KR20230103793A - Electronic device including semiconductor - Google Patents

Abstract

An electronic device according to an embodiment includes a circuit board, a shield can disposed on the circuit board and including an opening, a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can, and disposed to cover the opening, and the semiconductor A shielding sheet containing a blocking material that blocks at least some of the electromagnetic waves generated from the component, disposed between the semiconductor component and the shielding sheet, and covering at least a portion of a region in which the semiconductor component is disposed in a direction in which the semiconductor component is viewed through an opening It may include a barrier rib member that blocks at least a portion of an undisposed region, and a heat conducting material disposed in a space at least partially surrounded by the semiconductor component, the barrier rib member, and the shielding sheet.
In addition to this, various embodiments identified through the specification are possible.

Description

Electronic device containing a semiconductor {ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR}

Various embodiments disclosed in this document relate to electronic devices including semiconductors.

A portable electronic device may include a semiconductor component (eg, an application processor, referred to as an AP) that implements various functions. Heat and electromagnetic waves (or noise) generated from semiconductor components may cause malfunctions of components mounted in electronic devices or may cause electrical damage to the components. Therefore, the electronic device includes a thermal interface material (referred to as a thermal interface material (TIM)) for transferring heat generated from semiconductor components to other structures and a shielding structure (for example, a shield can) for shielding electromagnetic waves generated from semiconductor components. or a shielding sheet).

In the process of applying the thermally conductive material, a portion of the thermally conductive material may escape to an area other than the area where the thermally conductive material is applied (eg, an area where no semiconductor components are disposed). When a portion of the thermally conductive material is separated, the glue-spread of the thermally conductive material may vary or an empty space (eg, an air gap) may be formed between the thermally conductive material and the shielding sheet, resulting in electronic devices. heat transfer efficiency may decrease. In addition, the detached thermal conductive material may decrease bonding strength between the shielding sheet and the shield can.

An electronic device according to various embodiments of the present disclosure includes a circuit board, a shield can disposed on the circuit board and including an opening, a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can, and disposed to cover the opening. , A shielding sheet comprising a blocking material that blocks at least some of the electromagnetic waves generated from the semiconductor component, disposed between the semiconductor component and the shielding sheet, and covering at least a portion of a region in which the semiconductor component is disposed in a direction in which the semiconductor component is viewed through the opening is a semiconductor It may include a partition wall member that blocks at least a portion of an area where components are not disposed, and a heat conducting material disposed in a space at least partially surrounded by the semiconductor component, the partition wall member, and the shielding sheet.

A manufacturing method of an electronic device according to various embodiments of the present disclosure includes a process of disposing a semiconductor component and a shield can including an opening and surrounding at least a portion of the semiconductor component on a circuit board, and a direction in which the semiconductor component is viewed through the opening. A step of arranging a heat conduction material on at least a portion of the semiconductor component as seen from, a step of disposing a heat conduction material on at least a portion of the semiconductor component as seen from a direction of viewing the semiconductor component through the opening, and a heat conduction material from a direction of viewing the semiconductor component through the opening. A step of disposing a barrier member that blocks at least a portion of the region where the semiconductor component is disposed, including at least a portion of the semiconductor component on which the conductive material is disposed, and at least a portion of the region where the semiconductor component is not disposed, and a shielding sheet covering the opening, and A step of applying the heat conductive material to a space at least partially surrounded by the semiconductor component, the barrier member, and the shield sheet may be included by pressing at least a portion of the shield sheet corresponding to the region where the heat conductive material is disposed.

According to various embodiments disclosed in this document, an electronic device capable of preventing the thermal conductive material from escaping to an area other than the area to which the heat conductive material is applied by including a structure that blocks the area to which the heat conductive material is applied and other areas. can provide.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to an embodiment.
2 is a plan view illustrating an electronic device including a semiconductor component according to an exemplary embodiment.
3 is a cross-sectional view illustrating an electronic device including a barrier rib member according to an exemplary embodiment.
4 is a cross-sectional view illustrating an electronic device including a barrier rib member according to another exemplary embodiment.
5 is a plan view illustrating an electronic device including a barrier rib member according to an exemplary embodiment.
6 is a plan view illustrating an electronic device including a barrier rib member according to another exemplary embodiment.
7 is a plan view illustrating an electronic device including at least one accommodating part.
8 is a plan view illustrating an electronic device including a barrier rib member according to another exemplary embodiment.
9 is a flowchart illustrating a method of manufacturing an electronic device including a semiconductor component according to an exemplary embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

An electronic device according to various embodiments of the present document may include, for example, a smartphone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, Desktop personal computer, laptop personal computer, netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 player, mobile medical It may include at least one of a device, a camera, or a wearable device. According to various embodiments, the wearable device may be an accessory (eg, watch, ring, bracelet, anklet, necklace, glasses, contact lens, or head-mounted-device (HMD)), fabric or clothing integrated ( For example, it may include at least one of an electronic clothing), a body attachment type (eg, a skin pad or tattoo), or a living body implantable type (eg, an implantable circuit).

In some embodiments, the electronic device may be a home appliance. Home appliances include, for example, televisions, digital video disk (DVD) players, audio systems, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, home automation control panels ( It may include at least one of a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or an electronic picture frame.

In another embodiment, the electronic device may include various medical devices (eg, various portable medical measuring devices (blood glucose meter, heart rate monitor, blood pressure monitor, or body temperature monitor), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computer tomography), camera, or ultrasonic device), navigation device, global navigation satellite system (GNSS), event data recorder (EDR), flight data recorder (FDR), automotive infotainment device , marine electronics (e.g. marine navigation systems, or gyrocompasses), avionics, security devices, automotive head units, industrial or domestic robots, automatic teller's machines (ATMs) in financial institutions, shops point of sales (POS), or internet of things (e.g. light bulbs, various sensors, electricity or gas meters, sprinkler devices, smoke alarms, thermostats, street lights, toasters, exercise appliances, hot water tanks, heaters, or boilers).

According to some embodiments, the electronic device may be a piece of furniture or a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, water, electricity, gas, or radio wave measuring devices). In various embodiments, the electronic device may be one or a combination of more than one of the various devices described above. An electronic device according to some embodiments may be a flexible electronic device. In addition, the electronic device according to the embodiment of this document is not limited to the above-described devices, and may include new electronic devices according to technological development.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2 is a plan view illustrating an electronic device 200 including a semiconductor component 210 according to an exemplary embodiment.

Referring to FIG. 2 , the electronic device 200 includes a semiconductor component 210 disposed on a circuit board 260, a shield can 220 surrounding at least a portion of the semiconductor component 210 and including an opening 221, A thermal conductive material 230 that transfers heat generated from the semiconductor component 210 to another structure through the opening 221, and covering the opening 221 to block electromagnetic waves (or noise) generated from the semiconductor component 210. A partition wall member 250 may be included to at least partially block a space in which the shielding sheet 240 and the heat conducting material 230 are disposed from other spaces. However, components of the electronic device 200 are not limited thereto. The electronic device 200 may omit at least one of the aforementioned components or may further include at least one component. For example, the electronic device 200 may further include an accommodating portion accommodating a portion of the thermal conductive material 230 .

According to an embodiment, the semiconductor component 210 may be disposed on the circuit board 260 . The semiconductor component 210 may be operatively or electrically connected to the circuit board 260 . According to an embodiment, the shield can 220 may be disposed to shield electromagnetic waves (or noise) generated from the semiconductor component 210 or to protect the semiconductor component 210 . For example, the shield can 220 may surround at least a portion of the semiconductor component 210 on the circuit board 260 .

According to an embodiment, since the shield can 220 is disposed on the circuit board 260, a space at least partially surrounded by the shield can 220 and the circuit board 260 may be formed. At least a portion of the semiconductor component 210 may be disposed inside the space. Since at least a portion of the semiconductor component 210 is disposed inside the space, the shield can 220 can block electromagnetic waves (or noise) generated from the semiconductor component 210 or protect the semiconductor component 210 from external impact. can

According to an embodiment, the shield can 220 may include a metal material or a conductive material. For example, the shield can 220 may include at least one of iron, aluminum, or stainless steel (steel use stainless, SUS). However, it is not limited to this. For example, the shield can 220 may include a blocking material that blocks electromagnetic waves (or noise) generated from the semiconductor component 210 .

According to an embodiment, the shield can 220 transfers heat generated from the semiconductor component 210 to the outside of a space where at least a portion of the semiconductor component 210 is disposed (eg, the outside of the shield can 220). It may include at least one opening 221 for discharging. The opening 221 may serve as a physical passage through which heat generated from the semiconductor component 210 is discharged to the outside of a space in which at least a portion of the semiconductor component 210 is disposed. According to an embodiment, at least a portion of the semiconductor component 210 may be seen through the opening 221 .

According to an embodiment, the electronic device 200 may include a thermal conduction material 230 (eg, a thermal interface material (TIM)) that transfers heat generated from the semiconductor component 210 to another structure. . The thermal conductive material 230 may be disposed on at least a portion of the semiconductor component 210 viewed from a direction viewed through the opening 221 . The thermal conductive material 230 may transfer heat generated from the semiconductor component 210 to the outside of the shield can 220 through the opening 221 . For example, the heat conduction material 230 transfers heat generated from the semiconductor component 210 to a structure disposed outside the shield can 220 through the opening 221 (eg, the structure 270 of FIG. 3 ). can be conveyed

According to an embodiment, the shape of the opening 221 may be changed to correspond to the size or shape of the semiconductor component 210 . The opening 221 may include various shapes through which at least a portion of the semiconductor component 210 can be seen through the opening 221 . For example, the opening 221 may have a size smaller than the entire size of the semiconductor component 210 and equal to or larger than the space where the thermally conductive material 230 is disposed. can However, it is not limited to this. For example, the opening 221 may include a plurality of holes.

According to an embodiment, the barrier rib member 250 may be formed along at least a portion of the circumference of the semiconductor component 210 . In FIG. 2 , the barrier rib member 250 is illustrated as enclosing at least a portion of the semiconductor component 210 as a whole with only sidewalls of the barrier rib member 250, but is not limited thereto. For example, the barrier member 250 may further include an upper surface extending from the sidewall and disposed on at least a portion of the semiconductor component 210 .

According to an embodiment, at least a portion of at least one surface of the barrier rib member 250 may face the semiconductor component 210 . For example, the barrier rib member 250 may face at least a portion of at least one surface of the semiconductor component 210 viewed from a direction in which the semiconductor component 210 is viewed through the opening 221 . At least a portion of at least one surface of the barrier rib member 250 may be attached to the semiconductor component 210 using an adhesive member.

According to an embodiment, the barrier rib member 250 may block at least a portion of an area of the semiconductor component 210 on which the thermal conduction material 230 is disposed and at least a portion of an area on which the semiconductor component 210 is not disposed. For example, the partition wall member 250 may be disposed between the semiconductor component 210 and the shielding sheet 240 . The barrier rib member 250 may be disposed to at least partially surround at least a partial area of the semiconductor component 210 on which the heat conducting material 230 is disposed. The barrier rib member 250 blocks at least a portion of the semiconductor component 210 where the heat conductive material 230 is disposed and at least a portion of the region where the semiconductor component 210 is not disposed, so that the barrier rib member 250 is formed as a heat conductive material. Movement (or detachment) of the partition 230 to the outside of the barrier member 250 (eg, to an area where the semiconductor component 210 is not disposed) may be prevented.

According to an embodiment, the shape of the barrier rib member 250 may correspond to at least a partial region of the semiconductor component 210 on which the heat conducting material 230 is disposed. For example, as shown in FIG. 2 , when the barrier member 250 is viewed from above, when at least a portion of the semiconductor component 210 on which the thermal conduction material 230 is disposed has a rectangular shape, the barrier member 250 is It may have a rectangular shape. However, it is not limited thereto. For example, the barrier member 250 may have a polygonal, circular, or elliptical shape in a direction in which the barrier member 250 is viewed through the opening 221 .

According to an embodiment, the barrier rib member 250 may include an oil sorbent material. For example, the barrier rib member 250 may include a porous material capable of absorbing oil of the heat conducting material 230 such as a sponge.

According to an embodiment, the barrier rib member 250 may include at least one of an elastic material and a thermally conductive material. Since the barrier member 250 includes a thermally conductive material, the barrier member 250 can improve heat transfer efficiency of the electronic device 200 .

According to an embodiment, the shielding sheet 240 may be disposed to block electromagnetic waves (or noise) generated from the semiconductor component 210 . For example, the shielding sheet 240 may cover at least a portion of the opening 221 . According to one embodiment, at least a portion of the shielding sheet 240 may be attached to at least a portion of the shield can 220 in which the opening 221 is formed. For example, at least a portion of the shielding sheet 240 may be attached to at least a portion of the shield can 220 in which the opening 221 is formed along the opening 221 by using an adhesive member. The adhesive member may include at least one of an adhesive tape or a bond. However, it is not limited thereto.

According to an embodiment, the shielding sheet 240 may include a blocking material that blocks at least a portion of electromagnetic waves generated from the semiconductor component 210 . For example, the shielding sheet 240 may include ultrafine fibers (eg, nano fibers). However, it is not limited thereto. The shielding sheet 240 may prevent electromagnetic waves generated from the semiconductor component 210 from being emitted to the outside of the shield-can 220 through the opening 221 by including the blocking material.

According to one embodiment, the shielding sheet 240 may face at least a portion of at least one surface of the barrier rib member 250 . For example, the shielding sheet 240 may face at least a portion of one surface of the partition wall member 250 viewed from a direction in which the partition wall member 250 is viewed through the opening 221 . At least a portion of at least one surface of the barrier rib member 250 may be attached to the shielding sheet 240 using an adhesive member. However, it is not limited thereto. For example, the barrier rib member 250 may be integrally formed with the shielding sheet 240 .

According to an embodiment, the shielding sheet 240 covers at least a portion of the opening 221, so that a space at least partially surrounded by the semiconductor component 210, the barrier member 250, and the shielding sheet 240 is formed. can A heat conducting material 230 may be disposed in the space. For example, the heat conduction material 230 may be applied inside the space to fill the space. The heat conductive material 230 applied to the space transfers heat generated from the semiconductor component 210 to the outside of the shield can 220 (eg, to the outside of the shield can 220) through the shield sheet 240. to the deployed structure).

According to an embodiment, the space surrounded by the semiconductor component 210, the partition wall member 250, and the shielding sheet 240 is formed, so that a portion of the heat conducting material 230 disposed inside the space is formed in the space. It may not move (or deviate) to the outside. For example, in the barrier rib member 250, when a portion of the thermally conductive material 230 moves to an area where the semiconductor component 210 is not disposed, a variation in the coating amount of the thermally conductive material 230 may occur or the thermally conductive material ( 230) and the shielding sheet 240, an empty space (eg, an air gap) that hinders heat transfer may be prevented from being formed. In addition, the barrier rib member 250 moves the heat conducting material 230 to a region between the shield can 220 and the shielding sheet 240, so that the heat conducting material 230 moves between the shield can 220 and the shielding sheet 240. It can prevent weakening of the adhesive force between them.

3 is a cross-sectional view of an electronic device 200 including a barrier rib member 250 according to an exemplary embodiment. Figure 3 (b) is a cross-sectional view taken along A-A' of Figure 2.

The semiconductor component 210, the shield can 220, the heat conducting material 230, the shielding sheet 240, the barrier member 250, and the circuit board 260 of FIG. 3 are the semiconductor component 210 of FIG. 2, the shield It may be referred to as the can 220 , the heat conducting material 230 , the shielding sheet 240 , the barrier rib member 250 and the circuit board 260 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

According to an embodiment, the thermal conductive material 230 may include a material having high mobility. For example, the heat conducting material 230 may be a liquid or gel type. However, it is not limited to this. According to an embodiment, the barrier rib member 250 may prevent the thermal conductive material 230 including a material with high mobility from overflowing into an area where the semiconductor component 210 is not disposed.

FIG. 3(a) may be a view showing a state in which the thermal conduction material 230 is disposed on at least a portion of the semiconductor component 210 . 3(b) may be a view showing a state in which the thermal conductive material 230 is applied to a space at least partially surrounded by the semiconductor component 210, the shielding sheet 240, and the barrier rib member 250.

According to an embodiment, the semiconductor component 210 includes a processor 211 (eg, an AP, CPU, or electronic chip) disposed on a circuit board 260, and a memory device disposed on one surface of the processor 211. (212). However, the configuration of the semiconductor component 210 is not limited thereto. The semiconductor component 210 may omit at least one of the above-described components or may further include at least one component. For example, the semiconductor component 210 may further include a charger IC.

According to an embodiment, the processor 211 and the memory device 212 may be disposed inside a space at least partially surrounded by the shield can 220 and the circuit board 260 . For example, referring to FIG. 3 , the shield can 220 includes an opening 221 and a front surface spaced apart from the circuit board 260 at a predetermined interval, and a direction from the front surface toward the circuit board 260 (eg For example, it may include a side surface extending in a -z-axis direction) and surrounding at least a portion of a space between the front surface and the circuit board 260 . The processor 211 and the memory device 212 may be disposed inside a space at least partially surrounded by the circuit board 260 and the front surface and the side surface of the shield can 220 . However, the shape of the shield can 220 is not limited thereto.

According to one embodiment, the memory device 212 may be disposed between the processor 211 and the shielding sheet 240 . For example, the memory device 212 may be disposed on one surface of the processor 211 viewed in a direction (eg, a -z-axis direction) toward the semiconductor component 210 through the opening 221 .

According to an embodiment, the area of one surface of the processor 211 seen through the opening 221 in a state in which the processor 211 is disposed is, in a state in which the memory device 212 is disposed on the one surface of the processor 211. The area of one surface of the memory device 212 seen through the opening 221 may be larger than that of the area. However, it is not limited thereto.

According to one embodiment, the barrier member 250 may be disposed between the memory device 212 and the shielding sheet 240 . Referring to (a) of FIG. 3 , the thermal conduction material 230 may be disposed in a space at least partially surrounded by the memory device 212 , the barrier member 250 and the shielding sheet 240 .

According to an embodiment, referring to (b) of FIG. 3 , the heat conducting material 230 is inside a space at least partially surrounded by the memory device 212 , the barrier member 250 and the shielding sheet 240 . can be spread out. For example, by coupling the circuit board 260 to an electronic device or by disposing the structure 270 on top of the shielding sheet 240, the shielding sheet 240 corresponding to the region where the thermally conductive material 230 is disposed At least a portion of the region may receive a compressive force in a direction in which the thermal conductive material 230 is disposed (eg, in a -z-axis direction). At least a portion of the shielding sheet 240 corresponding to the region where the thermally conductive material 230 is disposed receives a compressive force, so that the thermally conductive material 230 is formed by the memory device 212, the barrier member 250 and the shielding sheet ( 240) may be applied to a space at least partially surrounded by. The thermal conductive material 230 may be applied inside the space to fill the space. According to an embodiment, the structure 270 may be at least a part of a housing of an electronic device, a vapor chamber, or a heat dissipation sheet made of graphite.

According to an embodiment, the heat conduction material 230 is applied to a space at least partially surrounded by the memory device 212, the barrier member 250, and the shielding sheet 240, so that the heat facing the shielding sheet 240 An upper surface of the conductive material 230 may be flat. For example, the top surface of the applied thermal conductive material 230 may overlap the shielding sheet 240 in a horizontal direction (eg, an x-axis direction). An upper surface of the applied thermal conductive material 230 may be at the same level as at least one surface of the partition wall member 250 facing the shielding sheet 240 . However, it is not limited thereto.

According to an embodiment, the heat conducting material 230 is applied to a space at least partially surrounded by the memory device 212, the partition wall member 250, and the shielding sheet 240 to fill the space, so that the heat conducting material ( 230) may not occur. For example, an empty space (eg, an air gap) may not be formed between the heat conducting material 230 and the shielding sheet 240 . Accordingly, heat transfer efficiency of the electronic device 200 may be improved.

According to an embodiment, the barrier member 250 may be disposed between the memory device 212 and the shielding sheet 240 to surround at least a portion of an edge of the memory device 212 . When the barrier rib member 250 is disposed to surround at least a portion of an edge of the memory device 212 , the area of the space where the thermal conductive material 230 is applied may be increased. Accordingly, heat transfer efficiency of the electronic device 200 may be improved.

According to one embodiment, at least a portion of at least one surface of the barrier rib member 250 facing the shielding sheet 240 may be attached to at least a portion of the at least one surface of the shielding sheet 240 using an adhesive member 290. . By attaching at least a portion of at least one surface of the barrier member 250 to at least a portion of the at least one surface of the shielding sheet 240, the adhesive member 290 is the memory device 212, the barrier member 250 and the shielding sheet 240 It is possible to seal between a space at least partially surrounded by and other spaces. The adhesive member 290 may prevent at least a portion of the thermal conductive material 230 from leaking into a space between the partition wall member 250 and the shielding sheet 240 . However, it is not limited to this. For example, the barrier rib member 250 may be integrally formed with the shielding sheet 240 .

According to an embodiment, the adhesive member 290 may include a material having high resistance to the oil component of the heat conducting material 230 . For example, the adhesive member 290 may include an antifouling material. However, it is not limited to this.

According to one embodiment, the adhesive member 290 may include at least one of an adhesive tape or a bond. However, it is not limited to this.

According to an embodiment, at least a portion of at least one surface of the barrier rib member 250 may be attached to at least a portion of at least one surface of the memory device 212 using an adhesive member 291 . By attaching at least a portion of at least one surface of the barrier member 250 to at least a portion of the semiconductor component 210, the adhesive member 291 forms the memory device 212, the barrier member 250, and the shielding sheet 240. It is possible to seal between a space at least partially surrounded by and other spaces. The adhesive member may prevent at least a portion of the thermal conductive material 230 from leaking into a space between the barrier rib member 250 and the semiconductor component 210 .

According to an embodiment, the adhesive member 291 may include a material having high resistance to the oil component of the heat conducting material 230 . For example, the adhesive member 291 may include an antifouling-based material. However, it is not limited to this.

According to one embodiment, the adhesive member 291 may include at least one of an adhesive tape or a bond. However, it is not limited to this.

4 is a cross-sectional view illustrating an electronic device 300 including a barrier rib member 251 according to an exemplary embodiment.

The semiconductor component 210, the shield can 220, the heat conducting material 230, the shielding sheet 240, and the circuit board 260 of FIG. 4 are the semiconductor component 210, the shield can 220 of FIGS. 2 and 3. ), the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 may be referred to. The partition wall member 251 of FIG. 4 may be referred to as the partition wall member 250 of FIG. 2 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 4 , a partition wall member 251 according to an embodiment may be disposed between the processor 211 and the shielding sheet 240 . For example, the barrier member 251 may be disposed between one surface of the processor 211 on which the memory device 212 is disposed and the shielding sheet 240 .

According to an embodiment, the thermal conduction material 230 may be disposed in a space at least partially surrounded by the processor 211 , the partition wall member 251 , and the shielding sheet 240 . The area of the space where the thermal conductive material 230 formed by disposing the barrier member 251 between the processor 211 and the shielding sheet 240 is applied is such that the barrier member 250 of FIG. It may be larger than the area of the space where the heat conducting material 230 formed by being disposed between the shielding sheets 240 is applied. Accordingly, heat transfer efficiency of the electronic device 300 may be improved.

According to an embodiment, the barrier rib member 251 may be disposed to surround at least a portion of the memory device 212 . For example, the barrier rib member 251 may be disposed to surround at least a portion of the periphery of the memory device 212 . According to an embodiment, at least a portion of the partition wall member 251 (eg, an inner surface of a wall of the partition wall member 251 ) may face the outside of the memory device 212 . When at least a portion of the barrier member 251 faces the outside of the memory device 212, at least a portion of the thermal conductive material 230 is formed by the memory device 212, the barrier member 251, and the shielding sheet 240. It can be placed in an enclosed space.

According to one embodiment, at least a portion of at least one surface of the barrier rib member 251 may be attached to at least a portion of at least one surface of the shielding sheet 240 using an adhesive member 290 . By attaching at least a portion of at least one surface of the barrier member 251 to at least a portion of the at least one surface of the shielding sheet 240, the adhesive member 290 is the memory device 212, the barrier member 251 and the shielding sheet 240 It is possible to seal between a space at least partially surrounded by and other spaces. The adhesive member 290 may prevent the thermal conductive material 230 from leaking into a space between the barrier rib member 251 and the shielding sheet 240 . However, it is not limited to this. For example, the barrier rib member 251 may be integrally formed with the shielding sheet 240 .

According to an embodiment, the adhesive member 290 may include a material having high resistance to the oil component of the heat conducting material 230 . For example, the adhesive member 290 may include an antifouling-based material. However, it is not limited to this.

According to an embodiment, at least a portion of at least one surface of the barrier rib member 251 may be attached to at least a portion of at least one surface of the processor 211 using an adhesive member 291 . Since at least a portion of at least one surface of the barrier member 251 is attached to at least a portion of the at least one surface of the semiconductor component 210, the adhesive member 291 is attached to the processor 211, the barrier member 251, and the shielding sheet 240. It is possible to seal between a space at least partially surrounded by and other spaces. The adhesive member 291 may prevent the thermal conductive material 230 from leaking into a space between the barrier rib member 251 and the semiconductor component 210 .

According to an embodiment, the adhesive member 291 may include a material having high resistance to the oil component of the heat conducting material 230 . For example, the adhesive member 291 may include an antifouling-based material. However, it is not limited to this.

5 is a plan view illustrating an electronic device 400 including a barrier rib member 252 according to an exemplary embodiment.

The semiconductor component 210, the shield can 220, the heat conducting material 230, the shielding sheet 240, and the circuit board 260 of FIG. 5 are the semiconductor component 210, the shield can 220 of FIGS. 2 to 4 ), the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 may be referred to. The partition wall member 252 of FIG. 5 may be referred to as the partition wall member 250 of FIGS. 2 to 3 or the partition wall member 251 of FIG. 4 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 5 , the electronic device 400 according to an exemplary embodiment is provided in a space where a thermal conductive material 230 is disposed (eg, a barrier rib member 252, a semiconductor component 210, and a shielding sheet 240). At least one hole 280 passing from the inside to the outside of the space where the heat conducting material 230 is disposed may be included.

According to an embodiment, when the amount of the heat conducting material 230 in the space is greater than the amount that the space can accommodate (for example, the volume of the heat conducting material 230 disposed in the space is greater than the volume of), a portion of the thermal conductive material 230 may be discharged from the inside of the space to the outside of the space through at least one hole 280 . For example, referring to FIG. 3 , in a direction in which the thermally conductive material 230 is disposed in at least a partial area of the shielding sheet 240 corresponding to the area in which the thermally conductive material 230 is disposed (eg, FIG. When the thermally conductive material 230 is applied by applying a compressive force (in the -z-axis direction of 3), a portion of the thermally conductive material 230 passes through the at least one hole 280 from the inside of the space to the outside of the space. can be ejected with Accordingly, the amount of the heat conducting material applied to the inside of the space can be adjusted.

According to an embodiment, the barrier rib member 252 may be spaced apart from the opening 221 by a predetermined interval. For example, at least one wall (eg, first wall 252B) of the barrier member 252 is spaced apart from at least one end (eg, one end 222) of the opening 221 by a predetermined distance. It can be. According to an embodiment, at least one hole 280 may be opened toward an area where the barrier member 252 and the shield can 220 are separated by a predetermined interval.

According to an embodiment, the partition wall member 252 may include at least one slit 252A formed in at least one wall (eg, the first wall 252B) of the partition wall member 252 . The at least one hole 280 is formed by disposing the semiconductor component 210, the barrier member 252, and the shielding sheet 240, thereby forming the at least one slit 252A, the semiconductor component 210, and the shielding sheet 240. It may be an enclosed space. However, it is not limited to this. For example, the at least one hole 280 may be at least one through hole formed in at least one wall (eg, the first wall 252B) of the partition wall member 252 .

According to one embodiment, the at least one slit 252A (if the at least one hole 280 according to one embodiment is a through hole formed in at least one wall of the partition wall member 252, it can be defined as a through hole. ) is formed on at least one wall 252B of the partition wall member 252 spaced apart from at least one end 222 of the opening 221 by a predetermined distance when the semiconductor component 210 is viewed through the opening 221. can

According to one embodiment, the at least one slit 252A (if the at least one hole 280 according to one embodiment is a through hole formed in at least one wall of the partition wall member 252, it can be defined as a through hole. ) may be formed on one wall of the barrier member 252 disposed at a position farther away from one end of the opening 221 when the semiconductor component 210 is viewed through the opening 221 . For example, referring to FIG. 5 , when viewing the semiconductor component 210 through the opening 221, the barrier rib member 252 is separated from one end 222 of the opening 221 by a first distance D1. The first wall 252B disposed at the position and the second wall 252C disposed at a position separated by a second distance D2 closer than the first distance D1 from the other end 223 of the opening 221 can include In this case, at least one slit 252B may be formed in the first wall 252B.

6 is a plan view illustrating an electronic device 500 including a barrier rib member 253 according to an exemplary embodiment.

The semiconductor component 210, the shield can 220, the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 of FIG. 6 are the semiconductor component 210, the shield can 220 of FIGS. 2 to 4. ), the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 may be referred to. The partition wall member 253 of FIG. 6 may be referred to as the partition wall member 250 of FIGS. 2 to 3 , the partition wall member 251 of FIG. 4 , or the partition wall member 252 of FIG. 5 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 6 , the partition wall member 253 according to an embodiment may include a first wall 253B and a second wall 253C facing the first wall 253B. The first wall 253B and the second wall 253C may include at least one slit. For example, the first wall 253B may include a first slit 253A opened in a first direction (eg, a +y-axis direction). The second wall 253C may include a second slit 253D opened in a second direction opposite to the first direction (eg, -y axis direction).

According to an embodiment, the shape of the first wall 253B may be symmetrical with respect to the shape of the second wall 253C and the space in which the heat conducting material 230 is disposed. The first slit 253A formed in the first wall 253B may be symmetrical with the second slit 253D formed in the second wall 253C. For example, the width of the first slit 253A may be the same as that of the second slit 253D. In another example, the position where the first slit 253A is formed may be symmetrical with the position where the second slit 253D is formed based on the space where the heat conducting material 230 is disposed.

According to an embodiment, the at least one slit (eg, the first slit 253A) is disposed in a longitudinal direction (eg, an x-axis direction) of the at least one wall (eg, the first wall 253B). ) can be formed at the center of For example, the barrier member 253 has a first length D3 from the at least one slit 253A to one end of the at least one wall 253B, and from the at least one slit 253A to the at least one wall 253B. ) may have a second length D4 to the other end. The first length D3 may be equal to the second length D4. However, it is not limited thereto.

7 is a plan view illustrating the electronic device 600 including the accommodating part 255 .

The semiconductor component 210, the shield can 220, the heat conducting material 230, the shielding sheet 240, and the circuit board 260 of FIG. 7 are the semiconductor component 210, the shield can 220 of FIGS. 2 to 4. ), the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 may be referred to. The partition wall member 254 of FIG. 7 may be referred to as the partition wall member 250 of FIGS. 2 to 3 or the partition wall member 251 of FIG. 4 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 7 , the electronic device 600 according to an exemplary embodiment may further include at least one accommodating portion 255 accommodating a portion of the thermal conductive material 230 . At least one accommodating portion 255 may be disposed in a region (eg, the first region R1) outside of a space at least partially surrounded by the semiconductor component 210, the partition wall member 254, and the shielding sheet 240. can At least one accommodating part 255 may be connected to a space at least partially surrounded by the semiconductor component 210 , the barrier member 254 , and the shielding sheet 240 . For example, at least one accommodating part 255 may be connected to the space through at least one hole 281 (which may be referred to as at least one hole 280 in FIG. 5 ).

According to an embodiment, at least one accommodating portion 255 is a portion of the thermal conductive material 230 disposed in a space at least partially surrounded by the semiconductor component 210, the partition wall member 254, and the shielding sheet 240. can accommodate For example, when the amount of the thermal conductive material 230 in a space at least partially surrounded by the semiconductor component 210, the partition wall member 254, and the shielding sheet 240 is greater than the amount that the space can accommodate ( For example, when the volume of the thermally conductive material 230 disposed in the space is greater than the volume of the space), a portion of the thermally conductive material 230 may be disposed in the at least one accommodating part 255 .

According to an embodiment, at least a portion of the thermal conductive material 230 may be discharged from the inside of the space to the at least one accommodating part 255 through the at least one hole 281 . For example, referring to FIG. 3 , in a direction in which the thermally conductive material 230 is disposed in at least a partial area of the shielding sheet 240 corresponding to the area in which the thermally conductive material 230 is disposed (eg, FIG. When the thermally conductive material 230 is applied by applying a compressive force (in the -z-axis direction of 3), a portion of the thermally conductive material 230 receives at least one inside of the space through the at least one hole 281 It can be discharged to the part 255. Accordingly, the amount of the heat conducting material 230 applied to the inside of the space may be adjusted.

According to an embodiment, an area other than the space at least partially surrounded by the semiconductor component 210, the barrier rib member 254, and the shielding sheet 240 may include the first area R1 and the second area R2. there is. The first region R1 may have a first distance D5 from the barrier rib member 254 to one end of the opening 221 . The second region R2 may have a second distance D6 from the barrier rib member 254 to the other end of the opening 221 . According to an embodiment, the first distance D5 may be shorter than the second distance D6.

According to an embodiment, the at least one accommodating part 255 may be disposed in a region where a distance from the barrier member 254 to one end of the opening 221 is greater. For example, at least one accommodating part 255 may be disposed in a first area R1 having a first distance D5.

According to an embodiment, the electronic device 600 extends from a space at least partially surrounded by the semiconductor component 210, the barrier rib member 254, and the shielding sheet 240 in a first direction (eg, +y-axis direction). It may include a first accommodating portion 255 disposed as . Although not shown in FIG. 7 , the electronic device 600 includes a second accommodating part (not shown) disposed in a second direction (eg, -y axis direction) opposite to the first direction from the space. can do.

According to one embodiment, the first accommodating part 255 may be symmetrical with the second accommodating part. For example, the shape of the first accommodating part 255 may be the same as that of the second accommodating part. However, it is not limited to this. For example, the location where the first accommodating portion 255 is disposed is based on a space at least partially surrounded by the semiconductor component 210, the barrier rib member 254, and the shielding sheet 240, where the second accommodating portion is disposed. position and may be symmetrical.

In FIG. 7 , the at least one accommodating part 255 is illustrated as having a rectangular shape in a direction viewed through the opening 221, but the shape of the at least one accommodating part 255 is not limited thereto. For example, the at least one accommodating part 255 may have a polygonal or circular shape in a direction viewed through the opening 221 .

According to an embodiment, the at least one accommodating part 255 may have a shape of a housing or a groove capable of accommodating a part of the heat conducting material 230 . For example, the at least one accommodating part 255 may include a front surface, a rear surface spaced apart from the front surface by a predetermined distance, and a side surface surrounding the space between the front surface and the rear surface. In another example, the at least one accommodating part 255 may include only the rear surface and the side surface, while omitting the front surface. According to an embodiment, the at least one accommodating portion 255 may be formed as a space surrounded by an additional barrier rib member extending from the barrier rib member 254 , the semiconductor component 210 , and the shielding sheet 240 .

8 is a plan view illustrating an electronic device 700 including a barrier rib member 256 according to an exemplary embodiment.

The semiconductor component 210, the shield can 220, the heat conducting material 230, the shielding sheet 240, and the circuit board 260 of FIG. 8 are the semiconductor component 210, the shield can 220 of FIGS. 2 to 8. ), the thermal conductive material 230, the shielding sheet 240, and the circuit board 260 may be referred to. The partition wall member 256 of FIG. 8 is the partition wall member 250 of FIGS. 2 to 3, the partition wall member 251 of FIG. 4, the partition wall member 252 of FIG. 5, the partition wall member 253 of FIG. 6, or the partition wall member 253 of FIG. can be referenced by the partition wall member 254 of The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

The barrier rib member 256 according to an embodiment may be disposed adjacent to a region in which adhesion between the shield sheet 240 and the shield can 220 is weak. For example, referring to FIG. 8 , the barrier member 256 may be disposed adjacent to a small area of the shield sheet 240 attached to the shield can 220 . In another example, the barrier member 256 may be disposed in a region close to one end of the opening 221. According to an embodiment, the barrier member 256 is disposed on one side of the semiconductor component 210. It can be. For example, the barrier rib member 256 may be disposed in an area where a distance between the semiconductor component 210 and the shield can 220 (or one end of the opening 221) is short. In some embodiments, the barrier member 256 may contact the shield can 220 (or one end of the opening 221).

According to one embodiment, the area where the barrier rib member 256 is disposed may vary. For example, the location where the barrier rib member 256 is disposed or the area where the partition wall member 256 is disposed may vary. For example, the barrier rib member 256 of FIG. 8 is shown in a shape surrounding at least a portion of one surface and both side surfaces of the semiconductor component 210, but the shape of the barrier rib member 256 is not limited to that of FIG. 8 . For example, the barrier rib member 256 may have a shape that shields at least a portion of the one surface of the semiconductor component 210 . In another example, the barrier rib member 256 may include a shape surrounding the one surface of the semiconductor component 210 and at least a portion of the one side surface.

According to an embodiment, the amount of the thermally conductive material 230 applied may be adjusted by regulating the position or area of the area where the barrier rib member 256 is disposed, or the area where the thermally conductive material 230 is applied The position or area of the can be adjusted.

9 is a flowchart illustrating a method of manufacturing an electronic device including a semiconductor component according to an exemplary embodiment.

The semiconductor component, shield can, heat conducting material, shielding sheet and circuit board of FIG. 9 are the semiconductor component 210, shield can 220, heat conducting material 230, shielding sheet 240 and It may be referenced by circuit board 260 . The partition wall member of FIG. 9 includes the partition wall member 250 of FIGS. 2 to 3, the partition wall member 251 of FIG. 4, the partition wall member 252 of FIG. 5, the partition wall member 253 of FIG. 6, and the partition wall member of FIG. 254 or partition member 256 of FIG. 8 . The same reference numerals are used for the same or substantially the same components as those described above, and redundant descriptions are omitted.

Referring to FIG. 9 , a method of manufacturing an electronic device according to an exemplary embodiment includes a process of disposing a semiconductor component and a shield can (801), a process of disposing a heat conducting material (803), and a process of disposing a partition wall member and a shielding sheet. (805), and a step (807) of applying a heat conductive material. However, the manufacturing method of the electronic device is not limited thereto. For example, the manufacturing method of the electronic device may omit at least one of the above-described processes or may further include at least one other process. For example, the manufacturing method of the electronic device may further include a process (not shown) of discharging a part of the heat conductive material in the process of applying the heat conductive material (807).

According to an embodiment, in process 801, the semiconductor component may be disposed on a circuit board (circuit board 260 of FIG. 1). According to one embodiment, the shield can including the opening may be disposed on the circuit board 260 . The shield can may be disposed to surround at least a portion of the semiconductor component. In a direction in which the semiconductor component is viewed through the opening, at least a portion of the semiconductor component may be visible.

According to an embodiment, in step 803, a heat conducting material may be disposed on at least a portion of the semiconductor component. For example, the heat conduction material may be disposed on at least a portion of the semiconductor component viewed from a direction in which the semiconductor component is viewed through the opening.

According to an embodiment, in operation 805, a barrier rib member may be disposed on the semiconductor component. At least a portion of the barrier rib member may face at least a portion of the semiconductor component. The barrier rib member may be disposed to block at least a portion of an area where the semiconductor component is disposed, including at least a portion of the semiconductor component on which the thermal conduction material is disposed, from a region where the semiconductor component is not disposed, in a direction in which the semiconductor component is viewed through the opening. can According to one embodiment, the shielding sheet may cover the opening. The shielding sheet may block electromagnetic waves (or noise) generated from semiconductor components by covering the opening.

According to an embodiment, in operation 805, by disposing the barrier rib member and the shielding sheet, a space at least partially surrounded by the semiconductor component, the barrier member, and the shielding sheet may be formed. A heat conduction material may be disposed inside the space.

According to an embodiment, in step 805, the barrier member and the shielding sheet may be disposed while the barrier member is attached to the shielding sheet. For example, at least a portion of at least one surface of the barrier rib member may be attached to the shielding sheet using an adhesive member. In another example, the barrier rib member may be integrally formed with the shielding sheet. By disposing the barrier member and the shielding sheet in a state where the barrier member is attached to the shielding sheet, the productivity of the manufacturing method of the electronic device can be improved. However, it is not limited thereto. According to another embodiment, in step 805, a shielding sheet may be disposed while the barrier member is attached to at least a portion of at least one surface of the semiconductor component.

According to an embodiment, in step 807, by pressing at least a portion of the shielding sheet corresponding to the region where the thermally conductive material is disposed, the thermally conductive material may be applied to a space at least partially surrounded by the semiconductor component, the partition wall member, and the shielding sheet. there is. A heat conducting material may be applied to fill the space.

According to an embodiment, the electronic device may include at least one hole passing from the inside of a space at least partially surrounded by the semiconductor component, the partition wall member, and the shielding sheet to the outside of the space. According to an embodiment, process 807 may further include a process of discharging a portion of the heat conducting material from the inside of the space to the outside of the space through at least one hole. According to an embodiment, in the process of discharging a portion of the heat conductive material, when the amount of the heat conductive material applied to the space is greater than the amount that the space can accommodate, the shield corresponding to the area where the heat conductive material is disposed. When at least a portion of the sheet is pressed to apply the heat conductive material, a portion of the heat conductive material may be discharged from the inside of the space to the outside of the space through at least one hole. Accordingly, the amount of the heat conducting material applied to the inside of the space can be adjusted.

As described above, an electronic device according to an embodiment includes a circuit board, a shield can disposed on the circuit board and including an opening, a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can, A shielding sheet disposed to cover the opening and including a blocking material that blocks at least a portion of electromagnetic waves generated from the semiconductor component, disposed between the semiconductor component and the shielding sheet, and viewing the semiconductor component through the opening In a space where at least a portion of the region where the semiconductor component is disposed is surrounded by a barrier member blocking at least a portion of the region where the semiconductor component is not disposed, and the semiconductor component, the barrier member, and the shielding sheet. A heat conducting material may be included.

According to an embodiment, the semiconductor component includes a processor disposed on the circuit board, and a memory device disposed between the processor and the shielding sheet, and the barrier member is disposed between the memory device and the shielding sheet. , The heat conduction material may be disposed in a space at least partially surrounded by the memory device, the barrier rib member, and the shielding sheet.

According to an embodiment, the barrier rib member may be disposed to surround at least a portion of an edge of the memory device.

According to an embodiment, the semiconductor component includes a processor disposed on the circuit board, and a memory device disposed between the processor and the shielding sheet, and the partition wall member is disposed on one surface of the processor and the memory device disposed thereon. The heat conduction material may be disposed between the shielding sheets to surround at least a portion of an outer periphery of the memory device, and the heat conduction material may be disposed in a space at least partially surrounded by the memory device, the partition wall member, and the shielding sheet.

According to an embodiment, the electronic device may include at least one hole passing from the inside of the space where the heat conduction material is disposed to the outside of the space where the heat conduction material is disposed.

According to an embodiment, the barrier rib member includes at least one slit formed in at least one wall of the barrier rib member, and the at least one hole is surrounded by the semiconductor component, the at least one slit, and the shielding sheet. may have been formed.

According to an embodiment, when viewing the semiconductor component through the opening, the barrier rib member includes a first wall disposed at a position separated by a first distance from one end of the opening, and viewing the semiconductor component through the opening. When viewed, a second wall disposed at a distance from the other end of the opening by a second distance shorter than the first distance, and the first wall may include the at least one slit.

According to an embodiment, the at least one slit may include a first slit formed on the at least one wall and a second slit formed on a wall facing the at least one wall.

According to an embodiment, the partition wall member has a first length from the at least one slit to one end of the at least one wall and a second length from the at least one slit to the other end of the at least one wall, One length may be the same as the second length.

According to an embodiment, the electronic device may further include at least one accommodating portion connected to the space where the thermally conductive material is disposed and accommodating a portion of the thermally conductive material.

According to an embodiment, an area other than the space in which the heat conducting material is disposed includes a first area and a second area in which a distance from the partition wall member to one end of the opening is shorter than that of the first area, and wherein the at least One accommodating part may be disposed in the first region.

According to an embodiment, the at least one accommodating part is a first accommodating part disposed in a first direction from the space where the heat conductive material is disposed, and a direction opposite to the first direction from the space where the heat conductive material is disposed. It may include a second accommodating portion disposed in the second direction.

According to one embodiment, the barrier rib member may include at least one of a porous material and an oil adsorption material.

According to an embodiment, the barrier rib member may include at least one of a thermally conductive material and a material having elasticity.

According to an embodiment, at least a portion of at least one surface of the barrier rib member may be attached to at least a portion of at least one surface of the semiconductor component by using an adhesive member.

According to one embodiment, the adhesive member may include an antifouling material.

According to one embodiment, at least a portion of at least one surface of the barrier rib member may be attached to at least a portion of at least one surface of the shielding sheet using an adhesive member.

According to one embodiment, the adhesive member may include an antifouling material.

As described above, the manufacturing method of an electronic device according to an embodiment includes a process of disposing a semiconductor component and a shield can including an opening and surrounding at least a portion of the semiconductor component on a circuit board, through the opening. A step of arranging a heat conducting material on at least a portion of the semiconductor component viewed from a direction of viewing the semiconductor component, including the at least a portion of the semiconductor component on which the heat conducting material is disposed in a direction of viewing the semiconductor component through the opening A step of arranging a barrier member for blocking at least a portion of the region where the semiconductor component is disposed from a region where the semiconductor component is not disposed, and a shielding sheet covering the opening, and corresponding to the region where the heat conducting material is disposed and applying the thermal conductive material to a space at least partially surrounded by the semiconductor component, the barrier member, and the shielding sheet by pressing at least a portion of the shielding sheet.

According to an embodiment, the process of applying the thermally conductive material may include pressing at least a portion of the shielding sheet corresponding to an area where the thermally conductive material is disposed so that at least a portion of the thermally conductive material applied to the space is applied to the space. A process of discharging from the inside of the space to the outside of the space through at least one hole passing from the inside to the outside of the space may be further included.

Claims (20)

In electronic devices,
circuit board;
a shield can disposed on the circuit board and including an opening;
a semiconductor component disposed in a space at least partially surrounded by the circuit board and the shield can;
a shielding sheet disposed to cover the opening and including a blocking material that blocks at least a portion of electromagnetic waves generated from the semiconductor component;
A barrier rib member disposed between the semiconductor component and the shielding sheet and blocking at least a portion of an area where the semiconductor component is disposed from an area where the semiconductor component is not disposed in a direction in which the semiconductor component is viewed through the opening. ; and
Including a thermal interface material (TIM) disposed in a space at least partially surrounded by the semiconductor component, the partition wall member, and the shielding sheet,
electronic device. The method of claim 1,
The semiconductor component includes a processor disposed on the circuit board, and a memory device disposed between the processor and the shielding sheet,
The barrier member is disposed between the memory device and the shielding sheet,
The heat conducting material is disposed in a space at least partially surrounded by the memory device, the partition wall member, and the shielding sheet.
electronic device. The method of claim 2,
The partition wall member is disposed to surround at least a portion of an edge of the memory device.
electronic device. The method of claim 1,
The semiconductor component includes a processor disposed on the circuit board, and a memory device disposed between the processor and the shielding sheet,
The barrier rib member is disposed between one surface of the processor on which the memory device is disposed and the shielding sheet to surround at least a portion of an periphery of the memory device,
The heat conducting material is disposed in a space at least partially surrounded by the memory device, the partition wall member, and the shielding sheet.
electronic device. The method of claim 1,
At least one hole passing from the inside of the space in which the heat-conducting material is disposed to the outside of the space in which the heat-conducting material is disposed,
electronic device. The method of claim 5,
The partition wall member includes at least one slit formed in at least one wall of the partition wall member,
The at least one hole is formed surrounded by the semiconductor component, the at least one slit, and the shielding sheet.
electronic device. The method of claim 6,
The partition wall member,
a first wall disposed away from one end of the opening by a first distance when viewing the semiconductor component through the opening; and
A second wall disposed at a distance from the other end of the opening by a second distance shorter than the first distance when the semiconductor component is viewed through the opening;
the first wall comprising the at least one slit;
electronic device. The method of claim 6,
The at least one slit,
a first slit formed in the at least one wall; and
A second slit formed in a wall facing the at least one wall,
electronic device. The method of claim 6,
The partition wall member,
a first length from the at least one slit to one end of the at least one wall, and a second length from the at least one slit to the other end of the at least one wall;
The first length is the same as the second length,
electronic device. The method of claim 5,
Further comprising at least one accommodating portion connected to the space in which the thermally conductive material is disposed and accommodating a portion of the thermally conductive material.
electronic device. The method of claim 10,
An area other than the space where the heat conducting material is disposed,
A first region and a second region having a shorter distance from the barrier member to one end of the opening than the first region,
Wherein the at least one accommodating part is disposed in the first region,
electronic device. The method of claim 10,
The at least one receiving part,
A first accommodating portion disposed in a first direction from the space in which the heat conductive material is disposed, and a second accommodating portion disposed in a second direction opposite to the first direction from the space in which the heat conductive material is disposed. ,
electronic device. The method of claim 1,
The barrier rib member includes at least one of a porous material and an oil sorbent material. The method of claim 1,
The barrier rib member includes at least one of a thermally conductive material and a material having elasticity. The method of claim 1,
At least a portion of at least one surface of the barrier rib member is attached to at least a portion of at least one surface of the semiconductor component using an adhesive member,
electronic device. The method of claim 15
The electronic device of claim 1 , wherein the adhesive member includes an antifouling material. The method of claim 1,
At least a portion of at least one surface of the partition wall member is attached to at least a portion of at least one surface of the shielding sheet using an adhesive member,
electronic device. The method of claim 17
The electronic device of claim 1 , wherein the adhesive member includes an antifouling material. In the method of manufacturing an electronic device,
disposing a semiconductor component and a shield can, which is disposed to surround at least a portion of the semiconductor component and includes an opening, on a circuit board;
arranging a heat conduction material on at least a part of the semiconductor component viewed from a direction in which the semiconductor component is viewed through the opening;
In a direction in which the semiconductor component is viewed through the opening, at least a portion of an area where the semiconductor component is disposed, including at least a portion of the semiconductor component where the heat conduction material is disposed, is separated from an area where the semiconductor component is not disposed. a step of arranging a barrier member to block and a shielding sheet covering the opening; and
Applying the heat conduction material to a space at least partially surrounded by the semiconductor component, the barrier rib member, and the shield sheet by pressing at least a portion of the shield sheet corresponding to the region where the heat conduction material is disposed. ,
Methods for manufacturing electronic devices. The method of claim 19
The process of applying the heat conductive material,
By pressing at least a portion of the shielding sheet corresponding to the region where the heat conductive material is disposed, at least a portion of the heat conductive material applied to the space passes through at least one hole extending from the inside of the space to the outside of the space. Further comprising a process of discharging from the inside to the outside of the space,
Methods for manufacturing electronic devices.

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