KR20230131346A - Deposition source and method for manufacturing display apparatus - Google Patents

Abstract

One embodiment of the present invention is disposed on a housing in which a deposition material is accommodated, a plurality of first nozzles for spraying the deposition material toward a mask assembly moving relative to a first direction, and at least a portion of the plurality of first nozzles. A deposition source is disclosed, including a second nozzle spaced from the first nozzle in the first direction and a second direction perpendicular to the first direction and surrounding the first nozzle.

Description

Manufacturing method of deposition source and display device {DEPOSITION SOURCE AND METHOD FOR MANUFACTURING DISPLAY APPARATUS}

The present invention relates to devices and methods, and more particularly, to deposition sources and manufacturing methods of display devices.

Recently, electronic devices have been widely used. Electronic devices are used in a variety of ways, such as mobile electronic devices and fixed electronic devices, and these electronic devices include display devices that can provide visual information such as images or videos to users to support various functions.

A display device is a device that visually displays data and is formed by depositing various layers such as organic layers and metal layers. A deposition apparatus may be used to form multiple layers of the display device. A deposition device is used to spray a deposition material from a deposition source and deposit it on a substrate through a mask.

The above-mentioned background technology is technical information that the inventor possessed for deriving the present invention or acquired in the process of deriving the present invention, and cannot necessarily be said to be known technology disclosed to the general public before filing the application for the present invention.

Embodiments of the present invention aim to provide a deposition source from which a deposition material can be effectively sprayed and an apparatus for manufacturing a display device including the deposition source.

However, these problems are illustrative, and the problems to be solved by the present invention are not limited thereto.

One embodiment of the present invention is disposed on a housing in which a deposition material is accommodated, a plurality of first nozzles for spraying the deposition material toward a mask assembly moving relative to a first direction, and at least a portion of the plurality of first nozzles. A deposition source is disclosed, including a second nozzle spaced from the first nozzle in the first direction and a second direction perpendicular to the first direction and surrounding the first nozzle.

In this embodiment, the second nozzle may form a closed loop outside the first nozzle on a plane.

In this embodiment, the second nozzle may be provided concentrically with the center of the first nozzle.

In this embodiment, the second nozzle may have a semicircular shape to surround a portion of the first nozzle in a plane view.

In this embodiment, the first nozzle includes a first height in the third direction, which is the spraying direction, and the second nozzle includes a second height in the third direction, and the first height is the third direction. It can be less than 2 height.

In this embodiment, the second height may vary along the circumference of the second nozzle.

In this embodiment, the second heights of the plurality of second nozzles disposed on the plurality of first nozzles may be different from each other.

In this embodiment, the second height may become smaller as it moves from the second nozzle at the center of the plurality of second nozzles in the second direction to the second nozzle at both ends of the second direction.

In this embodiment, the first nozzle may include a portion whose diameter increases in the third direction, which is the injection direction.

In this embodiment, the plurality of first nozzles are arranged side by side in the second direction, and a blocking plate is arranged to be spaced apart from the plurality of first nozzles in the first direction and extends along the second direction. More may be included.

In this embodiment, the first nozzle has a first height in the third direction, which is the spraying direction, the second nozzle has a second height in the third direction, and the blocking plate has a third height in the third direction. Each height may be included, and the first height may be smaller than the second height, and the second height may be smaller than the third height.

In this embodiment, the second nozzle may include a mesh structure disposed on an inner surface facing the first nozzle.

In this embodiment, a heating unit disposed outside the second nozzle and capable of heating the second nozzle may be further included.

In this embodiment, the second nozzle may be provided in all of the plurality of first nozzles.

Another embodiment of the present invention includes inserting a substrate into a chamber, aligning the substrate and the mask assembly, spraying the deposition material contained in the housing from a first nozzle, and spraying a second nozzle spaced apart from the first nozzle and surrounding the first nozzle. Disclosed is a method of manufacturing a display device, including the step of spraying with a limited spray angle using a nozzle.

In this embodiment, the step of spraying the deposition material sprayed through the second nozzle by restricting the spray angle by a blocking plate disposed on one side of the second nozzle and the other side opposite to the one side is further performed. It can be included.

In this embodiment, the first nozzle, the second nozzle, and the blocking plate each include a first height, a second height, and a third height in the spray direction, and the first height is smaller than the second height. , the second height may be smaller than the third height.

In this embodiment, the height of the second nozzle in the spraying direction may vary along the circumference of the second nozzle.

In this embodiment, the first nozzle and the second nozzle are provided in plural numbers, and the height of each of the plurality of second nozzles in the spraying direction may be different from each other.

In this embodiment, the second nozzle may include a mesh structure disposed on an inner surface facing the first nozzle.

In this embodiment, the step of heating the second nozzle may be further included.

Other aspects, features and advantages other than those described above will become apparent from the detailed description, claims and drawings for carrying out the invention below.

According to embodiments of the present invention, a method of manufacturing a deposition source and a display device through which a deposition material can be effectively sprayed can be provided.

In addition, the shadow phenomenon can be prevented, preventing defective deposition of the substrate and enabling the implementation of ultra-high resolution display devices.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a cross-sectional view showing a manufacturing apparatus for a display device according to an embodiment of the present invention.
Figure 2 is a perspective view showing a deposition source according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view taken along line III-III' of FIG. 2 showing a deposition source according to an embodiment of the present invention.
Figure 4 is a diagram schematically showing deposition material being sprayed from a deposition source according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along line VV' of FIG. 2 showing a deposition source according to an embodiment of the present invention.
Figure 6 is a cross-sectional view similar to Figure 3 showing a deposition source according to another embodiment of the present invention.
Figure 7 is a perspective view showing a deposition source according to another embodiment of the present invention.
Figure 8 is a perspective view showing a deposition source according to another embodiment of the present invention.
Figure 9 is a perspective view showing a deposition source according to another embodiment of the present invention.
Figure 10 is a perspective view showing a deposition source according to another embodiment of the present invention.
Figure 11 is a cross-sectional view showing a deposition source according to another embodiment of the present invention.
Figure 12 is a cross-sectional view showing a deposition source according to another embodiment of the present invention.
Figure 13 is a plan view schematically showing a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.
Figure 14 is a cross-sectional view schematically showing a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and redundant description thereof will be omitted. .

In the following embodiments, terms such as first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.

In the following examples, singular terms include plural terms unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have mean that the features or components described in the specification exist, and do not exclude in advance the possibility of adding one or more other features or components.

In the following embodiments, when a part of a film, region, component, etc. is said to be on or on another part, it is not only the case where it is directly on top of the other part, but also when another film, region, component, etc. is interposed between them. Also includes cases where there are.

In the drawings, the sizes of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are shown arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is shown.

In the following embodiments, the For example, the X-axis, Y-axis, and Z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.

In cases where an embodiment can be implemented differently, a specific process sequence may be performed differently from the described sequence. For example, two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.

1 is a cross-sectional view showing a manufacturing apparatus for a display device according to an embodiment of the present invention.

Referring to FIG. 1, the display device manufacturing apparatus 2 according to an embodiment of the present invention can be used to manufacture the display device 1 (see FIG. 13), which will be described later.

The display device manufacturing apparatus 2 includes a chamber 10, a first support part 20, a second support part 30, a mask assembly 40, a deposition source 500, a magnetic force part 60, and a vision part 70. ) and a pressure control unit 80.

A space may be formed inside the chamber 10 and the display substrate 100 and the mask assembly 40 may be accommodated. At this time, a portion of the chamber 10 may be formed to be open, and a gate valve 11 may be installed in the open portion of the chamber 10. In this case, the open portion of the chamber 10 may be opened or closed depending on the operation of the gate valve 11.

The first support portion 20 may seat and support the display substrate 100 . At this time, the first support part 20 may be in the form of a plate fixed inside the chamber 10. As another embodiment, the first support portion 20 may be in the form of a shuttle on which the display substrate 100 is seated and capable of linear movement within the chamber 10. As another embodiment, the first support part 20 may be fixed to the chamber 10 or may include an electrostatic chuck or an adhesive chuck disposed in the chamber 10 so as to be movable within the chamber 10.

The mask assembly 40 can be seated on the second support portion 30. At this time, the second support part 30 may be disposed inside the chamber 10. The second support part 30 may be able to finely adjust the position of the mask assembly 40. At this time, the second support unit 30 may be provided with a separate driving unit or alignment unit to enable the mask assembly 40 to move in different directions.

As another embodiment, the second support part 30 may be in the form of a shuttle. In this case, the second support portion 30 may seat the mask assembly 40 and may be capable of transporting the mask assembly 40. For example, the second support member 30 may move outside the chamber 10 and enter the inside of the chamber 10 from outside the chamber 10 after the mask assembly 40 is seated.

In the above case, it is also possible for the first support part 20 and the second support part 30 to be formed integrally. In this case, the first support part 20 and the second support part 30 may include a movable shuttle. At this time, the first support portion 20 and the second support portion 30 include a structure for fixing the mask assembly 40 and the display substrate 100 with the display substrate 100 seated on the mask assembly 40. It is also possible to linearly move the display substrate 100 and the mask assembly 40 at the same time.

However, hereinafter, for convenience of explanation, the first support part 20 and the second support part 30 are formed to be distinct from each other and disposed at different positions. The first support part 20 and the second support part 30 are A detailed description will be given focusing on the form disposed inside the chamber 10.

The deposition source 500 may be arranged to face the mask assembly 40 . At this time, the deposition material may be stored in the deposition source 500, and the deposition material may be evaporated or sublimated by applying heat to the deposition material. The deposition source 500 may be fixedly placed inside the chamber 10 or may be placed inside the chamber 10 to enable linear movement in one direction. The deposition source 500 will be described in detail later.

Mask assembly 40 may be selectively placed inside chamber 10 . At this time, the mask assembly 40 may include a mask frame 41 and a mask sheet 42.

The mask frame 41 may be formed by connecting a plurality of frames, and the central portion may be penetrated to form an opening. At this time, the interior of the mask frame 410 may be formed in a grid shape.

The mask sheet 42 may be installed in a tensioned state on the mask frame 41. The mask sheet 42 may include at least one pattern hole. The pattern hole may be a through hole formed to allow the deposition material to pass through the mask sheet 42.

The magnetic force unit 60 may be disposed inside the chamber 10 to face the display substrate 100 . At this time, the magnetic force unit 60 may apply magnetic force to the mask assembly 40 to force the mask assembly 40 toward the display substrate 100 . In particular, the magnetic force unit 60 not only prevents the mask sheet 42 from sagging but also allows the mask sheet 42 to be adjacent to the display substrate 100. Additionally, the magnetic force unit 60 can maintain a uniform gap between the mask sheet 42 and the display substrate 100.

The vision unit 70 is installed in the chamber 10 and can capture the positions of the display substrate 100 and the mask assembly 40. At this time, the vision unit 70 may include a camera that photographs the display substrate 100 and the mask assembly 40. The positions of the display board 100 and the mask assembly 40 can be determined based on the image captured by the vision unit 70, and the position of the display board 100 in the first support part 20 can be determined based on the image. The position of the mask assembly 40 on the second support 30 can be finely adjusted. However, hereinafter, the detailed description will focus on the case where the positions of the display substrate 100 and the mask assembly 40 are aligned by finely adjusting the position of the mask assembly 40 on the second support part 30.

The pressure control unit 80 is connected to the chamber 10 and can control the pressure inside the chamber 10. For example, the pressure regulator 80 can adjust the pressure inside the chamber 10 to be equal to or similar to atmospheric pressure. Additionally, the pressure regulator 80 can adjust the pressure inside the chamber 10 to be the same as or similar to a vacuum state.

The pressure regulator 80 may include a connection pipe 81 connected to the chamber 10 and a pump 82 installed in the connection pipe 81. At this time, depending on the operation of the pump 82, outside air may be introduced through the connection pipe 81 or the gas inside the chamber 10 may be guided to the outside through the connection pipe 81.

Meanwhile, looking at the operation of the display device manufacturing device 2 as described above, when the pressure regulator 80 makes the inside of the chamber 10 in a state equal to or similar to atmospheric pressure, the gate valve 11 operates and the chamber ( The opened part of 10) can be opened.

Afterwards, the display substrate 100 can be charged from the outside into the chamber 10 from the outside. At this time, the display substrate 100 may be charged into the chamber 10 in various ways. For example, the display substrate 100 may be inserted from the outside of the chamber 10 into the inside of the chamber 10 through a robot arm disposed outside the chamber 10. In another embodiment, when the first support part 20 is formed in a shuttle shape, a separate robot is placed outside the chamber 10 after the first support part 20 is transported from the inside of the chamber 10 to the outside of the chamber 10. It is also possible to seat the display substrate 100 on the first support part 20 through an arm or the like and insert the first support part 20 from the outside of the chamber 10 into the inside of the chamber 10 . Hereinafter, for convenience of explanation, a detailed description will be given focusing on the case where the display board 100 is charged from the outside of the chamber 10 into the inside of the chamber 10 through a robot arm disposed outside the chamber 10.

The mask assembly 40 may be disposed inside the chamber 10 as described above. In another embodiment, the mask assembly 40 may be charged from the outside of the chamber 10 into the chamber 10 in the same or similar manner as the display substrate 100. However, for convenience of explanation, hereinafter, the mask assembly 40 is placed inside the chamber 10 and only the display board 100 is inserted from the outside of the chamber 10 into the inside of the chamber 10. Let me explain.

In the above case, as another embodiment, as described above, the first support part 20 and the second support part 30 are in the form of a shuttle to fix the display substrate 100 and the mask assembly 40 and then move to the outside of the chamber 10. It is also possible to charge into the chamber 10.

When the display substrate 100 is inserted into the chamber 10, the display substrate 100 may be seated on the first support portion 20. At this time, the vision unit 70 can photograph the positions of the display substrate 100 and the mask assembly 40. In particular, the vision unit 70 can photograph the first alignment mark of the display substrate 100 and the second alignment mark of the mask assembly 40.

The positions of the display substrate 100 and the mask assembly 40 can be determined based on the first alignment mark and the second alignment mark photographed as described above. At this time, the display device manufacturing apparatus 2 is equipped with a separate control unit (not shown) to determine the positions of the display substrate 100 and the mask assembly 40.

Once the positions of the display substrate 100 and the mask assembly 40 are completed, the second support part 30 can finely adjust the position of the mask assembly 40.

Afterwards, the deposition source 500 operates to supply the deposition material to the mask assembly 40, and the deposition material passing through the plurality of pattern holes of the mask sheet 42 can be deposited on the display substrate 100. At this time, the deposition source 500 may move in parallel with the display substrate 100 and the mask assembly 40, or the display substrate 100 and the mask assembly 40 may move in parallel with the deposition source 500. . That is, the deposition source 500 can move relative to the display substrate 100 and the mask assembly 40. At this time, the pump 82 can maintain the pressure inside the chamber 10 in the same or similar form as a vacuum by sucking in the gas inside the chamber 10 and discharging it to the outside.

In the above case, the deposition material may pass through the pattern hole of the mask assembly 40 and be deposited on the display substrate 100. At this time, the mask assembly 40 may provide a pattern hole corresponding to an area to be deposited on the display substrate 100 . Accordingly, a plurality of layers, such as an organic layer and a metal layer, can be formed to be stacked on the display device 1, which will be described later.

Figure 2 is a perspective view showing a deposition source according to an embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line III-III' of FIG. 2 showing a deposition source according to an embodiment of the present invention.

Referring to FIGS. 1 to 3 , the deposition source 500 may be disposed in a direction parallel to one side of the mask assembly 40 (for example, the x direction in FIG. 1 ). Additionally, in one embodiment, the deposition source 500 may include a housing 510, a cover portion 520, and a first nozzle 531.

The housing 510 is a rigid body with an internal space and can accommodate a deposition material in the internal space. In one embodiment, the housing 510 may be formed in the shape of a rectangular parallelepiped, but is not limited thereto and may be formed in various shapes such as a cylinder. Hereinafter, for convenience of explanation, the description will focus on the fact that the housing 510 is formed in the shape of a rectangular parallelepiped.

The housing 510 may have a shape in which one side (eg, the +z direction side in FIG. 2) is open. The deposition material can be accommodated in the internal space of the housing 510 through this open surface. Additionally, a heater (not shown) is disposed in the housing 510 to heat the deposition material contained in the internal space to evaporate or sublimate it.

A cover portion 520 may be disposed on one open surface of the housing 510. The cover portion 520 can cover one open surface of the housing 510 and seal the housing 510.

The first nozzle 531 may be disposed on the cover part 520. The first nozzle 531 may be connected to the cover part 520 in various forms. For example, the first nozzle 531 may be formed integrally with the cover portion 520. In another embodiment, the first nozzle 531 may be formed separately from the cover part 520 and may be combined with the cover part 520. Hereinafter, for convenience of explanation, the first nozzle 531 will be described in detail focusing on the case where it is formed separately from the cover part 520 and is combined with the cover part 520.

The first nozzle 531 may be connected to the internal space of the housing 510 through the cover part 520. In one embodiment, the first nozzle 531 may be inserted into the bottom of the cover portion 520 or beyond the bottom. Alternatively, the first nozzle 531 may be disposed around the opening provided in the cover part 520. Hereinafter, the description will focus on the case where the first nozzle 531 is disposed on the periphery of the opening provided in the cover part 520. The deposition material may be heated by a heater, evaporated or sublimated, and then sprayed through the first nozzle 531.

In one embodiment, a plurality of first nozzles 531 may be provided. For example, the plurality of first nozzles 531 may be arranged side by side and spaced apart in a direction parallel to one side of the mask assembly 40 or the substrate 100 (e.g., the x direction in FIG. 1 or FIG. 2). there is. In one embodiment, the deposition source 500 may move relative to the substrate 100 and/or the mask assembly 40 in a direction perpendicular to the direction in which the plurality of first nozzles 531 are arranged side by side. That is, as described above, the deposition source 500 may spray the deposition material while moving relative to the substrate 100 and/or the mask assembly 40 in the first direction (for example, the y direction in FIG. 1). . The plurality of first nozzles 531 may be arranged side by side in a second direction perpendicular to the first direction (eg, x-direction in FIG. 1). The deposition source 500 can deposit a deposition material on the entire surface of the substrate 100 with this configuration.

In one embodiment, the plurality of first nozzles 531 may be arranged to be spaced apart in the first direction. That is, the plurality of first nozzles 531 may be arranged to be spaced apart in the first and second directions to form rows and columns. In FIG. 2 , as an example, the plurality of first nozzles 531 are shown in two rows and eight columns, but the present invention is not limited thereto.

The second nozzle 532 may be disposed on at least some of the plurality of first nozzles 531. Hereinafter, the description will focus on the case where the second nozzle 532 is disposed throughout the plurality of first nozzles 531.

Referring to FIGS. 2 and 3 , the first nozzle 531 may be disposed around the opening 521 provided on the cover 520. In one embodiment, the first nozzle 531 may be formed in various shapes. For example, the first nozzle 531 may have a cylindrical shape or a polygonal pillar shape. However, for convenience of explanation, the following description will focus on the case where the first nozzle 531 has a cylindrical shape. This first nozzle 531 may be connected to the internal space of the housing 510 through the opening 521 provided in the cover 52. That is, the deposition material evaporated or sublimated in the internal space of the housing 510 may be sprayed toward the substrate in a third direction (eg, z-direction in FIG. 3A) through the first nozzle 531.

The second nozzle 532 may be arranged to be spaced apart from the first nozzle 531. In one embodiment, the second nozzle 532 may be spaced apart from the outer surface of the first nozzle 531 and may be arranged to surround the first nozzle 531 . That is, the second nozzle 532 has a cylindrical shape with a larger diameter than the first nozzle 531, and the second nozzle 532 can be arranged to be spaced apart from the first nozzle 531 in the first and second directions. there is. The second nozzle 532 may limit the spray angle of the deposition material sprayed from the first nozzle 531.

In one embodiment, the second nozzle 532 may be formed in a circular shape with a larger diameter than the first nozzle 531 when viewed from a plane (that is, when viewed in the -z direction of FIG. 3).

At this time, the center of the second nozzle 532 and the center of the first nozzle 531 may be concentric. In this case, the distance (s) from the outer surface of the first nozzle 531 to the second nozzle 532 will be the same in all directions including the first direction, the second direction, and the center of the first nozzle 531. You can.

However, in another embodiment, the center of the first nozzle 531 and the center of the second nozzle 532 may not coincide. In this case, the distance s from the outer surface of the first nozzle 531 to the second nozzle 532 is the distance on one side of the first nozzle 531 (for example, the +x direction side in FIG. 3). The spacing may be different from the spacing on the other side (for example, the -x direction side in FIG. 3). In this way, the center of the second nozzle 532 may be arranged not to coincide with the center of the first nozzle 531 as needed, that is, considering the designed angle of incidence. However, for convenience of explanation, the following description will focus on the case where the center of the first nozzle 531 and the center of the second nozzle 532 are concentric.

In one embodiment, the first nozzle 531 includes a first height h1 that is a length in the third direction (for example, the z direction in FIG. 3), which is the injection direction, and the second nozzle 532 includes a length in the third direction (e.g., z-direction in FIG. 3), which is the injection direction. It may include a second height (h2), which is the length in the third direction. At this time, the first height (h1) may be smaller than the second height (h2). Accordingly, the spray angle of the deposition material sprayed from the first nozzle 531 by the second nozzle 532 may be limited.

Figure 4 is a diagram schematically showing deposition material being sprayed from a deposition source according to an embodiment of the present invention.

Referring to FIG. 4, as the deposition source 500 according to an embodiment of the present invention is provided with a second nozzle 532, the injection angle θ of the deposition material may be reduced.

In general, the deposition material may be sprayed, pass through the pattern hole of the mask assembly 40, and be deposited on the substrate 100. At this time, if the injection angle (θ) of the deposition material is large, it may pass through the pattern hole of the mask assembly 40 at an angle, creating an external shadow where the deposition material is deposited in an area where deposition is not required. Additionally, internal shadows may occur where only a portion of the deposition material is deposited in the area where deposition is required.

The deposition source 500 according to an embodiment of the present invention can improve straightness by limiting the injection angle (θ) of the deposition material through the second nozzle 532 disposed to surround the first nozzle 531. . Specifically, the injection angle of the deposition material injected from the first nozzle 531 is greater than the injection angle (θ) of the deposition material that passed through the second nozzle 532. However, some of the deposition material sprayed from the first nozzle 531 may not be sprayed because it hits the second nozzle 532, and the spray angle θ may be reduced by the second nozzle 532.

Accordingly, the above-described shadow can be prevented, and the deposition material can be deposited at a required location on the substrate 100 with a required thickness. This can reduce the defect rate of the display panel of the display device, and can achieve excellent deposition, especially in display panels that require ultra-high resolution.

Referring again to FIG. 2, the deposition source 500 may further include a blocking plate 540. The blocking plate 540 may be arranged to be spaced apart from the first nozzle 531 in a direction in which it moves relative to the substrate 100 and/or the mask assembly 40, that is, in the first direction (y direction in FIG. 2). The blocking plate 540 may be arranged to be spaced apart from one side of the first nozzle 531 in the first direction and the other side opposite to the one side. That is, the blocking plate 540 may be formed of a pair of plates facing each other in the first direction with the first nozzle 531 in between.

The blocking plate 540 may extend along a second direction (x-direction in FIG. 2) perpendicular to the first direction. In one embodiment, the blocking plate 540 may extend between both ends of the cover portion 520 in the second direction.

FIG. 5 is a cross-sectional view taken along line V-V' of FIG. 2 showing a deposition source according to an embodiment of the present invention.

Referring to FIG. 5 , the blocking plate 540 may include a third height h3 in the third direction (eg, z-direction in FIG. 5 ). At this time, the third height (h3) may be larger than the second height (h2). Accordingly, the path of the deposition material that has passed through the second nozzle 532 may be restricted by the blocking plate 540 so that the spray angle is once again reduced. Accordingly, the injection angle θ of the deposition material in the first direction (y direction in FIG. 5) is smaller than the injection angle in the second direction (x direction in FIG. 5) due to the presence of the blocking plate 540. You can lose. Accordingly, the deposition material can be deposited better in the required area because the straightness is improved, and the shadow phenomenon can be reduced. In addition, the spraying angle of the deposition material in the first direction (y direction in FIG. 5) becomes smaller, which may narrow the area where the deposition material can be sprayed instead of improving the deposition quality. However, the deposition source 500 is connected to the substrate 100. Since the deposition source 500 moves relative to one direction (y direction in FIG. 5) and sprays the deposition material, the deposition material can be excellently deposited on the entire surface of the substrate 100.

As described above, the deposition source 500 according to an embodiment of the present invention can prevent the shadow phenomenon and implement a display device with ultra-high resolution by limiting the spray angle of the deposition material.

Figure 6 is a cross-sectional view similar to Figure 3 showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 6, in another embodiment, the first nozzle 531 may include a portion whose diameter increases in the third direction. Specifically, the portion of the first nozzle 531 adjacent to the cover part 520 may extend in a direction perpendicular to the contact surface with the cover part 520. At this time, the first nozzle 531 may extend to have an inclination outward in the radial direction from a portion extending perpendicular to the contact surface with the cover portion 520. That is, the first nozzle 531 may be formed in a Y shape as shown in FIG. 6 on the front. In this case as well, the second nozzle 532 may be arranged to surround and be spaced apart from the first nozzle 531 as described above. When the first nozzle 531 is formed in a Y shape as described above, the deposition material is sprayed at an appropriate spray angle, and at this time, the second nozzle 532 can limit the spray angle by blocking the deposition material from scattering excessively. there is. Accordingly, the deposition quality of the deposition material can be improved.

Figure 7 is a perspective view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 7 , in another embodiment, the second nozzle 532 may be arranged to be spaced apart from the cover portion 520 in the third direction. That is, the second nozzle 532 may include a nozzle body 532-1 and a support stand 532-2. The nozzle body 532-1 may be formed in the shape of a cylinder or polygonal column like the second nozzle 532 described above. Hereinafter, the description will focus on the fact that the nozzle body 532-1 has a cylindrical shape. A plurality of supports 532-2 may be arranged at a lower portion of the nozzle body 532-1 and spaced apart along the circumference. For example, four supports 532-2 may be arranged along the lower circumference of the nozzle body 532-2. In one embodiment, the support 532-2 may be formed in a pin-like shape.

The support 532-2 may be connected to the cover portion 520 to support the nozzle body 532-1. Like the above-described second nozzle 532, the nozzle body 532-1 may surround the first nozzle 531 to reduce the injection angle of the deposition material. To this end, the maximum height of the nozzle body 532-1, that is, the distance from one side of the cover part 520 to the top of the nozzle body 532-1, may be greater than the height of the first nozzle 531. At this time, the distance from one surface of the cover part 520 to the bottom of the nozzle body 532-1 may be smaller than the height of the first nozzle 531. In this way, the second nozzle 532 may be in a form that exposes the lower part of the first nozzle 510 to the outside. In addition, the lower part of the second nozzle 532 is not curved but is shaped like a pin, so the weight can be reduced and lightened.

Figure 8 is a perspective view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 8 , in one embodiment, the second height h2 of the second nozzle 532 may vary along the circumference of the second nozzle 532 . That is, the upper circumference of the second nozzle 532 may not be located on the same plane as shown in FIG. 8 .

In one embodiment, the second nozzle 532 may include a concave portion 532-3 that is concave around one end, for example, the upper end. A plurality of concave portions 532-3 may be provided as required to adjust the spray angle of the deposition material. In one embodiment, two concave portions 532-3 may be provided to face each other in the second direction. Accordingly, the deposition material passing through the concave portion 532-3 can be sprayed at a larger spray angle. Additionally, the injection angle of the deposition material can be adjusted as needed by adjusting the depth of the concave portion 532-3. However, it is not limited to this, and the number, location, and depth of the concave portions 532-3 may be adjusted depending on the characteristics of the required deposition process.

Figure 9 is a perspective view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 9, in one embodiment, the second nozzle 532 may be provided to partially surround the first nozzle 531. For example, the second nozzle 532 may be provided in a semicircular shape on a plane. That is, the second nozzle 532 may be provided in the shape of a semicylindrical column to surround a portion of the first nozzle 531. Even in this case, the height of the second nozzle 532 may be greater than the height of the first nozzle 531. Accordingly, the spray angle may become smaller on the side where the second nozzle 532 is disposed, and the spray angle may not be limited on the side where the second nozzle 532 is not disposed. As the shape of the second nozzle 532 is provided in the shape of a semi-cylindrical column as described above, the injection angle of the deposition material can be adjusted according to the required deposition characteristics. For example, in a portion of the substrate 100 where the deposition material must be deposited with more straightness, second nozzles 532 in the shape of a semicylindrical column may be disposed between two adjacent first nozzles 531 as shown in FIG. 9. . Accordingly, the spray angle may be limited by the second nozzle 532 between two adjacent first nozzles 531. However, it is not limited to this, and the second nozzle 532 having a semi-cylindrical shape may be placed in various positions depending on the required deposition characteristics.

Figure 10 is a perspective view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 10, the second nozzle 532 may further include a mesh structure 532-4 on its inner surface. That is, the mesh structure 532-4 may be disposed on the inner surface of the second nozzle 532 facing the outer surface of the first nozzle 531. The mesh structure 532-4 can hold the deposition material sprayed from the first nozzle 531 so that it does not collapse and fall all at once when it hits the second nozzle 532.

Additionally, in one embodiment, a heating unit (not shown) capable of heating the second nozzle 532 may be disposed outside the second nozzle 532. For example, the heating unit may be a heat wire surrounding the second nozzle 532. The heating unit may heat the second nozzle 532 to remove the deposition material attached to the second nozzle 532 by evaporating or sublimating it. This may optionally cooperate with the mesh structure 532-4 described above. For example, when spraying the deposition material, the mesh structure 532-4 catches and holds the deposition material hitting the second nozzle 532, and after the injection of the deposition material is completed, the heating unit heats the second nozzle 532 to The deposition material retained in the mesh structure 532-4 can be removed by evaporation or sublimation. At this time, although not shown in the drawing, a cooling unit may be further disposed in the second nozzle 532. After the injection of the deposition material is completed as described above and the heating unit is operated to remove the deposition material attached to the second nozzle 532, the cooling unit cools the second nozzle 532 to an appropriate temperature. The temperature can be lowered and the next deposition process can be performed.

Alternatively, the heating unit may be used to increase the temperature of the second nozzle 532 regardless of the mesh structure 532-4 so that the deposition material is not attached to the second nozzle 532 and evaporates during the deposition process.

Figure 11 is a cross-sectional view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 11, as described above, a plurality of first nozzles 531 may be arranged side by side in the second direction. In one embodiment, the second heights h2 of the plurality of second nozzles 532 disposed in the plurality of first nozzles 531 may be different from each other. Specifically, for example, the second height h2 of the centrally placed second nozzle 532 among the plurality of second nozzles 532 may be the largest. The second height h2 of the second nozzles 532 may become smaller as it moves toward both ends in the second direction based on the second nozzle 532. As the second height (h2) becomes smaller, the spray angle of the deposition material may increase. Accordingly, in the central part of the substrate 100, where a large number of display elements are arranged, the deposition material is deposited to ensure higher straightness, and in the peripheral part of the substrate 100, where relatively few display elements are arranged, the deposition material is deposited to cover a wider area. can do.

However, this is described as an example, and the present invention is not limited thereto. Depending on the characteristics of the required deposition process, for example, the second height (h2) of the second nozzle 532 at both ends in the second direction It may be arranged so that is the largest and the second height h2 of the central second nozzle 532 is the smallest.

Figure 12 is a cross-sectional view showing a deposition source according to another embodiment of the present invention.

Referring to FIG. 12, in one embodiment, the second nozzles 532 may be disposed in only some of the plurality of first nozzles 531. In one embodiment, as shown in FIG. 12, a plurality of first nozzles 531 may be arranged side by side in the second direction. At this time, the second nozzle 532 may not be disposed at the first nozzle 531 at both ends in the second direction. The first nozzles 531 at both ends in the second direction where the second nozzles 532 are not disposed may have a wider spray angle of the deposition material than the central portion where the second nozzles 532 are disposed. Accordingly, in the central part of the substrate 100 where a large number of display elements are arranged, the deposition material is deposited to ensure higher straightness, and in the peripheral part of the substrate 100 where relatively few display elements are arranged, the deposition material is deposited to cover a wider area. can do.

However, it will be understood that the position of the first nozzle 531 where the second nozzle 532 is not disposed among the plurality of first nozzles 531 may be changed depending on the required deposition characteristics.

Figure 13 is a plan view schematically showing a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention.

Referring to FIG. 13, the display device 1 manufactured according to an embodiment of the present invention may include a display area DA and a peripheral area PA located outside the display area DA. The display device 1 can provide an image through an array of a plurality of pixels (PX) two-dimensionally arranged in the display area (DA).

The peripheral area (PA) is an area that does not provide an image and may completely or partially surround the display area (DA). A driver, etc. for providing an electrical signal or power to a pixel circuit corresponding to each of the pixels PX may be disposed in the peripheral area PA. A pad, which is an area where electronic devices, printed circuit boards, etc. can be electrically connected, may be disposed in the peripheral area (PA).

Hereinafter, it will be explained that the display device 1 is a light emitting element and includes an organic light emitting diode (OLED), but the display device 1 of the present invention is not limited thereto. As another example, the display device 1 may be a light emitting display device including an inorganic light emitting diode, that is, an inorganic light emitting display device. The inorganic light emitting diode may include a PN diode containing inorganic semiconductor-based materials. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons are injected, and the energy generated by the recombination of the holes and electrons is converted into light energy to emit light of a predetermined color. The above-described inorganic light-emitting diode may have a width of several to hundreds of micrometers, and in some embodiments, the inorganic light-emitting diode may be referred to as a micro LED. As another example, the display device 1 may be a quantum dot light emitting display.

Meanwhile, the display device 1 is used for mobile phones, smart phones, tablet personal computers, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation, and UMPCs. It can be used as a display screen for various products such as televisions, laptops, monitors, billboards, and the Internet of Things (IOT), as well as portable electronic devices such as (Ultra Mobile PC). In addition, the display device 1 according to one embodiment is mounted on a wearable device such as a smart watch, a watch phone, a glasses-type display, and a head mounted display (HMD). It can be used. In addition, the display device 1 according to one embodiment includes a dashboard of a car, a center information display (CID) placed on the center fascia or dashboard of a car, and a room mirror display (a display instead of a side mirror of a car). room mirror display), entertainment for the backseat of a car, and can be used as a display screen placed on the back of the front seat.

FIG. 14 is a cross-sectional view schematically showing a display device manufactured using a display device manufacturing apparatus according to an embodiment of the present invention, and may correspond to a cross-section of the display device taken along line II-II' of FIG. 13.

Referring to FIG. 14 , the display device 1 may include a stacked structure of a substrate 100, a pixel circuit layer (PCL), a display element layer (DEL), and an encapsulation layer 300.

The substrate 100 may have a multilayer structure including a base layer containing a polymer resin and an inorganic layer. For example, the substrate 100 may include a base layer containing a polymer resin and a barrier layer of an inorganic insulating layer. For example, the substrate 100 may include a first base layer 101, a first barrier layer 102, a second base layer 103, and a second barrier layer 104 sequentially stacked. The first base layer 101 and the second base layer 103 are made of polyimide (PI), polyethersulfone (PES), polyarylate, polyether imide (PEI), polyethylene napthalate (PEN), polyethyeleneterepthalate (PET), polyphenylene sulfide (PPS), polycarbonate (PC), cellulose triacetate (TAC), or/and cellulose acetate propio It may include cellulose acetate propionate (CAP), etc. The first barrier layer 102 and the second barrier layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and/or silicon nitride. The substrate 100 may have flexible characteristics.

A pixel circuit layer (PCL) is disposed on the substrate 100. 14 shows a buffer layer 111, a first gate insulating layer 112, and a second gate in which the pixel circuit layer (PCL) is disposed below or/and above the thin film transistor (TFT) and the components of the thin film transistor (TFT). It is shown to include an insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115, and a second planarization insulating layer 116.

The buffer layer 111 may reduce or block penetration of foreign substances, moisture, or external air from the lower portion of the substrate 100 and may provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure including the above-described materials.

The thin film transistor (TFT) on the buffer layer 111 includes a semiconductor layer (Act), and the semiconductor layer (Act) may include polysilicon. Alternatively, the semiconductor layer (Act) may include amorphous silicon, an oxide semiconductor, an organic semiconductor, etc. The semiconductor layer (Act) may include a channel region (C) and a drain region (D) and a source region (S) disposed on both sides of the channel region (C), respectively. The gate electrode (GE) may overlap the channel area (C).

The gate electrode (GE) may include a low-resistance metal material. The gate electrode (GE) may contain a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer containing the above materials. there is.

The first gate _insulating layer 112 between the semiconductor layer (Act ₎ and the gate electrode (GE) is made of silicon oxide (SiO ₂ ), silicon nitride ( _SiN ), titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO _x ). Zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ).

The second gate insulating layer 113 may be provided to cover the gate electrode (GE). The second gate insulating layer 113 _, similar to the first gate insulating layer 112, _is made _of silicon oxide (SiO ₂ ), silicon nitride (SiN , titanium oxide (TiO ₂ ), tantalum oxide (Ta ₂ O ₅ ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO _x ). Zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ).

The upper electrode (Cst2) of the storage capacitor (Cst) may be disposed on the second gate insulating layer 113. The upper electrode (Cst2) may overlap the gate electrode (GE) below it. At this time, the gate electrode (GE) and the upper electrode (Cst2) that overlap with the second gate insulating layer 113 therebetween may form a storage capacitor (Cst). That is, the gate electrode (GE) can function as the lower electrode (Cst1) of the storage capacitor (Cst).

In this way, the storage capacitor (Cst) and the thin film transistor (TFT) may be overlapped and formed. In some embodiments, the storage capacitor Cst may be formed so as not to overlap the thin film transistor (TFT).

The upper electrode (Cst2) is aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), and iridium (Ir). , chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), and may be a single layer or multiple layers of the foregoing materials. .

The interlayer insulating layer 114 may cover the upper electrode (Cst2). _The interlayer insulating layer 114 _is made of silicon _oxide (SiO ₂ ) _, silicon nitride ( _{SiN 5} ), hafnium oxide (HfO ₂ ), or zinc oxide (ZnO _x ). Zinc oxide (ZnO _x ) may be zinc oxide (ZnO) and/or zinc peroxide (ZnO ₂ ). The interlayer insulating layer 114 may be a single layer or a multilayer containing the above-described inorganic insulating material.

The drain electrode (DE) and the source electrode (SE) may each be located on the interlayer insulating layer 114. The drain electrode (DE) and the source electrode (SE) may be connected to the drain region (D) and the source region (S) through contact holes formed in the insulating layers below them, respectively. The drain electrode (DE) and source electrode (SE) may include a material with good conductivity. The drain electrode (DE) and source electrode (SE) may contain a conductive material containing molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may be a multilayer containing the above materials. Alternatively, it may be formed as a single layer. In one embodiment, the drain electrode (DE) and the source electrode (SE) may have a multilayer structure of Ti/Al/Ti.

The first planarization insulating layer 115 may cover the drain electrode (DE) and the source electrode (SE). The first planarization insulating layer 115 is made of general-purpose polymers such as polymethylmethacrylate (PMMA) or polystyrene (PS), polymer derivatives with phenol groups, acrylic polymers, imide polymers, and aryl ether polymers. It may include organic insulating materials such as polymers, amide-based polymers, fluorine-based polymers, p-xylene-based polymers, vinyl alcohol-based polymers, and blends thereof.

The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115 . The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may be a general-purpose polymer such as polymethylmethacrylate (PMMA) or polystyrene (PS), or phenol. It may include organic insulating materials such as polymer derivatives having a group, acrylic polymers, imide polymers, aryl ether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof. .

A display element layer (DEL) may be disposed on the pixel circuit layer (PCL) of the above-described structure. The display element layer (DEL) includes an organic light emitting diode (OLED) as a display element (i.e., a light emitting element), and the organic light emitting diode (OLED) includes a pixel electrode 210, an intermediate layer 220, and a common electrode 230. It may include a layered structure. Organic light-emitting diodes (OLEDs), for example, may emit red, green, or blue light, or may emit red, green, blue, or white light. Organic light-emitting diodes (OLEDs) emit light through a light-emitting area, and the light-emitting area can be defined as a pixel (PX).

The pixel electrode 210 of the organic light emitting diode (OLED) is formed by contact holes formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal disposed on the first planarization insulating layer 115. It can be electrically connected to a thin film transistor (TFT) through (CM).

The pixel electrode 210 is made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In ₂ O ₃ ), and indium. It may include a conductive oxide such as gallium oxide (IGO) or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 210 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), and neodymium (Nd). , may include a reflective film containing iridium (Ir), chromium (Cr), or a compound thereof. In another embodiment, the pixel electrode 210 may further include a film formed of ITO, IZO, ZnO, or In ₂ O ₃ above and below the above-described reflective film.

A pixel defining layer 117 having an opening 117OP exposing the central portion of the pixel electrode 210 is disposed on the pixel electrode 210. The pixel defining layer 117 may include an organic insulating material and/or an inorganic insulating material. The opening 117OP can define a light emitting area of light emitted from an organic light emitting diode (OLED). For example, the size/width of the opening 117OP may correspond to the size/width of the light emitting area. Accordingly, the size and/or width of the pixel PX may depend on the size and/or width of the opening 117OP of the corresponding pixel defining layer 117.

The middle layer 220 may include a light emitting layer 222 formed to correspond to the pixel electrode 210. The light-emitting layer 222 may include a polymer or low-molecular organic material that emits light of a predetermined color. Alternatively, the light-emitting layer 222 may include an inorganic light-emitting material or quantum dots.

In one embodiment, the middle layer 220 may include a first functional layer 221 and a second functional layer 223 disposed below and above the light emitting layer 222, respectively. For example, the first functional layer 221 may include a hole transport layer (HTL), or may include a hole transport layer and a hole injection layer (HIL). The second functional layer 223 is a component disposed on the light emitting layer 222 and may include an electron transport layer (ETL) and/or an electron injection layer (EIL). The first functional layer 221 and/or the second functional layer 223 may be a common layer formed to entirely cover the substrate 100, like the common electrode 230, which will be described later.

The common electrode 230 is disposed on the pixel electrode 210 and may overlap the pixel electrode 210. The common electrode 230 may be made of a conductive material with a low work function. For example, the common electrode 230 is made of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), and iridium ( It may include a (semi) transparent layer containing Ir), chromium (Cr), lithium (Li), calcium (Ca), or an alloy thereof. Alternatively, the common electrode 230 may further include a layer such as ITO, IZO, ZnO, or In ₂ O ₃ on the (semi) transparent layer containing the above-mentioned material. The common electrode 230 may be formed integrally to cover the entire substrate 100.

The encapsulation layer 300 may be disposed on the display element layer DEL and cover the display element layer DEL. The encapsulation layer 300 includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. As an example, Figure 14 shows a first inorganic encapsulation layer 310 in which the encapsulation layers 300 are sequentially stacked, and an organic encapsulation layer. It is shown to include an encapsulation layer 320 and a second inorganic encapsulation layer 330.

The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include one or more inorganic materials selected from the group consisting of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. there is. The organic encapsulation layer 320 may include a polymer-based material. Polymer-based materials may include acrylic resin, epoxy resin, polyimide, and polyethylene. In one embodiment, the organic encapsulation layer 320 may include acrylate. The organic encapsulation layer 320 can be formed by curing a monomer or applying a polymer. The organic encapsulation layer 320 may be transparent.

Although not shown, a touch sensor layer may be disposed on the encapsulation layer 300, and an optical functional layer may be disposed on the touch sensor layer. The touch sensor layer can acquire coordinate information according to an external input, for example, a touch event. The optical functional layer may reduce the reflectance of light (external light) incident from the outside toward the display device and/or improve the color purity of light emitted from the display device. In one embodiment, the optical functional layer may include a retarder and/or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ/2 phase retarder and/or a λ/4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretched synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and polarizer may further include a protective film.

An adhesive member may be disposed between the touch electrode layer and the optical function layer. The adhesive member may be any general material known in the art without limitation. The adhesive member may be a pressure sensitive adhesive (PSA).

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely examples. Those skilled in the art can fully understand that various modifications and equivalent other embodiments are possible from the embodiments. Therefore, the true technical protection scope of the present invention should be determined based on the attached claims.

1: Display device
2: Manufacturing device of display device
10: Chamber
20: first support
30: second support portion
40: Mask assembly
60: Magnetic force unit
70: Vision Department
80: Pressure control unit
100: display board
500: deposition source
510: housing
520: Cover part
531: First nozzle
532: Second nozzle

Claims (21)

A housing that accommodates the deposition material therein;
a plurality of first nozzles spraying the deposition material toward a mask assembly moving relative to a first direction; and
A second nozzle is disposed on at least some of the plurality of first nozzles and is spaced apart from the first nozzle in the first direction and a second direction perpendicular to the first direction and surrounds the first nozzle. , deposition source. According to paragraph 1,
The second nozzle forms a closed loop outside the first nozzle on a plane. According to paragraph 2,
The second nozzle is provided concentrically with the center of the first nozzle. According to paragraph 1,
The second nozzle is a deposition source that has a semicircular shape to surround a portion of the first nozzle on a plane. According to paragraph 1,
The first nozzle includes a first height in the third direction, which is the spraying direction, and the second nozzle includes a second height in the third direction,
The first height is smaller than the second height. According to clause 5,
The second height varies along the circumference of the second nozzle. According to clause 5,
The second heights of the plurality of second nozzles disposed in the plurality of first nozzles are different from each other. In clause 7,
The second height becomes smaller from the second nozzle at the center of the second direction among the plurality of second nozzles to the second nozzles at both ends of the second direction. According to paragraph 1,
The first nozzle is a deposition source including a portion whose diameter increases in the third direction, which is the injection direction. According to paragraph 1,
The plurality of first nozzles are arranged side by side in the second direction,
A deposition source further comprising a blocking plate disposed to be spaced apart from the plurality of first nozzles in the first direction and extending along the second direction. According to clause 10,
The first nozzle has a first height in the third direction, which is the spraying direction, the second nozzle has a second height in the third direction, and the blocking plate has a third height in the third direction,
The first height is smaller than the second height, and the second height is smaller than the third height. According to paragraph 1,
The second nozzle includes a mesh structure disposed on an inner surface facing the first nozzle. According to paragraph 1,
The deposition source further includes a heating unit disposed outside the second nozzle and capable of heating the second nozzle. According to paragraph 1,
A deposition source wherein the second nozzle is provided in all of the plurality of first nozzles. Inserting a substrate into the chamber;
aligning the substrate and mask assembly; and
A method of manufacturing a display device comprising: spraying the deposition material contained in the housing from a first nozzle, and spraying the deposition material at a limited spray angle by a second nozzle spaced apart from the first nozzle and surrounding the first nozzle. According to clause 15,
The display device further comprising: spraying the deposition material injected through the second nozzle by again limiting the spray angle by a blocking plate disposed on one side of the second nozzle and the other side opposite to the one side. Manufacturing method. According to clause 16,
The first nozzle, the second nozzle, and the blocking plate each include a first height, a second height, and a third height in the spray direction,
The first height is smaller than the second height, and the second height is smaller than the third height. According to clause 15,
A method of manufacturing a display device, wherein the height of the second nozzle in the spraying direction is varied along the circumference of the second nozzle. According to clause 15,
A method of manufacturing a display device, wherein the first nozzle and the second nozzle are provided in plural numbers, and the heights of each of the plurality of second nozzles in the spraying direction are different from each other. According to clause 15,
The second nozzle includes a mesh structure disposed on an inner surface facing the first nozzle. According to clause 15,
The method of manufacturing a display device further comprising: heating the second nozzle.

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