KR20240002656A - Electronic device for identifying attachment on display and method of the same - Google Patents

Abstract

An electronic device according to various embodiments disclosed in this document includes a housing, a display mounted on at least a portion of at least one side of the housing, a transmitter disposed in an area of the housing to transmit a signal in the direction of the display, and an area of the housing. It includes a receiver disposed within and receiving a signal corresponding to the transmitted signal, a memory, and a processor operatively connected to the transmitter and the receiver, wherein the processor controls the transmitter to transmit the transmitted signal when specified environmental conditions are met. It may be set to analyze a signal received by the receiver in response to the signal and determine whether an external attachment to the display exists.

Description

Electronic device and method for recognizing attachment to a display {ELECTRONIC DEVICE FOR IDENTIFYING ATTACHMENT ON DISPLAY AND METHOD OF THE SAME}

Various embodiments disclosed in this document relate to an electronic device and method for recognizing attachments to a display.

Recently, various electronic devices include displays for conveying visual information. Various electronic devices, such as mobile phones, tablets, wearable electronic devices, or laptops, are equipped with displays.

The display may include a window layer to protect the panel layer on top of the panel layer including the light emitting element that generates light. The window layer can be made of a material with good transmission properties, such as tempered glass or transparent polyimide (PI), to prevent attenuation or distortion of signals emitted from the panel layer, and can be fixed to the panel layer using an adhesive.

Recently, users of electronic devices including displays often attach various additional attachments, such as protective films or protective glasses, to the displays to protect the display surface. Attaching additional attachments to the display can change the thickness of the display, change the transmission characteristics of signals emitted from the panel layer, and affect the function of various components such as sensors.

The technical problem to be achieved in the present disclosure is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

An electronic device according to various embodiments disclosed in this document includes a housing, a display mounted on at least a portion of at least one side of the housing, a transmitter disposed in an area of the housing to transmit a signal in the direction of the display, and an area of the housing. It includes a receiver disposed within and receiving a signal corresponding to the transmitted signal, a memory, and a processor operatively connected to the transmitter and the receiver, wherein the processor controls the transmitter to transmit the transmitted signal when specified environmental conditions are met. It may be set to analyze a signal received by the receiver in response to the signal and determine whether an external attachment to the display exists.

A method for an electronic device according to various embodiments includes the operation of checking whether environmental conditions of the electronic device are met, a signal from a transmitter disposed within a housing of the electronic device toward a display mounted on at least a portion of at least one side of the housing. An operation of transmitting and receiving a signal corresponding to the transmitted signal at a receiver disposed in the housing, analyzing the received signal, and determining the presence or absence of an external attachment to the display based on the analysis. It can be included.

According to various embodiments, attachments additionally attached by a user to the display may be recognized.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components .
1 is a block diagram of an electronic device in a network environment, according to various embodiments.
FIG. 2A is a block diagram illustrating an electronic device according to various embodiments.
FIG. 2B is a cross-sectional view showing a display structure of an electronic device according to various embodiments.
FIGS. 2C and 2D are diagrams illustrating the external appearance of electronic devices according to various embodiments.
FIG. 3 is a diagram illustrating an example of a signal transmission and reception structure for a display of an electronic device according to various embodiments.
FIG. 4 is a diagram illustrating an example of a signal transmission and reception structure for a display of an electronic device according to various embodiments.
FIG. 5 is a diagram illustrating an example of a signal transmission and reception structure for a display of an electronic device according to various embodiments.
FIG. 6 is a diagram illustrating an example of a signal transmission and reception structure for a display of an electronic device according to various embodiments.
FIG. 7 is a diagram illustrating a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.
FIG. 8 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.
9 and 10 are diagrams for explaining a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.
FIG. 11 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.
FIG. 12 is a diagram illustrating a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.
FIG. 13 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.
FIG. 14 is a diagram illustrating an example of arrangement of a signal transmitter and receiver for a display of an electronic device according to various embodiments.
FIG. 15 is a diagram illustrating an example of arrangement of a signal transmitter and receiver for a display of an electronic device according to various embodiments.
FIG. 16 is a flowchart illustrating a method for recognizing attachments to a display of an electronic device according to various embodiments.
FIG. 17 is a flowchart illustrating a method for recognizing attachments to a display of an electronic device according to various embodiments.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2A is a block diagram illustrating an electronic device 200 (eg, the electronic device 101 of FIG. 1 ) according to various embodiments.

Referring to FIG. 2A, the electronic device 200 (e.g., the electronic device 101 of FIG. 1) includes a display 210 (e.g., the display module 160 of FIG. 1) and a processor 220 (e.g., the electronic device 101 of FIG. 1). processor 120), detection module 230, memory 240 (e.g., memory 130 in FIG. 1), sensor module 250 (e.g., sensor module 176 in FIG. 1), and camera 260. ) (e.g., the camera module 180 of FIG. 1). The components of the electronic device 200 in FIG. 2 are merely examples, and some components may be omitted or additional components may be added. FIG. 2B is a cross-sectional view showing the structure of the display 210 of the electronic device 200 according to various embodiments.

According to one embodiment, the display 210 may include a touch sensor 207 configured to detect a touch or a pressure sensor (not shown) configured to measure the intensity of force generated by the touch. The structure of the display 210 will be described in detail later with reference to FIG. 2B.

According to one embodiment, the detection module 230 may transmit a signal and receive at least a portion of the reflected signal to detect an additional attachment external to the display 210. For example, the detection module 230 detects at least some signals reflected from the interface between the display 210 and the external space or the interface between the external additional attachment and the external space in the transmission path of the detection signal and the transmitter 231 that transmits the detection signal. It may include a receiver 232 for receiving. For example, the detection module 230 may be implemented through the sensor module 250 or camera 260 included in the electronic device 200. For example, the detection module 230 may be implemented through various sensors including a light-emitting element and a light-receiving element included in the sensor module 250 or the camera 260.

According to one embodiment, the signal transmitted by the detection module 230 may include an optical signal such as visible light or infrared, a sound wave signal, or a radio frequency (RF) signal. For example, when the detection module 230 transmits an optical signal, the transmitter 231 may include a light-emitting element that emits an optical signal, and the receiver 232 may include a light-receiving element that receives the optical signal. . For example, when the transmitter 231 emits sound waves, the receiver 232 may include a piezoelectric element. For example, when the detection module 230 transmits an RF signal, the transmitter 231 may include an antenna that transmits the RF signal, and the receiver 232 may include an antenna that receives the RF signal.

According to one embodiment, when the transmitter 231 emits visible light, the receiver 232 may include a fingerprint sensor, an illumination sensor , or a camera that receives visible light . Accordingly, the receiver 232 can acquire an optical image.

According to one embodiment, when the transmitter 231 emits infrared rays, the receiver 232 may include a fingerprint sensor , an illumination sensor , or a camera that receives infrared rays . Accordingly, the receiver 232 can acquire an optical image.

According to one embodiment, when the transmitter 231 emits an RF signal, the receiver 232 may include an antenna. Accordingly, the receiver 232 can obtain phase and amplitude data of the RF signal.

According to one embodiment, when the transmitter 231 uses an optical signal such as visible light or infrared light, under conditions where external light is below a certain level or absent (e.g., in a dark room or at night), for example, the electronic device 200 does not move. Measurements can be performed under conditions that meet environmental data, including absence conditions and inactive (e.g. sleep) conditions.

According to one embodiment, when the transmitter 231 uses an RF signal, conditions in which there is no RF noise affecting the RF signal being used, for example, a condition in which the electronic device 200 does not move, connection with an external device ( Measurements can be performed under conditions that meet environmental data, including no conditions (e.g. charging or mirroring) and deactivation (e.g. sleep) conditions.

According to one embodiment, the receiver 232 may include a lens or a collimator to improve the signal-to-noise ratio of the received signal. For example, receiver 232 may include an optical fingerprint sensor.

According to one embodiment, the sensor module 250 may include a fingerprint sensor 251, a proximity sensor 253, an illumination sensor 255, and/or a grip sensor 257. The sensors included in the sensor module 250 are examples, and some sensors may be omitted or other sensors may be added.

According to one embodiment, the processor 220 may generally control the components of the electronic device 200. For example, the processor 220 can control the detection module 230 to check attachments added to the display 210. For example, the processor 220 controls the detection module 230 to change the settings of various components (e.g., sensor module 250, camera 260) according to attachments added to the display 210. can be controlled. For example, the processor 220 may control the detection module 230 to provide a user notification that the operation of some components may be affected depending on the attachment added to the display 210.

Referring to FIG. 2B, the display 200 includes a cushion 201 (e.g., a metal and/or polymer member), a display panel 203, a touch sensor panel (TSP) 207, Includes a structure in which a polarizer 209 (e.g., a polarizing film) and a window 213 (e.g., a polyimide (PI) film, polyethylene terephthalate (PET), or ultra thin glass (UTG)) are sequentially stacked. can do. The above-described structure is an example, and various modifications, integrations, deletions, or additions are possible. For example, the windows 213 may be arranged in plural numbers. For example, one layer (e.g., top surface (+z-axis direction)) of the plurality of windows 213 has a weaker adhesive force or a greater thickness than the adhesive of the other layer so that it can be easily separated from the other layer. It may also be placed by a thin adhesive. In one embodiment, the window 213 is at least one of the top surface (eg, +z-axis direction) or the bottom surface (eg, -z-axis direction) and/or the side surface (eg, x-axis or y-axis direction). It may further include various coating layers formed on some parts.

According to one embodiment, the shock absorbing member 201 may function to absorb shock from the outside of the electronic device 101. The buffer member 201 can prevent damage to the display 200 by absorbing shock. The buffer member 201 may include, for example, a polymer member and/or a metal material. For example, at least a portion of the buffer member 201 may be made of an insulating material that does not conduct electricity, and at least a portion may be made of a metal material.

In order to increase the visual information transmission efficiency and usability of the electronic device 200, when the size of the display 210 increases, the size of the bezel portion decreases and a number of components are placed at the bottom of the buffer member 201 of the display 210 (e.g. It is placed in the -z-axis direction. For example, the sensor module 250 of FIG. 2A (e.g., fingerprint sensor 251, proximity sensor 253, ambient light sensor 255, and/or grip sensor 257) and/or camera 260 (e.g., A front camera) may be placed at the bottom of the display 210.

According to one embodiment, an opening for arranging various components may be formed in the buffer member 201. For example, various laminated structures (e.g., polymer members and/or metal materials) included in the buffer member 201 may be used as detection modules (e.g., detection module 230 in FIG. 2A) and sensor modules (e.g., in FIG. 2A). At least a portion overlapping with the sensor module 250 (fingerprint sensor 241, proximity sensor 253, and/or illuminance sensor 255) and/or camera module (e.g., camera 260 in FIG. 2A) By removing (or patterning) to form an opening, the transmittance of the corresponding area can be increased. Various sensors (eg, grip sensor 257) or antennas included in the sensor module 250 may be located at the bottom of the buffer member 201 without being partially removed.

According to one embodiment, the display panel 203 may include organic light emitting diodes (OLED). As shown, the display panel 203 may include various light emitting elements 203-1 that emit visible light 203-3 of a plurality of different wavelengths. Examples of the display panel 203 include an OLED display panel, micro LED display panel, nano LED display panel, quantum dot light emitting display panel, liquid crystal display panel, plasma display panel, field emission display panel, electrophoresis display panel, and electrowetting display panel. I can hear it. Hereinafter, as an example of the display panel 203, a case in which an OLED display panel is applied is exemplified, but the present invention is not limited thereto, and other display panels may also be applied.

According to one embodiment, the touch panel 207 may include a pressure sensor (not shown) that detects pressure. The touch panel 207 may be provided as a separate member from the display panel 203 in the form of a panel or film and attached to the display panel 203. However, the present invention is not limited thereto, and the touch panel 207 may be formed integrally with the display panel 203 in the form of a touch layer (TSP).

According to one embodiment, the touch panel 207 may be attached to one side of the display panel 203 (eg, in the +z-axis direction) through an adhesive member 205 (eg, an optically transparent adhesive member). The adhesive member 205 may include, for example, optically clear adhesive (OCA), pressure sensitive adhesive (PSA), optically clear resin (OCR), or super view resin (SVR).

According to one embodiment, the window 213 may cover and protect the display panel 203. The window 213 may include transparent glass or transparent plastic with good transparency. The window 213 may be attached to one surface (eg, +z-axis direction) of the polarizing layer 209 through an adhesive member 211 (eg, an optically transparent adhesive member). The adhesive member 211 may include, for example, optically clear adhesive (OCA), pressure sensitive adhesive (PSA), optically clear resin (OCR), or super view resin (SVR).

According to one embodiment, the window 213 forms a surface on which the display 210 contacts the outside air, and the user places a protective film or protective glass on the window 213 to prevent damage to the display 210. Various external attachments can be attached.

In general, the window 213 is made of a material with good light transmission characteristics and can transmit the optical signal emitted from the display panel 203 (e.g., the light emitting element 203-1) to the outside with little attenuation or distortion. Additionally, the window 213 may have minimal influence on the operation of components disposed below the display 210, for example, the sensor module 250 and/or the camera 260. Even if the operation of these components is somewhat affected by the window 213, the corresponding components can be controlled by adjusting characteristics such as the sensing intensity or light characteristics of the corresponding components, or operating conditions such as the amount of light of the display 210. Their operating performance can be improved compared to before adjusting the operating conditions.

The external attachment attached to the window 213 may generally have a thickness of about 100 to about 150 μm or about 300 to about 500 μm in the case of a protective film or protective glass. Accordingly, when an external attachment is attached, the total length through which the optical signal emitted from the display panel 210 and/or the components disposed at the bottom of the display 210 passes through the display 210 becomes longer, and the light transmission characteristics are reduced. It can change. Additionally, the radio wave characteristics may change depending on characteristics such as the dielectric constant of the external attachment, thereby changing the radio wave signal transmission characteristics. In addition, due to the internal lamination of external attachments, polymer compounds undergo a stretching process during the manufacturing process, and the directionality may occur randomly, resulting in signal delay (retarding).

The operating performance of various components may deteriorate due to external attachments attached to the window 213. For example, in the case of the touch panel 205, the distance between the finger and the touch panel 205 may increase and the dielectric constant may change, thereby reducing touch sensitivity. For example, in the case of the camera 260 (e.g., under display camera), image quality characteristics may change according to changes in the optical refractive index. For example, in the case of the fingerprint sensor 251 (e.g., indisplay optical fingerprint sensor), the optical signal reflected from the fingerprint may be attenuated due to changes in focal length and retarding characteristics. Retarding properties typically occur in random directions in film or glass materials, which can cause performance changes to occur randomly. For example, in the case of the fingerprint sensor 251 (e.g., indisplay ultrasonic fingerprint sensor), ultrasonic transmission characteristics may change due to changes in acoustic impedance. For example, in the case of the proximity sensor 253 or the illuminance sensor 255, the optical path may change during the process of transmitting and receiving an optical signal due to the refractive index of the film or glass, thereby changing the internal characteristic values. For example, in the case of the grip sensor 257 or an antenna, a change in capacitance characteristics or a change in radiation performance characteristics may occur due to a change in dielectric constant.

As described above, the performance of a number of components is degraded due to external attachments attached to the window 213, or in particular, in the case of the touch panel 207 or the fingerprint sensor 251, performance is degraded or normal operation is not possible. can also occur.

According to one embodiment, the processor 220 may control the detection module 230 to recognize external attachments such as a protective film or protective glass attached to the top of the display 210.

According to one embodiment, the processor 220 recognizes an external attachment such as a protective film or protective glass attached to the top of the display 210, and when it is determined that the operation of various components is affected accordingly, the processor 220 recognizes the external attachment of the components. You can change the settings of various components to improve operating performance.

According to one embodiment, the processor 220 recognizes an external attachment such as a protective film or protective glass attached to the top of the display 210, and when it is determined that the operation of various components is affected accordingly, the processor 220 recognizes the external attachment of the components. If it is difficult to change the settings of various components to improve operating performance, such information can be provided to the user through notification.

FIG. 2C is a perspective view of the front of an electronic device (eg, the electronic device 200 of FIG. 2A) according to various embodiments of the present invention. Figure 2D is a perspective view of the rear of the electronic device 200 according to various embodiments of the present invention.

Referring to FIGS. 2C and 2D, the electronic device 200 according to one embodiment includes a first side (or front) 310A, a second side (or back) 310B, and a first side 310A. and a housing 310 including a side 310C surrounding the space between the second surfaces 310B. In another embodiment (not shown), housing 310 may refer to a structure that forms part of first side 310A, second side 310B, and side surface 310C.

According to one embodiment, the first surface 310A may be formed at least in part by a substantially transparent front plate 312 (eg, a glass plate including various coating layers, or a polymer plate). The second surface 310B may be formed by a substantially opaque rear plate 321. The back plate 321 forming the second side 310B may be, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any of the foregoing materials. It can be formed by a combination of at least two of the following. The side 310C may be formed by a side bezel structure (or “side member”) 328 that joins the front and back plates and includes metal and/or polymer. In some embodiments, back plate 321 and side bezel structure 328 may be formed as a single piece and include the same material (eg, a metallic material such as aluminum).

In the illustrated embodiment, the front plate 312 has a first region 310D that is curved from the first surface 310A toward the rear plate 321 and extends seamlessly. ) can be included at both ends of the long edge. In the illustrated embodiment (see FIG. 2D), the rear plate 321 is curved from the second surface 310B toward the front plate 312 to form a seamlessly extending second region 310E. It can be included at both ends of the edge. According to one embodiment, the front plate 312 or the rear plate 321 may include only one of the first area 310D or the second area 310E. In some embodiments, the front plate 312 may not include the first area 310D and the second area 310E, but may only include a flat plane disposed parallel to the second surface 310B. In the above embodiments, when viewed from the side of the electronic device 200, the side bezel structure 328 has a first area on the side that does not include the first area 310D or the second area 310E. It may have a thickness (or width) of 1, and may have a second thickness thinner than the first thickness on a side surface including the first or second area.

According to one embodiment, the electronic device 200 includes a display (e.g., display 210 in FIG. 2A), an input device 313, an audio output device 317 and 324, and a sensor module 314 and 329 (e.g. : sensor module 250 in FIG. 2A), camera modules 315, 322, and 323 (e.g., camera 260 in FIG. 2), key input device 327, indicator (not shown), and connector 318, 319) may include at least one of the following. According to one embodiment, the electronic device 200 may omit at least one of the components (eg, the key input device 327 or an indicator) or may additionally include another component.

Display 210 may be exposed, for example, through a significant portion of front plate 312 . In some embodiments, at least a portion of the display 210 may be exposed through the front plate 312 forming the first surface 310A and the first area 310D of the side surface 310C. The display 210 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. According to one embodiment, at least a portion of the sensor modules 314 and 329 and/or at least a portion of the key input device 327 are located in the first area 310D and/or the second area 310E. can be placed in

The sensor modules 314 and 329 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state. The sensor modules 314, 329 may include, for example, a first sensor module 314 (e.g., a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 310A of the housing 310. ) (eg, fingerprint sensor), and/or a third sensor module 329 (eg, HRM sensor) disposed on the second surface 310B of the housing 310. The fingerprint sensor may be disposed on the first surface 310A of the housing 310. A fingerprint sensor (eg, an ultrasonic or optical fingerprint sensor) may be disposed below the display 210 on the first side 310A. The electronic device 200 may include sensor modules not shown in the housing 310, such as a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may further include at least one of a sensor, a temperature sensor, a humidity sensor, or an illumination sensor 304.

The camera modules 315, 322, and 323 include a first camera device 315 (e.g., a front camera) disposed on the first side 310A (e.g., the front) of the electronic device 200, and a second side ( It may include a second camera device 322 (eg, a rear camera), and/or a flash 323 disposed in 310B). The camera modules 315 and 322 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 323 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be placed on one side of the electronic device 200.

Some camera modules 315 among the camera modules 315 and 322, some sensor modules 314 among the sensor modules 314 and 329, or indicators may be disposed in the housing 310 to be exposed through the display 210. there is. For example, the camera module 315, sensor module 314, or indicator is disposed in the internal space of the electronic device 200 to come into contact with the external environment through a perforated opening up to the front plate 312 of the display 210. It can be. In another embodiment, some sensor modules 314 may be arranged to perform their functions without being visually exposed through the front plate 312 in the internal space of the electronic device. For example, in this case, the area of display 210 facing the sensor module may not need a drilled opening.

FIG. 3 illustrates signal transmission and reception on the display 300 (e.g., the display 210 of FIG. 2A or FIG. 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 300 is the same or similar to the material, structure, and/or function of the display 210 described with reference to FIG. 2A, and detailed description thereof will be omitted here.

Referring to FIG. 3, the electronic device 200 may include a transmitter 301 and a receiver 302 as components of a detection module (eg, the detection module 230 of FIG. 2A).

According to one embodiment, the transmitter 301 emits a signal to form, for example, a designated angle θ with the plane of the stacked structure of the display 300, so that an optical path is formed at a designated angle within the stacked structure of the display 300. It can be configured by constantly fixing the direction of the device from which the signal is emitted.

According to one embodiment, the transmitter 301 may be placed at the bottom of the display 300. For example, the transmitter 301 may be placed at the bottom of the buffer member 201. At least a portion of the buffer member 201 on which the transmitter 301 is disposed may be removed.

According to one embodiment, the receiver 302 may be placed at the bottom of the display 300. For example, the receiver 302 may be placed at the bottom of the display panel 203. At least a portion of the buffer member 201 on which the receiver 302 is disposed may be removed.

According to one embodiment, the signal emitted from the transmitter 301 is reflected at the boundary between the window 213 and the outside, and at least some of the reflected signals may be received by the receiver 302. For example, the positions of the transmitter 301 and the receiver 302 and the signal emission angle (θ) of the transmitter 301 are such that the signal emitted from the transmitter 301 is reflected at the boundary between the window 213 and the outside, It can be arranged by adjusting the position and transmission angle (θ) so that at least some of the reflected signals can be received by the receiver 302.

The transmitter 301 may be implemented to transmit various types of signals, including, for example, visible light, infrared (IR), sound waves, or RF signals. Transmitter 301 may be implemented to transmit signals of one or more specific frequencies.

According to one embodiment, the receiver 302 may include a material suitable for receiving a signal generated from a transmitter. For example, when the transmitter 301 emits an optical signal, the receiver 302 may include a photodiode material that reacts to light. For example, when the transmitter 301 emits sound waves, the receiver 302 may include a piezoelectric element. For example, when the transmitter 301 emits an RF signal, the receiver 302 may include an antenna operating at the corresponding frequency.

FIG. 4 illustrates signal transmission and reception for the display 400 (e.g., the display 210 of FIG. 2A or FIG. 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 210 is the same or similar to the material, structure, and/or function of the display 210 described with reference to FIGS. 2A and 3, and detailed description thereof will be omitted here.

Referring to FIG. 4, the electronic device 200 may include a transmitter 401 and a receiver 402 as components of a detection module (e.g., the detection module 230 of FIG. 2A).

According to one embodiment, the transmitter 401 emits a signal to form, for example, a designated angle θ with the plane of the stacked structure of the display 400, so that the path of the signal within the stacked structure of the display 400 is designated. So that it can be formed at an angle, it can be implemented by fixing the signal emission direction of the device from which the signal is emitted to a specified angle.

According to one embodiment, the transmitter 401 may be placed on the side part of the display 400. For example, the transmitter 401 may be placed on the side of the touch panel 207 or the display panel 203. For example, when placed on the side of the display 210 (e.g., on the side of the touch panel 207 or the display panel 203), the signal emitted from the transmitter 401 more efficiently penetrates the laminated structure of the display 400. And the amount of signal reflected from the window 213 and the external boundary can increase, so the performance of the detection module 230 can be further improved.

According to one embodiment, the receiver 402 may be placed at the bottom of the display 400. For example, the receiver 402 may be placed at the bottom of the display panel 203. At least a portion of the buffer member 201 on which the receiver 402 is disposed may be removed.

According to one embodiment, the signal emitted from the transmitter 401 is reflected at the boundary between the window 213 and the outside, and at least part of the reflected signal may be received by the receiver 402. For example, the positions of the transmitter 401 and the receiver 402 and the signal emission angle of the transmitter 401 are determined by the signal emitted from the transmitter 401 being reflected at the boundary between the window 213 and the outside. It can be arranged by adjusting the position and transmission angle so that it can be received by the receiver 402.

FIG. 5 illustrates signal transmission and reception on the display 500 (e.g., the display 210 of FIG. 2A or FIG. 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 500 is the same or similar to the material, structure, and/or function of the display 210 described with reference to FIGS. 2A and 3, and detailed description thereof will be omitted here.

Referring to FIG. 5, the electronic device 200 may include a transmitter 501 and a receiver 502 as components of a detection module (e.g., the detection module 230 of FIG. 2A).

According to one embodiment, the transmitter 501 emits a signal to form, for example, a designated angle θ with the plane of the stacked structure of the display 500, so that the path of the signal within the stacked structure of the display 210 is designated. So that it can be formed at an angle, it can be implemented by fixing the signal emission direction of the device from which the signal is emitted to a specified angle.

According to one embodiment, the transmitter 501 may be placed on the side part of the display 500. For example, the transmitter 501 may be placed on the side of the window 213 or the polarization layer 209. For example, when placed on the side of the display 210 (e.g., on the side of the window 213 or the polarization layer 209), the signal emitted from the transmitter 501 passes through the stacked structure of the display 500 more efficiently. , the amount of signal reflected from the window 213 and the external boundary can increase, so the performance of the detection module 230 can be further improved.

FIG. 6 is a diagram illustrating an example of a signal transmission and reception structure for a display of an electronic device according to various embodiments.

Referring to FIG. 6, the display 600 includes a cushion 201 (e.g., a metal and/or polymer member), a display panel 203, a touch sensor panel (TSP) 207, Includes a structure in which a polarizer 209 (e.g., a polarizing film) and a window 213 (e.g., a polyimide (PI) film, polyethylene terephthalate (PET), or ultra thin glass (UTG)) are sequentially stacked. can do. Examples and repeated descriptions of the above-described structure with reference to FIG. 2B may be omitted here.

In order to increase the visual information transmission efficiency and usability of the electronic device 200, when the size of the display 600 increases, the size of the bezel portion is reduced and a number of components are placed at the bottom of the buffer member 201 of the display 600. there is. For example, the sensor module 250 of FIG. 2A (e.g., fingerprint sensor 251, proximity sensor 253, ambient light sensor 255, and/or grip sensor 257) and/or camera 260 (e.g., Components 601, such as a front camera, may be placed at the bottom of the display 600.

According to one embodiment, an opening for arranging the above-described component 601 may be formed in the buffer member 201. For example, various laminated structures (e.g., polymer members and/or metal materials) included in the buffer member 201 may be used as sensor modules (e.g., sensor module 250 of FIG. 2A (fingerprint sensor 251, proximity sensor ( 253) and/or the illuminance sensor 255)) and/or a camera module (e.g., the camera 260 in FIG. 2A) is removed (or patterned) to form an opening, thereby generating a signal in the corresponding area. Transmittance can be increased. The above-described component 601 may be placed at the bottom of the buffer member 201 without being partially removed.

According to one embodiment, the window 213 forms a surface on which the display 600 contacts the outside air, and the user places a protective film or protective glass on the window 213 to prevent damage to the display 210. Various external attachments 610 can be attached.

In general, when the external attachment 610 is not attached to the window 213, at least some of the visible light 203-3 emitted from the plurality of light emitting elements 203-1 of the display panel 203 (203) -5) may be reflected at the boundary surface where the window 213 and the outside air contact.

The external attachment 610, which is generally attached to the window 213, may generally have a thickness of about 100 to about 150 μm or about 300 to about 500 μm in the case of a protective film or protective glass. Accordingly, when the external attachment 610 is attached, the total length through which the signal emitted from the display panel 203 and/or the component 601 disposed at the bottom of the display 600 passes through the display 600 becomes longer, Light transmission properties may change. For example, when the external attachment 610 is attached to the window 213, at least some ( 203-7) may be reflected at the boundary surface where the external attachment 610 and external air contact. Additionally, signal transmission characteristics may change as propagation characteristics change depending on characteristics such as the dielectric constant of external attachments. In addition, due to the internal lamination of external attachments, polymer compounds undergo a stretching process during the manufacturing process, and the directionality may occur randomly, resulting in signal delay (retarding).

FIG. 7 is a diagram illustrating a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.

FIG. 7 illustrates signal transmission and reception on the display 700 (e.g., the display 210 of FIG. 2A or FIG. 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 700 is the same or similar to the material, structure, and/or function of the display 210 described with reference to FIG. 2A, and detailed description thereof will be omitted here.

Referring to FIG. 7, the electronic device 200 is a component of a detection module (e.g., the detection module 230 in FIG. 2a) and includes a transmitter 701 (e.g., the transmitter 231 in FIG. 2a) and a receiver 702. (e.g., receiver 232 in FIG. 2A).

According to one embodiment, the transmitter 701 may be implemented to transmit various types of signals, including, for example, visible light, IR, or sound wave signals.

According to one embodiment, the receiver 702 may include a material suitable for receiving a signal generated from a transmitter. For example, when the transmitter 701 emits an optical signal, the receiver 702 may include a photodiode material that reacts to light. Hereinafter, an example of emitting an optical signal from the transmitter 701 will be described, but the present embodiment is not limited to this.

According to one embodiment, the signal emitted from the transmitter 701 travels at a designated angle θ, and when there is no external attachment 710, it is reflected at the boundary between the window 213 and the outside, and at least a portion of the reflected Signal 703 may be received by receiver 702. The air layer outside the window 213 has a refractive index of about 1, which is relatively different from the refractive index of general glass, which is about 1.5, and reflection of light signals may occur at the interface between the window 213 and the outside air layer. In this case, the size of the reflected signal may vary depending on the angle of the incident signal or the intensity of the light source.

According to one embodiment, the transmitter 701 emits a signal to form, for example, a specified angle with the plane of the stacked structure of the display 700, and allows the optical path to be formed at a designated angle within the stacked structure of the display 700. , the transmitter 701 may be configured to fix the direction of the element emitting a signal at a certain angle.

According to one embodiment, the transmitter 701 may be placed at the bottom of the display panel 203, but the present invention is not limited thereto, and may be placed at the side as shown in FIG. 4 or 5, for example. When the receiver 702 is disposed at the lower part of the display panel 203, at least a portion of the buffer member 201 on which the receiver 702 is disposed may be removed.

According to one embodiment, the receiver 702 may be placed at the bottom of the display 700. For example, the receiver 702 may be placed at the bottom of the display panel 203. At least a portion of the buffer member 201 on which the receiver 702 is disposed may be removed.

In general, the plurality of layers constituting the display 700 are made of materials with relatively similar optical transmission characteristics in order to transmit optical signals generated in the display panel 203 to the outside, thereby minimizing direction and/or signal loss. there is.

According to one embodiment, the signal emitted from the transmitter 701 travels at a designated angle, and when there is no external attachment 710, it is reflected at the boundary between the window 213 and the external air layer, and at least a portion of the reflected signal 703 may be received by receiver 702.

According to one embodiment, the signal emitted from the transmitter 701 travels at a specified angle, and when there is an external attachment 710, it is reflected at the boundary between the external attachment 710 and the external air layer, and at least some of the reflected signals 713 may be received by receiver 702.

FIG. 8 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.

In (A) of FIG. 8, in the absence of an external attachment 710, the signal output from the transmitter 701 (e.g., the transmitter 701 of FIG. 7) is reflected at the boundary between the window 213 and the external air layer. An example of an image 810 formed by receiving at least a portion of the reflected signal 703 through the receiver 702 is shown.

According to one embodiment, the image 810 formed by the reflection signal 703 (e.g., the reflection signal 703 of FIG. 7) in the absence of an external attachment 710 (e.g., the external attachment 710 of FIG. 7). A signal value with the highest signal intensity may be displayed at the center position 811. For example, the images in FIG. 8 may be images displayed in gray scale according to the signal intensity value. For example, when 1 is displayed in white and 0 is displayed in black according to the signal intensity value, the signal intensity value between 1 and 0 may be displayed in gray scale according to the relative intensity. The background image 810 may show a specific pattern in the absence of an external attachment 710.

According to one embodiment, data on the image 810 formed by the reflected signal 703 in the absence of an external attachment 710 is acquired, for example, during the manufacturing process of the electronic device 200 and stored as reference signal data in a memory ( For example: it may be stored in memory 240 of FIG. 2A).

According to one embodiment, data about the environment that forms the image 810 by the reflection signal 703 in the absence of an external attachment 710 may be collected, for example, during the manufacturing process of the electronic device 200. illuminance data, pixel values, motion values, reference signal data, state data of the electronic device 200, and/or received strength of surrounding signals) in a memory (e.g., memory 240 in FIG. 2A) along with the reference signal data. You can save it.

According to one embodiment, the image 810 formed by the reflected signal 703 in the absence of an external attachment 710 is used with the transmitter 701 and the transmitter 701 when designing the structure so that the signal value with the highest signal intensity is displayed at the center position. The location of the receiver 702 may be set in advance.

According to one embodiment, the signal emitted from the transmitter 701 travels at a designated angle, passes through the window 213 if there is an external attachment 710, and is reflected at the boundary formed by the external attachment 710 with the outside. , at least some of the reflected signal 713 may be received by the receiver 702. In this case, as the signal further progresses through the external attachment 710 and is reflected, the position of the reflected signal incident on the receiver 702 may change.

In Figure 8 (B), in the presence of the external attachment 710, the signal output from the transmitter 701 passes through the window 213 and is reflected at the boundary between the external attachment 710 and the external air layer, and is reflected. An example of an image 820 formed by receiving a signal 713 through a receiver 702 is shown.

According to one embodiment, in the presence of the external attachment 710, the signal output of the transmitter 701 and the receiver 702 are recognized when environmental data similar to the environmental data in which the reference signal data for the reference image 810 was generated is recognized. ), the signal can be measured according to signal acquisition to form an image 820.

According to one embodiment, the image 820 formed by the reflected signal 713 in the presence of the external attachment 710 has the position where the signal value with the highest signal intensity is displayed from the center position 811 to the right side 821. It can be changed to indicate a changed pattern. Even when an external attachment 710 such as a protective film or protective glass having a similar refractive index as the window 213 is attached, the intensity and angle of the signal emitted from the transmitter 701 may be substantially the same. However, when an external attachment 710 such as a protective film or glass is attached, the emitted signal passes through the window 213 and proceeds further, and then surface reflection occurs from the external attachment 710 that forms a boundary with the air layer. , the position of the signal incident on the receiver 702 may change. Accordingly, the data of the acquired signal image 820 may represent a data value different from the reference signal data stored in the memory according to the signal image 810 acquired in the absence of the external attachment 710.

According to one embodiment, when comparing the reference signal data of the image 810 acquired without the external attachment 710 and the data of the image 820 acquired with the external attachment 710, the image pixel value is This changes the location of the highest pixel value, and the shape of the image and/or the ADC (analog to digital converter) output value at each pixel may change.

According to one embodiment, the degree of change in the position of the image pixel value may change in response to the thickness of the attached external attachment 710. For example, in a protective film with a thickness of about 100 to about 150 μm or a protective glass with a thickness of about 300 to about 500 μm, based on the pixel size of the image sensor, which generally has a size of about 30 to about 50 μm, the Image pixel values may move proportionally depending on thickness. In addition, depending on the material of the external attachment 710, for example, if it is a film or glass, the material characteristics are different and the attachment state may vary, so the ADC value may also change.

9 and 10 are diagrams for explaining a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.

FIG. 9 illustrates signal transmission and reception on the display 900 (e.g., the display 210 of FIG. 2A or FIG. 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 900 is the same as or similar to the material, structure, and/or function of the display 210 described with reference to FIG. 2A, and detailed description thereof will be omitted here.

Referring to FIG. 9, the electronic device 200 is a component of a detection module (e.g., the detection module 230 in FIG. 2a) and includes a transmitter 901 (e.g., the transmitter 231 in FIG. 2a) and a receiver 902. (e.g., receiver 232 in FIG. 2A).

According to one embodiment, the transmitter 901 and the receiver 902 may include an antenna using, for example, an RF method. The transmitter 901 and receiver 902 may be placed on different sides of the display 900, respectively. For example, the transmitting and receiving antennas of the transmitter 901 and/or the receiver 902 may be configured in an array form. Hereinafter, an example of emitting an electromagnetic wave signal from the transmitter 901 will be described, but the present embodiment is not limited to this.

According to one embodiment, the transmitter 901 and/or the receiver 902 may be placed on the side or bottom of the display panel 203. When the transmitter 901 and/or the receiver 902 are disposed at the bottom of the display panel 203, part of the corresponding portion of the buffer member 201 may be removed. For example, a slot may be formed in the metal material included in the buffer member 201 and the transmitter 901 and/or receiver 902 may be placed in the formed slot.

According to one embodiment, the transmitter 901 and the receiver 902 may each be placed on different sides of the display panel 203.

According to one embodiment, the electromagnetic wave signal emitted from the transmitter 901 may be reflected and/or transmitted at an interface where the difference in refractive index is large, substantially similar to an optical signal.

According to one embodiment, the electromagnetic wave signal emitted from the transmitter 901 is mainly reflected at the interface between the external air layer and the window 213, the display panel 203 containing a metal component, and/or the buffer member 201. Transmission may occur primarily in other layers.

According to one embodiment, the electromagnetic wave signal emitted from the transmitter 901 may form a signal path 903 in the form of a wave guide within the plurality of stacked structures of the display 900, and each of the plurality of layers A signal may be received by the receiver 902 through a process of transmission, reflection, or loss at the boundary surface.

According to one embodiment, signal characteristics, including the intensity and phase of the signal emitted from the transmitter 901 and received by the receiver 902 in the absence of external attachments, are stored as reference signal data in a memory (e.g., the memory of FIG. 2A). (240)). According to one embodiment, environmental data (e.g., illuminance data, pixel value, motion value, reference signal data, state data of the electronic device 200, and/or surrounding signal) at the time when the reference signal data is acquired in the absence of an external attachment. The reception intensity) may be stored together in a memory (e.g., memory 240 of FIG. 2A).

FIG. 10 illustrates signal transmission and reception on the display 1000 (e.g., the display 210 of FIG. 2A or 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 1000 is the same or similar to the material, structure, and/or function of the display 210 described with reference to FIG. 2A, and detailed description thereof will be omitted here.

Referring to FIG. 10, the electronic device 200 is a component of a detection module (e.g., the detection module 230 in FIG. 2a) and includes a transmitter 1001 (e.g., the transmitter 231 in FIG. 2a) and a receiver 1002. (e.g., receiver 232 in FIG. 2A).

According to one embodiment, the transmitter 1001 and the receiver 1002 may include an antenna using, for example, an RF method. The transmitter 1001 and the receiver 1002 may be disposed on different sides of the display 1000, respectively. For example, the transmitting and receiving antennas of the transmitter 1001 and/or the receiver 1002 may be configured in an array form. Hereinafter, an example of emitting an electromagnetic wave signal from the transmitter 1001 will be described, but the present embodiment is not limited to this.

According to one embodiment, the transmitter 1001 and/or the receiver 1002 may be placed on the side or bottom of the display panel 203. When the transmitter 1001 and/or the receiver 1002 are disposed at the bottom of the display panel 203, part of the corresponding portion of the buffer member 201 may be removed. For example, a slot may be formed in the metal material included in the buffer member 201 and the transmitter 1001 and/or receiver 1002 may be placed in the formed slot.

According to one embodiment, the transmitter 1001 and the receiver 1002 may each be placed on different sides of the display panel 203.

According to one embodiment, the electromagnetic wave signal emitted from the transmitter 1001 may be reflected and/or transmitted at an interface where the difference in refractive index is large, substantially similar to an optical signal.

Referring to FIG. 10, as the external attachment 1010 is attached to the outer surface of the window 213, the electromagnetic wave signal emitted from the transmitter 1001 passes through the window 213 and is connected to the external attachment 1010 and the external air layer. Reflection may occur primarily at the interface. The signal emitted from the transmitter 1001 may be mainly reflected in the display panel 203 and/or the buffer member 201 containing a metal component, and may be mainly transmitted in other layers.

According to one embodiment, the electromagnetic wave signal emitted from the transmitter 1001 may form a signal path 1013 in the form of a wave guide within a plurality of stacked structures of the display 1000, and the external attachment 1010 The path may be changed from the signal progression path 1003 that may occur in the absence of this. The electromagnetic wave signal emitted from the transmitter 1001 may have additional transmission, reflection and/or loss characteristics due to the external attachment 1010, resulting in changes in the intensity and phase of the electromagnetic wave signal reaching the receiver 1002.

According to one embodiment, signal characteristics including the strength and phase of a signal emitted from the transmitter 1001 and received by the receiver 1002 in the presence of an external attachment may be obtained. The acquired signal characteristics can be compared and analyzed with reference signal data obtained in the absence of an external attachment 1010 and stored in the memory, as described with reference to FIG. 9 .

FIG. 11 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.

Referring to FIG. 11, reference signal data 1103 for a signal acquired without an external attachment, as shown in FIG. 9, can be compared and analyzed with data 1113 for a signal acquired with an external attachment. Compared to the reference signal data 1103, the phase and size of the signal data 1113 obtained when an external attachment is attached may be changed. Therefore, the presence or absence of the attachment 1010 can be determined based on this by comparing the phase and magnitude of the acquired signal with the reference signal data.

FIG. 12 is a diagram illustrating a method of obtaining a signal for recognizing an attachment to a display of an electronic device according to various embodiments.

FIG. 12 illustrates signal transmission and reception on the display 1200 (e.g., the display 210 of FIG. 2A or 2B) of the electronic device 200 (e.g., the electronic device 101 of FIG. 1) according to various embodiments. This is a drawing showing an example of the structure. The structure of the display 1200 is the same as or similar to the material, structure, and/or function of the display 210 described with reference to FIG. 2A, and detailed description thereof will be omitted here.

Referring to FIG. 12, the electronic device 200 is a component of a detection module (e.g., the detection module 230 in FIG. 2a) and uses the light source 1201 inside the display panel 203 as a transmitter (e.g., the transmitter in FIG. 2a). (231)), and a light quantity recognition sensor 1202, such as a fingerprint sensor or an illumination sensor, can be used as a receiver (e.g., receiver 232 in FIG. 2A). In this case, the transmitter 1201 may emit an optical signal in the visible light band. The transmitter 1021 may emit an optical signal substantially vertically in a direction outside the display 1200.

According to one embodiment, when there is no external attachment to the display 1200, the optical signal 1203 emitted from the transmitter 1201 is transmitted to the outside at the interface between the window 213 and the external air layer, and the optical signal 1205 is partially reflected. ) can be received by the receiver 1202.

According to one embodiment, when there is an external attachment to the display 1200, the optical signal 1213 emitted from the transmitter 1201 is partially reflected at the interface between the window 213 and the external attachment 1210. In addition, most of it passes through the window 213 and is transmitted to the outside at the interface between the external attachment 1210 and the external air layer, and the optical signal 1215 partially reflected at the interface between the external attachment 1210 and the external air layer is transmitted to the receiver 1202. ) can be received.

FIG. 13 is a diagram illustrating a method of analyzing signals obtained to recognize attachments to a display of an electronic device according to various embodiments.

According to one embodiment, as shown in FIG. 7 or 12, when an external attachment (710 or 1210) is present, the transmission and reflection process of an optical signal occurring at the interface between the external attachment (710 or 1210) and the external air layer As this occurs, a data image 1320 or 1330 that is different from the image 1310 of the reference signal data acquired by the receiver 702 or 1202 in the absence of the external attachment 710 or 1210 may be obtained.

According to one embodiment, image data 1320 acquired when a first external attachment (eg, a protective film) is attached may be compared and analyzed with a reference signal data image 1310 acquired without the attachment. Depending on characteristics such as the material, curvature, and surface reflection characteristics of the external attachment, image data 1320 that is different from the reference image data 1310 obtained in the absence of the attachment may be obtained. For example, the location of the brightest part 1321 and/or the darkest part 1322 in the acquired image data 1320 is the brightest part 1311 of the reference signal data image 1310 in the case where there is no attachment. It may be different from the location of and/or the location of the darkest part (1312). For example, the images in FIG. 13 may be images displayed in 256 gray scale. For example, if a value of 255 is displayed in white color and a value of 0 is displayed in black depending on the signal intensity value, the signal intensity value between 255 and 0 may be displayed in gray scale according to the relative signal intensity. . For example, the location of a representative value (e.g., maximum, minimum, median, mode, or average) of a pixel value (e.g., luminance) compared to the reference signal data image 1310, the bright or dark area compared to the middle range of the pixel value. At least one of the characteristics of the pattern, such as size or position, ratio of bright and dark parts, phase, shape, size or position, may be different. For example, the characteristics of the high-frequency component on the image 1310, for example, the presence or absence of a grid or stripe pattern formed in the image 1310, may be different from the reference signal data image 1310.

According to one embodiment, image data 1330 acquired when a second external attachment (eg, protective glass) is attached may be compared and analyzed with a reference signal data image 1310 acquired without the attachment. Depending on characteristics such as the material, curvature, and surface reflection characteristics of the external attachment, image data 1320 that is different from the reference image data 1310 obtained in the absence of the attachment may be obtained. For example, the location of the brightest part 1331 and/or the darkest part 1332 in the acquired image data 1330 is the brightest part 1311 of the reference signal data image 1310 in the case where there is no attachment. It may be different from the location of and/or the location of the darkest part (1312). For example, the location of a representative value (e.g., maximum, minimum, median, mode, or average) of a pixel value (e.g., luminance) compared to the reference signal data image 1310, the bright or dark area compared to the middle range of the pixel value. At least one of the characteristics of the pattern, such as size or position, ratio of bright and dark parts, phase, shape, size or position, may be different. For example, the characteristics of the high-frequency component on the image 1320, for example, the presence or absence of a grid or stripe pattern formed on the image 1330, may be different from the reference signal data image 1310.

14 illustrates a transmitter 1401 for a display 1400 (e.g., display 210 of FIG. 2A or 2B) of an electronic device 200 (e.g., electronic device 101 of FIG. 1) according to various embodiments. This is a diagram showing an example of the arrangement of a transmitter 231 in FIG. 2A) and a receiver 1402 (e.g. receiver 232 in FIG. 2A).

According to one embodiment, the transmitter 1401 may be configured in a module form and attached to the electronic device 200. The transmitter 1401 may be disposed at the bottom of the display 1400 or at the bottom of a window (e.g., window 213 in FIG. 2B) or on the side of the display 210, as described above in FIGS. 3, 4, or 5. .

According to one embodiment, the signal of the transmitter 1401 may include optical signals having various wavelengths, such as visible light (about 400 to about 800 nm) and infrared light (about 800 to about 1000 nm).

According to one embodiment, the transmitter 1401 includes a single light source that emits optical signals in a single wavelength band, a single light source that emits optical signals in various wavelength bands, or a plurality of light sources (e.g., : LED, VCSEL, LASER).

According to one embodiment, the optical signal of the transmitter 1401 is incident on the window 213 at a specified angle θ and is substantially totally reflected at the surface of the window 213, that is, the interface between the window 213 and the external air layer, and is transmitted to the receiver 232. ) can be configured to be received. For example, the optical signal emission angle (θ) of the transmitter 1401 is configured so that the window 213 incident angle (θ1) 1421 satisfies Snell's law by considering the refractive index of the air and the window 213. As a result, the reflected signal 1423 can be substantially totally reflected. At an angle 1411 smaller than the total reflection incident angle θ1 1421, the signal will be transmitted 1413, and at an angle 1431 larger than the total reflection incident angle θ1 1421, the signal will be reflected 1433.

According to one embodiment, when located at the bottom of the display 1400, the positions of the transmitter 1401 and the receiver 1402 are such that the distance is 2t x tan(θ1) based on the thickness t of the display 1400. It can be placed.

15 illustrates a transmitter (e.g., display 1500) of an electronic device 200 (e.g., electronic device 101 of FIG. 1) (e.g., display 210 of FIG. 2A or 2B) according to various embodiments. This is a diagram showing an example of the arrangement of a transmitter 231 in FIG. 2A) and a receiver (eg, receiver 232 in FIG. 2A).

According to one embodiment, when the transmitter 231 and the receiver 232 are implemented as antennas, the transmitter 231 and the receiver 232 are used to increase the influence in the process of transmitting radio waves using the display 1500 as a guide. can be placed on the outermost side of each opposing position. For example, the transmitter 231 and the receiver 232 may be disposed at opposing positions 1511 and 1512, respectively. For example, the transmitter 231 and the receiver 232 may be disposed at opposing positions 1521 and 1522, respectively. For example, the transmitter 231 and the receiver 232 may be disposed at opposing positions 1531 and 1532, respectively.

According to one embodiment, the transmitter and receiver antennas may use a frequency of about 7 GHz or higher to minimize interference with commonly used frequencies. For example, the antennas of the transmitter and receiver may use the UWB frequency band (e.g., about 7.2 to about 10.2 GHz). For example, the operating frequencies of the antennas of the transmitter and receiver are in the frequency bands of common communication channels (e.g. 3G/4G/5G, BT/WIFI frequencies and 2 ^nd , 3 ^rd , 4 ^th , 5 ^th harmonics) to avoid interference. Can be excluded.

According to one embodiment, when a band of about 10 GHz is used as the operating frequency of the transmitter and receiver antenna, the wavelength in the air is about 30 mm, and considering the dielectric constant of the display 1500, which acts as a guide, the interval is more than three times the wavelength. (e.g., about 6cm or more). The transmitter antenna and the receiving antenna can be placed.

According to one embodiment, when the transmitter 231 and/or the receiver 232 are implemented as an array antenna, transmission and reception characteristics can be enhanced through phase adjustment.

According to one embodiment, the transmitter 231 and the receiver 232 are connected to a circuit (e.g., amplifier, filter, mixer) for transmitting and receiving signal processing to transmit a transmitted signal under the control of a processor (e.g., the processor 220 of FIG. 2A). It can be implemented to generate and process a received signal, for example, a transmitter antenna and a receiver antenna can both be connected to one circuit, so that the transmit operation and the receive operation can be processed together, for example, the transmitter antenna The and receiver antennas may be separately connected to respective circuits operated by synchronized signals and may be implemented to be processed separately.

According to one embodiment, synchronized transmission and reception circuitry can be operated for a transmitter and a receiver, thereby causing a signal to be emitted through a transmitter antenna and a signal to be received by a receiver antenna.

According to one embodiment, the transmission signal of the transmitter emits one or more specified frequency signals, and the phase and size of the signal received by the receiver antenna are compared with the reference signal data signal to recognize the presence or absence of an attachment or the characteristics of the attachment. You can.

FIG. 16 is a flowchart illustrating a method of recognizing an attachment to a display (e.g., the display 210 of FIG. 2b) of an electronic device (e.g., the electronic device 200 of FIG. 2a) according to various embodiments.

The embodiment shown in FIG. 16 is only one embodiment, and the operation sequence according to various embodiments disclosed in this document may be different from that shown in FIG. 16, and some operations shown in FIG. 16 are omitted or the order between operations may change or operations may be merged.

According to one embodiment, operations 1601 to 1607 may be understood as being performed by a processor (e.g., processor 220 of FIG. 2A) of an electronic device (e.g., electronic device 200 of FIG. 2A).

Referring to FIG. 16, the processor of the electronic device 200 (e.g., the processor 220 in FIG. 2A) controls the detection module (e.g., the detection module 230 in FIG. 2A) to obtain a measurement signal and confirm the attachment. You can.

According to one embodiment, the processor may determine whether environmental conditions are met in operation 1601. The environmental condition may include one or more of the operating state of the electronic device 200, movement, location, time, or user's state. The environmental conditions may include, for example, conditions regarding the current surrounding environment of the electronic device 200. For example, when the detection module 230 uses optical signals such as visible light or IR, the environmental conditions may include conditions in which external light is not possible. For example, this may include a case where the amount of light is less than or equal to a specified condition through an illumination sensor (e.g., the illumination sensor 255 of FIG. 2A). For example, the environmental condition may include a condition in which the electronic device 200 is motionless or inactive (eg, sleep). For example, when the detection module 230 uses an RF signal, the environmental conditions may include conditions in which external RF noise is not possible. For example, the environmental condition may include a condition in which the electronic device 200 is not connected to an external device for charging or mirroring. For example, the environmental condition may include a condition in which the electronic device 200 is motionless or inactive (eg, sleep). For example, the environmental conditions at the time of generating the reference signal data of the display 210 may be stored in a memory (eg, the memory 240 of FIG. 2A).

According to one embodiment, during the manufacturing process of the electronic device 200, the detection module 230 is controlled under conditions in which external light does not affect various sensors (e.g., a dark room or a black box), and one or more background images are used as reference signal data. You can take pictures and save them. The captured images can be individually stored in memory, or average data can be calculated and stored in memory. In this case, for example, illuminance data obtained using an illuminance sensor can be stored in the memory as environmental data.

According to one embodiment, when measuring using an optical signal, the environmental condition is such that when the current illuminance measured by the illuminance sensor is lower than the illuminance stored in the memory during the manufacturing process, the electronic device 200 is in an inactive state (e.g., sleep). ), when taking pictures with various cameras of the electronic device 200 (e.g., a camera disposed on the front where the display is installed or a camera disposed on the rear opposite it), the value of each pixel or a large cluster of pixels is changed during the manufacturing process. If it is darker than the captured pixel value, if no movement is detected by a motion detection sensor (e.g., an acceleration sensor or geomagnetic sensor), if the electronic device 200 is charging, if the electronic device 200 is repeatedly charged more than a specified number of times , when currently located at a location (e.g., the user's home) at a specified time, or after a designated point in time after the user has sufficiently entered a sleep state in conjunction with the sleep function in the application installed on the electronic device 200. It may contain more than one.

According to one embodiment, when using an RF signal, when manufacturing the electronic device 200 in a space without interference between radio waves, a signal with a specified frequency and a specified size is transmitted and received using a detection module, and the received signal The phase and magnitude of can be stored as reference signal data in a memory (e.g., memory 240 in FIG. 2A). In this case, one or more reference signal data can be stored in the memory using one or more signal frequencies. When using an RF signal , when manufacturing the electronic device 200 in a space without interference between radio waves, the reception intensity level of signals of frequencies other than the specified frequency can be stored in the memory as environmental data.

According to one embodiment, when measuring using an RF signal, the environmental conditions are determined by the motion sensor of the electronic device 200 when there is no movement or when the electronic device 200 does not charge or connect to an external device. , if the reception strength of a frequency signal other than the frequency signal used when acquiring the reference signal data generated during the manufacturing process and stored in the memory is below a specified level, the electronic device 200 is repeatedly placed at a location (e.g. : This may include one or more of the following: a case where the user is currently located in the user's home) or a case after a designated point in time after the user has sufficiently entered a sleep state in conjunction with a sleep function in an application installed on the electronic device 200.

According to one embodiment, the processor may control the detection module to obtain a measurement signal in operation 1603 when the environmental condition is met.

According to one embodiment, when the detection module uses an optical signal, the processor controls the detection module to emit an optical signal and receive at least a portion of the reflected optical signal to obtain an optical image as measurement signal data. .

According to one embodiment, when the detection module uses an RF signal, the processor controls the detection module to emit an RF signal and to receive at least a portion of the reflected RF signal to generate a signal including the phase and size of the received signal. Characteristics can be acquired as measurement signal data.

According to one embodiment, the processor may acquire measurement signal data more than a specified number of times at specified intervals.

According to one embodiment, the processor may analyze characteristics of signal data obtained in operation 1605.

According to one embodiment, the processor may compare and analyze the characteristics of the acquired signal data with reference signal data stored in the memory.

According to one embodiment, the processor determines whether, for example, the location of the center value of the light source shape (e.g., the brightest part) shown in the image has been moved for the acquired signal data compared to the image of the reference signal data, and the size of the light source shape. Compare and analyze one or more of the following: whether the image has changed compared to the reference signal data image, whether the average value and standard deviation of all pixels in the image have changed, whether the maximum and minimum values of the pixel have changed at a specified location, and whether the image frequency characteristics have changed. can do.

According to one embodiment, the processor may check the amount of change in the acquired signal data, for example, by comparing the phase or magnitude of the acquired signal with the phase or magnitude of the reference signal data.

According to one embodiment, the processor may determine whether an attachment exists by analyzing the characteristics of the signal data obtained in operation 1607.

According to one embodiment, if the position of the center value of the light source shape (e.g., the brightest part) shown in the image of the acquired signal data moves compared to the image of the reference signal data, the processor changes the size of the light source shape to the reference signal data. In one or more of the following cases: when there is a change compared to the image, when the average value or standard deviation of all pixels in the image changes, when the maximum and minimum values of the pixel at a specified location change, or when the image frequency characteristics change, the display You can confirm that an attachment has been attached.

According to one embodiment, the processor determines the location of the center value of the light source shape (e.g., the brightest part) shown in the image of the acquired signal data, the distance moved compared to the image of the reference signal data, and the reference signal data of the size of the light source shape. For one or more of the change amount compared to the image, the average value of all pixels in the image, the change amount of the standard deviation, the change amount of the maximum and minimum values of the pixel at a specified location, and the change amount of the image frequency characteristic, the amount of change is preliminarily based on learning such as machine learning. Using the constructed learning data, the characteristics of the attachment, such as the presence or absence of an attachment (e.g., protective film or protective glass) or the thickness of the attachment, can be confirmed.

According to one embodiment, the processor may check the amount of change in the acquired signal data, for example, by comparing the phase or magnitude of the acquired signal with the phase or magnitude of the reference signal data.

According to one embodiment, the processor builds in advance based on learning such as machine learning for the acquired signal data, for example, the amount of change in the phase or magnitude of the acquired signal compared to the phase or magnitude of the reference signal data. Using the learned data, the characteristics of the attachment, such as the presence or absence of an attachment (e.g., protective film or protective glass) or the thickness of the attachment, can be confirmed.

FIG. 17 is a flowchart illustrating a method of recognizing an attachment to a display (e.g., the display 210 of FIG. 2b) of an electronic device (e.g., the electronic device 200 of FIG. 2a) according to various embodiments.

The embodiment shown in FIG. 17 is only one embodiment, and the operation sequence according to various embodiments disclosed in this document may be different from that shown in FIG. 17, and some operations shown in FIG. 17 are omitted or the order between operations may change or operations may be merged.

According to one embodiment, operations 1701 to 1717 may be understood as being performed by a processor (e.g., processor 220 of FIG. 2A) of an electronic device (e.g., electronic device 200 of FIG. 2A). Referring to FIG. 17, the processor of the electronic device 200 (e.g., the processor 220 in FIG. 2A) controls the detection module (e.g., the detection module 230 in FIG. 2A) to obtain a measurement signal and determine whether an attachment is attached. can be judged.

According to one embodiment, the processor may determine whether environmental conditions are met in operation 1701. The environmental condition may include one or more of the operating state of the electronic device 200, movement, location, time, or user's state. The environmental conditions may include, for example, conditions regarding the current surrounding environment of the electronic device 200. For example, when the detection module 230 uses optical signals such as visible light or IR, the environmental conditions may include conditions in which external light is not possible. For example, this may include a case where the amount of light is below a specified condition through an illumination sensor (e.g., the illumination sensor 255 of FIG. 2A). For example, the environmental condition may include a condition in which the electronic device 200 is motionless or inactive (eg, sleep). For example, when the detection module 230 uses an RF signal, the environmental conditions may include conditions in which external RF noise is not possible. For example, the environmental condition may include a condition in which the electronic device 200 is not connected to an external device for charging or mirroring. For example, the environmental condition may include a condition in which the electronic device 200 is motionless or inactive (eg, sleep). For example, the environmental conditions at the time of generating the reference signal data of the display 210 may be stored in a memory (eg, the memory 240 of FIG. 2A).

According to one embodiment, during the manufacturing process of the electronic device 200, the detection module 230 is controlled under conditions in which external light does not affect various sensors (e.g., a dark room or a black box), and one or more background images are used as reference signal data. You can take a picture and save it in memory. The captured images can be individually stored in memory, or average data can be calculated and stored in memory. In this case, for example, illuminance data obtained using an illuminance sensor can be stored in the memory as environmental data.

According to one embodiment, when measuring using an optical signal, the environmental condition is such that when the current illuminance measured by the illuminance sensor is lower than the illuminance stored in the memory during the manufacturing process, the electronic device 200 is in an inactive state (e.g., sleep). ), when taking pictures with various cameras of the electronic device 200 (e.g., a camera disposed in the front where the display is located or a camera disposed in the opposing rear), the value of each pixel or a large cluster of pixels is changed during the manufacturing process. If it is darker than the captured pixel value, if no movement is detected by a motion detection sensor (e.g., an acceleration sensor or geomagnetic sensor), if the electronic device 200 is charging, if the electronic device 200 is repeatedly charged more than a specified number of times , when currently located at a location (e.g., the user's home) at a specified time, or after a designated point in time after the user has sufficiently entered a sleep state in conjunction with the sleep function in the application installed on the electronic device 200. It may contain more than one.

According to one embodiment, when using an RF signal, when manufacturing the electronic device 200 in a space without interference between radio waves, a signal with a specified frequency and a specified size is transmitted and received using a detection module, and the received signal The phase and magnitude of can be stored in a memory (eg, memory 240 in FIG. 2A) as reference signal data. In this case, one or more reference signal data can be stored in memory using one or more signal frequencies. When using an RF signal, when manufacturing the electronic device 200 in a space without interference between radio waves, the reception intensity level of signals of frequencies other than the designated frequency can be stored in the memory as environmental data.

According to one embodiment, when measuring using an RF signal, the environmental conditions are determined by the motion sensor of the electronic device 200 when there is no movement or when the electronic device 200 does not charge or connect to an external device. , if the reception strength of a frequency signal other than the frequency signal used when acquiring the reference signal data generated during the manufacturing process and stored in the memory is below a specified level, the electronic device 200 is repeatedly placed at a location (e.g. : This may include one or more of the following: a case where the user is currently located in the user's home) or a case after a designated point in time after the user has sufficiently entered a sleep state in conjunction with a sleep function in an application installed on the electronic device 200.

According to one embodiment, if the environmental condition is not met in operation 1703, the processor may return to operation 1701 if the specified time elapses to check again whether the environmental condition is met.

According to one embodiment, the processor may control the detection module to obtain a measurement signal in operation 1705 when the environmental condition is met.

According to one embodiment, when the detection module uses an optical signal, the processor controls the detection module to emit an optical signal and receive at least a portion of the reflected optical signal to obtain an optical image as measurement signal data. .

According to one embodiment, when the detection module uses an RF signal, the processor controls the detection module to emit an RF signal and to receive at least a portion of the reflected RF signal to generate a signal including the phase and size of the received signal. Characteristics can be acquired as measurement signal data.

According to one embodiment, the processor may acquire measurement signal data more than a specified number of times at specified intervals.

According to one embodiment, the processor may analyze characteristics of signal data obtained in operation 1707.

According to one embodiment, the processor may compare and analyze the characteristics of the acquired signal data with reference signal data stored in the memory.

According to one embodiment, the processor determines whether, for example, the location of the center value of the light source shape (e.g., the brightest part) shown in the image has been moved for the acquired signal data compared to the image of the reference signal data, and the size of the light source shape. Compare and analyze one or more of the following: whether the image has changed compared to the reference signal data image, whether the average value and standard deviation of all pixels in the image have changed, whether the maximum and minimum values of the pixel have changed at a specified location, and whether the image frequency characteristics have changed. can do.

According to one embodiment, the processor may check the amount of change in the acquired signal data, for example, by comparing the phase or magnitude of the acquired signal with the phase or magnitude of the reference signal data.

According to one embodiment, the processor may check whether the characteristics of the signal data obtained in operation 1709 substantially match the characteristics of the reference signal data.

According to one embodiment, if the characteristics of the acquired signal data substantially match the characteristics of the reference signal data, the processor may confirm that there is no attachment in operation 1711.

According to one embodiment, if the characteristics of the acquired signal data do not match the reference signal data in at least one or more, the processor may confirm that there is an attachment. In this case, the processor may check whether the characteristics of the signal data obtained in operation 1713 substantially match the characteristics of the specified signal data.

According to one embodiment, by performing learning based on machine learning on a plurality of acquired signal data for a specified attachment (e.g., a protective film or protective glass of a specified type, thickness, or mutual name), a specified attachment corresponding to the specified attachment is performed. Signal data can be built in advance. For example, specified signal data may include the location of the centroid value of the light source feature (e.g., the brightest part) as it appears in the image acquired for the given attachment, the size of the light source feature, the average value of all pixels in the image, the standard deviation, and the pixel at the specified location. It may include one or more of the maximum and minimum values of and image frequency characteristics.

According to one embodiment, if the characteristics of the signal data obtained in operation 1713 match the characteristics of the specified signal data, the processor may confirm that the added attachment is an attachment corresponding to the specified signal data.

According to one embodiment, if the characteristics of the signal data obtained in operation 1713 substantially match the characteristics of the specified signal data, the processor determines the electronic device (electronic device) based on a preset setting value according to the characteristics of the specified signal data in operation 1715. 200) You can change the settings for the components. The setting value according to the specified signal data characteristics can be derived in advance through experimentation using an attachment having the specified signal data characteristics during the manufacturing process of the electronic device 200 and stored in the memory in advance. Components of the electronic device 200 that apply settings according to specified signal data characteristics may include one or more of a fingerprint sensor, a pressure sensor, a camera, a proximity sensor, and a touch sensor, but are not limited to optical signals or RF signals. It can be applied to various components whose operation is affected by changes in signal characteristics.

According to one embodiment, if the characteristics of the signal data obtained in operation 1713 do not match the characteristics of the specified signal data, the processor may provide a notification about the attachment in operation 1717. For example, notifications about attachments can be provided when a fingerprint sensor, camera, proximity sensor, or touch sensor is used. For example, notifications about attachments could be provided at points when normal operation fails using a fingerprint sensor, camera, proximity sensor, or touch sensor. For example, a notification about an attachment may be provided when the electronic device 200 is activated from an inactive state (eg, sleep).

According to various embodiments, an electronic device (e.g., the electronic device 200 of FIG. 2) includes a housing, a display mounted on at least a portion of at least one side of the housing, and disposed within an area of the housing to transmit a signal in the direction of the display. A transmitter that transmits (e.g., the transmitter 231 in FIG. 2A), a receiver disposed within the area of the housing and receiving a signal corresponding to the transmitted signal (e.g., the receiver 232 in FIG. 2A), and a memory (e.g. : Memory 240 of FIG. 2A) and a processor (e.g., processor 220 of FIG. 2A) operatively connected to the transmitter and the receiver, wherein the processor controls the transmitter when specified environmental conditions are met. It may be set to analyze a signal received by the receiver in response to a transmitted signal and determine whether an external attachment to the display exists.

According to various embodiments, the transmitter may be placed at the bottom or side of the display.

According to various embodiments, the processor may confirm the presence or absence of the external attachment by comparing the signal received by the receiver with reference signal data.

According to various embodiments, the reference signal data may be acquired under the environmental conditions in the absence of the external attachment and stored in the memory.

According to various embodiments, the transmitted signal includes an optical signal, and the reference signal data may include data on one or more of a pixel value, a light source shape, or frequency characteristics of an image of the received signal.

According to various embodiments, the transmitted signal includes a radio frequency (RF) signal, and the reference signal data may include one or more of the magnitude or phase of the received signal.

According to various embodiments, the environmental condition may include one or more conditions of illumination, operating state of the electronic device, movement, location, time, or user's state.

According to various embodiments, the processor may check the characteristics of the external attachment by comparing the signal received by the receiver with pre-stored designated signal data.

According to various embodiments, the designated signal data may be learned and stored in advance using learning data according to the characteristics of the external attachment.

According to various embodiments, the processor may provide a notification about the external attachment when it is confirmed that the external attachment exists.

According to various embodiments, the transmitter may include a light source inside the display, and the receiver may include a light quantity recognition sensor within the housing.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

The embodiments disclosed in this document are merely presented as examples to easily explain the technical content and aid understanding, and are not intended to limit the scope of the technology disclosed in this document. Therefore, the scope of the technology disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical idea of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims (20)

In electronic devices,
housing;
a display mounted on at least a portion of at least one side of the housing;
a transmitter disposed within the area of the housing to transmit a signal in the direction of the display;
a receiver disposed within the area of the housing to receive a signal corresponding to the transmitted signal;
Memory; and
A processor operatively connected to the transmitter and the receiver,
The processor:
When specified environmental conditions are met, control the transmitter to analyze the signal received by the receiver in response to the transmitted signal,
An electronic device configured to determine the presence or absence of an external attachment to the display.
According to paragraph 1,
The transmitter is an electronic device disposed at the bottom or side of the display.
According to paragraph 1,
The processor determines the presence or absence of the external attachment by comparing the signal received by the receiver with reference signal data.
According to paragraph 3,
The reference signal data is acquired under the environmental conditions in the absence of the external attachment and stored in the memory.
According to paragraph 3,
The transmitted signal includes an optical signal,
The reference signal data includes data on one or more of a pixel value, a light source shape, or frequency characteristics of an image of the received signal.
According to paragraph 3,
The transmitted signal includes a radio frequency (RF) signal,
The reference signal data includes one or more of the magnitude or phase of the received signal.
According to claim 5 or 6,
The environmental condition includes one or more of illuminance, operating state of the electronic device, movement, location, time, or user's state.
According to paragraph 1,
The processor is an electronic device that compares the signal received by the receiver with pre-stored designated signal data to confirm characteristics of the external attachment.
According to clause 8,
The designated signal data is learned and stored in advance using learning data according to the characteristics of the external attachment.
According to paragraph 1,
The electronic device wherein the processor provides a notification about the external attachment when it is confirmed that the external attachment exists.
According to paragraph 1,
The transmitter includes a light source inside the display, and the receiver includes a light quantity recognition sensor within the housing.
In the method of the electronic device,
Checking whether environmental conditions of the electronic device are met;
Transmitting a signal from a transmitter disposed within a housing of the electronic device toward a display mounted on at least a portion of at least one side of the housing and receiving a signal corresponding to the transmitted signal from a receiver disposed within the housing;
Analyzing the received signal; and
A method comprising: determining the presence or absence of an external attachment to the display based on the analysis.
According to clause 12,
The analysis operation is a method of determining the presence or absence of the external attachment by comparing the received signal with reference signal data.
According to clause 13,
A method wherein the reference signal data is acquired under the environmental conditions in the absence of the external attachment and stored in the memory.
According to clause 13,
The transmitted signal includes an optical signal,
The reference signal data includes data on one or more of a pixel value, a light source shape, or frequency characteristics of an image of the received signal.
According to clause 13,
The transmitted signal includes a radio frequency (RF) signal,
The reference signal data includes one or more of the magnitude or phase of the received signal.
According to claim 15 or 16,
The method wherein the environmental conditions include one or more of illuminance, operating state of the electronic device, movement, location, time, or user's state.
According to clause 12,
The analysis operation is a method of confirming the characteristics of the external attachment by comparing the received signal with pre-stored designated signal data.
According to clause 18,
A method in which the designated signal data is learned and stored in advance using learning data according to the characteristics of the external attachment.
According to clause 12,
The method further includes providing a notification about the external attachment when it is confirmed that the external attachment exists.

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