KR20230134011A - Display device and method of operation thereof - Google Patents

Abstract

A display device includes a display panel, an input sensor disposed on the display panel and including sensing electrodes, electrically connected to some of the sensing electrodes, and receiving a first received signal corresponding to a signal received from the connected sensing electrodes. It includes a master readout circuit that generates a master readout circuit and a slave readout circuit that is electrically connected to another part of the sensing electrodes and generates a second received signal corresponding to a signal received from the connected sensing electrodes. The master readout circuit provides a synchronization signal to the slave readout circuit, the slave readout circuit operates in response to the synchronization signal, and sends a detection signal corresponding to the second received signal to the master readout circuit. to provide.

Description

Display device and method of operation thereof {DISPLAY DEVICE AND METHOD OF OPERATION THEREOF}

The present invention relates to a display device.

Multimedia electronic devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, etc. are equipped with display devices for displaying images. Electronic devices may be equipped with display devices that can provide a touch-based input method that allows users to easily and intuitively and conveniently input information or commands, in addition to typical input methods such as buttons, keyboards, and mice.

The purpose of the present invention is to provide a display device that can more accurately detect a user's input and a method of operating the same.

According to one feature of the present invention for achieving this object, a display device includes a display panel, an input sensor disposed on the display panel and including sensing electrodes, and electrically connected to some of the sensing electrodes, and connected to A master readout circuit that generates a first received signal corresponding to a signal received from the sensing electrodes and a second received signal electrically connected to another part of the sensing electrodes and corresponding to a signal received from the connected sensing electrodes. and a slave readout circuit that generates, wherein the master readout circuit provides a synchronization signal to the slave readout circuit, the slave readout circuit operates in response to the synchronization signal, and responds to the second received signal. A corresponding detection signal is provided to the master readout circuit.

In one embodiment, the master readout circuit may calculate the input position of the input sensor based on the first received signal and the second received signal.

In one embodiment, the master readout circuit may include a host interface that communicates with a host processor and a sensor interface that communicates with the slave readout circuit.

In one embodiment, the slave readout circuit may include a sensor interface that communicates with the master readout circuit.

In one embodiment, the input sensor may include a sensing area where the sensing electrodes are arranged, a first non-sensing area around the sensing area, and a second non-sensing area spaced apart from the first non-sensing area. there is.

In one embodiment, first sensing lines electrically connect some of the sensing electrodes to the master readout circuit and second sensing lines electrically connect other portions of the sensing electrodes to the slave readout circuit. Can contain lines.

In one embodiment, the first sensing lines may be disposed in the first non-sensing area, and the second sensing lines may be disposed in the second non-sensing area.

In one embodiment, the display device further includes a circuit board on which the master read-out circuit and the slave read-out circuit are disposed, and the circuit board may be electrically connected to the display panel.

In one embodiment, the display device may further include a first circuit board on which the master read-out circuit is disposed and a second circuit board on which the slave read-out circuit is disposed. The first circuit board may be electrically connected to a first side of the display panel, and the second circuit board may be electrically connected to a second side of the display panel that is different from the first side.

In one embodiment, the master readout circuit of the first circuit board and the slave readout circuit of the second circuit board may be electrically connected through a connection part.

A display device according to another feature of the present invention includes a display panel, an input sensor disposed on the display panel and including first sensing electrodes and second sensing electrodes, and transmitting a first transmission signal to a portion of the first sensing electrodes. A master readout circuit for transmitting and receiving a first received signal from some of the second sensing electrodes and transmitting a second transmitting signal to another portion of the first sensing electrodes and receiving a first receiving signal from some of the second sensing electrodes. and a slave readout circuit that receives a second reception signal from the master readout circuit, wherein the master readout circuit provides a synchronization signal to the slave readout circuit, and the slave readout circuit transmits the second signal in response to the synchronization signal. A signal is transmitted, the second received signal is received, and a detection signal corresponding to the second received signal is provided to the master readout circuit.

In one embodiment, the master readout circuit may calculate the input position of the input sensor based on the first received signal and the second received signal.

In one embodiment, the input sensor may include a sensing area where the sensing electrodes are arranged, a first non-sensing area around the sensing area, and a second non-sensing area spaced apart from the first non-sensing area. there is.

In one embodiment, the input sensor includes first sensing lines electrically connecting some of the second sensing electrodes and the master readout circuit and other portions of the second sensing electrodes and the slave readout circuit. It may further include second sensing lines electrically connected to each other.

In one embodiment, the first sensing lines may be disposed in the first non-sensing area, and the second sensing lines may be disposed in the second non-sensing area.

In one embodiment, the display device further includes a circuit board on which the master read-out circuit and the slave read-out circuit are disposed, and the circuit board may be electrically connected to the display panel.

In one embodiment, a first circuit board on which the master readout circuit is disposed, a second circuit board on which the slave readout circuit is disposed, and a connector electrically connecting the first circuit board and the second circuit board. The first circuit board may be electrically connected to a first side of the display panel, and the second circuit board may be electrically connected to a second side of the display panel that is different from the first side.

In one embodiment, the master readout circuit includes a first transmission circuit that outputs the first transmission signal to corresponding first sensing electrodes among the first sensing electrodes, and a corresponding first transmission circuit among the second sensing electrodes. A second receiving circuit for receiving the first received signal from two sensing electrodes, a first memory for storing the first received signal, a host interface for communicating with a host processor, and transmitting the synchronization signal to the slave readout circuit. It may include a processor that controls a first sensor interface, the first transmission circuit, the first memory, the host interface, and the first sensor interface.

In one embodiment, the slave readout circuit may include a second transmission circuit that outputs the second transmission signal to corresponding first sensing electrodes among the first sensing electrodes, and a corresponding transmitting circuit among the second sensing electrodes. a second receiving circuit that receives the second received signal from two sensing electrodes, a second memory that stores the second received signal, and the master that receives the sensing signal corresponding to the second received signal stored in the second memory. It may include a second sensor interface that transmits data to the first sensor interface of a readout circuit, and a second processor that controls the second transmission circuit, the second memory, and the second sensor interface.

A method of operating a display device according to an aspect of the present invention includes transmitting a synchronization signal from a master readout circuit to a slave readout circuit, transmitting a first transmission signal from the master readout circuit to an input sensor, and transmitting a first transmission signal to the input sensor. Receiving a first input signal for the first transmission signal from the master readout circuit, and receiving a second input signal for the first transmission signal from the slave readout circuit, from the slave readout circuit Transmitting a second transmission signal to the input sensor, receiving the first input signal for the second transmission signal from the input sensor at the master readout circuit, and receiving the second input signal for the first transmission signal receiving from the slave readout circuit, corresponding to the second input signal for the first transmission signal and the second input signal for the second transmission signal from the slave readout circuit to the master readout circuit. Transmitting a detection signal and calculating a touch position corresponding to the first input signal and the second input signal for each of the first transmission signal and the second transmission signal in the master readout circuit. do.

A display device having this configuration includes a plurality of readout circuits for detecting a user's input. Therefore, even if the number of transmission lines and/or reception lines increases, a plurality of transmission lines and/or reception lines can be distributed and connected to the readout circuits. Therefore, the wiring width and wiring spacing of the transmission lines and/or reception lines disposed in the non-sensing area of the input sensor can be sufficiently secured. As a result, the quality of the transmission signal transmitted through the transmission lines and/or the quality of the reception signal transmitted through the reception lines can be prevented from being deteriorated.

1 is a perspective view of a display device according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of a display device according to an embodiment of the present invention.
Figure 3 is a cross-sectional view taken along the cutting line II' shown in Figure 2.
FIG. 4 is a cross-sectional view of the display panel shown in FIG. 3.
Figure 5 is a plan view of a display panel according to an embodiment of the present invention.
Figure 6 is a plan view showing the configuration of an input sensor according to an embodiment of the present invention.
Figure 7 is a cross-sectional view of a display device according to an embodiment of the present invention.
Figure 8 is a diagram illustrating the connection relationship between an input sensor and readout circuits according to an embodiment of the present invention.
Figure 9 is a block diagram showing the circuit configuration of a master readout circuit and a slave readout circuit according to an embodiment of the present invention.
FIG. 10 is a timing diagram for explaining the operation of the master readout circuit and the slave readout circuit shown in FIG. 9.
Figure 11 is a block diagram showing the circuit configuration of a master readout circuit and a slave readout circuit according to an embodiment of the present invention.
FIG. 12 is a diagram illustrating the connection relationship between an input sensor, a first circuit board, and a second circuit board according to an embodiment of the present invention.
FIG. 13 is a diagram illustrating the connection relationship between an input sensor, a first circuit board, and a second circuit board according to an embodiment of the present invention.

In this specification, when a component (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” another component, it is directly placed/on the other component. This means that they can be connected/combined or a third component can be placed between them.

Like reference numerals refer to like elements. Additionally, in the drawings, the thickness, proportions, and dimensions of components are exaggerated for effective explanation of technical content. “And/or” includes all combinations of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

Additionally, terms such as “below,” “on the lower side,” “above,” and “on the upper side” are used to describe the relationship between the components shown in the drawings. The above terms are relative concepts and are explained based on the direction indicated in the drawings.

Terms such as “include” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but do not include one or more other features, numbers, or steps. , it should be understood that it does not exclude in advance the possibility of the existence or addition of operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Additionally, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and unless explicitly defined herein, should not be interpreted as having an overly idealistic or overly formal meaning. It shouldn't be.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a display device according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of a display device according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , the display device DD may be a device that is activated according to an electrical signal. The display device DD according to the present invention may be a large display device such as a television or monitor, as well as a small or medium-sized display device such as a mobile phone, tablet, laptop, car navigation, or game console. These are provided only as examples, and of course, other types of display devices may be included as long as they do not deviate from the concept of the present invention. The display device DD has a rectangular shape with a long side in the first direction DR1 and a short side in the second direction DR2 that intersects the first direction DR1. However, the shape of the display device DD is not limited to this, and the display device DD may be provided in various shapes. The display device DD may display the image IM in the third direction DR3 on the display surface IS parallel to each of the first and second directions DR1 and DR2. The display surface IS on which the image IM is displayed may correspond to the front surface of the display device DD.

In this embodiment, the front (or upper) and back (or lower) surfaces of each member are defined based on the direction in which the image IM is displayed. The front and back surfaces are opposed to each other in the third direction DR3, and the normal directions of each of the front and back surfaces may be parallel to the third direction DR3.

The separation distance between the front and back surfaces in the third direction DR3 may correspond to the thickness of the display device DD in the third direction DR3. Meanwhile, the direction indicated by the first to third directions DR1, DR2, and DR3 is a relative concept and can be converted to another direction.

The display device DD can detect an external input applied from outside. External input may include various types of inputs provided from outside the display device DD. The display device DD according to an embodiment of the present invention can detect a user's external input applied from outside. The user's external input may be any one or a combination of various types of external inputs, such as a part of the user's body, light, heat, gaze, or pressure. Additionally, the display device DD may detect a user's external input applied to the side or back of the display device DD depending on the structure of the display device DD, and is not limited to any one embodiment. As an example of the present invention, external input may include input using an input device (eg, stylus pen, active pen, touch pen, electronic pen, e-pen, etc.).

The display surface IS of the display device DD may be divided into a display area DA and a non-display area NDA. The display area DA may be an area where the image IM is displayed. The user views the image (IM) through the display area (DA). In this embodiment, the display area DA is shown as a square shape with rounded corners. However, this is shown as an example, and the display area DA may have various shapes and is not limited to any one embodiment.

The non-display area NDA is adjacent to the display area DA. The non-display area (NDA) may have a predetermined color. The non-display area (NDA) may surround the display area (DA). Accordingly, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is an exemplary illustration, and the non-display area NDA may be disposed adjacent to only one side of the display area DA or may be omitted. The display device DD according to an embodiment of the present invention may include various embodiments and is not limited to any one embodiment.

As shown in FIG. 2 , the display device DD may include a display module DM and a window WM disposed on the display module DM. The display module (DM) may include a display panel (DP) and an input sensor (ISU).

The display panel DP according to an embodiment of the present invention may be an emissive display panel. As an example, the display panel DP may be an organic light emitting display panel, an inorganic light emitting display panel, or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel may include an organic light emitting material. The light-emitting layer of the inorganic light-emitting display panel may include an inorganic light-emitting material. The light emitting layer of the quantum dot light emitting display panel may include quantum dots, quantum rods, etc. Hereinafter, the display panel DP in this embodiment will be described as an organic light emitting display panel.

The display panel DP outputs an image IM, and the output image IM may be displayed through the display surface IS.

The input sensor (ISU) is disposed on the display panel (DP) and can detect external input. The input sensor (ISU) may be placed directly on the display panel (DP). According to an embodiment of the present invention, the input sensor ISU may be formed on the display panel DP through a continuous process. That is, when the input sensor ISU is placed directly on the display panel DP, an internal adhesive film (not shown) is not placed between the input sensor ISU and the display panel DP. However, an internal adhesive film may be disposed between the input sensor (ISU) and the display panel (DP). In this case, the input sensor (ISU) is not manufactured through a continuous process with the display panel (DP), but is manufactured through a separate process from the display panel (DP) and then applied to the upper surface of the display panel (DP) by an internal adhesive film. can be fixed to

The window WM may be made of a transparent material capable of emitting an image IM. For example, it may be made of glass, sapphire, plastic, etc. The window WM is shown as a single layer, but is not limited to this and may include a plurality of layers.

Meanwhile, although not shown, the non-display area NDA of the above-described display device DD may be substantially provided as an area in which a material containing a predetermined color is printed in one area of the window WM. As an example of the present invention, the window WM may include a light-shielding pattern for defining a non-display area NDA. The light blocking pattern may be a colored organic film and may be formed, for example, by a coating method.

The window WM may be coupled to the display module DM through an adhesive film. As an example of the present invention, the adhesive film may include an optically clear adhesive film (OCA, Optically Clear Adhesive film). However, the adhesive film is not limited to this and may include conventional adhesives or adhesives. For example, the adhesive film may include optically clear adhesive resin (OCR) or pressure sensitive adhesive film (PSA).

An anti-reflection panel (RPP) may be further disposed between the window WM and the display module DM. The anti-reflection panel (RPP) reduces the reflectance of external light incident from the upper side of the window WM. The anti-reflection layer according to an embodiment of the present invention may include a phase retarder and a polarizer. In one embodiment, the anti-reflective layer may include color filters. The arrangement of the color filters may be determined considering the colors of light generated by the plurality of pixels (PX, see FIG. 5) included in the display panel DP. The antireflection layer may further include a light blocking pattern. In one embodiment of the present invention, the anti-reflection panel (RPP) may be omitted or may be built into the display module (DM).

The display module (DM) can display an image (IM) according to electrical signals and transmit/receive information about external input. The display module (DM) may be defined by an active area (AA) and a peripheral area (NAA). The active area (AA) may be defined as an area that emits the image (IM) provided from the display module (DM). Additionally, the active area (AA) may be defined as an area where the input sensor (ISU) detects an external input applied from outside.

The peripheral area (NAA) is adjacent to the active area (AA). For example, the surrounding area (NAA) may surround the active area (AA). However, this is shown as an example, and the peripheral area (NAA) may be defined in various shapes and is not limited to any one embodiment. According to one embodiment, the active area AA of the display module DM may correspond to at least a portion of the display area DA.

The display module (DM) may further include a circuit board (FCB). The circuit board (FCB) may be a flexible printed circuit board. The circuit board (FCB) may be electrically connected to the display panel (DP). The circuit board (FCB) may include a plurality of driving elements. The plurality of driving elements may include circuits for driving the display panel DP and readout circuits ROC_M and ROC_S for driving the input sensor ISU.

The input sensor (ISU) may be electrically connected to the readout circuits (ROC_M and ROC_S) through the circuit board (FCB). The input sensor and readout circuits (ROC_M, ROC_S) will be described in detail later.

The display device (DD) further includes an external case (BC) that accommodates the display module (DM). The outer case BC can be combined with the window WM to define the appearance of the display device DD. The outer case (BC) absorbs shock applied from the outside and protects the components contained in the outer case (BC) by preventing foreign substances/moisture, etc. from penetrating into the display module (DM). Meanwhile, as an example of the present invention, the outer case BC may be provided in a form in which a plurality of storage members are combined.

The display device DD according to an embodiment includes an electronic module including various functional modules for operating the display module DM, and a power supply module that supplies power required for the overall operation of the display device DD (e.g. , battery), a bracket that is combined with the display module (DM) and/or the external case (BC) to divide the internal space of the display device (DD), etc. may further be included.

Figure 3 is a cross-sectional view taken along the cutting line II' shown in Figure 2.

In FIG. 3 , the components of the display device DD are simply shown to explain their stacking relationship.

The display device DD according to an embodiment of the present invention may include a display panel DP, an input sensor ISU, an anti-reflector panel (RPP), and a window WM. At least some of the components of the display panel (DP), input sensor (ISU), anti-reflection panel (RPP), and window (WM) are formed by a continuous process, or at least some of the components are bonded to each other through an adhesive member. It can be. For example, the input sensor (ISU) and the anti-reflection panel (RPP) may be coupled by the adhesive member (AD1). The anti-reflection panel (RPP) and the window (WM) may be coupled by an adhesive member (AD2).

The adhesive members AD1 and AD2 are transparent adhesive members such as pressure sensitive adhesive film (PSA, Pressure Sensitive Adhesive film), optically clear adhesive film (OCA, Optically Clear Adhesive film), or optically clear adhesive resin (OCR, Optically Clear Resin). It can be. The adhesive member described below may include a conventional adhesive or adhesive. In one embodiment of the present invention, the anti-reflective panel (RPP) and window (WM) may be replaced with other components or omitted.

In FIG. 3 , the display panel DP and the input sensor ISU formed through a continuous process are directly disposed on the display panel DP. In this specification, “component B is disposed directly on component A” means that no separate adhesive layer/adhesive member is disposed between component A and component B. Component B is formed through a continuous process on the base surface provided by component A after component A is formed.

In this embodiment, the anti-reflective panel (RPP) and window (WM) are of the “panel” type, and the input sensor (ISU) is of the “layer” type. The “panel” type includes a base layer that provides a base surface, such as a synthetic resin film, composite material film, glass substrate, etc., but the “layer” type may omit the base layer. In other words, “layer” type components are placed on a base surface provided by other components. In one embodiment of the present invention, the anti-reflective panel (RPP) and window (WM) may be of the “layer” type.

The display panel DP generates an image, and the input sensor ISU acquires coordinate information of an external input (eg, a touch event). Although not separately shown, the display device DD according to an embodiment of the present invention may further include a protection member disposed on the lower surface (or rear surface) of the display panel DP. The protection member and the display panel DP may be coupled through an adhesive member.

The display panel DP according to an embodiment of the present invention may be an emissive display panel, but is not particularly limited. For example, the display panel DP may be an organic light emitting display panel or a quantum dot light emitting display panel. The panels are differentiated according to the constituent materials of the light emitting elements. The light emitting layer of the organic light emitting display panel may include an organic light emitting material. The light emitting layer of the quantum dot light emitting display panel may include quantum dots and/or quantum rods. Hereinafter, the display panel DP will be described as an organic light emitting display panel.

The anti-reflection panel (RPP) reduces the reflectance of external light incident from the upper side of the window WM. An anti-reflection panel (RPP) according to an embodiment of the present invention may include a retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and polarizer may further include a protective film. The phase retarder and polarizer itself or the protective film can be defined as the base layer of the anti-reflection panel (RPP).

An anti-reflection panel (RPP) according to an embodiment of the present invention may include color filters. Color filters have a predetermined arrangement. The arrangement of the color filters may be determined by considering the emission colors of the pixels included in the display panel DP. The anti-reflective panel (RPP) may further include a black matrix adjacent to the color filters.

An anti-reflection panel (RPP) according to an embodiment of the present invention may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers. The first reflected light and the second reflected light reflected from the first reflective layer and the second reflective layer, respectively, may interfere destructively, thereby reducing the external light reflectance.

The window WM according to an embodiment of the present invention may include a glass substrate and/or a synthetic resin film. The window (WM) is not limited to a single layer. The window WM may include two or more films joined by an adhesive member. Although not separately shown, the window WM may further include a functional coating layer. The functional coating layer may include an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer.

The input sensor (ISU) and display panel (DP) are described in detail below.

FIG. 4 is a cross-sectional view of the display panel DP shown in FIG. 3 .

As shown in FIG. 4, the display panel (DP) includes a base layer (BL), a circuit element layer (DP-CL) disposed on the base layer (BL), a light emitting element layer (DP-OLED), and a thin film encapsulation layer. (TFE). An active area (AA) and a peripheral area (NAA) corresponding to the image area (DD-DA) and the bezel area (DD-NDA) shown in FIG. 1 may be defined on the display panel (DP). In this specification, “region/part and region/part correspond” means “overlapping with each other,” but are not limited to having the same area and/or the same shape.

The base layer BL may include at least one synthetic resin film. The base layer BL may include a glass substrate, a metal substrate, or an organic/inorganic composite material substrate.

A circuit element layer (DP-CL) is disposed on the base layer (BL). The circuit element layer (DP-CL) includes at least one insulating layer and circuit elements. The insulating layer includes at least one inorganic layer and at least one organic layer. Circuit elements may include signal lines and pixel driving circuits.

A light emitting device layer (DP-OLED) is disposed on the circuit device layer (DP-CL). The light emitting device layer (DP-OLED) may include organic light emitting diodes. The light emitting device layer (DP-OLED) may further include an organic layer such as a pixel defining layer.

The thin film encapsulation layer (TFE) may be disposed on the light emitting device layer (DP-OLED) to encapsulate the light emitting device layer (DP-OLED). The thin film encapsulation layer (TFE) may entirely cover the active area (AA). The thin film encapsulation layer (TFE) may cover a portion of the peripheral area (NAA).

The thin film encapsulation layer (TFE) includes a plurality of thin films. Some thin films are placed to improve optical efficiency, and some thin films are placed to protect organic light emitting diodes.

Figure 5 is a plan view of the display panel DP according to an embodiment of the present invention.

As shown in FIG. 5, the display panel DP includes a scan driving circuit (SDC), an emission driving circuit (EDC), a plurality of signal lines (SGL, hereinafter referred to as signal lines), and a plurality of signal pads (DP- It may include PD, IS-PD, hereinafter signal pads) and a plurality of pixels (PX, hereinafter referred to as pixels).

The scan driving circuit (SDC) generates a plurality of scan signals (hereinafter, scan signals) and sequentially outputs the scan signals to a plurality of scan lines (SL, hereinafter, scan lines), which will be described later.

The emission driving circuit (EDC) generates a plurality of emission control signals (hereinafter referred to as emission control signals) and sequentially outputs the emission control signals to a plurality of emission control lines (EL, hereinafter referred to as emission control lines) described later. do.

The scan driving circuit (SDC) and the light emission driving circuit (EDC) may include a plurality of transistors formed through the same process as the transistors in the pixels (PX).

The signal lines (SGL) include scan lines (SL), data lines (DL), power line (PL), emission control lines (EL), and control signal line (CSL). Each of the scan lines SL, data lines DL, and emission control lines EL is connected to a corresponding pixel PX among the pixels PX. The power line PL is commonly connected to the pixels PX. The control signal line (CSL1) may provide control signals to the scan driving circuit (SDC). The control signal line (CSL2) may provide control signals to the light emission driving circuit (EDC). The power line PL may provide voltage required for the operation of the pixels PX. The power line PL may include a plurality of lines providing different voltages.

In this embodiment, the signal lines (SGL) may further include auxiliary lines (SSL). In one embodiment of the present invention, auxiliary lines (SSL) may be omitted. The auxiliary lines (SSL) are respectively connected to contact holes (CNT). The auxiliary lines (SSL) may be electrically connected to signal lines of the input sensor (ISU, see FIG. 6), which will be described later, through contact holes (CNT).

The display panel DP may include a pad area PP. A plurality of signal pads DP-PD and IS-PD may be disposed in the pad area PP of the display panel DP. The signal pads DP-PD and IS-PD are first type signal pads connected to the data lines DL, the power line PL, and the control signal lines CSL1 and CSL2. and second type signal pads (IS-PD) connected to auxiliary lines (SSL). The first type signal pads DP-PD and the second type signal pads IS-PD are disposed adjacent to each other in the pad area PP defined in a portion of the peripheral area NAA. The stacked structure or constituent materials of the signal pads DP-PD and IS-PD are not distinct from each other and may be formed through the same process. The first type signal pads DP-PD and the second type signal pads IS-PD may be electrically connected to the circuit board FCB shown in FIG. 2 .

The active area AA may be defined as an area where pixels PX are arranged. A plurality of electronic devices are disposed in the active area (AA). Electronic devices include an organic light emitting diode provided in each pixel PX and a pixel driving circuit connected thereto. The scan driving circuit (SDC), the light emission driving circuit (EDC), the signal lines (SGL), the signal pads (DP-PD, IS-PD), and the pixel driving circuit are the circuit element layer (DP-CL) shown in FIG. ) can be included.

Although not shown in the drawing, each pixel PX may include a plurality of transistors, a capacitor, and an organic light emitting diode. The pixels PX emit light in response to signals received through the scan lines SL, data lines DL, emission control lines EL, and power line PL.

In one embodiment, the display panel DP may further include a data driving circuit. In one embodiment, the data driving circuit may be disposed between the active area (AA) and the pad area (PP). The data driving circuit is electrically connected to the pixels PX through data lines DL and can provide data signals to the pixels PX.

In another embodiment, the data drive circuit may be placed on the circuit board (FCB) shown in FIG. 2.

Figure 6 is a plan view showing the configuration of an input sensor (ISU) according to an embodiment of the present invention.

Referring to FIG. 6, the input sensor (ISU) may include a sensing area (SA) and a non-sensing area (NSA). The sensing area (SA) may be an area activated according to an electrical signal. For example, the sensing area (SA) may be an area that detects an input. The non-sensing area (NSA) may surround the sensing area (SA). The detection area (SA) may correspond to the active area (AA) of FIG. 5, and the non-detection area (NSA) may correspond to the peripheral area (NAA) of FIG. 5.

The input sensor ISU includes first to sixteenth transmission electrodes (TE1 to TE16) and first to tenth reception electrodes (RE1 to RE10). The first to sixteenth transmission electrodes TE1 to TE16 and the first to tenth reception electrodes RE1 to RE10 are disposed in the sensing area SA. The first to sixteenth transmission electrodes TE1 to TE16 and the first to tenth reception electrodes RE1 to RE10 are electrically insulated from each other and intersect within the sensing area SA. As an example of the present invention, the input sensor (ISU) includes first to sixteenth transmission electrodes (TE1 to TE16) and first to tenth reception electrodes (RE1 to RE10), but the present invention is not limited thereto. . The number of each of the transmitting electrodes and receiving electrodes can be changed in various ways. In FIG. 6, the number of transmission electrodes is shown to be greater than the number of reception electrodes, but in other embodiments, the number of transmission electrodes may be greater than or equal to the number of reception electrodes.

In this specification, in order to clearly distinguish between the electrodes (TE1 to TE16) and the electrodes (RE1 to RE10), the electrodes (TE1 to TE16) are referred to as transmitting electrodes, and the electrodes (RE1 to RE10) are referred to as receiving electrodes. Although named, the functions of the electrodes (TE1 to TE16) and RE1 to RE10 in the present invention are not limited to the names. Depending on the operation mode, the transmitting electrodes (TE1 to TE16) operate as receiving electrodes as well as transmitting electrodes. This can be done, and the receiving electrodes (RE1 to RE10) can operate as not only a receiving electrode but also a transmitting electrode.

Each of the first to sixteenth transmission electrodes TE1 to TE16 extends in the second direction DR2. The first to sixteenth transmission electrodes TE1 to TE16 may be arranged to be spaced apart from each other in the first direction DR1. The first to sixteenth transmission electrodes TE1 to TE16 may be electrically separated from each other. Each of the first to sixteenth transmission electrodes TE1 to TE16 electrically connects the first sensing patterns SP1 and the first sensing patterns SP1 arranged to be spaced apart in the first direction DR1. Includes connection patterns (CP1). The first sensing patterns SP1 and the first connection patterns CP1 are disposed on different layers and do not have a unified shape.

Each of the first to tenth receiving electrodes RE1 to RE10 extends in the first direction DR1. The first to tenth receiving electrodes RE1 to RE10 may be arranged to be spaced apart from each other in the second direction DR2. The first to tenth receiving electrodes RE1 to RE10 may be electrically separated from each other. The first to tenth receiving electrodes (RE1 to RE10) are arranged to cross the first to sixteenth transmission electrodes (TE1 to TE16) and may be electrically insulated from each other. Each of the first to tenth receiving electrodes (RE1 to RE10) has second sensing patterns (SP2) arranged to be spaced apart in the first direction (DR1) and a second sensing electrode that electrically connects the second sensing patterns (SP2). Contains connection patterns (CP2). The second sensing patterns SP2 and the second connection patterns CP2 may have an integrated shape.

In FIG. 6 , each of the first and second sensing patterns SP1 and SP2 is shown as a diamond shape, but the present invention is not limited thereto. The first and second sensing patterns SP1 and SP2 may have different polygonal shapes.

Each of the first to sixteenth transmission electrodes (TE1 to TE16) and the first to tenth reception electrodes (RE1 to RE10) may have a mesh shape. Each of the first to sixteenth transmission electrodes (TE1 to TE16) and the first to tenth reception electrodes (RE1 to RE10) has a mesh shape, so that the electrodes of the display panel (DP, see FIG. 5) (e.g. , the parasitic capacitance between the second electrode (CE, see FIG. 7) can be reduced.

The input sensor (ISU) obtains position information about an external input through a change in mutual capacitance between the first to sixteenth transmission electrodes (TE1 to TE16) and the first to tenth reception electrodes (RE1 to RE10). can do.

The input sensor ISU may further include first to sixteenth transmission lines (TL1 to TL16) and first to tenth reception lines (RL1 to RL10). The first to sixteenth transmission lines (TL1 to TL16) and the first to tenth reception lines (RL1 to RL10) may be disposed in the non-detection area (NSA). The first to sixteenth transmission lines TL1 to TL16 may be electrically connected to one side of the first to sixteenth transmission electrodes TE1 to TE16. The first to fifth receiving lines (RL1 to RL5) are electrically connected to one side of the first to fifth receiving electrodes (RE1 to RE5), and the sixth to tenth receiving lines (RL6 to RL10) are electrically connected to one side of the first to fifth receiving electrodes (RE1 to RE5). It is electrically connected to the other side of the 6th to 10th receiving electrodes (RE6 to RE10). However, the present invention is not limited to this.

The input sensor (ISU) is electrically connected to the readout circuits (ROC_M, ROC_S, see FIG. 2) through the first to sixteenth transmission lines (TL1 to TL16) and the first to tenth reception lines (RL1 to RL10). It is connected to The readout circuits (ROC_M, ROC_S) can control the operation of the input sensor (ISU).

The readout circuits (ROC_M, ROC_S) transmit transmission signals to the first to sixteenth transmission lines (TL1 to TL16) and/or the first to tenth reception lines (RL1 to RL10), and A reception signal may be received from 16 transmission lines (TL1 to TL16) and/or first to tenth reception lines (RL1 to RL10).

In one embodiment, the first to sixteenth transmission lines (TL1 to TL16) and the first to tenth reception lines (RL1 to RL10) of the input sensor (ISU) are connected to the display panel through the contact holes (CNT). It may be electrically connected to the readout circuits (ROC_M, ROC_S) shown in FIG. 2 through the auxiliary lines (SSL) of DP and the second type signal pads (IS-PD). However, the present invention is not limited to this.

In one embodiment, the input sensor ISU of the display device DD includes pads electrically connected to the first to sixteenth transmission lines TL1 to TL16 and the first to tenth reception lines RL1 to RL10. It can be included. In this case, the circuit board FCB including the readout circuits ROC_M and ROC_S may be directly connected to the pads of the input sensor ISU without going through the display panel DP.

Figure 7 is a cross-sectional view of a display device according to an embodiment of the present invention.

As shown in FIG. 7, the display panel DP includes a base layer (BL), a circuit element layer (DP-CL) disposed on the base layer (BL), a light emitting element layer (DP-OLED), and a thin film encapsulation layer. layer (TFE). Although not separately shown, the display panel DP may further include functional layers such as an anti-reflection layer and a refractive index adjustment layer.

The base layer (BL) may include a synthetic resin film. A synthetic resin layer is formed on a working substrate used when manufacturing the display panel DP. Afterwards, a conductive layer and an insulating layer are formed on the synthetic resin layer. When the working substrate is removed, the synthetic resin layer corresponds to the base layer (BL). The synthetic resin layer may be a polyimide-based resin layer, and its material is not particularly limited. Additionally, the base layer BL may include a glass substrate, a metal substrate, or an organic/inorganic composite material substrate.

The circuit element layer (DP-CL) includes at least one insulating layer and a circuit element. Hereinafter, the insulating layer included in the circuit element layer (DP-CL) is referred to as an intermediate insulating layer. The intermediate insulating layer includes at least one intermediate inorganic layer and at least one intermediate organic layer. Circuit elements include signal lines, pixel driving circuits, etc. A circuit element layer (DP-CL) can be formed through a process of forming an insulating layer, a semiconductor layer, and a conductive layer by coating, deposition, etc., and a patterning process of the insulating layer, a semiconductor layer, and a conductive layer by a photolithography process.

The light emitting device layer (DP-OLED) may include a pixel defining layer (PDL) and an organic light emitting diode (OLED). The pixel defining layer (PDL) may include an organic material. The first electrode (AE) is disposed on the circuit element layer (DP-CL). A pixel defining layer (PDL) is formed on the first electrode (AE). An opening (OP) is defined in the pixel defining layer (PDL). The opening OP of the pixel defining layer PDL exposes at least a portion of the first electrode AE. In one embodiment of the present invention, the pixel defining layer (PDL) may be omitted.

The hole control layer (HCL) may be disposed on the first electrode (AE). The light emitting layer (EML) is disposed on the hole control layer (HCL). The light emitting layer (EML) may be disposed in an area corresponding to the opening OP. That is, the light emitting layer (EML) may be formed separately in each of the pixels (PX, see FIG. 5). The light emitting layer (EML) may include organic and/or inorganic materials. The light emitting layer (EML) can generate predetermined colored light.

An electronic control layer (ECL) is disposed on the light emitting layer (EML). A second electrode (CE) is disposed on the electronic control layer (ECL). The second electrode CE is commonly disposed in the pixels PX.

A thin film encapsulation layer (TFE) is disposed on the second electrode (CE). The thin film encapsulation layer (TFE) seals the light emitting device layer (DP-OLED). The thin film encapsulation layer (TFE) includes at least one insulating layer. The thin film encapsulation layer (TFE) according to an embodiment of the present invention may include at least one inorganic film (hereinafter referred to as inorganic encapsulation film). The thin film encapsulation layer (TFE) according to an embodiment of the present invention may include at least one organic layer (hereinafter referred to as encapsulation organic layer) and at least one encapsulation inorganic layer.

The encapsulation inorganic film protects the light emitting device layer (DP-OLED) from moisture/oxygen, and the encapsulation organic film protects the light emitting device layer (DP-OLED) from foreign substances such as dust particles. The encapsulating inorganic film may include, but is not particularly limited to, a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The encapsulation organic layer may include an acrylic-based organic layer and is not particularly limited.

The input sensor ISU includes a base layer IL1, first and second conductive layers disposed thereon, and first and second insulating layers IL2 and IL3. The base layer IL1 may include an inorganic material, for example, a silicon nitride layer. The inorganic film disposed on the uppermost side of the thin film encapsulation layer (TFE) may also include silicon nitride, and the silicon nitride layer and base layer (IL1) of the thin film encapsulation layer (TFE) may be formed under different deposition conditions. .

The first conductive layer is disposed on the base layer IL1. The first conductive layer may include a first sensing pattern (SP1), a second sensing pattern (SP2), and a second connection pattern (CP2). The second conductive layer is disposed on the first conductive layer. The second conductive layer may include a first connection pattern CP1. The first insulating layer IL2 is disposed between the first conductive layer and the second conductive layer. The first insulating layer IL2 separates and separates the first conductive layer and the second conductive layer in cross section. A contact hole is provided in the first insulating layer IL2 to partially expose the first sensing pattern SP1, and the first connection pattern CP1 can be connected to the first sensing pattern SP1 through the contact hole. there is. The second insulating layer IL3 is disposed on the first insulating layer IL2. The second insulating layer IL3 may cover the second conductive layer. The second insulating layer IL3 protects the second conductive layer from the external environment.

Mesh lines of the first sensing pattern SP1 and the second sensing pattern SP2 may define a plurality of mesh holes. The mesh lines may have a three-layer structure of titanium/aluminum/titanium.

In the display device according to an embodiment of the present invention, the input sensor ISU may be placed directly on the display panel DP. Directly disposed in this specification means that no adhesive film is disposed between the input sensor (ISU) and the display panel (DP). That is, the input sensor ISU may be formed on the display panel DP through a continuous process. In this case, the input sensor (ISU) can be expressed as an input sensing layer.

The portion where the first electrode (AE) and the light emitting layer (EML) are disposed may be referred to as the pixel area (PXA). The pixel areas PXA may be arranged to be spaced apart from each other in the first direction DR1 and the second direction DR2 (see FIG. 5 ). The non-pixel area NPAX is disposed between the pixel areas PXA and may surround the pixel area PXA.

An anti-reflection panel (RPP) may be placed on the upper surface of the input sensor (ISU). As an example of the present invention, an anti-reflection panel (RPP) may include a polarizing film. The anti-reflection panel (RPP) may further include a protective film and other functional films in addition to the polarizing film, but hereinafter, only the polarizing film is shown for convenience of explanation. An adhesive member (AD1) may be disposed between the anti-reflection panel (RPP) and the input sensor (ISU). Accordingly, the anti-reflection panel (RPP) can be coupled to the input sensor (ISU) by the adhesive member (AD1). The window WM may be coupled to the anti-reflection panel RPP through the adhesive member AD2.

Referring again to FIG. 6, the input sensor (ISU) may be a capacitive touch sensor. For example, one of the first to sixteenth transmission electrodes (TE1 to TE16) and the first to tenth reception electrodes (RE1 to RE10) receives the transmission signal, and the other receives the first to sixteenth transmission signal. The amount of change in capacitance between the electrodes TE1 to TE16 and the first to tenth receiving electrodes RE1 to RE10 is output as a detection signal. For example, when the first transmission electrode TE1 receives a transmission signal (or driving signal), the first transmission electrode TE1 is electrostatically coupled to the first to tenth reception electrodes RE1 to RE10. When a part of the user's body is located on a specific receiving electrode, for example, the first receiving electrode (RE1) among the electrostatically coupled first to tenth receiving electrodes (RE1 to RE10), the first transmitting electrode (TE1) and The capacitance between the first receiving electrodes RE1 changes. The readout circuit (ROC, see FIG. 2) detects the changed capacitance of the detection signal received from the first reception line (RL1) connected to the first reception electrode (RE1) and calculates the coordinate information of the user's touch location. there is.

FIG. 8 is a diagram illustrating the connection relationship between the input sensor (ISU) and the readout circuits (ROC_M and ROC_S) according to an embodiment of the present invention.

Referring to FIG. 8, in one embodiment, the readout circuit (ROC_M) may operate as a master, and the readout circuit (ROC_S) may operate as a slave. In another embodiment, the readout circuit (ROC_M) may operate as a slave and the readout circuit (ROC_S) may operate as a master. In the following description, the readout circuit (ROC_M) and the readout circuit (ROC_S) are called a master leadout circuit and a slave leadout circuit, respectively.

The first to eighth transmission lines TL1 to TL8 and the first to fifth reception lines RL1 to RL5 are electrically connected to the master readout circuit ROC_M. The 9th to 16th transmission lines (TL9 to TL16) and the 6th to 10th reception lines (RL6 to RL10) are electrically connected to the slave readout circuit (ROC_S).

The first to fifth receiving lines RL1 to RL5 extend from one side of the first to fifth receiving electrodes RE1 to RE5 and are disposed in the first non-sensing area NSA1 of the non-sensing areas NSA. You can. The sixth to tenth receiving lines (RL6 to RL10) extend from the other side of the sixth to tenth receiving electrodes (RE6 to RE10) and are disposed in the second non-sensing area (NSA2) of the non-sensing area (NSA). You can. The second non-detection area NSA2 may be arranged to be spaced apart from the first detection area NSA1 with the detection area SA interposed therebetween.

Referring again to FIG. 1, efforts are continuing to minimize the non-display area (NDA) to improve the aesthetics of the display device (DD). Generally, the non-detection area (NSA) corresponds to the non-display area (NDA). The area of the non-detection area (NSA) is reduced by arranging the first to tenth receiving lines (RL1 to RL10) in one of the first non-detection area (NSA1) and the second non-detection area (NSA2). In this case, the wiring width of each of the first to tenth reception lines (RL1 to RL10) and/or the first to sixteenth transmission lines (TL1 to TL16) and the spacing between the lines must be reduced. In this case, the resistance of the first to tenth reception lines (RL1 to RL10) and/or the first to sixteenth transmission lines (TL1 to TL16) increases, so the quality of the reception signals and/or transmission signals may deteriorate. You can.

In addition, since the areas of the first non-detection area (NSA1) and the second non-detection area (NSA2) are limited, the first to tenth reception lines (RL1 to RL10) and/or the first to sixteenth transmission lines (TL1 to TL1) There is a limit to increasing the number of TL16).

In one embodiment, the first to tenth reception lines RL1 to RL10 are distributed and disposed in the first non-detection area NSA1 and the second non-detection area NSA2. (RL1 to RL10) Each wiring width and wiring spacing can be sufficiently secured.

In Figure 8, the first to eighth transmission lines (TL1 to TL8) and the first to fifth reception lines (RL1 to RL5) are electrically connected to the master readout circuit (ROC_M), and the ninth to sixteenth transmission lines (TL1 to TL8) are electrically connected to the master readout circuit (ROC_M). Although the lines TL9 to TL16 and the sixth to tenth reception lines RL6 to RL10 are shown as being electrically connected to the slave readout circuit ROC_S, the present invention is not limited thereto.

In another embodiment, the first to eighth transmission lines TL1 to TL8 and the first to fifth reception lines RL1 to RL5 are electrically connected to the slave readout circuit ROC_S, and the ninth to eighth transmission lines TL1 to TL8 are electrically connected to the slave readout circuit ROC_S. The 16 transmission lines TL9 to TL16 and the 6th to 10th reception lines RL6 to RL10 may be electrically connected to the master readout circuit ROC_M. In this case, the first to fifth receiving lines RL1 to RL5 are disposed in the second non-detecting area NSA2, and the sixth to tenth receiving lines RL6 to RL10 are disposed in the first non-detecting area NSA1. ) can be placed in.

In addition, Figure 8 shows that 8 transmission lines and 5 reception lines are connected to the master readout circuit (ROC_M) and the slave readout circuit (ROC_S), respectively, but the present invention is not limited to this. The number of transmission lines and reception lines connected to each of the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) can be changed in various ways.

In one embodiment, the master readout circuit (ROC_M) may provide a synchronization signal (SYNC) to the slave readout circuit (ROC_S). In one embodiment, the slave readout circuit (ROC_S) may provide a detection signal (SS) to the master readout circuit (ROC_M).

Figure 9 is a block diagram showing the circuit configuration of the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) according to an embodiment of the present invention.

Referring to FIG. 9, the master readout circuit (ROC_M) includes a transmitting circuit 110, a receiving circuit 120, a processor 130, a host interface 140, a sensor interface 150, and a memory 160. .

The processor 130 may control the operations of the transmitting circuit 110, the receiving circuit 120, the host interface 140, the sensor interface 150, and the memory 160. The processor 130 generates signals to be transmitted to the first to eighth transmission lines TL1 to TL8 of the input sensor ISU (see FIG. 8) and converts the signal received from the input sensor ISU into a detection signal. do.

The transmission circuit 110 converts the signal provided from the processor 130 into a first transmission signal TX1 and provides it to the input sensor ISU. The first transmission signal TX1 may be provided through the first to eighth transmission lines TL1 to TL8 shown in FIG. 8.

The receiving circuit 120 receives the first input signal RX1 from the input sensor ISU and stores it in the memory 160. The first input signal RX1 may be received from the first to fifth reception lines RL1 to RL5 shown in FIG. 8.

The host interface 140 within the master readout circuit (ROC_M) may communicate with a host processor (not shown). The host interface 140 may receive a synchronization signal from the host processor and provide the synchronization signal to the processor 130. The host interface 140 receives a detection signal from the processor 130 and outputs touch position information (XY) corresponding to the detection signal. Touch location information (XY) may be provided to the host processor. The touch position information (XY) may include information indicating the touch position of the input sensor (ISU). In one embodiment, the touch location information (XY) may include coordinate information indicating the touch location as well as biometric information such as the user's fingerprint.

The sensor interface 150 in the master readout circuit (ROC_M) may communicate with the sensor interface 250 in the slave readout circuit (ROC_S). The sensor interface 150 transmits a synchronization signal (SYNC) to the sensor interface 250 and receives a detection signal (SS) from the sensor interface 250. The sensor interface 150 provides a detection signal SS to the processor 130. The processor 130 provides information indicating the touch position of the input sensor (ISU) based on the detection signal received from the input sensor (ISU) and the detection signal (SS) from the sensor interface 150 through the host interface 140. It can be provided as a host processor. That is, the detection signal provided from the host interface 140 to the host processor may be information indicating the touch position among the entire area of the input sensor (ISU).

The slave readout circuit (ROC_S) includes a transmission circuit 210, a reception circuit 220, a processor 230, a host interface 240, a sensor interface 250, and a memory 260.

The transmitting circuit 210, receiving circuit 220, and processor 230 in the slave readout circuit (ROC_S) are the transmitting circuit 110, receiving circuit 120, and processor 130 in the master readout circuit (ROC_M). It can operate similarly.

The transmission circuit 210 in the slave readout circuit (ROC_S) generates a signal to be transmitted to the 9th to 16th transmission lines (TL9 to TL16) of the input sensor (ISU) (see FIG. 8), and the input sensor (ISU) Converts the signal received from to a detection signal.

The host interface 240 in the slave readout circuit (ROC_S) may not substantially perform any operation.

The receiving circuit 220 in the slave readout circuit (ROC_S) receives the second input signal (RX2) from the input sensor (ISU) and stores it in the memory 260. The second input signal RX1 may be received from the 6th to 10th reception lines RL6 to RL10 shown in FIG. 8.

The sensor interface 250 in the slave readout circuit (ROC_S) may communicate with the sensor interface 150 in the master readout circuit (ROC_M). The sensor interface 250 receives a synchronization signal (SYNC) from the sensor interface 150 and provides a detection signal (SS) to the sensor interface 150.

The processor 230 may provide a transmission signal to the transmission circuit 210 in response to the synchronization signal (SYNC) received from the sensor interface 250. The processor 230 may provide the detection signal SS received from the receiving circuit 220 to the sensor interface 150 through the sensor interface 250.

Each of the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) may further include a clock generator for generating a clock, a voltage generator for generating a driving voltage, etc.

FIG. 10 is a timing diagram for explaining the operation of the master readout circuit (ROC_M) and slave readout circuit (ROC_S) shown in FIG. 9.

Referring to FIGS. 9 and 10, the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) detect external input in each of the touch report sections (ST1 and ST2) and provide location information corresponding to the detected input. can be output.

The touch report section (ST1) includes a detection section (T1) and a communication section (T2). During the detection period (T1), the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) transmit the first and second transmission signals (TX1, TX2) to the input sensor (ISU), and the input sensor (ISU) The first and second input signals (RX1, RX2) may be received from. During the communication period (T2), the slave readout circuit (ROC_S) transmits the detection signal (SS) to the master readout circuit (ROC_M).

The master readout circuit (ROC_M) transmits a synchronization signal (SYNC) to the slave readout circuit (ROC_S). The first transmission signal TX1 of the master readout circuit (ROC_M) and the second transmission signal TX2 of the slave readout circuit (ROC_S) may be transmitted to the input sensor (ISU) in synchronization with the synchronization signal (SYNC). .

The operation sequence of the master readout circuit (ROC_M) and slave readout circuit (ROC_S) is as follows.

① Step: When the input signals (RX1) are received after transmitting the first transmission signal (TX1), the master readout circuit (ROC_M) stores the first received signal (RXS1) corresponding to the input signal (RX1) in memory ( 160) and save it. The first input signals RX1 are signals received from the first to fifth reception lines RL1-RL5 for the first transmission signal TX1. At the same time, when the second input signal (RX2) for the first transmission signal (TX1) is received, the slave readout circuit (ROC_S) stores the second received signal (RXS2) corresponding to the second input signal (RX2) in memory ( 260). The second input signal RX2 is signals received from the 6th to 10th reception lines RL6-RL10 for the first transmission signal TX1.

② Step: After transmitting the second transmission signal (TX2), the slave readout circuit (ROC_S) receives the second input signal (RX2), and transmits the second reception signal (RXS2) corresponding to the second input signal (RX2). ) is stored in memory 260. The second input signal (RX2) is signals received from the 6th to 10th reception lines (RL6-RL10) for the second transmission signal (TX2). At the same time, when the first input signal (RX1) for the second transmission signal (TX2) is received, the master readout circuit (ROC_M) stores the first received signal (RXS1) corresponding to the first input signal (RX1) in memory ( 260). The first input signal (RX1) is signals received from the first to fifth reception lines (RL1-RL5) for the second transmission signal (TX2).

Step ③: The slave readout circuit (ROC_S) transmits the second received signal (RXS2) stored in the memory 260 as a detection signal (SS) to the master readout circuit (ROC_M). The detection signal SS may include both a second reception signal RXS2 for the first transmission signal TX1 and a second reception signal RXS2 for the second transmission signal TX2. That is, the detection signal SS may include both the second input signal RX2 for the first transmission signal TX1 and the second input signal RX2 for the second transmission signal TX2. The master readout circuit (ROC_M) stores the second received signal (RXS2) included in the detection signal (SS) in the memory 160.

Step ④: The master readout circuit (ROC_M) stores the received second reception signal (RXS2) in the memory 160. The memory 160 may store a first received signal (RXS1) and a second received signal (RXS2) for each of the first and second transmitted signals (TX1) and TX2.

Step ⑤: The processor 130 in the master readout circuit (ROC_M) calculates the touch position based on the first received signal (RXS1) and the second received signal (RXS2) stored in the memory 160.

Step ⑥: The host interface 140 within the master readout circuit (ROC_M) may receive a detection signal from the processor 130 and provide touch position information (XY) corresponding to the detection signal to the host processor.

Figure 11 is a block diagram showing the circuit configuration of the master readout circuit (ROC_M) and the slave readout circuits (ROC_S1 and ROC_S2) according to an embodiment of the present invention.

The master readout circuit (ROC_M) shown in FIG. 11 has substantially the same circuit configuration as the master readout circuit (ROC_M) shown in FIG. 9 and operates similarly, so overlapping descriptions will be omitted.

The slave readout circuits (ROC_S1 and ROC_S2) shown in FIG. 11 have substantially the same circuit configuration as the slave readout circuit (ROC_S) shown in FIG. 9 and operate similarly, so overlapping descriptions will be omitted.

6 and 11, the first to sixteenth transmission lines (TL1 to TL16) and the first to tenth reception lines (RL1 to RL10) include a master readout circuit (ROC_M) and a slave readout circuit. It can be electrically connected to (ROC_S1, ROC_S2).

In one embodiment, the master readout circuit (ROC_M) may be electrically connected to the first to fifth transmission lines (TL1 to TL5) and the first to third reception lines (RL1 to RL3). The slave readout circuit (ROC_S1) may be electrically connected to the sixth to tenth transmission lines (TL6 to TL10) and the fourth to sixth reception lines (RL4 to RL6). The slave readout circuit (ROC_S2) may be electrically connected to the 11th to 16th transmission lines (TL11 to TL16) and the 7th to 10th reception lines (RL7 to RL10).

The master readout circuit (ROC_M) includes a transmission circuit 110, a reception circuit 120, a processor 130, a host interface 140, a sensor interface 150, and a memory 160.

The sensor interface 150 in the master readout circuit (ROC_M) may communicate with the sensor interface 250 in the slave readout circuit (ROC_S1) and the sensor interface 350 in the slave readout circuit (ROC_S2). The sensor interface 150 transmits a first synchronization signal (SYNC1) to the sensor interface 250 and receives a first detection signal (SS1) from the sensor interface 250. The sensor interface 150 transmits a second synchronization signal (SYNC2) to the sensor interface 350 and receives a second detection signal (SS2) from the sensor interface 250.

The sensor interface 150 provides the first detection signal SS2 and the second detection signal SS2 to the processor 130. The processor 130 operates the input sensor based on the detection signal received from the input sensor (ISU), the first detection signal (SS1) from the sensor interface 150, and the second detection signal (SS2) from the sensor interface 250. Information indicating the touch position of (ISU) may be provided to the host processor through the host interface 140. That is, the detection signal provided from the host interface 140 to the host processor may be information indicating the touch position among the entire area of the input sensor (ISU).

The slave readout circuit (ROC_S1) includes a transmission circuit 210, a reception circuit 220, a processor 230, a host interface 240, a sensor interface 250, and a memory 260.

The slave readout circuit (ROC_S2) includes a transmission circuit 310, a reception circuit 320, a processor 330, a host interface 340, a sensor interface 350, and a memory 360.

The host interface 240 in the slave read-out circuit (ROC_S1) and the host interface 340 in the slave read-out circuit (ROC_S2) may not substantially perform any operation.

The sensor interface 250 in the slave readout circuit (ROC_S1) may communicate with the sensor interface 150 in the master readout circuit (ROC_M). The sensor interface 250 receives a first synchronization signal (SYNC1) from the sensor interface 150 and provides a first detection signal (SS1) to the sensor interface 150. The first detection signal SS1 may include the second reception signal RXS2 stored in the memory 260.

The sensor interface 350 in the slave readout circuit (ROC_S2) may communicate with the sensor interface 150 in the master readout circuit (ROC_M). The sensor interface 350 receives the second synchronization signal (SYNC2) from the sensor interface 150 and provides a second detection signal (SS2) to the sensor interface 150. The second detection signal SS2 may include the third reception signal RXS3 stored in the memory 360.

The master readout circuit (ROC_M) may store the second received signal (RXS2) and the third received signal (RXS3) received from the slave readout circuits (ROC_S1 and ROC_S2) in the memory 160.

The processor 130 in the master readout circuit (ROC_M) may calculate the touch position information (XY) based on the first received signal (RXS1) as well as the second received signal (RXS2) and the third received signal (RXS3). .

Each of the master readout circuit (ROC_M) and the slave readout circuits (ROC_S1 and ROC_S2) may further include a clock generator for generating a clock, a voltage generator for generating a driving voltage, etc.

As shown in FIG. 11, one master readout circuit (ROC_M) can communicate with a plurality of slave readout circuits (ROC_S1 and ROC2).

FIG. 12 is a diagram illustrating the connection relationship between the input sensor ISU and the first circuit board FCB1 and the second circuit board FCB2 according to an embodiment of the present invention.

Referring to FIG. 12 , the display device DD2 includes a display module DM, a first circuit board FCB11, and a second circuit board FCB12.

The display module (DM) includes a display panel (DP) and an input sensor (ISU). The input sensor (ISU) may include a sensing area (SA) and a non-sensing area (NSA). The sensing area (SA) may be an area activated according to an electrical signal. For example, the sensing area (SA) may be an area that detects an input. The non-sensing area (NSA) may surround the sensing area (SA).

The non-detection area (NSA) includes first to fourth non-detection areas (NSA1, NSA2, NSA3, and NAS4).

The first circuit board FCB11 may be connected to the first side of the display panel DP at a position adjacent to the third non-sensing area NSA3. The second circuit board FCB12 may be connected to the second side of the display panel DP at a position adjacent to the fourth non-sensing area NSA4. The master readout circuit (ROC_M) of the first circuit board (FCB11) and the slave readout circuit (ROC_S) of the second circuit board (FCB12) may be electrically connected to each other through the connection portion (CNN1). The connection part (CNN1) may be one of various components for signal transmission, such as a flexible printed circuit board, wire harness, or signal cable.

The master readout circuit (ROC_M) is disposed on the first circuit board (FCB11), and the slave readout circuit (ROC_S) is disposed on the second circuit board (FCB12). The master readout circuit (ROC_M) and the slave readout circuit (ROC_S) may include the circuit configuration shown in FIG. 9.

The master readout circuit ROC_M is electrically connected to the reception line RLa among the reception lines RLa and RLb, and is electrically connected to the transmission line TLa among the transmission lines TLa and TLb.

The slave readout circuit ROC_S is electrically connected to the reception line RLb among the reception lines RLa and RLb, and is electrically connected to the transmission line TLb among the transmission lines TLa and TLb.

The receiving lines RLa may include first to fifth receiving lines RL1 to RL5 connected to the first to fifth receiving electrodes RE1 to RE5 shown in FIG. 6 . The reception lines RLb may include sixth to tenth reception lines RL6 to RL10 connected to the sixth to tenth reception electrodes RE6 to RE10 shown in FIG. 6 .

The transmission lines TLa may include first to eighth transmission lines TL1 to TL8 connected to the first to eighth transmission electrodes TE1 to TE8 shown in FIG. 6 . The transmission lines TLb may include 9th to 16th transmission lines TL9 to TL16 connected to the 9th to 16th transmission electrodes TE9 to TE16 shown in FIG. 6 .

The receiving lines RLa are placed in the first non-detecting area NSA1, and the receiving lines RLb are placed in the second non-detecting area NSA2. The transmission lines TLa are placed in the third non-detection area NSA3, and the transmission lines TLb are placed in the fourth non-detection area NSA4.

As the reception lines (RLa, RLb) are distributed and arranged in the first non-detection area (NSA1) and the second non-detection area (NSA2), the wiring width and wiring spacing of each of the reception lines (RLa, RLb) are sufficiently secured. can do.

FIG. 13 is a diagram illustrating the connection relationship between the input sensor (ISU) and the first circuit board (FCB21) and the second circuit board (FCB22) according to an embodiment of the present invention.

Referring to FIG. 13 , the display device DD3 includes a display module DM, a first circuit board FCB21, and a second circuit board FCB22.

The display module (DM) includes a display panel (DP) and an input sensor (ISU). The input sensor (ISU) may include a sensing area (SA) and a non-sensing area (NSA). The sensing area (SA) may be an area activated according to an electrical signal. For example, the sensing area (SA) may be an area that detects an input. The non-sensing area (NSA) may surround the sensing area (SA).

The non-detection area (NSA) includes first to fourth non-detection areas (NSA1, NSA2, NSA3, and NAS4).

The first circuit board FCB21 may be connected to the display panel DP at a position adjacent to the first sensing area NSA1. The second circuit board FCB22 may be connected to the display panel DP at a position adjacent to the fourth non-sensing area NSA4. The first circuit board FCB21 and the second circuit board FCB22 may be electrically connected to each other through the connection part CNN2. The connection part (CNN2) may be one of various components for signal transmission, such as a flexible printed circuit board, wire harness, or signal cable.

The master readout circuit (ROC_M) is disposed on the first circuit board (FCB21), and the slave readout circuit (ROC_S) is disposed on the second circuit board (FCB22). The master readout circuit (ROC_M) and the slave readout circuit (ROC_S) may include the circuit configuration shown in FIG. 9.

The master readout circuit ROC_M is electrically connected to the reception line RLa among the reception lines RLa and RLb, and is electrically connected to the transmission line TLa among the transmission lines TLa and TLb.

The slave readout circuit ROC_S is electrically connected to the reception line RLb among the reception lines RLa and RLb, and is electrically connected to the transmission line TLb among the transmission lines TLa and TLb.

The receiving lines RLa may include first to fifth receiving lines RL1 to RL5 connected to the first to fifth receiving electrodes RE1 to RE5 shown in FIG. 6 . The reception lines RLb may include sixth to tenth reception lines RL6 to RL10 connected to the sixth to tenth reception electrodes RE6 to RE10 shown in FIG. 6 .

The transmission lines TLa may include first to eighth transmission lines TL1 to TL8 connected to the first to eighth transmission electrodes TE1 to TE8 shown in FIG. 6 . The transmission lines TLb may include 9th to 16th transmission lines TL9 to TL16 connected to the 9th to 16th transmission electrodes TE9 to TE16 shown in FIG. 6 .

The receiving lines RLa are placed in the first non-detecting area NSA1, and the receiving lines RLb are placed in the second non-detecting area NSA2. The transmission lines TLa are placed in the third non-detection area NSA3, and the transmission lines TLb are placed in the fourth non-detection area NSA4.

As the reception lines (RLa, RLb) are distributed and arranged in the first non-detection area (NSA1) and the second non-detection area (NSA2), the wiring width and wiring spacing of each of the reception lines (RLa, RLb) are sufficiently secured. can do.

As shown in FIGS. 12 and 13 , the master readout circuit (ROC_M) and the slave readout circuit (ROC_S) may be disposed on different circuit boards.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or have ordinary knowledge in the relevant technical field should not deviate from the spirit and technical scope of the present invention as set forth in the claims to be described later. It will be understood that the present invention can be modified and changed in various ways within the scope not permitted. Therefore, the technical scope of the present invention should not be limited to what is described in the detailed description of the specification, but should be determined by the scope of the patent claims.

DD: display device
DM: display module
DP: Display panel
ISU: input sensor
TE1 to TE8: first to eighth transmission electrodes
RE1 to RE10: 1st to 10th receiving electrodes
ROC_M: Master readout circuit
ROC_S: Slave readout circuit
110, 210, 310: Transmission circuit
120, 220, 320: Receiving circuit
130, 230, 340: Processor
140, 240, 340: Host interface
150, 250, 350: Sensor interface
160, 260, 360: Memory

Claims (20)

display panel;
an input sensor disposed on the display panel and including sensing electrodes;
a master readout circuit electrically connected to some of the sensing electrodes and generating a first received signal corresponding to a signal received from the connected sensing electrodes; and
A slave readout circuit electrically connected to another portion of the sensing electrodes and generating a second received signal corresponding to a signal received from the connected sensing electrodes,
The master readout circuit provides a synchronization signal to the slave readout circuit, the slave readout circuit operates in response to the synchronization signal, and sends a detection signal corresponding to the second received signal to the master readout circuit. Display device provided. According to claim 1,
The display device wherein the master readout circuit calculates the input position of the input sensor based on the first received signal and the second received signal. According to claim 1,
The master readout circuit is
a host interface that communicates with the host processor; and
A display device including a sensor interface that communicates with the slave readout circuit. According to claim 1,
The slave readout circuit is
A display device comprising a sensor interface that communicates with the master readout circuit. According to claim 1,
The input sensor includes a sensing area where the sensing electrodes are arranged, a first non-sensing area around the sensing area, and a second non-sensing area spaced apart from the first non-sensing area. According to claim 4,
First sensing lines electrically connecting some of the sensing electrodes and the master readout circuit; and
A display device including second sensing lines electrically connecting another portion of the sensing electrodes and the slave readout circuit. According to claim 6,
The first sensing lines are disposed in the first non-sensing area, and the second sensing lines are disposed in the second non-sensing area. According to claim 1,
Further comprising a circuit board on which the master readout circuit and the slave readout circuit are disposed,
A display device wherein the circuit board is electrically connected to the display panel. According to claim 1,
a first circuit board on which the master readout circuit is disposed; and
Further comprising a second circuit board on which the slave readout circuit is disposed,
A display device wherein the first circuit board is electrically connected to a first side of the display panel, and the second circuit board is electrically connected to a second side of the display panel that is different from the first side. According to clause 9,
A display device in which the master readout circuit of the first circuit board and the slave readout circuit of the second circuit board are electrically connected through a connection part. display panel;
an input sensor disposed on the display panel and including first sensing electrodes and second sensing electrodes;
a master readout circuit that transmits a first transmission signal to some of the first sensing electrodes and receives a first reception signal from some of the second sensing electrodes; and
A slave readout circuit transmitting a second transmission signal to another part of the first sensing electrodes and receiving a second reception signal from another part of the second sensing electrodes,
The master readout circuit provides a synchronization signal to the slave readout circuit, the slave readout circuit transmits the second transmission signal and receives the second reception signal in response to the synchronization signal, and the second readout circuit transmits the second transmission signal and receives the second reception signal. A display device that provides a detection signal corresponding to a received signal to the master readout circuit. According to claim 11,
The display device wherein the master readout circuit calculates the input position of the input sensor based on the first received signal and the second received signal. According to claim 11,
The input sensor includes a sensing area where the sensing electrodes are arranged, a first non-sensing area around the sensing area, and a second non-sensing area spaced apart from the first non-sensing area. According to claim 13,
The input sensor is
First sensing lines electrically connecting some of the second sensing electrodes and the master readout circuit; and
The display device further includes second sensing lines electrically connecting another portion of the second sensing electrodes and the slave readout circuit. According to claim 14,
The first sensing lines are disposed in the first non-sensing area, and the second sensing lines are disposed in the second non-sensing area. According to claim 11,
Further comprising a circuit board on which the master readout circuit and the slave readout circuit are disposed,
A display device wherein the circuit board is electrically connected to the display panel. According to claim 11,
a first circuit board on which the master readout circuit is disposed;
a second circuit board on which the slave readout circuit is disposed; and
Further comprising a connector electrically connecting the first circuit board and the second circuit board,
A display device wherein the first circuit board is electrically connected to a first side of the display panel, and the second circuit board is electrically connected to a second side of the display panel that is different from the first side. According to claim 11,
The master readout circuit is
a first transmission circuit that outputs the first transmission signal to corresponding first sensing electrodes among the first sensing electrodes;
a second receiving circuit that receives the first receiving signal from corresponding second sensing electrodes among the second sensing electrodes;
a first memory storing the first received signal;
a host interface that communicates with the host processor;
a first sensor interface transmitting the synchronization signal to the slave readout circuit; and
A display device comprising a processor that controls the first transmission circuit, the first memory, the host interface, and the first sensor interface. According to claim 18,
The slave readout circuit is
a second transmission circuit that outputs the second transmission signal to corresponding first sensing electrodes among the first sensing electrodes;
a second receiving circuit that receives the second receiving signal from corresponding second sensing electrodes among the second sensing electrodes;
a second memory storing the second received signal;
a second sensor interface transmitting the detection signal corresponding to the second received signal stored in the second memory to the first sensor interface of the master readout circuit; and
A display device comprising a second processor that controls the second transmission circuit, the second memory, and the second sensor interface. transmitting a synchronization signal from the master readout circuit to the slave readout circuit;
Transmit a first transmission signal from the master readout circuit to an input sensor, receive a first input signal for the first transmission signal from the input sensor at the master readout circuit, and receive a first transmission signal for the first transmission signal from the master readout circuit. 2. Receiving an input signal from the slave readout circuit;
Transmitting a second transmission signal from the slave readout circuit to the input sensor, receiving the first input signal for the second transmission signal from the input sensor at the master readout circuit, and responding to the first transmission signal receiving the second input signal from the slave readout circuit;
Transmitting the second input signal for the first transmission signal and a detection signal corresponding to the second input signal for the second transmission signal from the slave readout circuit to the master readout circuit; and
A method of operating a display device comprising calculating a touch position corresponding to the first input signal and the second input signal for each of the first transmission signal and the second transmission signal in the master readout circuit.

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