KR20230110193A - Electronic device - Google Patents

Abstract

An electronic device includes a housing sidewall defining an opening and a display component disposed in an opening, such as a display cover, to form a gap between the housing sidewall and the display component. In at least one example, the cavity is bounded by the sidewall and the display cover, and the cavity is in fluid communication with the external environment through the gap. In at least one example, the epoxy component at least partially defines the cavity and may be in direct contact with the housing sidewall.

Description

Electronic device {ELECTRONIC DEVICE}

CROSS REFERENCES OF RELATED APPLICATIONS

This application is filed on September 6, 2022 with the title "ELECTRONIC DEVICE", US Provisional Patent Application No. 63/374,738, filed on May 2, 2022 with the title "ELECTRONIC DEVICE", US Provisional Patent Application No. 63/364,012, and filed on January 2022 with the title "ELECTRONIC DEVICE" Priority is claimed to U.S. Provisional Patent Application Serial No. 63/266,829, filed on the 14th, the disclosures of these Provisional Patent Applications are hereby incorporated by reference in their entirety.

technology field

The present disclosure relates generally to electronic devices. More specifically, the present disclosure relates to wearable electronic devices.

Electronic devices are increasingly being designed with device portability in mind, eg, to enable users to use these devices in a wide variety of situations and environments. In the context of wearable devices, these devices can be designed to include many different functions and to operate in many different locations and environments. Components of an electronic device, such as processors, memory, antennas, display, and other components, may in part determine the performance level of the electronic device. Additionally, the arrangement of these components within a device relative to each other may also determine the overall performance level of the electronic device.

BACKGROUND OF THE INVENTION Continued advances in electronic devices and their components have enabled significant increases in performance. However, existing components and structures for electronic devices may limit the performance levels of such devices. For example, although some components can achieve high levels of performance in some situations, including multiple components in devices sized to enhance portability can limit the performance of the components, and thus the device. Consequently, arrangements and further customization of components to electronic devices to provide additional or enhanced functionality without introducing or increasing undesirable device attributes may be desirable.

In at least one example of the present disclosure, a housing sidewall can define an opening and a display component, such as a display cover, can be placed in the opening to form a gap between the housing sidewall and the display component. In at least one example, the cavity is bounded by the sidewall and the display cover, and the cavity is in fluid communication with the external environment through the gap. In at least one example, the epoxy component at least partially defines the cavity and may be in direct contact with the housing sidewall.

In at least one example of an electronic device, a housing sidewall includes an upper sidewall portion and a lower sidewall portion bonded to a middle sidewall portion disposed between the upper sidewall portion and the lower sidewall portion. The housing can define an opening, and a display assembly can be placed in the opening to form a gap between the housing and the display assembly. Also, in at least one example, the epoxy component can serve as a seal disposed between the display assembly and the sidewall, the epoxy extending laterally across the gap with the epoxy component seal directly bonded to the middle portion of the sidewall.

In at least one embodiment, an electronic device may include a sidewall defining an interior volume and opening. The sidewall may include an upper portion, a lower portion, and an intermediate portion disposed between and bonded to the upper and lower portions. The device may also include a display cover disposed in the opening and defining an interior volume, a side cavity defined by the display assembly and the sidewall, the cavity being in fluid communication with the external environment through a gap formed between the display assembly and the sidewall, and an epoxy layer contacting the lower and middle portions and at least partially defining the cavity.

In at least one example embodiment, an electronic device can include an outer housing defining an interior volume, a first speaker and a second speaker disposed in the interior volume. The first speaker may include a frame disposed around a periphery of a diaphragm of the first speaker. The front volume may be defined by the outer housing, the first speaker, and the second speaker. Similarly, the first rear volume can be defined by the first speaker and frame, and the second rear volume can be defined by the second speaker and frame.

In at least one embodiment, an electronic device may include an outer housing, an inner housing spaced apart from the outer housing, and a speaker assembly disposed between the inner and outer housings. The speaker assembly may include a first speaker, a second speaker, and a speaker frame supporting the first speaker. The device may further include a first rear volume defined by the inner housing and the first speaker, and a second rear volume defined by the inner housing and the second speaker, the second rear volume being separated from the first rear volume by the speaker frame.

In at least one example, an electronic device can include an outer housing, an inner housing, and a speaker assembly disposed between the inner and outer housings. The speaker assembly may include a first speaker and a second speaker. The electronic device may further include a front volume defined by the outer housing and speaker assembly, a rear volume defined by the inner housing and speaker assembly, a first vent that brings a first end of the front volume into fluid communication with an external environment, and a second vent that brings a second end of the front volume into fluid communication with an external environment. The posterior volume can be divided into first and second isolated parts.

In at least one embodiment, an electronic device may include a housing defining an interior volume and an aperture, a button disposed in the aperture, the button including a plunger extending into the interior volume, and a speaker frame disposed in the interior volume defining an opening. A plunger may extend through the opening.

In at least one embodiment, an electronic device can include a housing defining an interior volume, a plunger extending into the interior volume, and a frame structurally supporting the first speaker and the second speaker. A frame may be disposed in the interior volume and define an opening between the first speaker and the second speaker. The plunger may be aligned with the aperture.

In at least one embodiment, an electronic device may include a speaker assembly that includes an outer housing defining an aperture, an inner housing spaced from the outer housing and defining an interior volume, the inner housing and outer housing defining a speaker volume, a button having a plunger, the button disposed in the aperture, and a speaker frame defining a hole. The plunger can align with the hole and extend into the speaker volume towards the inner housing.

In at least one embodiment, an electronic device includes a sidewall that includes an antenna and defines an interior volume, a printed circuit board (PCB) disposed within the interior volume, an insulating material disposed in the interior volume, and an electrical connector in contact with the PCB, the electrical connector extending through the insulation material and forming electrical contact between the antenna and the PCB.

In at least one exemplary embodiment, an electronic device may include a conductive housing sidewall defining an interior volume, a printed circuit board (PCB) disposed in the interior volume, an electrical connector contacting the PCB and extending through an insulating material, and an elongate conductive member disposed between the housing sidewall and the electrical connector, the elongate conductive member contacting the electrical connector and the housing sidewall.

In at least one embodiment, an electronic device includes a housing sidewall including a lower portion and an electrically conductive upper portion separated from the lower portion by a non-conductive material, the housing sidewall defining an interior volume and an opening, a display component disposed in the opening, a printed circuit board (PCB) disposed in the interior volume below the display component, an insulating material disposed in the interior volume between the housing sidewall and the PCB, and a connector forming an electrical path between the upper conductive portion of the sidewall and the PCB. The upper portion may form a ring surrounding the periphery of the display component.

In at least one embodiment, a wearable electronic device may include a housing having sidewalls. The sidewall may define an interior volume, and the sidewall extends 360 degrees circumferentially around the interior volume. The sidewall may also define a first aperture, a second aperture between about 155 and 205 degrees relative to the first aperture, and a third aperture closer to the second aperture than the first aperture. The wearable electronic device may further include a first microphone disposed in the interior volume and configured to receive sound through the first aperture, a second microphone disposed in the interior volume and configured to receive sound through the second aperture, and a third microphone disposed in the interior volume and configured to receive sound through the third aperture.

In at least one embodiment, the wearable electronic device includes a housing sidewall defining an interior volume, a first band reception feature, a second band reception feature opposite the first band reception feature, a first sidewall portion extending between the first band reception feature and the second band reception feature, the first sidewall portion defining a first aperture closer to the first band reception feature than the second band reception feature, disposed opposite the first band reception feature and second band reception feature. and a second sidewall portion extending between the features, the second sidewall portion defining a second aperture and a third aperture, the second aperture being defined closer to the second band receive feature than the first band receive feature. The wearable electronic device may further include a first microphone disposed in the interior volume adjacent to the first aperture, a second microphone disposed in the interior volume adjacent to the second aperture, and a third microphone disposed in the interior volume adjacent to the third aperture.

In at least one example of the present disclosure, an electronic device includes an interior volume, a sidewall defining a first aperture, a second aperture, a third aperture, and a fourth aperture, a first microphone disposed in the interior volume adjacent to the first aperture, a second microphone disposed in the interior volume adjacent to the second aperture, a third microphone disposed in the interior volume adjacent to the third aperture, and a speaker disposed in the interior volume adjacent to the fourth aperture. You can. A distance along the sidewall between the first and second apertures may be greater than a distance along the sidewall between the second and third apertures, and the fourth aperture may be adjacent to the first aperture.

The disclosure will be readily understood by the following detailed description taken in conjunction with the accompanying drawings, in which like reference numbers indicate like structural elements.
1A shows an example of a wearable electronic device.
1B shows a top view of a portion of a wearable electronic device.
1C shows a bottom view of a portion of a wearable electronic device.
2A shows a perspective view of an example of a wearable electronic device.
2B shows a perspective view of an example of a wearable electronic device.
2C shows an exploded view of an example of a wearable electronic device.
3 shows an exploded view of an example of a wearable electronic device.
4 shows a portion of a sidewall of an example of a wearable electronic device.
5A shows a cross-sectional view of an example sidewall of a wearable electronic device.
5B shows another cross-sectional view of an example sidewall of a wearable electronic device.
5C shows another cross-sectional view of an example sidewall of a wearable electronic device.
6 shows a cross-sectional view of an interface between a plastic and metal portion of an example sidewall of an electronic device.
Figure 7a shows another view of the interface of Figure 6;
Fig. 7b shows another view of the interface of Fig. 6;
Figure 7c shows another view of the interface of Figure 6;
8 shows a method of bonding a metal substrate to a non-metal substrate.
9A shows a cross-sectional view of an example sidewall and internal components of a wearable electronic device.
9B shows another cross-sectional view of an example sidewall and internal components of a wearable electronic device.
9C shows another cross-sectional view of an example sidewall and internal components of a wearable electronic device.
10A shows a top perspective view of an example housing sidewall of an electronic device.
Fig. 10b shows a plan view of the housing side wall of Fig. 10a;
FIG. 10C shows a close-up plan view of a portion of the sidewall of the housing of FIG. 10A.
11 shows a cross-sectional view of an example sidewall and internal components of a wearable electronic device.
12 shows a top view of a portion of an example of an electronic device that includes a printed circuit board (PCB) and peripheral electrical contacts.
13 shows a top view of a portion of an example of an electronic device including a printed circuit board (PCB) and peripheral electrical contacts.
14A shows a cross-sectional view of an example sidewall and internal components of a wearable electronic device.
14B shows a cross-sectional view of an example sidewall and internal components of a wearable electronic device.
15A shows a side view of an example of a wearable electronic device.
15b shows a cross-sectional view thereof.
FIG. 15C shows a circuit diagram equivalent of the device shown in FIGS. 15A and 15B worn by a user.
16 shows an example PCB of an electronic device.
17 shows a portion of an example PCB of an electronic device.
18 shows a portion of an example PCB of an electronic device.
19 shows a temperature sensor disposed on an example ALS module of an electronic device.
20A shows a cross-sectional view of a portion of an example of an electronic device.
FIG. 20B shows a close-up view of a portion of FIG. 20A.
20C shows an example of a speaker frame.
20D shows an example of a speaker assembly of an electronic device.
20E shows the speaker assembly of FIG. 20D with one example of a button.
FIG. 20F shows another cross-sectional view of the speaker assembly of FIG. 20E.
20g shows another cross-sectional view of the speaker and button assembly of FIG. 20e.
Figure 20h shows another cross-sectional view of the speaker and button assembly of Figure 20e.
Figure 20I shows another cross-sectional view of the speaker and button assembly of Figure 20F.
Figure 20j shows another cross-sectional view of the speaker and button assembly of Figure 20f.
20K shows another cross-sectional view of the speaker and button assembly of FIG. 20F.
21 shows another cross-sectional view of the speaker assembly of FIG. 20E.
22 illustrates a user riding a bike while wearing an example of a wearable electronic device.
23 shows an example of an electronic device receiving wind.
24 shows an example of an electronic device receiving wind from various directions.
25 shows a top view of an example of an electronic device.
26 shows a top view of an example of an electronic device.
27 shows a top view of an example of an electronic device.
28 shows a top view of an example of an electronic device.
29A shows a bottom view of an example of an electronic device.
29B shows a cross-sectional view of an example rear cover of an electronic device.
30 shows a partial cross-sectional view of an example rear cover and fastener of an electronic device.
31 shows a partial cross-sectional view of an example rear cover and fastener of an electronic device.
32 shows an example of a rear cover fastener.
33A shows another example of a rear cover fastener.
33B shows another example of a rear cover fastener.
34 shows a plan view of another example of a fastener.
35 shows a plan view of another example of a fastener.
36A shows a plan view of another example of a fastener.
36b shows a side view thereof.
37 illustrates a method of forming the fastener shown in FIGS. 36A and 36B.

Reference will now be made in detail to representative examples illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred example or embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalents as may be included within the spirit and scope of the described embodiments as defined by the appended claims.

The following disclosure relates generally to electronic devices. More specifically, the present disclosure relates to wearable electronic devices. Wearable electronic devices of the present disclosure include custom arrangements of components to provide additional or enhanced functionality without introducing or increasing undesirable device properties or performance. In this way, more functions and components can be included in wearable devices for a user to wear and operate in any condition or activity without limiting the functionality and durability of the devices.

Specific examples and embodiments of electronic devices, including wearable electronic devices, are discussed below with reference to FIGS. 1-28 . However, those skilled in the art will readily appreciate that with respect to these drawings, the specific details for practicing the invention provided herein are for illustrative purposes only and should not be construed as limiting. Moreover, as used herein, a system, method, article, component, feature, or sub-feature comprising at least one of a first option, a second option, or a third option may be one of each enumerated option (e.g., only one of the first option, only one of the second option, or only one of the third option), multiple options of a single enumerated option (e.g., two or more of the first option), two or more options simultaneously (e.g., one of the first option and one of the second option). ), or a combination thereof (eg, two of the first options and one of the second options).

1A shows an example of an electronic device 100 . The electronic device shown in FIG. 1A is a watch such as a smart watch. The smartwatch of FIG. 1A is just one representative example of a device that can be used with the systems and methods disclosed herein. Electronic device 100 may correspond to any type of wearable electronic device, portable media player, media storage device, portable digital assistant (“PDA”), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. Electronic device 100 may be referred to as an electronic device or a consumer device. In some examples, the electronic device 100 can include a housing 102 that can contain operative components within an interior volume defined at least in part by the housing, for example. The electronic device 100 may also include a strap 104, or other retaining component, that may secure the device 100 to a user's body as desired. Additional details of the electronic device are provided below with reference to FIG. 1B.

1B illustrates an electronic device 100, e.g., a smartwatch, which may be substantially similar to, and may include some or all of, some or all of the features of the devices described herein, including the electronic device 100 shown in FIG. 1A but without the strap 104. Device 100 may include a housing 102 and a display assembly 106 attached to housing 102 . Housing 102 can substantially define at least a portion of an outer surface of device 100 .

Display assembly 106 may include glass, plastic, or any other substantially transparent outer layer, material, component, or assembly. The display assembly 106 may include multiple layers, each layer providing a unique function, as described herein. Accordingly, the display assembly 106 may be an interface component, or may be part of it. Display assembly 106 may define a front exterior surface of device 100 , and as described herein, this exterior surface may be considered an interfacial surface. In some examples, the interface surface defined by display assembly 106 can receive inputs, such as touch inputs, from a user.

In some examples, housing 102 can be a substantially continuous or integral component and can define one or more openings for receiving components of electronic device 100 . In some examples, device 100 may include input components such as crown 110 and/or one or more buttons 108 that may be disposed in openings. In some examples, a material may be disposed between buttons 108 and/or crown 110 and housing 102 to provide an airtight and/or watertight seal at the locations of the openings. Housing 102 may also define one or more openings or apertures, such as aperture 112 , that may allow sound to pass into or out of an interior volume defined by housing 102 . For example, aperture 112 may communicate with a microphone component disposed in the interior volume. In some examples, housing 102 may define or include a feature such as an indentation for removably coupling housing 102 and a strap or retaining component.

1C shows a bottom perspective view of electronic device 100 . Device 100 may include a back cover 114 that may be attached to housing 102 , for example, opposite display assembly 106 . The back cover 114 may include ceramic, plastic, metal, or combinations thereof. In some examples, the back cover 114 can include a component 116 that is at least partially electromagnetically transparent. The electromagnetically transparent component 116 can be transparent to electromagnetic radiation of any desired wavelengths, such as visible light, infrared light, radio waves, or combinations thereof. In some examples, the electromagnetically transparent component 116 can allow sensors and/or emitters disposed in the housing 102 to communicate with the external environment. Housing 102 , display assembly 106 , and back cover 114 together may substantially define an interior volume and an exterior surface of device 100 .

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 1A-1C ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 1A-1C.

As mentioned above, portable and wearable electronic devices can be designed to be used in many different environments and during any kind of activity throughout a user's day. For example, wearable electronic watches, headphones, and phones can be carried by a user while exercising, sleeping, driving, biking, hiking, swimming, diving, outside in the rain, outside in the sun, and the like. The wearable electronic devices described herein are configured to withstand the varied and often harsh conditions of a variety of environments, including changing environments and wet environments. Wet environments may include, for example, wearing the devices in the rain or when entering water while bathing or swimming.

Examples of electronic devices disclosed herein include components, features, arrangements, and configurations that resist corrosion and damage due to exposure to moisture. Some aspects of the devices described herein may include gaps between components that allow moisture, water, or other fluids to enter. Gaps may exist for aesthetic purposes or for functional purposes. However, one or more components, including epoxy seals, insulating materials and frames, and other components of the devices described herein can be configured to prevent such moisture from entering the internal volume of the device, whereby it can damage sensitive electronic components.

In this context, FIGS. 2A and 2B show right and left perspective views, respectively, of an example of a wearable electronic device 200 that includes a housing 202 that includes sidewalls 228 that define an opening in which a display cover 222 is disposed. The sidewalls may include an upper portion 232 defining an upper peripheral edge surrounding the display cover 222, a lower portion 234, and an intermediate portion 236 disposed between the upper portion 232 and the lower portion 234. The wearable electronic device 200 may also include a securing strap 203 configured to secure the wearable electronic device 200 to an appendage of a user. In at least one example, sidewalls 228 of housing 202 may define an upper peripheral edge of device 200 surrounding display cover 222 .

In at least one example, display cover 222 defines a planarly disposed top surface. The plane may be set flush with or below the upper peripheral edge of the sidewalls 228 . In this way, when the wearable electronic device 200 comes into contact with a surface or object at or near the top surface of the display cover 222 and/or the upper peripheral edge of the sidewalls 228, contact and potential damage to the display cover 222 can be reduced. In one example, the display cover 222 is set flush with or below the upper peripheral edges of the sidewalls 228 to protect the display cover 222 from damage.

In at least one example, as shown in FIG. 2A , sidewalls 228 may define a first side of wearable electronic device 200 having a recessed feature on which crown 210 is located. Crown 210 may be part of a turn dial button or other functional knob configured to be operated by a user. Crown 210 may be disposed in the recessed portion such that a first side of sidewalls 228 extends outwardly and at least partially around crown 210 , as noted above. In this way, bumps and contacts to other objects against the first side of sidewall 228 during use can make contact with sidewall 228 without compressing or rotating crown 210 . In this way, the recessed portion of the first side of the sidewalls 228 prevents unintentional manipulation of the crown 210 . The button 209 shown in FIG. 2A may also be at least partially surrounded by an outwardly extending portion of the sidewall 228, such that the button 209 is placed within a recess in that portion to protect the button 209 from unintended touches.

In at least one example, as shown in FIG. 2B , sidewalls 228 may define a second side opposite the first side shown in FIG. 2A . In such an example, the wearable electronic device 200 can include a first speaker vent 249, a second speaker vent 247, and a button 208 disposed between the first speaker vent 249 and the second speaker vent 247. The first and second speaker vents 249, 247 can provide fluid communication from the external environment and a common speaker volume behind sidewall 228 (e.g., within the interior volume defined by sidewalls 228). The button 208 can be placed between the first and second speaker vents 249, 247 to save space and provide a compact design without disrupting the ability of one or more speakers to communicate with the external environment through the first and second speaker vents 247, 249.

2C illustrates an exploded view of another example of an electronic device 200 that may also be part of a wearable electronic watch or other wearable electronic device. Device 200 includes display assembly 206 , housing 202 , back cover 214 , and electromagnetically transmissive component 216 . Additionally, the exploded view of FIG. 2A illustrates housing 202, back cover 214, electromagnetically transparent component 216, and various internal components that may be disposed within the interior volume defined by display assembly 206. For example, device 200 may include one or more printed circuit boards (PCBs) 218 and one or more antenna components 220, electrical connectors and flexes, buttons, seals, gaskets, memory components, processors, sensors, dials, batteries, and the like.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 2A-2C ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 2A-2C.

3 illustrates an enlarged view of a portion of an exploded view of device 200 shown in FIG. 2 including housing 202 and display assembly 206, which is further exploded to illustrate display cover 222 and display layers 224. Additionally, the exploded view of FIG. 3 shows a wave ring 226 (also referred to herein as an “elongated conductive member”), which will be described and discussed in more detail below with reference to the other figures. In at least one example, housing 202 includes a sidewall or sidewalls 228 defining an interior volume and opening 230 . When assembled, display assembly 206 or one or more components of display assembly 206 may be disposed in an opening to define an interior volume and form an outer surface of device 200 .

In at least one example, sidewall 228 can include an upper portion 232 and a lower portion 234 . Upper portion 232 and lower portion 234 may be separated by a middle portion 236 disposed between upper portion 232 and lower portion 234 . In at least one example, upper portion 232 and lower portion 234 of sidewall 228 may include one or more electrically conductive materials, and middle portion 236 may include one or more electrically non-conductive materials and/or insulating material. Middle portion 236 may be molded or otherwise glued to upper portion 232 and/or lower portion 234 such that upper portion 232, lower portion 234, and middle portion 236 form a single integral sidewall 228 of housing 202, as shown.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 3 ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 3 alone or in any combination.

4 illustrates an example of a middle portion 336 separated from the rest of the sidewall of the housing, similar to the middle portion 236 shown as part of the sidewall 228 in FIG. 3 . In the example shown in FIG. 4 , a non-conductive material component or ring 338 is bonded to the intermediate portion 336 . In at least one example, the non-conductive material ring 338 may include an epoxy component 338 . As used herein, the term “epoxy” may include non-conductive adhesives as commonly used and understood in the art, including hot melt adhesives. The middle portion 336 can also include a ridge feature 340 that extends at least partially around an inner surface of the middle portion 336 . Raised feature 340 may form a lower surface of middle portion 336 . Additionally, as at least one example, intermediate portion 336 may include one or more upper protrusions 342 spaced apart from and extending inwardly relative to the outer surface of sidewall 328 . Additionally, at least one example of intermediate portion 336 can include one or more lower protrusions 344 spaced apart from and extending from intermediate portion 336 , as shown in FIG. 4 . 5A, 5B, and 5C illustrate partial cross-sectional views as indicated in FIG. 3 but around various points along sidewall 228 to illustrate the locations and configurations of middle portion 336, epoxy component 338, upper portion 332, and lower portion 334.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 4 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 4 alone or in any combination.

In the first cross-sectional view of FIG. 5A , raised feature 340 and lower protrusion 344 of middle portion 336 can be seen. In at least one example, epoxy component 338 is bonded to upper surface 348 defined by lower portion 334 of sidewall 328 . The epoxy component 338 may also be bonded directly to the middle portion 336, including, for example, the bottom protrusion 344 and the bottom surface 346 of the middle portion 336 defined by the raised feature 340. 5B illustrates another cross-sectional view at a point along sidewall 328 where upper projection 342 and lower projection 344 of middle portion 336 can be seen, and FIG. 5C illustrates another cross-sectional view at a point along sidewall 328 where upper projection 342 of middle portion 336 can be seen.

As shown in FIGS. 5A, 5B, and 5C, any possible path for moisture to travel from the external environment 350 to the internal volume 352 through the sidewall 328 of the device is blocked by an epoxy component 338 bonded directly to either the middle portion 336 or the lower portion 334 of the sidewall 328. Thus, the tight bonding of the epoxy component 338 to one or more parts 334, 336 prevents water and moisture from entering the interior volume 352 from the external environment 350 through the sidewall 328. In addition to the moisture-tight bond between the epoxy component 338 and the sidewall 328, in at least one example, a middle portion 336 of the sidewall 328 may be bonded to upper and lower portions 332 and 334, respectively, such that the bond therebetween substantially prevents moisture from being transferred through or into the sidewall 328 at an interface between the middle portion 336 and the upper and lower portions 332, 334, respectively. to or completely prevent 6-8 illustrate interfaces and methods for bonding middle portion 336 to lower portion 334 and/or upper portion 332 of sidewall 328 .

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 5A-5C ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 5A-5C.

An example of a plastic-to-metal interface, such as the interface between the conductive bottom portion 434 and the non-conductive middle portion 436 is shown in FIG. 6 . In at least one example, the bottom portion 434 can include titanium and the middle portion 436 can include a polymeric material. In one example, the polymeric material may include PBT, including glass-filled polybutylene terephthalate (PBT). As shown, the titanium material of the bottom portion 434 may be treated to form an enhanced polymer-Ti bond at the interface.

In at least one example, there may be surface features including nano-pores and protrusions 454, and polymer may flow into and around the pores and protrusions during formation, increasing bonding between them. In at least one example, an etch process may be performed to form features 454 shown in FIG. 6 . In at least one example, the etching process may include etching with sulfuric acid to form rough macro-pockets or features in the titanium substrate of the bottom portion 434 . An oxide layer may also be formed using a sodium hydroxide oxidation step resulting in the nano-pores and protrusions 454 shown in FIG. 6 .

In this context, FIGS. 7A-7C show images of bottom portion 434 at various stages of the process described above, including a 1,000× SEM image of the acid etched surface in FIG. 7A . Figure 7b shows a 50,000x SEM image of an oxide surface with uniform oxide formation showing a plate-like morphology. FIG. 7C shows a layered double hydroxide interface comprising protrusions 454 similar to those illustrated in FIG. 6 , as described above, where the plastic polymer material of the middle portion 436 can flow into and around the interface and can be interlocked with the metal material of the bottom portion 434 for improved bonding.

8 shows a flow diagram of one example of a method 460 of forming the interface shown in FIGS. 6-7C. In at least one example, step 456 includes the above mentioned sulfuric acid etching step, and another step 458 includes the above mentioned sodium hydroxide oxidation step. In at least one example of method 460, between steps 456 and 458, a de-smutting method 462 may be performed to de-smut the surface. In at least one example of de-smutting method 462 shown in FIG. 8 , step 464 may include alkaline de-smutting, e.g., using sodium hydroxide (NaOH), and another step 466 may include an acidic de-smutting step, e.g., using nitric acid (HNO3).

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 6-8) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIGS. 6-8.

9A-9C are cross-sectional views of device 500 similar to FIGS. 5A-5C , but with display assembly 506 disposed in opening 532 formed by sidewall 528 . In at least one example, a display assembly 506 that includes a display cover 522 and one or more other display layers 524 disposed below the display cover 522 can be disposed in the opening 532 such that a gap 568 is formed between the display assembly 506 and the sidewall 528. Gap 568 can be understood as the space between display assembly 506, or display cover 522 thereof, and sidewall 528, or upper portion 532 thereof, where display cover 522 does not contact sidewall 528. In at least one example, the top surface of the display cover 522 can be flush with or lower than the top surface of the top portion 532 .

In at least one example, a cavity 570 is formed in which the wave ring 526 is disposed. The cavity may be defined by a sidewall 528 including an upper portion 532 and a middle portion 536 , an epoxy component 538 , and a display assembly 506 or at least a display cover 522 thereof. In at least one example, the cavity may also be defined by an insulating material 576 disposed between the display assembly 506 and/or its display cover 522 and the epoxy component 538 . One or more other components include the first (or last) antenna layer 578 or other layers. As noted above, the epoxy component 538 includes the first antenna layer 578, the middle portion 536, the lower portion 534, and/or the insulating material 576 to prevent moisture from entering the interior volume 552 from the external environment 550 of the device 500 so that any moisture or fluids entering the cavity 570 through the gap 568 do not continue into the interior volume 552. Can be bonded to other layers and components. In this way, the cavity can be fluid-tight.

9A, 9B, and 9C illustrate how a wave ring 526 disposed in cavity 570, as shown in FIG. 9B, may contact upper portion 532 of sidewall 528 at one or more locations along the length of wave ring 526, and electrical contact on the other side of cavity 570 at one or more other locations along the length of wave ring 526, as shown in FIG. 9C. Cross-sectional views are shown at various locations around sidewall 528 to illustrate how portion 572 may be contacted.

Thus, in at least one example of the present disclosure, the housing sidewall 528 can define an opening 532, and a display component, such as a display cover 522, can be disposed in the opening 532 to form a gap 568 between the housing sidewall 528 and the display component. In at least one example, cavity 570 is bounded by sidewall 528 and display cover 522 , and cavity 570 is in fluid communication with external environment 550 through gap 568 . In at least one example, the epoxy component 538 at least partially defines the cavity 570 and may directly contact the housing sidewall 528 .

In at least one example of the electronic device 500, the housing sidewall 528 has an upper sidewall portion 532 and a lower sidewall portion 534 each bonded to a middle sidewall portion 536 disposed between the upper sidewall portion 532 and the lower sidewall portion 534. The housing can define an opening 532 , and the display assembly 506 can be disposed in the opening 532 to form a gap 568 between the housing and the display assembly 506 . Further, in at least one example, the epoxy component 538 can serve as a seal disposed under the display assembly 506, and the epoxy component seal 538 can extend laterally across the gap 568 while being directly bonded to the middle portion 536 of the sidewall 528.

In at least one example of the present disclosure, electronic device 500 can include sidewall 528 defining interior volume 552 and opening 532 . In at least one example, sidewall 528 can include an upper portion 532, a lower portion 534, and an intermediate portion 536 disposed between and bonded to upper portion 532 and lower portion 534. Device 500 also includes display cover 522 disposed in opening 532 and defining interior volume 552, side cavity 570 defined by display assembly 506 and sidewall 528, cavity 570 being in fluid communication with external environment 550 via gap 568 formed between display assembly 506 and sidewall 528, and lower portion 534 ) and an epoxy layer 538 that contacts intermediate portion 536 and at least partially defines cavity 570 .

As noted above and as shown in FIGS. 9A-9C , device 500 may include an epoxy component 538 disposed at least partially between display cover 522 and lower portion 534 of display assembly 506, or between lower portion 534 and one or more other components of display assembly 506, including display layers 524. One or more other components may also be disposed or stacked between the epoxy component 538 and the display assembly 506 or cover 522 , for example the first antenna layer 578 . Additionally, as shown in FIG. 9C , one or more examples of device 500 can include insulating material 576 . Insulating polymer 576 may include and support a printed circuit board (PCB) 574 disposed in interior volume 552 .

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 9A-9C ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 9A-9C.

As noted above, FIGS. 9A, 9B, and 9C show cross-sectional views at various locations around the sidewall 528 to illustrate how the wave ring 526 disposed in the cavity 570 may contact the upper portion 532 of the sidewall 528 at one or more locations along the length of the wave ring 526, as shown in FIG. 9B. Accordingly, in at least one example, middle portion 536 may include gaps or windows that allow columns or other portions of upper portion 532 of sidewall 528 to be exposed through middle portion 536 so that wave ring 526 may directly contact upper portion 532, as shown in FIG. 9B. Wave ring 526 may also make contact with electrical contact 572 on the other side of cavity 570 at one or more other locations along the length of wave ring 526, as shown in FIG. 9C. Electrical contacts 572 may extend through insulating material 576 and electrically connect to PCB 574 . In this way, upper portion 532 of sidewall 528 may be electrically connected to PCB 574 through wave ring 526 . Although contact between wave ring 526 and electrical contact 572 is shown in FIGS. 9A-9C (as well as FIGS. 12 and 13 below) as resulting from an undulation or circumferential fluctuation (or wave) in wave ring 526, the electrical contacts may be by any number of discrete or continuous geometries, such as indentations or protrusions on wave ring 526 or discrete or continuous protrusions on the housing. can be done by According to this example, any number of mating geometries may be used between the wave ring 526 and the housing.

In at least one example, upper portion 532 of sidewall 528 may be electrically isolated from lower portion 534 via intermediate and non-conductive intermediate portion 536 . In this way, upper portion 532 may be a resonant element of an antenna of device 500 having lower portion 534 of sidewall 528 acting as an electrical ground plane to the resonant plane of upper portion 532 . As noted above, upper portion 532 can be electrically connected to PCB 574 of device 500, such that signals received and transmitted by resonant upper portion 532 can be directed to PCB 574 and processed using one or more processors or other electronic components of device 500, including any processors or other electronic components mounted on the PCB.

The wearable electronic devices described herein may include antennas configured to transmit and receive electromagnetic signals during use. Incorporating effective antennas into small compact devices, such as wearable electronic watches, can be difficult because, among other factors, the greater the distance between the resonance plane of an antenna and the ground plane, the better the performance of the antenna will be. However, space is often limited to create the required Z-distances needed in compact wearable electronic devices. In the devices described herein, the housing and sidewalls of the device can be electrically separated into multiple parts to create a sufficient separation (Z-distance) between them, the resonating elements and ground elements of the antenna relative to the housing itself to act as an antenna. However, this design has its own challenges, including electrically connecting the resonating element to a PCB, processor, or other electronic device without reducing the Z-distance of the antenna. The wearable electronic devices described herein are configured to overcome these problems.

In this context, FIGS. 10A and 10B show top perspective and plan views, respectively, of a subassembly of a device 600, in accordance with the present disclosure. The subassembly includes a housing sidewall 628 that includes an upper portion 632 , a lower portion 634 , and an intermediate portion 636 separating the upper portion 632 from the lower portion 634 . As noted above, upper portion 632 and lower portion 632 may include electrically conductive material, and middle portion 636 may include electrically insulating or non-conductive material, such that upper portion 632 of sidewall 628 forms resonant elements of an antenna that are separated by a vertical or “Z” directional distance (or “Z-distance”) relative to the electrical ground plane of lower portion 634.

Epoxy component 638 may also be bonded to the interior of sidewall 628 and to middle portion 636 and lower portion 634 . Additionally, a wave ring 626 is also shown in 10a. To illustrate a portion of the wave ring 626 extending away from the sidewall 628 to make contact with electrical contacts within the internal volume of the device, an enlarged view of the subassembly from a plan view is shown in FIG. 10C, with enlarged regions indicated in FIG. 10B. As shown in FIG. 10B , the inner portion of wave ring 626 includes a number of dimples or protrusions 640 configured to engage electrical contacts 572 that extend through insulating material 576 (as shown in FIG. 9C ) and may be electrically connected to PCB 574. As noted above, additionally or alternatively to protrusions 640 on wave ring 626, protrusions may be formed on the housing to facilitate or ensure a secure connection between wave ring 626 and electrical contacts 572.

10A also illustrates a cutout 650 formed in the inner surface of housing sidewall 628 . As shown, cutout 650 extends into housing sidewall 628 under middle portion 636 and epoxy portion 638 . According to one example, cutout 650 is formed by machining or otherwise removing slots in housing sidewall 628 to create a cavity on an upper portion of the interior volume prior to assembly of device 600 . As shown, cutout 650 provides additional volume within housing sidewall 628 that can be used for connections or other housings. According to one example, the cutout provides an isolated volume within which component connections can be made, such as for microphones or pressure sensors typically located near the exterior of device 600, without consuming valuable internal volume. In one example, board-to-board connections, such as hot-bar soldering, can be performed on the main PCB in the main cavity, and then a flexible cable can extend from the main PCT to a cutout 650 formed in the inner surface of the housing sidewall 628. Within cutout 650, according to one example, tray 652, which may be fastened to a housing, may include a circuit board 654 having any number of components 656, such as connectors, components, gyroscopes, accelerometers, etc., which may then be connected to a PCB via a flexible cable. According to this example, diversion of multiple connections to previously unused portions of housing sidewall 628 allows for additional battery volume on the main PCB or added room within the housing for inclusion of additional connectors or features.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 10A-10C ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 10A-10C.

FIG. 11 shows another cross-sectional view similar to the cross-sectional views shown in FIGS. 9A-9C , wherein sidewall 728 includes an upper portion 732 , a middle portion 736 , and a lower portion 734 . Sidewall 728 defines an opening 732 in which display assembly 706 is disposed, which includes display cover 722 and one or more other display layers or components 724 . Epoxy component 738 may contact lower portion 734 and middle portion 736 as shown, and one or more other layers or components may be laminated or disposed between display cover 722 and epoxy component 738, e.g., first antenna layer 772 and insulating material 776. In at least one example, insulating material 776, which may also be referred to herein as mounting component 776, can structurally support one or more other components, including electrical contacts 772 extending therethrough and/or display cover 722 or other components 724 of display assembly 706.

In at least one example, the display mounting component 776 can be formed from a molded material, such as a molded insulating material comprising a polymer (eg, a low-injection-pressure-overmolded polymer). The material forming component 776 may be epoxy, polyurethane, and/or other polymeric materials. Thermoplastic and/or thermoset polymers may be used to form component 776 . Heat and/or light (eg, ultraviolet light) may be used to cure the polymer forming component 776 . As an illustrative example, component 776 may be formed from a thermoset structural adhesive, such as a one-part heat set epoxy. If desired, other polymer(s) may be used. A vacuum may be applied to the inside of the mold to help draw the liquid polymer into a desired shape within the mold during formation of component 776 .

One or more surfaces of component 776 can serve as a reference surface (reference) that helps establish a desired physical relationship between component 776 and other parts of a device that includes display assembly 706 . As one example, component 776 can be attached to the opposite surface of the housing using a layer of adhesive. The shape and position of component 776 relative to display cover layer 722, display layers 724, and other structures within display 706 can help establish a desired location for display 706 relative to the device housing. The top surface of component 776 can be molded directly to the underside of display cover 722 to help form an environmental seal. However, in some examples, the display assembly 706 can include a separate seal that can help form an environmental seal between the display assembly 706 and the housing.

The location of the display mounting components is indicated in FIGS. 11 and 12 . As can be seen, display mounting component 776 extends around the periphery of PCB 774 . Since PCB 774 is smaller than display cover 722 , the molded insulating material of display mounting component 776 can abut the edge of PCB 774 .

However, in some examples, display assembly 706 for an electronic device may include PCB 774 having one or more major dimensions substantially similar to corresponding major dimensions of display cover 722 or other components 724 of display assembly 706, such as width and/or height. By using a PCB 774 with these dimensional relationships, the tail of the display layer 724 can be made coplanar with a major surface of the PCB 774 so that only a single block is required during a molding operation that can be used to form a display mount component. Thus, the molded insulating material of the display mounting component 776 can be disposed on and adjacent to the periphery of the major surface of the PCB 774 while also at least partially surrounding the flexible tail of the associated display layers 724.

In this example, the molded material of the display mounting component 776 can also serve to attach the display assembly 706 to the device housing sidewall 728 or to a component of the sidewall 728, such as at least the lower portion 734, and/or to provide an environmental seal between the display cover 722 and the device housing sidewall 728. In some examples, display mounting component 776 can at least partially define an outer surface of the device, such as at an upper surface of upper portion 732 . Thus, in some examples, a portion of the insulatively molded material of the display mounting component 776 that defines the outer surface of the device can be located between the display cover 722 and the sidewall 728 of the housing. Additionally, in some examples, a portion of an external surface defined by display mounting component 776 may be substantially co-level, aligned with, and/or coplanar with a portion of an external surface defined by housing sidewall 728 and/or display cover 722.

As noted above, to electrically connect upper portion 732 of sidewall 728, as a resonant element of the antenna, electrical connector 772 may extend through insulating material 776 from wave ring 726 to PCB 774, similar to that shown in FIG. 32) can be contacted. In this way, while the PCB 774 is positioned lower than the upper portion 732 of the sidewall 728, the upper portion 732 of the sidewall 728 may primarily define an upper resonant plane that is separated from the ground plane defined by the lower portion 734 of the sidewall 728. This increased Z-distance between the upper and lower portions 732, 734 of the sidewall 728 correspondingly increases the performance of the antenna, with the upper portion 732 of the antenna forming part, or at least part of, a resonating element of the antenna.

As illustrated in FIG. 11 , wavering 726 can vary in profile. According to one example, wave ring 726 is asymmetric in shape, placing the protrusion or dimple lower on the body so that it provides better contact with elongated feature 784 of electrical connector 772 . In other words, due to the asymmetrical profile of the wave ring 726, the dimple or protrusion can sit lower in the channel formed by the sidewall 728 and make a more secure connection to the lower profile elongated feature 784. Additionally, as shown in FIG. 11 , wave ring 726 can include any number of optional back dimples 727 that extend toward wave ring 726 and toward extension feature 784 to ensure consistent contact therewith as well as facilitate contact with the housing. Alternatively or additionally, sidewall 728 can have optional protrusions or bump-outs 729 that reduce the distance between wave ring 726 and elongated feature 784, ensuring a secure contact. Such added connection fixation features may be particularly beneficial at the corners of sidewall 728 where antenna feeds may be located.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIG. 11 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 11 alone or in any combination.

12 shows a top view of a subassembly of a device according to the present disclosure that includes a wave ring 826, insulating material 876, electrical contacts 872, and a PCB 874, which may be similar to or part of any of the devices, systems, or subassemblies described herein with reference to the other figures. 12, portions of the wave ring 826 may optionally be overmolded 827 or otherwise insulated in areas where metal on metal contact with the housing is not desired, e.g., plastic-to-metal housing interlocks may occur. In the illustrated example of FIG. 12 , the electrical contacts 872 form a single integral piece that extends around the PCB 874, and the discrete connection points 882 extend onto and contact the PCB 882 or electrical circuits/paths or other components on or on the PCB 882.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 12 ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 12 alone or in any combination.

FIG. 13 shows another example of a top view of a subassembly similar to that shown in FIG. 12 , but having multiple separate and separate electrical connectors 972a, 972b, 972c in contact with a PCB 974. Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 13 ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 13 alone or in any combination.

In at least one example, the electronic device can include a sidewall 728 that includes an antenna 732, the sidewall defining an interior volume. The device can also include a PCB 774 disposed in the interior volume, insulating material 776 disposed in the interior volume, and an electrical connector 772 in contact with the PCB 774, the electrical connector 772 extending through the insulating material 776 and forming electrical contact between the antenna 732 and the PCB 774.

In one example, the device may include a conductive housing sidewall 728 defining an interior volume, a PCB 774 disposed in the interior volume, an electrical connector 772 in contact with the PCB 774 and extending through an insulating material 776, and an elongate conductive member 726 (also referred to herein as a wave ring 726) disposed between the housing sidewall 728 and the electrical connector 772, the elongate conductive member ( 726 contacts electrical connector 772 and housing sidewall 728 .

In one example, the electronic device includes a housing sidewall 728 that includes a lower portion 734 and an electrically conductive upper portion 732 separated from the lower portion 734 by a non-conductive material 736, the housing sidewall 728 defining an interior volume and an opening 732, a display component 722 disposed in the opening 732, and a PCB 7 disposed in the interior volume below the display component 722. 74), an insulating material 776 disposed in the interior volume between the housing sidewall 728 and the PCB 774, and a connector 772 forming an electrical path between the upper conductive portion 732 of the sidewall 728 and the PCB 774. In such an example, upper portion 732 can form a ring around the periphery of display component 722 .

In at least one example, insulating material 776 is molded into electrical connector 772 . In one example, as shown in FIG. 12 , insulating material 776 may include a continuous member that extends around the periphery of PCB 774 . Similarly, in at least one example, insulating material 776 may form or include a closed ring disposed between PCB 774 and antenna 732 formed by upper portion 732 of sidewall 728 . In one example, the elongate conductive member 726 contacts the electrical connector 772 at a first location along the length of the elongate conductive member 726 and contacts the housing sidewall 728 at a second location along the length of the elongate conductive member 726. In at least one example, elongate conductive member 726 contacts electrical connector 772 at a third location along the length of elongate conductive member 726 and contacts housing sidewall 728 at a fourth location along the length of elongate conductive member 772.

In at least one example, electrical connector 772 includes a continuous member 886 shown in FIG. 12 having one or more discrete extension features 784 extending from the continuous member 886 through insulating material 776 as shown in FIG. 11 . Extension features 784 extend through insulating material 776 to contact wave ring 726 (or “elongated conductive member”), as shown in FIG. 11 .

As mentioned above, and referring now to FIG. 14A , an increased Z-distance between the upper portion 1032 as a resonating element of the antenna relative to the electrical ground plane of the lower portion 1034 of the sidewall 1028 can increase the performance of the antenna. To increase the Z-distance, the display cover 1022 of the device may include a lower sloped surface to make room for the electrical connector 1072 to extend upwards further when in contact with the wave ring 1026, thus increasing the overall plane of the resonating element of the antenna above the ground plane of the lower portion 1034 of the housing.

For example, as shown in FIG. 14A , the display cover 1022 includes an electrical connector 1072 for making electrical connections with the wave ring 1026 and thus a lower sloped surface 1084 that provides space for the upper portion 1032 of the sidewall 1028 in contact with the wave ring 1026, further upward to increase the Z-distance. The Z-distance between resonance plane 1088 and ground plane 1090 is illustrated in FIG. 14B. As shown in FIG. 14A , the electrical connectors 1072 extend upward toward the display cover 1022 into a space that would otherwise be occupied by the display cover 1022 if not to the sloped surface 1084 .

Wave ring 1026 can likewise be raised to a level of contact with electrical connector 1072 shown in FIG. In this way, the Z-distance shown in FIG. 14B can be maximized to increase the average height/level of the resonant plane relative to the ground plane for improved antenna performance.

In at least one example, insulating material 1076, referred to elsewhere herein as a display mounting component, can extend into the space adjacent the sloped surface of display cover 1022 to support the display cover and other components of display assembly 1006, including the various display layers 1024 shown. Additionally, in at least one example, a mask layer, which may include a PVD layer, an ink layer, or other masking layer, may be disposed on the lower flat surface 1086 of the display cover 1022 adjacent the sloped surface 1085. The mask can provide an aesthetic feature that reduces unwanted light scattering and reflections at the transition between the lower surface of the display cover 1022 and the sloped surface 1084 . In at least one example, the mask may be between about 50 microns and 150 microns thick, such as about 100 microns thick.

Thus, in at least one example, an electronic device described herein may include a display component, such as a sidewall 1028 defining an opening, and a display cover 1022 disposed in the opening. Display cover 1022 can include a lower sloped edge that forms a sloped surface facing the interior volume of the device. In such an example, insulating material 1076 may contact a sloped surface of display cover 1022 forming sloped boundary 1078 as shown in FIG. 14A .

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 14A and 14B ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 14A and 14B.

Referring briefly back to the exploded view of the device shown in FIG. 2 , at least one example of the device 200 can include a back cover 214 and an electromagnetically transparent component 216 .

Because wearable electronic devices come into contact with a user's body during use, it can be advantageous to use the device to detect a user's body temperature, including surface and core temperatures. However, since the temperature of the device and the environment in which the device is used may change moment by moment during use, it may be difficult to detect the user's core temperature using the wearable device. However, the devices described herein can overcome this problem by incorporating more than one temperature sensor into the device at different locations and applying one or more algorithms that include as input the temperature sensed by each sensor to determine the user's core temperature.

15A illustrates an example of a device, eg a wearable electronic watch device 1700 . In at least one example, an electronic device 1700 can include a housing 1702 defining front and rear openings, with a display component 1706 disposed in the front opening and a rear cover 1714 disposed in the rear opening. Device 1700 of FIG. 15A can also include strap retention features 1779 defined by housing 1702 to secure the strap to device 1700 . When the strap is connected to device 1700 via strap retention features 1779, device 1700 can be configured to be worn by the user, e.g., on the user's wrist, and the strap secures back cover 1714 against the user's skin.

In such an example, device 1700 may be configured to detect the user's wrist or skin temperature and to extrapolate or detect/measure the user's core temperature. To do this, in at least one example, device 1700 may include two or more temperature sensors on or within device 1700 . For example, the first temperature sensor 1777 can be located on, near, or adjacent to the rear cover 1714, also referred to as the bottom or bottom side of the device 1700, as indicated by the bottom dot shown in FIG. 15A. The dot indicates the approximate location of the first temperature sensor 1777, not a representation of the sensor itself. Additionally, device 1700 can include a second temperature sensor 1775 positioned at, near, or adjacent to display component 1706 on the side opposite from the first temperature sensor, also referred to as the top side of device 1700.

In at least one example, a processor (not shown in FIG. 15A but disposed inside device 1700) can be electrically coupled to first temperature sensor 1777 and second temperature sensor 1775 and configured to determine a core temperature of the user based on the first temperature detected by first temperature sensor 1777 and the second temperature detected by second temperature sensor 1775.

FIG. 15A shows a partial cross-sectional view of device 1700 shown in FIG. 15A to illustrate various internal components of the device 1700 . As shown, device 1700 can include a housing 1702 defining front and rear openings and an interior volume, with display component 1706 disposed in the front opening and rear cover 1714 disposed in the rear opening. Internal components may include various processors, batteries, microphones, speakers, wires and electrical flexes, antennas, display components, and the like. Additionally, internal components of the device 1700 can include a first PCB 1773 disposed near, adjacent to, and over the back cover 1714 . In at least one example, first PCB 1773 may be glued to rear cover 1714 . Device 1700 can also include a second PCB 1774 disposed near, adjacent to, and under display component 1706 .

As shown in the cross-sectional view of FIG. 15B , the first temperature sensor 1777 may be disposed on the first PCB 1773, and the second temperature sensor 1775 may be disposed on the second PCB 1774. In at least one example, one or more other electronic components, including heat-generating electronic components, may be disposed between first temperature sensor 1777 and second temperature sensor 1775, or, if not between temperature sensors 1777 and 1775, from one temperature sensor to another temperature sensor, through one or more internal components of device 1700. For example, battery 1767 can be disposed at least partially within the interior volume of device 1700 between first temperature sensor 1777 and second temperature sensor 1775 .

Although first temperature sensor 1777 can be located at or near the user's wrist to determine the temperature at or near the user's wrist, device 1700 can include other internal components that can generate or absorb heat so that the system temperature of device 1700 can affect the accuracy of measurements of the user's wrist with first temperature sensor 1777. Thus, in at least some examples, device 1700 can include a second temperature sensor 1775 that takes into account the system temperature of device 1700, and one or more algorithms can be used to determine the user's core temperature using measurements taken from both first temperature sensor 1777 and second temperature sensor 1775. In at least one example, the first temperature sensor 1777 and the second temperature sensor can be in electrical communication with each other.

In at least one example, device 1700 can include one or more processors in electrical communication with first temperature sensor 1777 and second temperature sensor 1775 . One or more processors may determine a user's core temperature from measurements taken by both first and second temperature sensors 1777, 1775, one or more algorithms applied to the measurement to account for system temperature, any thermal path that exists through device 1700 and its internal components disposed therein, some of which internal components may be disposed between first and second temperature sensors 1777, 1775, or temperature sensors If not between 1777 and 1775 , then from one temperature sensor to another temperature sensor may be placed on a portion of a defined thermal path through one or more internal components of device 1700 . In this way, determining the user's core temperature may be based at least in part on heat generated by heat generating components or heat absorbing components or any other components disposed in the internal volume of device 1700 .

In this context, FIG. 15C illustrates a circuit diagram equivalent to a device 1700 that contacts a user 1771 with the contact interface shown at 1769 . The illustrated diagram identifies temperature sensors T 1 and T ₂ , which may be identical to the first and second temperature sensors ₁₇₇₇ and 1775 shown in FIG. 15B , respectively. 사용자(1771)로부터 디바이스(1700)를 통한 외부 환경 밖으로의 열 전달 경로는 도 15c에 도시된 바와 같이 저항기들(R _phys , R _contact- , R _BC , R _1-2 , R _FC )에 의해 예시된 일련의 저항들로서 모델링될 수 있으며, R _phys 는 사용자의 저항과 동일하고, R _contact 는 접촉 계면에서의 저항과 동일하고, R _BC 는 온도(T ₁ )를 측정하는 제1 온도 센서(T ₁ )(도 15b의 1777)와 접촉 계면(1769) 사이에서의 디바이스(1700)의 후면 커버 또는 임의의 다른 컴포넌트들의 저항과 동일하고, R _1-2 는 제1 온도 센서(1777)와 제2 온도 센서(1775) 사이의 열적 경로를 포함하는 디바이스(1700)의 시스템의 임의의 저항과 동일하고, R _FC 는 온도(T ₂ )를 측정하는 제2 온도 센서(도 15b의 1775)와 디바이스(1700)의 외부 표면 또는 외부 환경 사이에서의 디바이스(1700)의 디스플레이 컴포넌트(1706) 또는 임의의 다른 컴포넌트들의 저항과 동일하다.

Using a modeled circuit diagram of heat flow from the wrist through device 1700 as shown in FIG. 15C , one or more algorithms may be used to determine a user's core temperature. For example, a first algorithm to model the temperature T _BC of the back cover 1714 of the device 1700 may include:

T _BC = T ₁ + a _o (T ₁ − T ₂ )

here:

a _o = R _BC / R _1-2

Algorithms that model the calibrated temperature may include:

T _c = T ₁ + c _o (T ₁ − T ₂ )

here:

c _o = a _o + h _o

and here:

h _o = R _o / R _1-2

Moreover, the model may also include self-heating constants (ie c ₁ , a ₁ , h ₁ ).

In at least one example, more than two temperature sensors may be placed in device 1700, and when device 1700 contacts the user, a measurement is taken and input into one or more algorithms to determine the user's core temperature. As noted above, in at least one example, one or more electrical and/or heat generating components may be disposed in an internal volume of device 1700 and at least partially between various sensors, or at least as part of a thermal path between various sensors.

In at least one example, the first temperature sensor 1777 can be placed directly against or adhered directly to the rear cover 1714 or other portion of the housing 1702 that is near or adjacent to or in contact with the user during use. Similarly, in at least one example, the second temperature sensor 1775 can be placed directly against or adhered directly to the display component 1706 or another portion of the housing 1702 . In at least one example, regardless of where each temperature sensor 1777, 1775 is placed, a thermally conductive adhesive, such as a thermally conductive pressure sensitive adhesive, may be used to secure the temperature sensors 1777, 1775 to another component within the internal volume of the device 1700.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 15A-15C ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 15A-15C.

16 illustrates a PCB 1773 with an example of the location of a temperature sensor 1777. A PCB 1773 may be disposed near the rear cover 1714 similarly to the first PCB 1773 shown in FIG. 15B. 26 illustrates a PCB 1774 similar to the second PCB shown in FIG. 15B that may be placed in the interior volume of device 1700 proximate display component 1706 . In the illustrated example of FIG. 17 , two locations of a temperature sensor 1775 are shown that can be placed on a PCB 1774 such that the temperature sensor 1775 is at or near the display component 1706 of the device 1700. In the illustrated example, temperature sensor 1775 may be disposed on ALS module 1765. 18 shows another example of locations for temperature sensor 1775 on an example of PCB 1774, one example location of temperature sensor 1775 is on ALS module 1765 of PCB 1774.

In at least one example, the temperature sensors 1777, 1775 described herein may be glued or otherwise secured to a PCB or other component comprising the housing 1702 of the device 1700 without any under-fill material between the temperature sensors 1777, 1775 and the housing 1702 or PCB 1774. In at least one example, temperature sensors 1777 and 1775 can be mounted to PCB 1774, housing 1702, or other part of device 1700 without any encapsulation over temperature sensors 1777 and 1775. The absence of underfill material and/or encapsulation over the temperature sensors 1777 and 1775 reduces the complexity and uncertainty of the thermal pathways between the sensors 1777 and 1775 and/or between the sensors 1777 and 1775 and the user's body or the external environment, thus simplifying modeling and processing of the user's core temperature.

In at least one example, as shown in FIG. 19 , temperature sensor 1777 is disposed on ALS module 1765 . In at least one example, as noted above, temperature sensor 1777 may be placed over temperature sensor 1777 and/or adhered to ALS module 1765 using SMT/solder or other adhesive or bonding medium without any encapsulating material encapsulating it. In such an example, to protect the temperature sensor 1777 from physical damage, one or more shields 1767a, 1767b, 1767c, 1767d can be placed around the temperature sensor 1777 such that other components are likely to come into contact with the shields 1767a-d before they come into contact with the temperature sensor 1777 during assembly or use. Shields 1767a - 1767d may vary in number, size, location, and configuration, but generally shields 1767a - 1767d are taller than temperature sensor 1777 to physically protect temperature sensor 1777. In at least one example, shields 1767a-1767d include inexpensive, non-electrically functional or connected components. In this way, shields 1767a - 1767d may absorb contact, be crushed, crushed, or otherwise physically damaged during assembly or use of device 1700 without adversely affecting the functionality of device 1700 and temperature sensor 1777.

In many scenarios or environments in which a user may wish to wear the devices disclosed herein, it may be advantageous to output high frequency, high decibel sounds to alert other users of an emergency, such as a user's fall or injury. These sounds or alerts may be referred to herein as siren alerts and/or sounds. At least one example of a device may include a dual speaker system as shown in FIGS. The speaker assemblies shown herein generally include two speakers that share a front volume but have separate rear volumes associated with each speaker. In addition to separate rear volumes, separate vents to the outside environment may allow tuning of the speaker assembly to produce distinct frequencies in various high and low ranges from the various speakers within the device 1800 shown.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 16-19 ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIGS. 16-19.

20A shows an outer housing 1802 defining an inner volume 1852, a first speaker 1863 and a second speaker 1861 disposed in the inner volume 1852, the first speaker 1863 including a frame 1859 disposed around the periphery of the diaphragm 1857 of the first speaker 1863, the outer housing, the first speaker 1863 ), and a front volume 1855 defined by the second speaker 1861, a first rear volume 1853 defined by the first speaker 1863 and frame 1859, and a second rear volume 1845 defined by second speaker 1861 and frame 1859.

In at least one example, the electronic device 1800 can include an outer housing 1802, an inner housing 1851 spaced apart from the outer housing 1802, and a speaker assembly disposed between the inner and outer housings 1802 and 1851. The speaker assembly may include a first speaker 1863 , a second speaker 1861 , and a speaker frame 1859 supporting the first speaker 1863 . The device can further include a first rear volume 1853 defined by an inner housing 1851 and a first speaker 1863, and a second rear volume 1845 defined by an inner housing 1851 and a second speaker 1861, the second rear volume 1845 being separated from the first rear volume 1853 by a speaker frame 1859.

Another example of an electronic device 1800 can include a speaker assembly disposed between inner and outer housings 1851, 1802 including an outer housing 1802, an inner housing 1851, a first speaker 1863 and a second speaker 1861. Device 1800 can also include a front volume 1855 defined by outer housing 1802 and speaker assembly, and a rear volume defined by inner housing and speaker assembly and separated into first and second isolated portions 1853, 1845, respectively. In at least one example, device 1800 can also include a first vent 1849 defined by housing 1802 that brings a first end of front volume 1855 into fluid communication with an external environment, and a second vent 1847 defined by housing 1802 that brings a second end of front volume 1855 into fluid communication with an external environment.

In at least one example, anterior volume 1855 can be isolated from first and second posterior volumes 1853 and 1845, respectively. The speakers 1863 and 1861 can be disposed between the front volume 1855 and the first and second rear volumes 1853 and 1845, and the frame 1859 can structurally support the first speaker 1863. In at least one example, frame 1859 forms an airtight seal between first rear volume 1853 and second rear volume 1845 . Additionally, as noted above, inner housing 1851 can at least partially define first rear volume 1853 . For example, frame 1859 can include a collar 1843 and a molded seal 1841, which extends from collar 1843 toward interior volume 1852 and contacts inner housing 1851, sealing first rear volume 1853 as shown behind/below first speaker 1863. Collar 1843 can include a metal ring disposed around speaker 1863 and configured to redirect magnetic flux around speaker 1863 . In at least one example, speaker frame 1859 structurally supports second speaker 1861 .

In one example, the first speaker 1863 is smaller than the second speaker 1861 . The first speaker 1863 may be referred to as a tweeter and may be configured to output higher frequency sound waves than the larger second speaker 1861 . Thus, to accommodate the smaller volume air displacement caused by the first speaker 1863, in at least one example, the first back volume 1853 can be smaller than the second back volume 1845.

In at least one example, as shown in FIGS. 20A and 20B , the electronic device 1800 can also include a valve 1839 disposed in the aperture defined by the inner housing 1851 to exhaust air from the first isolated portion 1853 of the rear volume to the interior volume 1852. In at least one example, pressure valve 1839 can be configured to equalize pressure between interior volume 1852 and back volume 1853 . In at least one example, the valve 1839 can include a mesh and a channel passing through and defined by the inner housing 1851 .

The shared front volume 1855 can be in fluid communication with the external environment through various vents through the outer housing 1802 . The location and configuration of each vent can be designed to accommodate the high siren-like frequencies output by the smaller tweeter speaker (first speaker 1863) and the lower frequencies output by the second speaker 1861. In this way, a wider range of frequencies can be clearly and effectively output by the speaker assembly.

In at least one example, first vent 1849 is formed with a single aperture defined by outer housing 1802 . Second vent 1847 can include two or more apertures defined by outer housing 1802 . In at least one example, the distance between any two adjacent apertures of the second vent 1847 can be less than the distance between any aperture of the second vent 1847 and a single aperture of the first vent 1849.

As mentioned above, the arrangement and configuration of the speaker assembly of the electronic device 1800 shown in FIGS. 20A and 20B is capable of outputting loud high frequencies in the range of greater than 3 kHz, 3.5 kHz, or even greater than 4.5 kHz from a first, smaller speaker 1863 for use as a siren, as well as a normal range of frequencies for everyday use, including music, voice, and other typical audio outputs. do A siren may be used in conjunction with the fall-detection system of device 1800 to alert others if the user has fallen or suffered an injury. During other activities, for example during mountain biking, the siren may output warning signals when passing around a blind corner on a trail or the like. A guardian mode of device 1800 may activate a siren as an assault whistle or mugging deterrent.

To fit the dual speaker assembly within the airtight space between the inner housing 1851 and the outer housing 1802 of the device 1800, some of the components discussed above and shown in FIGS. For example, the speaker assembly shown in FIGS. 20A and 20B can be disposed within device 1800 generally at the same location as the buttons of the device, such that the button and speaker assembly share the same location or portion of the internal volume of device 1800. In such an example, the button may include one or more components disposed through or with one or more components of the speaker assembly.

To accommodate the speaker assembly and buttons together in the same area, as shown in FIG. 20C , the speaker frame 1859 may include an opening 1835 defined by the frame 1859 . The opening may be positioned to receive one or more components of the button passing through the frame 1859. 20D illustrates frame 1859 supporting first speaker 1863 and second speaker 1861 and defining opening 1835 . An opening 1835 may be defined/disposed between the first speaker 1863 and the second speaker 1861 . As shown in FIG. 20E , the button 1808 can include a plunger 1837 aligned with and/or extending through an opening 1835 between the first speaker 1863 and the second speaker 1861 .

In at least one example of electronic device 1800 , outer housing 1802 can define an interior volume 1852 and aperture 1833 as labeled in FIG. 20B . Button 1808 may be placed in aperture 1833 . Button 1808 can include a plunger 1837 that extends into or toward interior volume 1852 , and speaker frame 1859 can be disposed in interior volume 1852 and define an opening 1835 . In such instances, the plunger may extend through the opening.

In one example, the frame 1859 may structurally support the first speaker 1863 and the second speaker 1861 . A frame 1859 can be disposed in the interior volume 1852, and the frame 1859 defines an opening 1835 (otherwise referred to herein as a “hole”) between first and second speakers 1863 and 1861, respectively. In at least one example, plunger 1837 may be aligned with hole/opening 1835 . A portion of the inner volume 1852 between the inner housing 1851 spaced apart from the outer housing 1802 can define a speaker volume that includes a front volume 1855 and first and second rear volumes 1853 and 1845, respectively. Plunger 1837 may align with hole 1835 and extend into the speaker volume toward inner housing 1851 .

In at least one example, a speaker frame 1859 supports a first speaker 1863 and a second speaker 1861 , and an opening 1835 is defined between the first speaker 1863 and the second speaker 1861 . Thus, in at least one example, plunger 1837 extends between first speaker 1863 and second speaker 1861 . In at least one example, plunger 1837 can extend through anterior volume 1855 and into posterior volume 1845 .

To seal the front volume 1855 from the second rear volume 1845, the device 1800 can include a gasket 1825 that surrounds the plunger 1837 and forms a fluid-tight seal between the frame 1859 and the plunger 1837. Thus, a fluid-tight seal is formed by gasket 1825 between front volume 1855 and second back volume 1845. In at least one example, the gasket may include an O-ring disposed around the plunger 1837. The plunger 1837 can define a recess in which an O-ring can be placed and positioned between the plunger 1837 and the speaker frame 1859. The materials, size, and shape of the O-ring 1825 can be selected to prevent fluid from being contained in the volumes surrounding the speakers 1863 and 1861, and to tune the tactile sensation experienced by the user when pressing the button 1808.

Additionally, as the button is pressed down, the plunger may contact an electrical contact 1823 disposed on the inner housing, as shown at least in FIG. 20F. The plunger is aligned with the electrical contact 1823 such that when the button 1808 is pressed down during operation, an electrical path or circuit between the plunger 1837 and the electrical contact 1823 can be completed. Accordingly, the plunger may include or be formed of an electrically conductive material.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 20A-20F ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 20A-20F.

FIG. 20G illustrates a cross-sectional side view of a portion of device 1800 showing a viewing plane orthogonal to the cross-sectional viewing plane of FIG. 20F and extending through plunger 1837. 20G shows button 1808 and plunger 1837 extending through hole 1835 defined by speaker frame 1859 and electrical contact 1823, the lower surface of plunger 1837 making electrical contact when button 1808 is depressed, as shown to complete an electrical circuit between plunger 1837 and electrical contact 1823. Pressed or contacted against portion 1823. When button 1808 is not depressed, plunger 1837 and electrical contact 1823 are disconnected so that no electrical connection is made between them. Electrical contact 1823 may also be referred to herein as a "tactile switch" or "tac switch."

Tact switch 1823 may be electrically coupled to and/or physically contacted with an electrical flex 1804 disposed partially on a top surface of inner housing 1851 and extending between tack switch 1823 and inner housing 1851 and at least partially below tack switch 1823. The flex 1804 can extend around the edge of the inner housing 1851, as shown, and can continue under or on a lower surface opposite the top surface of the inner housing 1851. In one example, a bend formed in the flex 1804 as the flex rounds the edge of the inner housing 1851 from one surface to another can itself deflect a portion of the flex 1804 disposed between the tack switch 1823 and the inner housing 1851 away from the inner housing 1851.

To counteract this biasing force away from the inner housing 1851, the device 1800 can include a foot 1806 that presses downward onto the flex 1804 to hold the flex 1804 in position between the tack switch 1823 and the inner housing 1851, as shown in FIG. 20G. The foot 1806 may be a molded piece of plastic or other non-conductive material anchored to the speaker frame 1859, the inner housing 1851, or other component to create a force of the foot 1806 that presses the flex 1804 against the inner housing as shown. In at least one example, foot 1806 can also engage tack switch 1823 such that foot 1806 presses the tack switch against or against flex 1804 and/or inner housing 1851 . Additionally or alternatively, one or more adhesives or adhesive layers may be disposed between flex 1804 and inner housing 1851, between tack switch 1823 and flex 1804, and/or between tack switch 1823 and inner housing 1851 to hold flex 1804 and tack switch 1823 in place as shown in FIG. 20G.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 20G ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIG. 20G.

20H shows another example of a portion of a device 1800 that includes a button 1808 and a button spring 1810. In at least one example, button spring 1810 may include upwardly extending spring arms 1812 secured to button 1808 . Button spring 1810, and specifically spring arms 1812, can be formed from a conductive material, including metal, and shaped to provide an upward biasing force against button 1808. The button spring 1810 can include a lower portion 1814 anchored to a speaker housing 1859 or another component of the device 1800 (the button 1808 moves relative to them when pressed). In at least one example, the button spring 1810 provides a constant force to hold the top/outer surface of the button 1808 flush with the outer surface of the housing 1802 of the device 1800 (not shown in FIG. 20H, but shown in at least FIGS. 20A and 20B). The materials, shapes, lengths of spring arms 1814, and other factors of button spring 1810 can be tuned to change the tactile response of button 1808 when depressed by a user.

Referring briefly to FIG. 20A , an electrical ground path may be formed through one or more screws 1816 that contact a portion of housing 1802 when button 1808 is not depressed. Accordingly, screws 1816 and housing 1802 may be formed from electrically conductive materials. The screws 1816 can act as a stop feature or reference that contacts the inner surface of the housing 1802 to prevent the button 1808 from extending beyond the housing 1802 and maintaining the outer surface flush with the housing 1802. Referring again to FIG. 20H , when button 1808 is partially depressed, screws 1816 are disengaged from housing 1802, but plunger 1837, which is also in electrical communication with button 1808, is not yet in electrical contact with tack switch 1823.

As shown in FIG. 20I , in this partially depressed position of button 1808, button spring 1810 can form an electrical ground path between the button and a ground component or plane of device 1800. The button spring 1810 can form such a ground path with the button 1808 when the button 1808 is fully depressed to contact the plunger relative to the tack switch 1823, partially depressed as discussed above, or when not depressed. A lower portion 1814 of the button spring 1810 can be in electrical contact with or coupled to a collar 1818 that can be coupled to ground, or one or more other components that form a ground path. Spring arms 1812 may contact button 1808 as shown in FIG. 20H to complete a path to button 1808 .

In at least one example, lower portion 1814 of button spring 1810 defines an aperture 1820 through which plunger 1837 extends. In at least one example, the lower portion 1814 of the button spring 1810 forms a bend 1822 that biases the portions of the button spring 1810 on either side of the bend 1822 away from each other, which contributes to an upward force from the button spring 1810. For example, the bend 1822 can deflect a first portion 1824 on one side of the bend 1822 away from a second portion 1826 on the other side of the bend 1822 .

In at least one example, first portion 1824 contacts or extends into housing 1802 at 1828 to complete an electrical path from button 1808 through button spring 1810 to housing 1802. Additionally, in at least one example, collar 1818 defines aperture 1830, and an anti-rotation feature or extension 1832 of second portion 1826 can extend through or at least partially into aperture 1830 to prevent button spring 1810 from rotating out of position as button 1808 is depressed and moved up and down during use. . In at least one example, anti-rotation feature 1832 engages collar 1818 without adhesives. Generally, the button spring can be placed and secured in place as shown without adhesives. The area or volume in which the button spring 1810 is disposed may include the area between the inner housing 1851 and the outer housing 1802 such that any adhesive present may be exposed to chemical attackers from the external environment, e.g., through the various vents defined by the housing including first and second vents 1849 and 1847, respectively. Thus, button spring 1810 may be secured in place via anti-rotation feature 1832, interface with housing 1802 at 1828 and/or with button 1808.

In at least one example, device 1800 may include a shim 1834 disposed between a button 1808 or button cap and a plunger 1837 . In at least one example, shim 1834 may include a more elastic or compressible material than button 1808 and/or plunger 1837 . In one example, button 1808 and plunger 1837 include conductive metals, and shim 1834 includes a plastic or rubber material. A shim 1834 may be placed between and in contact with the button 1808 and the plunger 1837 as shown, such that the shim 1834 absorbs forces and movements from the plunger 1837 and button 1808, and the shim 1834 absorbs forces and movements from the plunger 1837 and button 1808 as the components of the speakers 1863 and 1861 vibrate and pressure sound waves impinge on the plunger 1837 and button 1808. 834 reduces chattering or buzzing caused by plunger 1837 and button 1808 vibrating relative to each other. In at least one example, shim 1834 may include an elastic material. In at least one example, shim 1834 may include a compressible material. In at least one example, the compressible material may include foam.

Referring back to FIG. 20H , device 1800 can include speaker meshes 1836a and 1836b disposed over speakers 1863 and 1861 , respectively. Each screw 1816 of the button 1808 may include a lower surface 1838 of the screw head facing the mesh 1836a, 1836b. Lower surface 1838 may be chamfered. Meshes 1836a and 1836b may be recessed to match or accommodate the curvature of lower surfaces 1838 of screws 1816 . The recessed geometry of the meshes 1836a, 1836b can provide extra space or volume for the screws 1816 to extend towards the meshes 1836, without the screws 1816 and the meshes 1836a, 1836b contacting or colliding when the button 1808 is depressed. Additionally, speaker meshes 1836a, 1836b can include any number of stacked meshes of various pore sizes and materials. Pore size can be identified and selected to balance resistance to ingress of foreign substances, decorative benefits, water drainage, and acoustic performance. In some examples, the speaker meshes can both be metal and welded to device 1800 . In other examples, the meshes can be metal, fabric, polymer, or combinations thereof, and can be attached to device 1800 by adhesives, fasteners, welding or other bonding methods, or the like.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIGS. 20H and 20I ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 20H and 20I.

20J shows a cross-sectional view of a portion of a device 1800 that includes a button 1808 disposed in an aperture 1833 defined by a housing 1802 and a speaker diaphragm 1836 disposed in the interior volume of the device 1800. The speaker diaphragm 1836, button 1808, and housing 1802 may define a front volume 1855, also shown and labeled in FIG. 20A. In at least one example, device 1800 can include acoustic gasket 1840 extending between button 1808 and housing 1802 . In at least one example, gasket 1840 is about 100 micrometers or greater thick, where gasket 1840 contacts housing 1802 . In at least one example, a top surface of gasket 1840 interfaces at an angle with a vertical surface of housing 1802 defining aperture 1833 by more than 0 degrees, for example at least about 20 degrees or more, to a horizontal plane orthogonal to the surface of housing 1802 defining aperture 1833. In at least one example, the gasket includes a resilient material. In at least one example, gasket 1840 includes a material having a Shore-A hardness of about 30A to 90A, or about 40A to 80A, or about 50A to 70A, such as about 60A.

Thus, if gasket 1840 has the dimensions and material properties noted above, gasket 1840 can retain and return to its rest shape after button 1808 is depressed by the user. Additionally, according to the dimensions and material properties mentioned above, gasket 1840 can seal front volume 1855 such that pressure can build greater than atmospheric pressure outside device 1800 . In this way, the volume of the first speaker 1863 can be increased. In at least one example, the material properties, shape, and dimensions of gasket 1840 can be tuned to maximize at least one of the resonant frequencies of first speaker 1863 . In at least one example, gasket 1840 is permeable to water, but may be impermeable to dust and debris from the external environment.

The first speaker 1863 can include two peak resonant frequencies, a mechanical resonant frequency created by the shape of the first speaker 1863 itself operating outdoors, and a front port resonance that leverages the length of the first vent 1849 as a tube that creates a higher pitch frequency and lets sound out of the first speaker 1863 through the housing 1802. The pressure built up in the front volume 1855 affects pressure waves of sound exiting the first vent 1849 from the first speaker 1863 due in part to the seal formed by the gasket 1840 . In this way, gasket 1840 can tune the sound from first speaker 1863 and increase the resonant tube frequency. In this way, multiple resonant frequencies (mechanical and tubular) can be used and a wider range of sound frequencies can be increased.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIG. 20J) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIG. 20J.

20K illustrates a cross-sectional view of a portion of a device 1800 that includes a button 1808, a housing 1802, and a gasket 1840 extending between the housing 1802 and the button 1808. Button 1808 can include an outer color layer 1842 that can be formed by physical vapor deposition. Color layer 1842 may also be referred to as PVD layer 1842 . The PVD layer can extend over a first surface 1844 that is angled or curved at a first angle or curvature and a second surface 1848 that is angled at a second angle different from the angle of the first surface 1844 . During the PVD process of forming the PVD layer 1842, the PVD layer 1842 may be deposited on the button 1808 in a direction regardless of the curvature, angles, or portion of the surface being deposited to simplify the PVD process. In one example, the deposition direction is indicated by deposition direction 1850 .

Since the first angle of the first surface 1844 is different from the second angle of the second surface 1848 with respect to the deposition direction 1850, the PVD layer 1842 deposited on the first surface 1844 is formed thicker than the PVD layer 1842 of the second surface 1848. This may be due to the steeper angle of the second surface 1848 relative to the horizontal plane of FIG. 20K orthogonal to the deposition direction 1850. As shown, the PVD layer 1842 of the second surface 1848 is thinner than the PVD layer 1842 of the first surface 1844 due to this angular difference with respect to the deposition direction 1850 . The thickness of the PVD layer 1842 affects the color of the PVD layer 1842. In one example, the thicker PVD layer 1842 on the first surface 1844 can appear red, while the transition between the first and second surfaces 1844, 1848 or the color of the PVD layer 1842 at the corner surface 1846 can appear blue, and the color of the thinner PVD layer 1842 on the second surface 1848 can shift back towards red, for example For example, it appears orange or red-orange. The thickness of the PVD layer 1842 at the corner 1846 can be thicker than the PVD layer 1842 at the second surface 1848, but thinner than the PVD layer 1842 at the first surface 1844.

In the example mentioned above, the blue color of the PVD layer 1842 at the corner 1846 appears more visually compared to the red color of the PVD layer 1842 at the first surface 1844 than the orange color of the PVD layer 1842 at the second surface 1848. To minimize the blue and red contrast between corner 1846 and first surface 1844, corner 1846 can include a small radius of curvature to minimize the area of the surface of button 1808 bounded by corner 1846. Although the PVD layer 1842 at the second surface 1848 is thinner than the PVD layer 1842 at the corner 1846, the orange color of the PVD layer 1842 at the second surface 1848 is closer to red and is less visually contrasting or noticeable. Thus, the angle of the second surface 1848 can be selected to tune the thickness of the PVD layer 1842 on the second surface 1848 relative to the thickness of the PVD layer 1842 on the first surface 1842 to minimize color differences.

In at least one example, second surface 1848 is angled from about 1 degree to about 10 degrees relative to deposition direction 1850, or from about 3 degrees to about 7 degrees relative to deposition direction 1850, such as about 5 degrees relative to deposition angle 1850. In this way, the thickness of the PVD layer 1842 on the second surface 1848 may be less than or less than about 50% of the thickness of the PVD layer 1842 on the first surface 1844. In examples where the PVD layer 1842 on the second surface 1848 is less than about 50% of the thickness of the PVD layer 1842 on the first surface, the color difference between the PVD layer 1842 on the first and second surfaces 1844, 1848 can be visually minimized.

Any of the features, components, and/or portions (including the arrangements and configurations thereof shown in FIG. 20K) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIG. 20K.

21 illustrates a cross-sectional view of the assembly shown in FIGS. 20A-20F, 1852 showing the interior volume of the device and 1802 being the outer housing. To simplify machining of the housing 1802 during manufacture, an angled receiving cavity for the speaker assembly can be machined into the inner surface of the housing 1802 so that machining tools can reach the necessary points within the housing to machine the cavity. Thus, in at least one example, a speaker assembly including speaker 1863 shown in FIG. 21 may be disposed at an angle relative to horizontal plane 1831 of device 1800 . In one example, the speaker angle θ may be between about 5 degrees and 10 degrees, for example about 7.5 degrees, from the horizontal plane 1831 of the device 1800, and the cavity angle β may be between about 7 degrees and 13 degrees beyond the speaker angle θ, for example about 10 degrees.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 21 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 21 alone or in any combination.

As mentioned above, the wearable electronic devices described herein may be configured to be used during any of a user's daily activities. Often, a wearable device will be rubbed against other objects, including clothing, or blown up if it is outside during use. Typically, these types of interactions, including rubbing, scratching, and wind blowing, can cause a negative impact on the performance of one or more microphones of the device. For example, some wearable devices may include a microphone for receiving a user's voice during a cellular call using the device. However, when speaking in an external environment where wind is often present, the wind can cause unwanted noise when the wind passes the device and specifically when the wind passes one or more microphone apertures in the housing of the device, which can create unwanted background noise and unclear voice transmissions from the device.

For example, as shown in FIG. 22 , a user wears a wearable electronic watch 1900 on his/her wrist while riding a bicycle. Such activity causes wind to pass through and contact device 1900 . The same may be true while walking, jogging, hiking, or any other active and/or outdoor activity. 23 shows device 1900 receiving wind flowing towards and around device 1900. Flow lines 1919 illustrate one possible flow path of wind across device 1900 . In some examples, turbulences 1921 can be created on one or more sides of device 1900 . Such wind and turbulent flow can travel through certain components or openings to the microphones and speakers of device 1900 and can cause unwanted noise when transmitting a user's voice during a cellular call or while recording one's own voice using device 1900.

The degree of such noise interference from wind can vary depending on the position of the microphone and the direction of the wind. As mentioned above, the principles discussed with respect to wind interference may also hold true for other types of interference, such as water and moisture interference and rubbing or scratching the device 1900 against other objects such as clothing. 24 shows wind 1919 coming from all a variety of different directions around device 1900 . Positions 1917a, 1917b, 1917c, and 1917d on device 1900 illustrate potential positions of the microphone of device 1900. Again, the degree of noise interference from the wind can change depending on the location of the microphone and the direction of the wind, and those directions and locations can change from moment to moment during use.

In order to reduce interference from wind and other objects, the wearable electronic devices of these systems and methods may include three microphones configured to receive the sound through the inner volume of the device and to receive the sound through three individual afterwarming, and the position and orientation of the asserters and microphones are one or two of the microphones during use during use. While you can pick up the subtle, it can be made to be positioned and oriented so that at least one of the microphones and the afterglosts can pick up less noise. In such a configuration, the device may be configured to process the combined noise detected by all three microphones to reduce the noise. In one example, the device can be configured to rely more on microphones that pick up less interfering noise, so that the detected noise is clear and unaffected by interfering noise caused by wind.

In at least one example, as shown in FIG. 25 , the wearable electronic watch 2000 can include a housing sidewall 2028 defining an interior volume 2052, the sidewall 2028 extending circumferentially 360 degrees around the interior volume 2052. The sidewall 2028 can also define a first aperture 2015, a second aperture 2013 that is between about 155 and 205 degrees relative to the first aperture 2015, and a third aperture 2011 that is closer to the second aperture 2013 than the first aperture 2015.

Additionally, the device 2000 includes a first microphone 2009 disposed in the interior volume 2052 and configured to receive sound through a first aperture 2015, a second microphone 2007 disposed in the interior volume 2052 and configured to receive sound through a second aperture 2013, and a third aperture 2011 disposed in the interior volume 2052. and a third microphone 2005 configured to receive sound through.

In one example, device 2000 can include a first strap receiving feature 2001 and a second strap receiving feature 2003 opposite the first strap receiving feature 2001 . The first sidewall portion 2004 can extend between the first strap receiving feature 2001 and the second strap receiving feature 2003, the first sidewall portion 2004 defining the first aperture 2015 closer to the first strap receiving feature 2001 than the second strap receiving feature 2003. Additionally, one example can include a second sidewall portion 2006 disposed opposite the first sidewall portion 2004 and extending between the first strap receiving feature 2001 and the second strap receiving feature 2003, the second sidewall portion 2006 defining a second aperture 2013 and a third aperture 2011, the second aperture 2013 comprising: It is defined closer to the second strap receiving feature 2003 than to the first strap receiving feature 2001 . In such an example, as shown in FIG. 25 , device 2000 includes a first microphone 2009 disposed in interior volume 2052 adjacent to first aperture 2015 , a second microphone 2007 disposed in interior volume 2052 adjacent to second aperture 2013 , and an interior volume 2052 disposed adjacent to third aperture 2011 . A third microphone 2005 may be included. Although the system is described as detecting noise and wind from various lateral directions, the system may also include microphones oriented to detect wind and sounds from various orientations, including on and off the page illustrated in FIG. 24 .

In one example, as shown in FIG. 25 , the electronic device 2000 can include a fourth aperture 2008 . A first microphone 2009 can be disposed in the interior volume 2052 adjacent to the first aperture 2015, a second microphone 2007 can be disposed in the interior volume 2052 adjacent to the second aperture 2013, and a third microphone 2005 can be disposed in the interior volume 2052 adjacent to the third aperture 2011. Additionally, the speaker 2010 is positioned adjacent to the fourth aperture 2008 such that the distance along the sidewall 2028 between the first and second apertures 2015 and 2013 is greater than the distance along the sidewall 2028 between the second and third apertures 2013 and 2011 and the fourth aperture 2008 is adjacent to the first aperture 2015. may be disposed in interior volume 2052 .

In at least one example, second aperture 2013 and third aperture 2011 may be defined on the distal side of the wearable electronic watch. The distal side of the wearable electronic watch 2000 may include or be defined by the second sidewall portion 2006 , where the term “distal” refers to being anatomically distal when worn on a user's wrist. In other words, the distal side of the wearable electronic watch 2000 includes the side facing the user's hand when worn. Conversely, the proximal side of the wearable electronic watch 2000 may include or be defined by the first sidewall portion 2004, where the term “proximal” refers to being anatomically proximal when worn on a user's wrist. In other words, the proximal side of the wearable electronic watch 200 includes the side facing the user's forearm when worn. In at least one example, first aperture 2015 may be defined on a proximal side of wearable electronic watch 2000 .

In at least one example, second aperture 2013 may be defined at about 170 to 190 degrees relative to first aperture 2015 . In such an example, third aperture 2011 may be defined at about 30 to 60 degrees counterclockwise along sidewall 2028 relative to second aperture 2013 . In one example, third aperture 2011 may be defined at about 40 to 50 degrees counterclockwise along sidewall 2028 relative to second aperture 2013 .

In at least one example of a wearable electronic watch 2000 , sidewall 2028 defines a strap receiving feature 2001 between first aperture 2015 and second aperture 2013 . Sidewall 2028 can further define a second strap receiving feature 2003 opposite first strap receiving feature 2001 and between third aperture 2011 and first aperture 2015 . In at least one example, first aperture 2015 can be defined closer to first strap receiving feature 2001 than second strap receiving feature 2003, and second aperture 2013 can be defined closer to second strap receiving feature 2003 than first strap receiving feature 2001. In one example, third aperture 2011 can be defined between second aperture 2013 and first strap receiving feature 2001 .

In at least one example, third aperture 2011 is defined at about 30 to 60 degrees counterclockwise along housing sidewall 2028 from second aperture 2013 . The first aperture 2015 may be defined from the second aperture 2013 to about 170 to 190 degrees along the housing sidewall 2028 . In at least one example, first aperture 2015 can be defined proximally relative to first strap receiving feature 2001 and second strap receiving feature 2003, and second aperture 2013 and third aperture 2011 can be defined distally relative to first strap receiving feature 2001 and second strap receiving feature 2003.

In at least one example, first microphone 2009 can be oriented to receive sound from a first direction, and second microphone 2007 can be oriented to receive sound from a second direction different from the first direction. In one example, the second direction is opposite the first direction. In such an example, first aperture 2015 and fourth aperture 2008 may be defined on the proximal side of electronic device 2000 . In such an example, second and third apertures 2013 and 2011 may be defined on the distal side of electronic device 2000 .

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 22-25 ) may be included singly or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 22-25.

26 illustrates another example of a wearable electronic device 2100 that includes a sidewall 2128 defining an interior volume 2152 and first, second, and third apertures 2115, 2113, and 2111, respectively. A first microphone 2109 is disposed in the interior volume 2152 adjacent to the first aperture 2115 and is configured to receive sound through the first aperture 2115 . A second microphone 2107 is disposed in the interior volume 2152 adjacent to the second aperture 2113 and is configured to receive sound through the second aperture 2113 . A third microphone 2105 is disposed in the interior volume 2152 adjacent to the third aperture 2111 and is configured to receive sound through the third aperture 2111 . In the illustrated example of FIG. 26 , apertures 2115 , 2113 , 2111 are defined by distal sidewall portion 2106 between first and second strap receiving features 2101 , 2103 , respectively.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 26 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 26 alone or in any combination.

27 shows another example of a wearable electronic device 2200 that includes a sidewall 2228 defining an interior volume 2252 and first and second apertures 2215 and 2213, respectively. A first microphone 2209 is disposed in the interior volume 2252 adjacent to the first aperture 2215 and is configured to receive sound through the first aperture 2215 . A second microphone 2207 is disposed in the interior volume 2252 adjacent to the second aperture 2213 and is configured to receive sound through the second aperture 2213 . In the illustrated example of FIG. 27 , aperture 2215 is defined between first and second strap receiving features 2201 and 2203 by proximal sidewall portion 2204 , respectively. Second aperture 2213 is defined by distal sidewall portion 2206 between first and second strap receiving features 2201 and 2203, respectively.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 27 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 27 alone or in any combination.

28 illustrates another example of a wearable electronic device 2300 that includes an interior volume 2352 and a sidewall 2328 defining first and second apertures 2313 and 2311, respectively. A first microphone 2307 is disposed in the interior volume 2352 adjacent to the first aperture 2313 and configured to receive sound through the first aperture 2313 . A second microphone 2305 is disposed in the interior volume 2352 adjacent to the second aperture 2311 and is configured to receive sound through the second aperture 2311 . In the illustrated example of FIG. 28 , apertures 2312 and 2111 are defined by distal sidewall portion 2306 between first and second strap receiving features 2301 and 2303 , respectively.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIG. 28 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included in the example devices, features, components, and portions shown in FIG. 28 alone or in any combination.

In each example shown in FIGS. 25-28 , the device can be configured to receive and process multiple audio signals from multiple microphones through multiple apertures and identify the microphone with the lowest perceived wind noise. This microphone can be used as a baseline, and data can be extracted from other locations to process a distinct audio signal. This can improve audio transmission and detection performance in windy conditions when the device is rubbed against another object or when one or more microphone apertures become clogged with debris and/or liquid.

29A shows an example bottom elevation view of back cover 1114 and electromagnetically transparent components 1116 assembled together to form the back side or back surface of device 1100. In at least one example, back cover 1114 can be secured to sidewalls 1128 of device 1100 .

In at least one example, back cover 1114 may be secured to sidewalls 1128 using one or more fasteners 1192 . In the illustrated example of FIG. 29A , four fasteners 1192 are used to secure the back cover 1114 to the sidewalls 1128, with one fastener 1192 disposed at each corner of the device 1100. Using the fasteners shown, the back cover 1114, which in some examples may be made of ceramic, glass, or other brittle material, the back cover 1114 may be secured to the sidewalls 1128 without cracking, separating from the sidewalls 1128, or otherwise being damaged during assembly.

In at least one example, back cover 1114 may include zirconia, or other brittle material that is difficult to CNC and machine, to form complex connection features. Using the fasteners shown in the figures to secure the back cover 1114 to the sidewalls 1128 of the device 1100 can simplify the geometry of the back cover 1114 to simplify the manufacturing process of the back cover 1114. For example, as shown in the cross-sectional view of FIG. 15B , the back cover 1114 may be formed of a simple geometry that extends around the electromagnetically transparent components 1116 and defines a through hole 1194 through which each fastener 1192 passes.

In at least one example, each fastener 1192 can be disposed through the back cover 1114 a certain distance from the outer peripheral edge of the back cover 1114 such that there is sufficient material between the fastener and the outer edge to prevent cracking of the back cover between the fastener 1192 and the outer peripheral edge of the back cover 1114. It is designed to reduce any stress concentrations in the back cover 1114 during and after assembly by forcing the material of the back cover 1128 against the sidewalls 1128 .

30 and 31 , in at least one example, the through hole 1194 defined by the back cover 1114 may include a counter bore into which the head 1196 of the fastener 1192 is disposed when assembled. Additionally, in at least one example, the head 1196 of the fastener 1192 can include an outwardly extending flange 1198, and a gasket 1199 is pressed between the flange 1198 and the back cover 1114. In one example, fastener 1192 may include a threaded screw. When assembled, the threaded screw may be threaded into a threaded receiving hole defined by the side walls 1128 such that the head 1196 of the fastener 1192 presses the back cover 1114 against the side walls 1128.

Thus, flange 1198 is pressed against gasket 1199 to form an environmental seal against external moisture and other debris entering through hole 1194 . This environmental seal may also reduce corrosion of the fastener itself as it prevents water or other moisture/fluid from entering the through hole 1194 and coming into contact with the fastener 1192 disposed inside the through hole 1194. 31 shows an O-ring seal 1197 instead of the gasket shown in the example of FIG. 30, and FIG. 32 shows a side view of fastener 1192 with gasket 1199 disposed below flange 1198.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 29A-32 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIGS. 29A-32.

In at least one example, as shown in FIG. 33A , the fastener 1292 can include an eave feature 1295 formed by a flange 1298 on the lower side of the head 1296 configured to laterally constrain the O-ring or gasket as the fastener 1292 is pressed downward on the O-ring or gasket. 33B shows an example of an O-ring 1297 disposed on eave feature 1295. Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 33A and 33B ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included singly or in any combination in the example devices, features, components, and portions shown in FIGS. 33A and 33B.

34 illustrates a five-point punch 1393 recessed into the top surface of the head 1396 of the fastener 1392 with convex transitional edges between each of the five points of the punch shape. 35 illustrates a five-point punch 1493 recessed into the top surface of the head 1496 of fastener 1492 with five recessed points to form the five-leaf clover shape of punch 1493. These punches 1393, 1493 can provide aesthetically pleasing punch designs and tool specific mating features for assembly and disassembly that increase surface area and engagement and removal for secure fastening.

Additionally, as shown in the top and side views of FIGS. 36A and 36B , respectively, the top surface of fastener head 1596 can include patterns and lines 1591 to improve surface engagement and safe removal of fastener 1592 and other fasteners described herein and shown in other figures, while further improving aesthetic appeal. In at least one example, lines 1591 may be scored, machined, etched, or otherwise physically formed on the surface of head 1596. As shown from the side view of FIG. 36B , lines or scoring features 1591 may be formed in the head 1596 of fastener 1592 to a certain depth.

37 illustrates a flow diagram of a method 1600 of forming score lines and/or machined features 1591 shown in FIGS. 36A and 36B. In a first step of method 1600, a 50 degree feature is machined or otherwise formed into the surface to a depth of approximately 0.01 mm. Next, in step 1687 of method 1600, the feature may be widened to approximately 130 degrees at the same depth. Next, at step 1685, the feature may be increased to a depth of approximately 0.05 mm to form an approximately 45 degree feature. Then, at step 1683, the feature may be widened to approximately 60 degrees at the same depth of approximately 0.05 mm. Next, the depth of the feature can be increased to approximately 0.10 mm to form an approximately 45 degree feature. The angles and depth dimensions shown in FIG. 37 and described herein are exemplary only and may vary to form features of different sizes, shapes, number and depth. In general, the depth and angle of the features can be iteratively widened and deepened as described until the desired depth and angle of each feature is achieved.

Any of the features, components, and/or portions (including their arrangements and configurations shown in FIGS. 33A-37 ) may be included alone or in any combination in any of the other examples of devices, features, components, and portions shown in the other figures. Likewise, any of the features, components, and/or portions (including arrangements and configurations thereof shown in other figures) may be included alone or in any combination in the example devices, features, components, and portions shown in FIGS. 33A-37.

Wearable electronic devices currently on the market, including current wearable electronic watches, cannot accurately detect environmental pressures both in an underwater environment and on the surface of the water. Generally, this is because the scale of the pressures is quite different between the air pressure above the water surface and the fluid pressure below the water surface. It can be particularly difficult to construct a single pressure sensor in such a device that is sensitive enough to detect changes in air pressure above the water surface but robust enough to detect pressure changes below the water surface, for example up to 10-bar below the water surface.

However, devices of the present disclosure, including the wearable electronic devices and watches described herein, may include a single pressure sensor for detecting pressure up to 10-bar above and below the water surface. In at least one example, the pressure sensor can be electrically connected to an ASIC switch and associated circuitry and processors to switch pressure scales when high pressures are detected when the device is submerged under water.

For example, such ASIC circuitry coupled to the sensor may include a low gain mode for measuring depth and a high gain mode for measuring depth and altitude. This gain change can be switched using an ASIC to tune the sensor between water and air sensitivities. The device's processor may also receive a temperature measurement from the device's temperature sensor to account for the temperature of the external environment, which may affect the pressure sensor reading and sensitivity. In this context, at least one example of such a device may also include a heater for applying heat to the pressure sensor to perform a health check on the sensor to calibrate the sensor to its original calibration that was set or performed at the same temperature at which the pressure sensor was heated by the heater.

To the extent applicable to the present technology, the collection and use of data available from various sources may be used to improve the delivery to users of invited content or any other content that may be of interest to the users. This disclosure contemplates that, in some examples, this collected data may include personal information data that uniquely identifies a particular individual or that can be used to contact or locate him/her. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, TWITTER® IDs, home addresses, data or records relating to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

This disclosure recognizes that the use of such personal information data in the present technology can be used to benefit users. For example, personal information data may be used to deliver targeted content of greater interest to a user. Accordingly, the use of such personal information data enables users to exercise calculated control over the content delivered. Additionally, other uses for personal information data that benefit the user are also contemplated by this disclosure. For example, health and fitness data can be used to provide insight into a user's general wellness, or as positive feedback to individuals using technology to pursue wellness goals.

This disclosure contemplates that entities responsible for the collection, analysis, disclosure, transfer, storage, or other use of such personal information data will comply with well-established privacy policies and/or privacy practices. In particular, such entities must implement and consistently use privacy policies and practices that are generally recognized to meet or exceed industrial or administrative requirements for keeping personal information data private and secure. Such policies should be readily accessible by users and should be updated as the collection and/or use of data changes. Personal information from users should be collected for legitimate and appropriate uses of the entity, and should not be shared or sold outside of these legitimate uses. Additionally, such collection/sharing should occur after receiving the users' informed consent. Additionally, such entities should consider taking any necessary steps to protect and secure access to such personal information data and to ensure that others having access to such personal information data adhere to their privacy policies and procedures. Additionally, such entities may themselves be evaluated by third parties to demonstrate their adherence to widely accepted privacy policies and practices. Additionally, policies and practices must be adapted for the specific types of personal information data being collected and/or accessed, and must be adapted to applicable laws and standards, including jurisdiction-specific considerations. For example, in the United States, the collection of, or access to, certain health data may be regulated by federal and/or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); Health data in other countries may be subject to different laws and policies and should be handled accordingly. Accordingly, different privacy practices must be maintained for different types of personal data in each country.

Notwithstanding the foregoing, the present disclosure also contemplates embodiments in which users selectively block the use of, or access to, personal information data. That is, the present disclosure contemplates that hardware and/or software components may be provided to prevent or block access to such personal information data. For example, in the case of advertisement delivery services, the technology may be configured to allow users to select "agree" or "disagree" of participation in the collection of personal information data during registration for the service or at any time thereafter. In another example, users may choose not to provide mood-related data for targeted content delivery services. In another example, users may choose to limit the length of time that mood-related data is maintained or to forbid development of a baseline mood profile entirely. In addition to providing “agree” and “disagree” options, this disclosure contemplates providing notices regarding access or use of personal information. For example, a user may be notified upon downloading an app that their personal data will be accessed, and then reminded immediately before the personal data is accessed by the app.

Moreover, it is the intent of this disclosure that personal information data should be managed and processed in a manner to minimize risks of unintended or unauthorized access or use. Risk can be minimized by limiting the collection of data and deleting data when it is no longer needed. Additionally, and when applicable, including applicable to certain health-related applications, data de-identification may be used to protect a user's privacy. Where appropriate, de-identification may be facilitated by removing certain identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than the address level), controlling how the data is stored (e.g., aggregating data across users), and/or other methods.

Thus, while this disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the disclosure also contemplates that various embodiments may also be implemented without the need to access such personal information data. That is, various embodiments of the present technology are not rendered inoperable due to a lack of all or some of such personal information data. For example, content may be selected and delivered to users by inferring preferences based on minimal amounts of personal information or non-personal information data, such as content requested by a device associated with a user, other non-personal information available for content delivery services, or publicly available information.

The foregoing description, for purposes of explanation, has used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Accordingly, the foregoing descriptions of specific embodiments described herein have been presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

Claims (20)

As an electronic device,
a housing defining an interior volume, a front opening, and a rear opening;
a display component disposed in the front opening;
a rear cover disposed in the rear opening;
a first temperature sensor disposed adjacent to the display component;
a second temperature sensor disposed adjacent to the rear cover; and
A processor electrically connected to the first temperature sensor and the second temperature sensor;
wherein the processor is configured to determine a core temperature of the user based on a first temperature detected by the first temperature sensor and a second temperature detected by the second temperature sensor. According to claim 1,
and a component disposed in the interior volume and forming part of a thermal path between the first temperature sensor and the second temperature sensor. According to claim 2,
The electronic device of claim 1 , wherein the component is disposed between the first temperature sensor and the second temperature sensor. According to claim 2,
The electronic device of claim 1 , wherein the component is a heat generating electrical component. According to claim 1,
The electronic device of claim 1 , wherein the second temperature sensor is disposed directly with respect to the rear cover. According to claim 1,
wherein the second temperature sensor is disposed relative to the housing. As an electronic device,
a housing defining a front opening, a rear opening, and an interior volume;
a display component disposed in the front opening;
a first printed circuit board (PCB) disposed below the display component within the interior volume;
a rear cover disposed in the rear opening;
a second PCB attached to the rear cover;
a first temperature sensor disposed on the first PCB; and
and a second temperature sensor disposed on the plate and in electrical communication with the first temperature sensor. According to claim 7,
Wherein the first temperature sensor is disposed on the ALS module of the first PCB. According to claim 8,
The electronic device of claim 1, further comprising a shield disposed on the ALS module next to the first temperature sensor. According to claim 7,
Further comprising a processor electrically connected to the first temperature sensor and the second temperature sensor,
wherein the processor is configured to determine a core temperature of the user based on a first temperature detected by the first temperature sensor and a second temperature detected by the second temperature sensor. According to claim 10,
and a component disposed in the interior volume and forming part of a thermal path between the first temperature sensor and the second temperature sensor. According to claim 11,
The electronic device of claim 1 , wherein the component is disposed between the first temperature sensor and the second temperature sensor. According to claim 12,
The electronic device of claim 1 , wherein the component is a heat generating electrical component. According to claim 10,
The electronic device of claim 1 , wherein the second temperature sensor is disposed directly with respect to the rear cover. According to claim 10,
wherein the second temperature sensor is disposed relative to the housing. A method of measuring core body temperature using a wearable electronic device,
measuring a system temperature of the wearable electronic device using a first temperature sensor disposed in the wearable electronic device;
measuring a surface body temperature using a second temperature sensor disposed in the wearable electronic device; and
determining a user's body temperature by considering a thermal thermal path comprising components disposed between the first temperature sensor and the second temperature sensor. According to claim 16,
wherein the components of the thermal thermal path include a heat generating component. According to claim 16,
wherein the components of the thermal thermal path include a heat absorbing component. According to claim 16,
Wherein considering the thermal thermal path comprises determining a thermal effect associated with the components. According to claim 19,
wherein the determined thermal effect comprises factoring the thermal effect when evaluating a temperature difference between the first temperature sensor and the second temperature sensor.

Images