KR20230141193A - An Apparatus for Processing a Surface of a Substrate - Google Patents

Abstract

The present invention relates to a substrate surface processing device, the substrate surface processing device comprising: a grinding chamber defining a space for grinding a substrate; A grinding wheel mounting unit for processing the surface of a substrate, comprising: a mounting plate capable of rotating around a rotation axis; a plurality of surface grinding wheels disposed on a circumference at a predetermined radius from the rotation center of the mounting plate, and capable of processing the surface of the substrate with substantially different surface conditions; and a plate rotation actuator that rotates the mounting plate; a grinding wheel mounting unit including a; a grinding wheel drive unit including a grinding wheel rotation actuator that is selectively connected to one of the plurality of surface grinding wheels mounted on the mounting plate to transmit rotational force; a substrate support unit disposed within the grinding chamber and supporting the substrate; and a substrate surface height measurement unit disposed within the grinding chamber and measuring the height of the surface of the substrate.

Description

Substrate surface processing device {An Apparatus for Processing a Surface of a Substrate}

The present invention relates to a device for processing the surface of a substrate, and more specifically, to a substrate surface processing device that can select and process the surface of a single crystal substrate for semiconductors under various grinding conditions.

In general, gallium nitride (GaN) has characteristics suitable for use as optical devices and high-power devices that can be operated at high temperatures due to its wide energy band gap, large mutual bonding force between atoms, and high thermal conductivity. Therefore, gallium nitride-based semiconductor compounds are widely used as materials for manufacturing optoelectronic devices, and specifically, optical devices such as light emitting diode (LED) and laser diode (LD) manufactured using gallium nitride and power It is applied to a wide range of fields, including power semiconductors such as conversion and transmission, and information and communication fields such as RF devices for communication.

Gallium nitride substrates are manufactured using heterogeneous substrates such as sapphire or silicon carbide (SiC), which have a hexagonal structure like gallium nitride, due to the absence of a seed substrate and for economic reasons. However, due to the difference in lattice constant and thermal expansion coefficient between gallium nitride and sapphire, when a gallium nitride substrate is formed on a sapphire substrate, a high density of crystalline defects may occur, and depending on the difference in thermal expansion coefficient, the gallium nitride substrate may be damaged during the cooling process. Bending occurs in In addition, due to the high strength and chemical resistance of the gallium nitride material, the substrate manufacturing process using gallium nitride single crystal requires a long substrate processing process, and also, if a damaged layer under the surface generated during the processing process remains, the processing process is interrupted. Even through this process, bending of the substrate occurs, which causes significant problems when manufacturing devices using the substrate.

Conventionally, in order to minimize the above-mentioned long-time substrate manufacturing process and the damage layer under the surface, several grinding devices with one specific abrasive particle size used during processing are provided to gradually lower the particle size to prevent damage to the surface. The layer was removed.

A conventional semiconductor substrate grinding device includes a rotating disc, a surface grinding wheel having a specific grinding particle size attached entirely to the upper surface of the rotating disc, a rotating holder formed above the rotating disc, and a rotating disc fixed to the rotating holder. It includes a substrate plate, and the rotation holder is configured to move up and down and rotate by an axis.

In the case of a conventional semiconductor substrate grinding device, one grinding wheel is fixedly installed in one grinding device, so if the grain size of the grinding wheel is to be changed in stages, multiple grinding devices are installed or one grinding device is installed. There was a problem in using one grinding wheel mounted on the grinding device by replacing it one by one.

In addition, when performing grinding work step by step for each individual grinding wheel, measuring the surface height between the grinding wheel and the substrate was cumbersome and inaccurate.

In order to solve the above-described problem, the present invention allows selection of grinding wheels with various abrasive particle sizes within one processing device when it is necessary to process grinding wheels with different abrasive particle sizes in stages. , We aim to provide a substrate processing device that can process a substrate by changing the grinding wheel according to the stage.

In order to achieve the above-described object, a substrate surface processing apparatus according to an embodiment of the present invention includes a grinding chamber defining a space for grinding a substrate; A grinding wheel for processing the surface of the substrate as a mounting unit, and a mounting plate capable of rotating around a rotation axis; a plurality of surface grinding wheels disposed on a circumference at a predetermined radius from the rotation center of the mounting plate and capable of processing the surface of the substrate with different surface conditions; and a plate rotation actuator that rotates the mounting plate; a grinding wheel mounting unit including a; a grinding wheel drive unit including a grinding wheel rotation actuator that is selectively connected to one of the plurality of surface grinding wheels mounted on the mounting plate to transmit rotational force; a substrate support unit disposed within the grinding chamber and supporting the substrate; and a substrate surface height measurement unit disposed within the grinding chamber and measuring the height of the surface of the substrate.

Here, the mounting plate and the surface grinding wheel are disposed inside the grinding chamber.

The plate rotation actuator and the grinding wheel drive unit are disposed outside the grinding chamber.

The grinding wheel driving unit further includes a clutch that transmits rotational force of the grinding wheel rotation actuator to the surface grinding wheel or blocks transmission of the rotational force.

The substrate surface processing apparatus according to one embodiment of the present invention further includes an impact alleviating member for alleviating an impact between the clutch and a surface grinding wheel selected from among the plurality of surface grinding wheels.

Each grinding wheel among the plurality of grinding wheels is disposed at a conformal angle with respect to the rotation center of the mounting plate.

In the substrate surface processing apparatus according to an embodiment of the present invention, the grinding wheel driving unit further includes a linear motion actuator that moves the grinding wheel rotation actuator forward and backward with respect to the mounting plate.

The grinding wheel drive unit further includes a magnet capable of applying a magnetic force to generate an attractive force at a predetermined distance with respect to the clutch to an end of the grinding wheel rotation actuator.

Meanwhile, the substrate surface height measurement unit includes a rod pivoted about one end toward a selected surface grinding wheel; and a sensor assembly disposed at the other end of the rod and including a first sensor that measures the distance to the surface grinding wheel and a second sensor that measures the distance to the surface of the substrate.

Here, the first sensor acquires height information on a plurality of points while rotating the selected surface grinding wheel at predetermined equiangular intervals, and the second sensor rotates the substrate at predetermined equiangular intervals to obtain height information on a plurality of points. Height information about the point is acquired, and the maximum protrusion height of the substrate is selected as the smallest difference between the height information measured by the first sensor and the height information value measured by the second sensor.

The substrate surface height measuring unit is accommodated in a storage chamber inside the grinding chamber while a surface grinding wheel is grinding the substrate.

The grinding wheel rotation actuator support supporting the grinding wheel rotation actuator is L-shaped.

The plate rotation actuator is electrically excited to remain stationary during grinding after the surface grinding wheel has been selected.

Meanwhile, the substrate surface processing apparatus according to one embodiment of the present invention further includes a lubricating liquid supply unit that supplies lubricating liquid to the substrate supported on the substrate supporting unit.

As described above, according to the present invention, when it is necessary to process grinding wheels with different abrasive particle sizes in stages, grinding wheels with various abrasive particle sizes can be selected within one processing device, It is possible to provide a substrate processing device that can process a substrate while changing the grinding wheel according to the step.

In addition, according to the present invention, when the surface grinding wheel is replaced and changed, the height of the substrate to be ground can be easily measured by simply measuring the distance between the replaced surface grinding wheel and the substrate to be ground.

In addition, according to the present invention, it is possible to reduce the impact applied to the clutch during the clutch connection operation in order to transmit power to the selected specific surface grinding wheel, and in the repeated clutch connection operation, the mounting plate moves in a direction away from the center of rotation. This reduces the possibility of bending.

In addition, according to the present invention, when connecting an actuator that rotates a surface grinding wheel, the rotational force transmission shaft connection operation can be performed accurately and stably using the power of magnetic force.

1 is a partially exploded perspective view of a substrate surface processing apparatus according to an embodiment of the present invention.
Figure 2 is a side view of the substrate surface processing apparatus of Figure 1.
Figure 3 is a front view of the grinding wheel mounting unit as viewed from the grinding chamber.
Figure 4 is a partial perspective view of the substrate surface height measurement unit of Figure 1;

Hereinafter, embodiments of the present invention will be described with reference to the attached drawings. The following description and attached drawings are for understanding the operation according to the present invention, and parts that can be easily implemented by a person skilled in the art may be omitted.

Additionally, the specification and drawings are not provided for the purpose of limiting the present invention, and the scope of the present invention should be determined by the claims. The terms used in this specification should be interpreted with meanings and concepts consistent with the technical idea of the present invention so as to most appropriately express the present invention.

Figure 1 shows a partially exploded perspective view of a substrate surface processing device according to an embodiment of the present invention, and Figure 2 is a schematic view of a side of the substrate surface processing device of Figure 1.

As shown in Figures 1 and 2, the substrate surface processing apparatus 10 according to an embodiment of the present invention is, for example, a grinding process that divides a space for grinding the substrate S, which is a workpiece on which gallium nitride is grown. It includes a chamber 20 and a grinding wheel mounting unit 30 that processes the surface of the substrate S by grinding.

The grinding wheel mounting unit 30 includes a mounting plate 32 capable of rotating around a rotation axis, and a mounting plate 32 that is disposed on a circumference at a predetermined radius from the rotation center of the mounting plate and has different surface conditions (different abrasives). A plurality of surface grinding wheels capable of processing the surface of the substrate (particle size), for example five grinding wheels (34a, 34b, 34c, 34d, 34e); and a plate rotation actuator 36 that rotates the mounting plate.

The mounting plate 32 is formed as a circular plate as shown in FIGS. 1 and 2, and the plurality of grinding wheels 34a, 34b, 34c, 34d, and 34e have the same radius around the rotation axis of the mounting plate. placed on the table.

As the mounting plate 32 rotates, the grinding wheel disposed on the lowest side among the plurality of grinding wheels, for example, five grinding wheels disposed on the mounting plate, is selected depending on the degree to which the mounting plate is rotated. The particular grinding wheel selected for use in grinding is the grinding wheel positioned vertically lowermost in the mounting plate.

Meanwhile, the substrate surface processing device 10 according to an embodiment of the present invention is selectively connected to one surface grinding wheel among a plurality of surface grinding wheels mounted on the mounting plate 32 to transmit rotational force. It has a grinding wheel drive unit (40) with a wheel rotation actuator (42).

The grinding wheel driving unit 40 and the plate rotation actuator 36 are mounted on the unit frame 14 located on the upper side of the basic frame 12 disposed adjacent to the polishing chamber 20 of the substrate surface processing device 10. It is installed. The unit frame 14 has a two-story structure, and the grinding wheel drive unit 40 and its related components are placed in the space corresponding to the first floor, and the plate is placed in the space corresponding to the second floor of the unit frame 14. Rotational actuator 36 and its associated components are disposed.

The mounting plate 32 of the grinding wheel mounting unit 30 is rotatably connected to the plate rotation actuator 36 mounted on the second floor space of the unit frame 14.

Meanwhile, the substrate surface processing apparatus 10 according to an embodiment of the present invention includes a substrate support unit 50 that is disposed inside the grinding chamber 20 and supports a substrate, which is a workpiece to be grinded. The substrate support unit 50 can support the substrate S fixedly or optionally support the substrate S to rotate, and has a separate actuator inside to rotate the substrate when supporting the substrate while rotating. do.

In addition, the substrate surface processing device 10 according to an embodiment of the present invention is disposed inside the grinding chamber 20 and includes a substrate surface height measurement unit 60 that measures the height of the surface of the substrate S. do.

In addition, the substrate surface processing apparatus 10 according to an embodiment of the present invention further includes a lubricating liquid supply unit 70 that supplies lubricating liquid to the substrate supported on the substrate supporting unit 50.

The grinding chamber 20 forms a substantially hexahedral space, and the mounting plate 32 and the surface grinding wheels 34a, 34b, 34c, 34d, and 34e are disposed inside the grinding chamber 20. do.

Meanwhile, the plate rotation actuator 36 and the grinding wheel drive unit 40 are disposed outside the grinding chamber 20.

Although not shown in the drawing, the grinding chamber 20 includes an entry window through which a worker can enter from the outside and an observation window through which the worker can observe the grinding operation inside. The entry window and the observation window may be integrated or may be separate components.

Although not shown in the drawings, a control panel for inputting various work conditions for substrate surface processing or controlling work may be installed close to the grinding chamber 20. The control panel may be installed in a casing (not shown) that surrounds and covers the unit frame and the basic frame, but is preferably placed close to the observation window so that the operator can operate the work panel while looking at the observation window. .

Of the five surface grinding wheels 34a, 34b, 34c, 34d, 34e, for example, placed on the mounting plate 32, the surface grinding wheel selected to be used for grinding and grinding the surface of the substrate is mounted on the mounting plate 32. ) is positioned at the vertical lowermost side of the mounting plate 32 by rotation (in FIGS. 1, 2, and 3, the surface grinding wheel 34c is shown as the selected surface surface grinding wheel). The position where the selected surface grinding wheel is placed is a position corresponding to the position of the substrate to be processed within the grinding chamber, and a corresponding position that can receive power from the grinding wheel rotation actuator by a power transmission means from the perspective outside the grinding chamber. It is placed in

Referring again to FIG. 2, the grinding wheel drive unit 40 further includes a clutch 44 that transmits the rotational force of the grinding wheel rotation actuator 42 to the surface grinding wheel or blocks the transmission of the rotational force.

Therefore, an actuator for driving the grinding wheel is not disposed for every grinding wheel, but only the grinding wheel selected by the operator or a predetermined processor rotates the grinding wheel of the grinding wheel drive unit 40 through the clutch 44. Rotational force is transmitted from the actuator 42.

1 and 2 show a situation in which the surface grinding wheel 34c is selected among the five surface grinding wheels 34a, 34b, 34c, 34d, and 34e.

It is desirable that the grinding conditions (particle size of the grinding material) of each surface grinding wheel change sequentially according to adjacent positions. That is, if the particle size of the abrasive of the surface grinding wheel 34a is the smallest among the five surface grinding wheels 34a, 34b, 34c, 34d, and 34e arranged in the circumferential direction, the surface grinding wheel 34b, the surface grinding wheel The grain size of the abrasive is arranged to increase sequentially as it goes to (34c), the surface grinding wheel (34d), and the surface grinding wheel (34e). Optionally, they may be arranged in the opposite direction, and may be arranged in an arbitrary arrangement order as needed. Through this arrangement structure, it is possible to reduce the rotation time of the mounting plate 32 in the total work time when sequential grinding work is performed on the substrate.

The clutch 44 may be a plate-type clutch that transmits rotational force through frictional force of surface contact, or a positive connection type clutch that has predetermined protrusions or concavities and is engaged with a complementary component to transmit rotational force. The clutch of the present invention is not limited to a specific type of clutch, and various types of clutches capable of transmitting and blocking rotational force are all included in the clutch of the present invention.

Meanwhile, the grinding wheel driving unit 40 of the substrate surface processing apparatus 10 of the present invention includes the clutch 44 and a surface grinding wheel selected from among a plurality of surface grinding wheels (example in the case of FIGS. 1 and 2, surface grinding An impact relieving member 46 is provided between the wheels 34c to relieve impact. The shock alleviating member 46 absorbs shock in the axial direction of the rotation axis that transmits rotational force to the surface grinding wheel. For example, the impact alleviating member may be formed of elastic rubber or fabric.

Meanwhile, the grinding wheel driving unit 40 includes a linear motion actuator 48 that moves the grinding wheel rotation actuator 42 forward and backward with respect to the mounting plate 32. When a particular grinding wheel among the surface grinding wheels on the mounting plate 32 is selected (i.e., when the mounting plate stops rotating), the linear motion actuator 48 pushes the grinding wheel rotation actuator 42 toward the mounting plate. The rotational drive surface of the grinding wheel rotation actuator 42 is engaged with the clutch 44.

Additionally, the grinding wheel drive unit 40 includes a magnet 49 capable of applying a magnetic force to generate an attractive force at a predetermined distance with respect to the clutch 44 to the end of the grinding wheel rotation actuator 42. Therefore, when the linear motion actuator 48 pushes the grinding wheel rotation actuator 42 toward the mounting plate, the grinding wheel rotation actuator 42 moves the clutch 44 by the force of the magnetic force at a distance where a predetermined magnetic force acts. is connected to.

When the linear motion actuator 48 moves the grinding wheel rotation actuator 42 forward to be connected to the clutch 44 and the grinding wheel rotation actuator 42 is connected to the clutch 44, the grinding wheel rotation actuator 42 The rotational force can be transmitted to the selected surface grinding wheel.

When the grinding operation by the specific surface grinding wheel is completed, the linear motion actuator 48 pulls the grinding wheel rotation actuator 42, which has stopped operating, in a direction away from the mounting plate, and the grinding wheel rotation actuator 42 moves in a specific direction. The connection with the surface grinding wheel is lost.

Thereafter, if necessary, the plate rotation actuator 36 further rotates the mounting plate 32 to bring the surface grinding wheel representing different grinding conditions to the selected position, and as previously explained, the linear motion actuator 48 ) pushes the grinding wheel rotation actuator 42 towards the mounting plate, thereby transmitting rotational force to the newly selected surface grinding wheel.

The plate rotation actuator 36 may be a stepping motor with precise angular resolution for rotating the mounting plate, but is not necessarily limited thereto, and various types of actuators may be used.

Figure 3 is a front view of the grinding wheel mounting unit as viewed from the grinding chamber.

Referring to FIG. 3, each surface grinding wheel among the plurality of surface grinding wheels 34a, 34b, 34c, 34d, and 34e is disposed at an equal angle with respect to the rotation center 32c of the mounting plate 32, and is mounted. The occurrence of eccentricity during rotation of the plate is prevented as much as possible, and the time required to change the selection of the surface grinding wheel can be kept predictable and constant.

As shown in Figure 3, the space between each surface grinding wheel (34a, 34b, 34c, 34d, 34e) and the rotation center 32c of the mounting plate 32 contains lubrication applied to the surface grinding wheel during grinding. A guide 35 for preventing liquid splashing is formed corresponding to the circular circumferential direction of the surface grinding wheel.

Figure 4 is a partial perspective view of the substrate surface height measurement unit of Figure 1;

1, 2, and 4, the substrate surface height measurement unit 60 includes a rod 62 pivoted about one end 62a toward a selected surface grinding wheel 34c; and a sensor assembly (64) disposed at the other end (62b) of the rod and comprising a first sensor (64a) displaced toward the surface of the surface grinding wheel and a second sensor (64b) disposed toward the surface of the substrate. ) includes.

Here, the first sensor 64a acquires height information about a plurality of points while rotating the selected surface grinding wheel at predetermined equal angular intervals (for example, three times while rotating the surface grinding wheel at 120-degree intervals). The second sensor 64b rotates the substrate at predetermined equal angular intervals and Height information is acquired for multiple points (e.g., measured three times while rotating the substrate at 120-degree intervals in synchronization with the rotation of the surface grinding wheel).

The maximum protrusion height (height to be grinded) of the substrate S is selected as the value (h) with the smallest difference between the height information measured by the first sensor and the height information value measured by the second sensor.

This substrate surface height measurement is performed after a specific surface grinding wheel is selected and before rotating it for grinding.

As shown in FIGS. 1 and 2, the substrate surface height measurement unit 60 is located in the storage chamber 22 inside the grinding chamber 20 while the surface grinding wheel is grinding the substrate. to be accepted.

The first sensor 64a and the second sensor 64b may be sensors that measure the height by contacting the object to be detected while the probe extends, but are not necessarily limited thereto, and measure the height in an optical manner. It may be a sensor that measures, etc.

Referring again to FIGS. 1, 2, and 4, the grinding wheel rotation actuator support 43 mounted on the reference frame 12 and supporting the grinding wheel rotation actuator 42 is L-shaped. In particular, the grinding wheel rotation actuator support 43 must be able to withstand the force that pushes the grinding wheel rotation actuator 42 in a retreating direction away from the clutch in the process of transmitting rotational force when coupled with the clutch 44. Accordingly, the transverse member connected to the longitudinal member of the grinding wheel rotation actuator support 43 extends from the lower part of the longitudinal member in a direction away from the mounting plate 32.

The grinding wheel rotation actuator 42 may be provided with a guide rod or guide roller at the bottom to enable linear motion according to the linear motion force of the linear motion actuator 48.

Meanwhile, the plate rotation actuator 36 is electrically excited to remain stationary even while grinding is in progress after a specific surface grinding wheel is selected. In other words, the plate rotation actuator 36 actively operates to maintain a stationary state in order to maintain its alignment while a specific surface grinding wheel is selected and the surface grinding wheel is rotating with the rotational force of the grinding wheel rotation actuator 42. It is under electrical control.

Referring again to FIG. 3, the surface grinding wheels 34a, 34b, 34c, 34d, and 34e are generally disk-shaped, and the peripheral peripheral surface of one side each has a protruding grinding wheel body. Each of the grinding wheel bodies is connected to a pad shaft formed at its radial center, and each pad shaft is connected to a clutch by a fixing pin. The grinding wheel body is connected to the pad axis by a body connection pin.

On the protruding circumferential surface of the grinding wheel body, a plurality of abrasive protrusions are disposed inclined at a predetermined angle and have a predetermined size of abrasive material particles. Therefore, when the surface grinding wheel rotates, the abrasive material protrusions grind the surface of the substrate to a predetermined grinding quality.

Although specific embodiments have been described in detail in this invention, this invention is not limited thereto, and various modifications of this invention can be made by those skilled in the art in the technical field to which this invention pertains, and such modifications are within the scope of this invention. included in

With regard to interpretation, it can be understood that this invention can be implemented in a modified form without departing from the essential characteristics of this invention.

The disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of this invention is indicated in the patent claims, not the foregoing description, and any differences within the equivalent scope should be interpreted as being included in this invention.

In the case of terms whose meaning is not specifically defined in this invention, they should be interpreted broadly in their general meaning and should be interpreted to include other terms of equivalent scope.

10: Substrate surface processing device 12: Basic frame
14: Unit frame
20: grinding chamber 22: storage room
30: Grinding wheel mounting unit 31: Rotating shaft
32: Mounting plate
34a, 34b, 34c, 34d, 34e: surface grinding wheels
36: plate rotation actuator
40: Grinding wheel drive unit 42: Grinding wheel rotation actuator
42a: End of grinding wheel rotation actuator
43: Grinding wheel rotation actuator support
44: Clutch 46: Shock alleviating member
48: linear motion actuator 49: magnet
50: substrate support unit
60: Substrate surface height measurement unit
62: Rod 64: Sensor assembly
64a: first sensor 64b: second sensor
70: lubricating liquid supply unit S: substrate

Claims (13)

In the substrate surface processing device, the substrate surface processing device includes:
a grinding chamber defining a space for grinding the substrate;
A unit equipped with a grinding wheel that processes the surface of a substrate,
A mounting plate capable of rotational movement about a rotation axis;
a plurality of surface grinding wheels disposed on a circumference at a predetermined radius from the rotation center of the mounting plate and capable of processing the surface of the substrate with different surface conditions; and
a grinding wheel mounting unit including a plate rotation actuator that rotates the mounting plate;
a grinding wheel drive unit including a grinding wheel rotation actuator that is selectively connected to one of the plurality of surface grinding wheels mounted on the mounting plate to transmit rotational force;
a substrate support unit disposed within the grinding chamber and supporting the substrate; and
A substrate surface processing device comprising: a substrate surface height measurement unit disposed within the grinding chamber and measuring the height of the surface of the substrate. According to claim 1,
A substrate surface processing apparatus, wherein the mounting plate and the surface grinding wheel are disposed inside the grinding chamber. According to claim 2,
A substrate surface processing apparatus, wherein the plate rotation actuator and the grinding wheel driving unit are disposed outside the grinding chamber. According to claim 1,
The grinding wheel driving unit is a substrate surface processing device, characterized in that it further includes a clutch that transmits rotational force of the grinding wheel rotation actuator to the surface grinding wheel or blocks transmission of the rotational force. According to claim 4,
A substrate surface processing device, characterized in that it further comprises an impact relieving member for relieving impact between the clutch and a surface grinding wheel selected from among the plurality of surface grinding wheels. According to claim 1,
A substrate surface processing device, wherein each grinding wheel among the plurality of grinding wheels is disposed at an equal angle with respect to the rotation center of the mounting plate. According to claim 1,
The grinding wheel driving unit further includes a linear motion actuator that moves the grinding wheel rotation actuator forward and backward with respect to the mounting plate. According to claim 1,
The grinding wheel driving unit further includes a magnet capable of applying a magnetic force to generate an attractive force at a predetermined distance with respect to the clutch to an end of the grinding wheel rotation actuator. According to claim 1,
The substrate surface height measurement unit,
a rod pivoted about one end toward a selected surface grinding wheel; and
A sensor assembly disposed at the other end of the rod and including a first sensor that measures the distance to the surface of the surface grinding wheel and a second sensor that measures the distance to the surface of the substrate. Substrate surface processing device. According to clause 9,
The first sensor acquires height information about a plurality of points while rotating the selected surface grinding wheel at predetermined equal angular intervals,
The second sensor acquires height information about a plurality of points while rotating the substrate at predetermined equal angular intervals,
A substrate surface processing device, characterized in that the maximum protrusion height of the substrate is selected as the smallest difference between the height information measured by the first sensor and the height information value measured by the second sensor. According to claim 1,
The substrate surface processing device is characterized in that the substrate surface height measuring unit is accommodated in a storage chamber inside the grinding chamber while a surface grinding wheel is grinding the substrate. According to claim 1,
The plate rotation actuator is electrically excited to maintain a stationary state even while grinding is in progress after the surface grinding wheel is selected. According to claim 1,
A substrate surface processing device, characterized in that it further comprises a lubricating liquid supply unit that supplies lubricating liquid to the substrate supported on the substrate support unit.