KR20230161851A - Electronic device including housing - Google Patents

Abstract

An electronic device according to an embodiment includes a housing including a plurality of sides, and an electronic component disposed in the housing and surrounded by the plurality of sides, wherein the housing includes a first alloy and the first alloy. a conductive portion comprising a first region comprising a second alloy distinct from the alloy and defining some of the plurality of sides, and a second region comprising the first alloy and surrounded by the first region, a non-conductive portion coupled to the conductive portion and defining another portion of the plurality of sides, and an anodizing film disposed on the first alloy and the second alloy, the plurality of sides comprising: a first side including a portion of the region, a second side including another portion of the first region, and a second side disposed between the first side and the second side and including a portion of the non-conductive portion. Includes 3 aspects.

Description

Electronic device including housing {ELECTRONIC DEVICE INCLUDING HOUSING}

The embodiment described below relates to an electronic device including a housing.

Electronic devices can provide users with various user experiences. For example, an electronic device may include one or more electronic components to provide various functions to a user. An electronic device may include a housing that accommodates electronic components and forms at least a portion of the outer surface of the electronic device.

The housing may protect the electronic components and perform the function of decorating the electronic device through the outer surface of the housing. For example, the housing may include a pattern or shape disposed on the outer surface of the housing to decorate the electronic device. When a user uses an electronic device, the outer surface of the housing in contact with a part of the user's body may be worn by the part of the user's body. Electronic devices may need a method to reduce wear of patterns or shapes formed on the outer surface of the housing.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

An electronic device according to an embodiment may include a housing including a plurality of sides, and an electronic component disposed in the housing and surrounded by the plurality of sides. According to one embodiment, the housing includes a first alloy and a second alloy distinct from the first alloy and a first region defining a portion of the plurality of sides, and the first alloy and a second alloy distinct from the first alloy. It may include a conductive portion including a second region surrounded by a first region. According to one embodiment, the housing may include a non-conductive portion coupled to the conductive portion and defining another portion of the plurality of sides. According to one embodiment, the housing may include an anodizing film disposed on the first alloy and the second alloy. According to one embodiment, the plurality of sides include a first side including a part of the first area, a second side including another part of the first area, and a combination of the first side and the second side. It is disposed between and may include a third side including a portion of the non-conductive portion.

A method for manufacturing a housing for an electronic device according to an embodiment includes rubbing the boundary between a first alloy and a second alloy that is distinct from the first alloy using a rotating tool, It may include the step of manufacturing a weldment in which two alloys are welded. The method according to one embodiment may include cutting a portion of the weldment so that the first alloy and the second alloy are exposed on the side of the weldment. The method according to one embodiment may include forming an anodizing film on the cut weldment.

A housing according to one embodiment includes a first region comprising a first alloy and a second alloy distinct from the first alloy and defining some of a plurality of sides of the housing, and the first alloy comprising: It may include a conductive portion including a second region surrounded by the first region. According to one embodiment, the housing may include a non-conductive portion coupled to the conductive portion and defining another portion of the plurality of sides. According to one embodiment, the housing may include an anodizing film disposed on the first alloy and the second alloy. According to one embodiment, the plurality of sides include a first side including a part of the first area, a second side including another part of the first area, and a space between the first side and the second side. and may include a third side including a portion of the non-conductive portion.

An electronic device according to an embodiment may provide a variety of aesthetic experiences to users through a housing in which different alloys are exposed to the outside of the electronic device.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
FIG. 2 is a diagram illustrating an electronic device according to an embodiment.
Figure 3 is an exploded perspective view of an electronic device according to an embodiment.
FIG. 4A is a perspective view of a housing of an electronic device according to one embodiment.
FIG. 4B is a partial cross-sectional view illustrating an example in which the housing of an electronic device according to an embodiment is cut along line A-A' of FIG. 4A.
FIG. 5 is a partial cross-sectional view illustrating an example in which the housing of an electronic device according to an embodiment is cut along line B-B' of FIG. 4A.
Figure 6 shows an example of a method for manufacturing a housing for an electronic device according to an embodiment.
Figure 7 shows an example of a method for manufacturing a housing for an electronic device according to an embodiment.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a diagram illustrating an electronic device according to an embodiment.

Referring to FIG. 2 , an electronic device 200 according to an embodiment may include a housing that forms the exterior of the electronic device 200. For example, the housing may include a first side (or front) 200A, a second side (or back) 200B, and a third side surrounding the space between the first side 200A and the second side 200B. It may include a face (or side) (200C). In one embodiment, the housing has a structure that forms at least a portion of the first side 200A, the second side 200B, and/or the third side 200C (e.g., the frame structure 240 of FIG. 2). It may also refer to .

The electronic device 200 according to one embodiment may include a substantially transparent front plate 202. In one embodiment, the front plate 202 may form at least a portion of the first surface 200A. In one embodiment, the front plate 202 may include, but is not limited to, a glass plate including various coating layers, or a polymer plate.

The electronic device 200 according to one embodiment may include a substantially opaque rear plate 211. In one embodiment, the rear plate 211 may form at least a portion of the second surface 200B. In one embodiment, back plate 211 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. You can.

The electronic device 200 according to one embodiment may include a side bezel structure (or side member) 218 (eg, the side wall 241 of the frame structure 240 in FIG. 2). In one embodiment, the side bezel structure 218 may be combined with the front plate 202 and/or the back plate 211 to form at least a portion of the third side 200C of the electronic device 200. For example, the side bezel structure 218 may form all of the third side 200C of the electronic device 200, or in another example, the side bezel structure 218 may form the front plate 202 and/or Together with the back plate 211, the third side 200C of the electronic device 200 may be formed.

Unlike the illustrated embodiment, when the third side 200C of the electronic device 200 is partially formed by the front plate 202 and/or the rear plate 211, the front plate 202 and/or the rear plate 211 The plate 211 may include a region that is curved and extends seamlessly from its edge toward the rear plate 211 and/or the front plate 202 . The extended area of the front plate 202 and/or the rear plate 211 may be, for example, located at both ends of a long edge of the electronic device 200, but according to the above-described example, It is not limited.

In one embodiment, side bezel structure 218 may include metal and/or polymer. In one embodiment, the rear plate 211 and the side bezel structure 218 may be formed integrally and may include the same material (eg, a metal material such as aluminum), but are not limited thereto. For example, the back plate 211 and the side bezel structures 218 may be formed of separate construction and/or may include different materials.

In one embodiment, the electronic device 200 includes a display 201, an audio module 203, 204, and 207, a sensor module (not shown), a camera module 205, 212, and 213, a key input device 217, It may include at least one of a light emitting device (not shown) and/or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the above components (e.g., key input device 217 or a light emitting device (not shown)) or may additionally include other components.

In one embodiment, display 201 (e.g., display module 160 of Figure 1) may be visually exposed through a significant portion of front plate 202. For example, at least a portion of display 201 may be It may be visible through the front plate 202 forming the first side 200A. In one embodiment, the display 201 may be disposed on the back of the front plate 202.

In one embodiment, the outer shape of the display 201 may be substantially the same as the outer shape of the front plate 202 adjacent to the display 201. In one embodiment, in order to expand the area to which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed to be substantially the same.

In one embodiment, the display 201 (or the first side 200A of the electronic device 200) may include a screen display area 201A. In one embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first side 200A is viewed from the front, the screen display area 201A is shown to be located inside the first side 200A and spaced apart from the outer edge of the first side 200A. However, it is not limited to this. In another embodiment, when the first side 200A is viewed head on, at least a portion of an edge of the screen display area 201A substantially coincides with an edge of the first side 200A (or the front plate 202). It could be.

In one embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of “the screen display area 201A includes the sensing area 201B” can be understood as at least a portion of the sensing area 201B being overlapped with the screen display area 201A. there is. For example, the sensing area 201B, like other areas of the screen display area 201A, can display visual information by the display 201 and can additionally acquire the user's biometric information (e.g., fingerprint). It can mean area. In another embodiment, the sensing area 201B may be formed in the key input device 217.

In one embodiment, the display 201 may include an area where the first camera module 205 (eg, the camera module 180 of FIG. 1) is located. In one embodiment, an opening is formed in the area of the display 201, and a first camera module 205 (e.g., a punch hole camera) is at least partially disposed within the opening to face the first side 200A. You can. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. In another embodiment, the first camera module 205 (eg, an under display camera (UDC)) may be placed below the display 201 to overlap the area of the display 201. In this case, the display 201 can provide visual information to the user through the area, and additionally, the first camera module 205 is positioned in a direction toward the first side 200A through the area of the display 201. A corresponding image can be obtained.

In one embodiment, the display 201 is combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen. .

In one embodiment, the audio modules 203, 204, and 207 (e.g., audio module 170 in FIG. 1) may include microphone holes 203 and 204 and speaker holes 207.

In one embodiment, the microphone holes 203 and 204 include a first microphone hole 203 formed in a portion of the third side 200C and a second microphone hole 204 formed in a portion of the second side 200B. may include. Microphones (not shown) may be placed inside the microphone holes 203 and 204 to acquire external sounds. The microphone may include a plurality of microphones to detect the direction of sound.

In one embodiment, the second microphone hole 204 formed in a partial area of the second surface 200B may be disposed adjacent to the camera modules 205, 212, and 213. For example, the second microphone hole 204 may acquire sound according to the operation of the camera modules 205, 212, and 213. However, it is not limited to this.

In one embodiment, the speaker hole 207 may include an external speaker hole 207 and a receiver hole (not shown) for a call. The external speaker hole 207 may be formed in a portion of the third side 200C of the electronic device 200. In another embodiment, the external speaker hole 207 and the microphone hole 203 may be implemented as one hole. Although not shown, a receiver hole (not shown) for a call may be formed in another part of the third side 200C. For example, the receiver hole for a call may be formed on the third side 200C opposite the external speaker hole 207. For example, based on the illustration in FIG. 2, the external speaker hole 207 is formed on the third side 200C corresponding to the lower part of the electronic device 200, and the receiver hole for a call is formed on the electronic device 200. It may be formed on the third side 200C corresponding to the upper end. However, it is not limited to this, and in another embodiment, the call receiver hole may be formed in a location other than the third surface 200C. For example, a receiver hole for a call may be formed by a spaced space between the front plate 202 (or display 201) and the side bezel structure 218.

In one embodiment, the electronic device 200 includes at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 207 and/or the call receiver hole (not shown). can do.

In one embodiment, a sensor module (not shown) (e.g., sensor module 176 in FIG. 1) generates an electrical signal or data value corresponding to the internal operating state of the electronic device 200 or the external environmental state. can be created. For example, the sensor module may include a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyro sensor, barometric pressure sensor, magnetic sensor, acceleration sensor, grip sensor, color sensor, IR (infrared) sensor, biometric sensor, temperature sensor, It may include at least one of a humidity sensor or an illuminance sensor.

In one embodiment, the camera modules 205, 212, and 213 (e.g., the camera module 180 in FIG. 1) are a first camera module disposed to face the first side 200A of the electronic device 200. 205), a second camera module 212 arranged to face the second surface 200B, and a flash 213.

In one embodiment, the second camera module 212 may include a plurality of cameras (eg, a dual camera, a triple camera, or a quad camera). However, the second camera module 212 is not necessarily limited to including a plurality of cameras and may include one camera.

In one embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, an image sensor, and/or an image signal processor.

In one embodiment, the flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be placed on one side of the electronic device 200.

In one embodiment, the key input device 217 (eg, the input module 150 of FIG. 1) may be disposed on the third side 200C of the electronic device 200. In other embodiments, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may be in other forms, such as soft keys, on the display 201. It can be implemented as:

In one embodiment, the connector hole 208 may be formed on the third side 200C of the electronic device 200 to accommodate a connector of an external device. A connection terminal (eg, connection terminal 178 in FIG. 1) that is electrically connected to a connector of an external device may be disposed in the connector hole 208. The electronic device 200 according to one embodiment may include an interface module (eg, interface 177 of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

In one embodiment, the electronic device 200 may include a light emitting device (not shown). For example, the light emitting device (not shown) may be disposed on the first side 200A of the housing. The light emitting device (not shown) may provide status information of the electronic device 200 in the form of light. In another embodiment, the light emitting device (not shown) may provide a light source linked to the operation of the first camera module 205. For example, the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.

Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

Hereinafter, overlapping descriptions of components having the same reference numerals as the above-described components will be omitted.

Referring to FIG. 3, the electronic device 200 according to one embodiment includes a frame structure 240, a first printed circuit board 250, a second printed circuit board 252, a cover plate 260, and a battery. It may include (270).

In one embodiment, the frame structure 240 includes a side wall 241 that forms the exterior of the electronic device 200 (e.g., the third side 200C of FIG. 2) and extending inward from the side wall 241. It may include a support portion 243. In one embodiment, frame structure 240 may be disposed between display 201 and back plate 211. In one embodiment, sidewalls 241 of frame structure 240 may surround the space between rear plate 211 and front plate 202 (and/or display 201), and frame structure 240 The support portion 243 may extend from the side wall 241 within the space.

In one embodiment, frame structure 240 may support or accommodate other components included in electronic device 200. For example, the display 201 may be disposed on one side of the frame structure 240 facing in one direction (e.g., +z direction), and the display 201 may be disposed on the support portion 243 of the frame structure 240. It can be supported by . For another example, a first printed circuit board 250, a second printed circuit board 252, and a battery 270 are provided on the other side of the frame structure 240 facing in a direction opposite to the one direction (e.g., -z direction). ), and the second camera module 212 may be disposed. The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 are attached to the side wall 241 and/or the support portion 243 of the frame structure 240. Each can be seated in a recess defined by

In one embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may each be combined with the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixed to the frame structure 240 through a coupling member such as a screw. For example, the battery 270 may be fixed to the frame structure 240 through an adhesive member (eg, double-sided tape). However, it is not limited to the above-described example.

In one embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the back plate 211. In one embodiment, a cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a side of the first printed circuit board 250 facing the -z direction.

In one embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. In one embodiment, the cover plate 260 may cover at least a partial area of the first printed circuit board 250 . Through this, the cover plate 260 protects the first printed circuit board 250 from physical shock or the connector coupled to the first printed circuit board 250 (e.g., connector 34 in FIG. 3) is separated. can be prevented.

In one embodiment, the cover plate 260 is fixedly disposed on the first printed circuit board 250 through a coupling member (e.g., a screw), or is coupled with the first printed circuit board 250 through the coupling member. Can be coupled to frame structure 240.

In one embodiment, display 201 may be disposed between frame structure 240 and front plate 202. For example, the front plate 202 may be disposed on one side (e.g., +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (e.g., -z direction).

In one embodiment, front plate 202 may be coupled with display 201. For example, the front plate 202 and the display 201 may be adhered to each other through an optical adhesive member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

In one embodiment, front plate 202 may be coupled with frame structure 240. For example, the front plate 202 may include an outer portion extending outside the display 201 when viewed in the z-axis direction, and the outer portion of the front plate 202 and the frame structure 240 ( For example, it may be adhered to the frame structure 240 through an adhesive member (eg, double-sided tape) disposed between the side walls 241). However, it is not limited to the above-mentioned example.

In one embodiment, the first printed circuit board 250 and/or the second printed circuit board 252 include a processor (e.g., processor 120 of FIG. 1) and a memory (e.g., memory 130 of FIG. 1). ), and/or an interface (e.g., interface 177 of FIG. 1) may be installed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector. In one embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operatively or electrically connected to each other through a connecting member (eg, a flexible printed circuit board).

In one embodiment, battery 270 (eg, battery 189 of FIG. 1 ) may supply power to at least one component of electronic device 200 . For example, the battery 270 may include a rechargeable secondary battery or fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and/or the second printed circuit board 252.

The electronic device 200 according to one embodiment may include an antenna module (not shown) (eg, the antenna module 197 of FIG. 1). In one embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. For example, the antenna module may perform short-distance communication with an external device or wirelessly transmit and receive power to and from an external device.

In one embodiment, the first camera module 205 (e.g., a front camera) has a lens that covers some area (e.g., camera area 237) of the front plate 202 (e.g., front side 200A of FIG. 2). It may be disposed on at least a portion of the frame structure 240 (eg, the support portion 243) to receive external light through the frame structure 240.

In one embodiment, the second camera module 212 (eg, a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In one embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 through a connection member (eg, connector). In one embodiment, the second camera module 212 may be arranged so that the lens can receive external light through the camera area 284 of the rear plate 211 of the electronic device 200.

In one embodiment, the camera area 284 may be formed on the surface of the back plate 211 (eg, the back side 200B in FIG. 2). In one embodiment, the camera area 284 may be formed to be at least partially transparent to allow external light to enter the lens of the second camera module 212. In one embodiment, at least a portion of the camera area 284 may protrude from the surface of the back plate 211 at a predetermined height. However, it is not limited to this, and in another embodiment, the camera area 284 may form substantially the same plane as the surface of the rear plate 211.

In one embodiment, the housing of the electronic device 200 may refer to a configuration or structure that forms at least part of the exterior of the electronic device 200. In this regard, at least some of the front plate 202, frame structure 240, and/or back plate 211 that form the exterior of the electronic device 200 may be referred to as the housing of the electronic device 200. .

FIG. 4A is a perspective view of a housing of an electronic device according to an embodiment, and FIG. 4B shows an example of the housing of an electronic device according to an embodiment cut along line A-A' of FIG. 4A. This is a partial cross-sectional view.

Referring to FIGS. 4A and 4B, the housing 400 of an electronic device (e.g., the electronic device 200 of FIG. 2) according to an embodiment has a front 410, a rear 420, and a plurality of side surfaces ( 430), a conductive portion 440, a non-conductive portion 450, and/or an anodizing film 460. According to one embodiment, the housing 400 may define at least a portion of the outer surface of the electronic device 200. When the electronic device 200 is used by a user, the outer surface of the housing 400 may come into contact with a part of the user's body. According to one embodiment, the electronic device 200 may include one or more electronic components disposed within. The electronic device 200 can provide various functions to the user through electronic components. According to one embodiment, the housing 400 may be extended to have a long length. For example, the housing 400 may extend longer in a second direction (e.g., -y direction or +y direction) perpendicular to the first direction than in the first direction (e.g., +x direction or -x direction). may, but is not limited to this.

The front 410 may be one side of the housing 400 that faces the user when the user uses the electronic device 200. According to one embodiment, a display (eg, display module 160 of FIG. 1) may be disposed on the front 410 of the housing 400. When manufacturing of the electronic device 200 is completed, at least a portion of the front surface 410 may be covered by the display and may not be substantially visible from the outside of the electronic device 200.

The rear 420 may be the other side of the housing 400 that faces a direction opposite to the direction the front 410 faces when a user uses the electronic device. According to one embodiment, the rear 420 may face the front 410 and be spaced apart from the front 410 . According to one embodiment, the battery of the electronic device 200 (eg, battery 189 in FIG. 1) may be disposed on the rear 420 of the housing 400. According to one embodiment, the rear surface 420 may be substantially parallel to the front surface 410. When the manufacturing of the electronic device 200 is completed, at least a portion of the rear surface 420 may not be substantially visible from the outside of the electronic device 200.

A plurality of side surfaces 430 may connect the front 410 and the rear 420. According to one embodiment, the plurality of side surfaces 430 may extend between the edge of the front 410 and the edge of the rear 420 to connect the front 410 and the rear 420. For example, each of the plurality of side surfaces 430 may be substantially perpendicular to the front surface 410 and/or the rear surface 420 . As the plurality of side surfaces 430 connect the front 410 and the rear 420, the housing 400 may define the internal space of the electronic device 200. The plurality of side surfaces 430 may surround electronic components placed in the housing 400 . When manufacturing of the electronic device 200 is completed, the plurality of side surfaces 430 may be visible from the outside of the electronic device 200.

According to one embodiment, the housing 400 may include a corner 401 defined by a plurality of side surfaces 430. For example, the edge 401 of the housing 400 has one side of the housing 400 facing in a first direction (e.g., +x direction or -x direction) and one side of the housing 400 facing in a second direction (e.g., +y direction or -x direction). It may be an area of the housing 400 that is in contact with the other side of the housing 400 facing (y direction). For example, the edge 401 of the housing 400 may have a curvature, but is not limited thereto. For another example, the edge 401 may have a substantially right angle.

The conductive portion 440 may form at least a portion of the housing 400 . According to one embodiment, the conductive portion 440 may occupy most of the area of the housing 400. The conductive portion 440 may include a conductive material so that the exterior of the housing 400 has a glossy appearance. According to one embodiment, the conductive portion 440 may include a first alloy 440a and a second alloy 440b that is distinct from the first alloy 440a. The first alloy 440a and the second alloy 440b may have different physical properties. For example, the second alloy 440b may have a lower hardness than the first alloy 440a, but is not limited thereto. The first alloy 440a and the second alloy 440b may be welded to each other to form the conductive portion 440 integrally. For example, the first alloy 440a and the second alloy 440b may be welded to each other by friction stir welding (fsw), but are not limited thereto.

According to one embodiment, the first alloy 440a and the second alloy 440b may be selected from aluminum-based alloys. Aluminum series alloys may include, for example, 1xxx series aluminum, 2xxx series aluminum, 3xxx series aluminum, 4xxx series aluminum, 5xxx series aluminum, 6xxx series aluminum, and/or 7xxx series aluminum. . 1xxx series aluminum is pure aluminum containing more than 99.00 wt (weigh ratio)% of aluminum, 2xxx series aluminum is an aluminum-copper alloy, 3xxx series aluminum is an aluminum-manganese alloy, and 4xxx series aluminum is an aluminum-silicon alloy. , 5xxx series aluminum can be referred to as an aluminum-magnesium alloy, 6xxx series aluminum can be referred to as an aluminum-magnesium-silicon alloy, and 7xxx series aluminum can be referred to as an aluminum-zinc alloy. The 5xxx series aluminum may include, for example, at least one of AL5052 and AL5182. The 6xxx series aluminum may include, for example, AL6013. 7xxx series aluminum may be referenced as, for example, AL7003H, AL7N03.

According to one embodiment, the first alloy 440a may include at least one of aluminum, magnesium, silicon, recycled aluminum, and recycled magnesium. The second alloy 440b may include at least one of aluminum, zinc, recycled aluminum, and recycled zinc. For example, the first alloy 440a may include recycled 7xxx series aluminum, and the second alloy 440b may include recycled 6xxx series aluminum. The housing 400 according to one embodiment can provide a structure with a reduced manufacturing cost of the housing 400 by using the first alloy 440a and the second alloy 440b, each containing recycled alloys. .

According to one embodiment, the conductive portion 440 may include a first region 441 and a second region 442 surrounded by the first region 441. For example, the first region 441 may refer to a portion of the conductive portion 440 connected to the edge of the second region 442. The first region 441 may include a first alloy 440a and a second alloy 440b that is distinct from the first alloy 440a. According to one embodiment, the first region 441 formed by the first alloy 440a and the second alloy 440b may define a portion of the plurality of sides 430 of the housing 400. . The second region 442 may include the first alloy 440a. For example, the second region 442 may include only the first alloy 440a among the first alloy 440a and the second alloy 440b. According to one embodiment, the second area 442 may define the front 410 of the housing 400 and the rear 420 opposite to the front 410. The area of the second area 442 may be larger than the area of the first area 441.

According to one embodiment, the area of the first alloy (440a) included in both the first region 441 and the second region 442 is the area of the second alloy (440b) included only in the first region 441. It can be bigger than As the area of the first alloy 440a is larger than the area of the second alloy 440b, the strength of the first alloy 440a is increased to that of the second alloy 440b to ensure the rigidity of the housing 400. ) can be greater than the intensity of.

According to one embodiment, the first alloy 440a and the second alloy 440b of the first region 441 define a portion of the plurality of side surfaces 430 and are visible from the outside of the housing 400. You can. For example, within the first region 441, the first alloy 440a may surround a portion of the second alloy 440b. One side of the second alloy 440b that is not surrounded by the first alloy 440a may be exposed to the outside of the housing 400. According to one embodiment, as the physical properties of the second alloy 440b and the first alloy 440a are different, the first alloy 440a and the second alloy 440b exposed to the outside of the housing 400 are, You can define a pattern or shape. For example, the first alloy 440a may include a 7xxx series aluminum alloy, and the second alloy 440b may include a 6xxx series aluminum alloy. Because the 7xxx series aluminum alloy contains zinc, it can have a darker color and higher gloss than the 6xxx series aluminum alloy containing silicon. Through the appearance difference between the first alloy 440a and the second alloy 440b, the housing 400 can provide various appearances to the user.

According to one embodiment, the hardness of the second alloy 440b and the hardness of the first alloy 440a may be different from each other. For example, the first alloy 440a may include a 7xxx series aluminum alloy, and the second alloy 440b may include a 6xxx series aluminum alloy having a lower hardness than the 7xxx series aluminum alloy. Due to the difference in hardness between the first alloy 440a and the second alloy 440b, the roughness of the first alloy 440a and the roughness of the second alloy 440b may be different. For example, during the process of manufacturing the housing 400, the first alloy 440a and the second alloy 440b may be polished. When the hardness of the second alloy 440b is lower than the hardness of the first alloy 440a, the abrasion degree due to polishing of the second alloy 440b is greater than the abrasion degree due to polishing of the first alloy 440a. It can be big. As the wear degree of the second alloy 440b is greater than that of the first alloy 440a, the roughness of one side of the second alloy 440b may be smaller than the roughness of one side of the first alloy 440a. there is. For another example, in the process of manufacturing the housing 400, a sand blasting process may be performed on the first alloy 440a and the second alloy 440b. The sandblasting process may mean abrading a portion of the surface of the first alloy 440a and/or the second alloy 440b using an abrasive. When the hardness of the second alloy 440b is lower than the hardness of the first alloy 440a, the degree to which the second alloy 440b is worn by the abrasive is greater than the degree to which the first alloy 440a is worn by the abrasive. It can be big. As the degree to which the second alloy 440b is worn is greater than the degree to which the first alloy 440a is worn, the roughness of one side of the second alloy 440b is that of one side of the first alloy 440a. It can be greater than roughness. Due to the difference in roughness between the second alloy 440b and the first alloy 440a, the housing 400 can provide various tactile sensations to the user. According to one embodiment, the second alloy 440b may be formed in plural pieces. For example, the second alloy 440b may be formed as a plurality of lines and/or as a plurality of shapes.

According to one embodiment, the housing 400 may include an opening 443 and a receiving groove 444. The opening 443 and the receiving groove 444 may be formed in the conductive portion 440. The opening 443 may connect the front 410 and the rear 420 of the housing 400. For example, the opening 443 may penetrate the front 410 and the rear 420 of the housing 400. As the opening 443 connects the front 410 and the rear 420, the electronic component disposed on the front 410 may be electrically connected to another electronic component disposed on the rear 420. The receiving groove 444 can accommodate components of the electronic device 200. For example, the receiving groove 444 may accommodate at least a portion of the non-conductive portion 450. The receiving groove 444 may define a step within the housing 400 . The receiving groove 444 may be formed by a portion of the conductive portion 440 being depressed inward. According to one embodiment, the opening 443 and the receiving groove 444 may be formed through a cutting process of cutting at least a portion of the conductive portion 440. For example, the cutting process may include a CNC (computer numerical control) process that controls a cutter through a computer.

According to one embodiment, the conductive portion 440 may include a connector hole 445. The connector hole 445 may connect the inside of the housing 400 and the outside of the housing 400. According to one embodiment, the connector hole 445 may be disposed on at least one of the plurality of side surfaces 430. According to one embodiment, the electronic device 200 may be electrically connected to an external electronic device through the connector hole 445. For example, when a charging terminal for charging the electronic device 200 is inserted into the connector hole 445, the battery 189 of the electronic device 200 can be charged. For another example, when a terminal for transmitting or receiving data to the electronic device 200 is inserted into the connector hole 445, the electronic device 200 may be able to communicate with an external electronic device.

The non-conductive portion 450 may be coupled to the conductive portion 440. For example, the non-conductive portion 450 may pass through the opening 443 formed in the conductive portion 440 or may be seated in the receiving groove 444 and coupled to the conductive portion 440. According to one embodiment, the non-conductive portion 450 may define a portion of the front 410, back 420, and/or a plurality of sides 430 of the housing 400. For example, some of the plurality of side surfaces 430 may be defined by the conductive portion 440 and other portions of the plurality of side surfaces 430 may be defined by the non-conductive portion 450 . According to one embodiment, the non-conductive portion 450 may be coupled to the conductive portion 440 after the conductive portion 440 is manufactured. For example, the non-conductive portion 450 may be disposed within the conductive portion 440 through an injection process. The non-conductive portion 450 may be formed by injection molding that is injected into the opening 443 or the receiving groove 444 of the conductive portion 440 and then cooled.

According to one embodiment, the non-conductive portion 450 includes a non-conductive material and thus may segment the conductive portion 440. For example, the plurality of side surfaces 430 may include a first side 431, a second side 432, and a third side 433. The first side 431 may include a portion of the first area 441 of the conductive portion 440. For example, first side 431 is defined by conductive portion 440 and may form part of a side of housing 400 facing a second direction (e.g., -y direction or +y direction). there is. The second side 432 may include another portion of the first region 441 of the conductive portion 440. For example, second side 432 is defined by conductive portion 440 and may form another portion of the side of housing 400 facing the second direction. As another example, the second side 432 may define an edge 401 of the housing 400 and a side of the housing 400 facing a first direction (e.g., the +x direction or the -x direction). there is. The third side 433 is disposed between the first side 431 and the second side 432 and may include a portion of the non-conductive portion 450. The first side 431 and the second side 432, which are spaced apart from each other by the third side 433, may be segmented.

According to one embodiment, a portion of the conductive portion 440 segmented by the non-conductive portion 450 may function as an antenna radiator. For example, the electronic device 200 may include a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1) disposed within the housing 400. The wireless communication circuit may be electrically (or operationally) connected to at least one of the first side 431 and the second side 432. According to one embodiment, the wireless communication circuit may be configured to communicate with an external electronic device in a designated frequency band through at least one of the first side 431 and the second side 432. For example, the designated frequency band may be referred to as a low-band band (e.g., a frequency band of about 1 GHz or less), but is not limited thereto.

The anodizing film 460 may be disposed on the conductive portion 440 to protect the conductive portion 440. According to one embodiment, the anodizing film 460 may be disposed on the first alloy 440a and the second alloy 440b. For example, the anodizing film 460 may be in contact with the outer surface of the first alloy 440a and the outer surface of the second alloy 440b facing the outside of the conductive portion 440, within the first region 441. there is. According to one embodiment, the anodizing film 460 may be disposed only on the conductive portion 440 among the conductive portion 440 and the non-conductive portion 450. For example, the anodizing film 460 may cover areas of the housing 400 excluding the non-conductive portion 450. According to one embodiment, the anodizing film 460 may be formed by an anodizing process of oxidizing the conductive portion 440 using a designated solution. The anodizing film 460 formed through an anodizing process can reduce corrosion and damage of the conductive portion 440. For another example, the anodizing film 460 may include a colorant so that the conductive portion 440 has a color.

According to one embodiment, the anodizing film 460 may be formed integrally on the conductive portion 440. For example, the anodizing film 460 is not cut off on the first area 441 and can contact the first alloy 440a and the second alloy 440b. When the housing 400 is manufactured from one type of alloy, different anodizing films may be placed on the one type of alloy to decorate the exterior of the housing 400. If different anodizing films are disposed on one type of alloy, the lifespan of the housing 400 may be reduced. For example, the lifespan of one type of alloy may be reduced by penetration of foreign substances (e.g., moisture) through the boundaries between different anodizing films. For another example, when the housing 400 is made of one type of alloy, the housing 400 may undergo an anodizing process a plurality of times to form different anodizing films. there is. As the anodizing process is performed multiple times, the manufacturing cost of the housing 400 may increase, or the lifespan of one type of alloy may be reduced during the anodizing process. The electronic device 200 according to one embodiment provides a variety of aesthetic experiences to the user by different alloys 440a and 440b defining portions of the plurality of sides 430 of the housing 400, A structure that can increase the lifespan of the housing 400 can be provided. The electronic device 200 according to one embodiment increases the lifespan of the housing 400 and increases the lifespan of the housing 400 by a single anodizing film 460 disposed on different alloys 440a and 440b. A structure that can reduce production costs can be provided.

As described above, the electronic device 200 according to one embodiment provides the user with a variety of aesthetic experiences through different alloys 440a and 440b that are exposed to the outside of the housing 400 and decorate the housing 400. can be provided. The electronic device 200 according to one embodiment provides a variety of aesthetic experiences to the user by means of a conductive portion 440 that is segmented by the non-conductive portion 450 and can operate as an antenna radiator, and is connected to external electronic devices and A structure capable of communication can be provided.

FIG. 5 is a partial cross-sectional view illustrating an example in which the housing of an electronic device according to an embodiment is cut along line B-B' of FIG. 4A.

Referring to FIG. 5 , according to one embodiment, a portion 450a of the non-conductive portion 450 may penetrate the conductive portion 440. For example, a portion 450a of the non-conductive portion 450 may be connected to another portion 450b of the non-conductive portion 450 disposed in the second region 442 of the conductive portion 440. A portion 450a of the non-conductive portion 450 may extend from the second region 442 of the conductive portion 440 toward the outside of the housing 400 to the first region 441 of the conductive portion 440. there is. A portion 450a of the non-conductive portion 450 extending into the first area 441 may be exposed to the outside of the housing 400. The outer surface of the portion 450a of the non-conductive portion 450 may define a third side 433 among the plurality of side surfaces 430 . For example, the outer surface of the portion 450a of the non-conductive portion 450 forms the third side 433 and may be disposed between the first side 431 and the second side 432.

According to one embodiment, the housing 400 may include a bonding film 470. The bonding film 470 can maintain the bond between the non-conductive portion 450 and the conductive portion 440. According to one embodiment, the bonding film 470 may be interposed between the conductive portion 440 and the non-conductive portion 450. For example, the bonding film 470 may be disposed on the outer surface of the conductive portion 440 facing the non-conductive portion 450. According to one embodiment, in the process of manufacturing the housing 400, the bonding film 470 is disposed on the outer surface of the conductive portion 440 before the non-conductive portion 450 is disposed on the conductive portion 440. You can. For example, the bonding film 470 may be formed by immersing the conductive portion 440 in a solution for forming the bonding film. After the non-conductive portion 450 is coupled to the conductive portion 440, a portion of the bonding film 470 disposed on the outer surface of the conductive portion 440 that does not face the non-conductive portion 450 is attached to the housing 400. It can be removed during the production process.

As described above, the electronic device (e.g., the electronic device 200 of FIG. 2) according to one embodiment provides a variety of aesthetic experiences to the user by the non-conductive portion 450 dividing the conductive portion 440. While doing so, it is possible to provide a structure capable of communicating with an external electronic device.

Figure 6 shows an example of a method for manufacturing a housing for an electronic device according to an embodiment.

6, in step 610, a first alloy (e.g., first alloy 440a in FIGS. 4A and 4B) and a second alloy distinct from the first alloy (e.g., second alloy 440a in FIGS. 4A and 4B) are formed. The boundary of the alloy 440b can be rubbed by a rotating tool. For example, the second alloy 440b can surround the first alloy 440a. The tool can use the first alloy 440a And it can provide friction for mixing the first alloy 440a and the second alloy 440b adjacent to the boundary of the second alloy 440b). The process of step 610 through the tool may be referred to as friction stir welding. The first alloy 440a and the second alloy 440b are welded to produce a weldment.

In step 620, a portion of the weldment may be cut to expose the first alloy 440a and the second alloy 440b on the side of the weldment. The first alloy 440a and the second alloy 440b exposed on the side of the welded product may define a pattern or shape. For example, a portion of the cut weldment may be disposed outside the first alloy 440a based on the rotation axis of the tool. For another example, a portion of the cut weldment may be disposed outside the first alloy 440a based on the trajectory of the tool formed on the weldment. The process of step 620 in which part of the weldment is cut may be referred to as a CNC process. The amount of the second alloy 440b included in the part of the cut weldment may be greater than the amount of the first alloy 440a.

In step 630, an anodizing film (eg, anodizing film 460 in FIGS. 4A and 4B) may be formed on the cut weldment. For example, the anodizing film 460 can be formed by oxidizing the cut weldment with a designated solution. As the anodizing film 460 is formed, manufacturing of the housing 400 can be completed.

As described above, the manufacturing method of the housing 400 according to an embodiment can form a single anodizing film 460 on the weldment, thereby reducing the manufacturing cost and manufacturing time of the housing 400. there is. For example, if the housing 400 includes only one type of alloy, multiple anodizing processes need to be performed to decorate the housing 400. When multiple anodizing processes are performed, a masking process must be performed between the multiple anodizing processes, so the manufacturing cost and manufacturing time of the housing 400 may increase. The manufacturing method of the housing 400 according to one embodiment can provide a method of omitting a plurality of anodizing processes and masking processes because the housing 400 is decorated with different alloys 440a and 440b. there is. The manufacturing method of the housing 400 according to an embodiment can provide a method of reducing the manufacturing cost and manufacturing time of the housing 400 by omitting some processes.

Figure 7 shows an example of a method for manufacturing a housing for an electronic device according to an embodiment.

Referring to FIG. 7 , it is possible to know in more detail about the manufacturing method of the housing (e.g., the housing 400 of FIGS. 4A and 4B) according to the embodiment of FIG. 6 .

According to one embodiment, in step 710, a first alloy 701 (e.g., first alloy 440a in FIGS. 4A and 4B) and a second alloy 702 (e.g., second alloy 440a in FIGS. 4A and 4B) Alloy 440b) may be prepared. The second alloy 702 may have lower hardness and/or strength than the first alloy 701. For example, the first alloy 701 may include a 7xxx series aluminum alloy, and the second alloy 702 may include a 6xxx series aluminum alloy. According to one embodiment, the first alloy 701 and the second alloy 702 may have the shape of a plate. For example, the first alloy 701 may have a substantially rectangular shape, and the second alloy 702 may have the shape of a plate including an opening 702a.

According to one embodiment, in step 720, the second alloy 702 may be placed in contact with the first alloy 701. For example, the second alloy 702 may surround the first alloy 701 on the outside of the first alloy 701. As another example, the first alloy 701 may be accommodated in the opening 702a included in the second alloy 702. According to one embodiment, the second alloy 702 and the first alloy 701 may be welded through a rotating tool t1. For example, the rotating tool t1 may apply frictional force to the boundary 703 of the first alloy 701 and the second alloy 702 while rotating at a specified speed. At the boundary 703 between the welded first alloy 701 and the second alloy 702, the first alloy 701 and the second alloy 702 may be mixed with each other. As the first alloy 701 and the second alloy 702 are welded by the tool t1, a weldment 704 may be formed.

According to one embodiment, before manufacturing the weldment 704, one of the outer surfaces of the first alloy 701 facing the second alloy 702 and the outer surface of the second alloy 702 facing the first alloy 701 In at least one, a pattern may be formed. For example, the pattern formed on at least one of the outer surface of the first alloy 701 and the outer surface of the second alloy 702 may be formed before the first alloy 701 and the second alloy 702 come into contact. there is.

According to one embodiment, the tool t1 may move in a straight line along the boundary 703 between the first alloy 701 and the second alloy 702 while rotating. By moving the tool t1 in a straight line, a trajectory p1 may be formed at the boundary 703 between the first alloy 701 and the second alloy 702. According to one embodiment, the formation direction of the trajectory p1 may be designated based on the rotation direction of the tool t1. The formation direction of the trajectory p1 may be substantially the same as the rotation direction of the tool t1. For example, when the tool t1 rotates clockwise in FIG. 7, the formation direction of the trajectory p1 may be clockwise. For another example, when the tool t1 rotates counterclockwise in FIG. 7, the formation direction of the trajectory p1 may be counterclockwise. When the tool (t1) rotates and moves in a straight line, a difference in friction force may occur between the part (703a) of the boundary (703) and the other part (703b) of the boundary (703) that face each other with respect to the tool (t1). there is. For example, when the rotation direction of the tool (t1) and the formation direction of the trace (p1) are different from each other, the pore (pore) is a boundary disposed inside the first alloy 701 with respect to the tool (t1). It may be formed in part 703a. If pores are disposed inside the first alloy 701, the strength of the housing 400 may be reduced. The method of manufacturing the housing 400 according to an embodiment can provide the housing 400 with improved strength because the rotation direction of the tool t1 and the formation direction of the trajectory p1 are substantially the same. For example, if the rotation direction of the tool t1 and the formation direction of the trajectory p1 are substantially the same, the tool t1 is formed at a portion 703a of the boundary 703 disposed inside the first alloy 701. The rotation direction of and the moving direction of the tool t1 may be opposite to each other. As the rotation direction of the tool t1 and the moving direction of the tool t1 are opposite to each other, sufficient frictional force is applied at a portion 703a of the boundary 703 disposed inside the first alloy 701, The formation of pores may be reduced.

According to one embodiment, in step 730, after the weldment 704 is fabricated, one or more openings 704a may be formed in the weldment 704. For example, opening 704a can be formed by weldment 704 penetrating. The process by which the opening 704a is formed may be referred to as a CNC process.

According to one embodiment, in step 740, a weldment 704 having one or more openings 704a formed therein may be placed in a designated solution to form a bond coating 705. The bonding film 705 may cover the outer surface of the weldment 704. The bonding film 705 can bond the alloys 701 and 702 and the injection molded product 706.

According to one embodiment, in step 750, a non-conductive material may be injected onto the weldment 704 on which the bond coating 705 has been formed. For example, molten resin may be injected into one or more openings 704a. The molten resin may be contained within one or more openings 704a and then cooled within the openings 704a to form the injection molded product 706. The injection molded product 706 may be in contact with the bonding film 705 disposed on the first alloy 701 or the second alloy 702.

According to one embodiment, in step 760, a portion of the weldment 704 to which the injection molded product 706 is joined may be cut. For example, a portion of the cut weldment 704 may be disposed outside the first alloy 701 based on the tool t1. According to one embodiment, an anodizing film may be formed on the cut weldment 704. For example, an anodizing film can be formed by contacting the outer surface of the weldment 704 with a solution for oxidizing the weldment 704. According to one embodiment, the weldment 704 may be polished prior to forming the anodizing film. As the weldment 704 is polished, the weldment 704 may have roughness. After the anodizing film is formed, manufacturing of the housing 400 can be completed.

As described above, the manufacturing method of the housing 400 according to one embodiment is to manufacture the housing 400 with increased durability by using the tool t1 whose rotation direction and the forming direction of the trajectory p1 are the same. You can.

An electronic device (e.g., the electronic device 200 of FIG. 2) according to an embodiment includes a housing (e.g., the housing 400 of FIG. 4a), and is disposed in the housing and has a side surface of the housing (e.g., the housing 400 of FIG. 4a). It may include an electronic component surrounded by a plurality of side surfaces 430). According to one embodiment, the housing includes a first alloy (e.g., the first alloy 440a in Figure 4a) and a second alloy distinct from the first alloy (e.g., the second alloy 440b in Figure 4a). a first region defining a portion of the side surface (e.g., first region 441 in FIG. 4A), and a second region comprising the first alloy and surrounded by the first region (e.g., FIG. It may include a conductive portion (eg, the conductive portion 440 of FIG. 4A) including the second region 442 of FIG. 4A. According to one embodiment, the housing may include a non-conductive portion (eg, non-conductive portion 450 in FIG. 4A) coupled to the conductive portion and defining another portion of the side surface. According to one embodiment, the housing may include an anodizing film (eg, anodizing film 460 in FIG. 4A) in contact with the outer surface of the first alloy and the outer surface of the second alloy. According to one embodiment, the side is a first side defined by a part of the first area (e.g., the first side 431 in FIG. 4A), and a second side defined by another part of the first area. A side (e.g., the second side 432 in FIG. 4A), and disposed between the first side and the second side, and a portion of the non-conductive portion (e.g., the non-conductive portion 450 in FIG. 5). It may include a third side (eg, third side 433 in FIG. 4A) defined by the portion 450a.

According to one embodiment, the first alloy may surround a portion of the second alloy. According to one embodiment, one side of the second alloy may be exposed to the outside of the housing.

According to one embodiment, the roughness of one side of the first alloy may be smaller than the roughness of one side of the second alloy.

According to one embodiment, the portion of the non-conductive portion may extend from the second region of the conductive portion and be exposed to the outside of the first region.

According to one embodiment, the conductive portion may include a receiving groove (eg, receiving groove 444 in FIG. 4A) into which the non-conductive portion is inserted.

According to one embodiment, the conductive portion may include an opening (eg, opening 443 in FIG. 4A) penetrating a front surface of the housing perpendicular to the side surface of the housing and a rear surface of the housing.

According to one embodiment, the first alloy may include at least one selected from aluminum, magnesium, silicon, recycled aluminum, recycled magnesium, and combinations thereof. According to one embodiment, the second alloy may include at least one selected from aluminum, zinc, recycled aluminum, recycled zinc, and combinations thereof.

According to one embodiment, the housing may further include a bonding film (eg, bonding film 470 in FIG. 5) disposed on an outer surface of the conductive portion facing the non-conductive portion.

According to one embodiment, the electronic component may include a display disposed on the front of the housing (eg, the front 410 in FIG. 4A) perpendicular to the side of the housing.

According to one embodiment, the electronic component may include a wireless communication circuit operatively coupled to at least one of the first side and the second side. According to one embodiment, the wireless communication circuit may be configured to communicate with an external electronic device in a designated frequency band through at least one of the first side and the second side.

A method for manufacturing a housing for an electronic device according to an embodiment includes a first alloy (e.g., the first alloy 701 in FIG. 7) and a second alloy (e.g., the first alloy 701 in FIG. 7) that is distinct from the first alloy. 2 The boundary (e.g., boundary 703 in FIG. 7) of the alloy 702 is rubbed using a rotating tool (e.g., tool (t1) in FIG. 7) to form the first alloy and the second alloy. This may include manufacturing a welded weldment (e.g., weldment 704 in FIG. 7). The method according to one embodiment may include cutting a portion of the weldment so that the first alloy and the second alloy are exposed on the side of the weldment. The method according to one embodiment may include forming an anodizing film (eg, an anodizing film in FIG. 7) on the cut weldment. According to one embodiment, the formation direction of the trajectory of the tool (eg, trajectory p1 in FIG. 7) may be substantially the same as the rotation direction of the tool when the weldment is viewed from above.

According to one embodiment, the part of the cut weldment may be disposed outside the first alloy based on the tool.

According to one embodiment, the method includes, after manufacturing the weldment, forming one or more openings (e.g., one or more openings 704a in FIG. 7) in the weldment, and forming the weldment with the one or more openings formed therein. It may further include forming a bonding film (e.g., bonding film 705 in FIG. 7) by immersing in a designated solution, and disposing a non-conductive material on the weldment on which the bonding film is formed.

According to one embodiment, the method, before manufacturing the weldment, forms a pattern on at least one of the outer surface of the first alloy facing the second alloy and the outer surface of the second alloy facing the first alloy. It may further include a step of forming.

According to one embodiment, the method may further include polishing the weldment before forming the anodizing film.

The housing according to one embodiment includes a first alloy (e.g., first alloy 440a in FIG. 4A) and a second alloy distinct from the first alloy (e.g., second alloy 440b in FIG. 4A). a first region (e.g., first region 441 in FIG. 4A) defining a portion of the side surface, and a second region (e.g., first region 441 in FIG. 4A) that includes the first alloy and is surrounded by the first region. It may include a conductive portion (eg, the conductive portion 440 in FIG. 4A) including the second region 442. According to one embodiment, the housing may include a non-conductive portion coupled to the conductive portion and defining another portion of the side surface. According to one embodiment, the housing may include a non-conductive portion (eg, non-conductive portion 450 in FIG. 4A) coupled to the conductive portion and defining another portion of the side surface. According to one embodiment, the housing may include an anodizing film (eg, anodizing film 460 in FIG. 4A) disposed on the first alloy and the second alloy. According to one embodiment, the side includes a first side including a part of the first area (e.g., the first side 431 in FIG. 4A), and a second side including another part of the first area ( For example, the second side 432 of FIG. 4A), and disposed between the first side and the second side, and a portion of the non-conductive portion (e.g., a portion of the non-conductive portion 450 of FIG. 5) It may include a third side (eg, third side 433 of FIG. 4A) including 450a)).

According to one embodiment, the first alloy may surround a portion of the second alloy. According to one embodiment, one side of the second alloy may be exposed to the outside of the conductive portion.

According to one embodiment, the roughness of one side of the second alloy may be greater than the roughness of one side of the first alloy.

According to one embodiment, the portion of the non-conductive portion may be exposed to the outside of the housing by penetrating the conductive portion.

According to one embodiment, the first alloy may include at least one of aluminum, magnesium, silicon, recycled aluminum, and recycled magnesium. According to one embodiment, the second alloy may include at least one of aluminum, zinc, recycled aluminum, and recycled zinc.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In electronic devices,
a housing comprising a plurality of sides; and
an electronic component disposed in the housing and surrounded by the plurality of sides; Including,
The housing is,
a first region defining some of the plurality of sides and comprising a first alloy and a second alloy distinct from the first alloy, and a second region comprising the first alloy and surrounded by the first region A conductive portion including;
a non-conductive portion coupled to the conductive portion and defining another portion of the plurality of sides; and
An anodizing film disposed on the first alloy and the second alloy; Including,
The plurality of aspects are:
a first side comprising a portion of the first region;
a second side comprising another portion of the first region; and
a third side disposed between the first side and the second side and including a portion of the non-conductive portion; Including,
Electronic devices.
According to paragraph 1,
The first alloy is,
Surrounding a portion of the second alloy,
One side of the second alloy is,
Exposed to the outside of the housing,
Electronic devices.
According to paragraph 1,
The roughness of one side of the second alloy is,
greater than the roughness of one side of the first alloy,
Electronic devices.
According to paragraph 1,
Said portion of said non-conductive portion is,
By penetrating the conductive portion, exposed to the outside of the housing,
Electronic devices.
According to paragraph 1,
The conductive part is,
a receiving groove accommodating the non-conductive portion; Including,
Electronic devices.
According to paragraph 1,
The conductive part is,
an opening penetrating the conductive portion; Including,
Electronic devices.
According to paragraph 1,
The first alloy is,
Contains at least one of aluminum, magnesium, silicon, recycled aluminum, and recycled magnesium,
The second alloy is,
Containing at least one of aluminum, zinc, recycled aluminum, and recycled zinc,
Electronic devices.
According to paragraph 1,
The housing is,
a bonding film interposed between the conductive portion and the non-conductive portion; Containing more,
Electronic devices.
According to paragraph 1,
The electronic components are,
a display disposed on a front surface of the housing perpendicular to the plurality of sides of the housing; Including,
Electronic devices.
According to paragraph 1,
The electronic components are,
a wireless communication circuit electrically connected to at least one of the first side and the second side; Including,
The wireless communication circuit is,
Configured to communicate with an external electronic device in a designated frequency band through at least one of the first side and the second side,
Electronic devices.
In a method for manufacturing a housing for an electronic device,
manufacturing a weldment in which the first alloy and the second alloy are welded by rubbing the boundary between the first alloy and the second alloy, which is distinct from the first alloy, using a rotating tool;
cutting a portion of the weldment so that the first alloy and the second alloy are exposed on the side of the weldment; and
Forming an anodizing film on the cut weldment; Including,
method.
According to clause 11,
The part of the cut weldment is,
disposed outside the first alloy based on the tool,
method.
According to clause 11,
After fabricating the weldment, forming one or more openings in the weldment;
Forming a bonding film by immersing the welded product with the one or more openings in a designated solution; and
Injecting a non-conductive material onto the weldment on which the bonding film is formed; Containing more,
method.
According to clause 11,
Before manufacturing the weldment, forming a pattern on at least one of an outer surface of the first alloy facing the second alloy and an outer surface of the second alloy facing the first alloy; Containing more,
method.
According to clause 11,
Further comprising polishing the weldment before forming the anodizing film,
method.
In housing,
a first region comprising a first alloy and a second alloy distinct from the first alloy and defining a portion of a plurality of sides of the housing, and a first region comprising the first alloy and surrounded by the first region. a conductive portion including two regions;
a non-conductive portion coupled to the conductive portion and defining another portion of the plurality of sides; and
An anodizing film disposed on the first alloy and the second alloy; Including,
The plurality of aspects are:
a first side comprising a portion of the first region;
a second side comprising another portion of the first area; and
a third side disposed between the first side and the second side and including a portion of the non-conductive portion; Including,
housing.
According to clause 16,
The first alloy is,
Surrounding a portion of the second alloy,
One side of the second alloy is,
Exposed to the outside of the conductive part,
housing.
According to clause 16,
The roughness of one side of the second alloy is,
greater than the roughness of one side of the first alloy,
housing.
According to clause 16,
Said portion of said non-conductive portion is,
By penetrating the conductive portion, exposed to the outside of the housing,
housing.
According to clause 16,
The first alloy is,
Contains at least one of aluminum, magnesium, silicon, recycled aluminum, and recycled magnesium,
The second alloy is,
Containing at least one of aluminum, zinc, recycled aluminum, and recycled zinc,
housing.

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