KR20230154728A - Fem including switch and electronic device including same - Google Patents

Abstract

An electronic device according to various embodiments includes a first power supply circuit, a second power supply circuit, a switch, a first radio frequency front end (FEM), a second FEM, a third FEM, and a fourth FEM, and a processor. And the processor transmits a signal using the first PA in the first FEM, which operates based on the first voltage provided from the first power supply circuit, based on the first voltage provided from the second power supply circuit. The third PA in the third FEM operates based on the second voltage, or the third PA through the second power supply circuit and the switch to transmit a signal using the fourth PA in the fourth FEM. And the fourth PA may be electrically connected. Various other embodiments may be possible.

Description

FEM including a switch and an electronic device including the same {FEM INCLUDING SWITCH AND ELECTRONIC DEVICE INCLUDING SAME}

Various embodiments of the present invention relate to a FEM including a switch and an electronic device including the same.

Electronic devices are required to support various frequency ranges. Electronic devices that support 5G may support evolved universal mobile telecommunications system terrestrial radio access (E-UTRA) new radio (NR) dual connectivity (EN-DC). The electronic device may include a plurality of power supply circuits that supply voltage to a power amplifier (PA) within a front end module (FEM) to support dual connectivity.

According to one embodiment, an electronic device may provide a structure of various connectable power supply circuits in operable frequency bands to increase the degree of freedom of the antenna and to simplify the number of power supply circuits and power supply circuits.

The technical problem to be achieved in this document is not limited to the above-described technical problem, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. .

According to one embodiment, the electronic device includes a plurality of power supply circuits including a processor, a first power supply circuit, and a second power supply circuit, and a plurality of front end modules (FEMs) electrically connected to the processor. It can be included. The FEMs are electrically connected to the first power supply circuit, a first FEM including a first power amplifier (PA) configured to transmit a first RF signal, and electrically connected to the second power supply circuit. , a second FEM comprising a second PA configured to transmit a second RF signal different from the first RF signal, a first RF signal configured to transmit a third RF signal different from the second RF signal 3 PAs and a switch configured to electrically connect the third PA with a power supply circuit selected from among the first power supply circuit and the second power supply circuit, and connecting the selected one power supply circuit to the second power supply circuit. A third FEM and a fourth signal, distinct from the first RF signal, the second RF signal, and the third RF signal, configured to electrically connect to another FEM through an electrical path extending from a node between the 3 PA and the switch. It may include a fourth PA that transmits an RF signal, and a fourth FEM electrically connected to the electrical path. The processor transmits a signal using the first PA, which operates based on the first voltage provided from the first power supply circuit, and transmits a signal based on the second voltage provided from the second power supply circuit. A first circuit electrically connecting the second power supply circuit and the third PA and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating in Can provide connection status. The processor transmits a signal using the second PA, which operates based on the second voltage provided from the second power supply circuit, to determine the first voltage provided from the first power supply circuit. A device that electrically connects the first power supply circuit and the third PA and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating based on 2 Connection status can be provided. The processor simultaneously transmits the first RF signal and a selected one of the third RF signal or the fourth RF signal in the first connection state, or transmits the third RF signal or the fourth RF signal in the second connection state. It may be configured to simultaneously transmit a selected one of the RF signals and the second RF signal.

According to one embodiment, a front end module (FEM) includes a power amplifier (PA) configured to set the transmission power of a signal, and a power amplifier external to the FEM configured to provide a first voltage for operating the PA within an operating range. A first terminal electrically connected to a first power supply circuit, a second terminal electrically connected to a second power supply circuit external to the FEM configured to provide a second voltage for operating the PA within an operating range, a third terminal electrically connected to a PA in another FEM outside the FEM, and a first electrical connection between the first terminal and the PA in the FEM or a second electrical connection between the second terminal and the PA in the FEM. It may include a switch configured to provide connectivity. According to one embodiment, the third terminal is configured to provide the first voltage to the PA in the other FEM while the first voltage is provided to the PA in the FEM through the first electrical connection from the first power supply circuit. It may be configured to provide 1 voltage. According to one embodiment, the third terminal is connected to the PA in the other FEM while the second voltage is provided to the PA in the FEM through the second electrical connection from the second power supply circuit. It can be configured to provide 2 voltages.

The electronic device according to one embodiment can miniaturize components within the electronic device and reduce the number of components within the electronic device by improving the connection structure of the power supply circuit that provides the voltage supplied to the PAs.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to one embodiment.
Figure 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication, according to one embodiment.
FIG. 3 is a diagram illustrating a wireless communication system providing a network of legacy communication and/or 5G communication according to an embodiment.
Figure 4 is a simplified block diagram of an electronic device according to one embodiment.
Figure 5 shows an example of the structure of an FEM in an electronic device according to an embodiment.
6 shows an example of the structure of another FEM in an electronic device according to one embodiment.
7 and 8 show examples of the connection relationship between the PA of one FEM and the terminals of one FEM in an electronic device according to an embodiment.
FIG. 9 shows an example of the arrangement of antenna modules electrically connected to FEMs in an electronic device according to an embodiment.

Terms used in the present disclosure are merely used to describe specific embodiments and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions, unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by a person of ordinary skill in the technical field described in this disclosure. Among the terms used in this disclosure, terms defined in general dictionaries may be interpreted to have the same or similar meaning as the meaning they have in the context of related technology, and unless clearly defined in this disclosure, have an ideal or excessively formal meaning. It is not interpreted as In some cases, even terms defined in the present disclosure cannot be interpreted to exclude embodiments of the present disclosure.

In an embodiment of the present disclosure described below, a hardware approach method is explained as an example. However, since an embodiment of the present disclosure includes technology using both hardware and software, an embodiment of the present disclosure does not exclude a software-based approach.

Terms related to multiple connectivity used in the following description (e.g., dual connectivity (DC), multi-RAT (radio technology)-DC, cell group, master cell group) , MCG), secondary cell group (SCG)), terms referring to signals (e.g. reference signals, system information, control signals, messages, data), terms referring to network entities (e.g. : communication node, radio node, radio unit, network node, master node (MN), secondary node (SN), transmission and reception point ( Transmission/reception point (TRP), digital unit (DU), radio unit (RU), Massive MIMO unit (MMU), etc. are shown as examples for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meaning may be used.

In addition, in the present disclosure, the expressions greater than or less than may be used to determine whether a specific condition is satisfied or fulfilled, but this is only a description for expressing an example, and the description of more or less may be used. It's not exclusion. Conditions written as ‘more than’ can be replaced with ‘more than’, conditions written as ‘less than’ can be replaced with ‘less than’, and conditions written as ‘more than and less than’ can be replaced with ‘greater than and less than’.

Terms used in the present disclosure are merely used to describe specific embodiments and may not be intended to limit the scope of other embodiments. Singular expressions may include plural expressions, unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by a person of ordinary skill in the technical field described in this disclosure. Among the terms used in this disclosure, terms defined in general dictionaries may be interpreted to have the same or similar meaning as the meaning they have in the context of related technology, and unless clearly defined in this disclosure, have an ideal or excessively formal meaning. It is not interpreted as In some cases, even terms defined in the present disclosure cannot be interpreted to exclude embodiments of the present disclosure.

In an embodiment of the present disclosure described below, a hardware approach method is explained as an example. However, since an embodiment of the present disclosure includes technology using both hardware and software, an embodiment of the present disclosure does not exclude a software-based approach.

Terms related to multiple connectivity used in the following description (e.g., dual connectivity (DC), multi-RAT (radio technology)-DC, cell group, master cell group) , MCG), secondary cell group (SCG)), terms referring to signals (e.g. reference signals, system information, control signals, messages, data), terms referring to network entities (e.g. : communication node, radio node, radio unit, network node, master node (MN), secondary node (SN), transmission and reception point ( Transmission/reception point (TRP), digital unit (DU), radio unit (RU), Massive MIMO unit (MMU), etc. are shown as examples for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meaning may be used.

In addition, in the present disclosure, the expressions greater than or less than may be used to determine whether a specific condition is satisfied or fulfilled, but this is only a description for expressing an example, and the description of more or less may be used. It's not exclusion. Conditions written as ‘more than’ can be replaced with ‘more than’, conditions written as ‘less than’ can be replaced with ‘less than’, and conditions written as ‘more than and less than’ can be replaced with ‘greater than and less than’.

1 is a block diagram of an electronic device in a network environment, according to one embodiment.

Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 to communicate within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology can provide high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access to multiple terminals (massive machine type communications (mMTC)), or ultra-reliable and low-latency (URLLC). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band), for example, to achieve a high data transmission rate. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for the communication method used in the communication network, such as the first network 198 or the second network 199, is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to one embodiment.

Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC. (226), fourth RFIC (228), first radio frequency front end (RFFE) 232, second RFFE (234), first antenna module 242, second antenna module 244, and antenna 248 ) may include. The electronic device 101 may further include a processor 120 and a memory 130. The second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the second network 199 may further include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and second RFFE 234 may form at least a portion of wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

The first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first cellular network 292, and legacy network communication through the established communication channel. According to one embodiment, the first cellular network 292 may be a legacy network including second generation (2G), third generation (3G), fourth generation (4G), and/or long term evolution (LTE) networks. . The second communication processor 214 establishes a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network 294, and establishes a 5G network through the established communication channel. Can support communication. According to one embodiment, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network 294. It can support the establishment of a communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to one embodiment, the first communication processor 212 or the second communication processor 214 is formed in a single chip or a single package with the processor 120, the auxiliary processor 123 of FIG. 1, or the communication module 190. It can be.

When transmitting, the first RFIC 222 converts the baseband signal generated by the first communications processor 212 to a frequency range from about 700 MHz to about 700 MHz used in the first cellular network 292 (e.g., a legacy network). It can be converted to a radio frequency (RF) signal of 3GHz. Upon reception, an RF signal is obtained from a first cellular network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242) and an RFFE (e.g., first RFFE 232). It can be preprocessed through. The first RFIC 222 may convert the pre-processed RF signal into a baseband signal to be processed by the first communication processor 212.

When transmitting, the second RFIC 224 uses the first communications processor 212 or the baseband signal generated by the second communications processor 214 to a second cellular network 294 (e.g., a 5G network). It can be converted to an RF signal (hereinafter referred to as a 5G Sub6 RF signal) in the Sub6 band (e.g., approximately 6 GHz or less) or NR's frequency band 1 (frequency range 1, FR1) (e.g., 410 MHz (megahertz) to 7125 MHz). there is. Upon reception, the 5G Sub6 RF signal is obtained from the second cellular network 294 (e.g., 5G network) via an antenna (e.g., second antenna module 244) and RFFE (e.g., second RFFE 234) ) can be preprocessed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 converts the baseband signal generated by the second communications processor 214 into a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (e.g., a 5G network) or It can be converted to an RF signal (hereinafter referred to as 5G Above6 RF signal) in NR's frequency range 2 (FR2) (e.g., 24250 MHz to 52600 MHz). Upon reception, the 5G Above6 RF signal may be obtained from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and preprocessed via a third RFFE 236. For example, the third RFFE 236 may perform preprocessing of the signal using the phase converter 238. The third RFIC 226 may convert the pre-processed 5G Above 6 RF signal into a baseband signal to be processed by the second communication processor 214. According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

According to one embodiment, the electronic device 101 may include a fourth RFIC 228 separately from the third RFIC 226 or at least as a part thereof. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an intermediate frequency (IF)) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz). ) signal, the IF signal can be transmitted to the third RFIC (226). The third RFIC 226 can convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second cellular network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by a third RFIC 226. there is. The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to one embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least part of a single chip or a single package. According to one embodiment, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in some area (e.g., bottom surface) of the second substrate (e.g., sub PCB) separate from the first substrate, and the antenna 248 is located in another part (e.g., top surface). is disposed, so that the third antenna module 246 can be formed. According to one embodiment, antenna 248 may include an antenna array that may be used for beamforming, for example. By placing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce the loss (e.g. attenuation) of signals in the high frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communication by the transmission line. Because of this, the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).

The second cellular network 294 (e.g., 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to the first cellular network 292 (e.g., legacy network) ( Example: Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device 101 may access the access network of the 5G network and then access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in the memory 230 and stored in the memory 230, 120, first communication processor 212, or second communication processor 214).

FIG. 3 is a diagram illustrating a wireless communication system providing a network of legacy communication and/or 5G communication according to embodiments. FIG. 3 illustrates a first base station 310, a second base station 330, and an electronic device 101 as some of the nodes that use a wireless channel in a wireless communication system.

Referring to FIG. 3, each of the first base station 310 and the second base station 330 may be a network infrastructure that provides wireless access to the electronic device 101. Each of the first base station 310 and the second base station 330 may have a coverage, which is a geographic area defined based on the distance at which signals can be transmitted. 'Coverage', described below, may refer to an area in which the services of a base station can be used (service coverage area). Each base station may cover one cell or multiple cells. Here, multiple cells can be divided by the frequency supported by the base station or the area of the sector covered by the base station.

In addition to the base station, the first base station 310 includes 'access point (AP)', 'eNodeB (eNB)', 'wireless point', and 'transmission/reception point'. It may be referred to as ‘point, TRP)’, ‘distributed unit (DU)’, ‘radio unit (RU)’, remote radio head (RRH) or other terms with equivalent technical meaning. there is. According to one embodiment, the first base station 310 is a radio access technology (RAT) and may provide a first communication technique (eg, LTE). According to one embodiment, the first base station 310 may operate as an eNB to support an evolved universal terrestrial radio access (E-UTRA) carrier in EN-DC. In one example, the electronic device 101 may transmit and receive wireless signals with the first base station 310 within a frequency band of about 800 MHz to about 2.6 GHz.

In addition to the base station, the second base station 330 includes '5G node (5th generation node)', '5G NodeB (NB)', 'gNB (next generation node B)', and 'wireless point (wireless point). point)', 'transmission/reception point (TRP)', central unit (CU)', 'distributed unit (DU)', 'radio unit (RU), remote radio It may be referred to as equipment (remote radio head, RRH) or other terms with equivalent technical meaning. According to one embodiment, the second base station 330 may be connected to one or more 'transmission/reception points (TRP)'. The second base station 330 may transmit a downlink signal to the electronic device 101 or receive an uplink signal from the electronic device 101 through one or more TRPs. According to one embodiment, the second base station 330 is a radio access technology (RAT) and may provide a second communication technique (eg, NR). According to one embodiment, the second base station 330 may operate as a gNB to support the NR carrier in EN-DC. In one example, the electronic device 101 is configured to operate in a first frequency range (e.g., FR1 of NR: about 410 megahertz (MHz) to about 7125 MHz)) or a second frequency range (e.g., FR1 of NR). FR2: It is possible to transmit and receive wireless signals in the frequency band (about 24250 MHz to about 52600 MHz, or about 24250 MHz to about 100000 MHz).

Although not shown in FIG. 3, in a 5G system, a base station may be implemented in a distributed deployment to support network function virtualization or more efficient resource management and scheduling. For example, in a 5G system, a base station (gNB) may be further divided into a central unit (CU) and a distributed unit (DU). For example, a CU may have at least radio resource control (RRC) and packet data convergence protocol (PDCP) protocol layers. According to one embodiment, the CU may further include SDAP (service data adaptation protocol). For example, a DU may have radio link control (RLC), medium access control (MAC), and physical layers. For example, the F1 interface, a standardized public interface, may exist between the CU and DU. The F1 interface can be divided into control plane F1-C and user plane F1-U. The transmission network layer of F1-C may be based on IP transmission. For more reliable signaling, the stream control transmission protocol (SCTP) protocol can be added on top of the internet protocol (IP). The application layer protocol may be F1AP. SCTP can provide reliable application layer messaging. The transmission layer of F1-U may be UDP (user datagram packet)/IP. General packet radio service (GPRS) tunneling protocol (GTP)-U can be used over UDP/IP to carry user plane protocol data unit PDUs.

The electronic device 101 is a device used by a user and can communicate with the first base station 310 and/or the second base station 330 through a wireless channel. In some cases, the electronic device 101 may operate without user involvement. That is, at least one of the electronic devices 101 is a device that performs machine type communication (MTC) and may not be carried by the user. In addition to terminals, the electronic device 101 includes 'user equipment (UE)', 'mobile station', 'subscriber station', and 'customer premises equipment (CPE). ), ‘remote terminal’, ‘wireless terminal’, ‘electronic device’, or ‘vehicle terminal’, ‘user device’ or equivalent It may be referred to by other terms that have technical meanings.

According to one embodiment, the electronic device 101 may be connected to the first base station 310 and the second base station 330 through dual connectivity (DC) 350. One base station (a) among the first base station 310 and the second base station 330 operates as a master node (MN), and the other base station among the first base station 310 and the second base station 330 operates as a secondary node (SN). node). The MN and SN can be connected through a network interface (e.g., X2 interface, XN interface).

Although not shown in FIG. 3, the first base station 310 or the second base station 330 may be connected to an evolved packet core (EPC) network, which is the core of the 4G network. When the first base station 310 provides a primary cell group and the second base station 330 provides a secondary cell group, the connection between the two base stations is EN-DC (evolved). It may be referred to as universal terrestrial radio access-new radio dual-connectivity. Through EN-DC, the terminal can access an LTE cell using LTE technology and an NR cell using NR technology. Hereinafter, cells using LTE technology are referred to as LTE cells, E-UTRA cells, or 4G cells, and the frequencies of cells using LTE technology may be referred to as E-UTRA carriers, LTE carriers, or 4G carriers. . Hereinafter, a cell using NR technology may be referred to as an NR cell or 5G cell, and the frequency of a cell using NR technology may be referred to as an NR carrier or 5G carrier.

Hereinafter, EN-DC is described as an example as a technology for providing both an LTE carrier and an NR carrier in various embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. The same principle of the embodiments described later can be applied to other types of DC (e.g., NE-DC (new radio-Evolved universal terrestrial radio access dual-connectivity), NGEN-DC (NG-RAN (next generation-radio access network) evolved universal terrestrial) It can also be applied to radio access-new radio dual-connectivity)).

Figure 4 is a simplified block diagram of an electronic device according to one embodiment. Figure 5 shows an example of the structure of an FEM in an electronic device according to an embodiment. 6 shows an example of the structure of another FEM in an electronic device according to one embodiment. 7 and 8 show examples of the connection relationship between the PA of one FEM and the terminals of one FEM in an electronic device according to an embodiment.

4, 5, 6, 7, and 8, the electronic device 101 includes a processor 400, a first power supply circuit 401, a second power supply circuit 402, and a first power supply circuit 402. It may include a FEM 410, a second FEM 420, a third FEM 430, a fourth FEM 440, a fifth FEM 450, and/or a sixth FEM 460.

In one embodiment, the processor 400 may include the processor 120 shown in FIG. 1 . In one embodiment, the processor 400 includes the processor 120, the first communication processor 212, the second communication processor 214, the first RFIC 222, and the second RFIC shown in FIG. 2. It may include at least one of (224), the third RFIC (226), or the fourth RFIC (228).

The FEMs 410, 420, 430, 440, 450, and 460 in the electronic device 101 include antennas A1 and A2 connected to each of the FEMs 410, 420, 430, 440, 450, and 460. , A3, A4, A5, and A6). Each of the FEMs 410, 420, 430, 440, 450, and 460 may be connected to one of the antennas A1, A2, A3, A4, A5, and A6. According to one embodiment, some of the antennas A1, A2, A3, A4, A5, and A6 may be connected to one or more FEMs. For example, each of the FEMs 410, 420, 430, 440, 450, and 460 is configured to process the signal transmitted through one of the antennas A1, A2, A3, A4, A5, and A6. At least one filter (e.g., first filter 521, second filter 531, or third filter 541), at least one power amplifier (PA) (e.g., first PA 411, second PA 421, third PA 431, fourth PA 441, fifth PA 451 and/or sixth PA 461), switch (e.g. switch 550 and/or It may include a switch 580) or a duplexer (eg, a first duplexer 520, a second duplexer 530, or a third duplexer 540). Each of the FEMs 410, 420, 430, 440, 450, and 460 can process signals having different frequencies. For example, the first signal of the first signal processed by the first FEM 410 and transmitted through the antenna A (e.g., at least one of the antennas A1, A2, A3, A4, A5, and A6) The frequency band may be processed by the second FEM 420 and spaced apart from the second frequency band of the second signal transmitted through the antenna. The first frequency band of the first signal processed by the first FEM 410 and transmitted through the antenna is a portion of the third frequency band of the third signal processed by the third FEM 430 and transmitted through the antenna. May overlap. However, it is not limited to this. The voltage for the operating range of the PAs 411, 421, 431, 441, 451, and 461 may be set by the processor 400. According to one embodiment, the voltage may be set by at least one radio frequency integrated circuit (RFIC) (not shown) connected to the processor 400 and each FEM. Meanwhile, FEM may be referred to as an RF chain (radio frequency chain) or an RF path.

Antenna A (eg, at least one of antennas A1, A2, A3, A4, A5, and A6) may include at least a portion of the antenna module shown in FIG. 1. For example, the antenna A may include at least one array antenna each including a plurality of antennas. According to one embodiment, the antenna A may include an antenna that uses a conductive portion disposed along at least a portion of the side surface of the housing of the electronic device 101. According to one embodiment, the antenna A may include a plurality of antennas, and the plurality of antennas may correspond to each FEM. However, it is not limited to this, and the number of antennas and the number of FEMs may be different. For example, the third FEM 430 and the fourth FEM 440 may be connected to one antenna, and one antenna connected to the third FEM 430 and the fourth FEM 440 may be connected to the third FEM 430. ) and may be a shared antenna for the fourth FEM (440). The fifth FEM (450) and the sixth FEM (460) may be connected to another antenna, and the other antenna connected to the fifth FEM (450) and the sixth FEM (460) may be connected to the fifth FEM (450). And it may be a shared antenna for the sixth FEM (460). According to one embodiment, it is described that six FEMs are arranged, but the present invention is not limited thereto and may include fewer than six FEMs or more than six FEMs. For example, the plurality of FEMs may include a first FEM 410, a second FEM 420, a third FEM 430, and/or a fourth FEM 440. The FEMs may be configured to transmit different RF signals to the outside. For example, the first FEM 410 may include a first PA 411 configured to transmit a first RF signal at a first frequency. The second FEM 420 may include a second PA 421 configured to transmit a second RF signal of a second frequency that is distinct from the first RF signal. The third FEM 430 may include a third PA 431 configured to transmit a third RF signal of a third frequency that is distinct from the first RF signal and the second RF signal. The fourth FEM 440 may include a fourth PA 441 configured to transmit a fourth RF signal of a fourth frequency that is distinct from the first RF signal, the second RF signal, and the third RF signal. You can. The fifth FEM 450 is a fifth PA configured to transmit a fifth RF signal of a fifth frequency that is distinct from the first RF signal, the second RF signal, the third RF signal, and the fourth RF signal. It may include (451). The sixth FEM 460 transmits a sixth RF signal of a sixth frequency that is distinct from the first RF signal, the second RF signal, the third RF signal, the fourth RF signal, and the fifth RF signal. It may include a sixth PA (461) configured to do so.

At least one power supply circuit (e.g., the first power supply circuit 401 or the second power supply circuit 402) is used to control the processor 400 and/or a radio frequency integrated circuit (RFIC) (not shown). Based on this, the voltage can be variably supplied to PAs. According to one embodiment, the voltage for the dynamic range of the PAs 411, 421, 431, 441, 451, and 461 may be set by the processor 400. The voltage may be set by a radio frequency integrated circuit (RFIC) (not shown) connected to the processor 400 and each of the FEMs 410, 420, 430, 440, 450, and 460. For example, the RFIC may set the voltage through at least one power supply circuit (401, 402) based on envelope tracking (ET). However, it is not limited to this. At least one power supply circuit 401, 402, based on the control of the processor 400 and/or the RFIC, variably adjusts the voltage to the PAs 411, 421, 431, 441, 451, 461. can be supplied to. For example, at least one of the power supply circuits 401, 402 may be used to set the voltage based on ET. According to one embodiment, at least one power supply circuits 401 and 402 may be used to set the voltage based on average power tracking (APT). The at least one power supply circuits 401 and 402 may be referred to as a modulator, ET modulator, supply modulator, power supply, or voltage supply circuit.

According to one embodiment, at least one power supply circuit may include a first power supply circuit 401 and/or a second power supply circuit 402. For example, each of the PAs 431, 441, 451, and 461 included in some of the FEMs 430, 440, 450, and 460 is connected to the first power supply circuit 401 or the second power supply circuit 401. The voltage may be supplied from the power supply circuit 402. For example, the first PA 411 included in the first FEM 410 among the FEMs may receive the first voltage Vcc1 from the first power supply circuit 401. For example, the second PA 421 included in the second FEM 420 among the FEMs may receive the second voltage Vcc2 from the second power supply circuit 402. For example, the first power supply circuit 401 includes a first FEM (410), a third FEM (430), a fourth FEM (440), a fifth FEM (450), and a sixth FEM (460), respectively. It may be configured to supply the first voltage (Vcc1) to the PAs (411, 431, 441, 451, and 461) included in . For example, the second power supply circuit 402 includes a second FEM (420), a third FEM (430), a fourth FEM (440), a fifth FEM (450), and a sixth FEM (460), respectively. It may be configured to supply the second voltage (Vcc2) to the PAs 421, 431, 441, 451, and 461 included in . The first PA 411 of the first FEM 410 may receive the first voltage Vcc1 through the first power supply circuit 401. The second PA 421 of the second FEM 420 may receive the second voltage Vcc2 through the second power supply circuit 402. Each of the PAs 431, 441, 451, and 461 of the third FEM 430, fourth FEM 440, fifth FEM 450, and sixth FEM 460 is connected to the first power supply circuit 401. Alternatively, the first voltage (Vcc1) or the second voltage (Vcc2) may be supplied through the second power supply circuit 402.

The processor 400 according to an embodiment includes the PAs 411, 431, and One PA (e.g., the first PA (411)) among 441, 451, and 461 is operated, and one of the FEMs (410, 430, 440, 450, and 460) is supplied with the first voltage (Vcc1). FEMs 420 and 430 that are different from the PA (e.g., first PA (411)) in the FEM (e.g., first FEM (410)) and are supplied with a second voltage (Vcc2) from the second power supply circuit 402. , 440, 450, 460) may be configured to operate the PA in one FEM.

According to one embodiment, a switch is used to supply the first voltage (Vcc1) supplied from the first power supply circuit 401 and the second voltage (Vcc2) supplied from the second power supply circuit 402 to a designated FEM. 490 may be operatively coupled to processor 400 . The switch 490 includes the third FEM 430, fourth FEM 440, fifth FEM 450, and sixth FEM 460 and the first power supply circuit 401 or the second power supply circuit 402. ) can be optionally connected. The first power supply circuit 401 is always electrically connected to the first FEM 410, and the third FEM 430, fourth FEM 440, fifth FEM 450, and It can be selectively connected to the sixth FEM (460). The second power supply circuit 402 is always electrically connected to the second FEM 420, and is connected to the third FEM 430, fourth FEM 440, fifth FEM 450, and the third FEM 430 through the switch 490. and may be selectively connected to the sixth FEM (460).

According to one embodiment, the processor 400, through the switch 490, determines a first connection state between the power supply circuits 401 and 402 and the PAs 411, 421, 431, 441, 451 and 461 and It may be configured to provide a second connection state. The first connection state is based on transmitting a signal using the first PA 411 operating based on the first voltage Vcc1 provided from the first power supply circuit 401, and the second power supply A signal is transmitted using the third PA (431), fourth PA (441), fifth PA (451), or sixth PA (461) operating based on the second voltage (Vcc2) provided from the circuit 402. In order to transmit, the second power supply circuit 402, the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) are electrically connected through the switch 490. It may be in a connected state. The second connection state is based on transmitting a signal using the second PA 421 operating based on the second voltage Vcc2 provided from the second power supply circuit 402, and the first power supply circuit 402 Transmitting a signal using the third PA (431), fourth PA (441), fifth PA (451), or sixth PA (461) operating based on the first voltage (Vcc1) provided from (401) To do this, the first power supply circuit 401 and the third PA (431), fourth PA (441), fifth PA (451) and sixth PA (461) are electrically connected through the switch 490. It may be in a state of being

The processor 400 may be configured to simultaneously transmit a first RF signal and a selected one of the third to sixth RF signals in the first connection state. The processor 400 may be configured to simultaneously transmit a selected one of the third to sixth RF signals and the second RF signal in the second connection state.

According to one embodiment, the processor 400 provides voltage to one PA through the first power supply circuit 401, while providing voltage to other PAs other than the PA through the second power supply circuit 402. voltage can be provided.

According to one embodiment, the processor 400 transmits a signal to an external electronic device using the first PA 411, the second PA 421, the third PA 431, and the fourth PA 441. , a signal can be transmitted to another external electronic device that is different from the external electronic device using one of the fifth PA 451 or the sixth PA 461. However, it is not limited to this, and the processor 400 transmits a signal to an external electronic device using the first PA 411, the second PA 421, the third PA 431, and the fourth PA 441. , a signal can be transmitted to another external electronic device that is different from the external electronic device by using a plurality of PAs among the fifth PA 451 or the sixth PA 461. For example, the processor 400 uses the first PA 411 that operates based on the first voltage (Vcc1) provided from the first power supply circuit 401 while transmitting a signal through the antenna. , the second voltage (Vcc2) provided from the second power supply circuit 402 through the switch 490 is applied to the third PA (431), fourth PA (441), fifth PA (451) and/or Can be supplied in 6 PA (461). For example, while transmitting a signal to the outside through the antenna A1 using the first PA 411, the processor 400 switches the switch 490 to the first power supply circuit 401 and the third PA ( 431), refrain from being electrically connected to the fourth PA (441), fifth PA (451) and sixth PA (461), and switch 490 is connected to the second power supply circuit 402 and the third PA ( 431), the fourth PA (441), the fifth PA (451), and the sixth PA (461). For example, the processor 400 includes the third PA 431, fourth PA 441, fifth PA 451, and It is possible to communicate with an external electronic device through an antenna (A3, A4, A5, or A6) connected to one of the 6 PAs (461).

According to one embodiment, the processor 400 is selected from among the third PA (431), fourth PA (441), fifth PA (451), and sixth PA (461) supplied with the second voltage (Vcc2). You can disable all but one PA that communicates with an external electronic device. For example, the processor 400 identifies one PA that communicates with an external electronic device among the third PA (431), fourth PA (441), fifth PA (451), and sixth PA (461). can do. The processor 400 requests deactivation of the fourth PA 441, the fifth PA 451, and the sixth PA 461 based on identifying the one PA as the third PA 431. Signals can be transmitted.

According to one embodiment, based on the above-described operations, the processor 400 uses the first PA 411 that operates based on the first voltage Vcc1 provided from the first power supply circuit 401. Based on transmitting the signal, the third PA 431, fourth PA 441, and fifth PA (operating based on the second voltage Vcc2 provided from the second power supply circuit 402) 451) or the sixth PA (461), the third PA (431), the fourth PA (441) through the second power supply circuit 402 and the switch 490 to transmit a signal using one of the PAs (451) or the sixth PA (461). ), the fifth PA (451) and the sixth PA (461) can be electrically connected. For another example, the processor 400 transmits a signal using the second PA 421, which operates based on the voltage provided from the second power supply circuit 402, to Using one of the third PA (431), fourth PA (441), fifth PA (451), or sixth PA (461) that operates based on the first voltage provided from the power supply circuit 401 In order to transmit a signal, the third PA (431), fourth PA (441), fifth PA (451) or sixth PA ( 461) may be configured to electrically connect.

According to one embodiment, the processor 400, while a signal is transmitted to the first external electronic device (e.g., the first base station 310 of FIG. 3) using the first PA 411, the first PA 411 It may be configured to receive a control message from an external electronic device. The control message may be an RRC message. The control message may include information related to a second external electronic device (eg, the second base station 330 of FIG. 3) requesting additional connection with the electronic device 101 and/or a frequency band for connection.

According to one embodiment, the processor 400 configures the PA for the signal to be transmitted while the signal is transmitted using the first PA 411, based on the control message, to the second PA 421, It may be configured to identify among the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461). Based on the information in the control message, the processor 400 identifies the frequency band of the signal to be transmitted while the signal is transmitted using the first PA 411, and based on the frequency band, the signal to be transmitted FEM, PA, and/or antenna for can be identified.

According to one embodiment, the processor 400 identifies the identified PA as the third PA (431), the fourth PA (441), the fifth PA (451), or the sixth PA (461). Under the conditions, the second power supply circuit 402, the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA ( 461) may be configured to electrically connect. For example, when the identified PA is the third PA 431, the processor 400 connects the second power supply circuit 402, the third PA 431, and the third PA 431 through the switch 490. It may be configured to electrically connect the 4th PA (441), the 5th PA (451), and the 6th PA (461). The switch 490 includes the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461), and the first power supply circuit 401 or the second power supply circuit (402). ) can be configured to electrically connect. When the first power supply circuit 401 is electrically connected to the third PA (431), fourth PA (441), fifth PA (451), and sixth PA (461), the second power supply circuit (402) may be electrically disconnected from the third PA (431), fourth PA (441), fifth PA (451), and sixth PA (461).

According to one embodiment, the signal transmitted using the first PA 411 is transmitted using a first communication technique (e.g., LTE) to the first external electronic device (e.g., the first base station 310 of FIG. 3). ) can be transmitted according to. The signal transmitted using the identified PA among the second PA (421), the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461). The first communication technique and It may be transmitted according to another secondary communication technique (eg, NR). For example, based on the control message, the processor 400 identifies that the third PA 431 is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique. Based on this, the third PA (431), the fourth PA (441), the fifth PA (451), and/or the sixth PA (451) through the second power supply circuit 402 and the switch 490. It may be configured to electrically connect the PA (461). The processor 400 identifies, based on the control message, that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the fourth PA 441. , the third PA (431), the fourth PA (441), the fifth PA (451), and/or the sixth PA ( 461) may be configured to electrically connect. As another example, the processor 400 identifies, based on the control message, that the PA for the signal to be transmitted to the external electronic device according to the second communication technique is the second PA 421. Based on this, the third PA (431), fourth PA (441), fifth PA (451) and sixth PA (461) are electrically connected through the second power supply circuit 402 and the switch 490. It can be configured to refrain from making a connection.

According to one embodiment, the processor 400 receives a control message from the first external electronic device while a signal is transmitted to the first external electronic device using the second PA 421, and Based on the control message, while the signal is transmitted using the second PA 421, the PA for the signal to be transmitted is changed to the first PA 411, the third PA 431, and the fourth PA ( 441), the fifth PA (451) and the sixth PA (461), and the identified PA is the third PA (431), the fourth PA (441), and the fifth PA (451). Or, under the condition of being identified as the sixth PA (461), the first power supply circuit 401, the third PA (431), the fourth PA (441), and the fifth PA (451) are connected through the switch. ) and may be configured to electrically connect the sixth PA (461). The signal transmitted using the second PA 421 may be transmitted to the first external electronic device according to a first communication technique. The first PA (411), the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) are transmitted using the identified PA. A signal may be transmitted to a second external electronic device that is different from the first external electronic device according to a second communication technique that is different from the first communication technique.

According to one embodiment, the processor 400 identifies, based on the control message, that the third PA 431 is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique. Based on this, the third PA (431), the fourth PA (441), the fifth PA (451) and the sixth PA ( 461) can be electrically connected. The processor 400, based on the control message, identifies that the PA for the signal to be transmitted to the external electronic device according to the second communication technique is the fourth PA 441, 1 Electrically connect the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) through the power supply circuit 401 and the switch 490. You can. Based on the control message, the processor 400 identifies that the fifth PA 451 is the PA for the signal to be transmitted to the first external electronic device according to the second communication technique. 1 Electrically connect the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) through the power supply circuit 401 and the switch 490. You can. Based on the control message, the processor 400 identifies that the sixth PA 461 is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique. 1 Electrically connect the third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) through the power supply circuit 401 and the switch 490. You can. The processor 400, based on the control message, identifies that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the first PA 411, The third PA (431), the fourth PA (441), the fifth PA (451), and the sixth PA (461) are electrically connected through the first power supply circuit 401 and the switch 490. It can be configured to refrain from connecting to .

According to one embodiment, the processor 400 provides voltage to the first PA 411 through the first power supply circuit 401 and sends a signal to an external electronic device through the first PA 411. During transmission, based on identifying that the PA identified based on the control message is the third PA 431, the second PA 421, the fourth PA 441, the fifth PA 451, and the sixth PA It can be controlled to refrain from the operation of (461). According to one embodiment, the processor 400 provides a second voltage to the second PA 421 through the second power supply circuit 401 and to an external electronic device through the second PA 421. While transmitting a signal, based on identifying that the PA identified based on the control message is the third PA 431, the first PA 411, the fourth PA 441, the fifth PA 451, and the third PA 431 6 It can be controlled to refrain from operating the PA (461).

According to the above-described embodiment, components that must receive power from the first power supply circuit 401 and the second power supply circuit 402 (e.g., the third FEM 430, the fourth FEM 440, the Instead of including a power switch on each of the fifth FEM 450, and/or sixth FEM 460), the third FEM 430, fourth FEM 440, fifth FEM 450, and/or 6 A switch 490 may be placed outside the FEM 460. The switch 490 disposed outside the third FEM 430, fourth FEM 440, fifth FEM 450, and/or sixth FEM 460 is connected to the first power supply circuit 401 and the first power supply circuit 401. The 3 FEM (430), the 4th FEM (440), the 5th FEM (450), or the 6th FEM (460) are electrically connected, or the second power supply circuit 402, the 3rd FEM (430), the 4th The FEM 440, the fifth FEM 450, and/or the sixth FEM 460 may be electrically connected. As described above, the switch 490 is connected to the third FEM 430, fourth FEM 440, fifth FEM 450, and/or sixth FEM 460, and the first power supply circuit 401 or the first power supply circuit 401. 2 Through the electrical connection of the power supply circuit 402, the antenna freedom to support various frequency bands can be secured.

Referring to FIGS. 5 and 6, the FEM 500 in FIG. 5 may be an FEM for an antenna that supports multiple bands. The FEM 600 in FIG. 6 may be an FEM for an antenna that supports a single band. The FEM 500 is configured to support multiple bands and may include multiple filters or multiple duplexers. According to one embodiment, the FEM 500 may be a FEM that supports the LTE frequency domain or EN-DC. For example, the FEM 500 may be the first FEM 410, the second FEM 420, the fifth FEM 450, or the sixth FEM 460 shown in FIG. 4. According to one embodiment, the FEM 600 may be connected to an antenna that supports an ultra-high band (UHB) in the NR frequency range. For example, the FEM 600 may be the third FEM 430 or the fourth FEM 440 shown in FIG. 4 . However, the present invention is not limited to this, and the FEM 500 of FIG. 5 and the FEM 600 of FIG. 6 may be provided in various combinations within the electronic device 101.

Referring to FIG. 5, the FEM 500 may be operatively and/or electrically connected to an antenna 590 (eg, antenna A in FIG. 4). In one embodiment, the FEM 500 includes a first duplexer 520 operably and/or electrically connectable with the antenna 590, and a second duplexer 520 operably and/or electrically connectable with the antenna 590. It may include a third duplexer 540 that is operatively and/or electrically connectable to the second duplexer 530 and/or the antenna 590.

The first duplexer 520 may include a first filter 521 that passes the first signal within the uplink frequency range of the first frequency band. The uplink frequency range of the first frequency band may be referred to as a transmission frequency range of the first frequency band in terms of the frequency range of a signal transmitted from the electronic device 101.

Similar to the first duplexer 520, the second duplexer 530 may include a second filter 531 for passing signals within the uplink frequency range of a second frequency band different from the first frequency band. . The third duplexer 540 may include a third filter 541 for passing signals within an uplink frequency range of a third frequency band that is different from the first and second frequency bands.

According to one embodiment, the FEM 500 may further include a switch 550. For example, switch 550 may be controlled by processor 400. For example, the processor 400 operatively connects the PA 510 and the first filter 521 in the first duplexer 520 through the switch 550, or connects the PA 510 and the second duplexer 520 to operably connect the second filter 531 in 530, operably connect PA 510 and the third filter 541 in the third duplexer 540, or operably connect PA 510 and the first filter. All of 521 , second filter 531 , and third filter 541 can be operatively disconnected. For example, the switch 550 forms a first electrical path 551 between the PA 510 and the first filter 521 in the first duplexer 520, based on the control of the processor 400. (or providing) a first state, a second state forming a second electrical path 552 connecting the PA 510 and the second filter 531 in the second duplexer 530, the PA 510 and the second filter 531 3 A third state forming a third electrical path 553 connecting the third filter 541 in the duplexer 540, or the first electrical path 551, the second electrical path 552 and the third electrical path. (553) It is possible to have a fourth state that cuts off everything.

According to one embodiment, the FEM 500 may further include a switch 580. For example, the switch 580 may be controlled by the processor 400. For example, the processor 400 operatively connects the first duplexer 520 and the antenna 590 or operatively connects the second duplexer 530 and the antenna 590 through the switch 580. Connect, operatively connect the third duplexer 540 and the antenna 590, or connect two duplexers of the first duplexer 520, the second duplexer 530, and the third duplexer 540 and the antenna 590. ), or operably connect all of the first duplexer 520, the second duplexer 530, and the third duplexer 540 and the antenna 590, or operably connect the first duplexer 520, the third duplexer 530, and the third duplexer 540. It is possible to operatively disconnect from both the second duplexer 530 and the third duplexer 540.

Referring to FIG. 6 , FEM 600 may be operatively coupled with antenna 690 . In one embodiment, the FEM 600 may include a duplexer 620 connectable to the antenna 690.

The duplexer 620 may include a filter that passes signals within the frequency range of the NR standard in the third frequency band.

Referring to FIG. 7, the FEM 700 may include a PA 710, a first switch 750, a first terminal 720, a second terminal 730, and a third terminal 740. .

According to one embodiment, the FEM 700 may perform the operation of the third FEM 430 of FIG. 4 and the operation of the switch 490 of FIG. 4. For example, the FEM 700 may place the switch 490 of FIG. 4 inside the third FEM 430 of FIG. 4. For example, the FEM 700 may include a switch 750 configured to selectively provide a first voltage (Vcc1) or a second voltage (Vcc2) to the PA 710. According to one embodiment, the first terminal 720 may be configured to provide the first voltage (Vcc1) provided from the first power supply circuit 401. The switch 750 may provide an electrical connection 751 connected from the first terminal 720 to the PA 710. The first terminal 720 is a terminal of the FEM 700 configured to provide a first voltage (Vcc1) for operating the PA 710 (e.g., the third PA 431 in FIG. 4) within an operating range. It may be electrically connected to the external first power supply circuit 401.

According to one embodiment, the second terminal 730 may be configured to provide a second voltage (Vcc2) provided from the second power supply circuit 402. The switch 750 may provide an electrical connection 752 from the second terminal 730 to the PA 710. The second terminal 730 is electrically connected to a second power supply circuit 402 external to the FEM 700 configured to provide a second voltage (Vcc2) for operating the PA 710 within an operating range. can be connected

According to one embodiment, the third terminal 740 may be electrically connected to the PA 710 inside the FEM 700. According to one embodiment, the third terminal 740 is connected to another FEM (e.g., the fourth FEM 440 of FIG. 4) outside the FEM 700 (e.g., the third FEM 430 of FIG. 4). It may be electrically connected to the PA (e.g., the fourth PA (441), the fifth PA (451), or the sixth PA (461) in FIG. 4) in the fifth FEM (450) or the sixth FEM (460). . The third terminal 740 provides an electrical connection 753 connected to the outside from the node (N) or switch 750 between the first terminal 720 and the second terminal 730 and the PA 710. You can. The electrical connection 753 may be a path for supplying the voltage (Vcc1 or Vcc2) supplied to the node (N) to a PA in another FEM. The third terminal 740 is configured to provide the first voltage Vcc1 from the first power supply circuit 401 to the PA 710 in the FEM 700 through the first electrical connection 751. While, the PA (e.g., the fourth PA (441), the fifth PA (451), or The first voltage (Vcc1) may be provided to the sixth PA (461). The third terminal 740 is configured to provide the second voltage Vcc2 from the second power supply circuit 402 to the PA 710 in the FEM 700 through the second electrical connection 752. While, the PA (e.g., the fourth PA (441), the fifth PA (451), or It may be configured to provide the second voltage to the sixth PA (461).

According to one embodiment, the first switch 750 is disposed in the FEM 700 and connects the first electrical connection 751 between the first terminal 720 and the PA 710 or the second terminal 730. It may be configured to provide a second electrical connection 752 between PAs 710 . The first switch 750 has a first state forming a first electrical connection 751 between the first terminal 720 and the PA 710 and a second state between the second terminal 730 and the PA 710. It may have a second state forming an electrical connection 752 and a third state disconnecting both the first electrical connection 751 and the second electrical connection 752.

According to one embodiment, components that need to be supplied with power from the first power supply circuit 401 and the second power supply circuit 402 (e.g., the third FEM 430, the fourth FEM 440, the fifth Instead of including a power switch in each of the FEMs 450 and/or the sixth FEM 460, the first switch 750 may be placed in one FEM 700 (e.g., the third FEM 430). You can. The first switch 750 disposed in one FEM 700 includes the first power supply circuit 401 and the third FEM 430, fourth FEM 440, fifth FEM 450, or sixth FEM. (460) is electrically connected, or the second power supply circuit 402 and the third FEM (430), fourth FEM (440), fifth FEM (450) and/or sixth FEM (460) are electrically connected. Connect or connect the third FEM (430), fourth FEM (440), fifth FEM (450) and/or sixth FEM (460) to the first power supply circuit (401) and the second power supply circuit (402). It can be electrically disconnected from the. As described above, the first switch 750 is connected to the third FEM 430, fourth FEM 440, fifth FEM 450 and/or sixth FEM 460 and the first power supply circuit 401. Alternatively, the antenna freedom to support various frequency bands can be secured through electrical connection of the second power supply circuit 402.

According to one embodiment, PA 710 may be configured to set the transmission power of the signal. The PA 710 may set the transmission power of the signal based on the first voltage (Vcc1) or the second voltage (Vcc2). For example, the PA 710 receives a voltage (e.g., the first voltage Vcc1) from a power supply circuit external to the FEM 700 (e.g., the first power supply circuit 401 or the second power supply circuit 402). Alternatively, a second voltage (Vcc2) may be received. In response to receiving the voltage, PA 710 may transfer the transmit power of the signal to antenna A.

Referring to FIG. 8, the FEM 800 may further include a second switch 760 in addition to the FEM 700 of FIG. 7. The second switch 760 is disposed within the FEM 800 and provides a third electrical connection 753 between the first switch 750 and the third terminal 740 and between the first switch 750 and the PA (710). It may be configured to provide a fourth electrical connection 754. The second switch 760 has a first state forming a third electrical connection 753 between the third terminal 740 and the first switch 750, and a fourth electrical connection between the first switch 750 and the PA. It may have a second state forming a connection 754 and a third state disconnecting both the third electrical connection 753 and the fourth electrical connection 754.

According to one embodiment, the second switch 760 is included in another FEM (e.g., the fourth FEM 440, the fifth FEM 450, or the sixth FEM 460) outside the FEM 700. When set to provide voltage to the PA (e.g., the fourth PA (441), fifth PA (451), or sixth PA (461) in FIG. 4, it is set not to provide voltage to the PA (710). , stability can be increased. The second switch 760 can be set to not provide voltage to the external PA of the FEM 700 while providing voltage to the internal PA 710 of the FEM 700, such that the second switch 760 extends from the PA 710. The influence of the track may be small.

FIG. 9 shows an example of the arrangement of antenna modules electrically connected to FEMs in an electronic device according to an embodiment.

Referring to FIG. 9, the electronic device 101 has a first side 901, a second side 902 substantially parallel to the first side 901, and substantially perpendicular to the first side 901, and A third side 903 extending from one end of the first side 901 to one end of the second side 902, and substantially perpendicular to the first side 901, the first side 901 It may include a fourth side 904 extending from the other end of the second side 902 to the other end of the second side 902 . The length of the first side 901 and the second side 902 may be shorter than the length of the third side 903 and the fourth side 904. The first antenna A1 and/or the second antenna A2 may be disposed on the first side 901 of the first side 901 and the second side 902 having a short length. For example, the first antenna A1 and/or the second antenna A2 may be placed in a location where the electronic device 101 is less affected by the user's hand when the user holds the electronic device 101. The first antenna A1 and/or the second antenna A2 may be disposed in the first area 900A. The first area 900A may be an area located close to the user's chin (or mouth) when the user uses the electronic device 101 for a call. The third antenna A3 and/or the fourth antenna A4 may be disposed in the second area 900B. The second area 900B may be an area located close to the user's ears when the user uses the electronic device 101 for a call. The electronic device 101 may further include a housing including a side wall forming a side surface. The conductive portion of the sidewall disposed in the second area 900B may be configured to operate as at least part of the third antenna A3 and the fourth antenna A4.

According to one embodiment, one of the first antenna (A1) and the second antenna (A2) is operated for communication with an external electronic device, and one of the remaining antennas excluding the operated antenna is operated. It can be. For example, when the first antenna (A1) operates, one of the second antenna (A2), the third antenna (A3), and the fourth antenna (A4) may operate together with the first antenna (A1). You can. For another example, when the second antenna (A2) operates, one of the first antenna (A1), the third antenna (A3), and the fourth antenna (A4) operates together with the second antenna (A2). can do.

According to one embodiment, the electronic device 101 may include a plurality of antennas A1, A2, A3, and A4. The frequency ranges supported by each of the plurality of antennas (A1, A2, A3, and A4) may be different. For example, the first antenna A1 may be electrically connected to a first FEM (eg, the first FEM 410 of FIG. 4) that supports signals within the first frequency range. The second antenna A2 may be connected to a second FEM (eg, the second FEM 420 in FIG. 4) supporting a second frequency range. The third antenna A3 and/or the fourth antenna A4 may be selectively connected to one of a plurality of FEMs (eg, the third FEM 430 and the fourth FEM 440 in FIG. 4). The third antenna A3 may be connected to a third FEM (e.g., the third FEM 430 in FIG. 4) or a fourth FEM (e.g., the fourth FEM 440 in FIG. 4). The third antenna A3 may transmit a signal in a third frequency range based on connection with the third FEM 430, and the third antenna may transmit a signal in a fourth frequency range based on connection with the fourth FEM 440. A range of signals can be transmitted. For example, the fourth antenna A4 may be connected to a fifth FEM (e.g., the fifth FEM 450 in FIG. 4) or a sixth FEM (e.g., the sixth FEM 460 in FIG. 4). The fourth antenna (A4) can transmit a signal in the fifth frequency range (e.g., n77 or n79 of the NR standard) based on connection with the fifth FEM (450), and the fourth antenna (A4) can transmit a signal in the fifth frequency range (e.g., n77 or n79 in the NR standard). Based on the connection with the FEM 460, a signal in the sixth frequency range (eg, n77 or n79 of the NR standard) can be transmitted.

According to one embodiment, the processor (e.g., the processor 400 in FIG. 4) uses a first antenna connected to the first PA (e.g., the first PA 411 in FIG. 4) to transmit a signal to the first external While the signal is transmitted to the second external electronic device using the third antenna A3 that is transmitted to the electronic device and connected to the third PA (e.g., the third PA 431 in FIG. 4), the electronic device 101 ) may be configured to transmit a signal to a second external electronic device using a second antenna (A2) through the second PA, based on identifying a change in state. A change in the state of the electronic device 101 may mean a change in state that affects antenna radiation performance due to a user's grip. A change in the state of the electronic device 101 may mean a change in the folding or unfolding state of the foldable electronic device when the electronic device 101 is a foldable electronic device.

For example, an example of dual connection according to the structure of the FEMs in FIG. 4 and the antenna arrangement structure in FIG. 9 may be as shown in the table below.

Primary communication technique (e.g. LTE) Secondary communication technique (e.g. NR) frequency band PA power supply circuit antenna location frequency band PA power supply circuit antenna location Low 1st PA(411) First power supply circuit 401 lower Low 5th PA(451) Second power supply circuit 402 Top Low 1st PA(411) First power supply circuit 401 lower Mid 2nd PA(421) Second power supply circuit 402 lower 6th PA(461) Second power supply circuit 402 Top Low 1st PA(411) First power supply circuit 401 lower High 2nd PA(421) Second power supply circuit 402 lower 6th PA(461) Second power supply circuit 402 Top Mid 2nd PA(421) Second power supply circuit 402 lower Low 1st PA(411) First power supply circuit 401 lower 5th PA(451) First power supply circuit 401 Top Mid 2nd PA(421) Second power supply circuit 402 lower Mid 6th PA(461) First power supply circuit 401 Top Mid 2nd PA(421) Second power supply circuit 402 lower High 6th PA(461) First power supply circuit 401 Top High 2nd PA(421) Second power supply circuit 402 lower Low 1st PA(411) First power supply circuit 401 lower 5th PA(451) First power supply circuit 401 Top High 2nd PA(421) Second power supply circuit 402 lower Mid 6th PA(461) First power supply circuit 401 Top High 2nd PA(421) Second power supply circuit 402 lower High 6th PA(461) First power supply circuit 401 Top Low 1st PA(411) First power supply circuit 401 lower UHB 3rd PA(431)/ 4th PA(441) Second power supply circuit 402 Top Mid 2nd PA(421) Second power supply circuit 402 lower UHB 3rd PA(431)/ 4th PA(441) First power supply circuit 401 Top High 2nd PA(421) Second power supply circuit 402 lower UHB 3rd PA(431)/ 4th PA(441) First power supply circuit 401 Top

Referring to Table 1, FIGS. 4, and 9, the electronic device 101 operates the third FEM (e.g., the switch 490 in FIG. 4 or the first switch 750 in FIG. 7) through a switch. 430), the 3rd PA (431), the 4th PA (441) of the 4th FEM (440), the 5th PA (451) of the 5th FEM (450), or the 6th PA (460) of the 6th FEM (460). 461) and the first power supply circuit 401, or provide an electrical connection between the third PA (431) of the third FEM (430), the fourth PA (441) of the fourth FEM (440), and the fifth FEM. An electrical connection may be provided between the fifth PA 451 of 450 or the sixth PA 461 of the sixth FEM 460 and the second power supply circuit 402. The processor (e.g., processor 400 in FIG. 4) transmits the first signal to the first PA 411 connected to the first antenna A1 located in the first area 900A through the first power supply circuit 401. When providing a voltage, the third antenna of the third FEM 430 is connected to the third antenna A3 or the fourth antenna A4 located in the second area 900B through the second power supply circuit 402. The second PA (431), the fourth PA (441) of the fourth FEM (440), the fifth PA (451) of the fifth FEM (450), or the sixth PA (461) of the sixth FEM (460) It may be configured to provide voltage. The processor (e.g., processor 400 in FIG. 4) provides a second voltage to the second PA 412 connected to the second antenna A2 located at the bottom through the second power supply circuit 402. In this case, the third PA 431 and the fourth FEM ( It may be configured to provide the first voltage to the fourth PA 441 of the fourth PA 441 of the fifth FEM 450, the fifth PA 451 of the fifth FEM 450, or the sixth PA 461 of the sixth FEM 460. According to one embodiment, the first antenna (A1) and the second antenna (A2) supporting LTE may be placed at the bottom of the electronic device 101 where the first side 901 is located. While the electronic device 101 operates in EN-DC, if the LTE connection is unstable, communication using NR is also affected, so the antennas A1 and A2 that support LTE can be placed at the bottom. . In one embodiment, each of the antennas A1 and A2 disposed at the bottom may be connected to a power supply circuit (eg, the first power supply circuit 401 or the second power supply circuit 402). For example, the first power supply circuit 401 connected to the first antenna A1 may be connected to the third antenna A3 and the fourth antenna A4. The second power supply circuit 402 connected to the second antenna A2 may be connected to the third antenna A3 and the fourth antenna A4. The third antenna (A3) and the fourth antenna (A4) are electrically connected to the first power supply circuit 401 or the second power supply circuit 402 according to the operation of the first antenna (A1) or the second antenna (A2). It can be connected to . For example, while the first power supply circuit 401 is connected to the first antenna A1, the second power supply circuit 402 is connected to the first power supply circuit 402 through a switch (e.g., switch 490 in FIG. 4). It can be connected to the third antenna (A3) and the fourth antenna (A4). While the second power supply circuit 402 is connected to the second antenna A2, the first power supply circuit 401 is connected to the third antenna A3 and the fourth antenna A4 through the switch 490. can be connected with

According to the above-described embodiment, the electronic device 101 supplies a plurality of power supplies through a switch 490 disposed outside the FEM or a first switch 750 disposed inside one of the plurality of FEMs. The degree of freedom of the antenna can be increased by connecting the circuits 401 and 402 and FEMs that need to be connected. The electronic device 101 can reduce the size of the FEM and reduce the number of switches by placing a switch in one FEM or placing a switch outside the FEM instead of including a switch in each of the plurality of FEMs. As a result, costs can be reduced.

According to the above-described embodiment, the electronic device (e.g., the electronic device 101 of FIG. 1) includes a processor (e.g., the processor 120 of FIG. 1) and a first power supply circuit (e.g., the first power supply of FIG. 4). A plurality of power supply circuits including a supply circuit 401) and a second power supply circuit (e.g., the second power supply circuit 402 in FIG. 4), and a plurality of FEMs electrically connected to the processor ( 410, 420, 430, 440, 450, 460). The FEMs are electrically connected to the first power supply circuit and include a first power amplifier (PA) configured to transmit a first RF signal (e.g., the first PA 411 in FIG. 4). A radio frequency front end (FEM) (e.g., the first FEM 410 in FIG. 4), electrically connected to the second power supply circuit and configured to transmit a second RF signal different from the first RF signal. A second FEM 420 (e.g., the second FEM 420 in FIG. 4) including 2 PAs (e.g., the second PA 421 in FIG. 4), the first RF signal, the second RF signal, and a third PA configured to transmit a different third RF signal and a switch configured to electrically connect the third PA with a power supply circuit selected from the first power supply circuit and the second power supply circuit; , a third FEM (e.g., third FEM 430 in FIG. 4), configured to electrically connect the selected power supply circuit to another FEM through an electrical path extending from a node between the third PA and the switch. ), and a fourth PA that transmits a fourth RF signal distinct from the first RF signal, the second RF signal, and the third RF signal, and a fourth FEM (e.g. : May include the fourth FEM (440) of FIG. 4).

According to one embodiment, the at least one processor is based on transmitting a signal using the first PA operating based on the first voltage provided from the first power supply circuit through the switch, To transmit a signal using the third PA or the fourth PA operating based on a second voltage provided from the second power supply circuit, through the switch, the second power supply circuit and the third PA Based on transmitting a signal using a first connection state electrically connecting the PA and the fourth PA, and the second PA operating based on the second voltage provided from the second power supply circuit, To transmit a signal using the third PA or fourth PA operating based on the first voltage provided from the first power supply circuit, through the switch, the first power supply circuit and the fourth PA It may be configured to provide a second connection state that electrically connects the 3 PA and the 4 PA. According to one embodiment, the processor simultaneously transmits the first RF signal and a selected one of the third RF signal or the fourth RF signal in the first connection state, or transmits the first RF signal in the second connection state. It may be configured to simultaneously transmit a selected one of an RF signal or the fourth RF signal and the second RF signal.

According to one embodiment, the electronic device includes a first antenna electrically connected to the first PA, a second antenna electrically connected to the second PA, a third antenna electrically connected to the third PA, and the fourth antenna electrically connected to the third PA. A plurality of antennas including a fourth antenna connected to the PA (e.g., the first antenna (A1), the second antenna (A2), the third antenna (A3), the fourth antenna (A4), and the fifth antenna in FIG. 4 (A5) and a sixth antenna (A6)) may be further included.

According to one embodiment, the third antenna or the fourth antenna may be placed on one side of the electronic device.

According to one embodiment, the electronic device may further include a side wall that forms a side surface of the electronic device.

According to one embodiment, the conductive portion of the sidewall disposed on one side may be configured to operate as at least part of one of the third antenna or the fourth antenna.

According to one embodiment, the first antenna or the second antenna may be disposed on a side opposite to the one side of the electronic device.

According to one embodiment, the processor simultaneously transmits the first RF signal and a selected one of the third RF signal or the fourth RF signal in the first connection state, or transmits the first RF signal in the second connection state. By simultaneously transmitting the second RF signal and one of the three RF signals or the fourth RF signal, it may be configured to support dual connectivity or carrier aggregation.

According to one embodiment, the at least one processor transmits a signal to the outside using the first PA that operates based on the first voltage provided from the first power supply circuit, and the second power supply circuit The third PA and the fourth PA operate based on a second voltage provided from a supply circuit through the second power supply circuit and the switch to transmit a signal to the outside. It may be configured to electrically connect the fourth PA.

According to one embodiment, the at least one processor transmits a signal to the outside using the second PA that operates based on the second voltage provided from the second power supply circuit, and the first power supply circuit The third PA and the fourth PA operate through the first power supply circuit and the switch to transmit a signal to the outside using the third PA or the fourth PA operating based on the first voltage provided from the supply circuit. It can be configured to electrically connect 4 PAs.

According to one embodiment, the at least one processor may be configured to receive a control message from the first external electronic device while transmitting a signal to the first external electronic device through an antenna using the first PA. You can.

According to one embodiment, the at least one processor, based on the control message, configures a PA for transmitting another signal distinct from the signal while the signal is transmitted using the first PA to the second PA. , the third PA, and the fourth PA.

According to one embodiment, when the identified PA is identified as the third PA or the fourth PA, the at least one processor is configured to connect the second power supply circuit and the third PA and the fourth PA through the switch. It may be configured to electrically connect the PA.

According to one embodiment, the signal transmitted using the first PA is transmitted according to the first communication technique to the first external electronic device supporting the first communication technique, and the second PA and the first The signal transmitted using the identified PA among 3 PAs or the 4th PA is a second external electronic device that is distinct from the first external electronic device and supports a second communication technique different from the first communication technique. , may be transmitted according to the second communication technique.

According to one embodiment, the at least one processor identifies, based on the control message, that the third PA is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique. , It may be configured to electrically connect the third PA and the fourth PA through the second power supply circuit and the switch, and to deactivate the fourth PA.

According to one embodiment, the at least one processor identifies, based on the control message, that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the fourth PA. Based on this, it may be configured to electrically connect the third PA and the fourth PA through the second power supply circuit and the switch, and deactivate the third PA.

According to one embodiment, the at least one processor identifies, based on the control message, that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the second PA. Based on this, it may be configured to refrain from electrically connecting the third PA and the fourth PA through the second power supply circuit and the switch.

According to one embodiment, the at least one processor receives a control message related to the signal to be transmitted from the first external electronic device while the signal is transmitted to the first external electronic device using the second PA, and , Based on the control message, the PA for the signal to be transmitted may be configured to identify among the first PA, the third PA, and the fourth PA while the signal is transmitted using the second PA. .

According to one embodiment, the at least one processor, on the condition that the identified PA is identified as the third PA or the fourth PA, the first power supply circuit, the third PA, and the fourth PA through the switch. It may be configured to electrically connect the fourth PA.

According to one embodiment, the signal transmitted using the second PA that receives voltage from the second power supply circuit may be configured to be transmitted to the first external electronic device according to a first communication technique.

According to one embodiment, the signal transmitted using the identified PA among the first PA, the third PA, or the fourth PA is sent to a second external electronic device that is distinct from the first external electronic device. , may be configured to be transmitted according to a second communication technique different from the first communication technique.

According to one embodiment, the at least one processor identifies, based on the control message, that the third PA is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique. , It may be configured to supply voltage from the second power supply circuit to the third PA and the fourth PA through the switch.

According to one embodiment, the at least one processor identifies, based on the control message, that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the fourth PA. Based on this, it may be configured to supply voltage from the second power supply circuit to the third PA and the fourth PA through the switch.

According to one embodiment, based on the control message, the switch is operated based on identifying that the PA for the signal to be transmitted to the second external electronic device according to the second communication technique is the second PA. It may be configured to refrain from supplying voltage from the second power supply circuit to the third PA and the fourth PA.

According to one embodiment, the third FEM has a first terminal configured to provide a first voltage provided from the first power supply circuit (e.g., the first terminal 720 in FIG. 7), and the second power supply. A second terminal configured to provide a second voltage provided from the circuit (e.g., the second terminal 730 in FIG. 7), and a third terminal connected to the third PA (e.g., the third terminal 740 in FIG. 7) ))) may be included.

According to one embodiment, the switch in the third FEM is configured to provide a first electrical connection between the first terminal and the third PA or a second electrical connection between the second terminal and the third PA. It can be.

According to one embodiment, the third terminal is configured to provide the first power supply to the fourth PA while the first voltage provided from the first power supply circuit is provided to the third PA through the first electrical connection. It may be configured to provide the first voltage provided from a supply circuit.

According to one embodiment, the second voltage provided from the second power supply circuit is provided to the third PA through the second electrical connection, while the second voltage provided from the second power supply circuit is provided to the fourth PA. It may be configured to provide a second voltage.

According to one embodiment, the third FEM is distinguished from the switch, and the third PA to which the first voltage provided from the first power supply circuit or the second voltage provided from the second power supply circuit is applied. It may further include another switch configured to electrically connect the node and the third terminal.

According to one embodiment, the at least one processor receives a control message from the first external electronic device while a signal is transmitted to the first external electronic device using the second PA, and responds to the control message Based on this, a PA for a signal to be transmitted is identified among the third PA and the fourth PA while the signal is transmitted using the first PA, and the switch is based on the identified PA being the third PA. While electrically connecting the other switch and the first terminal, electrically connecting the third PA and the first terminal through the other switch, and electrically connecting the node of the third PA and the third terminal It may be configured to refrain from electrically connecting.

According to one embodiment, the at least one processor operates the other switch while electrically connecting the other switch and the first terminal through the switch based on the fact that the identified PA is the fourth PA. It may be configured to electrically connect the node and the third terminal of the third PA through, and refrain from electrically connecting the third PA and the first terminal.

According to one embodiment, the first PA is configured to set a first transmission power having a first frequency band, and the second PA is configured to set a second transmission power having a second frequency band, The third PA may be configured to set third transmission power having a third frequency band, and the fourth PA may be configured to set fourth transmission power having a fourth frequency band.

According to one embodiment, the first frequency band may be spaced apart from the second frequency band, and the third frequency band may be spaced apart from the fourth frequency band.

According to one embodiment, the first frequency band or the second frequency band may be lower than the third frequency band or the fourth frequency band.

According to one embodiment, the first frequency band may include at least a portion of the third frequency band.

According to one embodiment, the second frequency band may include at least a portion of the fourth frequency band.

According to one embodiment, the electronic device has a first side (e.g., the first side 901 in FIG. 9), a second side parallel to the first side (e.g., the second side 902 in FIG. 9), A third side (e.g., third side 903 in FIG. 9) extending from one end of the first side to one end of the second side in a direction perpendicular to the first side, and on the first side A housing that forms an internal space of the electronic device by a fourth side (e.g., fourth side 904 in FIG. 9) extending from the other end of the first side to the other end of the second side in a vertical direction. It may further include.

According to one embodiment, the electronic device includes at least one first antenna (e.g., the first antenna (A1) in FIG. 9 and/or the second antenna (A1) formed by at least one conductive portion disposed on the first side. Antenna A2) and at least one second antenna (e.g., third antenna A3 and/or fourth antenna A4 in FIG. 9) formed by at least one conductive portion disposed on the second side. ) may further be included.

According to one embodiment, the at least one first antenna may be configured to transmit a signal received from the first FEM or the second FEM to an external electronic device.

According to one embodiment, the at least one second antenna may be configured to transmit a signal received from the third FEM or the fourth FEM to an external electronic device.

According to one embodiment, the at least one processor transmits a signal to a first external electronic device using the first PA and the at least one first antenna and transmits the signal to the at least one second external electronic device through the third PA. While a signal is transmitted to a second external electronic device using an antenna, based on identifying a state of the electronic device, a signal is transmitted to the second external electronic device using the at least one first antenna through the second PA. It may be configured to transmit to .

A FEM (e.g., FEM 700 in FIG. 7) according to an embodiment includes a power amplifier (PA) configured to set the transmission power of a signal, and configured to provide a first voltage for operating the PA within an operating range. A first terminal (e.g., first terminal 720 in FIG. 7) electrically connected to a first power supply circuit external to the FEM, configured to provide a second voltage for operating the PA within an operating range. A second terminal electrically connected to a second power supply circuit outside the FEM (e.g., the second terminal 730 in FIG. 7), and a third terminal electrically connected to another PA in another FEM outside the FEM (e.g. : configured to provide a first electrical connection between the third terminal 740 in FIG. 7 and the first terminal and the PA in the FEM or a second electrical connection between the second terminal and the PA in the FEM It may include a switch (eg, the first switch 750 in FIG. 7).

According to one embodiment, the third terminal is electrically connected to the other PA in the other FEM while the first voltage is provided to the PA in the FEM through the first electrical connection from the first power supply circuit. It can be configured to be connected to .

According to one embodiment, the third terminal is electrically connected to the other PA in the other FEM while the second voltage is provided to the PA in the FEM through the second electrical connection from the second power supply circuit. It can be configured to be connected to .

According to one embodiment, the third terminal may be electrically connected to a node of the PA in the FEM to which the first voltage or the second voltage is applied.

According to one embodiment, the FEM is distinct from the switch and is configured to provide a third electrical connection between the switch and the PA in the FEM or a fourth electrical connection between the switch and the third terminal. It may further include.

According to one embodiment, the other switch is configured to operate the other FEM via the fourth electrical connection while the first voltage is provided from the first power supply circuit to the PA in the FEM via the third electrical connection. and may be configured to refrain from providing the first voltage to the other PAs within the PA.

According to one embodiment, the other switch is configured to provide the first voltage from the first power supply circuit to the other PA in the other FEM via the third electrical connection while providing the first voltage to the other PA in the other FEM via the fourth electrical connection. and may be configured to refrain from providing the first voltage to the PA in the FEM.

According to one embodiment, the other switch is configured to operate the other FEM via the fourth electrical connection while the second voltage is provided from the second power supply circuit to the PA in the FEM via the third electrical connection. and may be configured to refrain from providing the second voltage to the other PAs within the PA.

According to one embodiment, the second voltage is provided from the second power supply circuit to the PA in the FEM via the third electrical connection while being provided to the other PA in the other FEM via the fourth electrical connection. It may be configured to refrain from providing the second voltage.

An electronic device according to an embodiment disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

An embodiment of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or substitutes for the embodiment. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one element from another, and may be used to distinguish such elements in other respects, such as importance or order) is not limited. One (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". Where mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

One embodiment of the present document is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, a method according to an embodiment disclosed in this document may be provided and included in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. A computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or through an application store (e.g., Play Store??), or on two user devices. It can be distributed (e.g. downloaded or uploaded) directly between smartphones (e.g. smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to one embodiment, each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components. . According to one embodiment, one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to one embodiment, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

Claims (28)

In electronic devices,
processor;
a plurality of power supply circuits including a first power supply circuit and a second power supply circuit; and
It includes a plurality of front end modules (FEMs) electrically connected to the processor, wherein the FEMs:
a first FEM electrically connected to the first power supply circuit and including a first power amplifier (PA) configured to transmit a first RF signal;
a second FEM electrically connected to the second power supply circuit and including a second PA configured to transmit a second RF signal different from the first RF signal;
a third PA configured to transmit a third RF signal different from the first RF signal, the second RF signal, and a power supply circuit selected from the first power supply circuit and the second power supply circuit, and the third A third FEM, comprising a switch configured to electrically connect a PA, and configured to electrically connect the selected one power supply circuit to another FEM via an electrical path extending from a node between the third PA and the switch. ; and
It includes a fourth PA that transmits a fourth RF signal that is distinct from the first RF signal, the second RF signal, and the third RF signal, and includes a fourth FEM electrically connected to the electrical path,
The processor,
Based on transmitting a signal using the first PA, which operates based on the first voltage provided from the first power supply circuit, through the switch, the second voltage provided from the second power supply circuit A device that electrically connects the second power supply circuit, the third PA, and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating based on the 1 connection state, and based on transmitting a signal using the second PA operating based on the second voltage provided from the second power supply circuit, the first power supply circuit is provided from the first power supply circuit. Electrically connecting the first power supply circuit and the third PA and the fourth PA through the switch to transmit a signal using the third PA or the fourth PA operating based on voltage. provide a second connection state,
Simultaneously transmitting the first RF signal and a selected one of the third RF signal or the fourth RF signal in the first connection state, or transmitting a selected one of the third RF signal or the fourth RF signal in the second connection state configured to transmit one and the second RF signal simultaneously,
Electronic devices.
According to paragraph 1,
A plurality of devices including a first antenna electrically connected to the first PA, a second antenna electrically connected to the second PA, a third antenna electrically connected to the third PA, and a fourth antenna connected to the fourth PA. further comprising antennas,
Electronic devices.
According to claim 1 or 2,
The third antenna or the fourth antenna,
disposed on one side of the electronic device,
Electronic devices.
According to any one of the preceding clauses,
It further includes a side wall forming a side of the electronic device,
The conductive portion of the side wall disposed on one side is,
configured to operate as at least part of one of the third antenna or the fourth antenna,
Electronic devices.
According to any one of the preceding clauses,
The first antenna or the second antenna,
disposed on a side opposite to the one side of the electronic device,
Electronic devices.
According to any one of the preceding clauses,
The processor,
In the first connection state, transmitting the first RF signal and a selected one of the third RF signal or the fourth RF signal simultaneously, or in the second connection state, the third RF signal or the fourth RF signal Configured to support dual connectivity or carrier aggregation by transmitting the selected one and the second RF signal simultaneously,
Electronic devices.
According to any one of the preceding clauses,
The at least one processor,
While a signal is transmitted to the first external electronic device using the first PA, receive a control message from the first external electronic device,
Based on the control message, identify a PA for a signal to be transmitted among the second PA, the third PA, and the fourth PA while the signal is transmitted using the first PA, and
Configured to electrically connect the second power supply circuit and the third PA and the fourth PA through the switch, on the condition that the identified PA is identified as the third PA or the fourth PA,
Electronic devices.
According to any one of the preceding clauses,
The signal transmitted using the first PA is:
is transmitted to the first external electronic device according to a first communication technique,
The signal transmitted using the identified PA among the second PA, the third PA, or the fourth PA is:
Transmitted to a second external electronic device that is distinct from the first external electronic device according to a second communication technique different from the first communication technique,
Electronic devices.

According to one of the preceding clauses,
At least one processor,
Based on the control message, identifying that the third PA is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique, through the second power supply circuit and the switch. electrically connecting the third PA and the fourth PA, deactivating the fourth PA,
Based on the control message, identifying that the PA for the signal to be transmitted according to the second communication technique to the second external electronic device is the fourth PA, the second power supply circuit and the switch configured to electrically connect the third PA and the fourth PA through and deactivate the third PA,
Electronic devices.
According to one of the preceding clauses,
The at least one processor,
Based on the control message, identifying that the PA for the signal to be transmitted according to the second communication technique to the second external electronic device is the second PA, the second power supply circuit and the switch configured to refrain from electrically connecting the third PA and the fourth PA via,
Electronic devices.
According to one of the preceding clauses,
The at least one processor,
While a signal is transmitted to the first external electronic device using the second PA, receive a control message from the first external electronic device,
Based on the control message, identify a PA for a signal to be transmitted among the first PA, the third PA, and the fourth PA while the signal is transmitted using the second PA, and
Configured to electrically connect the first power supply circuit and the third PA and the fourth PA through the switch, on the condition that the identified PA is identified as the third PA or the fourth PA,
Electronic devices.
According to one of the preceding clauses,
The signal transmitted using the second PA is,
is transmitted to the first external electronic device according to a first communication technique,
The signal transmitted using the identified PA among the first PA, the third PA, or the fourth PA is:
Transmitted to a second external electronic device that is distinct from the first external electronic device according to a second communication technique different from the first communication technique,
Electronic devices.
According to one of the preceding clauses,
Based on the control message, identifying that the third PA is the PA for the signal to be transmitted to the second external electronic device according to the second communication technique, through the second power supply circuit and the switch. Electrically connecting the third PA and the fourth PA,
Based on the control message, identifying that the PA for the signal to be transmitted according to the second communication technique to the second external electronic device is the fourth PA, the second power supply circuit and the switch Electrically connecting the third PA and the fourth PA through,
Based on the control message, identifying that the PA for the signal to be transmitted according to the second communication technique to the second external electronic device is the second PA, the second power supply circuit and the switch configured to refrain from electrically connecting the third PA and the fourth PA via,
Electronic devices.
According to one of the preceding clauses,
The third FEM is,
a first terminal configured to provide a first voltage provided from the first power supply circuit;
a second terminal configured to provide a second voltage provided from the second power supply circuit; and
A third terminal connected to the third PA; including,
Electronic devices.
According to one of the preceding clauses,
The switch is
disposed within the third FEM and configured to provide a first electrical connection between the first terminal and the third PA or a second electrical connection between the second terminal and the third PA,
Electronic devices.
According to one of the preceding clauses,
The third terminal is,
providing the first voltage provided from the first power supply circuit to the fourth PA while the first voltage provided from the first power supply circuit is provided to the third PA through the first electrical connection; ,
to provide the second voltage provided from the second power supply circuit to the fourth PA while the second voltage provided from the second power supply circuit is provided to the third PA through the second electrical connection. , consisting of,
Electronic devices.
According to one of the preceding clauses,
The third FEM is,
Distinguished from the switch, and electrically connecting the third terminal to the node of the third PA to which the first voltage provided from the first power supply circuit or the second voltage provided from the second power supply circuit is applied. Further comprising other switches configured,
The at least one processor,
While a signal is transmitted to the first external electronic device using the second PA, receive a control message from the first external electronic device,
Identifying a PA for a signal to be transmitted among the third PA and the fourth PA while the signal is transmitted using the first PA based on the control message,
While electrically connecting the other switch and the first terminal through the switch based on the identified PA being the third PA, the third PA and the first terminal are electrically connected through the other switch. configured to connect and refrain from electrically connecting the node and the third terminal of the third PA,
Electronic devices.
According to one of the preceding clauses,
The at least one processor,
While electrically connecting the other switch and the first terminal through the switch based on the identified PA being the fourth PA, the node and the third terminal of the third PA through the other switch configured to electrically connect and refrain from electrically connecting the third PA and the first terminal,
Electronic devices.
According to one of the preceding clauses,
The first PA is configured to set a first transmission power with a first frequency band,
The second PA is configured to set a second transmission power having a second frequency band,
The third PA is configured to set a third transmission power having a third frequency band,
The fourth PA is configured to set a fourth transmit power having a fourth frequency band,
Electronic devices.
According to one of the preceding clauses,
The first frequency band is spaced apart from the second frequency band,
The third frequency band is spaced apart from the fourth frequency band,
Electronic devices.
According to one of the preceding clauses,
The first frequency band or the second frequency band,
lower than the third frequency band or the fourth frequency band,
Electronic devices.
According to one of the preceding clauses,
The first frequency band overlaps at least part of the third frequency band,
The second frequency band overlaps at least part of the fourth frequency band,
Electronic devices.


According to one of the preceding clauses,
The at least one processor,
A signal is transmitted to a first external electronic device using the first PA and the at least one first antenna, and a signal is transmitted to a second external electronic device using the at least one second antenna through the third PA. configured to transmit a signal to the second external electronic device using the at least one first antenna through the second PA, based on identifying the state of the electronic device, while
Electronic devices.
In FEM (front end module),
a power amplifier (PA) configured to set the transmit power of the signal;
a first terminal electrically connected to a first power supply circuit external to the FEM configured to provide a first voltage for operating the PA within an operating range;
a second terminal electrically connected to a second power supply circuit external to the FEM configured to provide a second voltage for operating the PA within an operating range;
a third terminal electrically connected to another PA outside the FEM and within another FEM; and
a switch configured to provide a first electrical connection between the first terminal and the PA in the FEM or a second electrical connection between the second terminal and the PA in the FEM;
The third terminal is,
providing the first voltage to the other PAs in the other FEM while the first voltage is provided to the PA in the FEM through the first electrical connection from the first power supply circuit;
configured to provide the second voltage to the other PA in the other FEM while the second voltage is provided to the PA in the FEM through the second electrical connection from the second power supply circuit.
F.E.M.
According to clause 24,
The third terminal is,
Electrically connected to the node of the PA in the FEM to which the first voltage or the second voltage is applied,
F.E.M.
According to claim 24 or 26,
The FEM is,
further comprising another switch distinct from the switch and configured to provide a third electrical connection between the switch and the PA in the FEM or a fourth electrical connection between the switch and the third terminal,
F.E.M.
The method of claims 24 to 26,
The other switches above are:
While the first voltage is provided from the first power supply circuit to the PA in the FEM via the third electrical connection, the first voltage is provided to the other PA in the other FEM via the fourth electrical connection. Refrain from doing
providing the first voltage to the PA in the FEM via the third electrical connection, while providing the first voltage from the first power supply circuit to the other PA in the other FEM via the fourth electrical connection. Consisting of refraining from doing,
F.E.M.
According to claims 24 to 27,
The other switches above are:
While the second voltage is provided from the second power supply circuit to the PA in the FEM via the third electrical connection, the second voltage is provided to the other PA in the other FEM via the fourth electrical connection. Refrain from doing
providing the second voltage to the PA in the FEM via the third electrical connection, while providing the second voltage from the second power supply circuit to the other PA in the other FEM via the fourth electrical connection. Consisting of refraining from doing,
F.E.M.

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