KR20230174423A - Rotaty union assembly - Google Patents

Abstract

A rotary union assembly mounted on a semiconductor substrate processing apparatus that processes a semiconductor substrate while rotating a semiconductor loading unit accommodating the semiconductor substrate is disclosed. The rotary union assembly includes a plurality of fluid supply passages, a rotating shaft extending into the semiconductor substrate processing apparatus, a hollow first housing accommodating at least a portion of the rotating shaft therein, and a gap between the first housing and the rotating shaft. a rotating shaft sealing device including a sealing portion for sealing the rotating shaft, a hollow second housing accommodating at least a portion of the rotating shaft therein, a rotary union supplying fluid to the fluid supply path of the rotating shaft, and the first It includes an adapter disposed between the housing and the second housing and detachably fixed to the first housing and the second housing.

Description

Rotary union assembly {ROTATY UNION ASSEMBLY}

The present invention relates to a rotary union assembly, and more specifically, to a rotary union assembly that combines a rotary shaft sealing device for maintaining a vacuum in semiconductor equipment and a rotary union that supplies fluid to the rotating shaft.

Semiconductor equipment is used for mass production of integrated circuits. In order to deposit a thin film of a certain thickness on a substrate such as a semiconductor wafer or glass, physical vapor deposition (PVD) methods such as sputtering and chemical vapor deposition (CVD) using chemical reactions, etc. This is used. Chemical vapor deposition methods include Atmospheric Pressure CVD (APCVD), Low Pressure CVD (LPCVD), and Plasma Enhanced CVD. In addition, furnace equipment for heat treatment of substrates is used for film formation, oxidation, annealing, and impurity diffusion of semiconductor wafers.

In these semiconductor devices, a rotary union may be installed to transfer fluid flowing from the fixed part to the rotating part. In other words, the rotary union is a rotary pipe joint device used to supply or discharge fluid from a fixed pipe to the rotating part of various mechanical devices without leaking fluid under pressure or in a vacuum condition below atmospheric pressure. Heat media such as steam, hot water, and thermal oil for heating drums and cylinders, etc., and refrigerant media such as water, ammonia, and freon for cooling, or compressed air and hydraulic oil for rotating devices such as clutches and brakes that operate with fluids. It can be used when you want to supply media. Additionally, the rotary union is provided with a seal to maintain the vacuum of the semiconductor equipment.

These rotary unions may have different seal performance or cooling performance through fluid supply depending on the semiconductor equipment to be installed. Additionally, seal performance and cooling performance through fluid supply can affect each other.

However, the conventional rotary union has a structure in which the seal function and fluid supply function are provided as a single device, so it is difficult to meet the various seal performance or cooling performance required in semiconductor equipment, and when developing a rotary union product, there is a need for seal performance and cooling performance. Testing also has difficult problems. Additionally, if some parts of the rotary union are damaged, replacement is difficult.

Japanese Patent Application No. 2011-521226

The present invention is intended to solve this problem, and an embodiment of the present invention aims to provide a rotary union assembly that can be provided to suit various seal performance or cooling performance required in semiconductor equipment.

Additionally, an embodiment of the present invention aims to provide a rotary union assembly that is easy to replace when some parts of the rotary union assembly are damaged.

Additionally, an embodiment of the present invention aims to provide a union assembly capable of cooling the housing to minimize the effect of heat transferred from the flange to the sealing member.

The problems to be solved in the embodiments are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

According to an embodiment of the present invention, a rotary union assembly is mounted on a semiconductor substrate processing apparatus that processes a semiconductor substrate while rotating a semiconductor loading unit accommodating the semiconductor substrate, and includes a plurality of fluid supply paths and the semiconductor substrate processing apparatus. A rotating shaft sealing device including a rotating shaft extending inward, a hollow first housing accommodating at least a portion of the rotating shaft therein, a sealing portion for sealing a gap between the first housing and the rotating shaft, and at least one of the rotating shafts. A rotary union that includes a hollow second housing partially accommodating the inside, and supplies fluid to the fluid supply path of the rotating shaft, and is disposed between the first housing and the second housing to connect the first housing and the second housing. 2 It may include an adapter that is detachably fixed to the housing.

Additionally, the adapter may have a ring shape.

In addition, a hole is formed in the first housing, a through hole corresponding to the hole in the first housing is formed in the adapter, the adapter is detachably fixed to the first housing by a fastener, and the adapter is detachably fixed to the first housing. 2 A hole is formed in the housing, and a through hole corresponding to the hole in the second housing is formed in the adapter, so that the adapter can be detachably fixed to the second housing by a fastener.

In addition, the first housing includes a hollow inner housing having a flange for mounting on a semiconductor processing substrate device, and a hollow outer housing disposed on the inner housing between the flange and the adapter, and the inner housing. An annular space is formed between the housing and the external housing so that coolant can be supplied to the space.

Additionally, the annular space may be formed by a concave groove on the outer surface of the inner housing.

Additionally, at least a portion of the groove may be formed in an area between the flange and the first sealing member.

In addition, the groove is formed as a plurality of grooves with different depths, and the plurality of grooves may be formed with a greater depth as the groove is closer to the flange.

Additionally, a plurality of fluid communication holes are provided in the second housing, and the rotary union may include a plurality of annular flow path forming members that communicate with the fluid communication holes and the flow path.

In addition, the flow path forming member includes a pair of ring portions spaced apart from each other, an annular base portion connecting and supporting the pair of ring portions, and one or more through holes penetrating the inner peripheral surface and outer peripheral surface of the base portion, The outer diameter of the ring portion is formed to be larger than the outer diameter of the base portion, so that a flow space can be formed along the circumference of the base portion.

Additionally, an O-ring may be formed on the outer peripheral surface of the flow path forming member to prevent movement within the housing and perform sealing on the outer peripheral surface facing the housing.

Additionally, the sealing unit may include a vacuum seal provided to maintain a vacuum in the semiconductor substrate processing apparatus.

In addition, the sealing unit further includes an elastic seal provided to support the rotating shaft and suppress vibration, and both the vacuum seal and the elastic seal are made of a plastic material, and the elastic seal may have a greater elastic force than the vacuum seal.

In addition, the rotary union includes a plurality of lip seals provided between the second housing and the rotating shaft, and the plurality of lip seals are provided in pairs at each disposed position, and each pair of lip seals has lips curved in different directions. can be formed.

The present invention is intended to solve this problem. According to the rotary union assembly according to an embodiment of the present invention, the seal function and fluid supply function are implemented by devices having individual housings, that is, a rotary shaft seal and a rotary union. And these housings are detachably connected through an adapter, so that a rotary union assembly can be provided to suit various seal performance or cooling performance requirements in semiconductor equipment.

In addition, according to the rotary union assembly according to an embodiment of the present invention, when some parts of the rotary union assembly are damaged, it is easy to replace them.

Additionally, according to the rotary union assembly according to an embodiment of the present invention, a space for coolant can be formed to minimize the influence of heat transmitted from the flange to the sealing part.

1 is a perspective view of a rotary union assembly according to an embodiment of the present invention.
Figure 2 is a plan view of a rotary union assembly according to an embodiment of the present invention.
Figure 3 is a side view of a rotary union assembly according to one embodiment of the present invention.
Figure 4 is a bottom perspective view of a rotary union assembly according to an embodiment of the present invention.
Figure 5 is a cross-sectional view taken along line IV-IV in Figure 3.
Figure 6 is a diagram schematically showing the structure of a sealing part according to an embodiment of the present invention.
Figure 7 is a diagram schematically showing the structure of a sealing part according to another embodiment of the present invention.
Figure 8 is a perspective view of the flow path forming member of the rotary union of Figure 3.
FIG. 9 is a diagram for explaining the gap relationship between the flow path forming member of the rotary union of FIG. 3, the second housing, and the rotation shaft.

Below, with reference to the attached drawings, embodiments of the present invention are described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in order to clearly explain the embodiments of the present invention in the drawings, parts unrelated to the description have been omitted.

The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the invention. Singular expressions may include plural expressions, unless the context clearly indicates otherwise.

In this specification, terms such as “include,” “have,” or “equipped with” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. It can be understood that it does not exclude in advance the existence or possibility of addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

Additionally, the following embodiments are provided to provide a clearer explanation to those with average knowledge in the art, and the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

Hereinafter, preferred embodiments according to the present invention will be described with reference to the attached drawings.

1 to 5, the rotary union assembly 1 includes a rotating shaft 100, a rotating shaft sealing device 200, a rotary union 300, and an adapter 400 connecting the rotating shaft sealing device and the rotary union. do.

According to one embodiment of the present invention, the rotary shaft sealing device 200 is a device composed of elements that perform a sealing function to maintain the vacuum of the semiconductor substrate processing apparatus and accommodated in one housing. In addition, the rotary union 300 is a device composed of elements that perform the function of supplying fluid to a fluid supply path formed on a rotating shaft and housing them in one housing. In this way, the seal function and the fluid supply function are each implemented by the rotating shaft sealing device 200 and the rotary union 300, that is, by devices having individual housings, and these housings are separated through an adapter 400. Possibly connected. As an example, the housing 220 (hereinafter referred to as “first housing”) of the rotating shaft sealing device 200 is provided in a hollow cylindrical shape and accommodates a portion of the rotating shaft 100 therein. A hole is formed in the first housing 220, and a through hole corresponding to this hole is formed in the adapter 400, so that a fastener such as a screw is fastened to the hole and the through hole so that the first housing is detachable from the adapter. It can be fixed. The adapter 400 may have a hollow ring shape. In addition, the housing 320 (hereinafter referred to as “second housing”) of the rotary union 300 is provided in a hollow cylindrical shape and accommodates a portion of the rotating shaft 100 therein. A hole is formed in the second housing 320, and a through hole corresponding to this hole is formed in the adapter 400, so that a fastener such as a screw is fastened to the hole and the through hole, so that the second housing 320 is connected to the adapter ( 400) can be detachably fixed.

Accordingly, it becomes easy to provide an optimal rotary union assembly in accordance with the various seal performance and cooling performance required in the semiconductor substrate processing apparatus.

For example, seal performance or cooling performance may vary depending on the semiconductor substrate processing device to be installed, and cooling performance may affect seal performance. This is because the coolant introduced into the rotating shaft 100 by the rotary union 300 cools the rotating shaft 100, and thus may affect the sealing performance of the sealing member installed on the rotating shaft 100. According to one embodiment of the present invention, an appropriate rotary shaft sealing device 200 and a rotary union 300 can be selected and combined depending on the seal performance or cooling performance required for the semiconductor substrate processing device to be installed. Additionally, as a result of the actual test, if the selected combination of the rotary shaft sealing device 200 and the rotary union 300 does not meet the needs of the semiconductor substrate processing device to be installed, another combination can be easily tested. Therefore, it becomes easy to provide the optimal rotary union assembly 1 in accordance with the various seal performance and cooling performance required in the semiconductor substrate processing apparatus.

Next, the rotating shaft sealing device 200 will be described in detail. The rotating shaft sealing device 200 includes a first housing 220, a first sealing part 240, and a bearing 260. The first housing 220 consists of an inner housing 222 and an outer housing 224. The inner housing 222 is hollow and can accommodate the rotating shaft 100, the bearing 260, and the first sealing portion 240 therein. A flange 223 that is mounted on the semiconductor substrate processing apparatus may be provided on the upper part of the inner housing.

The outer housing 224 is hollow, and the inner diameter of the outer housing 224 is substantially the same as the outer diameter of the inner housing 222. The inner housing 222 is inserted into the hollow of the outer housing 224, and the adapter 400 is combined with the inner housing 222, so that the outer housing 224 is connected to the flange 223 of the inner housing 222 and the adapter ( 400).

Concave grooves 225, 226, and 227 may be formed in the inner housing 222 to form an internal space for coolant. As the inner housing 222 and the outer housing 224 are combined, the grooves 225, 226, and 227 form a housing interior space 228 by the inner housing 222 and the outer housing 224.

In the above-described structure, the inner housing 222 is inserted into the hollow of the outer housing 224 and the adapter 400 is coupled with the inner housing 222, so that the inner housing 222 and the outer housing 224 are integrally coupled. do. In the radial direction of the rotation shaft 100, the entire inner surface of the outer housing 224 is in contact with the entire outer surface of the inner housing 222, and in the axial direction of the rotation shaft 100, the outer housing 224 is in contact with the inner housing. Since it is stably fixed between the flange 223 of (222) and the adapter 400, the inner housing 222 and the outer housing 224 can be firmly coupled as one piece, and thus can be connected to the rotation of the rotating shaft 100. The impact of vibration is greatly reduced, and thus concerns about noise or coolant leaks can be reduced.

The grooves 225, 226, and 227 are formed in an annular shape in the radial direction of the rotation shaft 100, and are formed in an area where at least a portion of the first sealing portion 240 is disposed when viewed in the axial direction of the rotation shaft 100. Accordingly, the temperature of the first sealing part 240 can be lowered to extend the lifespan of the plurality of seals provided in the first sealing part 240. Preferably, the grooves 225, 226, and 227 may be formed over the entire area where the first sealing part 240 is disposed.

Additionally, when the semiconductor substrate processing apparatus is operated in a high temperature environment, heat in the high temperature environment is transferred to the first sealing portion 240 through the flange 223. In order to minimize the influence of heat transferred from the flange 223 to the first sealing part 240, at least a portion of the grooves 225, 226, and 227 are located in the area between the flange 223 and the first sealing part 240. can be placed.

As at least a portion of the grooves 225, 226, and 227 are disposed in the area between the flange 223 and the first sealing portion 240, the inner housing 222 between the flange 223 and the first sealing portion 240 ) is reduced, and heat transfer from the flange 223 to the first sealing part 240 may be reduced by the reduced cross-sectional area. In addition, as at least a portion of the grooves 225, 226, and 227 are disposed in the area between the flange 223 and the first sealing portion 240, a space ( 228) is formed, and cooling water is supplied to this space 228, thereby cooling the inner housing portion between the flange 223 and the first sealing portion 240. Accordingly, heat transfer from the flange 223 to the first sealing part 240 may be reduced.

As shown in Figure 5, the groove is formed of a plurality of grooves with different depths, and the plurality of grooves can be designed to have a greater depth as the groove is closer to the flange.

When viewed in the axial direction of the rotation axis, the plurality of grooves may be sequentially arranged in the order of the first groove 225, the second groove 226, and the third groove 227.

The first groove 225 is formed in the area between the flange 223 and the first sealing part 240, and the first groove 225 has a deeper depth than the second groove 226 and the third groove 227. It is formed large, so that heat transfer from the flange 223 to the first sealing part 240 can be minimized. Since the second groove 226 is disposed in an area closer to the flange 223 than the third groove 227, the second groove 226 may be formed to have a greater depth than the third groove 227.

The outer housing 224 has a through hole for introducing coolant into the space 228 between the inner housing 222 and the outer housing 224 and a through hole for discharging coolant from the space between the inner housing and the outer housing. can be formed.

As shown in Figure 5, the adapter 400 may be coupled to the inner housing 222 through a screw. As described above, by placing the outer housing 224 on the inner housing 222 and coupling the adapter 400 to the inner housing 222, the outer housing 224 is firmly coupled to the inner housing 222. do.

The bearing 260 is provided within the inner housing 222 and can rotatably support the rotating shaft 100 within the inner housing 222. In this embodiment, the bearing 260 is a thrust bearing and may be a double-row angular contact bearing.

The first sealing part 240 is provided to seal the gap between the inner housing 222 and the rotating shaft 100. The first sealing unit 240 prevents foreign substances (particles, etc.) generated from the rotary shaft sealing device from entering the vacuum semiconductor substrate processing device and seals the interior of the semiconductor substrate processing device to maintain a vacuum. The first sealing unit 240 may be arranged by combining a plurality of seals.

Hereinafter, with reference to FIG. 6, the structure of the first sealing part 240 used in the above-described rotary shaft sealing device will be described in detail.

Referring to FIG. 6, the first sealing unit 240 according to an embodiment of the present invention may include a plurality of vacuum seals 242 and a plurality of elastic seals 246. The vacuum seal 242 is provided to maintain the vacuum of the semiconductor substrate processing device disposed on the upper part of the rotating shaft sealing device 200, and the elastic seal 246 is provided to support the rotating shaft 120 and suppress vibration. . Both the vacuum seal 242 and the elastic seal 246 may be made of plastic material. Additionally, the elastic seal 246 may have greater elasticity than the vacuum seal 242, and may be twice or more.

The vacuum seal 242 is a lip seal made of plastic with a curved lip formed on the inner periphery of the annular sealing. As shown in FIG. 6, the vacuum seal 242 has a shape curved in the opposite direction to maintain the vacuum in the area A where the vacuum is formed. has

The elastic seal 246 serves to support the rotating shaft 100 together with the bearing 260 so that the axis line 110 remains constant without being changed due to vibration or the like as the rotating shaft 100 rotates. On the other hand, if the axis line 110 changes, the space between the rotating shaft 100 and the vacuum seal 242 may widen, causing a problem in which foreign substances may enter the gap. In this embodiment, even if the axis 110 changes, since the elastic seal 246 is provided, foreign substances introduced between the rotating shaft 100 and the vacuum seal 242 can be blocked from entering the area B. there is. The elastic seal 246 includes a seal body 246a made of plastic with a recess formed in one direction, and an elastic member ( 246b). The elastic member 246b may be, for example, an O-ring, a square ring, or a metal spring, but is not limited thereto.

The vacuum seal 242 and the elastic seal 246 are arranged adjacent to each other in series in the direction of the axis 110, but the vacuum seal 242 is arranged closer to the flange of the first housing than the elastic seal 246, and the elastic seal (246) may be disposed closer to the bearing (260) than the vacuum seal (242). In addition, a plurality of vacuum seals 242 and elastic seals 246 are provided, so that their function can be maintained even if one of the vacuum seals 242 or elastic seals 246 is damaged.

In addition, to prevent the vacuum seal 242 and the elastic seal 246 from rotating relative to the first housing within the first housing, the outer peripheral surface of the vacuum seal 242 and the elastic seal 246 facing the first housing is formed. An annular rotation prevention member 249 may be provided. The rotation prevention member 249 serves to further pressurize the vacuum seal 242 and the elastic seal 246 toward the rotation axis 100. In addition, compared to when the rotation prevention member 249 is not present, that is, when the vacuum seal 242 and the elastic seal 246 are in direct contact with the inner peripheral surface of the housing, the rotation prevention member 249 and the vacuum seal 242 The friction force between and the elastic seal 246 is large. Accordingly, the vacuum seal 242 and the elastic seal 246 can be prevented from rotating relative to the housing within the housing.

In addition, when disassembling and assembling the rotating shaft sealing device 200 for reasons such as damage or inspection, even if the surface roughness of the housing is relatively rough, the rotation prevention member 249 rubs against the inner peripheral surface of the housing during the disassembly and assembly process, thereby preventing sealing. Part 240 can minimize damage caused by low surface roughness of the housing. In addition, since the rotation prevention member 249 has the advantage of being reusable even if it is damaged to some extent, the rotation shaft sealing device 200 can be disassembled and assembled more easily.

Figure 7 is a diagram schematically showing the structure of a sealing part according to another embodiment of the present invention.

Referring to FIG. 7, the sealing part according to another embodiment of the present invention is the same as the embodiment shown in FIG. 6, with the only difference being that a pressure seal 248 is added. The pressure seal 248 is provided to prevent foreign substances from entering the semiconductor substrate processing apparatus when the inside of the semiconductor substrate processing apparatus is pressurized for reasons such as cleaning. In this embodiment, the pressure seal 248 is disposed in front of the vacuum seal 242, that is, closer to the lever seal 114 than the vacuum seal 242. The pressure seal 248, like the vacuum seal 242, may be a lip seal made of plastic with a curved lip formed on the inner periphery of the annular sealing. As shown, when the area A is pressurized, the pressure seal 248 has a shape curved in the direction of the area A to prevent foreign substances from entering the area A.

Alternatively, the first sealing portion 240 may be composed of a magnetic fluid seal.

Next, the rotary union 300 will be described in detail.

The rotary union 300 according to this embodiment includes a second housing 320, a bearing 360, a second sealing part 340, and a flow path forming member 330. The second housing 320 is provided in a cylindrical shape and accommodates the rotation axis 100 therein. A plurality of fluid communication holes 322 are provided on the outer peripheral surface of the second housing 320, and each fluid communication hole 322 communicates with the flow path of the rotation shaft 100 corresponding to the fluid communication hole 322.

The rotation shaft 100 is installed to be rotatable within the second housing 320 by a bearing 360. Inside the rotation shaft 100, a plurality of flow paths 120 are formed with different lengths along the axis 110. do. In this embodiment, two flow paths 120 are provided and formed parallel to each other as an example, but the present invention is not limited thereto. For example, one of the flow paths may be placed in the exact center, and a plurality of flow paths may be arranged outside of this flow path at equal intervals, each having a different length. A coolant may flow in the flow path to suppress temperature rise, or various working fluids for surface treatment may flow. Additionally, it may communicate with an external pressurized or negative pressure chamber to form pressurized or negative pressure in the flow path. Each flow path may have a fitting portion 140 formed at an end of a portion extending in the axial direction to communicate with a portion of the semiconductor substrate processing apparatus.

The second housing 320 is formed in a cylindrical shape with an elongated hollow, and a plurality of fluid communication holes 322 communicating perpendicularly with the hollow may be formed at different locations on the outer peripheral surface. One end of the second housing 320 may be open so that the rotating shaft 100 can be inserted, and the other end may be closed by fastening the housing cover 330 with a bolt. A rotating shaft, a bearing, a second sealing part, and a flow path forming member may be disposed inside the second housing.

The rotating shaft may be supported by a plurality of bearings to enable rotational movement. For example, the bearing may be a radial bearing. The rotation shaft may be electrically/mechanically connected to a driving unit (not shown) such as an external motor to perform rotational movement.

The second sealing unit 340 is composed of a plurality of lip seals provided between the second housing 320 and the rotating shaft 100 to prevent leakage of fluid therebetween. Specifically, the rotation shaft 100 is supported by a plurality of bearings 360 between the second housing 320 to enable rotational movement, and is attached to the inner peripheral surface of the second housing 320 to improve sealing force during the rotational movement. A second sealing part 340 may be provided and grounded to the outer peripheral surface of the rotating shaft 100. The second sealing portion 340 is provided as a plurality of lip seals 340a and 340b on the outer peripheral surface of the rotating shaft 100, and may be arranged to be spaced apart from each other to correspond to each position of the flow path 120 of the rotating shaft 100. In more detail, each of the plurality of lip seals 340a and 340b may be disposed at a position corresponding to the position of a plurality of fluid communication holes 322 formed on the outer peripheral surface of the rotation shaft 100 to communicate with each of the plurality of flow paths. Thanks to the arrangement of the lip seals 340a and 340b, each of the fluid communication holes 322 of the second housing 320 selectively communicates with one of the corresponding flow paths 120 of the rotation shaft 100 and the other. It may not be connected to the euro.

The lip seals 340a and 340b may be seals for rotational movement, and may be ring-shaped seals made of synthetic resin such as engineering plastic. Each lip seal is provided as a pair at each position, but may be arranged as a pair with lips 343 curved in different directions. When using a lip seal, the rotating shaft and the lip seal are in line contact with each other, thereby minimizing friction and eliminating the need for lubricant.

Additionally, an annular rotation prevention member 342 may be provided on the surface of the second sealing part 340 facing the second housing 320 to prevent relative rotation with the second housing 320. In this embodiment, the rotation prevention member 342 may be provided in the form of an O-ring.

A plurality of passage forming members 330 may be provided between the inner peripheral surface of the second housing 320 and the outer peripheral surface of the rotation shaft. Specifically, the flow path forming member 330 is provided at a position corresponding to the fluid communication hole 322 of the second housing 320 and the flow path 120 of the rotating shaft 100, and forms the fluid communication hole 322 and the corresponding fluid communication hole 320. The flow path 120 can be communicated. As shown, the flow path forming member 330 may have an overall annular shape. The flow path-shaped member 330 includes a pair of ring parts 332 that are symmetrically spaced from each other and an annular base part 336 provided between the pair of ring parts to connect and support each ring part. The pair of ring portions 332 and the base portion 336 have an annular shape with a predetermined thickness, and the rotation shaft 100 can penetrate the internal space. The rotation shaft 100 may be spaced apart by a predetermined gap to enable rotation within the internal space of the flow path-shaped member 330.

The outer diameter of the base portion 336 of the flow path forming member 330 is smaller than the outer diameter of the ring portion 332. Accordingly, when the flow path forming member 330 is installed on the inner peripheral surface of the housing, an annular empty flow space may be formed along the circumference of the base portion 336. Accordingly, the working fluid flowing through the fluid communication hole may flow along the flow space, that is, along the outer peripheral surface of the flow path forming member 330. Additionally, one or more through holes 334 penetrating the inner and outer peripheral surfaces may be provided in the base portion 336 of the flow path forming member 330. The working fluid flowing along the flow space may communicate with the internal space of the flow path forming member 330 through the through hole 334. The size or number of through holes 334 may be set according to the flow rate of the working fluid or the size of the hydraulic pressure. Likewise, the inner diameter of the base portion 336 of the flow path forming member 330 may be larger than the inner diameter of the ring portion 332. That is, the inner diameter of the ring portion 332 may be smaller than the inner diameter of the base portion 336. Accordingly, an annular flow space may be formed along the inner peripheral surface of the base portion 336. Thanks to the structure of the flow space of the flow path forming member 330, even if the positions of the through hole and the fluid communication hole are not exactly the same, the working fluid through the fluid communication hole can flow into the through hole while circulating through the flow space.

Referring to FIG. 9, an O-ring 339 may be provided on the outer peripheral surface of the flow path forming member 330 as a movement prevention member to prevent movement within the second housing and perform sealing on the outer peripheral surface.

The gap d1 between the rotating shaft 100 and the inner peripheral surface of the flow path forming member 330 may be larger than the gap d2 between the outer peripheral surface of the flow path forming member 330 and the inner peripheral surface of the second housing, and may be twice or more. You can. Thanks to these design conditions, interference between the flow path forming member 330 and the rotating shaft 100 is prevented, and the flow path forming member 300 is firmly fixed on the inner peripheral surface of the housing and cannot be moved thanks to the movement prevention member.

In the above, the present invention has been described with specific details such as specific components and limited embodiments and drawings, but this is only provided to facilitate a more general understanding of the present invention, and the present invention is not limited to the above embodiments. A person skilled in the art to which the present invention pertains can make various modifications and changes based on this description.

Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and the scope of the patent claims described below as well as all modifications equivalent to or equivalent to the scope of the claims fall within the scope of the spirit of the present invention. They will say they do it.

100: rotation axis
200: Rotating shaft sealing device
300: rotary union
400: adapter
220: first housing
240: First sealing part
260: bearing
223: Flange
222: inner housing
224: external housing

Claims (13)

A rotary union assembly mounted on a semiconductor substrate processing device that processes a semiconductor substrate while rotating a semiconductor loading unit that accommodates the semiconductor substrate,
a rotating shaft including a plurality of fluid supply paths and extending into the semiconductor substrate processing apparatus;
A rotating shaft sealing device including a hollow first housing accommodating at least a portion of the rotating shaft therein, and a sealing portion for sealing a gap between the first housing and the rotating shaft;
a rotary union including a hollow second housing accommodating at least a portion of the rotating shaft therein, and supplying fluid to a fluid supply path of the rotating shaft;
Comprising an adapter disposed between the first housing and the second housing and detachably fixed to the first housing and the second housing,
Rotary union assembly.
According to paragraph 1,
The adapter has a ring shape,
Rotary union assembly.
According to paragraph 1,
A hole is formed in the first housing, a through hole corresponding to the hole in the first housing is formed in the adapter, and the adapter is separated from the first housing by a fastener fastened to the hole and the through hole. fixed as possible,
A hole is formed in the second housing, a through hole corresponding to the hole in the second housing is formed in the adapter, and the adapter is separated from the second housing by a fastener fastened to the hole and the through hole. Possibly fixed,
Rotary union assembly.
The method of claim 1, wherein the first housing is:
It includes a hollow inner housing having a flange for mounting on a semiconductor processing substrate device, and a hollow outer housing disposed on the inner housing and disposed between the flange and the adapter,
An annular space is formed between the inner housing and the outer housing, and coolant is supplied to the space,
Rotary union assembly.
According to clause 4,
The annular space is formed by a concave groove on the outer surface of the inner housing,
Rotary union assembly.
The method of claim 5, wherein at least a portion of the groove is formed in an area between the flange and the first sealing member.
Rotary union assembly.
The method of claim 5, wherein the groove is formed of a plurality of grooves of different depths, and the plurality of grooves is formed with a greater depth as the groove is closer to the flange.
Rotary union assembly.
According to paragraph 1,
A plurality of fluid communication holes are provided in the second housing,
The rotary union includes a plurality of annular flow path forming members that communicate the fluid communication hole and the flow path,
Rotary union assembly.
According to clause 8,
The flow path forming member is,
A pair of ring parts arranged spaced apart from each other,
an annular base portion connecting and supporting the pair of ring portions, and
It includes one or more through holes penetrating the inner and outer peripheral surfaces of the base portion,
A rotary union assembly wherein the ring portion has an outer diameter larger than the base portion, thereby forming a flow space around the base portion.
According to clause 8,
A rotary union assembly in which an O-ring is formed on the outer peripheral surface of the flow path forming member to prevent movement within the housing and to perform sealing on the outer peripheral surface facing the housing.
According to paragraph 1,
The sealing unit includes a vacuum seal provided to maintain the vacuum of the semiconductor substrate processing device,
Rotary union assembly.
According to clause 11,
The sealing unit further includes an elastic seal provided to support the rotating shaft and suppress vibration, and both the vacuum seal and the elastic seal are made of a plastic material, and the elastic seal has a greater elastic force than the vacuum seal.
Rotary union assembly.
According to paragraph 1,
The rotary union includes a plurality of lip seals provided between the second housing and the rotating shaft, and the plurality of lip seals are provided in pairs at each disposed position, and the pair of lip seals forms lips curved in different directions. ,
Rotary union assembly.

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