showing a protective film transfer unit according to an embodiment.
Figure 10 is a flowchart showing a method of manufacturing a display panel according to an embodiment.
Figure 11 is a cross-sectional view showing a method of manufacturing a display panel according to an embodiment.
Figure 12 is an enlarged view showing a panel member and a bonding member according to an embodiment.
13 to 17 are cross-sectional views showing a method of manufacturing a display panel according to an embodiment.
Figure 18 is a cross-sectional view showing a display panel manufacturing apparatus according to another embodiment.
FIG. 19 is an example diagram showing the front of a tile-type display device according to an embodiment.
FIG. 20 is an enlarged layout diagram showing area H of FIG. 19 in detail.
FIG. 21 is a cross-sectional view showing an example of a tile-type display device cut along line J-J' of FIG. 20.
FIG. 22 is an example diagram showing the front of a first display panel according to an embodiment.
FIG. 23 is an example diagram showing the back of a first display panel according to an embodiment.
FIG. 24 is a cross-sectional view showing an example of the first display panel cut along line N-N' of FIGS. 22 and 23.
Figure 25 is a block diagram showing a tile-type display device according to an embodiment.
FIG. 26 is an example diagram showing wireless communication between a plurality of display panels of a tiled display device according to an embodiment.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

When an element or layer is referred to as “on” another element or layer, it includes all cases where the other element or layer is directly on top of or interposed between the other element and the other element. Like reference numerals refer to like elements throughout the specification. The shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining the embodiments are illustrative and the present invention is not limited to the details shown.

Hereinafter, specific embodiments will be described with reference to the attached drawings.

1 is a layout diagram showing a display device according to an exemplary embodiment. FIG. 2 is an exemplary diagram showing an example of the pixel of FIG. 1 . FIG. 3 is an exemplary diagram showing another example of the pixel of FIG. 1.

1 to 3, the display device is a device that displays moving images or still images, and includes mobile phones, smart phones, tablet personal computers, and smart watches. ), watch phones, mobile communication terminals, electronic notebooks, e-books, PMP (portable multimedia players), navigation, UMPC (Ultra Mobile PC), as well as portable electronic devices such as televisions, laptops, monitors, billboards, etc. It can be used as a display screen for various products such as the Internet of Things (IOT).

The display panel 100 may be formed as a rectangular plane having a long side in the first direction DR1 and a short side in the second direction DR2 that intersects the first direction DR1. A corner where the long side in the first direction DR1 and the short side in the second direction DR2 meet may be rounded to have a predetermined curvature or may be formed at a right angle. The planar shape of the display panel 100 is not limited to a square, and may be formed in other polygonal, circular, or oval shapes. The display panel 100 may be formed flat, but is not limited thereto. For example, the display panel 100 is formed at left and right ends and may include curved portions with a constant curvature or a changing curvature. In addition, the display panel 100 may be flexibly formed to be bent, curved, bent, folded, or rolled.

The display panel 100 may further include pixels PX to display an image, scan lines extending in the first direction DR1, and data lines extending in the second direction DR2. The pixels PX may be arranged in a matrix form in the first direction DR1 and the second direction DR2.

Each of the pixels PX may include a plurality of sub-pixels RP, GP, and BP, as shown in FIGS. 2 and 3 . 2 and 3, each of the pixels PX includes three sub-pixels (RP, GP, BP), that is, a first sub-pixel (RP), a second sub-pixel (GP), and a third sub-pixel (BP). ), but the embodiments of the present specification are not limited thereto.

The first sub-pixel (RP), the second sub-pixel (GP), and the third sub-pixel (BP) may be connected to one of the data lines and to at least one of the scan lines.

Each of the first sub-pixel (RP), the second sub-pixel (GP), and the third sub-pixel (BP) may have a rectangular, square, or diamond planar shape. For example, the first sub-pixel (RP), the second sub-pixel (GP), and the third sub-pixel (BP) each have a short side in the first direction (DR1) and a short side in the second direction (DR2) as shown in FIG. It may have a rectangular plan shape with long sides. Alternatively, each of the first sub-pixel (RP), the second sub-pixel (GP), and the third sub-pixel (BP) has the same length in the first direction (DR1) and the second direction (DR2) as shown in FIG. 3. It may have a square or rhombus planar shape including the sides.

As shown in FIG. 2 , the first sub-pixel RP, the second sub-pixel GP, and the third sub-pixel BP may be arranged in the first direction DR1. Alternatively, one of the second sub-pixel GP and the third sub-pixel BP and the first sub-pixel RP are arranged in the first direction DR1, and the other one and the first sub-pixel RP are arranged in the first direction DR1. It may be arranged in the second direction DR2. For example, as shown in FIG. 3, the first sub-pixel (RP) and the second sub-pixel (GP) are arranged in the first direction (DR1), and the first sub-pixel (RP) and the third sub-pixel (BP) may be arranged in the second direction DR2.

Alternatively, one of the first sub-pixel RP and the third sub-pixel BP and the second sub-pixel GP are arranged in the first direction DR1, and the other one and the second sub-pixel GP are arranged in the first direction DR1. It may be arranged in the second direction DR2. Alternatively, one of the first sub-pixel RP and the second sub-pixel GP and the third sub-pixel BP are arranged in the first direction DR1, and the other one and the third sub-pixel BP are arranged in the first direction DR1. It may be arranged in the second direction DR2.

The first sub-pixel (RP) includes a first light-emitting device that emits first light, the second sub-pixel (GP) includes a second light-emitting device that emits second light, and the third sub-pixel (BP) ) may include a third light-emitting device that emits third light. Here, the first light may be light in a red wavelength band, the second light may be light in a green wavelength band, and the third light may be light in a blue wavelength band. The red wavelength band is a wavelength band of approximately 600 nm to 750 nm, the green wavelength band is a wavelength band of approximately 480 nm to 560 nm, and the blue wavelength band may be a wavelength band of approximately 370 nm to 460 nm, but in the present specification The examples are not limited thereto.

Each of the first sub-pixel (RP), the second sub-pixel (GP), and the third sub-pixel (BP) may include an inorganic light-emitting device that emits light and includes an inorganic semiconductor. For example, the inorganic light emitting device may be a flip chip type micro LED (Light Emitting Diode), but embodiments of the present specification are not limited thereto.

2 and 3, the area of the first sub-pixel (RP), the area of the second sub-pixel (GP), and the area of the third sub-pixel (BP) may be substantially the same, but in the embodiment of the present specification is not limited to this. At least one of the area of the first sub-pixel (RP), the area of the second sub-pixel (GP), and the area of the third sub-pixel (BP) may be different from the other one. Alternatively, among the area of the first sub-pixel (RP), the area of the second sub-pixel (GP), and the area of the third sub-pixel (BP), any two may be substantially the same and the other may be different from the above two. You can. Alternatively, the area of the first sub-pixel (RP), the area of the second sub-pixel (GP), and the area of the third sub-pixel (BP) may be different from each other.

FIG. 4 is a cross-sectional view showing an example of a display panel cut along line A-A' of FIG. 2 .

Referring to FIG. 4 , the display panel 100 may include a thin film transistor layer (TFTL) and light emitting elements (LE) disposed on a substrate (SUB). The thin film transistor layer (TFTL) may be a layer in which thin film transistors (Thin Film Transistors, TFTs) are formed.

The thin film transistor layer (TFTL) includes an active layer (ACT), a first gate layer (GTL1), a second gate layer (GTL2), a first data metal layer (DTL1), a second data metal layer (DTL2), and a third data metal layer ( DTL3), and a fourth data metal layer (DTL4). In addition, the thin film transistor layer (TFTL) includes a buffer film (BF), a gate insulating film 130, a first interlayer insulating film 141, a second interlayer insulating film 142, a first planarization film 160, and a first insulating film 161. ), a second planarization film 180, and a second insulating film 181.

The substrate SUB may be a base substrate or base member for supporting the display device. The substrate (SUB) may be a rigid substrate made of glass, but the embodiments of the present specification are not limited thereto. The substrate (SUB) may be a flexible substrate capable of bending, folding, rolling, etc. In this case, the substrate (SUB) may include an insulating material such as a polymer resin such as polyimide (PI).

A buffer film (BF) may be disposed on one surface of the substrate (SUB). The buffer film (BF) may be a film to prevent penetration of air or moisture. The buffer film BF may be composed of a plurality of inorganic films stacked alternately. For example, the buffer film BF may be formed as a multilayer in which one or more inorganic layers selected from the group consisting of a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked. The buffer film (BF) may be omitted.

An active layer (ACT) may be disposed on the buffer film (BF). The active layer (ACT) may include a silicon semiconductor such as polycrystalline silicon, single crystalline silicon, low-temperature polycrystalline silicon, and amorphous silicon, or may include an oxide semiconductor.

The active layer (ACT) may include a channel (TCH), a first electrode (TS), and a second electrode (TD) of a thin film transistor (TFT). The channel TCH of the thin film transistor TFT may be an area that overlaps the gate electrode TG of the thin film transistor TFT in the third direction DR3, which is the thickness direction of the substrate SUB. The first electrode TS of the thin film transistor TFT may be disposed on one side of the channel TCH, and the second electrode TD may be disposed on the other side of the channel TCH. The first electrode TS and the second electrode TD of the thin film transistor TFT may be areas that do not overlap the gate electrode TG in the third direction DR3. The first electrode (TS) and the second electrode (TD) of the thin film transistor (TFT) may be conductive regions in which silicon semiconductors or oxide semiconductors are doped with ions.

A gate insulating layer 130 may be disposed on the active layer (ACT). The gate insulating layer 130 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

A first gate layer (GTL1) may be disposed on the gate insulating layer 130. The first gate layer (GTL1) may include the gate electrode (TG) of the thin film transistor (TFT) and the first capacitor electrode (CAE1). The first gate layer (GTL1) is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

A first interlayer insulating layer 141 may be disposed on the first gate layer (GTL1). The first interlayer insulating layer 141 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

A second gate layer (GTL2) may be disposed on the first interlayer insulating film 141. The second gate layer (GTL2) may include a second capacitor electrode (CAE2). The second gate layer (GTL2) is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

A second interlayer insulating film 142 may be disposed on the second gate layer (GTL2). The second interlayer insulating layer 142 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

A first data metal layer (DTL1) including a first connection electrode (CE1), a first sub-pad (SPD1), and a data line (DL) may be disposed on the second interlayer insulating film 142. The data line DL may be formed integrally with the first sub pad SPD1, but the embodiment of the present specification is not limited thereto. The first data metal layer (DTL1) is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

The first connection electrode (CE1) is connected to the first electrode (TS) or the second electrode of the thin film transistor (TFT) through the first contact hole (CT1) penetrating the first interlayer insulating film 141 and the second interlayer insulating film 142. It can be connected to the electrode (TD).

A first planarization film is formed on the first data metal layer (DTL1) to flatten the steps caused by the active layer (ACT), the first gate layer (GTL1), the second gate layer (GTL2), and the first data metal layer (DTL1). (160) can be arranged. The first planarization film 160 is formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. It can be.

A second data metal layer (DTL2) may be disposed on the first planarization film 160. The second data metal layer DTL2 may include a second connection electrode CE2 and a second sub pad PD2. The second connection electrode CE2 may be connected to the first connection electrode CE1 through the second contact hole CT2 penetrating the first insulating film 161 and the first planarization film 160. The second data metal layer (DTL2) is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

A second planarization film 180 may be disposed on the second data metal layer DTL2. The second planarization film 180 is formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. It can be.

A third data metal layer (DTL3) may be disposed on the second planarization film 180. The third data metal layer (DTL3) may include a third connection electrode (CE3) and a third sub-pad (SPD3). The third connection electrode CE3 may be connected to the second connection electrode CE2 through the third contact hole CT3 penetrating the second insulating film 181 and the second planarization film 180. The third data metal layer (DTL3) is made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

A third planarization film 190 may be disposed on the third data metal layer DTL3. The third planarization film 190 is formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. It can be.

A fourth data metal layer (DTL4) may be disposed on the third planarization film 190. The fourth data metal layer DTL4 may include an anode pad electrode (APD), a cathode pad electrode (CPD), and a fourth sub pad (SPD). The anode pad electrode (APD) may be connected to the third connection electrode (CE3) through the fourth contact hole (CT4) penetrating the third insulating film 191 and the third planarization film 190. The cathode pad electrode (CPD) may be supplied with a first power voltage that is a low potential voltage. The fourth data metal layer (DTL4) is any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). Alternatively, it may be formed as a single layer or multiple layers made of alloys thereof.

On each of the anode pad electrode (APD) and cathode pad electrode (CPD), a transparent conductive layer (TCO) and a fifth contact electrode are formed to increase adhesion to the first contact electrode (CTE1) and the second contact electrode (CTE2) of the light emitting element (LE). A sub pad (SPD5) may be disposed. The transparent conductive layer (TCO) and the fifth sub pad (SPD5) may be formed of a transparent conductive oxide such as indium tin oxide (ITO) and indium zinc oxide (IZO).

A protective film (PVX) may be disposed on the anode pad electrode (APD), the cathode pad electrode (CPD), and the first pad (PD1). The protective film PVX may be disposed to cover the edges of the anode pad electrode APD, the cathode pad electrode CPD, and the first pad PD1. The protective film (PVX) may be formed of an inorganic film, for example, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

The light emitting element (LE) is illustrated as a flip chip type micro LED in which the first contact electrode (CTE1) and the second contact electrode (CTE2) are arranged to face the anode pad electrode (APD) and the cathode pad electrode (CPD). . The light emitting device (LE) may be an inorganic light emitting device made of an inorganic material such as GaN. The light emitting device LE may have a length of several to hundreds of μm in the first direction DR1, a length in the second direction DR2, and a length in the third direction DR3, respectively. For example, the length of the light emitting device LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may each be approximately 100 μm or less.

Light emitting elements (LE) may be formed by growing on a semiconductor substrate such as a silicon wafer. Each of the light emitting elements (LE) can be directly transferred from the silicon wafer onto the anode pad electrode (APD) and cathode pad electrode (CPD) of the substrate (SUB). In this case, the first contact electrode (CTE1) and the anode pad electrode (APD) may be bonded to each other through a soldering process. Additionally, the second contact electrode (CTE2) and the cathode pad electrode (CPD) may be bonded to each other through a soldering process. The first contact electrode (CTE1) and the anode pad electrode (APD) may be electrically connected to each other through the bonding member 23. Additionally, the second contact electrode (CTE2) and the cathode pad electrode (CPD) may be electrically connected to each other through the bonding member 23. A description of this will be provided later with reference to FIGS. 10 to 17.

Alternatively, each of the light emitting elements (LE) is connected to the anode pad of the substrate (SUB) through an electrostatic method using an electrostatic head or a stamp layer method using an elastic polymer material such as PDMS or silicon as a transfer substrate. It can be transferred onto the electrode (APD) and cathode pad electrode (CPD).

Each of the light emitting elements (LE) includes a base substrate (SSUB), an n-type semiconductor (NSEM), an active layer (MQW), a p-type semiconductor (PSEM), a first contact electrode (CTE1), and a second contact electrode (CTE2). It may be a light-emitting structure.

The base substrate (SSUB) may be a sapphire substrate, but embodiments of the present specification are not limited thereto.

The n-type semiconductor (NSEM) may be disposed on one side of the base substrate (SSUB). For example, an n-type semiconductor (NSEM) may be disposed on the lower surface of the base substrate (SSUB). An n-type semiconductor (NSEM) may be made of GaN doped with an n-type conductive dopant such as Si, Ge, or Sn.

The active layer (MQW) may be disposed on a portion of one side of the n-type semiconductor (NSEM). The active layer (MQW) may include a material with a single or multiple quantum well structure. If the active layer (MQW) includes a material with a multi-quantum well structure, it may have a structure in which a plurality of well layers and barrier layers are alternately stacked. At this time, the well layer may be formed of InGaN, and the barrier layer may be formed of GaN or AlGaN, but are not limited thereto. Alternatively, the active layer (MQW) may be a structure in which a type of semiconductor material with a large band gap energy and a semiconductor material with a small band gap energy are alternately stacked, and other types of semiconductor materials from group 3 to 3 depending on the wavelength of the emitted light. It may also contain Group 5 semiconductor materials.

A p-type semiconductor (PSEM) may be disposed on one side of the active layer (MQW). A p-type semiconductor (PSEM) may be made of GaN doped with a p-type conductive dopant such as Mg, Zn, Ca, Se, Ba, etc.

The first contact electrode (CTE1) may be disposed on the p-type semiconductor (PSEM), and the second contact electrode (CTE2) may be disposed on another part of one side of the n-type semiconductor (NSEM). Another part of one surface of the n-type semiconductor NSEM on which the second contact electrode CTE2 is disposed may be disposed away from a part of one surface of the n-type semiconductor NSEM on which the active layer MQW is disposed.

The first contact electrode (CTE1) and the anode pad electrode (APD) may be bonded to each other through a soldering process. Alternatively, the first contact electrode (CTE1) and the anode pad electrode (APD) may be bonded to each other through a conductive adhesive member such as an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP). there is. A description of this will be provided later with reference to FIGS. 10 to 17.

Figure 5 is a cross-sectional view showing a display panel manufacturing apparatus according to an embodiment. Figure 6 is a block diagram showing a display panel manufacturing apparatus according to an embodiment.

Referring to FIGS. 5 and 6 , in the display panel manufacturing apparatus 1 according to one embodiment, the panel member 10 and the bonding member 20 may be bonded to each other through a soldering process. Specifically, the first contact electrode (CTE1) and the anode pad electrode (APD) and the second contact electrode (CTE2) and the cathode pad electrode (CPD) may be bonded through a soldering process. In this case, pressure is applied to the first contact electrode (CTE1), the anode pad electrode (APD), the second contact electrode (CTE2), and the cathode pad electrode (CPD), and laser irradiation is provided at the same time to achieve pressure melt bonding. This can be done. Hereinafter, the configuration of the display panel manufacturing apparatus 1 will be examined in detail.

The display panel manufacturing apparatus 1 includes a lower support member 6, a bonding member 20, a protective film 9, a laser transmission member 8, an upper pressing member 5, a protective film transfer unit 90, and Includes a control unit 40.

The lower support member 6 serves to support the panel member 10 in the display panel manufacturing apparatus 1. A panel member 10 is disposed on the lower support member 6. The panel member 10 may be an object of pressure melt bonding using a laser.

A bonding member 20 is disposed on the panel member 10. The panel member 10 and the bonding member 20 may be pressure-melted and bonded. That is, the bonding member 20 may be an object of pressure melt bonding using a laser.

The bonding member 20 includes a bonding member 23, a light emitting element LE disposed on the bonding member 23, a stamp layer 21 disposed on the light emitting element LE, and flux 24.

As described above, each of the light emitting elements (LE) includes a base substrate (SSUB), an n-type semiconductor (NSEM), an active layer (MQW), a p-type semiconductor (PSEM), a first contact electrode (CTE1), and a second contact electrode. (CTE2) may be included. The light emitting element LE may be an object of pressure melt bonding using a laser in the display panel manufacturing apparatus 1. Specifically, the first contact electrode CTE1 of the light emitting element LE is bonded to the anode pad electrode APD of the panel member 10, and the second contact electrode CTE2 of the light emitting element LE is connected to the panel member 10. It can be bonded to the cathode pad electrode (CPD) of (10). That is, according to pressure melt bonding using a laser in the display panel manufacturing apparatus 1, the first contact electrode (CTE1) and the second contact electrode (CTE2) of the light emitting element (LE) are connected to the anode pad electrode (APD) and the anode pad electrode (APD), respectively. It can be bonded to a cathode pad electrode (CPD).

A bonding member 23 may be disposed on one surface of the light emitting element LE. The bonding member 23 may be a bonded product of pressure melt bonding using a laser in the display panel manufacturing apparatus 1. Here, in pressurized melt bonding, the bonding member 23 receives heat and melts, and the light emitting element (LE), anode pad electrode (APD), and cathode pad electrode (CPD) are melted and mixed, and the laser supply is terminated and cooled. It refers to a solidified state. Even though it is cooled and solidified in the melted mixed state, the conductivity of the light emitting element (LE), anode pad electrode (APD), and cathode pad electrode (CPD) is maintained, so the anode pad electrode (APD) and cathode pad electrode (CPD) Each light emitting element (LE) can be electrically and physically connected. Accordingly, the bonding member 23 may be disposed on the first contact electrode CTE1 and the second contact electrode CTE2 of the light emitting element LE.

The bonding member 23 may include, for example, Au, AuSn, PdIn, InSn, NiSn, Au-Au, AgIn, AgSn, Al, Ag, or carbon nanotubes (CNT). These may be used individually or in combination of two or more. Depending on the type of the bonding member 23, the bonding member 23 may be formed by depositing on the pad electrode or may be formed on the pad electrode through various methods such as screen printing.

A stamp layer 21 may be disposed on the other side of the light emitting element LE. The stamp layer 21 may extend in the first direction (X). The stamp layer 21 may overlap the other surface of the light emitting element LE. Additionally, the stamp layer 21 may overlap the protective film 9. The light emitting element LE may be adhered to one side of the stamp layer 21, and the protective film 9 may be disposed on the other side of the stamp layer 21.

The stamp layer 21 may include, for example, glass or plastic. When the stamp layer 21 includes thin glass, the glass may be ultra-thin glass. Alternatively, the stamp layer 21 may be made of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), It may be made of polymethyl methacrylate (PMMA), triacetylcellulose (TAC), cycloolefin polymer (COP), etc. The stamp layer 21 may include an adhesive layer to adhere to the light emitting element LE. An explanation regarding this will be provided later.

Bonding member 20 includes flux 24 . The flux 24 may fill the outside of the light emitting element LE of the bonding member 20 and the joining member 23. The flux 24 may be a material that facilitates joining the panel member 10 and the bonding member 23 in a pressure melting process using a laser. Flux 24 may be oil-soluble or water-soluble and may include natural or synthetic rosin. Flux 24 may be in liquid form or gel form.

A protective film 9 is disposed on the bonding member 20. The protective film 9 may extend in the first direction (X). The protective film 9 may be overlapped on the bonding member 20 . Additionally, the protective film 9 may overlap the laser transmission member 8. The protective film 9 is attached to the top of the bonding member 20 to protect the laser transmission member 8 from contamination, while transmitting the laser emitted toward the bonding member 20.

The protective film 9 may be disposed to overlap the bonding member 20 and cover the entire surface of the bonding member 20 . The protective film 9 has a generally similar shape in plan view to the bonding member 20, but its size may be larger than that of the panel member 10. For example, the protective film 9 may protrude outward from the bonding member 20 on both sides of the display panel manufacturing apparatus 1 . Additionally, the protective film 9 may protrude outward from the lower support member 6. The protective film 9 may have a rectangular shape including both long sides and both short sides, the same as the planar shape of the bonding member 20.

The protective film 9 includes one side and the other side. When the protective film 9 is in contact with the bonding member 20, one side of the protective film 9 becomes the side in contact with the laser transmission member 8, and the other side of the protective film 9 becomes the bonding member 20. It becomes the side opposite to .

The protective film 9 may be made of a transparent material. The protective film 9 may include, for example, glass or plastic. When the protective film 9 includes thin glass, the glass may be ultra-thin glass.

The protective film transfer unit 90 may be disposed on both sides of the protective film 9. For example, the protective film transfer unit 90 may be disposed at both ends of the protective film 9 extending in the first direction (X). The protective film transport unit 90 serves to transport the protective film 9. For example, the protective film transfer unit 90 may be implemented in a reel-to-reel method that unwinds the protective film 9 wound in a roll and transfers it to one side. Accordingly, the protective film transfer unit 90 can remove the protective film 9 contaminated during the laser bonding process and place a new protective film 9 on the bonding member 20.

The protective film transport unit 90 includes a moving unit 91, a guide roller 92, and a rolling unit 93.

The rolling part 93 may be connected to the protective film 9. For example, the first rolling part 931 and the second rolling part 932 may be connected to the protective film 9. The rolling part 93 can roll or unwind the protective film 9. For example, in order to remove the contaminated protective film 9 during the laser bonding process, the first rolling part 931 and the second rolling part 932 rotate in the same direction to apply a new protective film 9 to the bonding member ( 20) It can be placed on the table. Description of the rolling part 93 and the protective film 9 will be described later in conjunction with FIGS. 7 to 9.

The guide roller 92 may support the protective film 9. For example, the guide roller 92 may support the protective film 9 so that the protective film 9 is disposed between the bonding member 20 and the laser transmission member 8. In the drawing, the first guide roller 921 may support the left side of the protective film 9, and the second guide roller 92 may support the right side of the protective film 9. Accordingly, the first guide roller 921 and the second guide roller 92 each support both sides of the protective film 9, so that the protective film 9 can be placed horizontally.

Additionally, the guide roller 92 may support the protective film 9 so that it can move in one direction. For example, when the protective film 9 is implemented in a reel-to-reel manner, the guide roller 92 is the first protective film 9 transferred through the rolling unit 93. It can be supported so that it can be transported in direction (X).

The moving unit 91 can move the protective film 9 in one direction. For example, the moving unit 91 may move in the third direction Z so that the protective film 9 can contact the bonding member 20 . Additionally, the first moving unit 911 and the first guide roller 921 may be connected to each other, and the second moving unit 912 and the second guide roller 92 may be connected to each other. Therefore, the first guide roller 921 is connected to the first moving unit 911 and the second guide roller 92 is connected to the second moving unit 912, so that the first guide roller 921 and the second The protective film 9 supported by the guide roller 92 can move in the third direction (Z). The specific operation of the protective film transfer unit 90 will be described later with reference to FIG. 9 .

A laser transmission member 8 is disposed on the protective film 9. Additionally, the laser transmission member 8 may be made of a material that transmits laser. The laser transmission member 8 can be implemented with any beam-transmitting material.

The laser transmission member 8 may be implemented, for example, with any one of quartz, sapphire, fused silica glass, or diamond. However, the physical properties of the laser transmission member 8 made of quartz are different from those of the laser transmission member 8 made of sapphire. For example, when irradiating a 980 nm Laser, the transmittance of the laser penetrating member 8 made of quartz is 85% to 99%, and the transmittance of the laser penetrating member 8 made of sapphire is 80%. It may be % to 90%. In order to prevent damage to the laser penetrating member 8 made of a quartz material and improve durability, a thin film coating layer can be formed on the bottom surface of the laser penetrating member 8 made of a quartz material. The thin film coating layer formed on the bottom surface of the laser transmission member 8 may be implemented as a dielectric coating, a typical optical coating, a SiC coating, or a metallic material coating.

The upper pressing member 5 may be connected to the laser transmission member 8. The upper pressing member 5 can press in one direction. For example, the upper pressing member 5 may apply pressure in one direction of the third direction (Z). Accordingly, the laser transmission member 8 connected to the upper pressing member 5 can press the bonding member 20 in one direction of the third direction (Z).

By radiating a laser to the bonding member 20 while pressing the bonding member 20 with the laser transmission member 8, the substrate and the bonding member 20 can be pressurized and melt bonded. In this case, the laser transmission member 8 is moved to a working position or a standby position by a predetermined type of laser transmission member 8 transfer unit. In one embodiment of the present invention, the protective film transfer unit 90 is a protective film 9. ) can be transported in one direction.

The control unit 40 controls the operation of the laser transmission member 8 transport unit. For example, the control unit 40 may control the operation of the laser penetrating member 8 transport unit using data input from a pressure sensor (not shown) and a height sensor (not shown). The control unit 40 receives data from the pressure sensor and controls the protective film transfer unit 90 so that the pressure reaches the target value. Additionally, the control unit 40 receives data from the height sensor and controls the protective film transfer unit 90 so that the pressure reaches the target value. You can control it.

Figure 7 is a cross-sectional view showing the protective film 9 according to one embodiment. Figure 8 is a cross-sectional view showing the protective film 9 and the bonding member 20 according to one embodiment.

Referring to FIG. 7, the protective film 9 includes a first film layer 901 and a first adhesive layer 902.

The first film layer 901 may extend in the first direction (X). The first film layer 901 may overlap on the bonding member 20 . Additionally, the first film layer 901 may overlap the laser transmission member 8. A laser transmission member 8 is disposed on one surface of the first film layer 901. One surface of the first film layer 901 is the surface that the laser transmission member 8 contacts. Accordingly, one surface of the first film layer 901 transmits the laser emitted toward the bonding member 20 and may be made of a transparent material.

The first film layer 901 may include, for example, glass or plastic. When the protective film 9 includes thin glass, the glass may be ultra-thin glass. Alternatively, the first film layer 901 may be made of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), or polysulfone (PSF). ), polymethyl methacrylate (PMMA), triacetylcellulose (TAC), cycloolefin polymer (COP), etc.

The first adhesive layer 902 is disposed on the other side of the first film layer 901. The first adhesive layer 902 bonds (adheres) the first film layer 901 to one surface of the bonding member 20. That is, the first film layer 901 is attached to one surface of the bonding member 20 through the first adhesive layer 902. The first adhesive layer 902 may be made of a low adhesive layer. For example, the first adhesive layer 902 may include an acrylic, urethane, or silicone adhesive material.

Referring further to FIG. 8 , the stamp layer 21 of the bonding member 20 includes a second film layer 211 and a second adhesive layer 212.

The second film layer 211 may extend in the first direction (X). The second film layer 211 may overlap the light emitting element LE. Additionally, the second film layer 211 may overlap the protective film 9. The protective film 9 may be adhered to one side of the second film layer 211, and the light emitting element LE may be disposed on the other side of the second film layer 211.

The second film layer 211 may include, for example, glass or plastic. When the protective film 9 includes thin glass, the glass may be ultra-thin glass. Alternatively, the second film layer 211 may be made of polyethylene terephthalate (PET), polyurethane (PU), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), or polysulfone (PSF). ), polymethyl methacrylate (PMMA), triacetylcellulose (TAC), cycloolefin polymer (COP), etc.

The second adhesive layer 212 is disposed on the other side of the second film layer 211. The second adhesive layer 212 bonds (adheres) the second film layer 211 to one surface of the light emitting element LE. That is, the second film layer 211 is attached to one surface of the light emitting element LE through the second adhesive layer 212. The second adhesive layer 212 may be made of a low adhesive layer. For example, the first adhesive layer 902 may include an acrylic, urethane, or silicone adhesive material.

As described later, the light emitting element (LE) adhered to the stamp layer 21 is combined with the panel member 10 through a laser bonding process, and the stamp layer 21 is bonded to the light emitting element (LE) through the protective film 9. ) is removed from. Therefore, in order for the stamp layer 21 to be detached from the light emitting element LE through the protective film 9, the first adhesive force of the protective film 9 is greater than the adhesive force of the second adhesive layer 212 of the stamp layer 21. The adhesion of layer 902 may be high. That is, the stamp layer 21 and the light emitting element LE are adhered due to the adhesive force of the second adhesive layer 212 of the stamp layer 21, and the adhesive force of the first adhesive layer 902 of the protective film 9 Because of this, the protective film 9 and the stamp layer 21 may be adhered.

Figure 9 is a cross-sectional view showing the protective film transfer unit 90 according to one embodiment.

Referring to FIG. 9 , the first rolling part 931 may rotate in the first rotation direction RR1. For example, when the stamp layer 21 is attached to the protective film 9 in a laser bonding process, the first rolling part 931 may rotate in the first rotation direction RR1. Accordingly, the protective film 9 connected to the first rolling part 931 may be released from the first rolling part 931. Accordingly, when the first rolling part 931 rotates in the first rotation direction RR1, the protective film 9 wound around the first rolling part 931 decreases.

Additionally, the second rolling part 932 may rotate in the first rotation direction RR1. For example, when the stamp layer 21 is attached to the protective film 9 in a laser bonding process, the second rolling part 932 may rotate in the first rotation direction RR1. Accordingly, the protective film 9 to which the stamp layer 21 is attached can be wound around the second rolling part 932. Accordingly, when the second rolling part 932 rotates in the first rotation direction RR1, the protective film 9 may be wrapped around the second rolling part 932.

Accordingly, as the first rolling part 931 and the second rolling part 932 rotate in the first rotation direction, the protective film 9 can be transferred in the first driving direction G1. That is, the protective film 9 with the stamp layer 21 disposed on the bonding member 20 is transferred to the second rolling unit 932, and the new protective film 9 is transferred to the first rolling unit 931. can be transferred from

The first moving unit 911 and the second moving unit 912 may move in the second driving direction G2. For example, when the first moving unit 911 and the second moving unit 912 move in one direction of the third direction (Z), the first guide roller 921 connected to the first moving unit 911 moves in one direction of the third direction (Z). Accordingly, the protective film 9 supported by the first guide roller 921 can move in one direction of the third direction (Z). Additionally, the second guide roller 92 connected to the second moving unit 912 moves in one direction of the third direction (Z). Accordingly, the protective film 9 supported by the second guide roller 92 can move in one direction of the third direction (Z).

Meanwhile, when the first moving unit 911 and the second moving unit 912 move in the other direction of the third direction (Z), the first guide roller 921 connected to the first moving unit 911 is 3 Move in the other direction (Z). Accordingly, the protective film 9 supported by the first guide roller 921 can move in the other direction of the third direction (Z). Additionally, the second guide roller 92 connected to the second moving unit 912 moves in the other direction of the third direction (Z). Accordingly, the protective film 9 supported by the second guide roller 92 can move in the other direction of the third direction (Z).

In summary, as the moving unit 91 moves in one direction and the other direction of the third direction (Z), the protective film 9 can move in one direction and the other direction of the third direction (Z). Accordingly, the protective film 9 moves in one direction of the third direction (Z) and contacts one surface of the bonding member 20, or the protective film 9 moves in the other direction of the third direction (Z). It may separate from the bonding member 20.

Figure 10 is a flowchart showing a method of manufacturing a display panel according to an embodiment. Figure 11 is a cross-sectional view showing a method of manufacturing a display panel according to an embodiment. Figure 12 is an enlarged view showing the panel member 10 and the bonding member 20 according to one embodiment. 13 to 17 are cross-sectional views showing a method of manufacturing a display panel according to an embodiment.

With reference to FIGS. 10 to 17 , a method of manufacturing a display panel using the laser bonding process of the display panel manufacturing apparatus 1 will be described.

Referring to FIG. 10, first, the bonding member 20 is aligned on the panel member 10 (S100).

With further reference to FIGS. 11 and 12 , the panel member 10 is disposed on the lower support member 6 and the bonding member 20 is disposed on the panel member 10 . In this case, the bonding member 20 can be aligned with the panel member 10 for pressure melt bonding of the panel member 10 and the bonding member 20 using a laser. For example, the anode pad electrode (APD) of the panel member 10 may be disposed to face the first contact electrode (CTE1) of the light emitting element (LE). Additionally, the cathode pad electrode (CPD) of the panel member 10 may be disposed to face the second contact electrode (CTE2) of the light emitting element (LE).

Next, the protective film 9 is attached to the bonding member 20 (S200), and the upper pressing member 5 presses the bonding member 20 in one direction of the third direction (Z) (S300). .

Referring further to FIG. 13 , by moving the moving unit 91 in one direction, the protective film 9 can move in one direction of the third direction (Z). For example, the first moving unit 911 and the second moving unit 912 may move in the second driving direction G2. For example, when the first moving unit 911 and the second moving unit 912 move in one direction of the third direction (Z), the first guide roller 921 connected to the first moving unit 911 moves in one direction of the third direction (Z). Accordingly, the protective film 9 supported by the first guide roller 921 can move in one direction of the third direction (Z). Additionally, the second guide roller 92 connected to the second moving unit 912 moves in one direction of the third direction (Z). Accordingly, the protective film 9 supported by the second guide roller 92 can move in one direction of the third direction (Z). Accordingly, the protective film 9 is attached to the stamp layer of the bonding member 20. (21) It can be attached to the phase. The stamp layer 21 of the bonding member 20 includes a second adhesive layer 212 disposed on the light emitting element LE and a second film layer 211 disposed on the second adhesive layer 212. . Accordingly, the first adhesive layer 902 of the protective film 9 may be adhered to the second film layer 211 of the stamp layer 21.

Additionally, with further reference to Figure 14, the upper pressing member 5 can move in one direction. For example, the upper pressing member 5 may move in one direction of the third direction (Z), and accordingly the laser transmission member 8 connected to the upper pressing member 5 may move in one direction of the third direction (Z). Can move in any direction. That is, by moving the upper pressing member 5 in one direction of the third direction Z, the laser transmission member 8 can contact the protective film 9. Additionally, the upper pressing member 5 may apply a third pressure G3 to the bonding member 20 in one direction of the third direction Z. Accordingly, the first adhesive layer 902 of the protective film 9 and the second film layer 211 of the stamp layer 21 are adhered, and the light emitting element LE and the panel member ( 10) may become sticky.

Next, the laser LS is irradiated to the bonding member 20 (S400).

Referring further to FIG. 15, as the bonding member 20 is in contact with the protective film 9 and the laser LS is irradiated while the protective film 9 is in contact with the laser transmission member 8, the laser ( LS) may be irradiated to the bonding member 20 by passing through the laser transmission member 8 and the protective film 9. Accordingly, the laser LS can heat the bonding member 20 to the melting temperature of the joining member 23. Accordingly, the bonding member 23 can press-melt and bond the light-emitting device LE to the anode pad electrode (APD) and cathode pad electrode (CPD).

Here, in pressure melt bonding, the bonding member 23 is heated and melted by irradiation of the laser LS, and the light emitting element LE, the anode pad electrode (APD), and the cathode pad electrode (CPD) are melted and mixed. , This refers to the state where the laser supply is terminated and cooled and solidified. Even though it is cooled and solidified in the melted mixed state, the conductivity of the light emitting element (LE), anode pad electrode (APD), and cathode pad electrode (CPD) is maintained, so the anode pad electrode (APD) and cathode pad electrode (CPD) Each light emitting element (LE) can be electrically and physically connected.

Next, the upper pressing member 5 is separated from the protective film 9 (S500), and the protective film 9 is separated from the bonding member 20 (S600).

With further reference to Figure 16, the upper pressing member 5 can move in other directions. For example, the upper pressing member 5 may move in the other direction of the third direction (Z), and accordingly, the laser transmission member 8 connected to the upper pressing member 5 may move in the other direction of the third direction (Z). Can move in any direction. That is, by moving the upper pressing member 5 in the other direction of the third direction Z, the laser transmission member 8 can be separated from the protective film 9. Additionally, the upper pressing member 5 can remove the pressure applied to the bonding member 20 by having the fourth pressure G4 in the other direction of the third direction Z.

In this case, the protective film 9 is disposed between the laser transmission member 8 and the bonding member 20, so that the stamp layer 21 does not directly contact the laser transmission member 8. Additionally, the laser transmission member 8 and the flux 24 of the bonding member 20 may not be in direct contact. Accordingly, when the laser transmission member 8 is separated from the bonding member 20, the flux 24 may not remain on the laser transmission member 8.

Additionally, with further reference to FIG. 17 , when the moving unit 91 moves in another direction, the protective film 9 can move in the other direction of the third direction Z. For example, the first moving unit 911 and the second moving unit 912 may move in the second driving direction G2. For example, when the first moving unit 911 and the second moving unit 912 move in the other direction of the third direction (Z), the first guide roller 921 connected to the first moving unit 911 moves in the other direction of the third direction (Z). Accordingly, the protective film 9 supported by the first guide roller 921 can move in the other direction of the third direction (Z). Additionally, the second guide roller 92 connected to the second moving unit 912 moves in the other direction of the third direction (Z). Accordingly, the protective film 9 supported by the second guide roller 92 can move in the other direction of the third direction (Z).

In this case, when the protective film 9 is detached from the bonding member 20, the stamp layer 21 of the bonding material may adhere to the protective film 9 and be detached from the light emitting element LE. As described above, since the adhesive force of the first adhesive layer 902 of the protective film 9 is greater than the adhesive force of the second adhesive layer 212 of the stamp layer 21, the protective film 9 and the stamp layer 21 ) The bonding force between them is greater than the bonding force between the stamp layer 21 and the light emitting element (LE). Therefore, when the protective film 9 moves in the other direction of the third direction (Z), the stamp layer may be adhered to the protective film 9. Accordingly, the stamp layer 21 can be detached from the light emitting element LE. Accordingly, when the protective film 9 is detached from the bonding member 20, the stamp layer 21 is also detached, thereby simplifying the manufacturing process of the display panel.

In addition, the protective film 9 is disposed between the laser transmission member 8 and the bonding member 20, so that the protective film 9 can prevent the stamp layer 21 from directly contacting the laser transmission member 8. there is. Additionally, the protective film 9 can prevent the laser transmission member 8 and the flux 24 of the bonding member 20 from coming into direct contact. Accordingly, the protective film 9 can protect the laser transmission member 8 from being contaminated with contaminants.

Finally, the protective film 9 is transferred (S700).

In the above-described process, in order to proceed with the new laser bonding process, the protective film 9 to which the remaining flux 24 and the stamp layer 21 are adhered must be removed. For example, as in the case of FIG. 17, when the protective film 9 is driven in a reel-to-reel manner, the first rolling part 931 may rotate in the first rotation direction RR1. For example, when the stamp layer 21 is attached to the protective film 9 in a laser bonding process, the first rolling part 931 may rotate in the first rotation direction RR1. Accordingly, the protective film 9 connected to the first rolling part 931 may be released from the first rolling part 931. Accordingly, when the first rolling part 931 rotates in the first rotation direction RR1, the protective film 9 wound around the first rolling part 931 decreases.

Additionally, the second rolling part 932 may rotate in the first rotation direction RR1. For example, when the stamp layer 21 is attached to the protective film 9 in a laser bonding process, the second rolling part 932 may rotate in the first rotation direction RR1. Accordingly, the protective film 9 to which the stamp layer 21 is attached can be wound around the second rolling part 932. Accordingly, when the second rolling part 932 rotates in the first rotation direction RR1, the protective film 9 may be wrapped around the second rolling part 932.

Accordingly, as the first rolling part 931 and the second rolling part 932 rotate in the first rotation direction, the protective film 9 can be transferred in the first direction (X). That is, the protective film 9 with the stamp layer 21 disposed on the bonding member 20 is transferred to the second rolling unit 932, and the new protective film 9 is transferred to the first rolling unit 931. can be transferred from

In the method of manufacturing a display panel according to an embodiment of the present invention, the adhesive force of the first adhesive layer 902 of the protective film 9 is greater than the adhesive force of the second adhesive layer 212 of the stamp layer 21, so the protective film The bonding force between (9) and the stamp layer 21 is greater than the bonding force between the stamp layer 21 and the light emitting element LE. Therefore, when the protective film 9 moves in the other direction of the third direction (Z), the stamp layer may be adhered to the protective film 9. Accordingly, the stamp layer 21 can be detached from the light emitting element LE. Accordingly, when the protective film 9 is detached from the bonding member 20 and transferred, the stamp layer 21 is also detached and removed, thereby simplifying the manufacturing process of the display panel.

In addition, the protective film 9 is disposed between the laser transmission member 8 and the bonding member 20, so that the protective film 9 can prevent the stamp layer 21 from directly contacting the laser transmission member 8. there is. Additionally, the protective film 9 can prevent the laser transmission member 8 and the flux 24 of the bonding member 20 from coming into direct contact. Accordingly, the protective film 9 can protect the laser transmission member 8 from being contaminated with contaminants.

Figure 18 is a cross-sectional view showing a display panel manufacturing apparatus 1 according to another embodiment.

The embodiment of FIG. 18 differs from the embodiment of FIG. 5 in that the protective film 9 is formed in a sheet shape. Hereinafter, the embodiment of FIG. 18 will be described focusing on the differences from the embodiment of FIG. 5.

Referring to FIG. 18, the display panel manufacturing apparatus 1 includes a lower support member 6, a panel member 10 disposed on the lower support member 6, and a bonding member disposed on the panel member 10 ( 20), including a protective film 9 disposed on the bonding member 20, a laser transmission member 8 disposed on the protective film 9, and an upper pressing member 5. The configuration and arrangement of the lower support member 6, the panel member 10, the bonding member 20, the laser transmission member 8, and the upper pressing member 5 are substantially the same as those in the embodiment of FIG. 5, so they are omitted. Do this.

The protective film 9 may extend in the first direction (X). The protective film 9 may be overlapped on the bonding member 20 . Additionally, the protective film 9 may overlap the laser transmission member 8. The protective film 9 is attached to the top of the bonding member 20 to protect the laser transmission member 8 from contamination, while transmitting the laser emitted toward the bonding member 20.

The protective film 9 may be disposed to overlap the bonding member 20 and cover the entire surface of the bonding member 20 . The protective film 9 has a generally similar shape in plan view to the bonding member 20, but its size may be larger than that of the panel member 10. For example, the protective film 9 may protrude outward from the bonding member 20 on both sides of the display panel manufacturing apparatus 1 . Additionally, the protective film 9 may protrude outward from the lower support member 6. The protective film 9 may have a rectangular shape including both long sides and both short sides, the same as the planar shape of the bonding member 20.

The protective film 9 may be of a sheet type. For example, as in the case of the embodiment of FIG. 5, when the protective film 9 is transported in a reel-to-reel manner, as the rolling part 93 rotates in the pressure melt bonding process using a laser, the protective film becomes contaminated. The film 9 may be transferred to the second rolling unit 932, and a new protective film 9 may be transferred to the first rolling unit 931. On the other hand, in the case of the embodiment of FIG. 18, the protective film 9 may have a width that covers the entire surface of the bonding member 20, and in the pressure melt bonding process using a laser, the sheet-type protective film 9 is attached to the protective film transfer unit. It can be transported by (90). The protective film 9 includes a first film layer 901 and a first adhesive layer 902. The description regarding this will be omitted since it is substantially the same as the embodiment of FIG. 5.

The protective film transport unit 90 serves to transport the protective film 9. For example, the protective film transfer unit 90 may transfer the sheet-type protective film 9 to one side. The protective film 9 is disposed on one side of the protective film transfer unit 90, and the protective film transfer unit 90 can remove the contaminated protective film 9 and transfer a new protective film 9. The protective film transfer unit 90 may be made of a tray, chunk, mother board, etc.

Even in the case of the display panel manufacturing apparatus 1 according to the present embodiment, the adhesive force of the first adhesive layer 902 of the protective film 9 is greater than the adhesive force of the second adhesive layer 212 of the stamp layer 21. Therefore, the bonding force between the protective film 9 and the stamp layer 21 is greater than the bonding force between the stamp layer 21 and the light emitting element LE. Therefore, when the protective film 9 moves in the other direction of the third direction (Z), the stamp layer may be adhered to the protective film 9. Accordingly, the stamp layer 21 can be detached from the light emitting element LE. Accordingly, when the protective film 9 is detached from the bonding member 20 and transferred, the stamp layer 21 is also detached and removed, thereby simplifying the manufacturing process of the display panel.

In addition, the protective film 9 is disposed between the laser transmission member 8 and the bonding member 20, so that the protective film 9 can prevent the stamp layer 21 from directly contacting the laser transmission member 8. there is. Additionally, the protective film 9 can prevent the laser transmission member 8 and the flux 24 of the bonding member 20 from coming into direct contact. Accordingly, the protective film 9 can protect the laser transmission member 8 from being contaminated with contaminants.

FIG. 19 is an example diagram showing the front of a tile-type display device according to an embodiment.

Referring to FIG. 19 , a tiled display device (TDD) according to an embodiment may include a plurality of display panels 11, 12, 13, and 14, and a joint SM. For example, the tiled display device (TDD) may include a first display panel 11, a second display panel 12, a third display panel 13, and a fourth display panel 14.

The plurality of display panels 11, 12, 13, and 14 may be arranged in a matrix form in M (M is a positive integer) rows and N (N is a positive integer) columns. For example, the first display panel 11 and the second display panel 12 may be adjacent to each other in the first direction DR1. The first display panel 11 and the third display panel 13 may be adjacent to each other in the second direction DR2. The third display panel 13 and the fourth display panel 14 may be adjacent to each other in the first direction DR1. The second display panel 12 and the fourth display panel 14 may be adjacent to each other in the second direction DR2.

However, the number and arrangement of the plurality of display panels 11, 12, 13, and 14 in the tiled display device (TDD) are not limited to those shown in FIG. 19. The number and arrangement of the plurality of display panels 11, 12, 13, and 14 in the tiled display device (TDD) depend on the size and shape of the display device and the tiled display device (TDD), respectively. It can be decided accordingly.

The plurality of display panels 11, 12, 13, and 14 may have the same size, but embodiments of the present specification are not limited thereto. For example, the plurality of display panels 11, 12, 13, and 14 may have different sizes.

Each of the plurality of display panels 11, 12, 13, and 14 may have a rectangular shape including a long side and a short side. The plurality of display panels 11, 12, 13, and 14 may be arranged with their long or short sides connected to each other. Some or all of the plurality of display panels 11, 12, 13, and 14 are disposed at the edge of the tiled display device (TDD) and may form one side of the tiled display device (TDD). At least one display device among the plurality of display panels 11, 12, 13, and 14 may be disposed at at least one corner of the tiled display device TDD, and may be disposed on two adjacent sides of the tiled display device TDD. can be formed. At least one display device among the plurality of display panels 11, 12, 13, and 14 may be surrounded by other display devices.

Each of the plurality of display panels 11, 12, 13, and 14 may be substantially the same as the display panel 100 described with reference to FIG. 1 . Therefore, description of each of the plurality of display panels 11, 12, 13, and 14 will be omitted.

The joint SM may include a coupling member or an adhesive member. In this case, the plurality of display panels 11, 12, 13, and 14 may be connected to each other through a coupling member or adhesive member of the joint SM. The joint SM is between the first display panel 11 and the second display panel 12, between the first display panel 11 and the third display panel 13, and between the second display panel 12 and the fourth display panel 12. It may be disposed between the display panels 14 and between the third display panel 13 and the fourth display panel 14.

FIG. 20 is an enlarged layout diagram showing area H of FIG. 19 in detail.

Referring to FIG. 20, the joint SM is a tile-type display where the first display panel 11, the second display panel 12, the third display panel 13, and the fourth display panel 14 are adjacent to each other. The central area of the device (TDD) may have the form of a cross, a cross, or a planar shape of a plus sign. The joint SM is between the first display panel 11 and the second display panel 12, between the first display panel 11 and the third display panel 13, and between the second display panel 12 and the fourth display panel 12. It may be disposed between the display panels 14 and between the third display panel 13 and the fourth display panel 14.

The first display panel 11 may include first pixels PX1 arranged in a matrix form in the first direction DR1 and the second direction DR2 to display an image. The second display panel 12 may include second pixels PX2 arranged in a matrix form in the first direction DR1 and the second direction DR2 to display an image. The third display panel 13 may include third pixels PX3 arranged in a matrix form in the first direction DR1 and the second direction DR2 to display an image. The fourth display panel 14 may include fourth pixels PX4 arranged in a matrix form in the first direction DR1 and the second direction DR2 to display an image.

The minimum distance between neighboring first pixels (PX1) in the first direction (DR1) is defined as the first horizontal separation distance (GH1), and the minimum distance between neighboring second pixels (PX2) in the first direction (DR1) is defined as It may be defined as the second horizontal separation distance (GH2). The first horizontal separation distance GH1 and the second horizontal separation distance GH2 may be substantially the same.

A joint SM may be disposed between the first pixel PX1 and the second pixel PX2 that are adjacent in the first direction DR1. The minimum distance G12 between the neighboring first pixel PX1 and the second pixel PX2 in the first direction DR1 is the distance between the first pixel PX1 and the joint SM in the first direction DR1. The minimum distance (GHS1), the minimum distance (GHS2) between the second pixel (PX2) and the seam (SM) in the first direction (DR1), and the width of the seam (SM) in the first direction (DR1) It can be the sum of GSM1).

The minimum distance G12, the first horizontal separation distance GH1, and the second horizontal separation distance GH2 between the first pixel PX1 and the second pixel PX2 neighboring in the first direction DR1 are substantially can be the same. To this end, the minimum distance (GHS1) between the first pixel (PX1) and the joint (SM) in the first direction (DR1) is smaller than the first horizontal separation distance (GH1), and the second distance (GHS1) in the first direction (DR1) is smaller than the first horizontal separation distance (GH1). The minimum distance (GHS2) between the pixel (PX2) and the joint (SM) may be smaller than the second horizontal separation distance (GH2). Additionally, the width GSM1 of the joint SM in the first direction DR1 may be smaller than the first horizontal distance GH1 or the second horizontal distance GH2.

The minimum distance between neighboring third pixels (PX3) in the first direction (DR1) is defined as the third horizontal separation distance (GH3), and the minimum distance between neighboring fourth pixels (PX4) in the first direction (DR1) is defined as It may be defined as the fourth horizontal separation distance (GH4). The third horizontal separation distance GH3 and the fourth horizontal separation distance GH4 may be substantially the same.

A joint SM may be disposed between the third and fourth pixels PX3 and PX4 that are adjacent in the first direction DR1. The minimum distance G34 between the neighboring third pixel PX3 and fourth pixel PX4 in the first direction DR1 is between the third pixel PX3 and the joint SM in the first direction DR1. The minimum distance (GHS3), the minimum distance (GHS4) between the fourth pixel (PX4) and the seam (SM) in the first direction (DR1), and the width of the seam (SM) in the first direction (DR1) It can be the sum of GSM1).

The minimum distance G34, the third horizontal separation distance GH3, and the fourth horizontal separation distance GH4 between the third pixel PX3 and the fourth pixel PX4 neighboring in the first direction DR1 are substantially can be the same. To this end, the minimum distance GHS3 between the third pixel PX3 and the joint SM in the first direction DR1 is smaller than the third horizontal separation distance GH3, and the minimum distance GHS3 between the third pixel PX3 and the joint SM in the first direction DR1 is smaller than the third horizontal separation distance GH3 The minimum distance (GHS4) between the pixel (PX4) and the joint (SM) may be smaller than the fourth horizontal separation distance (GH4). Additionally, the width GSM1 of the joint SM in the first direction DR1 may be smaller than the third horizontal distance GH3 or the fourth horizontal distance GH4.

The minimum distance between neighboring first pixels (PX1) in the second direction (DR2) is defined as the first vertical separation distance (GV1), and the minimum distance between neighboring third pixels (PX3) in the second direction (DR2) is defined as It may be defined as the third vertical separation distance (GV3). The first vertical distance GV1 and the third vertical distance GV3 may be substantially the same.

A joint SM may be disposed between the first pixel PX1 and the third pixel PX3 that are adjacent in the second direction DR2. The minimum distance G13 between the neighboring first pixel PX1 and the third pixel PX3 in the second direction DR2 is between the first pixel PX1 and the joint SM in the second direction DR2. Minimum distance GVS1, minimum distance GVS3 between the third pixel PX3 and the seam SM in the second direction DR2, and width of the seam SM in the second direction DR2 ( It can be the sum of GSM2).

The minimum distance G13, the first vertical separation distance GV1, and the third vertical separation distance GV3 between the first pixel PX1 and the third pixel PX3 neighboring in the second direction DR2 are substantially can be the same. To this end, the minimum distance (GVS1) between the first pixel (PX1) and the joint (SM) in the second direction (DR2) is smaller than the first vertical separation distance (GV1), and the third The minimum distance (GVS3) between the pixel (PX3) and the joint (SM) may be smaller than the third vertical separation distance (GV3). Additionally, the width GSM2 of the joint SM in the second direction DR2 may be smaller than the first vertical distance GV1 or the third vertical distance GV3.

The minimum distance between neighboring second pixels (PX2) in the second direction (DR2) is defined as the second vertical separation distance (GV2), and the minimum distance between neighboring fourth pixels (PX4) in the second direction (DR2) is defined as It can be defined as the fourth vertical separation distance (GV4). The second vertical distance GV2 and the fourth vertical distance GV4 may be substantially the same.

A joint SM may be disposed between the second pixel PX2 and the fourth pixel PX4 that are adjacent in the second direction DR2. The minimum distance G24 between the neighboring second pixel PX2 and the fourth pixel PX4 in the second direction DR2 is between the second pixel PX2 and the joint SM in the second direction DR2. The minimum distance (GVS2), the minimum distance (GVS4) between the fourth pixel (PX4) and the seam (SM) in the second direction (DR2), and the distance of the seam (SM) in the second direction (DR2) It can be the sum of GSM4).

The minimum distance G24, the second vertical separation distance GV2, and the fourth vertical separation distance GV4 between the second pixel PX2 and the fourth pixel PX4 neighboring in the second direction DR2 are substantially can be the same. To this end, the minimum distance GVS2 between the second pixel PX2 and the joint SM in the second direction DR2 is smaller than the second vertical separation distance GV2, and the fourth distance in the second direction DR2 is smaller than the second vertical separation distance GV2. The minimum distance GVS4 between the pixel PX4 and the joint SM may be smaller than the fourth vertical separation distance GV4. Additionally, the width GSM2 of the joint SM in the second direction DR2 may be smaller than the second vertical distance GV2 or the fourth vertical distance GV4.

As shown in FIG. 20, in order to prevent the seam SM between images displayed by the plurality of display panels 11, 12, 13, and 14 from being visible, the minimum distance between pixels of neighboring display devices is set to may be substantially equal to the minimum distance between each pixel.

FIG. 21 is a cross-sectional view showing an example of a tile-type display device cut along line J-J' of FIG. 20.

Referring to FIG. 21 , the first display panel 11 includes a first display module (DPM1) and a first front cover (COV1). The second display panel 12 includes a second display module (DPM2) and a second front cover (COV2).

Each of the first display module DPM1 and the second display module DPM2 includes a substrate SUB, a thin film transistor layer, and a light emitting device layer. The thin film transistor layer and the light emitting device layer have already been described in detail with reference to FIG. 4. In FIG. 21, descriptions overlapping with the embodiment of FIG. 4 are omitted.

The substrate SUB has a first surface 41 on which the thin film transistor layer TFTL is disposed, a second surface 42 facing the first surface, and a space between the first surface 41 and the second surface 42. It may include a first side 43 disposed. The first surface 41 may be the front or top surface of the substrate SUB, and the second surface 42 may be the rear or bottom surface of the substrate SUB.

In addition, the substrate SUB further includes a chamfer surface 44 disposed between the first side 41 and the first side 43 and between the second side 42 and the first side 43. can do. The thin film transistor layer (TFTL) and the light emitting device layer (EML) may not be disposed on the chamfer surface 44. Due to the chamfer surface 44, the substrate SUB of the first display panel 11 and the substrate SUB of the second display panel 12 can be prevented from colliding and being damaged.

The chamfer surface 44 is between the first surface 41 and each of the other sides except the first side 43 and between the second surface 42 and each of the other sides except the first side 43. It can also be placed between . For example, when the first display panel 11 and the second display panel 12 have a rectangular planar shape as shown in FIG. 19, the substrate SUB has a first surface 41, a second side surface, and a third surface. It may be disposed between each of the side and fourth sides and between the second side 42 and each of the second, third, and fourth sides.

The first front cover COV1 may be disposed on the chamfered surface 44 of the substrate SUB. That is, the first front cover COV1 may protrude beyond the substrate SUB in the first direction DR1 and the second direction DR2. Therefore, the distance GSUB between the substrate SUB of the first display panel 11 and the substrate SUB of the second display panel 12 is the distance between the first front cover COV1 and the second front cover COV2. It can be larger than the distance (GCOV).

The first front cover (COV1) and the second front cover (COV2) each have an adhesive member 51, a light transmittance adjustment layer 52 disposed on the adhesive member 51, and a light transmittance adjustment layer 52. It may include an anti-glare layer (53) disposed.

The adhesive member 51 of the first front cover (COV1) serves to attach the light emitting element layer (EML) of the first display module (DPM1) to the first front cover (COV1). The adhesive member 51 of the second front cover (COV2) serves to attach the light emitting element layer (EML2) of the second display module (DPM2) to the second front cover (COV2). The adhesive member 51 may be a transparent adhesive member capable of transmitting light. For example, the adhesive member 51 may be an optically clear adhesive film or an optically clear resin.

The anti-glare layer 53 may be designed to diffusely reflect external light in order to prevent external light from being directly reflected and deteriorating image visibility. Accordingly, the anti-glare layer 53 may increase the contrast ratio of images displayed by the first display panel 11 and the second display panel 12.

The light transmittance adjustment layer 52 may be designed to reduce the transmittance of external light or light reflected from the first display module DPM1 and the second display module DPM2. As a result, the gap GSUB between the substrate SUB of the first display module DPM1 and the substrate SUB of the second display module DPM2 can be prevented from being viewed from the outside.

The anti-glare layer 53 may be implemented as a polarizing plate, and the light transmittance adjustment layer 52 may be implemented as a phase retardation layer, but the embodiments of the present specification are not limited thereto.

Meanwhile, an example of a tile-type display device cut along lines K-K', L-L', and MM' of FIG. 20 is a tile-type display device cut along lines J-J' described in conjunction with FIG. 21. Since it is substantially the same as an example of, description thereof is omitted.

FIG. 22 is an example diagram showing the front of a first display panel according to an embodiment. FIG. 23 is an example diagram showing the back of a first display panel according to an embodiment. FIG. 24 is a cross-sectional view showing an example of the first display panel cut along line N-N' of FIGS. 22 and 23.

Referring to FIGS. 22 and 23 , front display pads (DPD) and front power pads (VPD) may be front pads disposed on the front side of the substrate (SUB). Front display pads (DPD) may be disposed on the upper edge of the substrate (SUB), and front power pads (VPD) may be disposed on the lower edge of the substrate (SUB).

The rear display pads DBD and the rear power pads VBD may be rear pads disposed on the rear surface of the substrate SUB. The rear display pads DBD may be disposed on the upper edge of the substrate SUB, and the rear power pads VBD may be disposed on the lower edge of the substrate SUB.

Each of the front display pads (DPD) may include first to fifth sub-pads (SPD1, SPD2, SPD3, SPD4, and SPD5). The front power pads (VPD) may also include first to fifth sub-pads (SPD1, SPD2, SPD3, SPD4, and SPD5), respectively.

The first source metal layer further includes a first sub pad (SPD1), the second source metal layer further includes a second sub pad (SPD2), and the third source metal layer further includes a third sub pad (SPD3). , the fifth source metal layer may further include a fourth sub-pad (SPD4), and the transparent metal layer may further include a fifth sub-pad (SPD5).

The second sub pad SPD2 may be placed on the first sub pad SPD1, and the third sub pad SPD3 may be placed on the second sub pad SPD2. The fourth sub-pad SPD4 may be placed on the third sub-pad SPD3, and the fifth sub-pad SPD5 may be placed on the fourth sub-pad SPD4. The top surface of the first sub pad (SPD1) may contact the bottom surface of the second sub pad (SPD2), and the top surface of the second sub pad (SPD2) may contact the bottom surface of the third sub pad (SPD3). The top surface of the third sub-pad SPD3 may contact the bottom surface of the fourth sub-pad SPD4, and the top surface of the fourth sub-pad SPD4 may contact the bottom surface of the fifth sub-pad SPD5.

The back connection line (BCL) may be disposed on the back of the substrate (SUB). The back connection wire (BCL) is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a single layer or multiple layers made of alloys thereof.

The second pad PD2 of each of the rear display pads DBD and the rear power pad VBD is disposed at one end of the back connection line BCL, and the third pad PD3 is disposed at one end of the back connection line BCL. ) can be placed on the other end of the. The second pad PD2 and the third pad PD3 may be formed of a transparent conductive oxide such as indium tin oxide (ITO) and indium zinc oxide (IZO).

The fifth planarization film 170 may be disposed on the back of the back connection line (BCL) and the substrate (SUB). The fifth planarization film 170 is formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. It can be. The fifth planarization film 170 may be referred to as an organic insulating film.

The fifth inorganic insulating film 171 may be disposed on the fifth planarization film 170 . The fifth inorganic insulating layer 171 may be formed of an inorganic layer, for example, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

The side wiring (SIL) is on the first surface (FS), first chamfered surface (CS1), first side (SS1), fifth chamfered surface (CS5), and second surface (BS) of the substrate (SUB). can be placed. The side wiring SIL may be disposed on the first pad PD1 disposed at the edge of the first surface FS of the substrate SUB and connected to the first pad PD1. The side wiring SIL may be disposed on the second pad PD2 disposed at the edge of the second surface BS of the substrate SUB and connected to the second pad PD2. The side wiring SIL may contact the first chamfered surface CS1, the first side SS1, and the fifth chamfered surface CS5 of the substrate SUB.

The overcoat layer (OC) is on the first surface (FS), first chamfered surface (CS1), first side (SS1), fifth chamfered surface (CS5), and second surface (BS) of the substrate (SUB). can be placed. The overcoat layer (OC) may be disposed to cover the side interconnection (SIL). The overcoat layer (OC) can be formed of an organic film such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

The first circuit board 310 and the second circuit board 320 may be disposed on the back of the substrate SUB. The first circuit board 310 may be disposed close to the upper edge of the substrate SUB, and the second circuit board 320 may be disposed close to the lower edge of the substrate. The back connection wiring of each of the first circuit board 310 and the second circuit board 320 is exposed and not covered by the fifth planarization film 170 and the fifth inorganic insulating film 171 through a conductive adhesive member (CAM). It may be connected to the third pad (PD3) of (BCL). The conductive adhesive member (CAM) may be an anisotropic conductive film or an anisotropic conductive paste.

The first driving circuit 210 may be mounted on the first circuit board 310, and the second driving circuit 220 may be mounted on the second circuit board 320. The first driving circuit 210 and the second driving circuit 220 may be integrated circuits.

The first driving circuit 210 transmits data to data lines through the first circuit board 310, a back connection line (BCL), a back display pad (DBD), a side line (SIL), and a front display pad (DPD). Voltages can be output. Additionally, the first driving circuit 210 may output enable signals through the first circuit board 310, the back connection wiring (BCL), and the side wiring (SIL), and detect detection voltages of the sensing wiring. .

The second driving circuit 220 outputs a power voltage through the second circuit board 320, a back connection wire (BCL), a back power pad (VBD), a side wire (SIL), and a front power pad (VPD). , the initialization voltage can be output, and the gate-off voltage can be output. The second driving circuit 220 may be a direct current-direct current converter.

Figure 25 is a block diagram showing a tile-type display device according to an embodiment. FIG. 26 is an example diagram showing wireless communication between a plurality of display panels of a tiled display device according to an embodiment.

In FIG. 25, the first display panel 11 and the host system (HOST) are shown for convenience of explanation.

25 and 26, a tiled display device (TDD) according to an embodiment includes a host system (HOST), a broadcast tuning unit 2100, a signal processing unit 2200, a display unit 230, and a speaker 240. ), a user input unit 250, a storage unit 260, a network communication unit 270, a UI creation unit 280, and a control unit 290.

The host system (HOST) may be implemented as any one of a television system, home theater system, set-top box, navigation system, DVD player, Blu-ray player, personal computer, mobile phone system, and tablet.

User commands can be entered into the host system (HOST) in various formats. For example, the host system (HOST) may receive commands through a user's touch input. Alternatively, a user's command may be input to the host system (HOST) by keyboard input or button input of a remote controller.

The host system (HOST) can receive original video data (ODATA) corresponding to the original video from the outside. The host system (HOST) can divide the original video data (ODATA) by the number of display devices. For example, the host system (HOST) corresponds to the first display panel 11, the second display panel 12, the third display panel 13, and the fourth display panel 14, and provides original video data ( ODATA) to the first video data (DATA1) corresponding to the first image, the second video data (DATA2) corresponding to the second image, the third video data (DATA3) corresponding to the third image, and the fourth image. It can be divided into corresponding fourth video data (DATA4). The host system (HOST) transmits first video data (DATA1) to the first display panel 11, second video data (DATA2) to the second display panel 12, and third video data (DATA3). ) can be transmitted to the third display panel 13, and the fourth video data (DATA4) can be transmitted to the fourth display panel 14.

The first display panel 11 displays the first image according to the first video data (DATA1), the second display panel 12 displays the second image according to the second video data (DATA2), and the third The display panel 13 may display a third image according to the third video data DATA3, and the fourth display panel 14 may display a fourth image according to the fourth video data DATA4. Accordingly, the user can watch the original image in which the first to fourth images displayed on the first to fourth display panels 11, 12, 13, and 14 are combined.

The first display panel 11 includes a broadcast tuning unit 2100, a signal processing unit 2200, a display unit 230, a speaker 240, a user input unit 250, a storage unit 260, a network communication unit 270, It may include a UI creation unit 280 and a control unit 290.

The broadcast tuning unit 2100 may tune a predetermined channel frequency under the control of the control unit 290 and receive the broadcast signal of the corresponding channel through an antenna. The broadcast tuning unit 2100 may include a channel detection module and an RF demodulation module.

The broadcast signal demodulated by the broadcast tuning unit 2100 is processed by the signal processing unit 2200 and output to the display unit 230 and the speaker 240. Here, the signal processor 2200 may include a demultiplexer 221, a video decoder 222, a video processor 223, an audio decoder 224, and an additional data processor 225.

The demultiplexer 221 separates the demodulated broadcast signal into a video signal, an audio signal, and additional data. The separated video signal, audio signal, and additional data are restored by the video decoder 222, the audio decoder 224, and the additional data processing unit 225, respectively. At this time, the video decoder 222, the audio decoder 224, and the additional data processing unit 225 restore the decoding format to the encoding format corresponding to the encoding format when transmitting the broadcast signal.

Meanwhile, the decoded video signal is converted by the video processing unit 223 to fit the output standard of the display unit 230 in terms of vertical frequency, resolution, screen ratio, etc., and the decoded audio signal is output to the speaker 240.

The display unit 230 includes a display panel 100 on which an image is displayed and a panel driver that controls the operation of the display panel 100.

The user input unit 250 may receive a signal transmitted by a host system (HOST). The user input unit 250 allows the user to enter commands related to communication with other display devices (DV2 to DV4) as well as data related to channel selection transmitted by the host system (HOST) and selection and operation of the UI (User Interface) menu. Arrangements may be made so that data for selection and input can be entered.

The storage unit 260 stores various software programs, including OS programs, recorded broadcast programs, videos, photos, and other data, and may be formed of a storage medium such as a hard disk or non-volatile memory.

The network communication unit 270 is for short-distance communication with the host system (HOST) and other display devices (DV2 to DV4), and is a communication module including an antenna pattern that can implement mobile communication, data communication, Bluetooth, RF, Ethernet, etc. Implementation is possible.

The network communication unit 270 uses technical standards or communication methods for mobile communication (e.g., Global System for Mobile communication (GSM), Code Division Multi Access (CDMA), Code Division Multi Access 2000 (CDMA2000), EV-DO (Enhanced Voice-Data Optimized or Enhanced Voice-Data Only), WCDMA (Wideband CDMA), HSDPA (High Speed Downlink Packet Access), HSUPA (High Speed Uplink Packet Access), LTE (Long Term Evolution), LTE-A (Long Term Evolution) Wireless signals may be transmitted and received with at least one of a base station, an external terminal, and a server on a mobile communication network built according to Term Evolution-Advanced (Term Evolution-Advanced), 5G, etc.).

The network communication unit 270 may transmit and receive wireless signals in a communication network based on wireless Internet technologies. Wireless Internet technologies include, for example, WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), and WiMAX (Worldwide). These include Interoperability for Microwave Access), HSDPA (High Speed Downlink Packet Access), HSUPA (High Speed Uplink Packet Access), LTE (Long Term Evolution), and LTE-A (Long Term Evolution-Advanced). Antenna electrodes (AEs) transmit and receive data according to at least one wireless Internet technology, including Internet technologies not listed above.

Additionally, the first to fourth display panels 11, 12, 13, and 14 can transmit and receive wireless signals to each other as shown in FIG. 26. That is, the first display panel 11 can transmit the first wireless signal RS1, and the second to fourth display panels 12, 13, and 14 can receive the first wireless signal RS1. there is. Additionally, the second display panel 12 can transmit a second wireless signal (RS2), and the first, third, and fourth display panels (11, 13, and 14) can transmit the second wireless signal (RS2). You can receive it. Additionally, the third display panel 13 can transmit a third wireless signal (RS3), and the first, second, and fourth display panels (11, 12, and 14) can transmit the third wireless signal (RS3). You can receive it. Additionally, the fourth display panel 14 can transmit a fourth wireless signal (RS4), and the first to third display panels (11, 12, and 13) can receive the fourth wireless signal (RS4). there is.

The UI generator 280 generates a UI menu for wireless communication with the host system (HOST) and the second to fourth display panels 12, 13, and 14, and can be implemented using an algorithm code and an OSD IC. . The UI menu for communication with the host system (HOST) and the second to fourth display panels 12, 13, and 14 may be a menu for specifying a digital TV with which communication is desired and selecting a desired function.

The control unit 290 is responsible for overall control of the first display panel 11 and communication control of the host system (HOST) and the second to fourth display panels 12, 13, and 14. The corresponding algorithm code is stored and can be implemented by an MCU (Micro Controller Unit) that executes the stored algorithm code.

The control unit 290 sends corresponding control commands and data to the host system (HOST) and the second to fourth display panels 12, 13, and 14 through the network communication unit 270 according to the input and selection of the user input unit 250. Control to transmit to . Of course, when predetermined control commands and data are input from the host system (HOST) and the second to fourth display panels 12, 13, and 14, operations are performed according to the corresponding control commands.

Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms, and can be manufactured in various different forms by those skilled in the art. It will be understood by those who understand that the present invention can be implemented in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

1: Display panel manufacturing device
6: Lower support member
10: Panel member
20: Bonding member
21: Stamp layer
23: Joint member
24: flux
LE: light emitting element
9: Protective film
8: Absence of laser transmission
5: Upper press member
90: Protective film transfer unit
91: Mobile unit
92: Guide roller
93: Rolling unit
APD: anode pad electrode
CPD: cathode pad electrode

Claims (20)

a lower support member disposed on the panel member and the panel member and supporting a bonding member including a light emitting element and a stamp layer adhered on one surface of the light emitting element;
a protective film disposed on the lower support member;
a protective film transfer unit that moves the protective film in one direction so as to contact the bonding member, and moves the protective film in another direction opposite to the one direction so as not to contact the bonding member;
a laser transmission member disposed on the protective film and transmitting a laser;
and an upper pressing member configured to press the laser transmission member in one direction,
The pressing member presses in the one direction, and a laser is irradiated to the bonding member through the laser transmission member and the protective film, so that the panel member and the bonding member are pressurized and fused to each other,
When the protective film moves in one direction, the stamp layer is adhered to the protective film, and when the protective film moves in the other direction, the stamp layer is detached from the light emitting device. . According to claim 1,
The protective film is a display panel manufacturing apparatus including a first adhesive layer and a first film layer disposed on the first adhesive layer. According to clause 2,
The stamp layer includes a second adhesive layer and a second film layer disposed on the second adhesive layer, and one surface of the light emitting device is adhered to the second adhesive layer. According to clause 3,
The apparatus for manufacturing a display panel wherein the adhesive force of the first adhesive layer is greater than the adhesive force of the second adhesive layer. According to clause 3,
The first film layer and the second film layer are made of the same material. According to claim 1,
The panel member includes an anode pad electrode and a cathode pad electrode, and one surface of the panel member exposes the anode pad electrode and the cathode pad electrode. According to clause 6,
The light emitting device includes a first contact electrode and a second contact electrode, and the other surface of the light emitting device exposes the first contact electrode and the second contact electrode. According to clause 7,
The bonding member further includes a joining member disposed between the anode pad electrode and the first contact electrode and between the cathode pad electrode and the second contact electrode. According to clause 8,
The bonding member further includes flux that fills the outside of the bonding member. According to claim 1,
The protective film transfer unit includes a moving unit configured to move in the one direction and the other direction;
a guide roller connected to the moving unit and supporting the protective film; and
A display panel manufacturing apparatus including a first rolling part and a second rolling part around which the protective film is wound. Placing a panel member on a lower support member;
disposing a bonding member including a light-emitting element and a stamp layer adhered on one surface of the light-emitting element on the panel member;
contacting a protective film on the bonding member;
contacting a laser transmission member on the protective film and pressing the bonding member in one direction;
irradiating a laser to the bonding member through the laser transmission member and the protective film;
moving the laser transmission member in another direction opposite to the one direction;
A method of manufacturing a display panel including the step of moving the protective film in the other direction to detach the stamp layer from the light emitting device. According to claim 11,
The protective film is a method of manufacturing a display panel including a first adhesive layer and a first film layer disposed on the first adhesive layer. According to claim 12,
The stamp layer includes a second adhesive layer and a second film layer disposed on the second adhesive layer, and one surface of the light emitting device is adhered to the second adhesive layer. According to claim 13,
The method of manufacturing a display panel wherein the adhesive force of the first adhesive layer is greater than the adhesive force of the second adhesive layer. According to claim 11,
The step of moving the protective film in the other direction to detach the stamp layer from the light emitting device
A method of manufacturing a display panel in which the protective film and the stamp layer are adhered and move integrally in the other direction. According to claim 11,
The method of manufacturing a display panel wherein the panel member includes an anode pad electrode and a cathode pad electrode, and one surface of the panel member exposes the anode pad electrode and the cathode pad electrode. According to claim 16,
The method of manufacturing a display panel wherein the light emitting device includes a first contact electrode and a second contact electrode, and the other surface of the light emitting device exposes the first contact electrode and the second contact electrode. According to claim 17,
The bonding member further includes a joining member disposed between the anode pad electrode and the first contact electrode and between the cathode pad electrode and the second contact electrode. According to clause 18,
The method of manufacturing a display panel, wherein the bonding member further includes flux that fills an outside of the bonding member. According to claim 11,
The method of manufacturing a display panel further includes transferring the protective film to which the stamp layer is attached and disposing a new protective film on the lower support member.

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