KR20230167207A - Pressure detecting apparatus - Google Patents

Abstract

A pressure detection device according to an embodiment of the present invention includes a thin film sensor disposed between an upper panel and a lower panel facing each other at a predetermined interval, and formed to be in close contact with the upper and lower surfaces of the thin film sensor and the surface of the thin film sensor. an insulating pad to maintain this insulating state, a pressing member disposed between the upper panel and the insulating pad to transmit external pressure applied to the upper panel to the thin film sensor, and electrically connected to the thin film sensor, It includes a circuit unit that converts the change in impedance of the thin film sensor, which changes depending on the external pressure transmitted to the thin film sensor, into an electrical signal and outputs it.

Description

PRESSURE DETECTING APPARATUS}

The present invention relates to a pressure detection device.

Generally, force sensitive resistors, load cells, capacitive load cells, etc. are used to measure force or pressure.

A pressure-sensitive sensor consists of a pressure-sensitive part that senses pressure and an insulator surrounding the pressure-sensitive part. At this time, when pressure is applied from the outside, the resistance value of the pressure reducing unit changes, and this is detected and an output signal is received. However, although conventional pressure sensors have good sensitivity for measuring pressure, they can only measure relatively low pressures, so they have limitations in detecting pressure for high weights.

Meanwhile, a load cell is an elastic body that changes proportionally by external forces such as force or pressure, a foil-type strain gauge that detects strain, and a foil-type strain gauge. It consists of a wheatstone bridge circuit that measures resistance changes, and an electrical output unit that amplifies the minute output voltage, converts it into a digital signal, and outputs it. The sensitivity of these load cells to measure external force varies depending on the method of attaching the foil-type strain gauge, and in order to measure high weights, a bulky pressure-reducing elastic body must be used, making it bulky and expensive.

In addition, a capacitive load cell consists of an upper electrode part combined with an elastic body and a spring that converts the pressure fixed on a fixed support with an insulator into a moving distance, and a lower electrode part that converts this into electrostatic capacity. When pressure is applied from the outside, the capacitance value between the upper and lower electrode parts changes, and the changed capacitance value is converted into an electrical signal and output. However, capacitive load cells require the use of bulky pressure-reducing elastic bodies and springs to measure the pressure of high weights, making them bulky and expensive for parts.

The purpose of the present invention is to apply a thin film sensor that utilizes the stress impedance effect, in which the impedance changes when external pressure is applied to a soft magnetic alloy with a complex molecular structure, to measure high pressure by applying a bulky and expensive pressure-sensitive elastomer. The purpose is to provide a pressure detection device implemented in a thin and simple structure without using a spring.

Another object of the present invention is to detect pressure, which can be used not only to measure the load on heavy civil engineering structures such as bridges or underground anchors, but also to measure the weight of heavy oil tanks or large trucks. The purpose is to provide a device.

The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

To achieve the above object, a pressure detection device according to an embodiment of the present invention includes a thin film sensor disposed between an upper panel and a lower panel facing each other at a predetermined interval, and a thin film sensor arranged in close contact with the upper and lower surfaces of the thin film sensor. an insulating pad formed to maintain the surface of the thin film sensor in an insulated state, a pressing member disposed between the upper panel and the insulating pad to transmit external pressure applied to the upper panel to the thin film sensor, and the thin film It is electrically connected to the sensor and includes a circuit unit that converts the change in impedance of the thin film sensor, which changes depending on external pressure transmitted to the thin film sensor, into an electrical signal and outputs it.

In one embodiment, the thin film sensor is electrically connected to a pattern portion formed in a zigzag-shaped pattern structure that amplifies the magnitude of impedance that changes depending on external pressure, and the circuit portion, and generates a signal corresponding to the amount of impedance change of the pattern portion. It is characterized in that it includes an electrode unit that outputs to the circuit unit.

In one embodiment, the thin film sensor is characterized by being made of a soft magnetic alloy.

In one embodiment, the insulating pad includes a first insulating pad formed in close contact with the upper surface of the pattern portion of the thin film sensor, and a second insulating pad formed in close contact with the lower surface of the electrode portion and the pattern portion of the thin film sensor. It is characterized by

In one embodiment, the insulating pad is formed of polyamide material.

In one embodiment, the first pressing member is formed to be in close contact between the center of the upper panel and the first insulating pad, and presses the upper part of the pattern portion of the thin film sensor when external pressure is applied to the upper panel. It is characterized by

In one embodiment, the pressure detection device according to the present invention is formed to be in close contact between the center of the lower panel and the second insulating pad, so that when external pressure is applied to the upper panel, the lower portion of the pattern portion of the thin film sensor is pressed. It is characterized in that it further includes a second pressing member.

In one embodiment, the pressure detection device according to the present invention further includes a protrusion formed to protrude upward from the center of the upper panel so that external pressure applied to the upper panel is concentrated in the center.

In one embodiment, the circuit unit is formed to be fixed to a predetermined area of the lower panel, and when an impedance change according to external pressure is applied from the thin film sensor, the circuit unit detects a voltage difference generated according to the impedance change. do.

In one embodiment, the circuit unit is characterized by being composed of a Wheatstone bridge circuit.

In one embodiment, the pressure detection device according to the present invention is coupled to the upper panel and the lower panel and adjusts the pressure between the thin film sensor, the insulating pad, and the pressing member formed between the upper panel and the lower panel. It is characterized by further including members.

In one embodiment, the upper panel includes insertion holes formed through which the body of the pressure regulating member penetrates on both sides of corresponding positions relative to the center of the upper panel, and the lower panel includes the insertion holes and It is characterized in that it includes a fastening groove formed to fasten the body of the pressure adjustment member penetrating the insertion hole at a corresponding position.

In one embodiment, when the body of the pressure adjustment member passes through the insertion hole and fastens to the fastening groove, the head portion is in close contact with the upper surface of the upper panel, and the head portion is in close contact with the upper surface of the upper panel by rotating the pressure adjustment member. It is characterized in that the gap between the panel and the lower panel is adjusted.

In one embodiment, the fastening groove is characterized in that a spiral protrusion is formed on the inner surface to facilitate insertion and fastening of the body of the pressure adjustment member.

In one embodiment, the insertion hole is formed larger than the diameter of the body of the pressure adjustment member, but smaller than the diameter of the head of the pressure adjustment member.

In one embodiment, the lower panel includes insertion holes formed through which the body of the pressure regulating member penetrates on both sides of corresponding positions relative to the center of the lower panel, and the upper panel includes the insertion holes and It is characterized in that it includes a fastening groove formed to fasten the body of the pressure adjustment member penetrating the insertion hole at a corresponding position.

In one embodiment, the insertion hole includes a first insertion portion formed to be larger than the diameter of the body of the pressure adjusting member but smaller than the diameter of the head of the pressure adjusting member, and the first insertion portion below the first insertion portion. It is characterized in that it includes a second insertion portion having a larger diameter than the first insertion portion.

In one embodiment, when the body of the pressure adjustment member penetrates the insertion hole and fastens to the fastening groove, the head portion is in close contact with the upper surface of the second insertion portion, and the pressure adjustment member is rotated. It is characterized in that the gap between the upper panel and the lower panel is adjusted.

In one embodiment, the second insertion portion is formed to be larger than the diameter of the head of the pressure adjustment member.

In one embodiment, the fastening groove is characterized in that a spiral protrusion is formed on the inner surface to facilitate insertion and fastening of the body of the pressure adjustment member.

In one embodiment, the pressure detection device according to the present invention is formed in a shape that covers both the upper panel and the lower panel, is fixed along the edge of the upper surface of the lower panel, and has a protrusion formed on the upper panel at the center. It is characterized in that it further includes a cover in which a hole is formed so that it can protrude to the outside.

According to one embodiment of the present invention, by applying a thin film sensor that uses the stress impedance effect, in which the impedance changes when external pressure is applied to a soft magnetic alloy with a complex molecular structure, a bulky and expensive device can be used to measure high pressure. There is an effect in that a pressure detection device can be implemented with a thin and simple structure without using a pressure reducing elastic body or spring.

According to another embodiment of the present invention, by implementing the pressure detection device in a thin and simple structure, it can be used to measure the load on heavy civil engineering structures such as bridges and underground anchors, as well as heavy oil tanks or large trucks. It can also be used to measure the weight of the back.

1 is a diagram illustrating a pressure detection device according to an embodiment of the present invention.
Figure 2 is a diagram showing the coupling structure of a thin film sensor and an insulating pad according to an embodiment of the present invention.
Figures 3a, 3b, and 4 are diagrams showing the coupling structure of a pressure adjustment member according to an embodiment of the present invention.
Figure 5 is a diagram showing the configuration of a circuit unit according to an embodiment of the present invention.
Figure 6 is a diagram showing the structure of a pressure detection device according to another embodiment of the present invention.
Figures 7 and 8 are diagrams showing the coupling structure of a pressure adjustment member according to another embodiment of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through illustrative drawings. When adding reference numerals to components in each drawing, it should be noted that identical components are given the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing embodiments of the present invention, if detailed descriptions of related known configurations or functions are judged to impede understanding of the embodiments of the present invention, the detailed descriptions will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the component is not limited by the term. Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted in an ideal or excessively formal sense unless explicitly defined in the present application. No.

FIG. 1 is a diagram showing a pressure detection device according to an embodiment of the present invention, FIG. 2 is a diagram showing a combined structure of a thin film sensor and an insulating pad according to an embodiment of the present invention, and FIGS. 3A and 3B. and FIG. 4 is a diagram showing the coupling structure of a pressure adjustment member according to an embodiment of the present invention, and FIG. 5 is a diagram showing the configuration of a circuit portion according to an embodiment of the present invention.

Referring to FIG. 1, the pressure detection device according to an embodiment of the present invention includes an upper panel 10, a lower panel 20, a thin film sensor 30, an insulating pad, a pressing member, a pressure regulating member, and a circuit portion 70. Includes.

The upper panel 10 and the lower panel 20 are formed to have an upper surface and a lower surface, respectively, and the lower surface of the upper panel 10 and the upper surface of the lower panel 20 are arranged to face each other at a predetermined distance. You can. As an example, the upper panel 10 and lower panel 20 may be formed to have the same size. Since external pressure can be directly applied to the upper panel 10 and lower panel 20, they can be made of a material that does not bend even under high pressure.

At this time, a protrusion 19 may be formed in the center of the upper panel 10 so that external pressure applied to the upper panel 10 can be concentrated at the central position. As an example, the protrusion 19 may be formed of the same material as the upper panel 10.

The thin film sensor 30 is disposed between the upper panel 10 and the lower panel 20. At this time, the thin film sensor 30 is preferably disposed parallel to the upper panel 10 and the lower panel 20.

The thin film sensor 30 is a stress impedance sensing sensor whose impedance changes according to the external pressure when external pressure is transmitted, and may be configured to include an electrode portion 31 and a pattern portion 35. The pattern portion 35 may be formed in a zigzag pattern structure to amplify the size of impedance that changes depending on external pressure. The thin film sensor 30 may be made of a soft magnetic alloy that has a stress impedance effect. Preferably, the thin film sensor 30 may be made of a soft magnetic alloy containing Co, Ni, Si, Mo, B, and Fe. Therefore, in response to high pressure applied from the outside, the change in volume is extremely small and the impedance change is large, so it is possible to measure high pressure without using a pressure-reducing elastic body, which has the advantage of being able to measure a high weight while being thin.

Insulating pads may be formed to be in close contact with the upper and lower surfaces of the thin film sensor 30, respectively. For example, the first insulating pad 41 may be formed to be in close contact with the upper surface of the thin film sensor 30, and the second insulating pad 45 may be formed to be in close contact with the lower surface of the thin film sensor 30.

Referring to FIG. 2, the thin film sensor 30 is attached on the second insulating pad 45, and the thin film sensor 30 is covered with the first insulating pad 41 so that the thin film sensor 30 is connected to the first insulating pad ( 41) and the second insulating pad 45. Here, the first insulating pad 41 and the second insulating pad 45 may be formed of a material that has heat resistance and mechanical stability against high pressure. For example, the first insulating pad 41 and the second insulating pad 45 may be formed of polyimide material.

At this time, the first insulating pad 41 may be formed in a smaller size than the second insulating pad 45 and may cover only the pattern portion 35 excluding the electrode portion 31 of the thin film sensor 30. The second insulating pad 45 may be formed to a size that completely covers the entire surface of the electrode portion 31 and the pattern portion 35 of the thin film sensor 30. Accordingly, the pattern portion 35 of the thin film sensor 30 may be maintained in an insulated state by the first insulating pad 41 and the second insulating pad 45. Meanwhile, the electrode portion 31 is exposed to the outside and can be electrically connected to the circuit portion 70 through a connection line 71.

In addition, as shown in FIG. 1, the pressing member may press the upper and lower portions of the pattern portion 35 of the thin film sensor 30, and the pressing member may apply a first pressing force to the upper part of the thin film sensor 30. It may include a second pressing member 55 that presses the lower portion of the member 51 and the thin film sensor 30.

The first pressing member 51 may be formed to press the thin film sensor 30 between the upper panel 10 and the first insulating pad 41 formed in close contact with the upper surface of the thin film sensor 30. The first pressing member 51 may be formed so that its upper surface is in close contact with the upper panel 10 and its lower surface is in close contact with the first insulating pad 41. Accordingly, when external pressure is applied to the upper panel 10, the first pressing member 51 can transmit the external pressure applied to the upper panel 10 to the thin film sensor 30. At this time, the first pressing member 51 is a pattern portion ( 35) can be formed to press.

Additionally, the second pressing member 55 may be formed between the second insulating pad 45 formed in close contact with the lower surface of the thin film sensor 30 and the lower panel 20 to press the thin film sensor 30. The second pressing member 55 may be formed so that the upper surface is in close contact with the second insulating pad 45 and the lower surface is in close contact with the lower panel 20. Accordingly, when external pressure is applied, the second pressing member 55 can transmit the external pressure to the thin film sensor 30. At this time, the second pressing member 55 may be formed to press the pattern portion 35 of the thin film sensor 30 in close contact with the second insulating pad 45 so that external pressure can be well transmitted to the thin film sensor 30. there is.

For example, the first pressing member 51 and the second pressing member 55 may be formed in the form of a metal plate with an insulating material applied to the surface or a metal plate with an oxide film.

The structure formed of the first pressing member 51, the first insulating pad 41, the thin film sensor 30, the second insulating pad 45, and the second pressing member 55 resists external pressure applied to the upper panel 10. In order to effectively transmit pressure to the thin film sensor 30, it may be formed to be in close contact with the center position of the upper panel 10 and the lower panel 20.

The gap between the upper panel 10 and the lower panel 20 can be adjusted by the pressure control member, and the upper panel 10 and the lower panel 20 are adjusted according to the gap between the upper panel 10 and the lower panel 20. The pressure of the structures located in between can be adjusted. As an example, the pressure adjustment member may be formed of a bolt.

Referring to FIGS. 3A and 3B, there are insertion holes 11 and 15 into which the bodies 63 and 67 of the pressure adjustment member are inserted in the first region on one side and the second region on the other side of the upper panel 10. can be formed. At this time, the diameter of the insertion holes 11 and 15 formed in the first and second areas is larger than the diameter of the body 63 and 67 of the pressure adjustment member, and the head portion 62 and 66 of the pressure adjustment member It can be formed smaller than the diameter of .

Meanwhile, fastening grooves 21 and 25 into which the pressure adjustment member is fastened may be formed in the third region on one side and the fourth region on the other side of the lower panel 20, which corresponds to one side of the upper panel 10. there is. At this time, the diameter of the fastening grooves 21 and 25 formed in the third and fourth regions may be formed to be the same as the diameter of the bodies 63 and 67 of the pressure regulating member. For example, when the pressure control member is a bolt, a spiral protrusion (screw) may be formed on the inner surface of the fastening grooves 21 and 25 to facilitate insertion and fastening of the screw portion of the bolt.

Accordingly, the first pressure adjustment member 61 is fastened to the body 63 through the insertion hole 11 formed in the first area of the upper panel 10 and formed in the third area of the lower panel 20. It can be fastened to the groove (21). At this time, the body 63 may be fastened to the fastening groove 21 formed in the third region of the lower panel 20 by rotating the first pressure regulating member 61. In this case, the head 62 of the first pressure regulating member 61 is in close contact with the upper surface of the upper panel 10, and the upper panel 10 and the upper panel 10 are connected by rotating the first pressure regulating member 61. The gap between the lower panels 20 can be adjusted.

Likewise, the second pressure adjustment member 65 is fastened to the body 67 through the insertion hole 15 formed in the second region of the upper panel 10 and formed in the fourth region of the lower panel 20. It can be fastened to the groove (25). At this time, the body 67 may be fastened to the fastening groove 25 formed in the fourth region of the lower panel 20 by rotating the second pressure regulating member 65. In this case, the head 66 of the second pressure regulating member 65 is in close contact with the upper surface of the upper panel 10, and the upper panel 10 and the upper panel 10 are connected by rotating the second pressure regulating member 65. The gap between the lower panels 20 can be adjusted.

The first pressure control member 61 and the second pressure control member 65 can be adjusted so that the distance between one side and the other side of the upper panel 10 and the lower panel 20 is maintained the same. At this time, the pressure between each structure of the structure can be adjusted depending on the gap between the upper panel 10 and the lower panel 20. Accordingly, a constant pressure can be maintained between each structure of the structure without any voids.

As shown in Figure 4, when external pressure is applied to the upper panel 10, the upper panel 10 moves up and down, and the diameter of the insertion holes 11 and 15 is that of the pressure adjustment members 61 and 65. If the diameter is larger than the diameter of the bodies 63 and 67, the upper panel 10 can move up and down without being interfered with by the bodies 63 and 67 of the pressure adjustment members 61 and 65.

When external pressure is applied to the upper panel 10, the pressure applied to the upper panel 10 is concentrated at the center position by the protrusion 19 and is applied to the pattern portion of the thin film sensor 30 through the pressing members 51, 55, etc. (35) is pressurized. Accordingly, the impedance of the thin film sensor 30 changes depending on the amount of pressure applied to the pattern portion 35.

The circuit portion 70 may be formed in a predetermined area of the lower panel 20. For example, the circuit portion 70 may be formed in an area closer to the center of the lower panel 20 than the third or fourth area.

At this time, the circuit portion 70 may be formed in such a way that a predetermined lower area is inserted into the lower panel 20 and a predetermined upper area protrudes above the lower panel 20 . As another example, the circuit portion 70 may be formed so that the area excluding the upper surface is completely inserted into the lower panel 20, or may be formed so that only the lower surface of the circuit portion 70 is tightly fixed to the lower panel 20. .

The circuit part 70 is electrically connected to the electrode part 31 of the thin film sensor 30 by a connection line 71, and the amount of impedance change according to the magnitude of the pressure applied to the pattern part 35 of the thin film sensor 30 is the connection line. It can be applied to the circuit unit 70 through (71).

As an example, the circuit unit 70 may be configured as a wheatstone bridge circuit. The Wheatstone bridge circuit can convert the impedance change applied from the thin film sensor 30 into an electrical signal and output it through a signal output line.

Accordingly, the detailed configuration and operation of the Wheatstone bridge circuit will be described with reference to FIG. 5. Referring to Figure 5, the Wheatstone bridge is a circuit that can precisely measure resistance. It consists of three fixed resistors (R1, R2, R3) and one variable resistor (RP) across four interconnected nodes. Each consists of an arranged structure. Here, resistors located diagonally from each other form a pair. For example, R1 and RP form a pair, and R2 and R3 form a pair. At this time, if the product of one pair of resistances is equal to the product of the other pair of resistances, the voltage between nodes P1 and P2 is balanced and no current flows between nodes P1 and P2. Meanwhile, when the resistance value of the variable resistor (RP) changes, the product of the resistance between the two pairs changes, so an unbalanced voltage occurs between nodes P1 and P2, causing current to flow between nodes P1 and P2.

Accordingly, when pressure is applied to the thin film sensor 30, the resistance value of the variable resistor (RP) changes due to the change in impedance, and an unbalanced voltage is generated in the Wheatstone bridge circuit due to the change in resistance value. At this time, if the input voltage of the Wheatstone bridge circuit is kept constant, the output voltage becomes proportional to the applied pressure. Accordingly, the circuit unit 70 can precisely detect pressure by measuring the voltage difference between nodes P1 and P2. Preferably, the Wheatstone bridge circuit can be configured such that the differential output is close to zero volts. In this case, a pressure detection device that measures tens of tons of external pressure can be implemented in a thin manner.

The circuit unit 70 can convert the analog signal corresponding to the detected pressure value into a digital signal through an analog-to-digital converter (A/D converter) and output it through the signal output line 75.

Figure 6 is a diagram showing a pressure detection device according to another embodiment of the present invention, and Figures 7 and 8 are diagrams showing a coupling structure of a pressure adjustment member according to another embodiment of the present invention.

Referring to FIGS. 6 to 8 , a pressure detection device according to another embodiment of the present invention may be configured with a structure similar to the pressure detection device according to the embodiment of FIGS. 1 to 5 .

Referring to FIG. 6, the pressure detection device according to another embodiment of the present invention includes an upper panel 10', a lower panel 20', a thin film sensor 30, an insulating pad, a pressing member, a pressure regulating member, and a circuit portion ( 70) and may additionally include a cover.

The upper panel 10' and the lower panel 20' are formed to have an upper surface and a lower surface, respectively, and the lower surface of the upper panel 10' and the upper surface of the lower panel 20' are spaced apart from each other. Can be placed face to face. Here, as an example, the upper panel 10' may be formed to have a smaller size than the lower panel 20'. Since external pressure can be directly applied to the upper panel 10' and lower panel 20', they can be made of a material that does not bend even under high pressure.

At this time, a protrusion 19 may be formed at the center of the upper panel 10' so that external pressure applied to the upper panel 10' can be concentrated at the central position. As an example, the protrusion 19 may be formed of the same material as the upper panel 10'. The size and shape of the protrusion 19 may vary depending on the embodiment.

The thin film sensor 30 is disposed between the upper panel 10' and the lower panel 20'. At this time, the thin film sensor 30 is preferably disposed parallel to the upper panel 10' and the lower panel 20'.

The thin film sensor 30 is a stress impedance sensing sensor whose impedance changes according to the external pressure when external pressure is transmitted, and may be configured to include an electrode portion 31 and a pattern portion 35. The pattern portion 35 may be formed in a zigzag pattern structure to amplify the size of impedance that changes depending on external pressure. The thin film sensor 30 may be made of a soft magnetic alloy that has a stress impedance effect. Preferably, the thin film sensor 30 may be made of a soft magnetic alloy containing Co, Ni, Si, Mo, B, and Fe. Therefore, in response to high pressure applied from the outside, the change in volume is extremely small and the impedance change is large, so it is possible to measure high pressure without using a pressure-reducing elastic body, which has the advantage of being able to measure a high weight while being thin.

Insulating pads may be formed to be in close contact with the upper and lower surfaces of the thin film sensor 30, respectively. For example, the first insulating pad 41 may be formed to be in close contact with the upper surface of the thin film sensor 30, and the second insulating pad 45 may be formed to be in close contact with the lower surface of the thin film sensor 30. Here, the first insulating pad 41 and the second insulating pad 45 may be formed of a material that has heat resistance and mechanical stability against high pressure. For example, the first insulating pad 41 and the second insulating pad 45 may be formed of polyimide material.

The structures of the first insulating pad 41, the thin film sensor 30, and the second insulating pad 45 may be formed in the same structure as the embodiments of FIGS. 1 and 2. Accordingly, duplicate descriptions of the same structure will be omitted.

The pressing member may press the upper portion of the pattern portion 35 of the thin film sensor 30. Since the pressing member is formed in the same structure as the first pressing member 51 of FIG. 1, duplicate description of the same structure will be omitted. However, the pressure detection sensor according to another embodiment of FIG. 6 omits the second pressing member 55 according to the embodiment of FIG. 1.

The structure formed of the first pressing member 51, the first insulating pad 41, the thin film sensor 30, and the second insulating pad 45 absorbs external pressure applied to the upper panel 10' to the thin film sensor 30. In order to transmit the signal well, it may be formed to be in close contact with the center position of the upper panel 10' and the lower panel 20'.

The gap between the upper panel 10' and the lower panel 20' can be adjusted by a pressure control member, and the upper panel 10' and the lower panel 20' can be adjusted according to the gap between the upper panel 10' and the lower panel 20'. The pressure of the structure located between the lower panels 20' can be adjusted. As an example, the pressure adjustment member may be formed of a bolt.

Referring to Figures 7 and 8, a fastening groove 11' into which the body of the first pressure adjustment member 61 is fastened may be formed in the first area on one side of the upper panel 10'. At this time, the diameter of the fastening groove 11' formed in the first area may be formed to be the same as the diameter of the body of the first pressure adjustment member 61. For example, when the first pressure adjustment member 61 is a bolt, a spiral protrusion may be formed on the inner surface of the fastening groove 11' to facilitate insertion and fastening of the screw portion of the bolt. Although not shown in FIG. 7, a fastening groove of the same structure for fastening the body of the second pressure adjustment member 65 may be formed in the second area on the other side corresponding to the first area of the upper panel 10'. there is.

Meanwhile, an insertion hole into which the first pressure adjustment member 61 is inserted may be formed in a third area on one side of the lower panel 20' corresponding to one side of the upper panel 10'.

The insertion hole formed in the third area is a first insertion portion 22 formed to be smaller than the diameter of the head of the first pressure adjustment member 61 and larger than the diameter of the body so that the body of the first pressure adjustment member 61 penetrates. ) and a second insertion portion 23 formed at a lower portion of the first insertion portion 22 and having a larger diameter than the first insertion portion 22. Here, the second insertion part 23 is such that when the body of the first pressure control member 61 is inserted into the first insertion part 22, the head of the first pressure control member 61 is connected to the lower panel 20'. The diameter may be formed to be larger than the head diameter of the first pressure adjustment member 61 while being completely inserted so as not to protrude from the lower surface. Although not shown in FIG. 7, an insertion hole of the same structure for inserting the second pressure adjustment member 65 may be formed in the fourth region on the other side corresponding to the third region of the lower panel 10'.

At this time, the lower panel 20' may be formed to be thicker than the upper panel 10' in order to secure a space into which the heads of the first and second pressure regulating members 61 and 61 are inserted. there is.

Accordingly, the first pressure regulating member 61 has a body portion formed in the first region of the upper panel 10' through the insertion holes 22 and 23 formed in the third region of the lower panel 20'. It can be fastened to the fastening groove 11'. At this time, the body portion may be fastened and fixed to the fastening groove 11' formed in the first area of the upper panel 10' by the rotational movement of the first pressure adjustment member 61. In this case, the head of the first pressure adjustment member 61 is in close contact with the first insertion portion 22 of the lower panel 20', and the upper panel ( The gap between the 10') and the lower panel 20' can be adjusted.

The second pressure control member 65 may also be coupled to the upper panel 10' and the lower panel 20' in the same manner as the first pressure control member 61 shown in FIG. 7.

The first pressure control member 61 and the second pressure control member 65 can be adjusted so that the distance between one side and the other side of the upper panel 10' and lower panel 20' is maintained the same. At this time, the pressure between each structure of the structure can be adjusted depending on the gap between the upper panel 10' and the lower panel 20'. Accordingly, a constant pressure can be maintained between each structure of the structure without any voids.

As shown in Figure 8, when external pressure is applied to the upper panel 10', the upper panel 10' moves up and down. At this time, the pressure adjustment member fixed to the fastening groove of the upper panel 10' is also It moves up and down. At this time, if the diameter of the insertion hole formed in the lower panel 20' is larger than the diameter of the body of the pressure regulating member, when the pressure regulating member moves up and down as the upper panel 10' moves up and down, the pressure regulating member The body can move up and down without interference from the lower panel 20'.

When external pressure is applied to the upper panel 10', the pressure applied to the upper panel 10' is concentrated at the central position where the protrusion 19 is formed and is applied to the thin film sensor 30 through the first pressing member 51, etc. The pattern portion 35 is pressed. Accordingly, the impedance of the thin film sensor 30 changes depending on the amount of pressure applied to the pattern portion 35.

The circuit portion 70 may be formed in a predetermined area of the lower panel 20'. For example, the circuit portion 70 may be formed in an area farther from the center of the lower panel 20' than the third or fourth area.

At this time, the circuit portion 70 may be formed in such a way that a predetermined lower area is inserted into the lower panel 20' and a predetermined upper area protrudes above the lower panel 20'. As another example, the circuit portion 70 may be formed so that the area excluding the upper surface is completely inserted into the lower panel 20', or may be formed so that only the lower surface of the circuit portion 70 is tightly fixed to the lower panel 20'. It may be possible.

The circuit part 70 is electrically connected to the electrode part 31 of the thin film sensor 30 by a connection line 71, and the amount of impedance change according to the magnitude of the pressure applied to the pattern part 35 of the thin film sensor 30 is the connection line. It can be applied to the circuit unit 70 through (71).

As an example, the circuit unit 70 may be configured as a wheatstone bridge circuit. The Wheatstone bridge circuit can convert the impedance change applied from the thin film sensor 30 into an electrical signal and output it through a signal output line. Here, the detailed configuration and operation of the Wheatstone bridge circuit are the same as the pressure detection device according to the embodiment of FIG. 1. Accordingly, duplicate descriptions of the same configuration and operation will be omitted.

Therefore, the circuit unit 70 converts the analog signal corresponding to the pressure value detected according to the impedance change of the thin film sensor 30 into a digital signal through an analog-to-digital converter (A/D converter) and connects the signal output line 75. It can be printed through.

Meanwhile, as shown in FIG. 6, the pressure detection device according to another embodiment of the present invention may further include a cover 80 to prevent external dust and moisture from entering the structure and circuit part. At this time, the cover 80 is formed in a shape that covers both the upper panel 10' and the lower panel 20', and can be fixed along the edge of the upper surface of the lower panel 20', and the cover 80 A hole may be formed in the center so that the protrusion 19 can protrude outward.

The pressure detection device according to the embodiment of the present invention configured as described above detects pressure in a thin and simple structure using a thin film sensor 30 without using bulky and expensive pressure-reducing elastic bodies or springs to measure high pressure. There is an advantage in being able to implement the device.

As such, because the pressure detection device according to the present invention has a thin and simple structure, it can be used to measure the load on heavy civil engineering structures such as bridges and underground anchors, as well as the weight of heavy oil tanks and large trucks. It can also be used to measure .

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention.

Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

10, 10': Top panel 11, 15, 22, 23, 26, 27: Insertion hole
11', 21, 25: Fastening groove 19: Protrusion
20, 20': lower panel 30: thin film sensor
41: first insulating pad 45: second insulating pad
51: first pressing member 55: second pressing member
61: first pressure control member 65: second pressure control member
70: circuit part 71: connection line
75: signal output line 80: cover

Claims (21)

a thin film sensor disposed between the upper and lower panels facing each other at a predetermined interval;
an insulating pad formed to be in close contact with the upper and lower surfaces of the thin film sensor to maintain the surface of the thin film sensor in an insulated state;
a pressing member disposed between the upper panel and the insulating pad and transmitting external pressure applied to the upper panel to the thin film sensor; and
A circuit unit electrically connected to the thin film sensor and converting the change in impedance of the thin film sensor, which changes according to external pressure transmitted to the thin film sensor, into an electrical signal and outputting it;
A pressure detection device comprising a. In claim 1,
The thin film sensor is,
a pattern portion formed with a zigzag-shaped pattern structure that amplifies the size of impedance that changes according to external pressure; and
A pressure detection device comprising an electrode unit electrically connected to the circuit unit and outputting a signal corresponding to a change in impedance of the pattern unit to the circuit unit. In claim 2,
The thin film sensor is,
A pressure detection device characterized in that it is composed of a soft magnetic alloy. In claim 2,
The insulation pad is,
a first insulating pad formed in close contact with the upper surface of the pattern portion of the thin film sensor; and
A pressure detection device comprising a second insulating pad formed in close contact with a lower surface of the electrode portion and the pattern portion of the thin film sensor. In claim 4,
The insulation pad is,
A pressure detection device characterized in that it is formed of polyamide material. In claim 4,
The pressing member is,
Pressure detection comprising a first pressing member formed to be in close contact between the center of the upper panel and the first insulating pad and pressing the upper part of the pattern portion of the thin film sensor when external pressure is applied to the upper panel. Device. In claim 4,
The pressure further includes a second pressing member that is formed to be in close contact between the center of the lower panel and the second insulating pad and presses the lower portion of the pattern portion of the thin film sensor when external pressure is applied to the upper panel. Detection device. In claim 1,
A pressure detection device further comprising a protrusion protruding upward from the center of the upper panel so that external pressure applied to the upper panel is concentrated at the center. In claim 1,
The circuit part is,
A pressure detection device that is formed to be fixed to a predetermined area of the lower panel and detects a voltage difference generated according to the impedance change when an impedance change according to external pressure is applied from the thin film sensor. In claim 9,
The circuit part is,
A pressure detection device characterized by consisting of a Wheatstone bridge circuit. In claim 1,
A pressure detection device coupled to the upper panel and the lower panel and further comprising a pressure control member that adjusts the pressure between the thin film sensor, the insulating pad, and the pressing member formed between the upper panel and the lower panel. In claim 11,
The upper panel is,
It includes insertion holes formed through the body of the pressure adjustment member on both sides of the upper panel at corresponding positions based on the center of the upper panel,
The lower panel is,
A pressure detection device comprising a fastening groove formed at a position corresponding to the insertion hole to fasten the body of the pressure adjustment member penetrating the insertion hole. In claim 12,
The pressure control member is,
When the body penetrates the insertion hole and fastens to the fastening groove, the head portion is in close contact with the upper surface of the upper panel, and the gap between the upper and lower panels is adjusted by rotating the pressure adjustment member. Characterized by a pressure detection device. In claim 12,
The fastening groove is,
A pressure detection device characterized in that a spiral protrusion is formed on the inner surface to facilitate insertion and fastening of the body of the pressure adjustment member. In claim 12,
The insertion hole is,
A pressure detection device characterized in that it is formed larger than the diameter of the body of the pressure adjustment member, but smaller than the diameter of the head of the pressure adjustment member. In claim 11,
The lower panel is,
It includes insertion holes formed through which the body of the pressure adjustment member penetrates, on both sides of the lower panel at corresponding positions relative to the center of the lower panel,
The upper panel is,
A pressure detection device comprising a fastening groove formed at a position corresponding to the insertion hole to fasten the body of the pressure adjustment member penetrating the insertion hole. In claim 16,
The insertion hole is,
a first insertion portion formed to be larger than the diameter of the body of the pressure regulating member, but smaller than the diameter of the head of the pressure regulating member; and
A pressure detection device comprising a second insertion portion formed below the first insertion portion and having a larger diameter than the first insertion portion. In claim 17,
The pressure control member is,
When the body penetrates the insertion hole and fastens to the fastening groove, the head portion is in close contact with the upper surface of the second insertion portion, and the gap between the upper panel and the lower panel is adjusted by rotating the pressure adjustment member. A pressure detection device characterized in that. In claim 17,
The second insertion part,
A pressure detection device characterized in that it is formed larger than the diameter of the head of the pressure adjustment member. In claim 16,
The fastening groove is,
A pressure detection device characterized in that a spiral protrusion is formed on the inner surface to facilitate insertion and fastening of the body of the pressure adjustment member. In claim 16,
A cover is formed in a shape that covers both the upper panel and the lower panel, is fixed along the edge of the upper surface of the lower panel, and has a hole in the center so that the protrusion formed on the upper panel can protrude to the outside. A pressure detection device comprising:

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