KR20230133084A - Polyimide-based resin film, substrate for display device, substrate for touch panel, substrate for solar cell, optical device and electronic device using the same - Google Patents

Abstract

The present invention relates to a polyimide-based resin film, which contains a polyimide-based resin and a phosphine oxide-based compound represented by a chemical formula 1, and an amic acid-based compound, has the yellow index measured on specimens with a thickness of 9.5 to 10.5 ㎛ of 20 or less, the glass transition temperature of 430℃ or more, the transmittance for a wavelength of 450 nm of 75% or more, and the thermal expansion coefficient of 20 ppm/℃ or less measured while raising the temperature at a temperature range of 100 to 300℃, and tensile modulus of 8 GPa or more according to ASTM D638 Type V, and a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device and an electronic device using the same.

Description

Polyimide-based resin film and substrates for display devices using the same, substrates for touch panels, substrates for solar cells, optical devices and electronic devices DEVICE AND ELECTRONIC DEVICE USING THE SAME}

The present invention relates to a polyimide-based resin film that satisfies excellent heat resistance, optical properties, and mechanical properties, and a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device, and an electronic device using the same.

As various flexible displays and electronic products develop, substrate materials previously used as glass are being replaced by organic plastic films. In particular, the display device market is focusing attention on so-called flexible display devices that apply a flexible substrate to a flat panel display. These flexible display devices are being considered for application mainly to mobile devices such as smartphones, and their application fields are gradually expanding.

The representative material for these organic plastic films is polyimide, which is suitable for the high temperature process of LTPS. Mainly, homopolymers mixed with polyamic acid (PAA), polyamic acid ester (PAE), and soluble polyimide (SPI) are polymerized, applied to a substrate, and then used to manufacture flexible TFTs through an inorganic single-layer or double-layer metal lamination process. Flexible materials that can be used can be manufactured.

However, general transparent polyimide has very poor heat-resistance reliability due to structural factors, and has limitations in that yellowing occurs due to amine-based solvents in high-temperature processes.

Recently, in response to the demand for eco-friendly products and the realization of full screen, which is a challenging task for displays, the need for highly heat-resistant transparent polyimide materials for placing cameras inside the panel is increasing.

The present invention relates to a polyimide-based resin film that satisfies excellent heat resistance properties, optical properties, and mechanical properties.

In addition, the present invention is to provide a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device, and an electronic device using the polyimide resin film.

In order to solve the above problem, in the present specification, the yellow color measured on a specimen containing a polyimide resin, a phosphine oxide-based compound and an amic acid-based compound represented by the following formula (1) and having a thickness of 9.5 ㎛ to 10.5 ㎛ The index is 20 or less, the glass transition temperature measured on a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ is 430 ℃ or more, and the transmittance for a 450 nm wavelength measured on a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ is 75% or more, and for specimens with a thickness of 9.5 ㎛ to 10.5 ㎛, the thermal expansion coefficient measured while raising the temperature in the temperature range of 100 ℃ to 300 ℃ is 20 ppm/℃ or less, and for specimens with a thickness of 9.5 ㎛ to 10.5 ㎛ A polyimide-based resin film having a tensile modulus of 8 GPa or more according to ASTM D638 Type V measured for is provided.

[Formula 1]

In Formula 1, R ₁ and R ₂ are the same or different from each other and are each independently hydrogen, a hydroxy group, an alkyl group, or an aryl group, R ₃ is an arylene group, and R ₄ is an aryl group.

Also provided in this specification is a substrate for a display device including the polyimide film.

In this specification, a substrate for a touch panel including the polyimide film is also provided.

In this specification, a substrate for solar cells including the polyimide film is also provided.

Also provided herein is an optical device comprising the polyimide film.

Also provided in this specification is an electronic device including the polyimide film.

Hereinafter, a polyimide film and a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device, and an electronic device using the polyimide film according to specific embodiments of the invention will be described in more detail.

Unless explicitly stated herein, terminology is intended to refer only to specific embodiments and is not intended to limit the invention.

As used herein, singular forms include plural forms unless phrases clearly indicate the contrary.

As used herein, the meaning of 'comprise' is to specify a specific characteristic, area, integer, step, operation, element and/or component, and to specify another specific property, area, integer, step, operation, element, component and/or group. It does not exclude the existence or addition of .

Additionally, in this specification, terms including ordinal numbers such as 'first' and 'second' are used for the purpose of distinguishing one component from another component and are not limited by the ordinal numbers. For example, within the scope of the present invention, a first component may also be referred to as a second component, and similarly, the second component may be referred to as a first component.

In this specification, (co)polymer refers to both polymers or copolymers. The polymer refers to a homopolymer composed of a single repeating unit, and the copolymer refers to a complex polymer containing two or more types of repeating units.

In this specification, examples of substituents are described below, but are not limited thereto.

In this specification, the term "substitution" means bonding with another functional group in place of a hydrogen atom in a compound, and the position to be substituted is not limited as long as it is the position where the hydrogen atom is substituted, that is, a position where the substituent can be substituted, and if two or more substitutions are made, , two or more substituents may be the same or different from each other.

As used herein, the term “substituted or unsubstituted” refers to deuterium; halogen group; Cyano group; nitro group; hydroxyl group; carbonyl group; ester group; imide group; amide group; Primary amino group; carboxyl group; sulfonic acid group; sulfonamide group; Phosphine oxide group; Alkoxy group; Aryloxy group; Alkylthioxy group; Arylthioxy group; Alkyl sulphoxy group; Aryl sulfoxy group; silyl group; boron group; Alkyl group; Cycloalkyl group; alkenyl group; Aryl group; Aralkyl group; Aralkenyl group; Alkylaryl group; Alkoxysilylalkyl group; Arylphosphine group; or substituted or unsubstituted with one or more substituents selected from the group consisting of heterocyclic groups containing one or more of N, O and S atoms, or substituted or unsubstituted with two or more of the above-exemplified substituents linked. . For example, “a substituent group in which two or more substituents are connected” may be a biphenyl group. That is, the biphenyl group may be an aryl group, or it may be interpreted as a substituent in which two phenyl groups are connected.

In this specification, , or means a bond connected to another substituent, and a direct bond means a case where no separate atom exists in the part indicated by L.

In the present specification, aromatic is a characteristic that satisfies the Huckels Rule. According to the Huckels Rule, a case that satisfies all of the following three conditions can be defined as aromatic.

1) There must be 4n+2 electrons that are fully conjugated by empty p-orbitals, unsaturated bonds, and unpaired electron pairs.

2) 4n+2 electrons must form a planar isomer and form a ring structure.

3) All atoms in the ring must be able to participate in conjugation.

In the present specification, a multivalent functional group is a residue in which a plurality of hydrogen atoms bonded to any compound have been removed, and examples include a divalent functional group, a trivalent functional group, and a tetravalent functional group. For example, a tetravalent functional group derived from cyclobutane refers to a residue in which any four hydrogen atoms bonded to cyclobutane have been removed.

In the present specification, the alkyl group is a monovalent functional group derived from an alkane and may be straight-chain or branched, and the number of carbon atoms of the straight-chain alkyl group is not particularly limited, but is preferably 1 to 20. Additionally, the branched chain alkyl group has 3 to 20 carbon atoms. Specific examples of alkyl groups include methyl, ethyl, propyl, n-propyl, isopropyl, butyl, n-butyl, isobutyl, tert-butyl, sec-butyl, 1-methyl-butyl, 1-ethyl-butyl, pentyl, n. -pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, n-hexyl, 1-methylpentyl, 2-methylpentyl, 4-methyl-2-pentyl, 3,3-dimethylbutyl, 2-ethylbutyl, heptyl , n-heptyl, 1-methylhexyl, octyl, n-octyl, tert-octyl, 1-methylheptyl, 2-ethylhexyl, 2-propylpentyl, n-nonyl, 2,2-dimethylheptyl, 1-ethyl- Propyl, 1,1-dimethyl-propyl, isohexyl, 2-methylpentyl, 4-methylhexyl, 5-methylhexyl, 2,6-dimethylheptan-4-yl, etc., but are not limited to these. The alkyl group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.

In this specification, a halo alkyl group refers to a functional group in which a halogen group is substituted for the above-mentioned alkyl group, and examples of the halogen group include fluorine, chlorine, bromine, or iodine. The haloalkyl group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.

In this specification, the alkylene group is a divalent functional group derived from an alkane, and the description of the alkyl group described above can be applied except that it is a divalent functional group. For example, it may be straight-chain or branched, such as methylene group, ethylene group, propylene group, isobutylene group, sec-butylene group, tert-butylene group, pentylene group, hexylene group, etc. The alkylene group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.

In the present specification, the aryl group is a monovalent functional group derived from arene, and is not particularly limited, but preferably has 6 to 20 carbon atoms, and may be a monocyclic aryl group or a polycyclic aryl group. The aryl group may be a monocyclic aryl group, such as a phenyl group, biphenyl group, or terphenyl group, but is not limited thereto. The polycyclic aryl group may be a naphthyl group, anthracenyl group, phenanthryl group, pyrenyl group, perylenyl group, chrysenyl group, fluorenyl group, etc., but is not limited thereto. The aryl group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.

In the present specification, the arylene group is a divalent functional group derived from arene, and the description of the aryl group described above can be applied, except that it is a divalent functional group. For example, it may be a phenylene group, biphenylene group, terphenylene group, naphthalene group, fluorenyl group, pyrenyl group, phenanthrenyl group, perylene group, tetracenyl group, anthracenyl group, etc. The arylene group may be substituted or unsubstituted, and when substituted, examples of the substituent are as described above.

In the present specification, an alkoxysilyl group refers to a silyl group substituted with at least one alkoxy group. Specifically, the alkoxy group is a functional group in which the above-described alkyl group is bonded to one end of an ether group (-O-), and the description of the alkyl group described above can be applied except that these are functional groups bonded to an ether group (-O-). there is. For example, it may be straight chain, branched chain or ring chain. The number of carbon atoms of the alkoxy group is not particularly limited, but is preferably 1 to 20 carbon atoms. Specifically, methoxy, ethoxy, n-propoxy, isopropoxy, i-propyloxy, n-butoxy, isobutoxy, tert-butoxy, sec-butoxy, n-pentyloxy, neopentyloxy, iso Pentyloxy, n-hexyloxy, 3,3-dimethylbutyloxy, 2-ethylbutyloxy, n-octyloxy, n-nonyloxy, n-decyloxy, cycloheptoxy, benzyloxy, p-methylbenzyl Oxy, etc., but is not limited thereto. The alkoxy group may be substituted or unsubstituted. Specific examples of the alkoxysilyl group include triethylsilyl group.

In this specification, a direct bond or single bond means that no atom or atomic group exists at the corresponding position and is connected by a bond line. Specifically, it refers to the case where no separate atoms exist in the portions represented by L ₁ and L ₂ in the chemical formula.

In this specification, the weight average molecular weight means the weight average molecular weight in terms of polystyrene measured by GPC method. In the process of measuring the weight average molecular weight of polystyrene equivalent measured by the GPC method, commonly known analysis devices, detectors such as differential refractive index detectors, and analytical columns can be used, and the commonly applied temperature Conditions, solvent, and flow rate can be applied. For a specific example of the above measurement conditions, a Waters PL-GPC220 instrument was used using a Polymer Laboratories PLgel MIX-B 300 mm long column, the evaluation temperature was 160°C, and 1,2,4-trichlorobenzene was used as a solvent. The flow rate is 1 mL/min, the sample is prepared at a concentration of 10 mg/10 mL, and then supplied in an amount of 200 μL. The value of Mw can be obtained using a calibration curve formed using a polystyrene standard. Nine types of molecular weights of polystyrene standards were used: 2,000 / 10,000 / 30,000 / 70,000 / 200,000 / 700,000 / 2,000,000 / 4,000,000 / 10,000,000.

Hereinafter, the present invention will be described in more detail.

1. Polyimide resin film

According to one embodiment of the invention, the yellowness index measured on a specimen containing a polyimide resin, a phosphine oxide-based compound and an amic acid-based compound represented by the following formula (1) and having a thickness of 9.5 ㎛ to 10.5 ㎛ is 20. Below, the glass transition temperature measured on a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ is 430 ℃ or more, and the transmittance for a 450 nm wavelength measured on a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ is 75% or more. and the thermal expansion coefficient measured for a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ while raising the temperature in the temperature range of 100 ℃ to 300 ℃ is 20 ppm / ℃ or less, and measured for a specimen with a thickness of 9.5 ㎛ to 10.5 ㎛ A polyimide-based resin film having a tensile modulus of 8 GPa or more according to ASTM D638 Type V can be provided.

[Formula 1]

In Formula 1, R ₁ and R ₂ are the same or different from each other and are each independently hydrogen, a hydroxy group, an alkyl group, or an aryl group, R ₃ is an arylene group, and R ₄ is an aryl group.

The present inventors have found that the polyimide-based resin film of the embodiment includes a polyimide-based resin, a phosphine oxide-based compound and an amic acid-based compound represented by Formula 1, and has yellowness index, glass transition temperature, transmittance, and thermal expansion coefficient. , As the tensile modulus of elasticity satisfies a certain numerical range, it was confirmed through experiments that various properties such as transparency and mechanical properties were improved while having heat resistance suitable for the LTPS process, and the invention was completed.

Specifically, the polyimide-based resin film of one embodiment is measured on a specimen having a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. A yellowness index (YI) of 20 or less, or 10 or less, or 9 or less, or 8.7 or less, or 0.1 or more, or 1 or more, or 0.1 to 20, or 1 to 20, or 0.1 to 10, or 1 to 10, or 0.1 to 9, or 1 to 9, or 0.1 to 8.7, or 1 to 8.7, or 8.65 to 9.78. Yellowness index (YI) measured on specimens having a thickness of the polyimide resin film of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛ As decreases to 20 or less, the polyimide-based resin film can secure transparency and realize excellent optical properties.

The yellowness index may be measured from the polyimide resin film sample having a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. When the thickness of the polyimide-based resin film increases or decreases by a certain amount, the physical properties measured from the polyimide-based resin film may also change by a certain amount.

The polyimide resin film has a temperature range of 100 ℃ to 300 ℃ for specimens having a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. The measured coefficient of thermal expansion (CTE) measured while raising the temperature is 20 ppm/℃ or less, or 19 ppm/℃ or less, or 11 ppm/℃ or less, or 10.03 ppm/℃ or less, or 0.1 ppm/℃ or more, or 0.1 ppm /°C to 20 ppm/°C, or 0.1 ppm/°C to 19 ppm/°C, or 0.1 ppm/°C to 11 ppm/°C, or 0.1 ppm/°C to 10.03 ppm/°C, or 10.03 ppm/°C to 18.90 ppm/ It may be ℃.

For the polyimide resin film sample, the thermal expansion coefficient is set to 0.01N or more and 0.1N or less, or 0.01N or more and 0.05N or less, and 1°C/min or more in the temperature range of 100°C or more and 300°C or less. After carrying out the first temperature increase process at a temperature increase rate of 10 ℃/min or less, or 4 ℃/min or more and 6 ℃/min or less, the temperature range is 1 ℃/min or more and 10 ℃/min or less in the temperature range of 250 ℃ to 100 ℃, Alternatively, the thermal expansion change pattern when cooled at a cooling rate of 3 ℃/min or more and 5 ℃/min or less was measured using TMA (TA's Q400).

The thermal expansion coefficient may be measured from the polyimide-based resin film sample with a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. When the thickness of the polyimide-based resin film increases or decreases by a certain amount, the physical properties measured from the polyimide-based resin film may also change by a certain amount.

As the polyimide-based resin film satisfies the thermal expansion coefficient of 20 ppm/℃ or less in the range of 100 ℃ to 300 ℃, sufficient heat resistance is secured even in the polyimide-based resin film obtained through high temperature curing when used as a plastic substrate. , When heat treating the metal layer formed on the plastic substrate, it is possible to prevent the plastic substrate from being damaged by heat and also prevent warpage from occurring in the metal thin film formed on the plastic substrate.

The polyimide resin film is measured at a wavelength of 450 nm measured on a specimen having a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. Transmittance is 75% or more, or 78% or more, or 79% or more, or 100% or less, or 90% or less, or 75% to 100%, or 75% to 90%, or 78% to 100%, or 78% It may be from 79% to 90%, or from 79% to 100%, or from 79% to 90%%, or from 75.2% to 79.23%. At a wavelength of 450 nm measured on a specimen having a thickness of the polyimide resin film of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛ As the transmittance increases to 75% or more, the polyimide-based resin film can secure transparency and realize excellent optical properties.

The transmittance may be measured from the polyimide resin film sample of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. When the thickness of the polyimide-based resin film increases or decreases by a certain amount, the physical properties measured from the polyimide-based resin film may also change by a certain amount.

The polyimide resin film is 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛ ASTM D638 Type V measured on a specimen. The tensile modulus of elasticity is 8 GPa or more, or 8.2 GPa or more, or 8.3 GPa or more, or 8.4 GPa or more, or 8.5 GPa or more, or 15 GPa or less, or 8 GPa to 15 GPa, or 8.2 GPa to 15 GPa, or 8.3 GPa to 15 GPa, or 8.4 GPa to 15 GPa, or 8.5 GPa to 15 GPa, or 8.3 GPa to 8.5 GPa.

The tensile modulus can be measured from the polyimide resin film sample of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛. When the thickness of the polyimide-based resin film increases or decreases by a certain amount, the physical properties measured from the polyimide-based resin film may also change by a certain amount.

The polyimide resin film has a glass transition temperature of 430 when measured on a specimen having a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. ℃ or higher, or 440 ℃ or higher, or 450 ℃ or higher, or 452 ℃ or higher, or 460 ℃ or lower, or 430 ℃ to 460 ℃, or 440 ℃ to 460 ℃, or 450 ℃ to 460 ℃, or 452 ℃ to 460 ℃ , or 442.3°C to 452.9°C.

The example of the method for measuring the glass transition temperature is not greatly limited, but, for example, using a thermomechanical analysis device (TMA (Q400 from TA)), the force pulling the polyimide resin film is set to 0.2N, After performing the first temperature increase process at a temperature increase rate of 5°C/min in the temperature range of 100 to 400°C, the inflection point seen in the temperature increase section in the first temperature increase process can be calculated as Tg.

The glass transition temperature can be measured from the polyimide-based resin film sample with a thickness of 9.5 ㎛ or more, or 10.5 ㎛ or less, or 9.5 ㎛ to 10.5 ㎛, or 9.7 ㎛ to 10.3 ㎛, or 9.9 ㎛ to 10.1 ㎛. When the thickness of the polyimide-based resin film increases or decreases by a certain amount, the physical properties measured from the polyimide-based resin film may also change by a certain amount.

As the glass transition temperature of the polyimide resin film satisfies 430 ℃ or higher, sufficient heat resistance is secured even in the polyimide resin film obtained through high temperature curing, so when using it as a plastic substrate, when heat treating the metal layer formed on the plastic substrate It can prevent plastic substrates from being damaged by heat.

Meanwhile, the polyimide-based resin film of one embodiment may include polyimide-based resin. Polyimide-based resins may include both resins consisting only of polyimide repeating units or resins containing polyimide repeating units.

That is, the polyimide-based resin may include all of polyimide resins, polyamic acid resins that are precursor polymers of polyimide resins, polyamic acid ester resins, etc. That is, the polyimide-based resin may include one or more types selected from the group consisting of polyamic acid repeating units, polyamic acid ester repeating units, and polyimide repeating units. That is, the polyimide-based resin may include one type of polyamic acid repeating unit, one type of polyamic acid ester repeating unit, one type of polyimide repeating unit, or a copolymer in which two or more types of these repeating units are mixed.

One or more repeating units selected from the group consisting of polyamic acid repeating units, polyamic acid ester repeating units, and polyimide repeating units may form the main chain of the polyimide-based resin.

Additionally, the polyimide-based resin may include a copolymer in which polyimide repeating units and various other polymer repeating units are mixed. For example, it may include a polyamideimide resin in which polyimide repeating units and polyamide repeating units are mixed.

In particular, the polyimide-based resin may include any one of a polyimide repeating unit represented by the following formula (2), a precursor repeating unit thereof, or a mixture thereof.

[Formula 2]

In the above formula ( _{2 )} ,

[Formula 3]

In Formula 3, T ₁ to T ₃ are the same as or different from each other and are each independently an electron-withdrawing functional group, m1 to m3 are the same as or different from each other, at least one of m1 to m3 is an integer of 1 to 4, and the remainder is an integer from 0 to 4, and n is an integer from 1 to 10.

In _Chemical Formula ₂ ,

The polycyclic-containing tetravalent aromatic functional group may include a tetravalent functional group represented by the following formula (7).

[Formula 7]

In Formula 7, Ar is a multi-ring aromatic divalent functional group.

The multicyclic aromatic divalent functional group is a divalent functional group derived from a polycyclic aromatic hydrocarbon compound or a derivative thereof, and may include a fluorenylene group. The derivative compounds include all compounds in which one or more substituents are introduced or carbon atoms are replaced with heteroatoms.

More specifically, in Ar of Formula 7, the multi-ring aromatic divalent functional group may include a bonded cyclic divalent functional group containing at least two or more aromatic ring compounds. That is, the multi-ring aromatic divalent functional group contains at least two aromatic ring compounds in the functional group structure, and in addition, the functional group may have a fused ring structure.

The aromatic ring compound may include an arene compound containing one or more benzene rings, or a heteroarene compound in which carbon atoms in the arene compound are replaced with heteroatoms.

The aromatic ring compound may be contained in at least two or more multi-ring aromatic divalent functional groups, and each of the two or more aromatic ring compounds may form a fused ring directly or form a fused ring through another ring structure. For example, when two benzene rings are each bonded to a cycloalkyl ring structure, it can be defined that the two benzene rings form a bonded ring through the cycloalkyl ring.

The fused cyclic divalent functional group containing at least 2 or more aromatic ring compounds is a divalent functional group derived from a fused ring compound containing at least 2 or more aromatic ring compounds or a derivative thereof, and the derivative compound has one or more substituents introduced. It includes all compounds in which carbon atoms are replaced by heteroatoms.

Examples of the multicyclic aromatic divalent functional group are not greatly limited, but as an example, the tetravalent functional group represented by the formula 7 may include a functional group represented by the formula 4 below.

[Formula 4]

In Formula 2, Y ₁ is a divalent functional group represented by Formula 3, and Y ₁ may be a functional group derived from polyamic acid, polyamic acid ester, or a diamine compound used in polyimide synthesis.

The aromatic divalent functional group having 15 or more carbon atoms in Y ₁ may include three or more aromatic ring compounds. As the polyimide resin contains three or more aromatic ring compounds, the ordering and orientation characteristics between molecules are improved, and sufficient heat resistance can be secured even in polyimide films obtained through high temperature curing.

The electron withdrawing functional group may include one or more selected from the group consisting of haloalkyl group, halogen group, cyano group, nitro group, sulfonic acid group, carbonyl group, and sulfonyl group.

As electron-withdrawing substituents such as highly electronegative trifluorumethyl group (-CF ₃ ) are substituted, the effect of suppressing the formation of CTC (charge transfer complex) of Pi-electrons present in the polyimide resin chain increases. Accordingly, improved transparency can be secured. In other words, the packing within the polyimide structure or between chains can be reduced, and the electrical interaction between color sources can be weakened due to steric hindrance and electrical effects, resulting in high transparency in the visible light region.

The divalent functional group of Y ₁ may include a functional group represented by Formula 3-1 below, or a functional group represented by Formula 3-2 below.

[Formula 3-1]

[Formula 3-2]

The polyimide-based resin may include a combination of tetracarboxylic dianhydride represented by Formula 8 below and diamine represented by Formula 9 below.

[Formula 8]

[Formula 9]

In Formula 8, Ar' is a multi-ring aromatic divalent functional group. The multicyclic aromatic divalent functional group is a divalent functional group derived from a polycyclic aromatic hydrocarbon compound, a divalent functional group derived from a fluorenylene group or a derivative thereof, and may include a fluorenylene group. . The derivative compounds include all compounds in which one or more substituents are introduced or carbon atoms are replaced with heteroatoms.

A specific example of tetracarboxylic dianhydride represented by Formula 8 is 9,9-Bis(3,4-dicarboxyphenyl)fluorene dianhydride (BPAF). I can hear it.

The description of T, m1, m2, m3, and n in Formula 9 is the same as that described in Formula 3 above.

Specific examples of the diamine represented by the formula 9 include diamine represented by the following formula 9-1, or diamine represented by the formula 9-2.

[Formula 9-1]

[Formula 9-2]

More specifically, the polyimide resin is composed of the terminal anhydride group (-OC-O-CO-) of tetracarboxylic dianhydride represented by Formula 8 and the terminal amino group (-NH ₂ ) of diamine represented by Formula 9. Through the reaction, a bond can be formed between the nitrogen atom of the amino group and the carbon atom of the anhydride group.

In addition, the polyimide-based resin may further include a polyimide repeating unit represented by the following formula (5).

[Formula 5]

In Formula 5, X ₂ is one of the tetravalent functional groups represented by Formula 6 below, Y ₂ is the same functional group as Y ₁

[Formula 6]

In Formula 6, R ₅ to R ₁₀ are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms, and L is a single bond, -O-, -CO-, -COO-, -S-, -SO-, - SO ₂ -, -CR ₁₁ R ₁₂ -, -(CH ₂ ) _t -, -O(CH ₂ ) _t O-, -COO(CH ₂ ) _t OCO-, -CONH-, phenylene or a combination thereof is any one selected from the group consisting of, wherein R ₁₁ and R ₁₂ are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a halo alkyl group having 1 to 10 carbon atoms, and t is an integer of 1 to 10.

Specific examples of the functional group represented by Formula 6 include the functional group represented by Formula 6-1 below.

[Formula 6-1]

In particular, when the functional group represented by Chemical Formula 6-1 is included, the polyimide-based resin film exhibits excellent optical properties, and these optical properties can have technical advantages of improved YI and improved transmittance.

That is, the polyimide-based polymer includes a first repeating unit containing a repeating unit represented by Chemical Formula 2, wherein the repeating unit derived from tetracarboxylic dianhydride is a tetravalent aromatic functional group containing a polycyclic ring; and a second repeating unit containing a repeating unit represented by Formula 5, wherein the repeating unit derived from tetracarboxylic dianhydride is a functional group represented by Formula 6. The first repeating unit and the second repeating unit may be arranged randomly within the polyimide-based polymer to form a random copolymer, or may form a block between first repeating units and a block between second repeating units to form a block copolymer. You can.

A polyimide-based polymer containing a repeating unit represented by Formula 2 and a repeating unit represented by Formula 5 can be prepared by reacting two or more different tetracarboxylic dianhydride compounds with a diamine compound, and the two types of A random copolymer can be synthesized by simultaneously adding tetracarboxylic dianhydride, or a block copolymer can be synthesized by adding it sequentially.

The polyimide repeating unit represented by Formula 5 is 70 mol% or more, or 80 mol% or more, or 90 mol% or more, or 99.9 mol% or less, or 70 mol% or more, compared to the total repeating units contained in the polyimide resin. It may be contained at 99.9 mol%, or 80 mol% to 99.9 mol%, or 90 mol% to 99.9 mol%.

As the polyimide repeating unit represented by Formula 5 is contained in an excess of 70 mol% or more compared to the total repeating units contained in the polyimide resin, optical properties such as yellowness index and transmittance can be improved.

The polyimide repeating unit represented by Formula 2 and the polyimide repeating unit represented by Formula 5 are 70 mol% or more, or 80 mol% or more, or 90 mol% or more, compared to the total repeating units contained in the polyimide resin. 70 mol% or more but 100 mol% or less, 80 mol% or more but 100 mol% or less, 70 mol% or more but 90 mol% or less, 70 mol% or more but 99 mol% or less, 80 mol% or more but 99 mol% or less, 90 mol% or more 99 It may be contained in mole percent or less.

That is, the polyimide-based resin consists only of the polyimide repeating unit represented by Formula 2 and the polyimide repeating unit represented by Formula 5, or is mostly composed of the polyimide repeating unit represented by Formula 2 and the polyimide repeating unit represented by Formula 5. It may be composed of polyimide repeating units.

More specifically, in addition to the diamine represented by Chemical Formula 9, other diamines may not be mixed, or may be mixed in a very small amount of less than 1 mol%.

The weight average molecular weight (GPC measurement) of the polyimide resin is not greatly limited, but may be, for example, 1000 g/mol or more and 200,000 g/mol or less, or 10,000 g/mol or more and 200,000 g/mol or less.

The polyimide resin according to the present invention can exhibit excellent colorless and transparent properties while maintaining characteristics such as heat resistance and mechanical strength due to its rigid structure, and can be used as a substrate for devices, a cover substrate for displays, and optical films. It can be used in various fields such as IC (integrated circuit) package, adhesive film, multi-layer FRC (flexible printed circuit), tape, touch panel, protective film for optical disk, etc. It can be especially suitable for display cover substrate. there is.

Meanwhile, the polyimide-based resin film of one embodiment may include a phosphine oxide-based compound represented by the following formula (1).

[Formula 1]

In Formula 1, R ₁ and R ₂ are the same or different from each other and are each independently hydrogen, a hydroxy group, an alkyl group, or an aryl group, R ₃ is an arylene group, and R ₄ is an aryl group.

The phosphine oxide-based compound represented by Formula 1 may be added to the polyimide-based resin film as a heat resistance agent. Unlike multi-phosphine oxide compounds (containing two or three phosphine oxide groups) that have been used as flame retardants in existing patents, the phosphine oxide compound represented by Formula 1 contains only one phosphine oxide group. there is. In the case of multi-phosphine oxide-based compounds used in existing patents, as the content of phosphine functional groups increases, yellowing occurs in high-temperature processes, making it difficult to secure transparency, or fumes are generated during high-temperature processes, causing equipment contamination, etc. Technical problems that reduce efficiency may occur.

In addition, in Formula 1, R ₃ is an arylene group and R ₄ is an aryl group. Due to the structural characteristics, the phosphine oxide-based compound represented by Formula 1 can achieve the technical effect of improved high heat resistance stability. On the other hand, in Formula 1, if R ₃ is an alkylene group and R ₄ is an aryl group, the technical problem of reduced heat resistance may occur due to the introduction of an alkylene chain.

Specifically, R ₄ may be a polycyclic aryl group having 10 or more carbon atoms, or 10 to 20 carbon atoms. In particular, as R ₄ has a polycyclic aryl group having 10 or more carbon atoms, or 10 to 20 carbon atoms, the technical effect of improved heat resistance stability can be realized due to the increased molecular weight. Examples of R ₄ are not greatly limited, but a specific example may include a naphthyl group.

Additionally, R ₃ may be a monocyclic arylene group having 6 to 11 carbon atoms. Examples of R ₃ are not greatly limited, but a specific example may include a phenylene group.

R ₁ and R ₂ may each independently be a monocyclic aryl group having 6 to 11 carbon atoms.

Examples of R ₁ and R ₂ are not greatly limited, but a specific example may include a phenylene group.

In a more specific example, the phosphine oxide-based compound represented by Formula 1 may include a compound represented by the following Formula 1-1.

[Formula 1-1]

The phosphine oxide-based compound represented by Formula 1 may be included in an amount of 0.001 mol% to 15 mol% based on the total moles of solid content of the polyimide-based resin film. If the phosphine oxide-based compound represented by Formula 1 is excessively reduced to less than 0.001 mol% based on the total molar solid content of the polyimide-based resin film, it is difficult to improve heat resistance by the phosphine oxide-based compound, or the oxidation prevention effect is reduced. Because it is not sufficiently implemented, yellowing occurs during high-temperature processes, making it difficult to secure transparency.

On the other hand, if the phosphine oxide-based compound represented by Formula 1 is excessively increased to more than 15 mol% relative to the total molar solid content of the polyimide-based resin film, yellowing phenomenon occurs in a high temperature process, making it difficult to secure transparency, There is a technical limitation in that process efficiency is reduced due to equipment contamination due to fume generation in high temperature processes.

Meanwhile, the polyimide-based resin film of one embodiment may include an amic acid-based compound.

The amic acid-based compound can be prepared by reacting tetracarboxylic dianhydride and monoamino trialkoxysilane, and the alkoxy silane (Si-OR) portion is converted to a silanol group (Si-OH) by water or moisture. It has characteristics. The silanol group can condense with a glass or metal surface in the form of a Si-O-surface to increase adhesion to the substrate surface, and the amic acid-based compound does not contain an amino group, so the amino group of the silane compound reacts with amic acid and precipitates. The production of salts can be minimized. In other words, the amic acid-based compound can minimize salt precipitation even when used by mixing it with a polyimide resin precursor solution, so additional purification processes can be omitted, and adhesion to glass or metal surfaces can be significantly improved.

In addition, the portion derived from tetracarboxylic dianhydride of the amic acid-based compound can be easily combined or commercialized with organic compounds, and can be combined with the reactants of diamine and dianhydride in the polyimide resin precursor solution. . Accordingly, the amic acid-based compound can be uniformly mixed with the polyimide resin precursor solution through the portion derived from the tetracarboxylic dianhydride.

Therefore, the amic acid-based compound, as an adhesion promoter, can be uniformly mixed into the polyimide resin precursor solution to significantly improve the adhesion between the polyimide film and the glass or metal surface.

Specifically, the amic acid-based compound may include a compound represented by the following formula (10).

[Formula 10]

In Formula 10, X ₃ is a tetravalent aromatic functional group, Y ₃ is an alkylene group, and R ₁₃ and R ₁₄ are each independently an alkoxysilyl group.

In Formula 10, the types of _tetravalent organic groups that can be used for Substituted or unsubstituted C4 to C20 fused polycyclic carbocyclic group; and C6 to C30 non-fused polycyclic carbocyclic groups interconnected by substituted or unsubstituted linkers; It may be a tetravalent organic group selected from the group consisting of.

More specifically, in Formula ₁₀ ,

In Formula 10, Y ₃ is an alkylene group. Specific examples of the alkylene group include straight-chain or branched-chain alkylene groups having 1 to 10 carbon atoms.

In Formula 10, R ₁₃ and R ₁₄ may each independently be an alkoxysilyl group.

The amic acid-based compound may be included in an amount of 0.001 mol% to 0.9 mol% based on the total moles of solid content of the polyimide-based resin film. If the amic acid-based compound is excessively reduced to less than 0.001 mol% based on the total number of moles of solid content of the polyimide-based resin film, it is difficult to sufficiently implement the adhesion enhancement or crosslinking improvement effect of the amic acid-based compound.

On the other hand, if the amic acid-based compound excessively increases to more than 0.9 mol% based on the total number of moles of solid content of the polyimide-based resin film, yellowing phenomenon occurs in a high temperature process, making it difficult to secure transparency, or there is a technical limit of lowering light transmittance. there is.

More specifically, with respect to 100 moles of the phosphine oxide-based compound represented by Formula 1, the content of the amic acid-based compound may be 0.1 mole to 10 mole, or 1 mole to 10 mole, or 3 mole to 7 mole.

Meanwhile, the polyimide-based resin film of one embodiment may include a cured product of the polyimide-based resin. Specifically, the polyimide-based resin film of one embodiment may include a cured product of the polyimide-based resin cured at a temperature of 400° C. or higher. The cured product refers to a material obtained through a curing process of a resin composition containing the polyimide resin, and the curing process may be carried out at a temperature of 400 ℃ or higher, 500 ℃ or lower, or 400 ℃ to 500 ℃. .

More specifically, examples of methods for synthesizing the polyimide-based resin film are not greatly limited, and include, for example, applying a resin composition containing the polyimide-based resin to a substrate to form a coating film (step 1); Drying the coating film (step 2); A method for producing a film can be used, which includes curing the dried coating film by heat treatment (step 3).

Step 1 is a step of forming a coating film by applying a resin composition containing the above-described polyimide resin to a substrate. The method of applying the resin composition containing the polyimide resin to the substrate is not particularly limited, and for example, methods such as screen printing, offset printing, flexographic printing, and inkjet can be used.

Additionally, the resin composition containing the polyimide resin may be dissolved or dispersed in an organic solvent. When it has this form, for example, when a polyimide resin is synthesized in an organic solvent, the solution may be the obtained reaction solution itself, or may be a product diluted with another solvent. Additionally, when the polyimide resin is obtained as a powder, it may be dissolved in an organic solvent to form a solution.

Specific examples of the organic solvent include toluene, N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylacetamide, N-methyl-2-pyrrolidone, N-methylcaprolactam, 2-pyrrolidone, N-ethylpyrrolidone, N-vinylpyrrolidone, dimethyl sulfoxide, tetramethyl urea, pyridine, dimethyl sulfone, hexamethyl sulfoxide, gamma-butyrolactone, 3-methoxy-N ,N-dimethylpropanamide, 3-ethoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, 1,3-dimethyl-imidazolidinone, ethyl amyl ketone, methylnonyl Ketone, methyl ethyl ketone, methyl isoamyl ketone, methyl isopropyl ketone, cyclohexanone, ethylene carbonate, propylene carbonate, diglyme, 4-hydroxy-4-methyl-2-pentanone, ethylene glycol monomethyl ether, Ethylene Glycol Monomethyl Ether Acetate, Ethylene Glycol Monoethyl Ether, Ethylene Glycol Monoethyl Ether Acetate, Ethylene Glycol Monopropyl Ether, Ethylene Glycol Monopropyl Ether Acetate, Ethylene Glycol Monoisopropyl Ether, Ethylene Glycol Monoisopropyl Ether Acetate, Ethylene glycol Monobutyl ether, ethylene glycol monobutyl ether acetate, etc. can be mentioned. These may be used individually or in combination.

The resin composition containing the polyimide resin may contain solid content in an amount to have an appropriate viscosity in consideration of processability such as applicability during the film forming process. For example, the content of the composition can be adjusted so that the total resin content is 5% by weight or more, or 25% by weight or less, or 5 to 25% by weight, or 20% by weight or less, or 15% by weight or less, Alternatively, it can be adjusted from 5% to 20% by weight, or from 5% to 15% by weight.

Additionally, the resin composition containing the polyimide resin may further include other components in addition to the organic solvent. As a non-limiting example, when the resin composition containing the polyimide resin is applied, it improves the uniformity of film thickness or surface smoothness, improves adhesion to the substrate, or changes dielectric constant or conductivity. Alternatively, additives that can increase density may be additionally included. Examples of such additives may include surfactants, silane-based compounds, dielectrics, or crosslinking compounds.

Step 2 is a step of drying the coating film formed by applying the resin composition containing the polyimide resin to the substrate.

The drying step of the coating film may be performed by a heating means such as a hot plate, hot air circulation furnace, or infrared furnace, and is heated at 50°C or higher, or 150°C or lower, or 100°C or lower, or 50°C to 150°C, or 50°C to It can be performed at a temperature of 100°C.

Step 3 is a step of curing the dried coating film by heat treatment. At this time, the heat treatment may be performed by a heating means such as a hot plate, hot air circulation furnace, or infrared furnace, and may be performed at a temperature of 400°C or higher, or 500°C or lower, or 400°C to 500°C.

The thickness of the polyimide resin film is not greatly limited, but can be freely adjusted, for example, within the range of 0.01 ㎛ or more, 1000 ㎛ or less, or 0.01 ㎛ to 1000 ㎛.

2. Substrate for display device

Meanwhile, according to another embodiment of the invention, a substrate for a display device including the polyimide-based resin film of the above embodiment may be provided. Content regarding the polyimide-based resin film may include all of the information described above in the embodiment.

The display device including the substrate may be a liquid crystal display device (LCD), an organic light emitting diode (OLED), a flexible display, or a rollable display or foldable display. ), etc., but are not limited thereto.

The display device may have various structures depending on the field of application and specific form, etc., and may include, for example, a cover plastic window, a touch panel, a polarizer, a barrier film, a light-emitting device (OLED device, etc.), a transparent substrate, etc. there is.

The polyimide-based resin film of the above-described embodiment can be used for various purposes such as a substrate, external protective film, or cover window in various display devices, and more specifically, can be applied as a substrate.

For example, the substrate for the display device may have a structure in which a device protection layer, a transparent electrode layer, a silicon oxide layer, a polyimide film, a silicon oxide layer, and a hard coating layer are sequentially stacked.

The transparent polyimide substrate may include a silicon oxide layer formed between the transparent polyimide film and the cured layer in terms of improving solvent resistance, water permeability, and optical properties, and the silicon oxide layer is polysilazane. It may be created by hardening.

Specifically, the silicon oxide layer may be formed by coating and drying a solution containing polysilazane before forming a coating layer on at least one side of the transparent polyimide film, and then curing the coated polysilazane. there is.

The substrate for a display device according to the present invention can provide a transparent polyimide cover substrate having excellent bending properties and impact resistance, solvent resistance, optical properties, moisture permeability, and scratch resistance by including the above-described device protection layer. there is.

3. Substrate for touch panel, substrate for solar cell

Meanwhile, according to another embodiment of the invention, a substrate for a touch panel or a substrate for a solar cell including the polyimide-based resin film of the above embodiment may be provided. Content regarding the polyimide-based resin film may include all of the information described above in the embodiment.

The polyimide-based resin film of the above-described embodiment can be used for various purposes such as a substrate, external protective film, or cover window in a touch panel or solar cell, and more specifically, can be applied as a substrate.

The configuration and manufacturing method of the touch panel or solar cell can use techniques known in the art, except that the polyimide resin film is used for the above-described purpose.

4. Optics

Meanwhile, according to another embodiment of the invention, an optical device including the polyimide-based resin film of the above embodiment may be provided. Content regarding the polyimide-based resin film may include all of the information described above in the embodiment.

The optical device may include all kinds of devices that utilize properties realized by light, and may include, for example, a display device. Specific examples of the display device include a liquid crystal display device (LCD), an organic light emitting diode (OLED), a flexible display, or a rollable display or foldable display. These may include, but are not limited to these.

The optical device may have various structures depending on the field of application and specific form, and may include, for example, a cover plastic window, a touch panel, a polarizer, a barrier film, a light-emitting device (OLED device, etc.), a transparent substrate, etc. there is.

The polyimide-based resin film of the other embodiments described above can be used for various purposes such as a substrate, external protective film, or cover window in various optical devices, and more specifically, can be applied to a substrate.

5. Electronic devices

Meanwhile, according to another embodiment of the invention, an electronic device including the polyimide-based resin film of the above embodiment may be provided. Content regarding the polyimide-based resin film may include all of the information described above in the embodiment.

The electronic devices may include all kinds of devices that utilize properties implemented by electrical signals, and include, for example, semiconductor devices, communication equipment such as mobile phones, lighting devices, and batteries (secondary batteries, solar cells). there is.

In the electronic device, the polyimide-based resin film of one embodiment can be used for various purposes such as a substrate, interlayer insulating film, solder resist, external protective film, or cover window, and the configuration and manufacturing method of the electronic device include the polyimide. Techniques known in the art can be used, except that the resin film is used for the above-described purposes.

According to the present invention, a polyimide-based resin film that satisfies excellent heat resistance, optical properties, and mechanical properties, and a substrate for a display device, a substrate for a touch panel, a substrate for a solar cell, an optical device, and an electronic device using the same can be provided.

The invention is explained in more detail in the following examples. However, the following examples only illustrate the present invention, and the content of the present invention is not limited by the following examples.

<Examples and Comparative Examples: Preparation of polyimide precursor composition and polyimide film>

Example 1

(1) Preparation of polyimide precursor composition

After filling the organic solvent DMAc in a stirrer with a nitrogen stream flowing, the diamine (PIM110) represented by the following formula (a) was added and dissolved at the same temperature while maintaining the temperature of the reactor at 25°C. 9,9-bis (3,4-dicarboxyphenyl) fluorene dianhydride (9,9-Bis (3,4- dicarboxyphenyl)fluorene dianhydride (BPAF) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-Biphenyltetracarboxylic dianhydride (BPDA)) were added at the same temperature and stirred for 24 hours. did. As shown in [Table 1] below, the molar ratio of PIM110:BPAF:BPDA was 98.75:10:90.

[Formula a]

[Formula b]

Afterwards, (4-(2-naphthyl)phenyl)diphenylphosphine oxide {(4-(2-Naphthyl)phenyl)diphenylphosphine oxide, PIM409} represented by the following formula c was added to 10 mol% based on the total solid content. A polyimide precursor composition was prepared by adding the compound (ABA-1) represented by the following formula (d) at 0.5 mol% based on the total solid content and stirring.

[Formula c]

[Formula d]

In the above formula (d), X ₃ is a tetravalent aromatic functional group, Y ₃ is an alkylene group, and R ₁₃ and R ₁₄ are each independently an alkoxysilyl group.

(2) Production of polyimide film

The polyimide precursor composition was spin-coated on a glass substrate. The curing process was performed by maintaining the glass substrate coated with the polyimide precursor composition at 80°C for 30 minutes and 460°C for 30 minutes. After completing the curing process, the glass substrate was immersed in water, the film formed on the glass substrate was removed, and dried in an oven at 100°C to prepare a polyimide film with a thickness of 10 ㎛ (including ±0.5 ㎛ error).

Example 2

As shown in [Table 1] below, a polyimide precursor composition was prepared in the same manner as in Example 1, except that diamine (PIM139) represented by the formula e was used instead of diamine (PIM110) represented by the formula a. And a polyimide film was prepared.

[Chemical formula e]

Comparative Example 1

As shown in [Table 1] below, (4-(2-naphthyl)phenyl)diphenylphosphine oxide {(4-(2-Naphthyl)phenyl)diphenylphosphine oxide, PIM409} represented by the formula c, and A polyimide precursor composition and a polyimide film were prepared in the same manner as in Example 1, except that the compound (ABA-1) represented by Formula d was not added.

Comparative example 2

As shown in [Table 1] below, (4-(2-naphthyl)phenyl)diphenylphosphine oxide {(4-(2-Naphthyl)phenyl)diphenylphosphine oxide, PIM409} represented by the formula c, and A polyimide precursor composition and a polyimide film were prepared in the same manner as in Example 2, except that the compound (ABA-1) represented by Formula d was not added.

Comparative example 3

As shown in [Table 1] below, instead of (4-(2-naphthyl)phenyl)diphenylphosphine oxide {(4-(2-Naphthyl)phenyl)diphenylphosphine oxide, PIM409} represented by the formula c. A polyimide precursor composition and a polyimide film were prepared in the same manner as in Example 1, except that a compound represented by the following formula (f) was added.

<Formula f>

<Experimental Example: Measurement of physical properties of polyimide precursor composition and polyimide film obtained in Examples and Comparative Examples>

The physical properties of the polyimide precursor composition and polyimide film obtained in the above Examples and Comparative Examples were measured by the following method, and the results are shown in Tables 1 to 3.

1. Transmittance

The transmittance of the polyimide films prepared in Examples and Comparative Examples at a wavelength of 450 nm was measured using a transmittance meter (model name HR-100, manufactured by Murakami Color Research Laboratory) in accordance with JIS K 7105.

2. Yellow Index (YI)

The yellow index of the polyimide films prepared in Examples and Comparative Examples was measured using a color meter (Color-Eye 7000A from GRETAGMACBETH).

3. Coefficient of thermal expansion (CTE)

The polyimide film prepared in Examples and Comparative Examples was prepared in a size of 5 x 20 mm, and then the sample was loaded using an accessory. The actual length of the film measured was the same at 16 mm. The force pulling the film was set to 0.02N and the first temperature increase process was performed at a temperature increase rate of 5 ℃/min in the temperature range between 100 ℃ and 300 ℃, and then at a temperature increase rate of 4 ℃/min in the temperature range from 300 ℃ to 100 ℃. The change in thermal expansion when cooling at a cooling rate was measured using TMA (Q400 from TA).

4. Glass transition temperature (Tg)

The polyimide film prepared in Examples and Comparative Examples was prepared in a size of 5 x 20 mm, and then the sample was loaded using an accessory. The actual length of the film measured was the same at 16 mm. The force pulling the film was set to 0.02N and the first temperature increase process was performed at a temperature increase rate of 5 ℃/min in the temperature range of 100 to 350 ℃, followed by a cooling rate of 4 ℃/min in the temperature range of 350 to 100 ℃. After cooling, a second temperature increase process was performed again at a temperature increase rate of 5°C/min in the temperature range of 100 to 500°C, and the thermal expansion change pattern was measured using TMA (TA's Q400). At this time, the inflection point seen in the temperature increase section in the second temperature increase process was calculated as Tg and evaluated under the following criteria.

5. Tensile modulus

For the polyimide films manufactured in Examples and Comparative Examples, the gap between grips was measured at 30 mm and a speed of 10 mm/min using Instron's 3365 model equipment at room temperature as a specimen according to ASTM D638 Type V, and the tensile modulus ( Tesile Modulus (GPa) was calculated as the ratio of tensile stress to tensile strain of 5%.

Experimental measurement results of examples and comparative examples division Example 1 Example 2 Comparative Example 1 Comparative example 2 Comparative Example 3 Monomer molar ratio PIM110:BPAF:BPDA=98.75:10:90 PIM139:BPAF:BPDA=98.75:10:90 PIM110:BPAF:BPDA=98.75:10:90 PIM139:BPAF:BPDA=98.75:10:90 PIM110:BPAF:BPDA=98.75:10:90 additive PIM409
(10 mol%)/
ABA-1
(0.5 mol%) PIM409
(10 mol%)/
ABA-1
(0.5 mol%) - - Chemical formula f
(10 mol%)/
ABA-1
(0.5 mol%) Thickness (㎛) 10.3 10.1 10.2 10.4 10.2 Transmittance (%) @450nm 79.23 75.2 77.73 73.96 70.5 Y.I. 8.65 9.78 9.51 10.39 19.3 CTE (ppm/°C) 10.03 18.90 9.98 19.04 23.4 Tg 442.3 452.9 442.5 455.3 439.1 Tensile modulus (GPa) 8.3 8.5 8.1 8.5 6.6

As shown in Table 1, the polyimide films (based on a thickness of about 10 ㎛) obtained in Examples 1 and 2 had equivalent permeability, heat resistance properties of CTE and Tg, and mechanical properties of tensile properties compared to the polyimide film of the comparative example. It was confirmed that the optical properties of YI were improved.

Claims (20)

Contains a polyimide-based resin, a phosphine oxide-based compound and an amic acid-based compound represented by the following formula (1),
The yellowness index measured on specimens with a thickness of 9.5 ㎛ to 10.5 ㎛ is 20 or less,
The glass transition temperature measured on a specimen having a thickness of 9.5 ㎛ to 10.5 ㎛ is 430 ℃ or more,
The transmittance for a wavelength of 450 nm measured on a specimen having a thickness of 9.5 ㎛ to 10.5 ㎛ is 75% or more,
The thermal expansion coefficient measured while raising the temperature in the temperature range of 100 ℃ to 300 ℃ for a specimen having a thickness of 9.5 ㎛ to 10.5 ㎛ is 20 ppm/℃ or less,
A polyimide-based resin film having a tensile modulus of 8 GPa or more according to ASTM D638 Type V, measured on specimens having a thickness of 9.5 μm to 10.5 μm:
[Formula 1]

In Formula 1,
R ₁ and R ₂ are the same or different from each other and are each independently one of hydrogen, a hydroxy group, an alkyl group, or an aryl group,
R ₃ is an arylene group,
R ₄ is an aryl group.
According to paragraph 1,
The polyimide-based resin film wherein R ₄ is a polycyclic aryl group having 10 or more carbon atoms.
According to paragraph 1,
The polyimide-based resin film wherein R ₄ is a naphthyl group.
According to paragraph 1,
The polyimide-based resin film wherein R ₃ is a monocyclic arylene group having 6 to 11 carbon atoms.
According to paragraph 1,
The polyimide-based resin film wherein R ₃ is a phenylene group.
According to paragraph 1,
The polyimide-based resin film wherein R ₁ and R ₂ are each independently a monocyclic aryl group having 6 to 11 carbon atoms.
According to paragraph 1,
The polyimide-based resin film wherein R ₁ and R ₂ are each independently a phenyl group.
According to paragraph 1,
The phosphine oxide-based compound represented by Formula 1 is a polyimide-based resin film comprising a compound represented by the following Formula 1-1:
[Formula 1-1]

.
According to paragraph 1,
The phosphine oxide-based compound represented by Formula 1 is
A polyimide-based resin film comprised from 0.001 mol% to 15 mol% based on the total number of moles of solid content of the polyimide-based resin film.
According to paragraph 1,
The polyimide resin is,
A polyimide-based resin film comprising any one of a polyimide repeating unit represented by the following formula (2), a precursor repeating unit thereof, or a mixture thereof:
[Formula 2]

In Formula 2,
X ₁ is a tetravalent aromatic functional group containing multiple rings,
Y ₁ is a divalent functional group represented by the following formula (3),
[Formula 3]

In Formula 3 above,
T ₁ to T ₃ are the same or different from each other and are each independently an electron withdrawing functional group,
m1 to m3 are the same or different from each other, and at least one of m1 to m3 is an integer from 1 to 4, and the others are integers from 0 to 4,
n is an integer from 1 to 10.
According to clause 10,
A polyimide-based resin film wherein the divalent functional group of Y ₁ includes a functional group represented by the following Chemical Formula 3-1, or a functional group represented by the following Chemical Formula 3-2:
[Formula 3-1]

[Formula 3-2]

.
According to clause 10,
The polyimide resin is,
A polyimide-based resin film further comprising any one of a polyimide repeating unit represented by the following formula (5), a precursor repeating unit thereof, or a mixture thereof:
[Formula 5]

In Formula 5 above,
X ₂ is one of the tetravalent functional groups represented by the formula 6 below,
Y ₂ is the same functional group as Y ₁ ,
[Formula 6]

In Formula 6, R ₅ to R ₁₀ are each independently hydrogen or an alkyl group having 1 to 6 carbon atoms, and L is a single bond, -O-, -CO-, -COO-, -S-, -SO-, - SO ₂ -, -CR ₁₁ R ₁₂ -, -(CH ₂ ) _t -, -O(CH ₂ ) _t O-, -COO(CH ₂ ) _t OCO-, -CONH-, phenylene or a combination thereof is any one selected from the group consisting of, wherein R ₁₁ and R ₁₂ are each independently hydrogen, an alkyl group having 1 to 10 carbon atoms, or a halo alkyl group having 1 to 10 carbon atoms, and t is an integer of 1 to 10.
According to clause 12,
A polyimide-based resin film in which the polyimide repeating unit represented by Formula 5 is contained in an amount of 70 mol% or more compared to the total repeating units contained in the polyimide-based resin.
According to paragraph 1,
The amic acid-based compound is
A polyimide-based resin film comprising a compound represented by the following formula (10):
[Formula 10]

In Formula 10 above,
X ₃ is a tetravalent aromatic functional group,
Y ₃ is an alkylene group,
R ₁₃ and R ₁₄ are each independently an alkoxysilyl group.
According to paragraph 1,
The amic acid-based compound is
A polyimide-based resin film containing 0.001 mol% to 0.9 mol% based on the total number of moles of solid content of the polyimide-based resin film.
A substrate for a display device comprising the polyimide resin film of claim 1.
A substrate for a touch panel comprising the polyimide-based resin film of claim 1.
A substrate for a solar cell comprising the polyimide-based resin film of claim 1.
An optical device comprising the polyimide resin film of claim 1.
An electronic device comprising the polyimide-based resin film of claim 1.