KR20230141368A - Flexible electronic device - Google Patents

Abstract

An electronic device according to an embodiment of the present document is an electronic device having one or more display modules, wherein the one or more display modules include a display panel and a composite laminated structure arranged on the display panel, and the composite laminated structure The structure includes one or more bending layers and two or more unbending layers disposed at least partially above or below the bending layers, wherein each edge of the two or more unbending layers forms a predetermined slope with respect to each other. It can be laminated to do so.

Description

Flexible electronic device {FLEXIBLE ELECTRONIC DEVICE}

This document is about flexible electronic devices.

As electronic, information, and communication technologies develop, various functions are being integrated into a single portable communication device or electronic device. For example, a smart phone includes communication functions as well as the functions of a sound reproduction device, an imaging device, or an electronic notebook, and a wider variety of functions can be implemented in the smart phone by installing additional applications.

As the use of personal or portable communication devices such as smart phones becomes widespread, user demands for portability and ease of use are increasing. For example, a touch screen display is a screen, for example, an output device that outputs visual information, and can provide a virtual keypad that replaces a mechanical input device (for example, a button-type input device). As a result, portable communication devices or electronic devices can be miniaturized while providing the same or improved usability (eg, larger screen). On the other hand, as flexible displays, for example foldable or rollable, are commercialized, the portability and ease of use of electronic devices are expected to further improve. .

The purpose of this document is to provide a flexible display device that maintains the bending characteristics of the flexible display module and at the same time improves impact resistance.

An electronic device according to an embodiment of the present document is an electronic device having one or more display modules, wherein the one or more display modules include a display panel and a composite laminate structure arranged on the display panel, and the composite laminate structure It includes one or more bending layers and two or more unbending layers at least partially disposed above or below the bending layers, wherein the two or more unbending layers have their respective edges forming a predetermined slope with respect to each other. Can be laminated.

The display device according to an embodiment of this document not only improves impact resistance by bonding the unbending layer spaced apart by a predetermined distance to the bending layer and partially bending only the bending layer, but also improves impact resistance in the portion where the unbending layer is laminated. Impact resistance can also be improved at the same time.

The effects that can be obtained from the exemplary embodiments of this document are not limited to the effects mentioned above, and other effects not mentioned are common knowledge in the technical field to which the exemplary embodiments of this document belong from the following description. It can be clearly derived and understood by those who have it. That is, unintended effects resulting from implementing the exemplary embodiments of this document may also be derived by those skilled in the art from the exemplary embodiments of this document.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
FIG. 2A is a diagram illustrating an unfolded state of an electronic device according to an embodiment.
FIG. 2B is a diagram illustrating a folded state of an electronic device according to an embodiment.
Figure 2C is an exploded perspective view of an electronic device according to one embodiment.
Figure 3 is a cross-sectional view of a display module according to one embodiment.
4 to 7 are cross-sectional views of a composite laminated structure included in a foldable display module.
8 to 10 are cross-sectional views of a composite laminated structure included in a rollable display module.
Figures 11 to 13 are cross-sectional views of a composite laminated structure to improve boundary visibility and improve impact resistance.
Figures 14 and 15 are cross-sectional views of a composite laminated structure with improved impact resistance using two types of adhesives.
Figure 16 is a cross-sectional view of a composite laminated structure for improving the adhesion efficiency and impact resistance of the adhesive layer.
Figure 17 is an experimental example to explain the effect of improving visibility according to the chamfer angle.
Figure 18 is an experimental example to explain the effect of improving visibility according to the curvature of the edge of the unbending layer.
In the following description, reference is made to the accompanying drawings, and specific examples of how they may be practiced are shown by way of example in the drawings. Additionally, other examples may be used and structural changes may be made without departing from the scope of the various examples.

Hereinafter, with reference to the drawings, embodiments of this document will be described in detail so that those skilled in the art can easily implement them. However, this document may be implemented in several different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, identical or similar reference numerals may be used for identical or similar components. Additionally, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197. In some embodiments, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.

The processor 120, for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device 101 includes a main processor 121 and a secondary processor 123, the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, co-processor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is. According to one embodiment, the auxiliary processor 123 (eg, neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108). Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited. An artificial intelligence model may include multiple artificial neural network layers. Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, artificial intelligence models may additionally or alternatively include software structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed or authenticated.

The wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology). NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported. The wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates. The wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC. Example: Downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, in addition to the radiator, other components (eg, radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

2A and 2B, in one embodiment, the electronic device 200 includes a foldable housing 210, a hinge cover 213 that covers a foldable portion of the foldable housing 210, and a foldable housing 210. It may include a flexible or foldable display 221 disposed in the space formed by the housing 210. In this document, the side on which the display 221 is placed is defined as the first side or the front of the electronic device 200. And, the side opposite to the front is defined as the second side or the back of the electronic device 200. Additionally, the surface surrounding the space between the front and back is defined as the third side or side of the electronic device 200.

In one embodiment, the foldable housing 210 includes a first housing structure 211, a second housing structure 212 including a sensor area 2122, a first rear cover 214, and a second rear cover. It may include (215). The foldable housing 210 of the electronic device 200 is not limited to the shape and combination shown in FIGS. 2A and 2B, and may be implemented by other shapes or combinations and/or combinations of parts. For example, in another embodiment, the first housing structure 211 and the first rear cover 214 may be integrally formed, and the second housing structure 212 and the second rear cover 215 may be integrally formed. can be formed.

In one embodiment, the first housing structure 211 and the second housing structure 212 are disposed on both sides about the folding axis (A-axis) and may have an overall symmetrical shape with respect to the folding axis A. As will be described later, the angle or distance between the first housing structure 211 and the second housing structure 212 varies depending on whether the electronic device 200 is in an unfolded state, a folded state, or an intermediate state. You can. In one embodiment, the second housing structure 212, unlike the first housing structure 211, additionally includes a sensor area 2122 where various sensors are arranged, but has a mutually symmetrical shape in other areas. You can. In another embodiment, the sensor area 2122 may be additionally disposed or replaced in at least a partial area of the first housing structure 211 or the second housing structure 212.

In one embodiment, the electronic device 200 is folded (in) by rotating the first housing structure 210 in a range of 0 degrees to 360 degrees with respect to the second housing structure 220 through a hinge structure (not shown). -folding method and/or out-folding method. According to various embodiments, the hinge structure may be formed in a vertical direction or a horizontal direction when the electronic device 200 is viewed from above. According to various embodiments, there may be a plurality of hinge structures. For example, a plurality of hinge structures may all be arranged in the same direction. As another example, some hinge structures among a plurality of hinge structures may be arranged in different directions and folded.

In one embodiment, as shown in FIG. 2A , the first housing structure 211 and the second housing structure 212 may together form a recess that accommodates the display 221 . In one embodiment, the sensor area 2122 allows the recess to have two or more different widths in the direction perpendicular to the folding axis A.

For example, the recess is (a) a first portion (211a) parallel to the folding axis A of the first housing structure 211 and a second portion formed at the edge of the sensor area 2122 of the second housing structure 212. 1, the first width w1 between the portion 212a, and (b) the second portion 211b of the first housing structure 211 and the second housing structure 212, if it does not correspond to the sensor area 2122. It may have a second width w2 formed by the second portion 212b parallel to the folding axis A. In this case, the second width w2 may be formed to be longer than the first width w1. In other words, the first part 211a of the first housing structure 211 and the first part 212a of the second housing structure 212, which have mutually asymmetric shapes, form the first width w1 of the recess, , the second part 211b of the first housing structure 211 and the second part 212b of the second housing structure 212, which have mutually symmetrical shapes, may form the second width w2 of the recess. . In one embodiment, the first portion 212a and the second portion 212b of the second housing structure 212 may have different distances from the folding axis A. The width of the recess is not limited to the example shown. In various embodiments, the recess may have a plurality of widths due to the shape of the sensor area 2122 or the asymmetrically shaped portion of the first housing structure 211 and the second housing structure 212.

In one embodiment, at least a portion of the first housing structure 211 and the second housing structure 212 may be formed of a metallic material or a non-metallic material having a selected level of rigidity to support the display 221 .

In one embodiment, the sensor area 2122 may be formed to have a predetermined area adjacent to one corner of the second housing structure 212. However, the arrangement, shape, and size of the sensor area 2122 are not limited to the illustrated example. For example, in other embodiments sensor area 2122 may be provided at another corner of second housing structure 212 or any area between the top and bottom corners. In one embodiment, components for performing various functions built into the electronic device 200 transmit electronics through the sensor area 2122 or through one or more openings provided in the sensor area 2122. It may be exposed to the front of the device 200. In various embodiments, components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver or proximity sensor, an illumination sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

In one embodiment, the first back cover 214 is disposed on one side of the folding axis on the back of the electronic device, may have, for example, a substantially rectangular periphery, and is attached to the first housing structure 211. The edges can be wrapped by Similarly, the second back cover 215 may be disposed on the other side of the folding axis on the back of the electronic device, and its edges may be wrapped by the second housing structure 212.

In one embodiment, the first rear cover 214 and the second rear cover 215 may have a substantially symmetrical shape about the folding axis (A axis). However, the first rear cover 214 and the second rear cover 215 do not necessarily have mutually symmetrical shapes, and in another embodiment, the electronic device 200 includes the first rear cover 214 and the second rear cover 215 of various shapes. It may include a second rear cover 215. In another embodiment, the first rear cover 214 may be formed integrally with the first housing structure 211, and the second rear cover 215 may be formed integrally with the second housing structure 212. there is.

In one embodiment, the first back cover 214, the second back cover 215, the first housing structure 211, and the second housing structure 212 are used to form various components of the electronic device 200 (e.g., A space in which a printed circuit board (printed circuit board, or battery) can be placed can be formed. In one embodiment, one or more components may be placed or visually exposed on the rear of the electronic device 200. For example, at least a portion of the sub-display 2215 may be visually exposed through the first rear area 2141 of the first rear cover 214. In another embodiment, one or more components or sensors may be visually exposed through the second rear area 2151 of the second rear cover 215. In various embodiments, the sensor may include a proximity sensor and/or a rear camera.

Referring to FIG. 2B, the hinge cover 213 is disposed between the first housing structure 211 and the second housing structure 212 and may be configured to cover the internal components (e.g., hinge structure). there is. In one embodiment, the hinge cover 213 is configured to connect the first housing structure 211 and the second housing structure 212 depending on the state (flat state or folded state) of the electronic device 200. ) may be obscured by part of or exposed to the outside.

For example, when the electronic device 200 is in an unfolded state as shown in FIG. 2A, the hinge cover 213 may not be exposed because it is covered by the first housing structure 211 and the second housing structure 212. there is. For example, as shown in FIG. 2B, when the electronic device 200 is in a folded state (e.g., fully folded state), the hinge cover 213 is connected to the first housing structure 211 and the second housing structure 211. It may be exposed to the outside between the housing structures 212. For example, when the first housing structure 211 and the second housing structure 212 are in an intermediate state folded with a certain angle, the hinge cover 213 is folded with a certain angle. A portion may be exposed to the outside between the structure 211 and the second housing structure 212. However, in this case, the exposed area may be less than in the fully folded state. In one embodiment, the hinge cover 213 may include a curved surface.

The display 221 may be placed in the space formed by the foldable housing 210 . For example, the display 221 is seated on a recess formed by the foldable housing 210 and may constitute most of the front of the electronic device 200.

Accordingly, the front of the electronic device 200 may include the display 221 and a partial area of the first housing structure 211 adjacent to the display 221 and a partial area of the second housing structure 212. And, the rear of the electronic device 200 includes a first rear cover 214, a partial area of the first housing structure 211 adjacent to the first rear cover 214, a second rear cover 215, and a second rear cover. It may include a portion of the second housing structure 212 adjacent to 215 .

The display 221 may refer to a display in which at least some areas can be transformed into a flat or curved surface. In one embodiment, the display 221 includes a folding area 2211, a first area 2212 disposed on one side (left side of the folding area 2211 shown in FIG. 2A) with respect to the folding area 2211, and the other side. It may include a second area 2213 disposed on the right side of the folding area 2211 shown in FIG. 2A.

The area division of the display 221 shown in FIG. 2A is exemplary, and the display 221 may be divided into a plurality of areas (for example, four or more or two) depending on the structure or function. For example, as shown in FIG. 2A, the area of the display 221 is divided by a folding area 2211 extending parallel to the y-axis or a folding axis (A-axis), or by another folding area (e.g., x-axis). The area of the display 221 may be divided based on a folding area (eg, a folding area parallel to the x-axis) or another folding axis (eg, a folding axis parallel to the x-axis).

The first area 2212 and the second area 2213 may have an overall symmetrical shape with the folding area 2211 as the center. However, the second area 2213, unlike the first area 2212, may include a notch (2214 in FIG. 2C) cut according to the presence of the sensor area 2122. The area may have a symmetrical shape with the first area 2212. In other words, the first region 2212 and the second region 2213 may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

Hereinafter, the operation and display 221 of the first housing structure 211 and the second housing structure 212 according to the state (e.g., flat state and folded state) of the electronic device 200. Each area is explained.

In one embodiment, when the electronic device 200 is in a flat state (e.g., Figure 2a), the first housing structure 211 and the second housing structure 212 form an angle of 180 degrees and face the same direction. It can be placed facing. The surface of the first area 2212 and the surface of the second area 2213 of the display 221 form an angle of 180 degrees to each other and may face the same direction (eg, the front direction of the electronic device). The folding area 2211 may form the same plane as the first area 2212 and the second area 2213.

In one embodiment, when the electronic device 200 is in a folded state (eg, Figure 2b), the first housing structure 211 and the second housing structure 212 may be arranged to face each other. The surface of the first area 2212 and the surface of the second area 2213 of the display 221 form a narrow angle (eg, between 0 degrees and 10 degrees) and may face each other. At least a portion of the folding area 2211 may be formed of a curved surface with a predetermined curvature.

In one embodiment, when the electronic device 200 is in a folded state (e.g., Figure 2b), the first housing structure 211 and the second housing structure 212 are at a certain angle to each other. ) can be placed. The surface of the first area 2212 and the surface of the second area 2213 of the display 221 may form an angle that is larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folding area 2211 may be made of a curved surface with a predetermined curvature, and the curvature at this time may be smaller than that in the folded state.

Figure 2C is an exploded perspective view of an electronic device according to one embodiment.

Referring to FIG. 2C, in one embodiment, the electronic device 200 includes a display unit 220, a bracket assembly 230, a substrate unit 240, a first housing structure 211, and a second housing structure 212. , may include a first rear cover 214 and a second rear cover 215. In this document, the display unit 220 may be referred to as a display module or display assembly.

The display unit 220 may include a display 221 and one or more plates or layers 222 on which the display 221 is mounted. In one embodiment, plate 222 may be disposed between display 221 and bracket assembly 230. The display 221 may be disposed on at least a portion of one surface of the plate 222 (eg, the upper surface with respect to FIG. 2C). The plate 222 may be formed in a shape corresponding to the display 221. For example, some areas of the plate 222 may be formed in a shape corresponding to the notch 2214 of the display 221.

The bracket assembly 230 includes a first bracket 231, a second bracket 232, a hinge structure (not shown) disposed between the first bracket 231 and the second bracket 232, and the hinge structure is visible from the outside. It may include a hinge cover 213 that covers the case, and a wiring member 233 (e.g., flexible circuit board (FPC), flexible printed circuit) crossing the first bracket 231 and the second bracket 232. .

In one embodiment, a bracket assembly 230 may be disposed between the plate 222 and the substrate 240. For example, the first bracket 231 may be disposed between the first area 2212 of the display 221 and the first substrate 241. The second bracket 232 may be disposed between the second area 2213 of the display 221 and the second substrate 242.

In one embodiment, the wiring member 233 and at least a portion of the hinge structure may be disposed inside the bracket assembly 230. The wiring member 233 may be disposed in a direction (eg, x-axis direction) crossing the first bracket 231 and the second bracket 232. The wiring member 233 may be disposed in a direction (e.g., x-axis direction) perpendicular to the folding axis (e.g., y-axis or folding axis A in FIG. 2A) of the folding area 2211 of the electronic device 200. there is.

As mentioned above, the substrate portion 240 may include a first substrate 241 disposed on the first bracket 231 side and a second substrate 242 disposed on the second bracket 232 side. there is. The first substrate 241 and the second substrate 242 include a bracket assembly 230, a first housing structure 211, a second housing structure 212, a first rear cover 214, and a second rear cover ( 215) can be placed inside the space formed by. Components for implementing various functions of the electronic device 200 may be mounted on the first substrate 241 and the second substrate 242.

The first housing structure 211 and the second housing structure 212 may be assembled to each other to be coupled to both sides of the bracket assembly 230 with the display unit 220 coupled to the bracket assembly 230. As will be described later, the first housing structure 211 and the second housing structure 212 may be coupled to the bracket assembly 230 by sliding on both sides of the bracket assembly 230 .

In one embodiment, the first housing structure 211 may include a first rotation support surface 2111, and the second housing structure 212 may include a second rotation support corresponding to the first rotation support surface 2111. It may include cotton (2121). The first rotation support surface 2111 and the second rotation support surface 2121 may include a curved surface corresponding to a curved surface included in the hinge cover 213.

In one embodiment, the first rotation support surface 2111 and the second rotation support surface 2121 hold the hinge cover 213 when the electronic device 200 is in an unfolded state (e.g., the electronic device in FIG. 2A). The hinge cover 213 may not be exposed to the rear of the electronic device 200 or may be minimally exposed. Meanwhile, the first rotation support surface 2111 and the second rotation support surface 2121 are curved surfaces included in the hinge cover 213 when the electronic device 200 is in a folded state (e.g., the electronic device in FIG. 2B). By rotating along , the hinge cover 213 can be maximally exposed to the rear of the electronic device 200.

One or more display components provided as at least part of the display module (221 in FIG. 2) generally use flexible materials to be bent or folded. In particular, the composite laminated structure arranged on the outside of the display module 221 is closely related to external shocks, such as direct contact with physical input elements (eg, hands, digital pens). The outer components of the display module 221 need to have impact resistance, but if the modulus of the material is increased or the thickness is increased, flexible movements such as bending or folding cannot be realized.

The electronic device (eg, display device) 200 according to one embodiment may include a composite laminated structure configured to not only improve impact resistance but also maintain flexible characteristics. Hereinafter, a display panel provided in the electronic device 200 according to an embodiment of the present document will be described, and at least some components of the display panel (for example, the first window (340 in FIG. 3)) will be described. The introduced composite laminated structure will be described with reference to the subsequent description and drawings.

3 is a cross-sectional view of a display module according to various embodiments.

Referring to FIG. 3, the display module (221 in FIG. 2) of the electronic device (200 in FIG. 2) includes a metal layer 360, a display panel 350, a first window 340 layer, and a second window 320. It may include at least one of a layer, an adhesive layer 330, or a protective layer 310.

In one embodiment, the adhesive layer 330 bonds at least two of the metal layer 360, the display panel 350, the first window 340 layer, the second window 320 layer, or the protective layer 310 to each other. You can do it. The adhesive layer 330 may be, for example, a pressure sensitive adhesive (PSA). The adhesive layer 330 may include, for example, at least one of optical clear adhesive (OCA), pressure sensitive adhesive (PSA), heat-reactive adhesive, general adhesive, or double-sided tape. Meanwhile, in this document, “adhesive layer 330” may be used interchangeably with “adhesive” or “adhesive material.” “Adhesive layer 330” refers to an adhesive or adhesive material as a layer element of a laminated structure, and “adhesive” or “adhesive material” refers to a component that bonds two or more components.

In one embodiment, the display panel 350 may be adhered to the first window 340 layer so that it is arranged below the first window 340 layer. The display panel 350 may be implemented as including, for example, a plurality of organic light emitting diodes (OLEDs), but is not limited thereto. For example, the display panel 350 may be implemented in various forms, such as a liquid crystal display (LCD) panel or a light emitting diode (Micro-LED) panel. In one embodiment, the display panel 350 may be bent, folded, or rolled by an external force, and this display panel 350 may be referred to as a flexible display panel 350.

In one embodiment, the first window 340 layer may be arranged on the display panel 350. The first window 340 layer is arranged on the display panel 350 to protect the display panel 350 from the outside. In one embodiment, the first window 340 layer may be bent, folded, or rolled to correspond to the display panel 350 being bent, folded, or rolled. The first window 340 layer operatively coupled to the flexible display panel 350 may be made of thick glass, but is not limited thereto. Meanwhile, in one embodiment, the first window 340 layer may be implemented with chemically hardened glass, and the means and/or methods of chemical hardening in this document are not limited to any means and/or methods.

In one embodiment, a second window 320 layer may be arranged above the first window 340 layer. The second window 320 layer may be combined with the first window 340 layer by an adhesive layer 330. The second window 320 layer may be made of the same or different material as the first window 340 layer. In one embodiment, the second window 320 layer may contain a polymer resin. The polymer resin may include, for example, PET (polyethylene terephthalate), but is not limited thereto. In one embodiment, the second window 320 layer is arranged on the upper side of the first window 340 layer to improve the impact resistance of the display module (221 in FIG. 2), and in particular, the second window 320 layer It is possible to prevent the first window 340 layer and the display panel 350 arranged on the lower side from being damaged.

In one embodiment, a protective layer 310 may be arranged on the second window 320 layer. The protective layer 310 includes, for example, a hard coating layer. The hardcoat layer has high strength and can protect one or more components underneath. In addition, the protective layer 310 can improve reliability by reducing distortion or lifting of the window part under harsh conditions such as high temperature or high humidity, and can also absorb external shocks. In one embodiment, the protective layer 310 may include at least a portion of a functional layer as well as a hard coating layer. The functional layer is at least one of an anti-finger coating layer, an anti-fouling coating layer, an anti-reflection coating layer, or an anti-glare coating layer. It can be.

In one embodiment, the metal layer 360 may be arranged below the display panel 350. The metal layer 360 may be at least one of SUS (steel use stainless) or a lattice layer including patterns such as openings and recesses.

Below, one or more types of composite laminated structures applied to the display module (221 in FIG. 2) of this document are disclosed. Here, the composite laminated structure is arranged in a position corresponding to the above-described first window 340 layer in FIG. 3, or has a second window 320 layer joined by the first window 340 layer and the adhesive layer 330. Can be arranged to replace integrally. Hereinafter, a composite laminated structure according to an embodiment of the present document will be described with reference to the drawings. For reference, composite laminate structure may be used interchangeably with the term “laminated bonded glass structure,” but the interchange does not limit the materials and/or ingredients of one or more components that make up the composite laminate structure.

Figure 4 is a cross-sectional view of a composite laminated structure 400 applied to a display device according to an embodiment.

In one embodiment, the composite laminate structure 400 may include a bending layer 410 and one or more unbending layers 420 and 430. In one embodiment, one or more unbending layers 420 and 430 may be arranged above and/or below the bending layer 410 . In one embodiment, the unbending layers 420 and 430 may be arranged in two stages below the bending layer 410, as shown in FIG. 4. However, it is not limited to this and may be arranged in various forms as shown in FIGS. 5 to 7.

In various embodiments of this document, one or more unbending layers 420 and 430 may be arranged on the upper and/or lower side of the bending layer 410, and the number of unbending layers 420 and 430 increases. As the thickness increases, the pen drop characteristics of the composite layered structure 400 may be improved, but it may be difficult to maintain the overall thickness of the composite layered structure 400 thin. Additionally, as the number of unbending layers 420 and 430 increases, the flexible characteristics of the composite stacked structure 400 decreases, making it impossible to implement a flexible display. The composite laminated structure 400 of this document discloses a laminated structure that can significantly improve pendrop characteristics while maintaining flexible characteristics.

Referring to FIG. 4(a), two unbending layers 420 and 430 may be arranged below the bending layer 410. Here, the area where the bending layer 410 is exposed, that is, the area not covered by the unbending layers 420 and 430, may be defined as a bending area, and the remaining area may be defined as an unbending area. Since the unbending layers 420 and 430 with high modulus are not arranged in the bending area, the composite laminated structure 400 can be easily bent. In contrast, the composite laminated structure 400 cannot be bent in the unbending area where one or more unbending layers 420 and 430 are arranged. That is, the composite laminated structure 400 provided in the display device according to various embodiments of this document may be understood as having a bending area and an unbending area defined by one or more unbending layers 420 and 430.

In one embodiment, the bending layer 410 and the unbending layers 420 and 430 may be coupled by an adhesive layer 440. The unbending layers 420 and 430 may be divided into a first unbending layer 420 and a second unbending layer 430 as the distance from the bending layer 410 increases. The first unbending layer 420 may be disposed to expose the bending layer 410 at a portion (first exposed portion 423) including the bending area of the composite laminated structure 400. Furthermore, the second unbending layer 430 may also be arranged to expose the bending layer 410 at a portion (second exposed portion 433) of the composite laminate structure 400. The first exposed portion 423 may have a smaller width than the second exposed portion 433. The second exposed portion 433 may be formed to at least partially include the first exposed portion 423 or may be formed to entirely include the first exposed portion 423 . As shown in FIG. 4(a), when the second exposed portion 433 is formed to entirely include the first exposed portion 423, the second exposed portion 433 is larger than the first exposed portion 423. If formed to a larger width, the adhesive area between the composite laminate structure 400 and components located below it can be further increased.

In one embodiment, one or more unbending layer(s) 420 and 430 laminated on the bending layer 410 are symmetrically or asymmetrically located on the left or right side with each exposed portion 423 and 433 in between. can be formed. In one embodiment, the asymmetrically formed unbending layer(s) 420 and 430 may be made of materials having different moduli or hardness. The unbending layer(s) 420 and 430 may be configured in an asymmetric form to satisfy predetermined bending conditions (eg, location of the bending axis).

In one embodiment, the width of the first exposed portion 423 and the second exposed portion 433 may be designed based on the width of the bending area.

Meanwhile, in one embodiment, the first unbending layer 420 includes two or more unbending sheet(s) 421 and 422, and the second unbending layer 430 also includes two or more unbending sheet(s). Includes (431, 432). The first unbending sheets 421 and 422 may be spaced apart at a predetermined interval with the first exposed portion 423 therebetween, and the second unbending sheets 431 and 432 may be spaced apart from each other at a predetermined interval with the first exposed portion 423 therebetween. ) may be spaced apart at a predetermined interval. In one embodiment, the first unbending sheets 421 and 422 may have the same material and thickness. In one embodiment, the second unbending sheets 431 and 432 may have the same material and thickness.

Meanwhile, in one embodiment, two or more unbending sheets facing each other around the bending area may have different materials or thicknesses. The unbending sheets 421 and 431 on one side may be made of a different material from the unbending sheets 422 and 432 on the other side, but the different materials may cause mechanical properties (e.g., pen drop characteristics, It can be made to have GIT (Glass Impact Test) characteristics. Accordingly, in one embodiment, unbending sheets made of different materials may be formed to have different thicknesses so that mechanical properties for each region are maintained equally.

In one embodiment, the first unbending layer 420 and the second unbending layer 430 may have the same or different thickness compared to each other. In one embodiment, the bending layer 410, the first unbending layer 420, and/or the second unbending layer 430 may be implemented as thin glass, but the present invention is not limited thereto.

In one embodiment, the composite laminate structure 400 may be bent (preferably, folded) in one direction as shown in (b) of FIG. 4. One or more unbending layers stacked on the bending layer 410 may be maintained parallel to the bending layer 410 regardless of whether the bending layer 410 is bent. That is, the unbending layers 420 and 430 are maintained parallel to the bending layer 410, and as the bending layer 410 and the adhesive layer 440 are bent, the composite laminate structure 400 can be bent as a whole. In one embodiment, the bending layer 410 may at least partially form a predetermined curvature in a bent state. The predetermined curvature may have a curvature of 1.5R or less. Here, the bending state can be understood as a folding state, in which the bending layer 410 is bent to have a predetermined curvature, and the unbending layers 420 and 430 remain parallel to the bending layer 410. This refers to a state in which the composite laminated structure 400 is bending.

In one embodiment of this document, the direction in which the unbending layers 420 and 430 are stacked may be determined based on the direction in which the composite stacked structure 400 is bent. For example, when the composite laminated structure 400 is bent toward the top as shown in (b) of FIG. 4, the unbending layer may be provided toward the bottom. For another example, when the composite laminate structure 400 is bent toward the bottom, the unbending layer may be provided toward the top. In other words, the unbending layer may be arranged or stacked in a direction opposite to the direction in which the composite laminate structure 400 is bent (or folded). However, it is not limited to this, and in some embodiments of this document, the unbending layers 420 and 430 are not only in the direction opposite to the direction in which the composite laminate structure 400 is bent (or folded), but also in the composite laminate structure ( 400) may be arranged or stacked in a bending (or folding) direction.

In one embodiment of this document, the bending layer 410 and the unbending layer 420 and 430 are manufactured under different chemical strengthening conditions and have different strengths. Here, based on different chemical strengthening conditions, the bending layer 410 and the unbending layers 420 and 430 may have different detailed result values such as DoL, CS, and CSk. In one embodiment, the bending layer 410 may be bent at 1.5R or less, and in this case, the bending layer 410 may be made of a material with excellent bending characteristics. For example, the bending layer 410 may be made of a soft glass material with excellent bending properties, but is not limited thereto and may also be made of a soft plastic material with excellent bending properties. In other words, the bending layer 410 must have low hardness and good flexibility, and the unbending layer laminated on the upper and/or lower side must have high hardness. , flexibility may not be required.

In one embodiment, the bending layer 410 and/or the unbending layers 420 and 430 are made of polyimide (PI), polyethylene (PET), polyurethane (PU), cellulose triacetate (TAC), and/or ultra thin (UTG). glass). However, it is not limited to this. In another embodiment, the bending layer 410 and/or the unbending layers 420 and 430 are made of glass, polycarbonate (PC) + poly methyl methacrylate (PMMA) combination glass, ceramic, hardback crystal, sapphire crystal, It may contain at least one of mineral glass and gorilla glass as a material.

Glass/plastic/acrylic has a modulus of 6 and is weak against scratches but does not break easily. Mineral glass has a modulus of 6, is low in price, and is convenient to manufacture. Hardvex crystal has a modulus of 8 and is clear and transparent. Sapphire crystal has a modulus of 9 and is resistant to scratches but weak to impacts. Gorilla Glass has a modulus of 9 and is lightweight and inexpensive to manufacture.

In one embodiment, at least some of the unbending layers 420 and 430 may have a modulus that is the same as, greater than, or smaller than that of the bending layer 410 . In one embodiment, the two or more unbending layers 420 and 430 may include a first unbending layer having a first modulus and a second unbending layer having a second modulus different from the first modulus. In one embodiment, at least one of the first modulus and the second modulus may have a different modulus than the bending layer. In one embodiment, the first unbending layer may be bonded to the upper side of the bending layer, and the second unbending layer may be bonded to the lower side of the bending layer. In one embodiment, the first unbending layer may be bonded to the upper side of the bending layer, and the second unbending layer may be bonded to the upper side of the first unbending layer. In one embodiment, the first unbending layer may be bonded to the lower side of the bending layer, and the second unbending layer may be bonded to the lower side of the first unbending layer.

Referring back to FIG. 4 , in example embodiments, unbending layers 420 and 430 may have the same or different modulus as bending layer 410 . For example, the unbending layers 420 and 430 may have a greater modulus than the bending layer 410 . For example, the unbending layers 420 and 430 may have a smaller modulus than the bending layer 410 .

In an example embodiment, the unbending layers 420 and 430 may have the same or different moduli. That is, the composite laminate structure 400 may at least partially include an unbending layer with a high modulus, and at other portions may include an unbending layer with a relatively low modulus.

In an example embodiment, the unbending layers 420 and 430 may have the same or different moduli depending on the stacking order. In one embodiment, the modulus of the unbending layer may be the same as, greater than, or smaller than the modulus of the bending layer and/or the pre-laminated unbending layer as it is stacked further away from the bending layer 410 . For example, when the first-stage unbending layer 420 bonded to the bending layer 410 has the same modulus as the bending layer 410, the second-stage unbending layer bonded to the first-stage unbending layer 420 430 may have a modulus that is the same as, greater than, or smaller than that of the first-stage unbending layer 420. For example, when the first-stage unbending layer 420 bonded to the bending layer 410 has a greater modulus than the bending layer 410, the second-stage unbending layer bonded to the first-stage unbending layer 420 The layer 430 may have a modulus equal to or greater than that of the first-stage unbending layer 420. For example, when the first-stage unbending layer 420 bonded to the bending layer 410 has a smaller modulus than the bending layer 410, the second-stage unbending layer bonded to the first-stage unbending layer 420 The layer 430 may have a modulus that is the same as or smaller than that of the first-stage unbending layer 420.

In this way, the embodiment of providing the unbending layer in multiple layers is not limited to the structure shown in FIG. 4, and can be equally applied to all embodiments of this document including two or more unbending layers. For example, when two or more unbending layers are applied to one side of the bending layer as shown in FIGS. 11 and 12, the unbending layers are the same as or different from the bending layer, as illustratively described above with reference to FIG. 4. They may have a modulus, or they may have the same or different moduli. For example, as shown in FIG. 14, even when unbending layers are bonded to the upper and lower sides of the bending layer, each unbending layer may have a modulus that is the same as or different from that of the bending layer. For example, as shown in Figures 14 and 15, when two types of adhesives having different moduli are used, the unbending layers may also be different from each other or may be arranged to have a different modulus from the bending layer. .

Meanwhile, in one embodiment of this document, the adhesive layer 440 that combines the bending layer 410 and one or more unbending layers 420 and 430 is made of an optically clear adhesive (OCA) or an optically clear resin (OCR) polymer material. It may contain. Here, the OCA polymer material and the OCR polymer material may be filled into the exposed portion provided in one or more unbending layers through a roller, compression, or vacuum method. In one embodiment, the adhesive layer 440 may be made of a material having an optical refractive index that is the same as or adjacent to the bending layer 410 and/or the unbending layers 420 and 430. Furthermore, in one embodiment, the OCR polymer material may be made of a mixture of acrylic, silicone, and urethane coating solutions with the same refractive index.

The composite laminated structure 400 provided in an electronic device according to an embodiment of this document may be designed in various forms in addition to the form shown in FIG. 4, which will be described below with reference to FIGS. 5 to 7.

Referring to Figures 5(a) and 5(b), a single unbending layer 520 may be arranged below the bending layer 510. Here, the bending layer 510 and the unbending layer 520 may be understood to correspond to the bending layer 510 and the unbending layer 520 described above with reference to FIG. 4 .

In one embodiment, the single unbending layer 520 may be joined to the bending layer 510 by an adhesive layer. The bending layer 510 has an exposed portion 523 that is at least partially exposed. The exposed portion 523 may be filled with OCA polymer material or OCR polymer material. The single unbending layer 520 may be arranged on a side opposite to the direction in which the composite laminate structure 500 is bent. For example, when the composite laminate structure 500 is bent upward, the single unbending layer 520 may be arranged below the bending layer 510. The single bending layer 510 may be stacked in a direction opposite to the bending direction so as not to interfere with the bending movement of the composite laminated structure 500.

In one embodiment, the single unbending layer 520 may include unbending sheets 521 and 522. The unbending sheets 521 and 522 may be arranged to be spaced apart by a predetermined distance with the exposed portion 523 therebetween.

In one embodiment, as the composite laminate structure 500 is bent, a curvature may be formed at least partially in the bending layer 510. In the remaining portion excluding the curved portion, the bending layer 510 may be maintained flat. In the bending state, the unbending layer 520 may maintain a state parallel to the bending layer 510. Here, bending may be used interchangeably with folding. In this way, process difficulty can be improved by replacing the plurality of unbending layers 520 with a single bending layer 510.

Referring to Figures 6(a) and 6(b), one or more unbending layers 620 and 630 may be arranged on the upper and lower sides of the bending layer 610, respectively. Here, the bending layer 610 and the unbending layers 620 and 630 may be understood to correspond to the bending layer and the unbending layer described above with reference to FIG. 4 .

In one embodiment, the upper unbending layer 620 and the lower unbending layer 630 may be coupled to the bending layer 610 by an adhesive layer. The upper unbending layer 620 may include an upper exposed portion 623 that at least partially exposes the upper side of the bending layer 610. The lower unbending layer 630 may include a lower exposed portion 633 that at least partially exposes the lower side of the bending layer 610 . The upper exposed portion 623 and the lower exposed portion 633 may be filled with an OCA polymer material or an OCR polymer material. The upper exposed portion 623 and the lower exposed portion 633 may have the same or different widths. As such, in one embodiment, the composite laminate structure 600 not only includes one or more unbending layers 620 and 630 on the side opposite to the bending direction, but also includes one or more unbending layers 620 on the side corresponding to the bending direction. , 630). Here, bending may be used interchangeably with folding.

Figure 7 is a diagram for exemplarily explaining the laminated structure of various composite laminated structures.

Referring to (a) of FIG. 7, the composite laminate structure may include a bending layer 710a and single unbending layers 721a and 722a. The composite layered structure may be understood to correspond to the composite layered structure of FIG. 5 .

Referring to (b) of FIG. 7, the composite laminated structure may include a bending layer 710b and two unbending layers 721b, 722b, 731b, and 732b. The composite layered structure may be understood to correspond to the composite layered structure of FIG. 4.

Referring to (c) of FIG. 7, the composite laminated structure may include a bending layer and two unbending layers (721c, 722c, 731c, and 732c). Here, the unbending layer may be laminated in a direction opposite to the bending direction. In the composite laminate structure shown in (c) of FIG. 7, unlike the composite laminate structure shown in (b) of FIG. 7, the first exposed portion 723c is formed with a larger width than the second exposed portion 733c. Accordingly, the first exposed portion 723c may at least partially include the second exposed portion 733c or may completely include the second exposed portion 733c.

Referring to (d) of FIG. 7, the composite laminated structure may include a bending layer 710d and three unbending layers 721d, 722d, 731d, 732d, 741d, and 742d. Here, the unbending layers 721d, 722d, 731d, 732d, 741d, and 742d may be stacked on the side opposite to the bending direction. The composite laminate structure shown in (d) of FIG. 7 additionally includes one unbending layer (741d, 742d) compared to the composite laminate structure shown in (c) of FIG. 7. Based on the bending layer 710d, downwards may be called first unbending layers 721d and 722d, second unbending layers 731d and 732d, and third unbending layers 741d and 742d, respectively. The first unbending layers (721d, 722d) are the first exposed portion (732d), the second unbending layers (731d, 732d) are the second exposed portion (733d), and the third unbending layers (741d, 742d) are the first exposed portion (732d). 3 An exposed portion 743d can be formed.

In one embodiment, the third exposed portion 743d may have a larger width than the first exposed portion 723d and the second exposed portion 733d, and the second exposed portion 733d may have a width greater than that of the first exposed portion 723d and the second exposed portion 733d. 723d) can have a larger width. Accordingly, the third exposed portion 743d may at least partially include the first exposed portion 723d and the second exposed portion, or may entirely include the first exposed portion and the second exposed portion. The second exposed portion 733d may at least partially include the first exposed portion 723d or may completely include the first exposed portion 723d. That is, in one embodiment, the unbending layer may be arranged so that the width of the exposed portion increases as the distance from the bending layer 710d increases.

Referring to (e) of FIG. 7, the composite laminated structure may include a bending layer 710e and two unbending layers 721e, 722e, 731e, and 732e. The composite laminate structure shown in (e) of FIG. 7 may be understood to correspond to the composite laminate structure of FIG. 6. However, the present invention is not limited to this, and an additional unbending layer may be further laminated on the upper and/or lower side of the composite laminated structure shown in (e) of FIG. 7 . More specifically, an additional unbending layer having the same or different width of the exposed portion may be laminated outside the outermost unbending layer. The additional unbending layer may be arranged in the same manner as the arrangement of the unbending layer laminated on the outermost side of the composite laminated structure shown in FIG. 7 (a) or FIG. 7 (b).

Referring to (f) of FIG. 7, the composite laminated structure may include a bending layer 710f and four unbending layers 721f, 722f, 731f, 732f, 741f, 742f, 751f, and 752f. Here, the unbending layers 721f, 722f, 731f, 732f, 741f, 742f, 751f, and 752f may be laminated not only on one side opposite to the bending direction, but also on the other side corresponding to the bending direction. In one embodiment, four unbending layers 721f, 722f, 731f, 732f, 741f, 742f, 751f, and 752f may be stacked in equal numbers on one side and the other side of the bending layer 710f. As such, in various embodiments of this document, the same number of unbending layers (721f, 722f, 731f, 732f, 741f, 742f, 751f, 752f) may be symmetrically arranged on the upper and lower sides of the bending layer. Here, the number of one or more unbending layers arranged on the upper and lower sides of the bending layer 710f may be changed depending on the thickness and modulus conditions of the composite laminated structure. Meanwhile, this method of arranging the unbending layers and controlling the number of unbending layers can also be applied to the composite laminated structure described later with reference to FIGS. 9 to 12.

In one embodiment of this document described with reference to (a) to (f) of FIGS. 7, bending may be understood as folding. In other words, the composite laminated structure described with reference to (a) to (f) of FIGS. 7 can be used to implement a foldable display.

Below, a cross-sectional view of a composite laminated structure applied to an electronic device according to an embodiment of this document and its use will be described. The composite laminated structure described above with reference to FIGS. 4 to 7 included an exposed portion in at least a portion of the unbending layer so that the unbending layer was divided into unbending sheets. Accordingly, the composite laminated structure could be folded through a bending area corresponding to or included in the exposed portion, but could not be rolled because an unbending layer was provided in the remaining area excluding the bending area. Below, a rollable composite laminate structure will be described.

In various embodiments of this document, the electronic device is not limited to having a foldable display, and the display may be replaced with a rollable display. More specifically, the display may be implemented as a rollable display device that can accommodate at least a portion of the display inside the housing.

Figures 8 and 9 are diagrams for explaining another cross-sectional view and rolling operation of a composite laminated structure.

Referring to (a) of FIG. 8, in one embodiment, the composite laminate structure may include a bending layer 810 and a single unbending layer 820. The single unbending layer 820 may be coupled to the upper or lower side of the bending layer 810. The single unbending layer 820 and the bending layer 810 may be combined by an adhesive layer 840. In other words, the adhesive layer 840 may be positioned between the single unbending layer 820 and the bending layer 810. Meanwhile, the adhesive layer 840 is formed between the single unbending layer 820 and the bending layer 810, as well as surrounding the entire upper side of the bending layer 810 and the remaining surface of the unbending layer 820. It may be filled on the unbending layer 820. Meanwhile, the bending layer 810 and the unbending layer 820 may be understood to correspond to the bending layer 810 and the unbending layer 820 described with reference to FIGS. 4, 11, and 12.

Referring to (a) of FIG. 9, in one embodiment, the composite laminate structure may include a bending layer 910 and two unbending layers 920 and 930. One of the two unbending layers 920 and 930 may be coupled to the upper side of the bending layer 910, and the other may be coupled to the lower side of the bending layer 910. The unbending layer coupled to the upper side may be referred to as the upper unbending layer 920, and the unbending layer coupled to the lower side may be referred to as the lower unbending layer 930. The upper unbending layer 920 and the lower unbending layer 930 may be arranged to have the same or different lengths. Meanwhile, the bending layer 910 and the unbending layers 920 and 930 can be understood to correspond to the bending layer and unbending layer described with reference to FIGS. 4, 11, and 12.

In one embodiment, the composite laminate structure may be rolled in one direction as shown in Figures 8(b) and 9(b). One or more unbending layers (820, 920, 930) stacked on the bending layers (810, 910) may be maintained parallel to the bending layers (810, 910) regardless of whether the bending layers (810, 910) are bent. . That is, the unbending layers 820, 920, and 930 are maintained parallel to the bending layers 810 and 910, and as the bending layers 810 and 910 and the adhesive layer are bent, the composite laminate structure can be rolled as a whole.

In one embodiment of this document, the direction in which the unbending layers 820, 920, and 930 are stacked may be determined based on the direction in which the composite laminate structure is rolled. For example, when the composite laminated structure is rolled downward as shown in (b) of FIG. 8 and (b) of FIG. 9, the unbending layers 820, 920, and 930 may be provided toward the upper side. . For another example, when the composite laminated structure is rolled toward the top, the unbending layers 820, 920, and 930 may be provided toward the bottom. In other words, the unbending layers 820, 920, and 930 may be arranged or stacked in a direction opposite to the direction in which the composite laminated structure is rolled. However, it is not limited to this, and in some embodiments of this document, the unbending layer may be arranged or laminated not only in the direction opposite to the direction in which the composite laminate structure is rolled, but also in the direction in which the composite laminate structure is rolled.

In one embodiment of this document, the bending layer has rollable characteristics, and this bending layer can be made of a material with particularly excellent flexibility. For example, the bending layer may be made of a soft glass material with excellent flexibility, but is not limited thereto and may also be made of a soft plastic material with excellent flexibility. In other words, the bending layer must have low hardness and good flexibility, and the unbending layer laminated on the upper and/or lower side must have high hardness, but not flexibility. It may not be required.

The composite laminated structure provided in the electronic device according to an embodiment of this document may be designed in various forms in addition to those shown in FIGS. 8 and 9, which will be described below with reference to FIG. 12.

The composite laminate structure shown in (a) of FIG. 10 may include a bending layer 1010a, a single unbending layer 1020a, and an adhesive layer 1050 that bonds the bending layer 1010 and the single unbending layer 1020a. You can. Figure 10(a) may be understood to correspond to the composite laminate structure of Figure 8(a).

The composite laminate structure shown in (b) of FIG. 10 may include a bending layer 1010b, a first unbending layer 1020b, a second unbending layer 1030b, and an adhesive layer 1050 that connects them. Figure 10(b) may be understood to correspond to the composite laminate structure of Figure 8.

The composite laminate structure shown in (c) of FIG. 10 may include a bending layer 1010c, a first unbending layer 1020c, a second unbending layer 1030c, and an adhesive layer 1050 that connects them. The composite laminate structure shown in (c) of FIG. 10, unlike that shown in (b) of FIG. 10, has a first unbending layer (1020c) and a second unbending layer (1030c) below the bending layer (1010c). ) can be stacked.

The composite laminate structure shown in (d) of FIG. 10 may include a bending layer 1010d, a first unbending layer 1020d, a second unbending layer 1030d, and an adhesive layer 1050 connecting them. The composite laminate structure shown in (d) of FIG. 10 may be understood to correspond to the composite laminate structure of FIG. 9.

The composite laminated structure shown in (e) of FIG. 10 includes a bending layer 1010e, a first unbending layer 1020e, a second unbending layer 1030e, a third unbending layer 1040e, and an adhesive layer connecting them. It may include (1050). The composite laminated structure of FIG. 10(e) may further include a third unbending layer 1040e additionally arranged at the uppermost side compared to that shown in FIG. 10(b). The third unbending layer 1040e may be arranged to have a smaller width than the second unbending layer 1030e.

According to an embodiment of the present document, not only the lamination or arrangement method of the composite laminated structure, but also the shape of the edges of the unbending layers constituting the laminated structure and their lamination angles may also be important considerations. When one or more unbending layers are stacked on a bending layer, a boundary between a bending layer and an unbending layer, or a boundary between an unbending layer and another unbending layer may be visible. This boundary is recognized as a thin line when viewed by the user, and can be a factor that significantly reduces the quality of the display module.

11 and 12 are cross-sectional views for explaining detailed structural features of a composite laminated structure applied to an electronic device according to an embodiment of this document.

In one embodiment, the composite laminate structures 1100 and 1200 include bending layers 1110 and 1210 and one or more unbending layers 1120, 1130, 1220, and 1230. In one embodiment, one or more unbending layers 1120, 1130, 1220, and 1230 may be arranged above and/or below the bending layers 1110 and 1210. In one embodiment, the unbending layers 1120, 1130, 1220, and 1230 may be arranged in two stages on top of the bending layers 1110 and 1210, as shown in FIGS. 11 and 12. However, it is not limited to this and may be arranged in various forms as shown in FIGS. 4 to 10.

In various embodiments of the present document, one or more bending layers 1110 and 1210 may be arranged on the upper and/or lower sides of the unbending layers 1120, 1130, 1220, and 1230, and the unbending layers 1120 and As the number of (1130, 1220, 1230) increases, the pen drop characteristics of the composite laminated structures (1100, 1200) may be improved, but it may be difficult to maintain the overall thickness thin. Additionally, as the number of unbending layers (1120, 1130, 1220, and 1230) increases, the flexible characteristics of the composite stacked structures (1100, 1200) decrease, making it impossible to implement a flexible display. The composite laminated structures 1100 and 1200 of this document disclose a laminated structure that can significantly improve pen drop characteristics while maintaining flexible characteristics.

In one embodiment, two unbending layers (1120, 1130, 1220, 1230) may be arranged on the upper side of the bending layers (1110, 1210), and the bending layers (1110, 1210) and one or more unbending layers (1120) , 1130, 1220, 1230) may be joined by adhesives 1140, 1240. Two or more unbending layers 1120, 1130, 1220, and 1230 may be bonded to the bending layers 1110 and 1210 using a second adhesive while being bonded to each other using a first adhesive. Here, the first adhesive and the second adhesive may contain the same material and have the same properties. Examples using different types of adhesives will be described later with reference to FIG. 16.

In one embodiment, the area where the bending layers 1110 and 1210 are exposed, that is, the area not covered by the unbending layers 1120, 1130, 1220 and 1230, is a bending area BA (e.g., a folding area or a rolling area) and the remaining areas may be defined as an unbending area (FA) (e.g., an unfolding area, an unrolling area, or a flat area). In one embodiment, the composite laminate structures 1100 and 1200 have unbending layers 1120, 1130, 1220, and 1230 arranged above and/or below the bending layers 1110 and 1210 in the bending area BA. Otherwise, the bending layers 1110 and 1210 can be bent by external force, but cannot be bent in the unbending area FA. That is, it can be understood that the composite laminate structures 1100 and 1200 according to one embodiment can be bent using the bending area BA provided on one side.

In one embodiment, the bending layers 1110 and 1210 and the unbending layers 1120, 1130, 1220, and 1230 may be coupled by adhesive layers 1140 and 1240. The unbending layers (1120, 1130, 1220, 1230) can be divided into a first unbending layer (1120, 1220) and a second unbending layer (1130, 1230) as the unbending layers (1120, 1130, 1220, 1230) become farther away from the bending layer (1110, 1210). .

In one embodiment, the first unbending layer (1120, 1220) is a bending layer ( 1110, 1210) may be arranged to expose. Furthermore, the second unbending layers 1130 and 1230 are also unbended in other parts (second exposed portions 1133 and 1233) including the bending area BA of the composite laminate structures 1100 and 1200. ) can be arranged to expose.

In one embodiment, the first exposed portions 1123 and 1223 may have a smaller width than the second exposed portions 1133 and 1233. The second exposed portions 1133 and 1223 may be formed to at least partially include the first exposed portions 1123 or may be formed to entirely include the first exposed portions 1123 and 1223.

In various embodiments, curved portions 1121 and 1131 or inclined portions 1221 and 1231 may be formed at the edges of the first unbending layers 1120 and 1220 and the second unbending layers 1130 and 1230. In one embodiment, the curved portions 1121 and 1131 or the inclined portions 1221 and 1231 may be formed at the edge of the side facing the bending area BA. In one embodiment, the curved portions 1121 and 1131 or the inclined portions 1221 and 1231 may not be formed on the edge of the side opposite to the bending area BA.

In one embodiment, as shown in FIG. 11, the first unbending layer 1120 and the second unbending layer 1110 may include a first curved portion 1121 and a second curved portion 1111, respectively. You can. The first curved portion 1121 and the second curved portion 1111 may have the same or different curvatures.

In one embodiment, the first curved portion 1121 and/or the second curved portion 1111 may be formed to have a curvature of at least 0.05R or 0.1R. According to the present inventor's experiments, it was confirmed that boundary visibility is significantly improved at the above curvature.

In one embodiment, the first curved portion 1121 and/or the second curved portion 1111 of the unbending layers 1120 and 1130 are located on the upper side and/or of the bending layer 1110. Alternatively, it may be formed in advance before being laminated on the lower side. The first curved portion 1121 and/or the second curved portion 1111 of the unbending layers 1120 and 1130 may be formed by dry etching, wet etching, or polishing.

In one embodiment, a length difference 1122 may be formed between the first unbending layer 1120 and the second unbending layer 1130. Due to the length difference 1122, the first unbending layer 1120 and the second unbending layer 1130 may form a step. In one embodiment, the step may be formed at a predetermined angle. In one embodiment, the predetermined angle may be formed as a predetermined acute angle inclined toward the outside of the composite laminate structure based on the normal line of the bending layer in the unbended state, but is not limited thereto. The step will be described in detail later with reference to FIG. 13.

In one embodiment, as shown in FIG. 12, the first unbending layer 1220 and the second unbending layer 1230 may include a first inclined portion 1221 and a second inclined portion 1231, respectively. You can. Here, the first slope 1221 and the second slope 1231 are shown as having the same slope, but this is not limited to this, and the first slope 1221 and the second slope 1231 have different slopes. can also be formed.

Referring to FIG. 13, in one embodiment, the unbending layers 1320 and 1330 (more specifically, the unbending sheets forming the unbending layers 1320 and 1330) form a predetermined angle 1350 and are bent. It may be laminated on the top or bottom of 1310. That is, in one embodiment, the unbending layers 1320 and 1330 may be stacked to form a step forming a predetermined angle 1350.

Figure 13 illustrates a foldable composite laminate structure by way of example, but is not limited thereto. The exemplary embodiment shown in FIG. 13 can also be applied to a rollable composite laminate structure by excluding either the unbending sheets 1322 and 1332 on one side or the unbending sheets 1321 and 1331 on the other side. there is. The location (or side) of the excluded unbending sheets may correspond to the direction in which the rolling operation takes place.

In the case of a foldable composite laminate structure, exemplarily, the first unbending layer 1320 includes first unbending sheets 1321 and 1322, and the second unbending layer 1330 includes a second unbending sheet ( 1331, 1332). When the lengths of the first unbending sheets 1321 and 1322 and the second unbending sheets 1331 and 1332 are different, the edges 1321e and 1322e of the first unbending sheets 1321 and 1322 and the second unbending The edges 1331e and 1332e of the sheets 1331 and 1332 may form a predetermined inclination angle 1350. In the unbending (unfolded) state, based on the normal to the bending layer 1310, the edges 1321e and 1322e of the first unbending sheets 1321 and 1322 and the edges of the second unbending sheets 1331 and 1332. By connecting (1331e, 1332e) with a line, a predetermined tilt angle can be formed that is inclined toward the edge (left or right). As a predetermined slope is formed in this way, visibility of the boundary between the unbending layers 1320 and 1330 or the boundary between the bending layer 1310 and the unbending layers 1320 and 1330 may be improved.

In the case of a rollable composite laminated structure, for example, when the lengths of the first unbending layer 1320 and the second unbending layer 1330 are different, the edges 1321e and 1322e of the first unbending layer 1320 and the edges 1331e and 1332e of the second unbending layer 1330 may form a predetermined slope. In the unrolled state, based on the normal line to the bending layer 1310, the edges 1321e and 1322e of the first unbending layer 1320 and the edges 1331e and 1332e of the second unbending layer 1330 are drawn as a line. When connected, a predetermined inclination angle 1350 inclined toward the edge (left or right) can be formed. As the predetermined slope 1350 is formed in this way, visibility of the boundary between the unbending layers 1320 and 1330 or the boundary between the bending layer 1310 and the unbending layers 1320 and 1330 can be improved. . Meanwhile, in the case of a rollable composite laminated structure, the inclination angle may be formed to be inclined in a direction opposite to the rolling area.

Referring again to FIG. 13, the inclination angle may be illustratively formed by a virtual reference line and a virtual inclination line. The virtual reference line is a tangent to the edges 1321e and 1322e of the first unbending layer 1320 and may be determined as a line perpendicular to the bending layer 1310. The virtual reference line is a first point (1310p) through which the bending layer 1310 and the normal line pass, and a second point (1321p) located at the edges (1321e, 1322e) of the first unbending layer 1320 in contact with the normal line. It can be done to connect. The virtual inclined line refers to the line at the position (1331p) where the virtual reference line contacts the second unbending layer 1330 as the virtual reference line is rotated based on the first point (1310p), and the virtual inclined line The line may be formed to pass through the third point 1331p located at the edges 1321e, 1322e, 1331e, and 1332e of the second unbending layer 1330.

In one embodiment, the tilt angle may range from 0 degrees to 20 degrees, or from 1 degree to 10 degrees. According to experiments, it was confirmed that the visibility of the boundary was significantly improved in the above range.

14 and 15 exemplarily show composite laminate structures using two types of adhesives. 14 and 15 illustrate a foldable composite laminate structure, but the present invention is not limited thereto, and the same two types of adhesives may be used for the rollable composite laminate structure. In the case of a rollable composite laminated structure, the unbending layer is laminated on one side, and the unbending layer is not laminated on the other side where the rolling operation is to be performed, so it can be understood that the unbending layer on the other side is excluded.

Referring to FIG. 14, the composite laminate structure may include a bending layer 1410, a first unbending layer 1420, and a second unbending layer 1430, and a bending layer 1410 and a first unbending layer 1430. Layer 1420 and second unbending layer 1430 may be joined by an adhesive layer. In one embodiment, the first unbending layer 1420 (or the first unbending sheets 1421 and 1422) is coupled to the upper side of the bending layer 1410, and the second unbending layer 1430 (or the first unbending layer 1420) is coupled to the upper side of the bending layer 1410. 2 unbending sheets (1431, 1432) may be coupled to the lower side of the bending layer (1410). Accordingly, the first exposed portion 1423 is formed on the upper side of the bending layer 1410 by the first unbending layer 1420, and on the lower side of the bending layer 1410 by the second unbending layer 1430. A second exposed portion 1433 may be formed.

In one embodiment, the adhesive layer may be made of a material having the same optical refractive index as the bending layer 1410, the first unbending layer 1420, and/or the second unbending layer 1430. In one embodiment, the adhesive layer may include a first adhesive layer 1442 and a second adhesive layer 1441. The first adhesive layer 1442 is arranged between the bending layer 1410 and the first unbending layer 1420 to couple them, and the second adhesive layer 1441 is arranged between the bending layer 1410 and the second unbending layer ( 1430) are arranged between them to join them. Furthermore, the first adhesive layer 1442 and the second adhesive layer 1441 cover the remaining surfaces of the first unbending layer 1420 and the second unbending layer 1430 and the exposed portion provided in the bending layer 1410. can be filled.

In one embodiment, the first adhesive layer 1442 may be arranged on the upper side of the bending layer 1410, and the second adhesive layer 1441 may be arranged on the lower side of the bending layer 1410. Accordingly, the first adhesive layer 1442 is filled in the first exposed portion 1423 of the bending layer 1410, and the second adhesive layer 1441 is filled in the second exposed portion 1433 of the bending layer 1410. You can. In one embodiment, the first adhesive layer 1442 may be made of a material with a higher modulus than the second adhesive layer 1441. That is, the first adhesive layer 1442 may have a higher modulus than the second adhesive layer 1441. Here, the upper side of the bending layer 1410 refers to the outer direction of the housing from the overall perspective of the display module. That is, the first adhesive layer 1442 has a higher modulus than the second adhesive layer 1441, so that the external impact resistance of the display module can be improved.

Referring to FIG. 15, the composite laminate structure may include a bending layer 1510, a first unbending layer 1520, and a second unbending layer 1530, and a bending layer 1510 and a first unbending layer. (1520), the second unbending layer 1530 may be joined by an adhesive layer. In one embodiment, the first unbending layer 1520 (or the first unbending sheets 1521 and 1522) is coupled to one side of the bending layer 1510, and the second unbending layer 1530 (or The second unbending sheets 1531 and 1532 may be coupled to one side of the first unbending layer 1520. Here, one side of the bending layer 1510 and one side of the first unbending layer 1520 are oriented in the same direction.

In one embodiment, the first adhesive layer 1542 is attached to the first exposed part 1523 by the first unbending layer 1520, and the second exposed part 1533 by the second unbending layer 1530 is attached to the first adhesive layer 1542. Two adhesive layers 1541 may be arranged. In other words, the first adhesive layer 1542 may be filled in the first exposed portion 1523 of the bending layer 1510, and the second adhesive layer 1541 may be filled in the second exposed portion 1533. That is, the first adhesive layer 1542 may have a higher modulus than the second adhesive layer 1541. In this way, by forming the first adhesive layer 1542 close to the outside of the housing to have a higher modulus than the second adhesive layer 1541, the anti-axial rigidity of the display module can be improved.

Referring to FIG. 16, the unbending layer 1620 (or the unbending sheets 1621 and 1622 forming it) of the composite laminated structure applied to various embodiments of this document has pre-polished edge portions 1621e and 1622e. You can have In one embodiment, the thickness H2 of the edge portions 1621e and 1622e may range from 20% to 30% of the thickness H1 of the flat portions 1621f and 1622f. Additionally, the edge portions 1621e and 1622e may be made into a round shape with a curvature of 0.05R or more, or 0.1R or more. Additionally, in one embodiment, the edge portions 1621e and 1622e may be made by polishing the upper and lower sides of the flat portions 1621f and 1622f. That is, as the upper and lower sides of the edge portions 1621e and 1622e are polished, a step may be formed between the edge portions 1621e and 1622e and the flat portions 1621f and 1622f.

In one embodiment, one area below the edge portions 1621e and 1622e is filled with the first adhesive 1641, and another area above the edge portions 1621e and 1622e is filled with the second adhesive 1642. You can. Since the edge portions 1621e and 1622e are made by polishing the upper and lower sides of the flat portions 1621f and 1622f, one region that becomes wider toward the top and another region that becomes wider toward the bottom can be formed. By filling one area with the first adhesive 1641 and pushing the second adhesive 1642 into another area, the composite laminated structure according to an embodiment of this document improves the impact resistance of the display panel using differences in the components of the adhesive. effect can be achieved. As described above with reference to FIGS. 14 and 15 , the first adhesive 1641 may be an adhesive having a higher modulus than the second adhesive 1642 .

According to the various examples of this document above, the strength characteristics shown in Table 1 below were confirmed through experiments. Here, “standard” refers to the bending layer, and “lamination” refers to the unbending layer. The experiment was conducted on a structure in which one unbending layer was laminated on a bending layer, but the pen drop characteristics can be further improved as additional unbending layers are laminated.

The chamfer angle refers to the inclination angle illustratively explained with reference to FIG. 13. Referring to FIG. 17, it can be seen that boundary visibility is improved when the chamfer angle formed by the bending layer and the unbending layer is within the range of 0 degrees to 10 degrees.

Referring to FIG. 18, the results of a visibility test can be seen while changing the edge curvature of the unbending layer from 0.0R to 0.1R. It can be seen that border visibility is improved at 0.05R or higher, preferably 0.1R or higher.

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C”, and “A Each of phrases such as “at least one of , B, or C” may include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (e.g., module or program) of the above-described components may include a single or plural entity, and some of the plurality of entities may be separately placed in other components. there is. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

Claims (20)

In an electronic device having one or more display modules,
The one or more display modules include a display panel and a composite laminate structure arranged on the display panel,
The composite laminate structure includes one or more bending layers and two or more unbending layers at least partially disposed above or below the bending layer,
The electronic device wherein the two or more unbending layers are stacked so that each edge forms a predetermined inclination with respect to each other. According to paragraph 1,
The bending layer is,
One or more exposed portions not covered by the one or more unbending layers,
It is divided into one or more cover parts combined on one side with the two or more unbending layers,
The electronic device wherein the bending area of the display module is at least a portion of the one or more exposed portions. According to paragraph 1,
The two or more unbending layers include a first unbending layer bonded to the bending layer and a second unbending layer at least partially bonded to the first unbending layer,
The bending layer includes a first exposed portion on which the first unbending layer is not formed, at least partially, and a second exposed portion on which the second unbending layer is not formed, at least partially, and the first exposed portion and the An electronic device, wherein the second exposed portions have different widths. According to paragraph 3,
The first exposed portion is formed to have a larger width than the second exposed portion,
The first exposed portion is formed to at least partially or completely include the second exposed portion. According to paragraph 3,
The first exposed portion is formed to have a smaller width than the second exposed portion,
The electronic device wherein the second exposed portion is formed to at least partially or completely include the first exposed portion. According to paragraph 3,
The first exposed portion is filled with a first adhesive,
The second exposed portion is filled with a second adhesive,
wherein the first adhesive has a different modulus than the second adhesive. According to paragraph 1,
The electronic device, wherein the predetermined inclination is formed at an angle of 0 degrees to 20 degrees, or 1 degree to 10 degrees. According to paragraph 1,
The bending layer and the unbending layer are manufactured under different chemical strengthening conditions. According to paragraph 1,
The two or more unbending layers include a flat portion and an edge portion,
The electronic device wherein the edge portion has a thickness in the range of 20% to 30% of the thickness of the flat portion. According to paragraph 1,
An edge of the unbending layer has a curvature of 0.05R or more, or 0.1R or more. According to paragraph 1,
At least some of the two or more unbending layers are arranged on a side opposite to a direction in which the composite laminate structure is bent. According to paragraph 1,
The two or more unbending layers and the bending layer are bonded by an adhesive layer,
The electronic device, wherein the adhesive layer contains a material having the same optical refractive index as the unbending layer and the bending layer. According to paragraph 1,
The unbending layer remains parallel to the bending layer while the composite laminate structure is bent. According to paragraph 1,
At least some of the two or more unbending layers have a modulus that is equal to, larger than, or smaller than the bending layer. According to clause 14,
The two or more unbending layers include a first unbending layer having a first modulus, and a second unbending layer having a second modulus different from the first modulus,
At least one of the first modulus or the second modulus has a different modulus than the bending layer. In electronic devices,
Comprising a housing and a flexible, foldable or rollable display module disposed in a space formed by the housing,
The display module includes a display panel and a composite laminated structure arranged on the display panel,
The composite laminate structure includes one or more bending layers and two or more unbending layers at least partially disposed above or below the bending layer,
The electronic device wherein the two or more unbending layers are stacked so that each edge forms a predetermined inclination with respect to each other. According to clause 16,
The bending layer is,
One or more exposed portions not covered by the one or more unbending layers,
It is divided into one or more cover parts combined on one side with the two or more unbending layers,
The electronic device wherein the bending area of the display module is at least a portion of the one or more exposed portions. According to clause 16,
The two or more unbending layers include a first unbending layer bonded to the bending layer and a second unbending layer at least partially bonded to the first unbending layer,
The bending layer includes a first exposed portion on which the first unbending layer is not formed, at least partially, and a second exposed portion on which the second unbending layer is not formed, at least partially, and the first exposed portion and the An electronic device, wherein the second exposed portions have different widths. According to clause 16,
The electronic device, wherein the predetermined inclination is formed at an angle of 0 degrees to 20 degrees, or 1 degree to 10 degrees. According to clause 16,
The bending layer and the unbending layer are manufactured under different chemical strengthening conditions.

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