KR20240014418A - Camera module and electronic device including thereof - Google Patents

Abstract

A camera module according to an embodiment includes a lens assembly, an image sensor, an OIS carrier that simultaneously rotates the lens assembly and the image sensor about an axis perpendicular to the optical axis, a housing, a first OIS coil fixed to the first side of the OIS carrier, A second OIS coil secured to a second side of the OIS carrier substantially perpendicular to the first side, a first OIS magnet secured to the housing to face the first OIS coil. A second OIS magnet fixed to the housing to face the second OIS coil, a first portion disposed between the housing and a third side of the OIS carrier opposite the first side, and extending from the first portion, the second side. A frame comprising a second portion disposed between the housing and a fourth side of the OIS carrier that is the opposite side of the frame, at least one first ball disposed between the first portion and the third side, and between the second portion and the housing. It may include at least one second ball disposed. At least one first ball may be arranged to move along the inside of at least one first guide groove formed in the first portion as the OIS carrier rotates.
In addition to this, various embodiments identified through the specification are possible.

Description

Camera module and electronic device including the same {CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THEREOF}

Various embodiments disclosed in this document relate to camera modules and electronic devices including the same.

Recently, portable terminals such as tablet PCs and laptops, as well as mobile phones such as smartphones, are equipped with highly functional and ultra-small camera modules. As portable terminals become smaller, the response to hand shaking increases when taking video, so video quality may deteriorate. For example, the higher the magnification of the camera, the greater the degree of image shaking due to camera shake.

Therefore, in camera functions, the shake correction function is an essential and important function for obtaining clear photos. In general, stabilization methods for image stabilization include optical image stabilization (OIS) and digital IS (DIS). The optical image stabilization method (e.g. OIS) reduces shake by moving the lens or sensor, and the digital image stabilization method (e.g. DIS) is borrowed from portable terminals. This refers to a method of reducing shaking through digital processing.

A camera module according to an embodiment includes a lens assembly aligned along an optical axis, an image sensor that changes an image into an electrical signal, an OIS carrier that simultaneously rotates the lens assembly and the image sensor about an axis perpendicular to the optical axis, a lens assembly, A housing accommodating an image sensor and an OIS carrier, a first OIS coil fixed to a first side of the OIS carrier, a second OIS coil fixed to a second side of the OIS carrier substantially perpendicular to the first side, a first OIS coil The first OIS magnet fixed to the housing to face. A second OIS magnet fixed to the housing to face the second OIS coil, a first portion disposed between the housing and a third side of the OIS carrier opposite the first side, and extending from the first portion, the second side. A frame comprising a second portion disposed between the fourth side of the OIS carrier, which is the opposite side of the housing, and at least one first ball disposed between the first portion and the third side and enabling movement of the OIS carrier. , and at least one second ball disposed between the second part and the housing and enabling movement of the frame and the OIS carrier. At least one first ball may be arranged to move along the inside of at least one first guide groove formed in the first portion as the OIS carrier rotates.

An electronic device according to an embodiment may include a first camera module. The first camera module includes a lens assembly aligned along the optical axis, an image sensor that changes the image into an electrical signal, an OIS carrier that simultaneously rotates the lens assembly and the image sensor about an axis perpendicular to the optical axis, a lens assembly, an image sensor, and an OIS. A housing for receiving the carrier, a first OIS coil secured to a first side of the OIS carrier, a second OIS coil secured to a second side of the OIS carrier substantially perpendicular to the first side, the housing facing the first OIS coil. a first OIS magnet fixed to, a second OIS magnet fixed to the housing to face the second OIS coil, a first portion disposed between the housing and a third side of the OIS carrier that is opposite to the first side, and a first A frame extending from the portion and comprising a second portion disposed between the housing and a fourth side of the OIS carrier opposite the second side, disposed between the first portion and the third side and enabling movement of the OIS carrier. It may include at least one first ball that allows movement of the frame and the OIS carrier, and at least one second ball that is disposed between the second part and the housing and allows movement of the frame and the OIS carrier. At least one first ball may be arranged to move along the inside of at least one first guide groove formed in the first portion as the OIS carrier rotates.

1 is an exploded perspective view of a camera module according to an embodiment.
Figure 2 is a perspective view showing a frame according to one embodiment.
Figure 3 is a diagram schematically showing a first portion of a frame according to one embodiment.
Figure 4 is a perspective view showing a printed circuit board and an OIS carrier on which the printed circuit board is placed according to an embodiment.
Figure 5 is a perspective view showing the positions of the OIS coil, OIS magnet, and frame of the camera module according to one embodiment.
Figure 6 is a transparency showing the rotation of the OIS carrier when current is applied to the first OIS coil according to one embodiment.
Figure 7 is a transparency showing the rotation of the OIS carrier when current is applied to the second OIS coil according to one embodiment.
Figure 8 is a transparent perspective view showing a sub-housing and a frame according to one embodiment.
Figure 9 is a perspective view showing a camera module according to one embodiment.
Figure 10 is a cross-sectional view of a camera module according to one embodiment.
Figure 11 is a cross-sectional view of a camera module according to one embodiment.
Figure 12 is a transparent perspective view showing a frame including a suction magnet according to one embodiment.
Figure 13 is a perspective view showing a printed circuit board and an OIS carrier on which the printed circuit board is placed according to an embodiment.
Figure 14 is a perspective view showing the positions of the OIS coil, OIS magnet, and frame of the camera module according to one embodiment.
Figure 15 is a perspective view showing a camera module according to one embodiment.
Figure 16 is a plan view showing the front and back of an electronic device including a camera module according to an embodiment.
FIG. 17 is a cross-sectional view taken along line CC' of FIG. 16.
Figure 18 is a plan view showing the height of a camera module according to one embodiment.
19 is a block diagram of an electronic device in a network environment according to various embodiments.
20 is a block diagram illustrating a camera module according to various embodiments.
In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of the present disclosure are described with reference to the attached drawings. However, this is not intended to limit the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives to the embodiments of the present disclosure.

Electronic devices according to various embodiments of this document include, for example, a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, Desktop personal computer (laptop personal computer), netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile medical It may include at least one of a device, a camera, or a wearable device. According to various embodiments, the wearable device may be in the form of an accessory (e.g., a watch, ring, bracelet, anklet, necklace, glasses, contact lenses, or head-mounted-device (HMD)), or integrated into fabric or clothing ( It may include at least one of a body-attached type (e.g., an electronic garment), a body-attachable type (e.g., a skin pad or a tattoo), or a bioimplantable type (e.g., an implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances include, for example, televisions, DVD (digital video disk) players, stereos, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, and home automation control panels ( It may include at least one of a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include various medical devices (e.g., various portable medical measurement devices (blood sugar monitor, heart rate monitor, blood pressure monitor, or body temperature monitor), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computer tomography, imaging device, or ultrasonic device), navigation device, global navigation satellite system (GNSS), event data recorder (EDR), flight data recorder (FDR), automobile infotainment device , marine electronic equipment (e.g. marine navigation systems or gyrocompasses), avionics, security devices, head units for vehicles, industrial or domestic robots, automatic teller's machines (ATMs) in financial institutions, stores. point of sales (POS), or internet of things devices (e.g. light bulbs, various sensors, electric or gas meters, sprinkler systems, fire alarms, thermostats, street lights, toasters, exercise machines) It may include at least one of an appliance, a hot water tank, a heater, or a boiler).

According to some embodiments, the electronic device may be a piece of furniture or part of a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., It may include at least one of water, electricity, gas, or radio wave measuring devices). In various embodiments, the electronic device may be one or a combination of more than one of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. Additionally, electronic devices according to embodiments of this document are not limited to the above-mentioned devices and may include new electronic devices according to technological developments.

Figure 1 is an exploded perspective view of the camera module 100 according to one embodiment.

According to one embodiment, the at least one electronic device described above may include at least one camera module 100. For example, at least one camera module may be placed on the rear of a smart phone to face the rear of the smart phone. However, it is not limited to this. It can be clearly understood by those skilled in the art that the camera module 100 of FIG. 1 can be applied to electronic devices equipped with a camera among various electronic devices or mobile devices.

Referring to FIG. 1, the camera module 100 according to one embodiment includes a lens assembly 101, an optical image stabilization (OIS) carrier 110 that accommodates at least a portion of the lens assembly 101, and an OIS carrier 110. It may include a frame 130 surrounding at least a portion of the frame 130, and a housing 120 accommodating the OIS carrier 110 and the frame 130. However, the configuration of the camera module 100 is not limited to this. The camera module 100 may add or omit at least one of the above-described components. For example, the camera module 100 may further include a printed circuit board 180 and/or a lower cover 190. In one example, the camera module 100 may further include an image sensor 181.

According to one embodiment, the lens assembly 101 may be placed inside the OIS carrier 110. In one embodiment, lens assembly 101 may include at least one lens. The lens can move forward and backward along the optical axis (for example, Z-axis), and can operate to change the focus position so that the target object, which is the subject, can be captured clearly.

According to one embodiment, light information from a light incident incident through the lens assembly 101 may be converted into an electrical signal by an image sensor (not shown) and input to an image signal processor. However, it is not limited to this.

According to one embodiment, the image sensor (not shown) is mounted on a printed circuit board 180 (e.g., a printed circuit board (PCB), a printed board assembly (PBA), a flexible PCB (FPCB), or a rigid-flexible RFPCB (RFPCB). It can be placed on the top of the PCB)). The image sensor may be electrically connected to the image signal processor connected to the printed circuit board 180 by a connector. A flexible printed circuit board (FPCB) or cable may be used as the connector.

According to one embodiment, the image sensor may be a complementary metal oxide semiconductor (CMOS) sensor or a charged coupled device (CCD) sensor. An image sensor integrates a plurality of individual pixels, and each individual pixel may include a micro lens, a color filter, and a photodiode. Each individual pixel is a type of photodetector that can convert input light into an electrical signal. The photodetector may include a photodiode.

According to one embodiment, the OIS carrier 110 may accommodate at least a portion of the lens assembly 101. For example, OIS carrier 110 may surround lens assembly 101. According to one embodiment, the OIS carrier 110 has a first side 111, a third side 113 facing the first side 111, the first side 111, and the third side 113. It may include a second side 112 that is substantially perpendicular, and a fourth side 114 that is substantially perpendicular to the first side 111 and the third side 113 and faces the second side 112. there is. However, it is not limited to this.

According to one embodiment, the OIS carrier 110 may include an opening in the upper central portion that allows a portion of the lens assembly 101 to be exposed.

According to one embodiment, the OIS carrier 110 may include a first OIS coil 161 disposed on the first side 111 and a second OIS coil 162 disposed on the second side 112. . The first OIS coil 161 may be disposed in a position substantially perpendicular to the second OIS coil 162. In FIG. 1, the OIS coil is shown as being disposed on the side of the OIS carrier 110, but the present invention is not limited thereto. For example, an OIS magnet may be placed on the side of the OIS carrier 110. In Figure 1, one OIS coil is shown as disposed on each side of the OIS carrier 110, but the number of OIS carriers 110 is not limited to this.

According to one embodiment, the camera module 100 includes a barrel for mounting at least one lens aligned on an optical axis, and a housing (120) for mounting at least one coil and/or magnet surrounding the circumference of the barrel around the optical axis. ) may include. For example, referring to FIG. 1, the housing 120 may include a first OIS magnet 171 and a second OIS magnet 172 on its inner surface. However, it is not limited to this. In another example, the housing 120 may include a first OIS coil 161 and a second OIS coil 162 on the inner surface.

According to one embodiment, the housing 120 may accommodate at least a portion of the OIS carrier 110. The housing 120 may be formed in a box shape with an internal space. For example, the housing 120 may be formed to surround at least a portion of the side of the OIS carrier 110. However, it is not limited to this. For example, at least a portion of one side of the housing 120 may be open. According to one embodiment, the housing 120 may include a sub-housing 121 disposed on one side with at least a portion of the housing 120 open. In another example, the sub-housing 121 may be formed integrally with the housing 120.

According to one embodiment, the first OIS magnet 171 is disposed on the inner surface of the housing 120 facing the first OIS coil 161 disposed on the OIS carrier 110, and the second OIS magnet 172 May be disposed on the inner surface of the housing 120 facing the second OIS coil 162 disposed on the OIS carrier 110.

In one embodiment, the camera module 100 uses at least one coil and/or magnet included in the housing 120 to provide a stabilization function (e.g., OIS) for images acquired by an image sensor (not shown). can be performed. For example, the at least one coil can electromagnetically interact with each other under the control of a control circuit. For example, the camera module 100 may control electromagnetic force by controlling the direction and/or intensity of a current passing through at least one coil under the control of a processor. The camera module 100 uses the Lorentz force caused by electromagnetic force to align at least a portion of the lens assembly 101 and the OIS carrier 110 including the lens assembly 101 substantially perpendicular to the optical axis (for example, Z axis). It can rotate about the optical axis or move in a direction substantially perpendicular to the optical axis.

According to one embodiment, the housing 120 may include an opening in the upper central portion that allows a portion of the lens assembly 101 to be exposed.

According to one embodiment, the camera module 100 may include at least one frame 130 disposed between the OIS carrier 110 and the housing 120. In one example, the at least one frame 130 includes a first portion 131 disposed between the third side 113 of the OIS carrier 110 and the housing 120, and a fourth side of the OIS carrier 110. It may include a second portion 132 disposed between 114 and the housing 120. The second part 132 may extend from the first part 131. In the present disclosure, extension may include the meaning of being formed as one member. The second portion 132 may be substantially perpendicular to the first portion 131 .

According to one embodiment, the camera module 100 includes at least one first ball 141 disposed between the first part 131 and the third side 113, and the second part 132 and the fourth side It may include at least one second ball 142 disposed between (114). The number and/or location of at least one first ball 141 and at least one second ball 142 shown in FIG. 1 are not limited to FIG. 1 .

According to one embodiment, at least one first ball 141 may contact the OIS carrier 110. At least one first ball 141 may move (rotate) within a certain range on the OIS carrier 110.

According to one embodiment, the at least one first ball 141 forms a point contact between the OIS carrier 110 and the first portion 131 of the frame 130, thereby forming a point contact between the OIS carrier 110 and the frame 130. It can play a role in reducing friction accompanying the liver. The above-described role can be performed by moving (rotating) at least one first ball 141 on the OIS carrier 110. The rotation of at least one first ball 141 and the movement of the OIS carrier 110 may occur together.

According to one embodiment, at least one second ball 142 may contact at least a portion of the housing 120. For example, at least one second ball 142 may contact the sub-housing 121 . At least one second ball 142 may move (rotate) within a certain range on at least a portion of the housing 120 (eg, sub-housing 121).

According to one embodiment, the at least one second ball 142 establishes point contact between the housing 120 (e.g., sub-housing 121) and the second portion 132 of the frame 130, thereby: It may serve to reduce friction between the housing 120 and the frame 130. The above-described role may be performed by moving (rotating) the at least one second ball 142 on the housing 120. Rotation of at least one second ball 142 and movement of the OIS carrier 110 and/or frame 130 may occur together.

According to one embodiment, the frame 130 includes at least one first suction magnet 151 disposed in the first portion 131 and at least one second suction magnet disposed in the second portion 132. It may include a magnet 152.

According to one embodiment, the third side 113 may include at least one first yoke facing at least one first suction magnet 151. According to one embodiment, the inner surface of the housing 120 (e.g., sub-housing 121) facing the second portion 132 has at least one facing the at least one second suction magnet 152. It may include a second yoke.

According to one embodiment, the first suction magnet 151 is disposed at a position corresponding to at least one yoke disposed on one side of the OIS carrier 110, thereby fixing the frame 130 inside the camera module 100. can do. The second suction magnet 152 is disposed at a position corresponding to at least one yoke disposed in the housing 120 (e.g., sub-housing 121), thereby allowing the frame 130 to be positioned inside the camera module 100. It can be fixed. In the present disclosure, the suction magnet may refer to a magnet for adsorption. However, it is not limited to this.

According to one embodiment, at least one printed circuit board 180 may include a slit-type printed circuit board. However, it is not limited to this.

According to one embodiment, the camera module 100 of the present disclosure reduces the difficulty of manufacturing and simplifies assembly, thereby reducing variation in performance and ensuring reliability.

According to one embodiment, module tilt OIS (module tilt OIS) may be applied to the camera module 100. In one example, module tilt OIS may mean that the OIS carrier is tilting. However, it is not limited to this.

Figure 2 is a perspective view showing the frame 130 according to one embodiment.

Frame 130 of FIG. 2 may be referenced by frame 130 of FIG. 1 . For components that are the same or substantially the same as those described above, the same terminology or the same reference sign is used, and overlapping content is omitted.

Referring to FIG. 2, the frame 130 may have a bent plate shape. For example, the first part 131 of the frame 130 may be a plate with a longitudinal direction in one direction (eg, Y-axis direction). The second part 131 may be a plate that extends from the first part 131 and has a longitudinal direction substantially perpendicular to the longitudinal direction of the first part 131 (for example, the X-axis direction). . However, it is not limited to this.

According to one embodiment, the first part 131 may include a first receiving groove 131A and a second receiving groove 131B. The second receiving groove 131B may be formed at a position spaced apart from the first receiving groove 131A by a predetermined distance in the longitudinal direction of the first portion 131.

According to one embodiment, the first receiving groove 131A and the second receiving groove 131B may include a shape corresponding to the direction in which the OIS carrier (for example, the OIS carrier 110 in FIG. 1) rotates. there is. For example, the first receiving groove 131A and the second receiving groove 131B may have a curved shape facing each other. However, it is not limited to this.

According to one embodiment, the first portion 131 may include a first convex portion 133 disposed between the first receiving groove 131A and the second receiving groove 131B. The first convex portion 133 may be disposed on the outer surface of the first portion 131. For example, the first convex portion 133 may be formed to be convex on one side of the frame 130 facing the inner side of the housing (eg, housing 120 in FIG. 1). In one example, the first convex portion 133 is oriented in a direction from the third side 113 of the OIS carrier 110 toward the inner surface of the housing substantially parallel to the third side 113 (e.g., +X direction) may be a protruding shape.

According to one embodiment, the first convex portion 133 may include a curved shape. For example, the first convex portion 133 may be formed seamlessly from the top edge of the first portion 131 toward the bottom edge of the first portion 131 . However, it is not limited to this.

According to one embodiment, the second portion 132 may include a third receiving groove 132A and a fourth receiving groove 132B. The third receiving groove 132A may be formed at a position spaced apart from the fourth receiving groove 132B by a predetermined distance in the longitudinal direction of the second portion 132.

According to one embodiment, the third receiving groove 132A and the fourth receiving groove 132B are configured to rotate in the direction in which the OIS carrier (e.g., the OIS carrier 110 in FIG. 1) and/or the frame 130 rotates. It may include a corresponding shape. For example, the third receiving groove 132A and the fourth receiving groove 132B may have a curved shape facing each other. However, it is not limited to this.

According to one embodiment, the second portion 132 may include a second convex portion 134 disposed between the third receiving groove 132A and the fourth receiving groove 132B. The second convex portion 134 may be disposed on the inner surface of the second portion 132. For example, the second convex portion 134 may be formed to be convex on one side of the frame 130 facing the side of the OIS carrier 110. In one example, the second convex portion 134 is located on an inner surface of the housing (e.g., sub-housing 121) that is substantially parallel to the fourth side 114 of the OIS carrier 110. It may be a shape that protrudes in a direction opposite to the direction toward the inner surface (for example, +Y direction).

According to one embodiment, the second convex portion 134 may include a curved shape. For example, the second convex portion 134 may be formed seamlessly from the upper edge of the second convex portion 134 toward the lower edge of the second convex portion 134 . However, it is not limited to this.

According to one embodiment, the second convex portion 134 may be disposed at a position spaced apart from the upper edge of the second portion 132 and the lower edge of the second portion 132 by a predetermined distance. However, it is not limited to this.

According to one embodiment, the second convex portion 134 may be disposed with the longitudinal direction (eg, X-axis direction) of the second portion 132 as the longitudinal direction. However, it is not limited to this.

FIG. 3 is a diagram schematically showing the first portion 131 of the frame 130 according to one embodiment.

The frame 130 of FIG. 3 may be referenced by the frame 130 of FIGS. 1 and 2. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

FIG. 3 may be a diagram schematically illustrating the inner surface (eg, the surface facing the -X direction in FIG. 2 ) of the first portion 131 of the frame 130. The configuration of the frame 130 is not limited to FIG. 3. For example, the frame 130 may omit at least one of the components described later or may further include at least one component.

Referring to FIG. 3 , the frame 130 may include at least one guide groove that accommodates at least one ball 141. For example, the first part 131 may include a first guide groove 131C and a second guide groove 131D.

According to one embodiment, the first guide groove 131C is formed at a position spaced a predetermined distance from the second guide groove 131D in the longitudinal direction (for example, Y-axis direction) of the first portion 131. You can. In one example, the first receiving groove 131A and the second receiving groove 131B may be disposed between the first guide groove 131C and the second guide groove 131D. However, it is not limited to this. In another example, the first guide groove 131C and the second guide groove 131D may be disposed between the first receiving groove 131A and the second receiving groove 131B.

According to one embodiment, the first guide groove 131C and the second guide groove 131D may include a shape corresponding to the direction in which the OIS carrier (e.g., the OIS carrier 110 in FIG. 1) rotates. there is. For example, the first guide groove 131C and the second guide groove 131D may have a curved shape facing each other. However, it is not limited to this.

According to one embodiment, at least a portion of the at least one first ball 141 may be accommodated inside at least one guide groove. For example, referring to FIG. 3, a plurality of first balls 141 may be arranged inside the guide groove in the longitudinal direction of the guide groove. However, it is not limited to this.

According to one embodiment, the first ball 141 is disposed in the first guide groove 131C and may include a first group 141A including a plurality of first balls 141. In one example, at least some of the plurality of first balls 141 in the first group 141A may have different shapes and/or sizes. According to one embodiment, the first ball 141 may be disposed in the second guide groove 131D and include a second group 141B including a plurality of first balls 141. In one example, at least some of the plurality of first balls 141 in the second group 141B may have different shapes and/or sizes. However, it is not limited to this.

According to one embodiment, at least one first ball 141 may be accommodated inside at least one guide groove and guided along the inside of the guide groove. In the present disclosure, being guided may mean an action of being accommodated in an area and moving or rotating. However, it is not limited to this.

According to one embodiment, the frame 130 may include a first suction magnet 151 disposed between the first guide groove 131C and the second guide groove 131D. The first suction magnet 151 may be disposed between the first receiving groove 131A and the second receiving groove 131B. In one example, the first suction magnet 151 may be disposed in the central portion of the first portion 131. However, it is not limited to this. In FIG. 3, the first suction magnet 151 is shown as being exposed from the inner surface of the first portion 131, but the present invention is not limited thereto. For example, the first suction magnet 151 may be disposed inside the first part 131, so that at least a portion of it may not be visible from the outside.

Although the second portion of the frame 130 (e.g., the second portion 132 of FIG. 2) is not shown in FIG. 3, the configuration of the second portion, the location of the configuration, and/or the arrangement relationship of the configuration are It may be referenced by the first part 131.

FIG. 4 is a perspective view showing a printed circuit board 160 and an OIS carrier 110 on which the printed circuit board 160 is disposed according to an embodiment.

Figure 4 (a) may be a perspective view of the printed circuit board 160, and Figure 4 (b) may be a perspective view of the OIS carrier 110 on which the printed circuit board 160 is disposed.

The OIS carrier 110 and at least one OIS coil (eg, first OIS coil 161) of FIG. 4 may be referenced by the OIS carrier 110 and at least one OIS coil of FIG. 1. For components that are the same or substantially the same as those described above, the same terminology or the same reference number is used, and overlapping content is omitted.

According to one embodiment, at least one camera module (e.g., camera module 100 in FIG. 1) may include at least one printed circuit board 160 surrounding at least a portion of the OIS carrier 110. there is. For example, the printed circuit board 160 is connected to the fourth side along the first side (first side 111 of FIG. 1) from the second side (second side 112 of FIG. 1) of the OIS carrier 110. It may extend to the side (fourth side 114 in FIG. 1).

According to one embodiment, at least one coil may be disposed on the printed circuit board 160. For example, referring to FIG. 4 , the printed circuit board 160 may include a first OIS coil 161, a second OIS coil 162, and an AF coil 163. However, the configuration of the printed circuit board 160 is not limited to this. For example, the printed circuit board 160 may further include at least one coil, or at least one of the coils described above may be omitted. According to one embodiment, the first OIS coil 161 and the second OIS coil 162 are disposed on the outer side of the printed circuit board 160, and the AF coil 163 is on the inner side of the printed circuit board 160. can be placed in

According to one embodiment, the first OIS coil 161 may be fixed to a portion of the printed circuit board 160 corresponding to the first side of the OIS carrier 110. The second OIS coil 162 may be fixed to a portion of the printed circuit board 160 corresponding to the second side of the OIS carrier 110. The AF coil 163 may be fixed to a portion of the printed circuit board 160 corresponding to the fourth side of the OIS carrier 110.

According to one embodiment, at least one printed circuit board 160 may be electrically connected to at least a portion of the OIS carrier 110 and at least a portion of the AF carrier (not shown). When an electronic device including a camera module (e.g., camera module 100 in FIG. 1) is shaken, at least one processor included in the electronic device may generate an OIS control value to compensate for the shake of the electronic device. there is. The electronic device controls OIS by transmitting an electrical signal corresponding to the OIS control value to the OIS driving coil (e.g., the first OIS coil 161 and/or the second OIS coil 162) disposed on the OIS carrier 110. It can be implemented. When shooting with a camera, at least one processor included in the electronic device may generate an AF control value to adjust the focal distance of the subject and the camera, and the electronic device may generate an electrical signal corresponding to the AF control value to an AF carrier disposed in the camera. AF can be implemented by transmitting it to an AF driving coil (eg, AF coil 163).

Figure 5 is a perspective view schematically showing the positions of the OIS coils 161 and 162, the OIS magnets 171 and 172, and the frame 130 of the camera module according to one embodiment. Figure 6 is a transparency showing the rotation of the OIS carrier when current is applied to the first OIS coil 161 according to an embodiment. Figure 7 is a transparency showing the rotation of the OIS carrier when current is applied to the second OIS coil 162 according to one embodiment.

The configuration of the camera module of FIGS. 5 to 7 may be referenced from the configuration of the camera module of FIGS. 1 to 4 (eg, the camera module 100 of FIG. 1). For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

Referring to FIG. 5, an OIS magnet for hand shake correction (e.g., optical image stabilizer (OIS)) disposed in a housing according to an embodiment may be operated in pairs with a coil related to hand shake correction disposed in an OIS carrier. In one embodiment, when current is applied to the first OIS coil 161, the lens assembly (the lens assembly of FIG. 6) is generated by electromagnetic interaction between the first OIS coil 161 and the first OIS magnet 171. The OIS carrier including 101)) may rotate around a direction substantially perpendicular to the optical axis (eg, Y-axis direction) (or around a direction substantially perpendicular to the optical axis). In one embodiment, when current is applied to the second OIS coil 162, the OIS carrier including the lens assembly is moved along the optical axis by electromagnetic interaction between the second OIS coil 162 and the second OIS magnet 172. It may rotate about another direction substantially perpendicular to (for example, the X-axis direction) (or about another direction substantially perpendicular to the optical axis).

According to one embodiment, the camera module uses at least one coil 163 and/or magnet 173 included in the OIS carrier to perform autofocus (e.g., AF) in relation to the image acquired by the image sensor. Control function can be performed. For example, at least one coil 163 may electromagnetically interact with each other under the control of a control circuit. For example, the camera module may control electromagnetic force by controlling the direction and/or intensity of the current passing through at least one coil 163 under the control of the processor. The camera module may move at least a portion of the lens assembly 101 and the AF carrier in the optical axis (eg, Z-axis) direction using Lorentz force caused by electromagnetic force.

According to one embodiment, a structure that performs AF driving may be disposed on the OIS carrier 110. For example, the AF magnet 173 may be placed in an AF carrier (not shown), and the AF coil 163 may be placed in an AF housing (not shown). According to one embodiment, the AF housing is fixed to the OIS carrier 110, and the AF carrier may be disposed in a lens assembly (eg, lens assembly 101 in FIG. 6). However, it is not limited to this. According to one embodiment, the AF magnet 173 may be operated in pairs with the AF coil 163. For example, when current is applied to the AF coil 163, the lens assembly (lens assembly 101 in FIG. 6) is parallel to the optical axis due to electromagnetic interaction between the AF coil 163 and the AF magnet 173. It can move along one direction (for example, the Z-axis direction).

According to one embodiment, the camera module may include at least one position sensor (not shown). For example, the position sensor may be a hall sensor. According to one embodiment, the camera module (or a driving circuit included in the camera module) measures the position of the lens assembly (101 in FIG. 6) and/or the OIS carrier accommodating the lens assembly using at least one position sensor. You can. For example, the camera module may use a position sensor to measure the position on the X-axis and/or the position on the Y-axis of the lens assembly and/or OIS carrier.

The embodiment of FIG. 6 may be an embodiment in which current is applied to the first OIS coil 161. According to one embodiment, when current is applied to the first OIS coil 161, a driving force may be generated in a direction substantially parallel to the optical axis (eg, Z-axis direction). When a driving force is generated, at least one second ball 142 may move (or rotate) along the guide grooves 132C and 132D. As the at least one second ball 142 moves (or rotates) along the guide grooves 132C and 132D, the OIS carrier and frame 130 including the lens assembly 101 move in a direction substantially perpendicular to the optical axis. It can rotate around (for example, the Y-axis direction). According to one embodiment, as the at least one second ball 142 moves (or rotates) along the guide grooves 132C and 132D, the OIS carrier and frame 130 including the lens assembly 101 are at least A direction substantially parallel to the optical axis (e.g., It can rotate around .

The embodiment of FIG. 7 may be an embodiment in which current is applied to the second OIS coil 162. According to one embodiment, when current is applied to the second OIS coil 162, a driving force may be generated in a direction substantially parallel to the optical axis (eg, Z-axis direction). When a driving force is generated, at least one first ball 141 may move (or rotate) along the guide grooves 131C and 131D. As the at least one first ball 141 moves (or rotates) along the guide grooves 131C, 131D, the OIS carrier including the lens assembly 101 moves in different directions substantially perpendicular to the optical axis (e.g. , Y-axis direction) can be rotated. According to one embodiment, as the at least one first ball 141 moves (or rotates) along the guide grooves 131C and 131D, the OIS carrier including the lens assembly 101 includes at least one OIS magnet ( For example, a housing (e.g., housing 120 of FIG. 1) including a second OIS magnet 172) and another direction substantially parallel to the optical axis with respect to the frame 130 (e.g., Y It can rotate around its axis.

Figure 8 is a transparent perspective view showing the sub-housing 121 and the frame 130 according to one embodiment.

The sub-housing 121 and frame 130 of FIG. 8 may be referred to by the sub-housing 121 and frame 130 of FIGS. 1 to 7. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

The frame 130 according to one embodiment may include a third receiving groove 132A and a fourth receiving groove 132B in the second portion 132. According to one embodiment, the housing (eg, sub-housing 121) may include at least one protrusion received in at least one receiving groove of the frame 130. For example, referring to FIG. 8, the sub-housing 121 has a first protrusion 121A protruding in a direction toward the frame 130 (for example, +Y-axis direction) on a surface facing the frame 130. ) and a second protrusion 121B. When the second portion 132 of the frame 130 is disposed to face the sub-housing 120, the first protrusion 121A may be received in the third receiving groove 132A. The second protrusion 121B may be accommodated in the fourth receiving groove 132B. In FIG. 8, the sub-housing 121 is shown as including two protrusions, but the number of protrusions is not limited thereto.

According to one embodiment, the shape of at least one protrusion (e.g., the first protrusion 121A, the second protrusion 121B) includes at least one receiving groove (e.g., the third receiving groove 132A, It may be formed to correspond to the shape of the fourth receiving groove (132B). According to one embodiment, the first protrusion 121A and the second protrusion 121B may include a shape corresponding to the direction in which the OIS carrier (eg, the OIS carrier 110 of FIG. 1) rotates. For example, the first protrusion 121A and the second protrusion 121B may have a curved shape facing each other. However, it is not limited to this.

According to one embodiment, the at least one protrusion may be guided along the receiving groove while being accommodated in the at least one receiving groove. For example, when the OIS carrier (e.g., OIS carrier 110 in FIG. 1) rotates, the first protrusion 121A moves in the first direction inside the third receiving groove 132A, and moves in the second direction within the third receiving groove 132A. The protrusion 121B may move in a direction opposite to the first direction within the fourth receiving groove 132B.

According to one embodiment, the first protrusion 121A and/or the second protrusion 121B may serve to prevent the frame 130 from being separated from the housing when an external impact is applied to the electronic device. . According to one embodiment, the first protrusion 121A and/or the second protrusion 121B may serve to limit the amount of rotation of the OIS carrier when the OIS carrier rotates.

According to one embodiment, in FIG. 8, the sub-housing 121 is shown to include at least one protrusion and the second part 132 is shown to include at least one receiving groove, but the present invention is not limited thereto. For example, the sub-housing 121 may include at least one receiving groove, and the second portion 132 may include at least one protrusion.

Figure 9 is a perspective view showing the camera module 100 according to one embodiment.

The camera module 100 of FIG. 9 may be referenced by the camera module of FIGS. 1 to 8. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

The frame 130 according to one embodiment may include a first receiving groove 131A and a second receiving groove 131B in the first portion 131. According to one embodiment, the OIS carrier 110 may include at least one protrusion received in at least one receiving groove of the frame 130. For example, referring to FIG. 9, the OIS carrier 110 is mounted on the first portion 131 of the frame 130 and the first portion of the frame 130 on the side (e.g., the third side 113). It may include a third protrusion 113A and a fourth protrusion 113B that protrude in a direction toward the first portion 131 (for example, +X-axis direction). With the first portion 131 of the frame 130 disposed to face the OIS carrier 110 (e.g., the third side 113), the third protrusion 113A has a first receiving groove 131A. ) can be accepted. The fourth protrusion 113B may be accommodated in the second receiving groove 131B. In FIG. 9, the OIS carrier 110 is shown as including two protrusions, but the number of protrusions is not limited to this.

According to one embodiment, the shape of at least one protrusion (eg, third protrusion 113A, fourth protrusion 113B) is shaped like at least one receiving groove (eg, first receiving groove 131A, It may be formed to correspond to the shape of the second receiving groove (131B). According to one embodiment, the third protrusion 113A and the fourth protrusion 113B may have a shape corresponding to the direction in which the OIS carrier 110 rotates. For example, the third protrusion 113A and the fourth protrusion 113B may have a curved shape facing each other. However, it is not limited to this.

According to one embodiment, the at least one protrusion may be guided along the receiving groove while being accommodated in the at least one receiving groove. For example, when the OIS carrier 110 rotates, the third protrusion 113A moves in the second direction within the first receiving groove 131A, and the fourth protrusion 113B moves in the second receiving groove 131B. ) The interior can be moved in the direction opposite to the second direction.

According to one embodiment, the third protrusion 113A and/or the fourth protrusion 113B may serve to prevent the frame 130 from being separated from the OIS carrier when an external impact is applied to the electronic device. there is. According to one embodiment, the third protrusion 113A and/or the fourth protrusion 113B may serve to limit the rotation amount of the OIS carrier when the OIS carrier rotates.

According to one embodiment, in FIG. 9, the OIS carrier is shown to include at least one protrusion and the first portion 131 is shown to include at least one receiving groove, but the present invention is not limited thereto. For example, the OIS carrier may include at least one receiving groove and the first portion 131 may include at least one protrusion.

Figure 10 is a cross-sectional view of the camera module 100 according to one embodiment.

FIG. 10 may be a cross-sectional view of the camera module 100 of FIG. 9 taken along line A-A'.

The camera module 100 of FIG. 10 may be referenced by the camera module of FIGS. 1 to 9. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

Referring to FIG. 10, the first portion 131 of the frame may include at least one first convex portion 133 protruding toward the inner surface of the housing 120 facing the first portion 131. .

According to one embodiment, the at least one first convex portion 133 may be configured to be equal to or smaller than the reference radius of the Y-axis rotation axis of the OIS carrier. Therefore, the air gap between the first part 131 and the housing is maintained when the OIS carrier rotates (or the gap between the first part 131 and the housing is maintained constant when the OIS carrier rotates) ), so that the OIS carrier does not collide with the housing 120 when it rotates, or friction with the inner surface of the housing 120 may not occur. However, it is not limited to this.

According to one embodiment, the first portion 131 includes at least one convex portion 133, thereby preventing at least one first ball from being separated due to an external impact applied to the electronic device.

Figure 11 is a cross-sectional view of a camera module according to one embodiment.

FIG. 11 may be a cross-sectional view of the camera module 100 of FIG. 9 taken along line B-B'.

The camera module 100 of FIG. 11 may be referenced by the camera module of FIGS. 1 to 10. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

Referring to FIG. 11, the second portion 132 of the frame may include at least one second convex portion 134 protruding toward the outer surface of the OIS carrier 110 facing the second portion 132. there is. In one embodiment, the second portion 132 may include at least one second convex portion 134 protruding toward the fourth side 114 of the OIS carrier 110.

According to one embodiment, the second portion 132 includes at least one convex portion 134, thereby preventing at least one second ball from being separated by an external impact applied to the electronic device.

FIG. 12 is a transparent perspective view showing a frame 130 including at least one suction magnet 151 and 152 according to an embodiment.

Frame 130 of FIG. 12 may be referenced by the frames of FIGS. 1 to 11. For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

Referring to FIG. 12 , the first portion 131 of the frame 130 may include at least one first suction magnet 151. The second portion 132 of the frame 130 may include at least one second suction magnet 152.

According to one embodiment, the length of the first suction magnet 151 in the longitudinal direction (for example, Y-axis direction) is equal to or smaller than the distance from the first receiving groove 131A to the second receiving groove 131B. You can. However, it is not limited to this.

According to one embodiment, the width of the direction perpendicular to the longitudinal direction of the first suction magnet 151 (for example, the Z-axis direction) is the longitudinal direction of the first suction magnet 151 of the first portion 131. It may be equal to or smaller than the width in the vertical direction. However, it is not limited to this.

According to one embodiment, the length of the second suction magnet 152 in the longitudinal direction (e.g., X-axis direction) is equal to or smaller than the distance from the third receiving groove 132A to the fourth receiving groove 132B. You can. However, it is not limited to this.

According to one embodiment, the width of the direction perpendicular to the longitudinal direction of the second suction magnet 152 (for example, the Z-axis direction) is the longitudinal direction of the second suction magnet 152 of the second portion 132. It may be equal to or smaller than the width in the vertical direction. However, it is not limited to this.

According to one embodiment, the larger the size of the first suction magnet 151 or the second suction magnet 152, the more efficiently the movement of the OIS carrier can be controlled when the electronic device receives an external shock.

Figure 13 is a perspective view showing a printed circuit board 260 and an OIS carrier 210 on which the printed circuit board 260 is disposed according to an embodiment.

The OIS carrier 110 of FIG. 13 and at least one OIS coil (e.g., the first OIS coil 261) may be referenced by the OIS carrier 110 and at least one OIS coil of FIGS. 1 to 12. there is. For components that are the same or substantially the same as those described above, the same terminology or the same reference number is used, and overlapping content is omitted.

According to one embodiment, at least one coil may be disposed on the printed circuit board 260. For example, referring to FIG. 13, the printed circuit board 260 includes a first OIS coil 261, a second OIS coil 262, a third OIS coil 263, a fourth OIS coil 264, and AF. It may include a coil 265. However, the configuration of the printed circuit board 260 is not limited to this. For example, the printed circuit board 260 may further include at least one coil, or at least one of the coils described above may be omitted. According to one embodiment, the first OIS coil 261, the second OIS coil 262, the third OIS coil 263, and the fourth OIS coil 264 are disposed on the outer surface of the printed circuit board 260. And, the AF coil 265 may be disposed on the inner surface of the printed circuit board 260.

According to one embodiment, the first OIS coil 261 and the second OIS coil 262 may be fixed to a portion of the printed circuit board 260 corresponding to the first side of the OIS carrier 210. In one example, the first OIS coil 261 may be arranged parallel to the second OIS coil 262 (eg, in the X-axis direction). However, it is not limited to this.

According to one embodiment, the third OIS coil 263 and the fourth OIS coil 264 are parts of the printed circuit board 260 corresponding to the second side substantially perpendicular to the first side of the OIS carrier 210. can be fixed to According to one embodiment, the third OIS coil 263 may be arranged parallel to the fourth OIS coil 264 (eg, in the Y-axis direction). However, it is not limited to this.

Figure 14 is a perspective view showing the positions of the OIS coils 261, 262, 263, 264, OIS magnets 271, 272, and frame 230 of the camera module according to one embodiment.

Figure 14 is a perspective view schematically showing the positions of the OIS coils 261, 262, 263, 264, OIS magnets 271, 272, and frame 230 of the camera module according to an embodiment.

The configuration of the camera module of FIG. 14 may be referenced from the configuration of the camera module of FIGS. 1 to 13 (eg, the camera module 100 of FIG. 1). For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

Referring to FIG. 14, an OIS magnet for hand shake correction (e.g., optical image stabilizer (OIS)) disposed in a housing according to an embodiment may be operated in pairs with a coil related to hand shake correction disposed in an OIS carrier. In one embodiment, when current is applied to the first OIS coil 261 and/or the second OIS coil 262, the first OIS coil 261 and/or the second OIS coil 262 and the first OIS coil 262 Due to electromagnetic interaction between the magnets 272, the OIS carrier including the lens assembly (lens assembly 101 in FIG. 6) rotates about a direction substantially perpendicular to the optical axis (for example, the X-axis direction). can do. In one embodiment, when current is applied to the third OIS coil 263 and/or the fourth OIS coil 264, the third OIS coil 263 and/or the fourth OIS coil 264 and the second OIS Due to electromagnetic interaction between the magnets 271, the OIS carrier including the lens assembly may rotate about another direction substantially perpendicular to the optical axis (for example, the Y-axis direction).

Figure 15 is a perspective view showing the camera module 200 according to one embodiment.

The printed circuit board 260 of FIG. 15 may be referred to as the printed circuit board 260 of FIG. 14 . The camera module 200 of FIG. 15 may be referenced by the camera module 100 of FIGS. 1 to 13. The same reference numerals are used for the same components as those described above, and overlapping descriptions are omitted.

Referring to FIG. 15, the first side (e.g., the first side 111 of FIG. 1) of the OIS carrier 210 according to one embodiment includes at least one protruding direction toward the at least one OIS coil. May include protrusions. For example, the first side of the OIS carrier 210 may include at least one first protrusion 111A protruding in a direction toward the third OIS coil 263. In one embodiment, the number of at least one protrusion may correspond to the number of at least one OIS coil. For example, referring to FIG. 15, when the camera module 200 includes a fourth OIS coil 264 disposed in parallel with the third OIS coil 263, the first side has at least one second protrusion (111B) may further be included. However, it is not limited to this.

According to one embodiment, the OIS coil may be fixed to the OIS carrier by at least one protrusion. For example, referring to FIG. 15, the third OIS coil 263 may be fixed by the first protrusion 111A, and the fourth OIS coil 264 may be fixed by the second protrusion 111B.

According to one embodiment, although not shown in FIG. 15, the second side of the OIS carrier 210 (e.g., the second side 112 of FIG. 1) has at least one protruding direction toward the first OIS coil. It may include a third protrusion. For example, referring to FIG. 14, when the camera module 200 includes a second OIS coil 262 disposed in parallel with the first OIS coil 261, the second side has at least one fourth protrusion may further include. However, it is not limited to this. According to one embodiment, although not shown in FIG. 15, at least one OIS coil may be fixed to the OIS carrier 210 by at least one protrusion formed on the second side of the OIS carrier 210.

FIG. 16 is a plan view showing the front and back sides of an electronic device 10 including a camera module according to an embodiment. FIG. 17 is a cross-sectional view taken along line CC' of FIG. 16. Figure 18 is a plan view showing the height of a camera module according to one embodiment.

The camera modules of FIGS. 16 to 18 may be referenced by the camera modules 100 and 200 of FIGS. 1 to 15 . For components that are the same or substantially the same as those described above, the same terms or the same reference numerals are used, and overlapping descriptions are omitted.

According to one embodiment, the electronic device 10 may include at least one camera module. For example, at least one camera module may be disposed on the rear of the electronic device 10 to face the rear of the electronic device 10. According to one embodiment, the electronic device 10 may include a first camera module 20, a second camera module 30, and a third camera module 40. In FIG. 16, the electronic device 10 is shown as including three camera modules, but the number of camera modules included in the electronic device 10 is not limited to this.

The first camera module 20 of FIG. 16 may be referenced by the camera modules 100 and 200 of FIGS. 1 to 15. According to one embodiment, the first camera module 20 is an ultra-wide camera, the second camera module 30 is a wide angle camera, and the third camera module 40 is a telephoto camera. It may be a camera (tele camera). For example, the third camera module 40 may be a 3x zoom camera. According to one embodiment, the electronic device 10 may further include a distance sensor. However, the type or number of camera modules shown in FIG. 16 is an example and does not limit the scope of the present disclosure. According to one embodiment, the camera module of the present disclosure (eg, the camera module 100 of FIG. 1) may be applied to an ultra-wide-angle camera. However, it is not limited to this.

According to one embodiment, the rear cover of the electronic device 10 may include at least one opening. For example, the rear cover of the electronic device 10 has a first opening corresponding to the first camera module 20, a second opening corresponding to the second camera module 30, and a third camera module 40. It may include a corresponding third opening. The rear cover of the electronic device 10 may further include an opening corresponding to the distance sensor.

According to one embodiment, the electronic device 10 may include a processor electrically connected to a camera module (e.g., the first camera module 20, the second camera module 30, and the third camera module 40). You can. In the present disclosure, at least some of the operations described as being performed by the camera module may be understood as being performed by the processor of the electronic device 10. Additionally, in the present disclosure, at least some of the operations described as being performed by the processor of the electronic device 10 may be understood as being performed by the camera module.

Referring to FIG. 16, the electronic device 10 is shown as including three camera modules, but this is an example and does not limit the scope of the present disclosure. For example, embodiments of the present disclosure may be applied to an electronic device including one camera module, embodiments of the present disclosure may be applied to an electronic device including a plurality of camera modules, and a camera included in the electronic device Embodiments of the present disclosure may be applied to some or all of the modules.

Referring to FIG. 17 , an electronic device according to an embodiment may include a plate on which at least one of the first camera module 20, the second camera module 30, or the third camera module is disposed.

According to one embodiment, the first camera module 20 may have a first height D1 from the plate. The second camera module 30 may have a second height D2 from the plate. According to one embodiment, the first height D1 may be smaller than the second height D2. In one example, the camera module of the present disclosure (e.g., the camera module 100 of FIG. 1) is applied to an ultra-wide camera, such that at least one camera module protrudes compared to the other camera modules. can prevent it.

Referring to FIG. 18, when the OIS carrier 310 including the lens assembly 301 according to an embodiment rotates (or moves), the OIS carrier 310 forms a certain angle with respect to the housing 320. It can be tilted. As the OIS carrier 310 is tilted, the first camera module 300 has a third height D3 that is greater than the first height (e.g., the first height D1 in FIG. 17) from the plate 390. You can have

According to one embodiment, when the height of the camera module 300 increases as the OIS carrier 310 is tilted (for example, when the first camera module 300 has a third height D3) ), the height of the first camera module 300 (for example, the third height D3) may be lower than or substantially the same as the height of the other camera modules. For example, the electronic device is configured such that the third height D3 is substantially equal to or smaller than the second height D2 of the second camera module (e.g., the second camera module 30 in FIG. 17). 1 The camera module 300 can be controlled. However, it is not limited to this.

FIG. 19 is a block diagram of an electronic device 801 in a network environment 800 according to various embodiments. Referring to FIG. 19, in the network environment 800, the electronic device 801 communicates with the electronic device 802 through a first network 898 (e.g., a short-range wireless communication network) or a second network 899. It is possible to communicate with at least one of the electronic device 804 or the server 808 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 801 may communicate with the electronic device 804 through the server 808. According to one embodiment, the electronic device 801 includes a processor 820, a memory 830, an input module 850, an audio output module 855, a display module 860, an audio module 870, and a sensor module ( 876), interface 877, connection terminal 878, haptic module 879, camera module 880, power management module 888, battery 889, communication module 890, subscriber identification module 896 , or may include an antenna module 897. In some embodiments, at least one of these components (eg, the connection terminal 878) may be omitted, or one or more other components may be added to the electronic device 801. In some embodiments, some of these components (e.g., sensor module 876, camera module 880, or antenna module 897) are integrated into one component (e.g., display module 860). It can be.

The processor 820, for example, executes software (e.g., program 840) to operate at least one other component (e.g., hardware or software component) of the electronic device 801 connected to the processor 820. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 820 stores instructions or data received from another component (e.g., sensor module 876 or communication module 890) in volatile memory 832. The commands or data stored in the volatile memory 832 can be processed, and the resulting data can be stored in the non-volatile memory 834. According to one embodiment, the processor 820 may include a main processor 821 (e.g., a central processing unit or an application processor) or an auxiliary processor 823 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 801 includes a main processor 821 and a auxiliary processor 823, the auxiliary processor 823 may be set to use lower power than the main processor 821 or be specialized for a designated function. You can. The auxiliary processor 823 may be implemented separately from the main processor 821 or as part of it.

The auxiliary processor 823 may, for example, act on behalf of the main processor 821 while the main processor 821 is in an inactive (e.g., sleep) state, or while the main processor 821 is in an active (e.g., application execution) state. ), together with the main processor 821, at least one of the components of the electronic device 801 (e.g., the display module 860, the sensor module 876, or the communication module 890) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 823 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 880 or communication module 890). there is. According to one embodiment, the auxiliary processor 823 (e.g., neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 801 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 808). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of them, but is not limited to the above-described example. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 830 may store various data used by at least one component (eg, the processor 820 or the sensor module 876) of the electronic device 801. Data may include, for example, input data or output data for software (e.g., program 840) and instructions related thereto. Memory 830 may include volatile memory 832 or non-volatile memory 834.

The program 840 may be stored as software in the memory 830 and may include, for example, an operating system 842, middleware 844, or application 846.

The input module 850 may receive commands or data to be used in a component of the electronic device 801 (e.g., the processor 820) from outside the electronic device 801 (e.g., a user). The input module 850 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 855 may output sound signals to the outside of the electronic device 801. The sound output module 855 may include, for example, a speaker or receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 860 can visually provide information to the outside of the electronic device 801 (eg, a user). The display module 860 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 860 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 870 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 870 acquires sound through the input module 850, the sound output module 855, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 801). Sound may be output through an electronic device 802 (e.g., speaker or headphone).

The sensor module 876 detects the operating state (e.g., power or temperature) of the electronic device 801 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 876 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 877 may support one or more designated protocols that can be used to connect the electronic device 801 directly or wirelessly with an external electronic device (eg, the electronic device 802). According to one embodiment, the interface 877 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 878 may include a connector through which the electronic device 801 can be physically connected to an external electronic device (eg, the electronic device 802). According to one embodiment, the connection terminal 878 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 879 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 879 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 880 can capture still images and moving images. According to one embodiment, the camera module 880 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 888 can manage power supplied to the electronic device 801. According to one embodiment, the power management module 888 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

Battery 889 may supply power to at least one component of electronic device 801. According to one embodiment, the battery 889 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 890 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between the electronic device 801 and an external electronic device (e.g., electronic device 802, electronic device 804, or server 808). It can support establishment and communication through established communication channels. Communication module 890 operates independently of processor 820 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 890 is a wireless communication module 892 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 894 (e.g. : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 898 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 899 (e.g., legacy It may communicate with an external electronic device 804 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 892 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 896 to communicate within a communication network such as the first network 898 or the second network 899. The electronic device 801 can be confirmed or authenticated.

The wireless communication module 892 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 892 may support high frequency bands (e.g., mmWave bands), for example, to achieve high data rates. The wireless communication module 892 uses various technologies to secure performance in high frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 892 may support various requirements specified in the electronic device 801, an external electronic device (e.g., electronic device 804), or a network system (e.g., second network 899). According to one embodiment, the wireless communication module 892 supports peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 897 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 897 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 897 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 898 or the second network 899, is selected from the plurality of antennas by, for example, the communication module 890. It can be. Signals or power may be transmitted or received between the communication module 890 and an external electronic device through at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 897.

According to various embodiments, the antenna module 897 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band), and It may include a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in a designated high frequency band. .

At least some of the components are connected to each other through a means of communication between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal (e.g. : Commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 801 and the external electronic device 804 through the server 808 connected to the second network 899. Each of the external electronic devices 802 or 804 may be of the same or different type as the electronic device 801. According to one embodiment, all or part of the operations performed in the electronic device 801 may be executed in one or more of the external electronic devices 802, 804, or 808. For example, when the electronic device 801 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 801 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 801. The electronic device 801 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 801 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 804 may include an Internet of Things (IoT) device. Server 808 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 804 or server 808 may be included in the second network 899. The electronic device 801 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-mentioned devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include a single item or a plurality of items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that one component can be connected to another component directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document are one or more instructions stored in a storage medium (e.g., built-in memory 836 or external memory 838) that can be read by a machine (e.g., electronic device 801). It may be implemented as software (e.g., program 840) including these. For example, a processor (e.g., processor 820) of a device (e.g., electronic device 801) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to at least one instruction called. One or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (eg, a module or program) of the described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as that performed by the corresponding component of the plurality of components prior to integration. According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or Alternatively, one or more other operations may be added.

FIG. 20 is a block diagram 900 illustrating a camera module 880 according to various embodiments. Referring to FIG. 20, the camera module 880 includes a lens assembly 910, a flash 920, an image sensor 930, an image stabilizer 940, a memory 950 (e.g., buffer memory), or an image signal processor. It may include (960). The lens assembly 910 may collect light emitted from a subject that is the target of image capture. Lens assembly 910 may include one or more lenses. According to one embodiment, the camera module 880 may include a plurality of lens assemblies 910. In this case, the camera module 880 may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies 910 have the same lens properties (e.g., angle of view, focal length, autofocus, f number, or optical zoom), or at least one lens assembly is different from another lens assembly. It may have one or more lens properties that are different from the lens properties of . The lens assembly 910 may include, for example, a wide-angle lens or a telephoto lens.

The flash 920 may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash 920 may include one or more light emitting diodes (e.g., red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. The image sensor 930 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 910 into an electrical signal. According to one embodiment, the image sensor 930 is one image sensor selected from among image sensors with different properties, such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having different properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor 930 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 940 moves at least one lens or image sensor 930 included in the lens assembly 910 in a specific direction in response to the movement of the camera module 880 or the electronic device 801 including the same. The operating characteristics of the image sensor 930 can be controlled (e.g., adjusting read-out timing, etc.). This allows to compensate for at least some of the negative effects of movement on the captured image. According to one embodiment, the image stabilizer 940 is a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 880. It is possible to detect such movement of the camera module 880 or the electronic device 801 using . According to one embodiment, the image stabilizer 940 may be implemented as, for example, an optical image stabilizer. The memory 950 may at least temporarily store at least a portion of the image acquired through the image sensor 930 for the next image processing task. For example, when image acquisition is delayed due to the shutter or when multiple images are acquired at high speed, the acquired original image (e.g., Bayer-patterned image or high-resolution image) is stored in the memory 950. , the corresponding copy image (e.g., low resolution image) may be previewed through the display module 860. Thereafter, when a specified condition is satisfied (eg, user input or system command), at least a portion of the original image stored in the memory 950 may be obtained and processed, for example, by the image signal processor 960. According to one embodiment, the memory 950 may be configured as at least part of the memory 830 or as a separate memory that operates independently.

The image signal processor 960 may perform one or more image processes on an image acquired through the image sensor 930 or an image stored in the memory 950. One or more image processes may include, for example, depth map generation, three-dimensional modeling, panorama creation, feature extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring). ), sharpening, or softening. Additionally or alternatively, the image signal processor 960 may include at least one of the components included in the camera module 880 (e.g., an image sensor ( 930), control (e.g., exposure time control, lead-out timing control, etc.) may be performed. The image processed by the image signal processor 960 may be stored back in the memory 950 for further processing. It may be provided as an external component of the camera module 880 (e.g., memory 830, display module 860, electronic device 802, electronic device 804, or server 808). One embodiment According to this, the image signal processor 960 may be configured as at least a part of the processor 820, or may be configured as a separate processor that operates independently of the processor 820. The image signal processor 960 may be configured with the processor 820. When configured with a separate processor, at least one image processed by the image signal processor 960 may be displayed through the display module 860 as is or after additional image processing by the processor 820.

According to one embodiment, the electronic device 801 may include a plurality of camera modules 880, each with different properties or functions. In this case, for example, at least one of the plurality of camera modules 880 may be a wide-angle camera and at least another one may be a telephoto camera. Similarly, at least one of the plurality of camera modules 880 may be a front camera, and at least another one may be a rear camera.

As described above, the camera module according to an embodiment of the present disclosure includes a lens assembly aligned along the optical axis, an image sensor that changes the image into an electrical signal, and a lens assembly and an image sensor simultaneously based on an axis perpendicular to the optical axis. A rotating OIS carrier, a lens assembly, an image sensor and a housing accommodating the OIS carrier, a first OIS coil fixed to a first side of the OIS carrier, a first OIS coil fixed to a second side of the OIS carrier substantially perpendicular to the first side. 2 OIS coils, a first OIS magnet fixed to the housing to face the first OIS coil. A second OIS magnet fixed to the housing to face the second OIS coil, a first portion disposed between the housing and a third side of the OIS carrier opposite the first side, and extending from the first portion, the second side. A frame comprising a second portion disposed between the fourth side of the OIS carrier, which is the opposite side of the housing, and at least one first ball disposed between the first portion and the third side and enabling movement of the OIS carrier. , and at least one second ball disposed between the second part and the housing and enabling movement of the frame and the OIS carrier. At least one first ball may be arranged to move along the inside of at least one first guide groove formed in the first portion as the OIS carrier rotates.

According to one embodiment, the first part may include at least one second guide groove facing at least one first guide groove based on the rotation axis of the OIS carrier.

According to one embodiment, the at least one second ball may be arranged to move along the inside of at least one third guide groove formed on one surface of the housing facing the second portion as the OIS carrier rotates.

According to one embodiment, the first part may include at least one fourth guide groove facing at least one third guide groove based on the rotation axis of the frame.

According to one embodiment, the first part of the frame may include at least one first magnet, and the second part of the frame may include at least one second magnet. The third side may include at least one first yoke facing at least one first magnet. The inner surface of the housing facing the second portion may include at least one second magnet and at least one second yoke facing.

According to one embodiment, the third side may include at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame may include at least one first receiving groove receiving at least one first protrusion. The at least one first protrusion may be arranged to move along the at least one first receiving groove as the OIS carrier rotates.

According to one embodiment, the inner surface of the housing facing the second portion of the frame may include at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame may include at least one second receiving groove receiving at least one second protrusion. The at least one second protrusion may be arranged to move along the at least one second receiving groove as the OIS carrier rotates.

According to one embodiment, the OIS carrier may include a printed circuit board surrounding at least a portion of a side surface of the OIS carrier. The printed circuit board may include a first OIS coil disposed on the outer side of the printed circuit board, a second OIS coil, and an AF coil disposed on the inner side of the printed circuit board facing the fourth side.

According to one embodiment, it may further include a driving circuit electrically connected to the first OIS coil and the second OIS coil. The driving circuit may control the current applied to at least one of the first OIS coil and the second OIS coil to move the OIS carrier on a plane perpendicular to the optical axis.

According to one embodiment, the first portion of the frame may include at least one first convex portion formed convexly on an outer surface facing the housing.

According to one embodiment, the second portion of the frame may include at least one second convex portion formed convexly on the inner surface facing the fourth side of the OIS carrier.

According to one embodiment, the first side of the OIS carrier may include at least one first protrusion protruding in a direction toward the first OIS coil. The second side of the OIS carrier may include at least one second protrusion protruding in a direction toward the second OIS coil. The first OIS coil may be fixed to the OIS carrier by at least one first protrusion. The second OIS coil may be fixed to the OIS carrier by at least one second protrusion.

According to one embodiment, the camera module is fixed to a first side of the OIS carrier, a third OIS coil disposed parallel to the first OIS coil, and fixed to a second side of the OIS carrier substantially perpendicular to the first side. and may include a fourth OIS coil disposed in parallel with the second OIS coil.

As described above, an electronic device according to an embodiment of the present disclosure may include a first camera module. The first camera module includes a lens assembly aligned along the optical axis, an image sensor that changes the image into an electrical signal, an OIS carrier that simultaneously rotates the lens assembly and the image sensor about an axis perpendicular to the optical axis, a lens assembly, an image sensor, and an OIS. A housing for receiving the carrier, a first OIS coil secured to a first side of the OIS carrier, a second OIS coil secured to a second side of the OIS carrier substantially perpendicular to the first side, the housing facing the first OIS coil. a first OIS magnet fixed to, a second OIS magnet fixed to the housing to face the second OIS coil, a first portion disposed between the housing and a third side of the OIS carrier that is opposite to the first side, and a first A frame extending from the portion and comprising a second portion disposed between the housing and a fourth side of the OIS carrier opposite the second side, disposed between the first portion and the third side and enabling movement of the OIS carrier. It may include at least one first ball that allows movement of the frame and the OIS carrier, and at least one second ball that is disposed between the second part and the housing and allows movement of the frame and the OIS carrier. At least one first ball may be arranged to move along the inside of at least one first guide groove formed in the first portion as the OIS carrier rotates.

According to one embodiment, the electronic device may further include at least one of a second camera module or a third camera module.

According to one embodiment, the electronic device may include a plate on which at least one of a first camera module, a second camera module, or a third camera module is placed. The first camera module may have a first height from the plate and the second camera module may have a second height greater than the first height from the plate. When the OIS carrier rotates about an axis perpendicular to the optical axis, the camera module may have a third height that is greater than the first height. The third height may be less than or substantially equal to the second height.

According to one embodiment, the first part may include at least one second guide groove facing at least one first guide groove based on the rotation axis of the OIS carrier.

According to one embodiment, the first part of the frame may include at least one first magnet, and the second part of the frame may include at least one second magnet. The third side may include at least one first yoke facing at least one first magnet. The inner surface of the housing facing the second portion may include at least one second magnet and at least one second yoke facing.

According to one embodiment, the first portion of the frame may include at least one first convex portion formed convexly on an outer surface facing the housing. The second portion of the frame may include at least one second convex portion formed convexly on the inner side facing the fourth side of the OIS carrier.

According to one embodiment, the third side may include at least one first protrusion protruding in a direction toward the first portion of the frame. The first portion of the frame may include at least one first receiving groove receiving at least one first protrusion. The at least one first protrusion may be arranged to move along the at least one first receiving groove as the OIS carrier rotates. The inner surface of the housing facing the second portion of the frame may include at least one second protrusion protruding in a direction toward the second portion of the frame. The second portion of the frame may include at least one second receiving groove receiving at least one second protrusion. The at least one second protrusion may be arranged to move along the at least one second receiving groove as the OIS carrier rotates.

Claims (20)

In the camera module,
a lens assembly aligned along an optical axis;
An image sensor that changes images into electrical signals;
An optical image stabilization (OIS) carrier that simultaneously rotates the lens assembly and image sensor about an axis perpendicular to the optical axis;
A housing that houses the lens assembly, image sensor, and OIS carrier;
a first OIS coil fixed to a first side of the OIS carrier;
a second OIS coil secured to a second side of the OIS carrier substantially perpendicular to the first side;
A first OIS magnet fixed to the housing to face the first OIS coil;
a second OIS magnet fixed to the housing to face the second OIS coil;
a first portion disposed between the housing and a third side of the OIS carrier, which is the opposite side of the first side, and a first portion extending from the first portion and disposed between the housing and a fourth side of the OIS carrier, which is the opposite side of the second side. a frame including a second portion;
at least one first ball disposed between the first portion and the third side and enabling movement of the OIS carrier; and
comprising at least one second ball disposed between the second part and the housing, allowing movement of the frame and the OIS carrier;
The at least one first ball is arranged to move along the inside of the at least one first guide groove formed in the first portion as the OIS carrier rotates.
Camera module. In claim 1,
The first part includes at least one second guide groove facing the at least one first guide groove with respect to the rotation axis of the OIS carrier,
Camera module. In claim 1,
The at least one second ball is arranged to move along the inside of at least one third guide groove formed on one side of the housing facing the second portion as the OIS carrier rotates.
Camera module. In claim 3,
The first part includes at least one fourth guide groove facing at least one third guide groove based on the rotation axis of the frame,
Camera module. In claim 1,
A first portion of the frame includes at least one first magnet, a second portion of the frame includes at least one second magnet, and
The third side includes at least one first yoke facing at least one first magnet,
The inner surface of the housing facing the second portion includes at least one second yoke facing at least one second magnet,
Camera module. In claim 1,
The third side includes at least one first protrusion protruding in a direction toward the first portion of the frame,
The first portion of the frame includes at least one first receiving groove receiving at least one first protrusion,
The at least one first protrusion is arranged to move along the at least one first receiving groove as the OIS carrier rotates.
Camera module. In claim 1,
The inner surface of the housing facing the second portion of the frame includes at least one second protrusion protruding in a direction toward the second portion of the frame,
The second portion of the frame includes at least one second receiving groove receiving at least one second protrusion,
The at least one second protrusion is arranged to move along the at least one second receiving groove as the OIS carrier rotates.
Camera module. In claim 1,
The OIS carrier includes a printed circuit board surrounding at least a portion of a side of the OIS carrier,
The printed circuit board includes a first OIS coil disposed on the outer side of the printed circuit board, a second OIS coil, and an AF coil disposed on the inner side of the printed circuit board facing the fourth side,
Camera module. In claim 1,
Further comprising a driving circuit electrically connected to the first OIS coil and the second OIS coil,
The driving circuit controls the current applied to at least one of the first OIS coil and the second OIS coil to move the OIS carrier on a plane perpendicular to the optical axis.
Camera module. In claim 1,
The first portion of the frame includes at least one first convex portion formed convexly on an outer surface facing the housing,
Camera module. In claim 1,
The second portion of the frame includes at least one second convex portion formed convexly on the inner side facing the fourth side of the OIS carrier,
Camera module. In claim 1,
The first side of the OIS carrier includes at least one first protrusion protruding in a direction toward the first OIS coil,
The second side of the OIS carrier includes at least one second protrusion protruding in a direction toward the second OIS coil,
The first OIS coil is fixed to the OIS carrier by at least one first protrusion,
The second OIS coil is fixed to the OIS carrier by at least one second protrusion,
Camera module. In claim 1,
a third OIS coil fixed to the first side of the OIS carrier and disposed in parallel with the first OIS coil; and
a fourth OIS coil fixed to a second side of the OIS carrier substantially perpendicular to the first side and disposed in parallel with the second OIS coil;
Including,
Camera module. In an electronic device including a first camera module,
The first camera module is,
a lens assembly aligned along an optical axis;
An image sensor that changes images into electrical signals;
OIS carrier that simultaneously rotates the lens assembly and image sensor about an axis perpendicular to the optical axis;
A housing that houses the lens assembly, image sensor, and OIS carrier;
a first OIS coil fixed to a first side of the OIS carrier;
a second OIS coil secured to a second side of the OIS carrier substantially perpendicular to the first side;
A first OIS magnet fixed to the housing to face the first OIS coil;
a second OIS magnet fixed to the housing to face the second OIS coil;
a first portion disposed between the housing and a third side of the OIS carrier, which is the opposite side of the first side, and a first portion extending from the first portion and disposed between the housing and a fourth side of the OIS carrier, which is the opposite side of the second side. a frame including a second portion;
at least one first ball disposed between the first portion and the third side and enabling movement of the OIS carrier; and
comprising at least one second ball disposed between the second part and the housing, allowing movement of the frame and the OIS carrier;
The at least one first ball is arranged to move along the inside of the at least one first guide groove formed in the first portion as the OIS carrier rotates.
Electronic devices. In claim 14,
Further comprising at least one of a second camera module or a third camera module,
Electronic devices. In claim 15,
It includes a plate on which at least one of a first camera module, a second camera module, or a third camera module is disposed,
The first camera module has a first height from the plate,
The second camera module has a second height greater than the first height from the plate,
When the OIS carrier rotates about an axis perpendicular to the optical axis, the camera module has a third height greater than the first height,
the third height is less than or substantially equal to the second height,
Electronic devices. In claim 14,
The first part includes at least one second guide groove facing the at least one first guide groove with respect to the rotation axis of the OIS carrier,
Electronic devices. In claim 14,
A first portion of the frame includes at least one first magnet, a second portion of the frame includes at least one second magnet, and
The third side includes at least one first yoke facing at least one first magnet,
The inner surface of the housing facing the second portion includes at least one second yoke facing at least one second magnet,
Electronic devices. In claim 14,
The first portion of the frame includes at least one first convex portion formed convexly on an outer surface facing the housing,
The second portion of the frame includes at least one second convex portion formed convexly on the inner side facing the fourth side of the OIS carrier,
Electronic devices. In claim 14,
The third side includes at least one first protrusion protruding in a direction toward the first portion of the frame,
The first portion of the frame includes at least one first receiving groove receiving at least one first protrusion,
The at least one first protrusion is arranged to move along the at least one first receiving groove as the OIS carrier rotates,
The inner surface of the housing facing the second portion of the frame includes at least one second protrusion protruding in a direction toward the second portion of the frame,
The second portion of the frame includes at least one second receiving groove receiving at least one second protrusion,
The at least one second protrusion is arranged to move along the at least one second receiving groove as the OIS carrier rotates.
Electronic devices.

Images