KR20230139461A - Manufacturing Method for Microstrip Patch Antenna - Google Patents

Abstract

The present invention relates to a method for manufacturing a microstrip patch antenna. According to the present invention, the method includes: a patch forming step in which a through hole is formed in the inner part of a patch in the form of a flat plate, a feed pin extending from a portion of the edge of the through hole to the inside of the through hole is also formed, and then the feed pin is bent at an arbitrary angle with respect to the flat plate; and a dielectric bonding step of coupling the patch on which the feed pin is formed to a dielectric block. The technology can improve the productivity of microstrip patch antennas.

Description

{Manufacturing Method for Microstrip Patch Antenna}

The present invention relates to a method of manufacturing an antenna that transmits and receives radio waves, and more specifically, to a method of manufacturing a microstrip patch antenna including a patch and a dielectric.

In general, satellite signal receivers for using mobile multimedia information, broadcasting services, or current location and electronic map services use microstrip patch antennas. In other words, satellites use Right Hand Circular Polarization (RHCP) or Left Hand Circular Polarization during transmission to minimize the effects of ionospheric interference and multi-path signals (noise) reflected from the ground. It is desirable to use a circular polarization antenna in the receiver to receive such satellite radio signals or GPS satellite signals. Among various types of circular polarization antennas, microstrip patch antennas are inexpensive and have good reception rates. Because.

The microstrip patch antenna is an antenna that has the advantage of being light in weight and having a flat structure that occupies little space while maintaining the greatest gain and directivity within a given space. It can be used alone or in conjunction with an LNA (Low Noise Amplifier) amplification stage. They are used together and are mainly applied to application devices such as GPS (Global Positioning System), GNSS (Global Navigation Satellite System), and SXM (SiriusXM).

Such a microstrip patch antenna generally includes a dielectric block with a high dielectric constant, a radiating patch formed on the upper surface of the dielectric block, a ground formed on the lower surface of the dielectric block, and a feed pin penetrating the dielectric block. Here, the feed pin is electrically connected to the radiating patch, but is not connected to ground.

As a signal feeding method for microstrip patch antennas, the coaxial line feeding method is widely used. The coaxial line feeding method is a method of feeding power by conducting a conduction from under the ground at the bottom of the dielectric through the dielectric to the patch located on the top of the dielectric through a feed pin.

Microstrip patch antennas of the coaxial line feeding method required a process of soldering the feed pin to the patch in order to connect the patch located on the upper side of the dielectric and the feed pin during the manufacturing process. This made manufacturing the antenna difficult and required soldering. This was acting as a factor in the decline in quality.

Republic of Korea Patent Publication No. 10-1263444

The purpose of the present invention is to solve the conventional problems described above and to provide a method of manufacturing a microstrip patch antenna that can improve or improve productivity in manufacturing a microstrip patch antenna.

A method of manufacturing a microstrip patch antenna according to an embodiment of the present invention to achieve the above object is a method of manufacturing a microstrip patch antenna including a patch and a dielectric block, wherein the inner part of a flat plate made of a conductive material is After forming a through hole and forming a feed pin extending inside the through hole from a portion of the edge of the through hole, the feed pin is bent so that the feed pin has a random angle with respect to one surface of the flat plate. A patch forming step of forming the patch; and a dielectric bonding step of coupling the patch and the dielectric block by mounting the patch on which the feed pin is formed in the patch forming step to the dielectric block or embedding at least a portion of it; Including may be considered as a feature.

Here, in the dielectric bonding step, another feature may be that a bond between the patch and the dielectric block is formed using an insert injection method.

Here, in the dielectric bonding step, the patch is seated with the support post using a mold frame provided with at least one support post capable of seating the patch, and the dielectric block is placed in the mold frame on which the patch is seated. Another feature may be to form a bond between the patch and the dielectric block by injecting a dielectric that forms.

Here, in the dielectric bonding step, the dielectric block is provided with a tuning port that can expose the tuning part provided in the patch 100 to the outside for frequency tuning. It can also be used as a feature of .

Here, in the patch forming step, another feature may be that the through hole and the feed pin are formed in the patch using a laser cutting method or a pressing method.

The method of manufacturing a microstrip patch antenna according to the present invention does not require a separate process for connecting the patch by bonding a feed pin. Therefore, in manufacturing a microstrip patch antenna, the process becomes simpler and productivity can be improved or improved.

1 is a flowchart schematically showing a method of manufacturing a microstrip patch antenna according to an embodiment of the present invention.
Figure 2 is a plan view schematically showing the patch of the microstrip patch antenna in the microstrip patch antenna manufacturing method according to an embodiment of the present invention.
Figure 3 is a perspective view schematically showing the patch of the microstrip patch antenna in the microstrip patch antenna manufacturing method according to an embodiment of the present invention.
Figure 4 is a side view schematically showing a portion of a microstrip patch antenna in the microstrip patch antenna manufacturing method according to an embodiment of the present invention.
Figure 5 is a perspective view schematically showing a portion of a microstrip patch antenna in the microstrip patch antenna manufacturing method according to an embodiment of the present invention.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all transformations, equivalents, and substitutes included in the spirit and technical scope of the present invention. These embodiments are provided to explain the present invention in more detail to those skilled in the art. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a clearer description, and in explaining the present invention, if it is determined that a detailed description of the related known technology may obscure the gist of the present invention, the detailed description is provided. can be omitted.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. Terms are used for the purpose of explaining and understanding one component by distinguishing it from other components.

The terms used in the present invention are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions, unless the context clearly dictates otherwise.

In the present invention, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. The same reference numerals may be used for similar parts throughout the specification.

Hereinafter, a method of manufacturing a microstrip patch antenna according to an embodiment of the present invention will be described with reference to the drawings.

Figure 1 is a flow chart schematically showing a method of manufacturing a microstrip patch antenna according to an embodiment of the present invention, and Figure 2 is a flow chart schematically showing a patch of a microstrip patch antenna in the method of manufacturing a microstrip patch antenna according to an embodiment of the present invention. It is a top view, and Figure 3 is a perspective view schematically showing a patch of a microstrip patch antenna in a method of manufacturing a microstrip patch antenna according to an embodiment of the present invention, and Figure 4 is a method of manufacturing a microstrip patch antenna according to an embodiment of the present invention. , is a side view schematically showing a part of the microstrip patch antenna, and Figure 5 is a perspective view schematically showing a part of the microstrip patch antenna in the microstrip patch antenna manufacturing method according to an embodiment of the present invention.

Here, in explaining the present invention, the patch electrode is simply referred to as a patch for convenience, and the ground electrode is also simply referred to as ground.

First, as referred to in FIG. 1, the method of manufacturing a microstrip patch antenna according to an embodiment of the present invention includes a patch forming step (S110) and a dielectric bonding step. Includes (S120).

<S110>

In the patch forming step (S110), as shown in FIG. 2, a through hole 110 is formed in the inner portion of a flat plate made of a conductive material. Here, as shown in FIG. 2, a feed pin 120 extending inside the through hole 110 is also formed at a portion of the edge of the through hole 110.

Here, the length of the feed pin 120 is greater than the thickness or height of the dielectric block 200 so that the feed pin 120 can penetrate the dielectric block 200 in the dielectric coupling step (S120) to be described later. The feed pin 120 having a value can be formed.

In addition, a laser cutting method or a press method can be used to form the through hole 110 and the feed pin 120 on the inner part of the flat plate.

And, as referred to in FIG. 3, the formation of the patch 100 can be completed by bending the feed pin 120 so that the feed pin 120 has a random angle with respect to one surface of the flat plate.

If necessary, the feed pin 120 can be bent using a jig. It is desirable to bend the feed pin 120 so that the angle between one surface of the flat plate of the patch 100 and the feed pin 120 forms 90 degrees.

At least a portion of the patch 100 is in the form of a flat plate and may have an approximate shape of a square plate. The area of the patch 100 may be smaller than the upper area of the dielectric block 200 to be combined in the dielectric combining step (S120).

In addition, the patch 100 in the form of a square plate may, if necessary, be provided with chamfers on some of the opposing corners, as referenced in the drawings.

For example, patch 100 may include four sides and two chamfers, as referenced in the drawings. The patch 100 may have various sizes and areas depending on the operating frequency, and its shape is not limited to the above-mentioned square shape, and a circular shape is also possible.

In this way, if necessary, the edge of the patch 100 to be placed on the upper side of the dielectric block 200 may be chamfered, and the direction of the circular polarization type is determined by the direction of the chamfer formed in this way.

In this way, the feed pin 120 provided on the patch 100 is connected to the patch 100 and penetrates the dielectric block 200 in the dielectric combining step (S120), which will be described later. The feed pin 120 may have a shape substantially parallel to the side surface of the dielectric block 200. And the power supply pin 120 may be spaced apart from the ground 300.

For reference, the conductive patch 100 and the feed pin 120 may be formed of any one selected from gold, platinum, silver, copper, aluminum, nickel, palladium, chromium, alloys thereof, and equivalents thereof.

As a more specific example, patch 100 may be formed of brass alloy. If necessary, it is possible to plate the patch 100 made of brass alloy with tin.

The patch 100 and the feed pin 120 are electroless plating, electrolytic plating, sputtering, evaporation, CVD (Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition), PECVD (Plasma Enhanced CVD), and ALD (Atomic Layer Deposition). ), PVD (Physical vapor deposition), PLD (Pulsed Laser Deposition), L-MBE (Laser Molecular Beam Epitaxy), and equivalent methods may be formed.

The through hole 110 and the feed pin 120 of the patch 100 are made by forging, punching, drawing, and cutting metal foil. It can also be formed using processing methods such as bending.

In this way, since the feed pin 120 is formed in an integrated form with the patch 100, the conventional process of combining metal pins and soldering is unnecessary. Therefore, there is an advantage that the problem of quality deterioration caused by soldering the patch and the metal pin is suppressed.

< S120 >

Next, in the dielectric bonding step (S120), the patch 100 on which the feed pin 120 is formed in the patch forming step (S110) is mounted on the dielectric block 200 or at least a portion of it is embedded to form the patch 100 and the dielectric block. Combine (200).

The patch 100 may be placed on the upper side of the dielectric block 200, as shown in FIG. 4 or FIG. 5 . Here, the feed pin 120 is connected to the patch 100 and penetrates the dielectric block 200. The feed pin 130 may have a shape substantially parallel to the side surface of the dielectric block 200. And the power supply pin 120 may be spaced apart from the ground 300. For reference, it should be noted that the ground 300 is omitted in Figure 5.

The feed pin 120, dielectric block 200, and ground 300 may be mounted on a circuit board (not shown).

The dielectric block 200 may be roughly in the shape of a flat hexahedron. That is, the upper and lower surfaces of the dielectric block 200 may have a substantially flat square shape, and the side surfaces connecting the four circumferences of the upper and lower surfaces may also each have a square shape. If necessary, the dielectric block 200 may have the shape of a flat cylinder or a polygonal pillar.

The dielectric block 200 has a high dielectric constant and is made of ceramics such as alumina, zirconia, sialon, silicon carbide, silicon nitride, polyimide (PI), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), and polybutylene terephthalate (PBT). ), ASA (acrylonitrile-styrene-acrylate), PE (polyethylene), PET (polyethylene terephthalate), PP (polypropylene), or a mixture thereof. This dielectric block 110 may be designed to have a dielectric constant of 45 or more, if necessary, in order to reduce the size of the antenna.

In this dielectric bonding step (S120), it is preferable that the patch 100 and the dielectric block 200 are bonded using an insert injection method.

Of course, if necessary, it is also possible to form the patch 100 by adhering it to the dielectric block 200 with an adhesive layer in the dielectric bonding step (S120).

As a specific example of combining the patch 100 and the dielectric block 200 using the insert injection method, molding can be seen using a mold provided with a support post.

That is, the patch 100 is seated with a support post using a mold frame (not shown) equipped with at least one support post capable of holding the patch 100, and the dielectric material is placed in the mold frame on which the patch 100 is seated. The dielectric forming the block 200 is injected to form a bond between the patch 100 and the dielectric block 200.

For example, as shown in Figure 5, the dielectric injected into the mold frame cannot reach the patch 100 at the portion 220 where the support post of the mold frame holds and seats a portion of the patch 100, so after insert injection molding The portion 220 that was seated on the support post remains. In Figure 5, the patch 100 is seated by four support posts provided in the mold frame, and insert injection molding is shown.

In this way, since at least one support post provided in the mold frame secures the patch 100, bending of the patch can be suppressed while the patch 100 and the dielectric block 200 are formed by the insert injection method. .

And, in the dielectric bonding step (S120), the dielectric block 200 is provided with a tuning port that exposes the tuning part 150 provided in the patch 100 to the outside for frequency tuning. ) (240) is preferably provided.

As referenced in FIGS. 4 and 5, a tuning port 240 is formed concavely on the side of the dielectric block 200. Tuning ports 240 may be provided on each of the four sides of the dielectric block 200. The shape of the tuning port 240 prepared when molding the dielectric block 200 can be set through the mold.

In the tuning port 240, the tuning part 150 is exposed to the outside without being embedded or covered in the dielectric block 200. This tuning part 150 can be said to be a part of the patch 100.

If necessary, the tuning part 150 may be provided in a form that protrudes from the patch 100. This tuning part 150 is provided for frequency tuning of the microstrip patch antenna, and frequency tuning can be achieved by manipulating the tuning part 150.

For reference, the ground 300 may be prepared after the dielectric bonding step (S120).

The ground 300 may be provided on the lower side of the dielectric block 200 as referenced in the drawing. The ground 300 may also be formed in a substantially square shape. The area of the ground 300 may be similar to or smaller than the area of the dielectric block 200. Of course, the ground 300 may include a circular opening formed in an area corresponding to the feed pin 120 so that it can be spaced apart from the feed pin 120. If necessary, the ground 300 may also be formed in a circular shape.

The ground 300 may be formed of any one selected from gold, platinum, silver, copper, aluminum, nickel, palladium, chromium, alloys thereof, and equivalents thereof.

The ground 300 is used for electroless plating, electrolytic plating, sputtering, evaporation, CVD (Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition), PECVD (Plasma Enhanced CVD), ALD (Atomic Layer Deposition), and PVD (Physical Vapor Deposition). Deposition), PLD (Pulsed Laser Deposition), L-MBE (Laser Molecular Beam Epitaxy), and equivalent methods may be formed.

The ground 300 may be formed by a conductive ink printing and sintering process, a plasma spraying process, a room temperature vacuum spraying process, an aerosol deposition process, etc.

Ground (300) forging, punching, drawing, and cutting metal foil. It is also possible to form it using a traditional processing method such as bending, and then attach it to the dielectric block 200 with an adhesive layer.

In this way, the method of manufacturing a microstrip patch antenna according to the present invention does not require a separate process of bonding and connecting the feed pin to the patch because the feed pin is formed in an integrated form.

Therefore, in manufacturing a microstrip patch antenna, the manufacturing process is simpler compared to the conventional manufacturing method, quality degradation due to soldering can be suppressed, and the productivity of the microstrip patch antenna can be improved or improved.

While forming the combination of the patch and the dielectric block using the insert injection method, at least one support post provided on the mold frame secures the patch, thereby suppressing the occurrence of bending of the patch. Therefore, it can suppress the defect occurrence rate of products during the manufacturing process.

As described above, the specific description of the present invention has been made by way of examples with reference to the accompanying drawings, but since the above-described embodiments are only described by referring to preferred embodiments of the present invention, the present invention is not limited to the above. It should not be understood as being limited to the embodiments only, and the scope of the present invention should be understood in terms of the claims and equivalent concepts described later.

100: patch
110: Through hole
120: feed pin
150: tuning part
200: Dielectric block
240: tuning port
300: Ground

Claims (5)

In the method of manufacturing a microstrip patch antenna including a patch and a dielectric block,
A through hole is formed in the inner portion of a flat plate made of a conductive material, and a feed pin extending from a portion of the edge of the through hole to the inside of the through hole is also formed, and then the feed pin is connected to one surface of the flat plate. A patch forming step of forming the patch by bending the feed pin to have a random included angle; and
A dielectric bonding step of coupling the patch and the dielectric block by mounting the patch on which the feed pin is formed in the patch forming step to the dielectric block or embedding at least a portion of it; A microstrip patch antenna manufacturing method comprising:
According to clause 1,
In the dielectric combining step,
A microstrip patch antenna manufacturing method characterized by forming a bond between the patch and the dielectric block using an insert injection method.


According to clause 2,
In the dielectric combining step,
The patch is seated on the support post using a mold frame provided with at least one support post capable of holding the patch,
A method of manufacturing a microstrip patch antenna, characterized in that the dielectric forming the dielectric block is injected into the mold frame on which the patch is seated to form a bond between the patch and the dielectric block.
According to clause 1,
In the dielectric combining step,
A method of manufacturing a microstrip patch antenna, characterized in that the dielectric block is provided with a tuning port that can expose the tuning part provided in the patch 100 to the outside for frequency tuning.
According to clause 1,
In the patch forming step,
A method of manufacturing a microstrip patch antenna, characterized in that the through hole and the feed pin are formed in the patch using a laser cutting method or a pressing method.

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