KR20240018327A - Electronic device comprising antenna - Google Patents

Abstract

An electronic device including an antenna according to an embodiment is disclosed. The antenna may include a plurality of layers stacked on a plate. The plurality of layers may include a layer including a ground disposed in a second section of the plate.

Description

Electronic device comprising an antenna {ELECTRONIC DEVICE COMPRISING ANTENNA}

This disclosure relates to an electronic device including an antenna.

An antenna is an interface between radio waves that propagate through space and electric current. For example, an antenna may be used with a transmitter and/or receiver. The antenna may be configured to transmit data in a specific band. The above-mentioned background technology is possessed or acquired in the process of deriving this disclosure and cannot necessarily be said to be known technology disclosed to the general public before the application of this disclosure.

According to one embodiment, an electronic device includes a housing, a plate disposed on the housing, and an antenna disposed on a first side of the plate, wherein the plate includes a plurality of first sections and a second section. And the antenna includes a plurality of layers stacked on the plate, wherein the plurality of layers include a first layer including a plurality of radiating patches respectively disposed in the plurality of first sections, and the plurality of first sections. a second layer including one section and a dielectric disposed in the second section, a ground disposed in the second section, a plurality of layers respectively disposed in the plurality of first sections and configured to bond the dielectric and the plate; A third layer comprising first joints and a second joint disposed in the second section and configured to join the ground and the plate.

According to one embodiment, the antenna includes a first layer including a plurality of radiating patches each disposed in a plurality of first sections, a second layer including a dielectric disposed in the plurality of first sections and the second section. a layer, and a ground disposed in the second section, a plurality of first joints disposed in each of the plurality of first sections and configured to join the dielectric and the plate, and disposed in the second section and the ground and and a third layer including a second joint configured to join the plates.

The above and other aspects, features and advantages of specific embodiments of the present disclosure will become apparent from the following detailed description with reference to the accompanying drawings.
1 is a block diagram of an electronic device in a network environment according to an embodiment.
2A is a perspective view of an electronic device according to an embodiment.
Figure 2b is a perspective view of an electronic device according to one embodiment.
Figure 2C is an exploded perspective view of an electronic device according to an embodiment.
Figure 3 is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device according to an embodiment.
4 is a plan view of a plate and an antenna module of an electronic device according to an embodiment.
FIG. 5 is a cross-sectional view taken along line 5-5 of the electronic device of FIG. 4 according to an embodiment.
FIG. 6 is a cross-sectional view taken along line 6-6 of the electronic device of FIG. 4 according to an embodiment.
7 is a perspective view of a partial structure of a plate and an antenna module of an electronic device according to an embodiment.
8 is a front perspective view of a partial structure of a plate of an electronic device according to an embodiment.
Figure 9 is a rear perspective view of a partial structure of a plate of an electronic device according to an embodiment.
10 is a plan view of a plate of an electronic device according to an embodiment.
11 is a plan view of a plate and an antenna module of an electronic device according to an embodiment.
FIG. 12 is a cross-sectional view taken along line 12-12 of the electronic device of FIG. 11 according to an embodiment.
FIG. 13 is a cross-sectional view taken along line 13-13 of the electronic device of FIG. 11 according to an embodiment.
Figure 14 is a perspective view of a plate of an electronic device according to an embodiment.
Figure 15 is a perspective view of a plate and an antenna module of an electronic device according to an embodiment.
Figure 16 is a perspective view of a printed circuit board and an antenna module of an electronic device according to an embodiment.
17 is a perspective view of a plate of an electronic device according to an embodiment.
18 is a plan view of a plate and an antenna module of an electronic device according to an embodiment.
FIG. 19 is a diagram illustrating a plate and an antenna module of an electronic device according to an embodiment.

1 is a block diagram of an electronic device in a network environment according to an embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term "module" used in the embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. You can. A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Embodiments of this document include one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140). For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, the method according to the embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to embodiments, each component (eg, a module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or Alternatively, one or more other operations may be added.

2A is a perspective view of an electronic device according to an embodiment. Figure 2b is a perspective view of an electronic device according to one embodiment. Figure 2C is an exploded perspective view of an electronic device according to an embodiment.

2A to 2C, the electronic device 201 (e.g., the electronic device 101 of FIG. 1) has a first side 210a (e.g., the front) and a second side 210b (e.g., the back). ), and a housing 210 having a third surface 210c (eg, side) surrounding the space between the first surface 210a and the second surface 210b.

In one embodiment, the first surface 210a may be formed at least in part by a substantially transparent first plate 211a. For example, the first plate 211a may include a glass plate or a polymer plate including at least one coating layer.

In one embodiment, the second surface 210b may be formed by a substantially opaque second plate 211b. For example, the second plate 211b may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination thereof.

In one embodiment, the third surface 210c may be formed by a frame 211c that is combined with the first plate 211a and the second plate 211b and includes metal and/or polymer.

In one embodiment, the second plate 211b and the frame 211c may be formed seamlessly. In one embodiment, the second plate 211b and the frame 211c may be formed of substantially the same material (eg, aluminum).

In one embodiment, the first plate 211a may include a plurality of first edge areas 212a-1. A plurality of first edge areas 212a-1 may face the second plate 211b from at least a portion of the first surface 210a. A plurality of first edge areas 212a-1 may contact the second plate 211b. The plurality of first edge areas 212a-1 may extend in one direction (eg, +/-Y direction). The first plate 211a may include a plurality of second edge areas 212a-2. A plurality of second edge areas 212a-2 may face the second plate 211b from at least a portion of the first surface 210a. A plurality of second edge areas 212a-2 may contact the second plate 211b. The plurality of second edge areas 212a-2 may extend in a direction different from the extension direction (e.g. +/-Y direction) of the plurality of first edge areas 212a-1 (e.g. +/-X direction). You can. The first plate 211a may include a plurality of third edge areas 212a-3. A plurality of third edge areas 212a-3 may face the second plate 211b from at least a portion of the first surface 210a. A plurality of third edge areas 212a-3 may contact the second plate 211b. A plurality of third edge areas 212a-3 may be disposed between a plurality of first edge areas 212a-1 and a plurality of second edge areas 212a-2.

In one embodiment, the second plate 211b may include a plurality of fourth edge areas 212b-1. The plurality of fourth edge areas 212b-1 may face the first plate 211a from at least a portion of the second surface 210b. A plurality of fourth edge areas 212b-1 may contact the first plate 211a. The plurality of fourth edge areas 212b-1 may extend in one direction (eg, +/-Y direction). The second plate 211b may include a plurality of fifth edge areas 212b-2. The plurality of fifth edge areas 212b-2 may face the first plate 211a from at least a portion of the second surface 210b. A plurality of fifth edge areas 212b-2 may contact the first plate 211a. The plurality of fifth edge regions 212b-2 may extend in a direction (e.g., +/-X direction) different from the extension direction (e.g., +/-Y direction) of the plurality of fourth edge regions 212b-1. You can. The second plate 211b may include a plurality of sixth edge areas 212b-3. A plurality of sixth edge areas 212b-3 may face the first plate 211a from at least a portion of the second surface 210b. A plurality of sixth edge regions 212b-3 may contact the first plate 211a. A plurality of sixth edge areas 212b-3 may be disposed between a plurality of fourth edge areas 212b-1 and a plurality of fifth edge areas 212b-2.

In one embodiment, the electronic device 201 may include a display 261 (eg, the display module 160 of FIG. 1). In one embodiment, the display 261 may be located on the first side 210a. In one embodiment, the display 261 includes at least a portion of the first plate 211a (e.g., a plurality of first edge regions 212a-1, a plurality of second edge regions 212a-2, and/or It may be visible through a plurality of third edge regions 212a-3. In one embodiment, the display 261 may have a shape substantially the same as the shape of the outer edge of the first plate 211a. In an embodiment, the edge of the display 261 may substantially coincide with the outer edge of the first plate 211a.

In one embodiment, the display 261 may include a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.

In one embodiment, the display 261 may include a screen display area 261a that is visually exposed and displays content through pixels. In one embodiment, the screen display area 261a may include a sensing area 261a-1. The sensing area 261a-1 may overlap at least a portion of the screen display area 261a. The sensing area 261a-1 may allow the transmission of an input signal related to the sensor module 276 (eg, the sensor module 176 of FIG. 1). The sensing area 261a-1 can display content similarly to the screen display area 261a that does not overlap the sensing area 261a-1. For example, the sensing area 261a-1 may display content while the sensor module 276 is not operating. At least a portion of the camera area 261a-2 may overlap the screen display area 261a. In one embodiment, the screen display area 261a may include a camera area 261a-2. Camera area 261a-2 may allow transmission of optical signals associated with the first camera module 280a (eg, camera module 180 of FIG. 1). At least a portion of the camera area 261a-2 that overlaps the screen display area 261a may display content similarly to the screen display area 261a that does not overlap the camera area 261a-2. For example, the camera area 261a-2 may display content while the first camera module 280a is not operating.

In one embodiment, the electronic device 201 may include an audio module 270 (eg, the audio module 170 of FIG. 1). In one embodiment, audio module 270 may be located on third side 210c. In one embodiment, the audio module 270 may acquire sound through at least one hole.

In one embodiment, the electronic device 201 may include a sensor module 276. In one embodiment, sensor module 276 may be located on first side 210a. The sensor module 276 may form a sensing area 261a-1 in at least a portion of the screen display area 261a. The sensor module 276 may receive an input signal passing through the sensing area 261a-1 and generate an electrical signal based on the received input signal. As an example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). As an example, the input signal may include a signal related to the user's biometric information (eg, fingerprint).

In one embodiment, the electronic device 201 may include a first camera module 280a (eg, the camera module 180 of FIG. 1). In one embodiment, the first camera module 280a may be located on the first side 210a. In one embodiment, at least a portion of the first camera module 280a may be located below the display 261. In one embodiment, the first camera module 280a may receive an optical signal passing through the camera area 261a-2.

In one embodiment, the electronic device 201 may include a second camera module 280b (eg, the camera module 180 of FIG. 1). The second camera module 280b may be located on the second side 210b. In one embodiment, the second camera module 280b may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).

In one embodiment, the electronic device 201 may include a flash 280c. Flash 280c may be located on second side 210b. In one embodiment, flash 280c may include a light emitting diode or xenon lamp.

In one embodiment, the electronic device 201 may include an audio output module 255 (eg, the audio output module 155 of FIG. 1). In one embodiment, the sound output module 255 may be located on the third side 210c. In one embodiment, the audio output module 255 may include one or more holes.

In one embodiment, the electronic device 201 may include an input module 250 (eg, the input module 150 of FIG. 1). In one embodiment, the input module 250 may be located on the third side 210c. In one embodiment, the input module 250 may include at least one key input device.

In one embodiment, the electronic device 201 may include a connection terminal 278 (eg, the connection terminal 178 in FIG. 1). In one embodiment, the connection terminal 278 may be located on the third side 210c. For example, when the electronic device 201 is viewed in one direction (e.g., +Y direction), the connection terminal 278 is located substantially in the center of the third side 210c, with the connection terminal 278 as the reference. The audio output module 255 may be located on one side (e.g., right side).

In one embodiment, the electronic device 201 may include a support 240, a first circuit board 251, a second circuit board 252, and a battery 289 (e.g., battery 189 in FIG. 1). You can. At least a portion of the support 240 may form the housing 210 together with the first plate 211a and the second plate 211b.

In one embodiment, the support 240 may include a first frame structure 241, a second frame structure 243, and a plate structure 242. The first frame structure 241 may surround the edge of the plate structure 242. The first frame structure 241 may connect the edge of the first plate 211a and the edge of the second plate 211b. The first frame structure 241 may surround the space between the first plate 211a and the second plate 211b. At least a portion of the first frame structure 241 may form the third surface 210c of the electronic device 201. The second frame structure 243 may be positioned between the first frame structure 241 and the second plate 211b. The first frame structure 241 and the second frame structure 243 may at least partially form the frame 211c. The plate structure 242 may include a first part 242a that accommodates the first circuit board 251 and a second part 242b that accommodates the second circuit board 252. The display 261 may be located on one side (eg, the lower surface or the +Z-axis direction) of the plate structure 242. The first circuit board 251 and the second circuit board 252 may be located on the other surface (eg, top surface or -Z axis direction) of the plate structure 242. In one embodiment, plate structure 242 may include opening 245. Opening 245 may be located between first portion 242a and second portion 242b. Opening 245 may pass through both sides of plate structure 242. Opening 245 can accommodate battery 289.

Meanwhile, one or more embodiment(s) disclosed in this document may include electronic devices of various shapes/forms (e.g., foldable electronic devices, slideable electronic devices, digital cameras, digital video devices) in addition to the electronic devices shown in FIGS. 2A to 2C. It can also be applied to cameras, tablets, electronic devices in the form of notes, and other electronic devices).

Figure 3 is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device according to an embodiment.

Referring to FIG. 3 , the wireless communication module 392 may include an MST communication module 310 or an NFC communication module 330, and the power management module 388 may include a wireless charging module 350. In this case, the antenna module 397 is connected to the MST antenna 397-1 connected to the MST communication module 310, the NFC antenna 397-3 connected to the NFC communication module 330, and the wireless charging module 350. It may include a plurality of antennas including a wireless charging antenna 397-5. For convenience of explanation, components that overlap with those of FIG. 3 are omitted or briefly described.

The MST communication module 310 receives a signal including control information or payment information such as card information from the processor 320, and generates a magnetic signal corresponding to the received signal through the MST antenna 397-1. Afterwards, the generated magnetic signal can be transmitted to an external electronic device 302 (eg, POS device). To generate the magnetic signal, according to one embodiment, the MST communication module 310 includes a switching module (not shown) including one or more switches connected to the MST antenna 397-1, and this switching module By controlling, the direction of voltage or current supplied to the MST antenna 397-1 can be changed according to the received signal. Changing the direction of the voltage or current allows the direction of the magnetic signal (eg, magnetic field) transmitted through the MST antenna 397-1 to change accordingly. When a magnetic signal whose direction is changed is detected by the external electronic device 302, the magnetic card corresponding to the received signal (e.g. card information) is read by the card reader of the electronic device 302 ( swept) can cause similar effects (e.g. waveforms) to generated magnetic fields. According to one embodiment, the payment-related information and control signals received in the form of the magnetic signal in the electronic device 302 are, for example, sent to an external server 308 (e.g., a payment server) through the network 399. ) can be transmitted.

The NFC communication module 330 acquires a signal including control information or payment information such as card information from the processor 320, and transmits the acquired signal to the external electronic device 302 through the NFC antenna 397-3. It can be sent to . According to one embodiment, the NFC communication module 330 may receive such a signal transmitted from the external electronic device 302 through the NFC antenna 397-3.

The wireless charging module 350 wirelessly transmits power to an external electronic device 302 (e.g., a mobile phone or a wearable device) through the wireless charging antenna 397-5, or to an external electronic device 302 (e.g., : Wireless charging device) can receive power wirelessly. The wireless charging module 350 may support one or more of various wireless charging methods, including, for example, a magnetic resonance method or a magnetic induction method.

According to one embodiment, some antennas among the MST antenna 397-1, the NFC antenna 397-3, or the wireless charging antenna 397-5 may share at least a portion of the radiating portion with each other. For example, the radiating part of the MST antenna 397-1 can be used as the radiating part of the NFC antenna 397-3 or the wireless charging antenna 397-5, and vice versa. In this case, the antenna module 397 is connected to the wireless communication module 392 (e.g., MST communication module 310 or NFC communication module 330) or the power management module 388 (e.g., wireless charging module 350). It may include a switching circuit (not shown) set to selectively connect (e.g., close) or disconnect (e.g., open) at least some of the antennas (397-1, 397-3, or 397-3) according to control. there is. For example, when the electronic device 301 uses a wireless charging function, the NFC communication module 330 or the wireless charging module 350 controls the switching circuit to connect the NFC antenna 397-3 and the wireless charging antenna ( At least a portion of the radiating part shared by 397-5) may be temporarily separated from the NFC antenna 397-3 and connected to the wireless charging antenna 397-5.

According to one embodiment, at least one function of the MST communication module 310, NFC communication module 330, or wireless charging module 350 may be controlled by an external processor (e.g., processor 320). . According to one embodiment, designated functions (e.g., payment functions) of the MST communication module 310 or the NFC communication module 330 may be performed in a trusted execution environment (TEE). A trusted execution environment (TEE) according to an embodiment may, for example, designate at least a portion of the memory to be used to perform functions that require a relatively high level of security (e.g., financial transactions, or privacy-related functions). An execution environment in which areas are allocated can be formed. In this case, access to the designated area may be permitted on a limited basis, for example, depending on the subject accessing it or the application running in the trusted execution environment.

4 is a plan view of a plate and an antenna module of an electronic device according to an embodiment. FIG. 5 is a cross-sectional view taken along line 5-5 of the electronic device of FIG. 4 according to an embodiment. FIG. 6 is a cross-sectional view taken along line 6-6 of the electronic device of FIG. 4 according to an embodiment.

4 to 6, an electronic device 401 (e.g., the electronic device 101 of FIG. 1, the electronic device 201 of FIGS. 2A to 2C, and/or the electronic device 301 of FIG. 3). may include a plate 440 (eg, the second frame structure 243 in FIGS. 2A to 2C). Plate 440 may be configured to support one or more mechanical/mechanical components and/or one or more electronic components (e.g., antenna module 497).

In one embodiment, the plate 440 has a first side 440A (e.g., the front side or the side with the +Z normal direction), and a second side 440B opposite the first side 440A (e.g., the side with the +Z normal direction). may include a back surface or a face with a -Z normal direction).

In one embodiment, plate 440 may include placement area 441. One or more mechanical/mechanical components and/or one or more electronic components (e.g., antenna module 497) may be disposed in deployment area 441. In one embodiment, placement area 441 may include a substantially flat surface and/or a curved surface.

In one embodiment, plate 440 may include at least one fastening area 442. Fastening region 442 may be attached to another component of electronic device 401 (e.g., first frame structure 241, second frame structure 243, and/or first circuit board 251 of FIGS. 2A-2C). It may be configured to be fastened to. For example, fastening area 442 may include at least one or a combination of screws, bolts, and nuts, or any suitable fastening elements. The fastening area 442 may be located at the edge of the placement area 441 . The fastening area 442 may include a recessed area in the first surface 440A of the plate 440.

In one embodiment, plate 440 may include at least one protruding area 443. The protruding area 443 may protrude from at least a portion of the placement area 441 in one direction (eg, the normal direction or +/-Z direction of the placement area 441). For example, the protruding area 443 may include a curve. The protruding area 443 may protrude from the first surface 440A of the plate 440.

In one embodiment, plate 440 may include at least one hole 444. Holes 444 may include substantially square, circular, oval, and/or any of a variety of shapes. Hole 444 may be placed in placement area 441 . For example, the hole 444 may be configured to expose at least some components (e.g., connectors) of a printed circuit board (e.g., first circuit board 251 in FIG. 2C). Hole 444 may include a hole penetrating plate 440 . Holes 444 may include holes recessed in first side 440A and/or second side 440B of plate 440 .

In one embodiment, plate 440 may include a metallic material (eg, stainless steel). In one embodiment, plate 440 may include a region containing a metallic material and a region including a non-metallic material.

In one embodiment, different sections may be defined in plate 440. For example, the plate 440 may include a plurality (eg, three) of first sections 445 and second sections 446. The plurality of first sections 445 may not overlap with the second section 446. Some (eg, two) of the plurality of first sections 445 may be separated from any one first section 445 . For example, one first section 445 may be separated from the other first section 445 in the first direction (eg, +/-X direction) of the plate 440. One first section 445 is separated from the other first section 445 by a second direction (e.g., +/-Y direction) that intersects (e.g., orthogonal to) the first direction of the plate 440. It can be. The second section 446 may at least partially surround the plurality of first sections 445 .

In one embodiment, the electronic device 401 may include an antenna module 497 (e.g., the antenna module 197 in FIG. 1 and/or the antenna module 397 in FIG. 3). The antenna module 497 may be configured to transmit and/or receive signals in a specific band (eg, ultra-wide band (UWB)).

In one embodiment, the antenna module 497 may be configured to track the direction of another electronic device (e.g., the electronic device 102 of FIG. 1) using a signal received from an antenna included in the electronic device. For example, the antenna module 497 uses the phase difference of signals received by at least two of the plurality of radiation patches (P1, P2, and P3) to determine the angle of arrival (angle of arrival). AoA) can be measured.

In one embodiment, the antenna module 497 may be configured to measure the distance between the electronic device 401 and another electronic device (eg, the electronic device 102 of FIG. 1). For example, the antenna module 497 may be configured to measure the time of arrival (ToF) of a signal received from an antenna included in another electronic device.

In one embodiment, the antenna module 497 is or includes a printed circuit board including a plurality of layers (e.g., a first layer 491, a second layer 492, and a third layer 493). can do. For example, the antenna module 497 may be a flexible printed circuit board or may include a flexible printed circuit board. A plurality of layers may be disposed on or over the first surface 440A of the plate 440. Multiple layers may be stacked.

In one embodiment, the first layer 491 may include a plurality of radiation patches (P1, P2, and P3). A plurality of radiating patches (P1, P2, P3) may be configured to transmit and/or receive signals.

In one embodiment, the plurality of radiation patches P1, P2, and P3 may have a substantially square shape.

In one embodiment, the plurality of radiating patches (P1, P2, P3) each include a plurality (e.g., two) of first slots (S1) extending in a first direction (e.g., +/-X direction). can do. The plurality of first slots S1 may extend from each edge of the plurality of radiating patches P1, P2, and P3 toward the center.

In one embodiment, the plurality of radiating patches (P1, P2, P3) each include a plurality (e.g., two) of second slots (S2) extending in a second direction (e.g., +/-Y direction). can do. The plurality of second slots S2 may extend from each edge of the plurality of radiation patches P1, P2, and P3 toward the center.

In one embodiment, the length of each of the plurality of first slots (S1) and the length of each of the plurality of second slots (S2) are determined to correspond to the desired resonance frequencies of the plurality of radiating patches (P1, P2, and P3). You can. For example, the length of each of the plurality of first slots (S1) may be greater than the length of each of the plurality of second slots (S2).

In one embodiment, the second radiation patch (P2) of the plurality of radiation patches (P1, P2, P3) may be arranged to be spaced apart from the first radiation patch (P1) in a first direction (e.g., +X direction). there is. Among the plurality of radiation patches (P1, P2, P3), the third radiation patch (P3) is oriented in a second direction (e.g., +Y direction) that intersects (e.g., orthogonal to) the first direction from the first radiation patch (P1). can be separated from

In one embodiment, the plurality of radiation patches (P1, P2, and P3) may include a metal material. For example, the plurality of radiation patches (P1, P2, and P3) may include copper.

In one embodiment, a plurality of radiation patches P1, P2, and P3 may each be disposed in a corresponding first section 445.

In one embodiment, areas of the plurality of radiation patches P1, P2, and P3 may at least partially overlap areas of the plurality of first sections 445. In one embodiment, areas of the plurality of radiation patches P1, P2, and P3 may be included in areas of the plurality of first sections 445.

In one embodiment, the size (e.g., area) of each of the plurality of radiating patches (P1, P2, and P3) may be substantially the same as the size (e.g., area) of each area of the plurality of first sections 445. there is. In one embodiment, each size (eg, area) of the plurality of radiation patches (P1, P2, P3) may be smaller than the size (eg, area) of each area of the plurality of first sections 445.

In one embodiment, the first layer 491 may include a non-radiating area (VO). A non-radiating region VO may be disposed in the second section 446 . The plurality of radiating patches (P1, P2, P3) may not be disposed in the non-radiating area (VO). In one embodiment, the non-radiating area VO may include a void area. In one embodiment, the non-radiating region VO may include a dielectric.

In one embodiment, the second layer 492 may include a dielectric (DI). The dielectric DI may be disposed in a plurality of first sections 445 and second sections 446 .

In one embodiment, second layer 492 is disposed closer to first side 440A of plate 440 than first layer 491 is disposed to first side 440A of plate 440. It can be.

In one embodiment, the third layer 493 may include a plurality of first joints B1. The plurality of first joints B1 may be configured to connect the dielectric DI of the second layer 492 and the first surface 440A of the plate 440.

In one embodiment, the plurality of first joints B1 may each include a tape.

In one embodiment, the plurality of first joints B1 may each be disposed in a corresponding first section 445. In one embodiment, the plurality of first joints B1 may not be disposed in the second section 446. In one embodiment, a plurality of first junctions B1 may be disposed between the dielectric DI of the second layer 492 and the first surface 440A of the plate 440. The plurality of first junctions B1 may contact the dielectric DI of the second layer 492. The plurality of first joints B1 may contact the first surface 440A of the plate 440.

In one embodiment, the plurality of first joints B1 may include a non-conductive material. For example, the non-conductive material may include at least one or a combination of paper, glass, rubber, ceramic, plastic, or any suitable non-metallic material.

In one embodiment, the third layer 493 may not include a ground. According to the structure of the antenna module 497 in which the plurality of first sections 445 do not include a ground, a plurality of radiating patches (P1, P2, P3) of the first layer 491, the second layer 492 ) of the dielectric DI and the first junction B1 of the third layer 493 may form an increased effective volume V _eff of the antenna module 497 .

In one embodiment, the third layer 493 may include a ground (G). The ground (G) may be electrically connected to the plate 440 directly or indirectly through another component (eg, the second junction (B2)). By electrically connecting the ground (G) and the plate 440, the ground area of the antenna module 497 can be expanded larger than the ground (G) area of the third layer 493. Antenna module 497 may have increased gain in specific bands (e.g., approximately 6.5 GHz and/or approximately 8 GHz). Antenna module 497 may have increased bandwidth.

In one embodiment, the ground (G) may include a plate shape.

In one embodiment, the ground (G) may be placed in the second section 446. In one embodiment, the ground G may not be disposed in the plurality of first sections 445.

In one embodiment, the ground (G) is located on the first side 440A of the plate 440 rather than the dielectric DI of the second layer 492 is disposed on the first side 440A of the plate 440. Can be placed closer together.

In one embodiment, the ground (G) may include a conductive material. For example, the ground G may include a metal material (eg, copper).

In one embodiment, the third layer 493 may include a second joint B2. The second joint B2 may be configured to connect the ground G and the first surface 440A of the plate 440.

In one embodiment, the second joint B2 may include a tape.

In one embodiment, the second joint B2 may be disposed in the second section 446. In one embodiment, the second joint B2 may not be disposed in the plurality of first sections 445. In one embodiment, the second joint B2 may be physically separated from the plurality of first joints B1. In one embodiment, the second joint B2 may be disposed between the ground G and the first surface 440A of the plate 440. The second junction B2 may be in contact with the ground G. The second joint B2 may contact the first surface 440A of the plate 440.

In one embodiment, the second junction B2 may include a conductive material. For example, the conductive material may include at least one or a combination of gold, silver, copper, or any suitable metallic material.

In one embodiment, the thickness of each of the plurality of first joints B1 may be greater than the thickness of the second joint B2.

In one embodiment, third layer 493 is disposed closer to first side 440A of plate 440 than second layer 492 is disposed to first side 440A of plate 440. It can be.

In one embodiment, the antenna module 497 may include a plurality of transmission lines (T). A plurality of transmission lines (T) are configured to electrically connect a plurality of radiating patches (P1, P2, P3) and a connector (not shown) of another electronic component (e.g., the first circuit board 251 in FIG. 2C). It can be. A plurality of transmission lines (T) may be disposed in the second section (446).

In one embodiment, the plurality of radiating patches (P1, P2, P3), dielectric (DI), and ground (G) may be formed from the flexible printed circuit board of the antenna module 497 by any suitable method. For example, at least a portion of the metallic material (eg, copper foil) may be removed from the second section 446 of the first layer 491 by etching. At least a portion of the metallic material (eg, copper foil) may be removed from the first section 445 of the third layer 493 by etching.

7 is a perspective view of a partial structure of a plate and an antenna module of an electronic device according to an embodiment. 8 is a front perspective view of a partial structure of a plate of an electronic device according to an embodiment. 9 is a rear perspective view of a partial structure of a plate of an electronic device according to an embodiment.

7 to 9, the electronic device 401-1 (e.g., the electronic device 401 of FIGS. 4 to 6) includes a plate 440-1 (e.g., the plate 440 of FIGS. 4 to 6). ))) may be included. Plate 440-1 may include a first side 440A and a second side 440B. Plate 440-1 may include a placement area 441. The antenna module 497 may include a radiation patch (P) (eg, a first radiation patch (P1), a second radiation patch (P2), and/or a third radiation patch (P3).

In one embodiment, plate 440-1 may include a recess 444-1 (e.g., hole 444 in FIG. 4). The recess 444-1 is configured to receive at least a portion of the antenna module 497 (e.g., at least a portion of the second layer 492 and/or at least a portion of the third layer 493 in FIGS. 4 to 6). It can be configured. In one embodiment, the recess 444-1 may be disposed in the placement area 441.

In one embodiment, recess 444-1 may include a substantially polygonal cross-section. For example, the recess 444-1 may include a square cross-section.

In one embodiment, the recess 444-1 may be formed in the first surface 440A of the plate 440-1. The thickness of at least some layers (eg, the second layer 492 and/or the third layer 493) of the antenna module 497 may be increased. The distance between the rear of the antenna module 497 (eg, the rear of the third layer 493 in FIGS. 4 to 6) and the radiation patch P may be increased. The effective volume (eg, effective volume (V _eff ) of FIGS. 4 to 6 ) of the antenna module 497 may be increased. Antenna module 497 may have increased gain in specific bands (e.g., approximately 6.5 GHz and/or approximately 8 GHz).

In one embodiment, recess 444-1 may at least partially protrude from second surface 440B of plate 440. The thickness of at least some layers of the antenna module 497 (e.g., the second layer 492 and/or the third layer 493) may be increased while keeping the thickness of the plate 440-1 substantially constant. there is. The effective volume (eg, effective volume (V _eff ) of FIGS. 4 to 6 ) of the antenna module 497 may be increased.

In one embodiment, the recess 444-1 may be disposed in at least one first section 445 of the plurality of first sections 445. In one embodiment, the recess 441-1 may be formed in at least a portion of the first section 445. In one embodiment, the recess 441-1 may not be located in the second section 446.

10 is a plan view of a plate of an electronic device according to an embodiment. 11 is a plan view of a plate and an antenna module of an electronic device according to an embodiment. FIG. 12 is a cross-sectional view taken along line 12-12 of the electronic device of FIG. 11 according to an embodiment. FIG. 13 is a cross-sectional view taken along line 13-13 of the electronic device of FIG. 11 according to an embodiment.

10 to 13, the electronic device 401-2 (e.g., the electronic device 401 of FIGS. 4 to 6 and/or the electronic device 401-1 of FIGS. 7 to 9) includes a plate ( 440-2) (e.g., the plate 440 of FIGS. 4 to 6 and/or the plate 440-1 of FIGS. 7 to 9).

In one embodiment, the plate 440-2 may include a placement area 441 where the antenna module 497 is placed.

In one embodiment, the plate 440-2 may include a plurality of protruding areas 443. The protruding area 443 may include a curve 443 - 2 disposed in at least a portion of the placement area 441 . In one embodiment, the curve 443-2 may protrude from the first surface 440A of the plate 440-2.

In one embodiment, plate 440-2 may include a plurality of holes 444. The hole 444 may include a hole 444-2 disposed in at least a portion of the placement area 441. In one embodiment, hole 444-2 may extend between first side 440A and second side 440B of plate 440-2. Hole 444-2 may penetrate plate 440-2.

In one embodiment, the plate 440-2 may include a plurality of first sections 445 and second sections 446 and 446-2. In one embodiment, plate 440-2 may include a curve 443-2 disposed in some of the second sections 446-2. In one embodiment, plate 440-2 may include a hole 444-2 disposed in some of the second sections 446-2.

In one embodiment, the electronic device 401-2 may include an antenna module 497. The antenna module 497 may include a plurality of layers. For example, the antenna module 497 may include a first layer 491, a second layer 492, and a third layer 493.

In one embodiment, the first layer 491 may include a plurality of radiation patches (eg, a first radiation patch (P1), a second radiation patch (P2), and a third radiation patch (P3). The first radiation patch (P1) and the second radiation patch (P2) may each be disposed in the corresponding first section (445). The third radiation patch P3 may be disposed in the second section 446-2 where the bend 443-2 and/or the hole 444-2 are disposed.

In one embodiment, the second layer 492 may include a dielectric (DI).

In one embodiment, the third layer 493 may include ground (G). In one embodiment, the third layer 493 may include a second joint B2.

In one embodiment, in the second section 446-2 where the bend 443-2 is disposed, the ground (G) and the second junction (B2) are connected to the dielectric (DI) and the plate ( It may be disposed between the first side 440A of 440-2). The ground (G) and the second junction (B2) may be disposed between the dielectric (DI) and the bend (443-2) of the second layer (492). The ground (G) and the second joint (B2) may extend along the curved surface of the bend (443-2). The second joint B2 may be configured to join the ground G and the bend 443-2.

In one embodiment, in the second section 446-2 where the hole 444-2 is disposed, the ground (G) and the second junction (B2) are connected to the dielectric (DI) and plate ( It may be disposed between the first side 440A of 440-2). The second joint B2 may be disposed on the hole 444-2.

In an embodiment not shown, a bend 443-2 and/or a hole 444-2 may be disposed in a section where at least one radiation patch among the plurality of radiation patches P1, P2, and P3 is disposed. . Antenna module 497 may include ground in this section. For example, the first radiating patch (P1) or the second radiating patch (P2) may have a section (e.g., a second section 446-2) in which the curves 443-2 and/or holes 444-2 are disposed. ), and a ground (G) may be placed in the section. The ground (G) may not be disposed in a section where the bend (443-2) and/or the hole (444-2) are not disposed.

Figure 14 is a perspective view of a plate of an electronic device according to an embodiment. Figure 15 is a perspective view of a plate and an antenna module of an electronic device according to an embodiment.

Referring to FIGS. 14 and 15 , an electronic device 401-3 (e.g., the electronic device 401 of FIGS. 4 to 6, the electronic device 401-1 of FIGS. 7 to 9, and/or the electronic device 401-3 of FIG. 10 The electronic device 401-2 of FIGS. 13 to 13 includes a plate 440-3 (e.g., the plate 440 of FIGS. 4 to 6, the plate 440-1 of FIGS. 7 to 9, and/or 10 to 13) and an antenna module 497.

In one embodiment, plate 440-3 may include a non-metallic material (eg, plastic). For example, plate 440-3 may be made by injection molding.

In one embodiment, the electronic device 401-3 may include a metal layer 430-3 disposed between the plate 440-3 and the antenna module 497. The metal layer 430-3 may be electrically connected to the ground of the antenna module 497 (e.g., the ground (G) in FIGS. 4 to 6 and/or the ground (G) in FIGS. 10 to 13). For example, the metal layer 430-3 may act as an extended ground of the antenna module 497, like the plate 440 of FIGS. 4 to 6.

In one embodiment, the metal layer 430-3 may be disposed in at least a partial area of the plate 440-3.

In one embodiment, metal layer 430-3 may be formed by applying one or more metal materials. For example, the metal layer 430-3 may be formed by laser direct structure. The one or more metallic materials may include, for example, gold, silver, nickel, palladium, tin, or any suitable metal or combination thereof.

Figure 16 is a perspective view of a printed circuit board and an antenna module of an electronic device according to an embodiment.

Referring to FIG. 16 , an electronic device 401-4 (e.g., the electronic device 401 of FIGS. 4 to 6, the electronic device 401-1 of FIGS. 7 to 9, and/or the electronic device 401-4 of FIGS. 10 to 13 The electronic device 401-2) may include a printed circuit board 450-4 (eg, the first circuit board 251 and/or the second circuit board 252 in FIG. 2C). Printed circuit board 450-4 may include a substrate portion 440-4 (e.g., plate 440 of FIGS. 4-6, plate 440-1 of FIGS. 7-9, and/or FIGS. 10-10). It may include a plate 440-2 of 13). The electronic device 401-4 may include an antenna module 497 disposed over the printed circuit board 450-4.

In one embodiment, the electronic device 401-4 may include a shielding layer 430-4. The shielding layer 430-4 is capable of receiving signals (e.g., electromagnetic waves) from the printed circuit board 450-4 and/or the antenna module 497 and/or the printed circuit board 450-4 and/or the antenna module 497. ) can be configured to shield the signal to.

In one embodiment, the shielding layer 430-4 may be disposed between the printed circuit board 450-4 and the antenna module 497. In one embodiment, the shielding layer 430-4 may be disposed in at least a partial area of the substrate portion 440-4. In one embodiment, the antenna module 497 may be disposed in at least a partial area of the shielding layer 430-4.

In one embodiment, the shielding layer 430-4 may include a metallic material. For example, the metallic material may include steel, aluminum, or any metallic material suitable for shielding or a combination thereof.

In one embodiment, the shielding layer 430-4 may be disposed on the printed circuit board 450-4 by a surface mount process.

17 is a perspective view of a plate of an electronic device according to an embodiment. 18 is a plan view of a plate and an antenna module of an electronic device according to an embodiment.

Referring to FIGS. 17 and 18 , an electronic device 401-5 (e.g., the electronic device 401 of FIGS. 4 to 6, the electronic device 401-1 of FIGS. 7 to 9, and the electronic device 401-5 of FIGS. 10 to 13 The electronic device 401-2 of and/or the electronic device 401-3 of FIGS. 14 and 15) includes a first plate 440-51 (e.g., the plate 440 of FIGS. 4 to 6, FIG. Plate 440-1 of FIGS. 7 to 9, plate 440-2 of FIGS. 10 to 13, and/or plate 440-3 of FIGS. 14 and 15), and second plate 440-52 ) (e.g., the plate 440 of FIGS. 4 to 6, the plate 440-1 of FIGS. 7 to 9, and the plate 440-2 of FIGS. 10 to 13). The electronic device 401-5 may include an antenna module 497.

In one embodiment, the electronic device 401-5 may include a metal layer 430-5 (eg, metal layer 430-3). In one embodiment, the metal layer 430-5 may be disposed between the first plate 440-51 and the antenna module 497. In one embodiment, the metal layer 430-5 may be disposed in the first area A1, which is at least a partial area of the first plate 440-51.

In one embodiment, the antenna module 497 may include an area disposed in the first area A1, which is at least a partial area of the first plate 440-51. In one embodiment, the antenna module 497 may include an area disposed in the second area A2, which is at least a partial area of the second plate 440-52. In one embodiment, the second area A2 may not overlap the first area A1.

In one embodiment, the first plate 440-51 may include a non-metallic material (eg, plastic). For example, the first plate 440-51 may be made by injection molding.

In one embodiment, the second plate 440-52 may include a metallic material (eg, stainless steel). In one embodiment, the material of the second plate 440-52 may be different from the material of the metal layer 430-5.

In one embodiment, the thickness of the metal layer 430-5 may be substantially the same as the thickness of the second plate 440-52. In one embodiment, if the area of the conductive material of the metal layer 430-5 and the area of the conductive material of the second plate 440-52 that contact the ground of the antenna module 497 are substantially constant, the metal layer 430 The thickness of -5) and the thickness of the second plate 440-52 may vary depending on the antenna module 497.

In one embodiment, one or more first sections 445A, 445B of the plurality of first sections 445A, 445B, and 445C (e.g., first sections 445 in FIGS. 4 to 6) have a first region ( A1), and the remaining first section 445C may be placed in the second area A2.

In one embodiment, at least a portion of the second section 446 may be disposed in the first area A1. In one embodiment, at least a portion of the second section 446 may be disposed in the second area A2.

In one embodiment, the first plate 440-51 and the second plate 440-52 may be integrally and seamlessly connected. In one embodiment, the first plate 440-51 and the second plate 440-52 may be separately connected to each other.

FIG. 19 is a diagram illustrating a plate and an antenna module of an electronic device according to an embodiment.

Referring to FIG. 19, an electronic device 401-6 (e.g., the electronic device 401 of FIGS. 4 to 6, the electronic device 401-1 of FIGS. 7 to 9, and the electronic device of FIGS. 10 to 13) (401-2), the electronic device 401-3 of FIGS. 14 and 15, the electronic device 401-4 of FIG. 16, and/or the electronic device 401-5 of FIGS. 17 and 18) are plate (440-6) (e.g., plate 440 in FIGS. 4 to 6, plate 440-1 in FIGS. 7 to 9, plate 440-2 in FIGS. 10 to 13, FIGS. 14 and 15 plate 440-3, the substrate portion 440-4 of FIG. 16, and/or the first plate 440-51 of FIGS. 17 and 18).

In one embodiment, plate 440-6 may include a shielding layer (eg, shielding layer 430-4 in FIG. 16).

In one embodiment, the electronic device 401-6 may include an antenna module 497-6 (eg, the antenna module 497 of FIGS. 4 to 18). The antenna module 497-6 may include a plurality of layers. For example, the antenna module 497-6 may include a first layer 491, a second layer 492, and a third layer 493. The first layer 491 may include a plurality of radiation patches P (eg, a first radiation patch P1, a second radiation patch P2, and a third radiation patch P3). The second layer 492 may include a dielectric (DI). The third layer 493 may include ground (G). The third layer 493 may include a joint B (eg, a first joint B1 and/or a second joint B2). The antenna module 497-6 may include a plurality of transmission lines (T) each electrically connected to a plurality of radiation patches (P).

In one embodiment, the ground (G) may be physically separated from the plate (440-6). The ground (G) may not be in contact with the plate (440-6).

In one embodiment, the ground (G) may be configured to couple with the plate (440-6) (C). At least a portion of the ground (G) is coupled to the plate (440-6), so that the plate (440-6) can act as an extended ground of the antenna module (497-6).

One exemplary aspect of the present disclosure may provide an antenna and an electronic device including the same with increased effective volume and/or increased radiation performance.

Electronic devices 101, 201, 301, and 401 according to one embodiment may include a housing 210. The electronic devices 101, 201, 301, and 401 may include a plate 440 disposed in the housing 210. Electronic devices 101, 201, 301, and 401 may include an antenna 497. Antenna 497 may be disposed on the first side 440A of plate 440. Plate 440 may include a plurality of first sections 445 and second sections 446 . The antenna 497 may include a plurality of layers 491, 492, and 493. A plurality of layers 491, 492, and 493 may be stacked on the plate 440. A plurality of layers 491, 492, and 493 may include a first layer 491. The first layer 491 may include a plurality of radiation patches (P1, P2, and P3). A plurality of radiation patches (P1, P2, P3) may be respectively disposed in a plurality of first sections 445. The plurality of layers 491, 492, and 493 may include a second layer 492. The second layer 492 may include a dielectric (DI). The dielectric DI may be disposed in a plurality of first sections 445 and second sections 446 . The plurality of layers 491, 492, and 493 may include a third layer 493. The third layer 493 may include ground (G). Ground (G) may be placed in the second section (446). The third layer 493 may include a plurality of first joints B1. A plurality of first joints B1 may be respectively disposed in a plurality of first sections 445 . The plurality of first joints B1 may be configured to connect the dielectric DI and the plate 440. The third layer 493 may include a second joint B2. The second joint B2 may be disposed in the second section 446. The second joint B2 may be configured to connect the ground G and the plate 440. According to one embodiment, the effective volume of the antenna may be increased. According to one embodiment, the gain in a specific band of the antenna may be increased.

In one embodiment, the plurality of first joints B1 may include a non-conductive material.

In one embodiment, the plurality of first junctions B1 may contact the dielectric DI.

In one embodiment, the second junction B2 may include a conductive material.

In one embodiment, the second junction B2 may be in contact with the ground G.

In one embodiment, the size of each of the plurality of first sections 445 may be substantially equal to or larger than the size of each of the plurality of radiation patches (P1, P2, and P3).

In one embodiment, plate 440-1 may include a recess 444-1. The recess 444-1 may be disposed in at least one first section 445 of the plurality of first sections 445. The recess 444-1 may be configured to accommodate at least a portion of at least one layer among the plurality of layers 491, 492, and 493.

In one embodiment, the recess 444-1 may protrude from the second side 440B of the plate 440-1, which is opposite to the first side 440A of the plate 440-1.

In one embodiment, the plate 440 may include a metal material. Ground (G) may be electrically connected to the plate 440.

In one embodiment, plate 440-2 may include a curve 443-2. Bend 443-2 may be disposed in second section 446-2. Ground (G) may be placed on the bend (443-2).

In one embodiment, plate 440-2 may include a hole 444-2. Hole 444-2 may be disposed in second section 446-2. Ground (G) may be placed on the hole (444-2).

In one embodiment, the plate 440-3 may include a non-metallic material. The electronic device 401-3 may include a metal layer 430-3. The metal layer 430-3 may be disposed between the plate 440-3 and the antenna 497. The ground may be electrically connected to the metal layer 430-3.

In one embodiment, the electronic device 401-4 may include a printed circuit board 450-4. The electronic device 401-4 may include a shielding layer 430-4. Shielding layer 430-4 may be disposed between substrate portion 440-4 and antenna 497.

In one embodiment, the plate 440 may be a first plate 440-51 made of a non-metallic material. The electronic device 401-5 may include a metal layer 430-5 disposed between the first plate 440-51 and the antenna 497. The electronic device 401-5 may include a second plate 440-52 made of metal. At least one first section (445A, 445B) of the plurality of first sections (445A, 445B, 445C) may be at least partially disposed on the first plate (440-51). Among the plurality of first sections 445A, 445B, and 445C, at least one remaining first section 445C may be at least partially disposed on the second plate 440-52.

In one embodiment, the ground (G) may be placed separately from the plate (440-6). Ground (G) may be configured to couple with the plate (440-6).

The effects of the antenna and the electronic device including the same according to the embodiments are not limited to those mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description in the specification.

The embodiments in this document are intended to be illustrative and not restrictive. Various changes may be made to the details of the disclosure, including the appended claims and their equivalents. Any of the embodiment(s) described herein may be used in combination with any other embodiment(s) described herein as long as the combination between the embodiments does not result in an obvious technical conflict.

Claims (20)

housing (210),
A plate 440 disposed in the housing 210, and
Antenna 497 disposed on the first side 440A of the plate 440
Including,
The plate 440 includes a plurality of first sections 445 and second sections 446,
The antenna 497 includes a plurality of layers 491, 492, and 493 stacked on the plate 440,
The plurality of layers (491, 492, 493) are,
A first layer 491 including a plurality of radiation patches (P1, P2, P3) disposed in each of the plurality of first sections 445,
A second layer 492 including a dielectric (DI) disposed in the plurality of first sections 445 and the second section 446,
A ground (G) disposed in the second section 446, a plurality of first joints disposed in each of the plurality of first sections 445 and configured to bond the dielectric DI and the plate 440 ( B1), and a third layer 493 comprising a second joint B2 disposed on the second section 446 and configured to join the ground G and the plate 440.
Including,
The electronic device (101, 201, 301, 401) wherein each of the plurality of first joints (B1) has a thickness greater than the thickness of the second joint (B2). According to claim 1,
An electronic device wherein the plurality of first junctions (B1) include a non-conductive material. The method of claim 1 or 2,
The plurality of first junctions (B1) are in contact with the dielectric (DI). The method according to any one of claims 1 to 3,
The second junction B2 is an electronic device comprising a conductive material. The method according to any one of claims 1 to 4,
The second junction B2 is in contact with the ground G. The method according to any one of claims 1 to 5,
The electronic device wherein each size of the plurality of first sections 445 is substantially equal to or larger than each size of the plurality of radiating patches P1, P2, and P3. The method according to any one of claims 1 to 6,
The plate 440-1 is disposed on at least one first section 445 of the plurality of first sections 445 and is located on at least one layer of the plurality of layers 491, 492, and 493. The electronic device further includes a recess 444-1 configured to receive at least a portion of the electronic device. According to claim 7,
The recess (444-1) protrudes from the second side (440B) of the plate (440-1), which is opposite to the first side (440A) of the plate (440-1). The method according to any one of claims 1 to 8,
The plate 440 includes a metal material,
The ground (G) is an electronic device electrically connected to the plate (440). The method according to any one of claims 1 to 9,
The plate 440-2 includes a curve 443-2 disposed in the second section 446-2,
The ground (G) is an electronic device disposed on the bend (443-2). The method according to any one of claims 1 to 10,
The plate 440-2 includes a hole 444-2 disposed in the second section 446-2,
The ground (G) is an electronic device disposed on the hole (444-2). The method according to any one of claims 1 to 11,
The plate 440-3 includes a non-metallic material,
The electronic device 401-3 further includes a metal layer 430-3 disposed between the plate 440-3 and the antenna 497,
The ground is electrically connected to the metal layer 430-3. The method according to any one of claims 1 to 12,
printed circuit board (450-4), and
A shielding layer (430-4) disposed between the printed circuit board (450-4) and the antenna (497).
An electronic device further comprising: The method according to any one of claims 1 to 13,
The plate 440 is a first plate 440-51 made of non-metallic material,
The electronic device 401-5 includes a metal layer 430-5 disposed between the first plate 440-51 and the antenna 497, and a second plate 440-52 made of metal. Contains more,
At least one first section (445A, 445B) of the plurality of first sections (445A, 445B, 445C) is at least partially disposed on the first plate (440-51), and the plurality of first sections (445A, 445B, 445C) are at least partially disposed on the first plate (440-51), The remaining at least one first section (445C) among 445A, 445B, and 445C is at least partially disposed on the second plate (440-52). The method according to any one of claims 1 to 14,
The ground (G) is arranged separately from the plate (440-6),
The ground (G) is configured to couple with the plate (440-6). A first layer 491 including a plurality of radiating patches (P1, P2, P3) respectively disposed in a plurality of first sections 445,
a second layer 492 including a dielectric (DI) disposed in the plurality of first sections 445 and second sections 446, and
A ground (G) disposed in the second section 446, a plurality of first joints disposed in each of the plurality of first sections 445 and configured to bond the dielectric DI and the plate 440 ( A third layer 493 comprising B1) and a second joint B2 disposed on the second section 446 and configured to join the ground G and the plate 440.
Including,
The antenna 497 wherein each of the plurality of first joints (B1) has a thickness greater than the thickness of the second joint (B2). According to claim 16,
An antenna wherein the plurality of first junctions (B1) include a non-conductive material. The method of claim 16 or 17,
The antenna wherein the plurality of first junctions (B1) are in contact with the dielectric (DI). The method according to any one of claims 16 to 18,
The second junction (B2) is an antenna comprising a conductive material. The method according to any one of claims 16 to 19,
The second junction (B2) is an antenna in contact with the ground (G).

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