KR20240011584A - Electronic device including flexible printed circuit boards superimposed on each other - Google Patents

Abstract

The electronic device includes a housing, a first printed circuit board disposed within the housing next to a first edge of the housing, and a second printed circuit board disposed within the housing next to a second edge facing the first edge. a substrate, a first flexible printed circuit board connecting the first printed circuit board and the second printed circuit board, and an aperture and a conductive pattern configured to transmit or receive a wireless communication signal, within the housing, and a second flexible printed circuit board partially overlapping the first flexible printed circuit board. The first flexible printed circuit board extends from the first printed circuit board through the opening of the second flexible printed circuit board to the second printed circuit board. In addition to this, various embodiments may be possible.

Description

Electronic device comprising flexible printed circuit boards overlapped with each other {ELECTRONIC DEVICE INCLUDING FLEXIBLE PRINTED CIRCUIT BOARDS SUPERIMPOSED ON EACH OTHER}

This disclosure relates to an electronic device comprising flexible printed circuit boards overlapped with each other.

The electronic device may include an antenna for wireless communication. For example, an electronic device may include a conductive pattern configured to transmit and/or receive wireless communication signals via a magnetic field. The conductive pattern may be disposed on a flexible printed circuit board. The electronic device may include a plurality of shielding sheets to shield the magnetic field generated by the antenna and induce concentration of the magnetic field.

An electronic device according to an embodiment may include a housing, a first printed circuit board, a second printed circuit board, a first flexible printed circuit board, and a second flexible printed circuit board.

According to one embodiment, a display may be disposed on one side of the housing. The first printed circuit board may be disposed within the housing next to a first edge of the housing. The second printed circuit board may be disposed within the housing next to a second edge facing the first edge. The first flexible printed circuit board may connect the first printed circuit board and the second printed circuit board. The second flexible printed circuit board may include an opening and a conductive pattern. The conductive pattern may surround the edge of the opening. The conductive pattern may be configured to transmit or receive a wireless communication signal in a designated frequency band. The second flexible printed circuit board may partially overlap the first flexible printed circuit board within the housing. The first flexible printed circuit board may extend from the first printed circuit board through the opening of the second flexible printed circuit board to the second printed circuit board.

An electronic device according to an embodiment may include a housing, a first printed circuit board, a second printed circuit board, a first flexible printed circuit board, and a second flexible printed circuit board.

According to one embodiment, a display may be disposed on one side of the housing. The first printed circuit board may be disposed within the housing next to a first edge of the housing. The second printed circuit board may be disposed within the housing next to a second edge facing the first edge. The first flexible printed circuit board may include a conductive layer, a non-conductive layer, a first shielding sheet, and a second shielding sheet. The non-conductive layer may surround the conductive layer. The first shielding sheet may be disposed on one side of the non-conductive layer facing the display. The second shielding sheet may be disposed on the other side of the non-conductive layer opposite to the one side of the non-conductive layer. The second flexible printed circuit board may include an opening, a conductive pattern, and a third shielding sheet. The conductive pattern may surround the edge of the opening. The conductive pattern may be configured to transmit or receive a wireless communication signal in a designated frequency band. The third shielding sheet may be disposed on the conductive pattern within the housing to face the display. The second flexible printed circuit board may partially overlap the first flexible printed circuit board within the housing. The conductive pattern transmits the wireless communication signal through a magnetic field induced by the first shielding sheet and the second shielding sheet in an area of the second flexible printed circuit board that overlaps the first flexible printed circuit board. It can be configured to transmit or receive.

1 is a block diagram of an electronic device in a network environment according to an embodiment.
2 is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device, according to one embodiment.
3A shows an example electronic device.
3B is a side view of an example electronic device.
FIG. 4 illustrates an exemplary magnetic field formed by a first flexible printed circuit board and a second flexible printed circuit board.
FIG. 5 is a cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 3A.
FIG. 6 is a cross-sectional view of an exemplary electronic device taken along line B-B' of FIG. 3A.
7 shows an exemplary first flexible printed circuit board and a second flexible printed circuit board.
FIG. 8A is a diagram showing an xy-axis coordinate system in an exemplary electronic device.
Figure 8b shows the wireless communication performance of the conductive pattern according to the xy-axis distance of Figure 8a.

1 is a block diagram of an electronic device in a network environment, according to one embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to one embodiment, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

2 is a block diagram of a wireless communication module, a power management module, and an antenna module of an electronic device, according to one embodiment.

Referring to FIG. 2 , the wireless communication module 192 may include an MST communication module 210 or an NFC communication module 230, and the power management module 188 may include a wireless charging module 250. In this case, the antenna module 297 is connected to the MST antenna 297-1 connected to the MST communication module 210, the NFC antenna 297-3 connected to the NFC communication module 230, and the wireless charging module 250. It may include a plurality of antennas including a wireless charging antenna 297-5. For convenience of explanation, components that overlap with those of FIG. 1 are omitted or briefly described.

The MST communication module 210 receives a signal including control information or payment information such as card information from the processor 120, and generates a magnetic signal corresponding to the received signal through the MST antenna 297-1. Afterwards, the generated magnetic signal can be transmitted to an external electronic device 102 (eg, POS device). To generate the magnetic signal, according to one embodiment, the MST communication module 210 includes a switching module (not shown) including one or more switches connected to the MST antenna 297-1, and this switching module By controlling, the direction of voltage or current supplied to the MST antenna 297-1 can be changed according to the received signal. Changing the direction of the voltage or current allows the direction of a magnetic signal (eg, magnetic field) transmitted through the MST antenna 297-1 to change accordingly. When a magnetic signal whose direction is changed is detected by the external electronic device 102, the magnetic card corresponding to the received signal (e.g., card information) is read by the card reader of the electronic device 102 ( swept) can cause similar effects (e.g. waveforms) to generated magnetic fields. According to one embodiment, the payment-related information and control signal received in the form of the magnetic signal in the electronic device 102 are, for example, sent to an external server 108 (e.g., payment server) through the network 199. It can be sent to .

The NFC communication module 230 acquires a signal including control information or payment information such as card information from the processor 120, and transmits the acquired signal to the external electronic device 102 through the NFC antenna 297-3. It can be sent to . According to one embodiment, the NFC communication module 230 may receive such a signal transmitted from the external electronic device 102 through the NFC antenna 297-3.

The wireless charging module 250 wirelessly transmits power to an external electronic device 102 (e.g., a mobile phone or a wearable device) through the wireless charging antenna 297-5, or wirelessly transmits power to an external electronic device 102 (e.g., a mobile phone or wearable device). : Wireless charging device) can receive power wirelessly. The wireless charging module 250 may support one or more of various wireless charging methods, including, for example, a magnetic resonance method or a magnetic induction method.

According to one embodiment, some antennas among the MST antenna 297-1, the NFC antenna 297-3, or the wireless charging antenna 297-5 may share at least a portion of the radiating portion with each other. For example, the radiating part of the MST antenna 297-1 can be used as the radiating part of the NFC antenna 297-3 or the wireless charging antenna 297-5, and vice versa. In this case, the antenna module 297 is connected to the wireless communication module 192 (e.g., MST communication module 210 or NFC communication module 230) or the power management module 188 (e.g., wireless charging module 250). It may include a switching circuit (not shown) set to selectively connect (e.g., close) or disconnect (e.g., open) at least some of the antennas (297-1, 297-3, or 297-3) according to control. there is. For example, when the electronic device 101 uses a wireless charging function, the NFC communication module 230 or the wireless charging module 250 controls the switching circuit to connect the NFC antenna 297-3 and the wireless charging antenna ( At least some areas of the radiating unit shared by 297-5) can be temporarily separated from the NFC antenna 297-3 and connected to the wireless charging antenna 297-5.

According to one embodiment, at least one function of the MST communication module 210, the NFC communication module 230, or the wireless charging module 250 may be controlled by an external processor (e.g., processor 120). . According to one embodiment, designated functions (eg, payment functions) of the MST communication module 210 or the NFC communication module 230 may be performed in a trusted execution environment (TEE). A trusted execution environment (TEE) according to various embodiments may, for example, be used to perform functions that require a relatively high level of security (e.g., financial transactions, or privacy-related functions) of the memory 130. It is possible to form an execution environment in which at least some designated areas are allocated. In this case, access to the designated area may be permitted on a limited basis, for example, depending on the subject accessing it or the application running in the trusted execution environment.

3A shows an example electronic device. 3B is a side view of an example electronic device.

3A and 3B, the electronic device 101 according to one embodiment includes a housing 300, a first printed circuit board 310, a second printed circuit board 320, and a first printed circuit board 310. It may include one flexible printed circuit board (flexible printed circuit boards) 400, and a second flexible printed circuit board (500).

According to one embodiment, the housing 300 may form the exterior of the electronic device 101. For example, the housing 300 includes a first plate 303 forming the front, a second plate 304 forming the back, and a side disposed between the first plate 303 and the second plate 304. It may include a bezel member (not shown). According to one embodiment, the first plate 303 may support the display 161.

The electronic device 101 according to one embodiment may include at least one printed circuit board 310 and 320. At least one printed circuit board 310 or 320 may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. At least one printed circuit board (310, 320) provides electrical connections between the printed circuit board and/or various electronic components disposed outside the printed circuit board using wires and conductive vias formed in the conductive layer. can do.

According to one embodiment, the at least one printed circuit board 310 and 320 may include a first printed circuit board 310 and a second printed circuit board 320. The first printed circuit board 310 and the second printed circuit board 320 may be spaced apart from each other within the housing 300 . According to one embodiment, the first printed circuit board 310 may be disposed next to the first edge 305 of the housing 300. The second printed circuit board 320 may be placed next to the second edge 306 facing the first edge 305 . Referring to FIG. 3A , the first printed circuit board 310 may be adjacent to the first edge 305 of the housing 300 in the +y direction. The second printed circuit board 320 may be adjacent to the second edge 306 of the housing 300 in the -y direction. However, it is not limited to this. Various electronic components may be placed in the space between the first printed circuit board 310 and the second printed circuit board 320. For example, the battery 189 may be disposed between the first printed circuit board 310 and the second printed circuit board 320.

According to one embodiment, the first flexible printed circuit board 400 may connect the first printed circuit board 310 and the second printed circuit board 320. For example, the first flexible printed circuit board 400 may be configured to transmit an electrical signal from the first printed circuit board 310 to the second printed circuit board 320. For example, the first flexible printed circuit board 400 electrically connects various electronic components disposed on the first printed circuit board 310 and various electronic components disposed on the second printed circuit board 320. You can. The first flexible printed circuit board 400 includes a first printed circuit board 310 and a second printed circuit board ( 320) can be disposed across. For example, one end of the first flexible printed circuit board 400 may be connected to the first printed circuit board 310. The other end of the first flexible printed circuit board 400 may be connected to the second printed circuit board 320 . The first flexible printed circuit board 400 may extend from one end connected to the first printed circuit board 310 to the other end connected to the second printed circuit board 320 . Referring to FIGS. 3A and 3B , the first flexible printed circuit board 400 may extend along the y-axis within the housing 300 . However, it is not limited to this.

According to one embodiment, the second flexible printed circuit board 500 may include a conductive pattern 520 configured to transmit and/or receive a wireless communication signal in a designated frequency band. According to one embodiment, the conductive pattern 520 may include an antenna configured to transmit and/or receive a short-range wireless communication signal. For example, the conductive pattern 520 is a magnetic secure transmission (MST) antenna (e.g., the MST antenna 297 in FIG. 2) electrically connected to an MST communication module (e.g., the MST communication module 210 in FIG. 2). 1)), an NFC antenna (e.g., NFC antenna 297-3 in FIG. 2) electrically connected to an NFC communication module (e.g., NFC (near field communication) communication module 230 in FIG. 2), and a wireless charging module It may include at least one of a wireless power consortium (WPC) antenna (e.g., the wireless charging antenna 297-5 of FIG. 2) electrically connected to (e.g., the wireless charging module 250 of FIG. 2).

According to one embodiment, the second flexible printed circuit board 500 may include a connection portion 530 connected to the first printed circuit board 310. The second flexible printed circuit board 500 may be electrically connected to the first printed circuit board 310 through a connection portion 530. For example, the conductive pattern 520 may be configured to receive a signal including payment information from the processor 120 disposed on the first printed circuit board 310.

Referring to FIG. 3A , the second flexible printed circuit board 500 may include an opening 510 . The conductive pattern 520 may surround the edge of the opening 510. The opening 510 may be concentric with the shape of the conductive pattern 520 . For example, the conductive pattern 520 may be a loop antenna that forms a plurality of loops concentric with the opening 510. The conductive pattern 520 may be arranged to form a plurality of loops with the opening 510 in the center. The conductive pattern 520 may be configured to transmit and/or receive a wireless communication signal using a magnetic signal (eg, magnetic field) formed by the loop pattern.

According to one embodiment, the second flexible printed circuit board 500 may partially overlap the first flexible printed circuit board 400 within the housing 300. The second flexible printed circuit board 500 may be in contact with the first flexible printed circuit board 400 in an area that overlaps the first flexible printed circuit board 400 . 3A and 3B, the first flexible printed circuit board 400 passes through the opening 510 of the second flexible printed circuit board 500 from the first printed circuit board 310 to the second flexible printed circuit board 400. It may extend to the printed circuit board 500. According to one embodiment, the first flexible printed circuit board 400 extends through the opening 510, so that the second flexible printed circuit board 500 is partially connected to the first flexible printed circuit board 400. May overlap. For example, the electronic device 101 may include a first overlapping area A1 and a second overlapping area A2 that overlap the second flexible printed circuit board 500 . The first overlapping area A1 may refer to an area where the first flexible printed circuit board 400 directly or indirectly contacts one surface of the second flexible printed circuit board 500. The second overlapping area A2 may refer to an area where the first flexible printed circuit board 400 directly or indirectly contacts the other side opposite to one side of the second flexible printed circuit board 500. You can. However, it is not limited to this.

According to one embodiment, when using the penetrating structure, within the second housing 300, the space occupied by the first flexible printed circuit board 400 and the space occupied by the second flexible printed circuit board 500 can be reduced. The first flexible printed circuit board 400 and the second flexible printed circuit board 500 partially overlap within the housing 300, so that the first flexible printed circuit board 400 and the second flexible printed circuit board 500 The space it occupies within the housing 300 can be reduced. For example, when the first flexible printed circuit board 400 and the second flexible printed circuit board 500 do not overlap each other and are spaced apart, the first flexible printed circuit board 400 and the second flexible printed circuit board 500 ) Space may be required to place each. According to one embodiment, the space within the housing 300 occupied by the first flexible printed circuit board 400 and the space within the housing 300 occupied by the second flexible printed circuit board 500 overlap each other, thereby forming the first The space for arranging the flexible printed circuit board 400 and the second flexible printed circuit board 500 can be reduced. According to one embodiment, the space for arranging the first flexible printed circuit board 400 and the second flexible printed circuit board 500 is reduced, thereby securing space for mounting other electronic components in the housing 300. You can.

The electronic device 101 according to one embodiment may further include a battery 189. The battery 189 may supply power to at least one component of the electronic device 101. At least a portion of the battery 189 may be disposed on substantially the same plane as the first printed circuit board 310 and/or the second printed circuit board 320 .

According to one embodiment, the battery 189 may be disposed between the first printed circuit board 310 and the second printed circuit board 320. Referring to FIG. 3A , the first printed circuit board 310 may be placed next to the first edge 305 . The second printed circuit board 320 may be placed next to the second edge 306 facing the first edge 305 . The battery 189 may occupy the space between the first printed circuit board 310 and the second printed circuit board 320 .

According to one embodiment, the housing 300 includes a first plate 303 forming one side 301 of the housing 300 and a second plate 304 forming the other side 302 of the housing 300. ) may include. The display 161 may be disposed on one side 301 of the housing 300. The first plate 303 may support the display 161. At least one component of the electronic device 101 may be disposed in the space formed between the first plate 303 and the second plate 304. According to one embodiment, in the space formed between the first plate 303 and the second plate 304, a first printed circuit board 310, a second printed circuit board 320, and a first flexible printed circuit board 400, a second flexible printed circuit board 500, and a battery 189 may be disposed. Referring to FIG. 3B, the second flexible printed circuit board 500 may be disposed between the battery 189 and the other side 302 of the housing 300 facing one side 301 of the housing 300. there is. For example, the display 161 may be arranged in the +z direction with respect to the battery 189. The second flexible printed circuit board 500 may be disposed in the -z direction with respect to the battery 189. The second flexible printed circuit board 500 may overlap a portion of the battery 189 . By disposing the second flexible printed circuit board 500 on the battery 189, space for arrangement of components of the electronic device 101 can be secured in the limited internal space of the housing 300.

4 illustrates an exemplary magnetic field formed by a first flexible printed circuit board and a second flexible printed circuit board.

Referring to FIG. 4 , the first flexible printed circuit board 400 may pass through the opening 510 of the second flexible printed circuit board 500 . The first flexible printed circuit board 400 includes a first printed circuit board 310 (e.g., the first printed circuit board 310 in FIG. 3A) and a second printed circuit board 320 (e.g., the first printed circuit board 310 in FIG. 3A). In order to electrically connect the two printed circuit boards 320, the first printed circuit board 310 and the second printed circuit board 320 may have a length in a direction in which they are spaced apart. For example, when the first printed circuit board 310 and the second printed circuit board 320 are spaced apart from each other in the y-axis direction within a housing (e.g., the housing 300 in FIG. 3A), the first flexible The printed circuit board 400 may have a length in the y-axis direction.

According to one embodiment, the conductive pattern 520 may be configured to transmit and/or receive a wireless communication signal through a magnetic field. The conductive pattern 520 may be disposed on both sides of the second flexible printed circuit board 500 through conductive vias (eg, conductive vias 550 in FIG. 6). Referring to FIG. 4, the conductive pattern 520 is shown penetrating the base board of the second flexible printed circuit board 500 at about 1/2 of the second flexible printed circuit board 500 in the y-axis direction. However, it is not limited to this. The location and number of conductive vias may vary.

According to one embodiment, the second flexible printed circuit board 500 is an MST antenna (e.g., of FIG. 2) configured to transmit and/or receive a wireless communication signal at low power in a short distance through a magnetic signal (e.g., a magnetic field). It may include an MST antenna (297-1). For example, the MST communication module (e.g., MST communication module 210 of FIG. 2) may receive a signal including payment information from a processor (e.g., processor 120 of FIG. 1). The MST communication module 210 may generate a magnetic field corresponding to the signal received through the conductive pattern 520. For example, the MST communication module 210 may apply current or voltage to the conductive pattern 520. The conductive pattern 520 can form a magnetic field corresponding to the payment information based on the current or voltage applied from the MST communication module 210. The magnetic field may be formed in at least a partial area of the housing 300. An external electronic device that is distinct from an electronic device (e.g., the electronic device 101 of FIG. 3A) may detect the magnetic field formed in at least a portion of the housing 300 when adjacent to the magnetic field. When a magnetic field is detected by an external electronic device (eg, a reader), the external electronic device can identify the information contained in the magnetic field through an electromagnetic induction phenomenon. The external electronic device may transmit a request for payment to an external server (eg, payment server) based on the identified information.

According to one embodiment, the wireless communication performance of the conductive pattern 520 may be based on the range of the magnetic field formed by the conductive pattern 520. Wireless communication performance may refer to the degree to which wireless communication signals are smoothly recognized throughout the entire area of the housing 300 when the conductive pattern 520 operates as an antenna. For example, when the range of the magnetic field formed by the conductive pattern 520 is relatively narrow, an external electronic device may wirelessly communicate within a narrow range centered on the location where the conductive pattern 520 is placed within the housing 300. Signals can be recognized. In the case described above, when an external electronic device (eg, a reader) is located within the narrow range, a wireless communication signal can be recognized. In the case described above, when an external electronic device is located within the narrow range, a wireless communication signal transmitted from the conductive pattern 520 can be recognized. Since the external electronic device is required to be located within a relatively narrow range from the location of the conductive pattern 520 in the housing 300, the wireless communication performance of the electronic device 101 may be low. For example, when the range of the magnetic field formed by the conductive pattern 520 is relatively wide, the external electronic device can wirelessly operate within a wide range, centered on the position where the conductive pattern 520 is placed within the housing 300. Communication signals can be recognized. In the case described above, when an external electronic device is located within the wide range, a wireless communication signal can be recognized. Even if an external electronic device is located within a relatively wide range from the location of the conductive pattern 520 in the housing 300, the wireless communication signal can be recognized, so the wireless communication performance of the electronic device 101 can be improved.

Referring to FIG. 4 , the conductive pattern 520 may form a magnetic field through the first flexible printed circuit board 400 penetrating the opening 510 of the second flexible printed circuit board 500 . For example, the first flexible printed circuit board 400 penetrating the opening 510 may operate as a core for the conductive pattern 520 surrounding the opening 510. The magnetic field formed by the conductive pattern 520 may be provided along the first flexible printed circuit board 400. Since the first flexible printed circuit board 400 may have a length in the direction in which the first printed circuit board 310 and the second printed circuit board 320 are spaced apart (e.g., the y-axis direction), the conductive pattern 520 The magnetic field formed by ) may be formed along the extending direction of the first flexible printed circuit board 400. For example, when the first flexible printed circuit board 400 has a length with respect to the y-axis, the magnetic field formed by the conductive pattern 520 may extend in the y-axis direction.

According to one embodiment, the first printed circuit board 310 and the second printed circuit board 320 may be spaced apart from each other in the direction in which the housing 300 extends (eg, the y-axis direction). The first flexible printed circuit board 400 for connecting the first printed circuit board 310 and the second printed circuit board 320 may extend in the direction in which the housing 300 extends (e.g., the y-axis direction). there is. When an electrical signal flows through the conductive pattern 520, the magnetic field formed by the conductive pattern 520 may be formed in the direction in which the first flexible printed circuit board 400 extends (eg, the y-axis direction). The magnetic field may be formed in a direction (eg, y-axis direction) in which the first flexible printed circuit board 400 extends from the position of the conductive pattern 520 in the housing 300. According to one embodiment, when an external electronic device is located within a range where a magnetic field is formed, it can receive information (eg, payment information) included in the magnetic field. Since the magnetic field may be formed in a direction (e.g., y-axis direction) in which the first flexible printed circuit board 400 extends from the position of the conductive pattern 520 in the housing 300, the electronic device according to an embodiment The wireless communication performance of 101 can be improved for this direction. For example, when the external electronic device is located in a magnetic field formed in a direction (e.g., y-axis direction) in which the first flexible printed circuit board 400 extends from the position of the conductive pattern 520 in the housing 300, Information contained in the magnetic field can be received. Since the range of the magnetic field formed along the first flexible printed circuit board 400 can cover the entire length of the housing 300, wireless communication performance can be improved with respect to the longitudinal direction of the housing 300. According to one embodiment, the wireless communication performance of the conductive pattern 520 can be improved along the direction in which the magnetic field extends.

FIG. 5 is a cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 3A. FIG. 6 is a cross-sectional view of an exemplary electronic device taken along line B-B' of FIG. 3A.

Referring to Figure 5, the first flexible printed circuit board 400 and the second flexible printed circuit board 500 are shielding sheets (e.g., first shielding sheet 410, second shielding sheet 420, third shielding sheet 410). It may include a shielding sheet 540). The shielding sheet may shield the magnetic field generated from the conductive pattern 520 and induce concentration of the magnetic field for transmission and/or reception of wireless communication signals.

The shielding sheet may be a layer or set containing a high permeability material capable of shielding magnetic fields. For example, the shielding sheet may include a conductive material (eg, metal, ferrite) and/or a carbon material (eg, graphite). The shielding sheet may be configured to block electromagnetic waves. According to one embodiment, the shielding sheet can reduce deterioration in radiation performance of the conductive pattern 520. For example, an electronic device (eg, the electronic device 101 of FIG. 3A) may include components containing metal. Antenna performance of the conductive pattern 520 may deteriorate due to eddy currents induced by surrounding metal materials. The shielding sheet can reduce radiation performance degradation caused by coupling between the conductive pattern 520 and the metal material. The shielding sheet may block electromagnetic interaction between wireless communication signals transmitted and received through the conductive pattern 520 and other components of the electronic device 101. The shielding sheet can induce the magnetic field for wireless communication to be concentrated in a certain area or direction.

Referring to FIG. 5, the first flexible printed circuit board 400 may include a conductive layer 401, a non-conductive layer 402, a first shielding sheet 410, and a second shielding sheet 420. there is. The non-conductive layer 402 may surround the conductive layer 401. For example, the non-conductive layer 402 may include a first non-conductive layer 402a and/or a second non-conductive layer 402b. A conductive layer 401 may be disposed on the first non-conductive layer 402a. A second non-conductive layer 402b may be disposed on the conductive layer 401. The non-conductive layer 402 may be a film made of polyimide. The conductive layer 401 is electrically connected to a first printed circuit board (e.g., first printed circuit board 310 in FIG. 3A) and/or a second printed circuit board (e.g., second printed circuit board 320). It can be connected to .

According to one embodiment, the first shielding sheet 410 may be disposed on one side 402-1 of the non-conductive layer 402. The second shielding sheet 420 may be disposed on the other side 402-2 of the non-conductive layer 402, which is opposite to the one side of the non-conductive layer 402. Referring to FIG. 5, the first shielding sheet 410 may be disposed on the first non-conductive layer 402a. The second shielding sheet 420 may be disposed on the second non-conductive layer 402b.

Referring to FIG. 5 , the second flexible printed circuit board 500 may include a third shielding sheet 540 . The third shielding sheet 540 may be disposed on the conductive pattern 520 within the housing 300 to face the display 161 . For example, the third shielding sheet 540 may be disposed to face (e.g., face the +z direction) the display (e.g., the display 161 of FIG. 3B) of the second flexible printed circuit board 500. You can.

According to one embodiment, the conductive pattern 520 is formed in an area of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400, the conductive pattern 520, and the first shielding sheet. (410), and may be configured to transmit and/or receive a wireless communication signal through a magnetic field induced in the second shielding sheet (420). Referring to FIG. 4, due to the first flexible printed circuit board 400 passing through the opening 510 of the second flexible printed circuit board 500, the magnetic field extends in the direction of the first flexible printed circuit board 400. It can be formed according to . According to one embodiment, within the housing 300, the partially overlapping first flexible printed circuit board 400 and the second flexible printed circuit board 500 include a conductive pattern 520 and a first shielding sheet 410. ), and may be configured to provide a magnetic field induced in the second shielding sheet 420 along the first flexible printed circuit board 400 from the conductive pattern 520. When a magnetic field is formed along the first flexible printed circuit board 400, the magnetic field may expand in the direction in which the first flexible printed circuit board 400 extends. According to one embodiment, wireless communication performance can be improved when the conductive pattern 520 operates as an antenna by expanding the magnetic field formed around the housing 300. For example, when the range of the magnetic field includes most of the area of the housing 300, short-distance wireless communication may be possible at any point of the housing 300 that is away from the conductive pattern 520. For example, during short-distance wireless communication, wireless communication can be performed by bringing an arbitrary point of the housing 300 adjacent to an external electronic device (eg, a reader).

Referring to FIG. 5, the first flexible printed circuit board 400 may include a first surface 400a and a second surface 400b facing each other. The first surface 400a is of the first flexible printed circuit board 400, within the housing 300, facing in a first direction (e.g., +z direction) toward the display (e.g., display 161 in FIG. 3B). It could be cotton. The second side 400b may refer to a side opposite to the first side 400a. The second surface 400b may be a surface of the first flexible printed circuit board 400 that faces a second direction (eg, -z direction) opposite to the first direction within the housing 300. The second flexible printed circuit board 500 may include a third surface 500a and a fourth surface 500b facing each other. The third surface 500a may be a surface of the second flexible printed circuit board 500 that faces the first direction (eg, +z direction) toward the display 161 within the housing 300 . The fourth side 500b may refer to a side opposite to the third side 500a. The fourth surface 500b may be a surface of the second flexible printed circuit board 500 that faces a second direction (eg, -z direction) opposite to the first direction within the housing 300.

Referring to FIGS. 5 and 6 , the conductive pattern 520 may include a first conductive pattern 520a and a second conductive pattern 520b. The first conductive pattern 520a may be disposed on the third surface 500a of the second flexible printed circuit board 500. The second conductive pattern 520b may be disposed on the fourth surface 500b of the second flexible printed circuit board 500. The first conductive pattern 520a and the second conductive pattern 520b may be connected to each other by penetrating the base substrate S of the second flexible printed circuit board 500. For example, the first conductive pattern 520a and the second conductive pattern 520b may be connected to each other through the conductive via 550 of the second flexible printed circuit board 500. Conductive vias 550 may be placed at various positions within the second flexible printed circuit board 500 for electrical connection between a plurality of layers of the second flexible printed circuit board 500 . For example, one or more conductive vias 550 may be arranged. Referring to FIG. 6, the conductive via 550 may be disposed in the center of the second flexible printed circuit board 500, but is not limited thereto. For example, the conductive via 550 may be placed in various positions within the second flexible printed circuit board 500, depending on the structure, purpose, and function of the second flexible printed circuit board 500.

The conductive pattern 520 may have a continuous loop shape due to the first conductive pattern 520a and the second conductive pattern 520b. The first conductive pattern 520a disposed on the third side 500a may be connected to the second conductive pattern 520b disposed on the fourth side 500b through a conductive via 550. The conductive pattern 520 may form a loop antenna in which half of the turns are repeatedly arranged alternately with the opening 510 at the center.

According to one embodiment, the first flexible printed circuit board 400 and the second flexible printed circuit board 500 have a plurality of overlapping areas (e.g., a first overlapping area A1, a second overlapping area A2). ) can be overlapped. According to one embodiment, the plurality of overlapping regions are the first surface 400a of the first flexible printed circuit board 400 and the fourth surface 500b of the second flexible printed circuit board 500 in contact with each other. Overlapping area A1, and a second overlapping area A2 where the second surface 400b of the first flexible printed circuit board 400 and the third surface 500a of the second flexible printed circuit board 500 are in contact with each other. may include. According to one embodiment, the first overlapping area may be a surface where the first surface 400a of the first flexible printed circuit board 400 and the fourth surface 500b of the second flexible printed circuit board 500 are in contact. . The second overlapping area may be a surface where the second surface 400b of the first flexible printed circuit board 400 and the third surface 500a of the second flexible printed circuit board 500 contact each other. However, it is not limited to this. The first overlapping area A1 may be closer to the second printed circuit board 320 among the first printed circuit board 310 and the second printed circuit board 320 . The second overlapping area A2 may be closer to the first printed circuit board 310 of the first printed circuit board 310 and the second printed circuit board 320 . The opening 510 may be disposed between the first overlapping area A1 and the second overlapping area A2.

The electronic device 101 according to one embodiment may further include an adhesive member 600 disposed in at least a portion of an area of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400. You can. For example, the adhesive member 600 may be disposed in the second area (A). However, it is not limited to this. The adhesive member 600 may provide rigidity to the second flexible printed circuit board 500 by attaching the second flexible printed circuit board 500 to the first flexible printed circuit board 400 . For example, the adhesive member 600 may be disposed in the second overlapping area A2. Referring to FIG. 5, the adhesive member 600 is disposed between the fourth side 500b of the second flexible printed circuit board 500 and the second side 400b of the first flexible printed circuit board 400. You can. According to one embodiment, the second flexible printed circuit board 500 is supported by the first flexible printed circuit board 400 by being attached to the first flexible printed circuit board 400 through an adhesive member 600. It can be. The position of the second flexible printed circuit board 500 can be fixed through the first flexible printed circuit board 400 attached through the adhesive member 600.

According to one embodiment, the second flexible printed circuit board 500 includes the first shielding sheet 410 and the second shielding sheet 420 of the first flexible printed circuit board 400 within a plurality of overlapping regions. You can share. The second flexible printed circuit board 500 shares the first shielding sheet 410 and the second shielding sheet 420, meaning that the second flexible printed circuit board 500 shares the first shielding sheet 410 and the second shielding sheet 420. ) This may mean shielding the magnetic field and inducing concentration of the magnetic field through the first shielding sheet 410 and the second shielding sheet 420, which are components of ). Within the plurality of overlapping areas, the third shielding sheet 540 may be substantially stacked with the first shielding sheet 410 and the second shielding sheet 420. The second flexible printed circuit board 500 uses the first shielding sheet 410 and the second shielding sheet 420, which are stacked with the third shielding sheet 540, to transmit and/or receive a wireless communication signal. A magnetic field can be formed for

According to one embodiment, within the first overlapping area A1, the second shielding sheet 420, the first shielding sheet 410, and the third shielding sheet 540 are aligned in a first direction (eg, + z direction) can be arranged sequentially. Within the first overlapping area A1, the second shielding sheet 420, the first shielding sheet 410, and the third shielding sheet 540 may be substantially stacked. According to one embodiment, within the second overlapping area A2, the third shielding sheet 540, the second shielding sheet 420, and the first shielding sheet 410 are sequentially arranged in the first direction. You can. Within the second overlapping area A2, the third shielding sheet 540, the second shielding sheet 420, and the first shielding sheet 410 may be substantially stacked.

In general, a flexible printed circuit board including the conductive pattern 520 may have a structure in which a plurality of shielding sheets are stacked to induce a magnetic field for wireless communication. When the conductive pattern 520 is composed of a plurality of patterns having a plurality of operating frequencies, a plurality of shielding sheets each made of a material having excellent magnetic permeability at a frequency corresponding to each operating frequency may be required. When a plurality of shielding sheets are stacked, the thickness of the second flexible printed circuit board 500 may become thick. When the thickness of the second flexible printed circuit board 500 increases, the space occupied by the second flexible printed circuit board 500 may increase in the limited space within the housing 300. If the space occupied by the second flexible printed circuit board 500 increases, the space for various components disposed in the housing 300 may become insufficient.

According to one embodiment, the second flexible printed circuit board 500 may include one shielding sheet (eg, the third shielding sheet 540). The thickness of the second flexible printed circuit board 500 including one shielding sheet may be thinner than the thickness of another flexible printed circuit board having a structure in which a plurality of shielding sheets are stacked. According to one embodiment, the first flexible printed circuit board 400 and the second flexible printed circuit board 500 may partially overlap each other. The second flexible printed circuit board 500 has a plurality of areas overlapping with the first flexible printed circuit board 400 (e.g., a first overlapping area A1 and a second overlapping area A2). A plurality of shielding sheets of the flexible printed circuit board 400 may be shared. Even if the second flexible printed circuit board 500 has only one shielding sheet, a plurality of shielding sheets of the first flexible printed circuit board 400 can be used, thereby forming a structure in which a plurality of shielding sheets are substantially stacked. It can be.

According to one embodiment, the second flexible printed circuit board 500 has a relatively thin thickness, so the space it occupies within the housing 300 can be reduced. Because the space occupied by the second flexible printed circuit board 500 within the housing 300 is reduced, the electronic device 101 according to one embodiment may include other components (e.g., a camera, a battery 189, You can secure space to place speakers and audio). According to one embodiment, the second flexible printed circuit board 500 includes a plurality of shielding sheets (e.g., a first shielding sheet 410, a second shielding sheet 420) of the first flexible printed circuit board 400. ) can be used to form a magnetic field, so wireless communication can be performed smoothly.

7 shows an exemplary first flexible printed circuit board and a second flexible printed circuit board.

Referring to FIG. 7, the first flexible printed circuit board 400 has a first connector 430 connected to the first printed circuit board 310 and a second connector connected to the second printed circuit board 320 ( 440) may be included. The second flexible printed circuit board 500 may include a connection portion 530 connected to the first printed circuit board 310 . According to one embodiment, the conductive pattern 520 may extend from the conductive pattern 520 to a conductive layer in the first printed circuit board 310 within the connection portion 530 . For example, the processor disposed on the first printed circuit board 310, through the conductive pattern 520 connected to the conductive layer 401 of the first printed circuit board 310 within the connection portion 530, Signals related to the operation of 520 may be transmitted and/or received.

According to one embodiment, the connection part 530 may be electrically connected to the first printed circuit board 310 by being connected to the first connector 430. For example, the connection portion 530 may be detachably coupled to the first connector 430. The conductive pattern 520 may be electrically connected to the conductive layer in the first printed circuit board 310 through a connector. By connecting the connection part 530 to the first connector 430, the space occupied by the connection part 530 within the housing 300 can be reduced. According to one embodiment, the first connector 430 may include a connection member (eg, a socket) that is physically connected to the first printed circuit board 310. Since the first connector 430 is physically connected to the first printed circuit board 310, the connection portion 530 can be stably connected to the first printed circuit board 310 through the first connector 430. there is.

FIG. 8A is a diagram showing an x-y axis coordinate system in an exemplary electronic device. Figure 8b shows the wireless communication performance of the conductive pattern according to the x-y axis distance of Figure 8a.

Referring to FIG. 8A, the range of the magnetic field formed by the first flexible printed circuit board 400 and the second flexible printed circuit board 500 is such that the second flexible printed circuit board 400 covers a large area of the housing 300. The circuit board 500 may be disposed close to the center of the housing 300 within the housing 300 . The center of the housing 300 may mean an intersection between virtual lines connecting vertices of the housing 300.

To measure the wireless communication performance of the electronic device 101 according to one embodiment, an x-y coordinate system with the center as the origin is displayed in FIG. 8A. At a certain height of the housing 300 (e.g., 2 cm from one side of the housing 300), the wireless communication performance of the conductive pattern 520 according to the x-y axis distance was measured. Wireless communication performance was measured by whether a wireless signal was recognized at specific coordinates.

FIG. 8B indicates through O and “O” indicates that a wireless communication signal is recognized at that location. “X” indicates that no wireless communication signal is recognized at that location.

Referring to FIG. 8B, it can be seen that as the distance to the x-axis and/or the distance to the y-axis increases from the origin (0,0), the recognition rate of the wireless communication signal decreases. The above results can be interpreted as having the best wireless communication performance around the origin because the second flexible printed circuit board 500 is disposed close to the origin. The electronic device 101 according to one embodiment includes a first flexible printed circuit board 400 penetrating the opening 510 of the second flexible printed circuit board 500, thereby forming a first flexible printed circuit board 400 extending in the y-axis. Along the printed circuit board 400, a magnetic field may be formed. Referring to FIG. 8B, it can be confirmed that there is a range in which a wireless communication signal can be recognized even if the length increases along the y-axis from the origin. For example, at points 8cm away from the x-axis in the +y direction, there may be a certain range in which wireless communication signals can be recognized. The electronic device 101 according to one embodiment has radiation performance in the y-axis as the first flexible printed circuit board 400 operates as a core with respect to the conductive pattern 520 of the second flexible printed circuit board 500. This can be improved. Based on the improvement in radiation performance, the recognition range of wireless communication signals can be increased. The electronic device 101 according to one embodiment may transmit and/or receive a wireless communication signal even if the non-contact distance from the external electronic device is long.

One embodiment of the present disclosure aims to secure mounting space within the housing and expand the range of the magnetic field by overlapping flexible printed circuit boards disposed within the housing. However, the purpose of the present disclosure is not limited to the content described above. An electronic device (e.g., the electronic device 101 in FIG. 3A) according to an embodiment includes a housing (e.g., the housing 300 in FIG. 3a) and a first printed circuit board (e.g., the first printed circuit board in FIG. 3a). (310)), a second printed circuit board (e.g., second printed circuit board 320 in FIG. 3A), a first flexible printed circuit board (e.g., first flexible printed circuit board 400 in FIG. 3A), and It may include a second flexible printed circuit board (eg, the second flexible printed circuit board 500 of FIG. 3A). According to one embodiment, a display (eg, display 161 in FIG. 3B) may be disposed on one side of the housing. The first printed circuit board may be positioned within the housing next to a first edge of the housing (eg, first edge 305 in FIG. 3A). The second printed circuit board may be positioned within the housing next to a second edge (eg, second edge 306 in FIG. 3A) facing the first edge. The first flexible printed circuit board may connect the first printed circuit board and the second printed circuit board. The second flexible printed circuit board may include an opening (eg, opening 510 in FIG. 3A) and a conductive pattern (eg, conductive pattern 520 in FIG. 3A). The conductive pattern may surround the edge of the opening. The conductive pattern may be configured to transmit or receive a wireless communication signal in a designated frequency band. The second flexible printed circuit board may partially overlap the first flexible printed circuit board within the housing. The first flexible printed circuit board may extend from the first printed circuit board through the opening of the second flexible printed circuit board to the second printed circuit board. According to one embodiment of the present disclosure, the first flexible printed circuit board and the second flexible printed circuit board partially overlap, so that, within the housing, the space occupied by the first flexible printed circuit board and the second flexible printed circuit board can be reduced.

According to one embodiment, the first flexible printed circuit board includes a conductive layer (e.g., conductive layer 401 in FIG. 5), a non-conductive layer (e.g., non-conductive layer 402 in FIG. 5), and a first shield. It may include a sheet (e.g., the first shielding sheet 410 of FIG. 5), and a second shielding sheet (e.g., the second shielding sheet 420 of FIG. 5). The non-conductive layer may surround the conductive layer. The first shielding sheet may be disposed on one side of the non-conductive layer (eg, one side 402-1 in FIG. 5). The second shielding sheet may be disposed on the other side of the non-conductive layer (eg, the other side 402-2 in FIG. 5), which is opposite to the one side of the non-conductive layer. The second flexible printed circuit board may include a third shielding sheet (eg, the third shielding sheet 540 of FIG. 5). The third shielding sheet may be disposed on the conductive pattern within the housing to face the display. The conductive pattern is formed within a region of the second flexible printed circuit board that overlaps the first flexible printed circuit board, through a magnetic field induced by the conductive pattern, the first shielding sheet, and the second shielding sheet. , may be configured to transmit or receive the wireless communication signal.

According to one embodiment, the first flexible printed circuit board and the second flexible printed circuit board may provide the magnetic field from the conductive pattern along the first flexible printed circuit board.

According to one embodiment of the present disclosure, the first flexible printed circuit board penetrates the second flexible printed circuit board, so that a magnetic field for wireless communication may be formed along the first flexible printed circuit board. According to one embodiment, the magnetic field can be formed widely in the direction in which the first flexible printed circuit board extends, so the range in which wireless communication signals can be recognized can be increased.

According to one embodiment, the first shielding sheet, the second shielding sheet, and the third shielding sheet may include at least one of a conductive material or a carbon material. According to an embodiment of the present disclosure, the first shielding sheet, the second shielding sheet, and the third shielding sheet may be configured to shield the magnetic field generated from the conductive pattern and induce concentration of the magnetic field.

The electronic device according to one embodiment may further include a first overlapping area (e.g., the first overlapping area A1 in FIG. 3A) and a second overlapping area (e.g., the second overlapping area A2 in FIG. 3A). You can. In the first overlapping area, a first surface of the first flexible printed circuit board (e.g., first surface 400a of FIG. 5 ) facing in a first direction toward the display and, within the housing, in the first direction. The fourth side of the second flexible printed circuit board (eg, the fourth side 500b of FIG. 5 ) facing in the second direction opposite to may be in contact with each other. In the second overlap region, a second side of the first flexible printed circuit board (e.g., second side 400b in FIG. 5) opposite the first side and the second flexible side opposite the fourth side. The third side of the printed circuit board (eg, the third side 500a of FIG. 5) may be in contact.

According to one embodiment, the opening may be disposed between the first overlapping area and the second overlapping area.

According to one embodiment, within the first overlapping area, the second shielding sheet, the first shielding sheet, and the third shielding sheet may be sequentially arranged in the first direction. Within the second overlapping area, the third shielding sheet, the second shielding sheet, and the first shielding sheet may be sequentially arranged in the first direction. According to one embodiment of the present disclosure, the second flexible printed circuit board may be configured to communicate wirelessly using at least one shielding sheet disposed on the first flexible printed circuit board. According to one embodiment, even if the second flexible printed circuit board does not include a plurality of shielding sheets stacked on top of each other, at least one shielding sheet of the first flexible printed circuit board in an area overlapping with the first flexible printed circuit board. can be used. According to one embodiment, the thickness of the second flexible printed circuit board may be reduced, thereby securing space within the housing.

According to one embodiment, the first flexible printed circuit board includes a first connector (e.g., the first connector 430 in FIG. 7) and a second connector (e.g., the second connector 440 in FIG. 7). can do. The first connector may be connected to the first printed circuit board. The second connector may be connected to the second printed circuit board. The second flexible printed circuit board may include a connection part (eg, connection part 530 in FIG. 7) connected to the first printed circuit board.

According to one embodiment, the conductive pattern may extend from the conductive pattern to a conductive layer in the first printed circuit board within the connection portion.

According to one embodiment, the connection part may be electrically connected to the first printed circuit board by being connected to the first connector. According to an embodiment of the present disclosure, the connection portion of the second flexible printed circuit board and the connector of the first flexible printed circuit board are connected to each other, thereby reducing the space occupied by the connection portion. The connection part can be stably connected to the printed circuit board by being connected to a connector, which is a physical connection member (eg, a socket).

The electronic device according to one embodiment may further include an adhesive member (eg, the adhesive member 600 of FIG. 5). The adhesive member may be disposed in at least a portion of an area of the second flexible printed circuit board that overlaps the first flexible printed circuit board. The second flexible printed circuit board may be supported by the first flexible printed circuit board by being attached to the first flexible printed circuit board through the adhesive member. According to one embodiment of the present disclosure, in at least a portion of the area where the second flexible printed circuit board overlaps the first flexible printed circuit board, the adhesive member connects the first flexible printed circuit board and the second flexible printed circuit board. You can do it. The adhesive member may provide rigidity to the second flexible printed circuit board by supporting the second flexible printed circuit board.

According to one embodiment, the opening may be concentric with the shape of the conductive pattern. According to one embodiment of the present disclosure, the conductive pattern of the second flexible printed circuit board may be a loop antenna.

According to one embodiment, the conductive pattern may include a first conductive pattern and a second conductive pattern. The first conductive pattern may be disposed on a third side of the second flexible printed circuit board. The second conductive pattern may be disposed on the fourth side of the second flexible printed circuit board, which is opposite to the third side. The first conductive pattern and the second conductive pattern may be connected to each other through a conductive via (eg, conductive via 550 in FIG. 6) of the second flexible printed circuit board. According to an embodiment of the present disclosure, the conductive pattern may be composed of a plurality of antenna patterns stacked on top of each other.

The electronic device according to one embodiment may further include a battery (eg, battery 189 in FIG. 3A). The battery may be disposed between the first printed circuit board and the second printed circuit board. The second flexible printed circuit board may be disposed between the battery and the other side of the housing facing the one side of the housing. According to one embodiment of the present disclosure, the second flexible printed circuit board may be disposed on the battery. The second flexible printed circuit board can reduce the space it occupies within the housing by at least partially overlapping the battery.

According to one embodiment, the conductive pattern is a magnetic secure transmission (MST) antenna (e.g., MST antenna 297-1 in FIG. 2), a near field communication (NFC) antenna (e.g., NFC antenna 297 in FIG. 2), -3)), and a wireless power consortium (WPC) antenna (e.g., the wireless charging antenna 297-5 of FIG. 2). According to an embodiment of the present disclosure, the conductive pattern may be an antenna for short-range wireless communication.

An electronic device (e.g., the electronic device 101 in FIG. 3A) according to an embodiment includes a housing (e.g., the housing 300 in FIG. 3a) and a first printed circuit board (e.g., the first printed circuit board in FIG. 3a). (310)), a second printed circuit board (e.g., second printed circuit board 320 in FIG. 3A), a first flexible printed circuit board (e.g., first flexible printed circuit board 400 in FIG. 3A), and It may include a second flexible printed circuit board (eg, the second flexible printed circuit board 500 of FIG. 3A). According to one embodiment, a display (eg, display 161 in FIG. 3B) may be disposed on one side of the housing. The first printed circuit board may be positioned within the housing next to a first edge of the housing (eg, first edge 305 in FIG. 3A). The second printed circuit board may be positioned within the housing next to a second edge (eg, second edge 306 in FIG. 3A) facing the first edge. The first flexible printed circuit board includes a conductive layer (e.g., conductive layer 401 in FIG. 5), a non-conductive layer (e.g., non-conductive layer 402 in FIG. 5), and a first shielding sheet (e.g., FIG. 5). It may include a first shielding sheet 410), and a second shielding sheet (eg, the second shielding sheet 420 of FIG. 5). The non-conductive layer may surround the conductive layer. The first shielding sheet may be disposed on one side of the non-conductive layer (eg, one side 402-1 in FIG. 5) facing the display. The second shielding sheet may be disposed on the other side of the non-conductive layer (eg, the other side 402-2 in FIG. 5), which is opposite to the one side of the non-conductive layer. The second flexible printed circuit board includes an opening (e.g., opening 510 in FIG. 3A), a conductive pattern (e.g., conductive pattern 520 in FIG. 3A), and a third shielding sheet (e.g., the third shielding sheet in FIG. 5). It may include a shielding sheet 540). The conductive pattern may surround the edge of the opening. The conductive pattern may be configured to transmit or receive a wireless communication signal in a designated frequency band. The third shielding sheet may be disposed on the conductive pattern to face the display within the housing. The second flexible printed circuit board may partially overlap the first flexible printed circuit board within the housing. The conductive pattern transmits the wireless communication signal through a magnetic field induced by the first shielding sheet and the second shielding sheet in an area of the second flexible printed circuit board that overlaps the first flexible printed circuit board. It can be configured to transmit or receive.

The electronic device according to one embodiment may further include a first overlapping area (e.g., the first overlapping area A1 in FIG. 3A) and a second overlapping area (e.g., the second overlapping area A2 in FIG. 3A). You can. In the first overlapping area, a first surface of the first flexible printed circuit board (e.g., first surface 400a of FIG. 5 ) facing in a first direction toward the display and, within the housing, in the first direction. The fourth side of the second flexible printed circuit board (eg, the fourth side 500b of FIG. 5 ) facing in the second direction opposite to may be in contact with each other. In the second overlap region, a second side of the first flexible printed circuit board (e.g., second side 400b in FIG. 5) opposite the first side and the second flexible side opposite the fourth side. The third side of the printed circuit board (eg, the third side 500a of FIG. 5) may be in contact.

According to one embodiment, within the first overlapping area, the second shielding sheet, the first shielding sheet, and the third shielding sheet may be sequentially arranged in the first direction. Within the second overlapping area, the third shielding sheet, the second shielding sheet, and the first shielding sheet may be sequentially arranged in the first direction. According to one embodiment of the present disclosure, the first flexible printed circuit board and the second flexible printed circuit board partially overlap, so that, within the housing, the space occupied by the first flexible printed circuit board and the second flexible printed circuit board can be reduced. According to one embodiment, the second flexible printed circuit board may be configured to communicate wirelessly using at least one shielding sheet disposed on the first flexible printed circuit board. According to one embodiment, even if the second flexible printed circuit board does not include a plurality of shielding sheets stacked on top of each other, at least one shielding sheet of the first flexible printed circuit board in an area overlapping with the first flexible printed circuit board. can be used. According to one embodiment, the thickness of the second flexible printed circuit board may be reduced, thereby securing space within the housing.

The electronic device according to one embodiment may further include an adhesive member (eg, the adhesive member 600 of FIG. 5). The adhesive member may be disposed in at least a portion of an area of the second flexible printed circuit board that overlaps the first flexible printed circuit board. The second flexible printed circuit board may be supported by the first flexible printed circuit board by being attached to the first flexible printed circuit board through the adhesive member. According to one embodiment of the present disclosure, in at least a portion of the area where the second flexible printed circuit board overlaps the first flexible printed circuit board, the adhesive member connects the first flexible printed circuit board and the second flexible printed circuit board. You can do it. The adhesive member may provide rigidity to the second flexible printed circuit board by supporting the second flexible printed circuit board.

According to one embodiment, the conductive pattern is a magnetic secure transmission (MST) antenna (e.g., MST antenna 297-1 in FIG. 2), a near field communication (NFC) antenna (e.g., NFC antenna 297 in FIG. 2), -3)), and a wireless power consortium (WPC) antenna (e.g., the wireless charging antenna 297-5 of FIG. 2). According to one embodiment of the present disclosure, the conductive pattern of the second flexible printed circuit board may be a loop antenna.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, the processor 120 (e.g., processor 120) of the device (e.g., electronic device 101) may call at least one instruction among one or more instructions stored from a storage medium and execute it. . This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium such as the memory 130 of a manufacturer's server, an application store's server, or a relay server. there is.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In the electronic device 101,
A housing 300 on which a display 161 is disposed on one side 301;
a first printed circuit board 310 disposed next to a first edge 305 of the housing 300;
a second printed circuit board (320) disposed within the housing (300) next to a second edge (306) facing the first edge (305);
a first flexible printed circuit board 400 connecting the first printed circuit board 310 and the second printed circuit board 320; and
Comprising an opening 510 and a conductive pattern 520 surrounding an edge of the opening 510 and configured to transmit or receive a wireless communication signal in a designated frequency band, within the housing 300, the first flexible printing a second flexible printed circuit board 500 partially overlapping the circuit board 400; Including,
The first flexible printed circuit board 400,
Extending from the first printed circuit board 310 through the opening 510 of the second flexible printed circuit board 500 to the second printed circuit board 320,
Electronic device (101). According to paragraph 1,
The first flexible printed circuit board 400,
conductive layer (401);
a non-conductive layer 402 surrounding the conductive layer 401;
A first shielding sheet 410 disposed on one side of the non-conductive layer 402; and
a second shielding sheet 420 disposed on the other side of the non-conductive layer 402 opposite to the one side of the non-conductive layer 402; Including,
The second flexible printed circuit board 500,
Within the housing 300, it includes a third shielding sheet 540 disposed on the conductive pattern 520 to face the display 161,
The conductive pattern 520 is,
In a region of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400, the conductive pattern 520, the first shielding sheet 410, and the second shielding sheet configured to transmit or receive the wireless communication signal via a magnetic field induced by (420),
Electronic device (101). According to any one of paragraphs 1 and 2,
The first flexible printed circuit board 400 and the second flexible printed circuit board 500,
Providing the magnetic field from the conductive pattern 520 along the first flexible printed circuit board 400,
Electronic device (101). According to any one of claims 1 to 3,
The first shielding sheet 410, the second shielding sheet 420, and the third shielding sheet 540,
Containing at least one of a conductive material or a carbon material,
Electronic device (101). According to any one of claims 1 to 4,
A first side 400a of the first flexible printed circuit board 400 facing within the housing 300 in a first direction toward the display 161 and within the housing 300 in the first direction. a first overlapping area (A1) where the fourth surfaces (500b) of the second flexible printed circuit board (500) facing in the second direction opposite to each other contact each other; and
The second side 400b of the first flexible printed circuit board 400 is opposite to the first side 400a and the second side 400b of the second flexible printed circuit board 500 is opposite to the fourth side 500b. a second overlapping area (A2) in contact with the three sides (500a); Containing more,
Electronic device (101). According to any one of claims 1 to 5,
The opening 510 is,
disposed between the first overlapping area (A1) and the second overlapping area (A2),
Electronic device (101). According to any one of claims 1 to 6,
The first flexible printed circuit board 400,
conductive layer (401);
a non-conductive layer 402 surrounding the conductive layer 401;
a first shielding sheet 410 disposed on one side of the non-conductive layer 402 facing the first direction; and
a second shielding sheet 420 disposed on the other side of the non-conductive layer 402 opposite to the one side of the non-conductive layer 402; Including,
The second flexible printed circuit board 500,
Within the housing 300, it includes a third shielding sheet 540 disposed on the conductive pattern 520 to face the first direction,
Within the first overlapping area A1, the second shielding sheet 420, the first shielding sheet 410, and the third shielding sheet 540 are sequentially arranged in the first direction,
Within the second overlapping area A2, the third shielding sheet 540, the second shielding sheet 420, and the first shielding sheet 410 are sequentially arranged in the first direction,
Electronic device (101). According to any one of claims 1 to 7,
The first flexible printed circuit board 400,
a first connector 430 connected to the first printed circuit board 310; and
a second connector 440 connected to the second printed circuit board 320; Including,
The second flexible printed circuit board 500,
Comprising a connection portion 530 connected to the first printed circuit board 310,
Electronic device (101). According to any one of claims 1 to 8,
The conductive pattern 520 is,
Within the connection portion 530, extending from the conductive pattern 520 to a conductive layer in the first printed circuit board 310,
Electronic device (101). According to any one of claims 1 to 9,
The connection portion 530 is,
By being connected to the first connector 430, it is electrically connected to the first printed circuit board 310,
Electronic device (101). According to any one of claims 1 to 10,
an adhesive member 600 disposed in at least a portion of an area of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400; It further includes,
The second flexible printed circuit board 500,
Supported by the first flexible printed circuit board 400 by being attached to the first flexible printed circuit board 400 through the adhesive member 600,
Electronic device (101). According to any one of claims 1 to 11,
The opening 510 is,
Concentric with the shape of the conductive pattern 520,
Electronic device (101). According to any one of claims 1 to 12,
The conductive pattern 520 is,
a first conductive pattern 520a disposed on the third side 500a of the second flexible printed circuit board 500;
a second conductive pattern (520b) disposed on the fourth side (500b) of the second flexible printed circuit board (500) opposite to the third side (500a); Including,
The first conductive pattern 520a and the second conductive pattern 520b are,
Connected to each other through a conductive via 550 of the second flexible printed circuit board 500,
Electronic device (101). According to any one of claims 1 to 13,
a battery 189 disposed between the first printed circuit board 310 and the second printed circuit board 320; It further includes,
The second flexible printed circuit board 500,
disposed between the battery 189 and the other side of the housing 300 facing the one side of the housing 300,
Electronic device (101). According to any one of claims 1 to 14,
The conductive pattern 520 is,
Containing at least one of a magnetic secure transmission (MST) antenna (297-1), a near field communication (NFC) antenna (297-3), and a wireless power consortium (WPC) antenna (297-5),
Electronic device (101). In the electronic device 101,
A housing 300 on which a display 161 is disposed on one side;
a first printed circuit board (310) disposed next to a first edge of the housing (305) within the housing (300);
a second printed circuit board (320) disposed within the housing (300) next to a second edge (306) facing the first edge (305);
A conductive layer 401, a non-conductive layer 402 surrounding the conductive layer 401, a first shielding sheet 410 disposed on one side of the non-conductive layer 402 facing the display 161, and a first flexible printed circuit board 400 including a second shielding sheet 420 disposed on the other side of the non-conductive layer 402 opposite to the one side of the non-conductive layer 402; and
An opening 510 and a conductive pattern 520 surrounding an edge of the opening 510 and configured to transmit or receive a wireless communication signal in a designated frequency band, and facing the display 161 within the housing 300. A second flexible printed circuit comprising a third shielding sheet 540 disposed on the conductive pattern 520 and partially overlapping the first flexible printed circuit board 400 within the housing 300. substrate 500; Including,
The conductive pattern 520 is,
In the area of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400, the magnetic field induced by the first shielding sheet 410 and the second shielding sheet 420 is generated. configured to transmit or receive the wireless communication signal,
Electronic device (101). According to clause 16,
A first side 400a of the first flexible printed circuit board 400 facing within the housing 300 in a first direction toward the display 161 and within the housing 300 in the first direction. a first overlapping area (A1) where the fourth surfaces (500b) of the second flexible printed circuit board (500) facing in the second direction opposite to each other contact each other; and
The second side 400b of the first flexible printed circuit board 400 is opposite to the first side 400a and the second side 400b of the second flexible printed circuit board 500 is opposite to the fourth side 500b. a second overlapping area (A2) in contact with the three sides (500a); Containing more,
Electronic device (101). According to any one of claims 16 and 17,
Within the first overlapping area A1, the second shielding sheet 420, the first shielding sheet 410, and the third shielding sheet 540 are sequentially arranged in the first direction,
Within the second overlapping area A2, the third shielding sheet 540, the second shielding sheet 420, and the first shielding sheet 410 are sequentially arranged in the first direction,
Electronic device (101). According to any one of claims 16 to 18,
an adhesive member 600 disposed in at least a portion of an area of the second flexible printed circuit board 500 that overlaps the first flexible printed circuit board 400; It further includes,
The second flexible printed circuit board 500,
Supported by the first flexible printed circuit board 400 by being attached to the first flexible printed circuit board 400 through the adhesive member 600,
Electronic device (101). According to any one of claims 16 to 19,
The conductive pattern 520 is,
Containing at least one of a magnetic secure transmission (MST) antenna (297-1), a near field communication (NFC) antenna (297-3), and a wireless power consortium (WPC) antenna (297-5),
Electronic device (101).

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