KR20230090548A - Induction Heating Soldering Coil and Jig Unit - Google Patents

Abstract

The present invention relates to a soldering coil and a jig unit using induction heating. More particularly, according to the present invention, the soldering coil comprises: a jig unit for fixing an object to be soldered; and a coil unit including a magnetic induction coil for soldering an element mounted on a pattern circuit by inductively heating the pattern circuit implemented on the object to be soldered. The magnetic induction coil is stacked in several layers upward in the form of a spiral closed loop, and a number of elements are arranged in an inner space thereof, so that there is an effect in that soldering of multiple elements can be performed at once with uniform quality.

Description

Induction Heating Soldering Coil and Jig Unit {Induction Heating Soldering Coil and Jig Unit}

The present invention relates to a soldering technology using induction heating, and more particularly, to a soldering coil and a jig unit using induction heating capable of soldering elements to a pattern circuit implemented in a molded interconnected device (MID) component.

Currently, circuits with electric circuits are absolutely necessary in all parts such as connection between parts, control, and sensing in various industries.

As a method of implementing a conventional circuit, there is a method of soldering elements to a PCB or FPCB board or assembling a wire harness.

In the case of a PCB, which is the most common electrical circuit method, an electrical circuit is formed by soldering elements necessary for a part where an electrical circuit is implemented in a 2D form. This method is the most used circuit implementation method in most industries. A pattern is implemented on a board by photoresist, and solder paste is applied using a metal mask or dispensing method, and then the device is mounted to reduce ripple. A finished board can be manufactured through the row.

Recently, circuits of a MID (Molded Interconnected Device) structure to which Laser Direct Structuring (LDS) and Microscopic Integrated Processing Technology (Miptec) technologies have been applied have been introduced. In the case of MID, since circuits are directly implemented on a plastic base, circuits can be implemented in 3D, which is very advantageous in terms of space limitations and installation.

However, in the case of performing MID soldering by the reflow method, since the entire MID passes through a heating furnace that provides high-temperature heat, there is a limitation in that only limited materials must be used due to thermal damage to the material. Due to the spatial constraints of the furnace, there is a limit to its application to a circuit of a MID structure having a plane (2.5D) with a different height or a three-dimensional shape (3D).

Despite the advantages of MID as a very innovative solution for implementing 3D circuits due to the above limitations, it is not widely used in the industry due to limitations in soldering.

On the other hand, in the conventional soldering method, Korean Patent Registration No. 10-1576137 (hereinafter referred to as 'Patent Document 1', name: induction heating soldering device) has been proposed.

However, the above-described Patent Document 1 is a technology in which solder wire is supplied into the magnetic core, and the induction heating coil heats and melts the solder wire discharged from the magnetic core to supply it, to which the present invention is applied. There is a basic difference from a method of directly soldering a device by applying solder paste to the MID to be used.

In addition, conventional soldering devices using induction heating other than Patent Document 1 are difficult to process a plurality of soldering objects at once and have limitations in not being able to process them uniformly.

Registered Patent No. 10-1576137

The present invention has been made to solve the above problems of the prior art, and soldering is performed by locally heating only a certain area requiring soldering in a non-contact induction heating method, thereby minimizing thermal damage applied to parts that are vulnerable to heat. Its purpose is to provide an induction heating soldering coil and a jig unit.

In addition, an object of the present invention is to provide an induction heating soldering coil and a jig unit capable of soldering a plurality of soldering objects at once with uniform quality.

The induction heating soldering coil and jig unit according to the present invention for solving the above problems include a jig unit for fixing an object to be soldered; And a coil unit including magnetic induction coils stacked upward in multiple layers in a closed loop form to solder elements mounted on the pattern circuit by induction heating the pattern circuit implemented in the soldering object; including, A plurality of elements are disposed in the inner space of the magnetic induction coil to solder the plurality of elements at once.

Here, a plurality of magnetic cores are upright installed in the inner space of the magnetic induction coil so that magnetic flux is concentrated in the soldering portion, so that a plurality of devices are soldered at once more intensively.

And, the magnetic induction coil is wound on the outer surface, the coil fixing body formed with a core insertion groove into which the magnetic core is inserted; is configured to further include.

In addition, a coil insertion groove into which the magnetic induction coil is inserted is formed on an outer surface of the coil fixing body.

In addition, a cooling water path is formed inside the magnetic induction coil to supply cooling water.

In addition, a plurality of communication holes connecting the magnetic core and the magnetic induction coil are formed in the coil fixing body.

Here, a heat dissipation sheet is installed in the communication hole of the coil fixing body, and an inner surface of the heat dissipation sheet contacts the magnetic core while an outer surface contacts the magnetic induction coil.

In addition, the coil unit further includes a body jig in which the coil fixing body is embedded, and a front jig and a base jig respectively installed on the front and rear sides of the body jig.

In addition, a range finder for irradiating a laser toward the fixing jig through the body jig and the coil fixing body is installed in the front jig and the base jig.

In addition, the jig unit is provided with a sensing means for sensing the laser, and further includes a means for measuring the position of the magnetic core and the soldering part.

In addition, a lower magnetic core is installed at a point of the fixing jig facing the magnetic core.

In addition, the fixing jig and the bottom plate; a pair of guide plates installed facing each other on both sides of the upper surface of the bottom plate and having guide holes; first and second support plates installed facing each other on both sides of the upper surface of the bottom plate; an upper plate provided on top of the pair of guide plates and the first and second support plates and having an insertion hole; a spring installed on the first support plate; a pressure plate connected to the spring to receive elastic force and having protrusions provided at both ends inserted into the guide hole to move; It is configured to include; a fixing member disposed between the second support plate and the pressing plate through the insertion hole of the upper plate, the lower magnetic core is installed, and fixes the MID component.

Here, the fixing member includes a plurality of fixing panels on which the lower magnetic core is installed and a plurality of fixing panels disposed between the second support plate and the pressing plate to create a gap in which the MID component is disposed; It is composed of; a closing panel installed at one end of the fixed panel and in contact with the second support plate.

In addition, a plurality of magnets are installed on the fixed panel so that adjacent fixed panels are brought into close contact with each other by magnetic force.

The induction heating soldering coil and jig unit of the present invention configured as described above uses a magnetic induction coil to perform soldering by locally heating only a necessary part of the area in a non-contact manner, thereby causing thermal damage to MID components, which was impossible with conventional reflow soldering. In addition to solving the problem, since the magnetic induction coils are stacked in a closed loop form, there is an advantage in that the strength of the magnetic field can be increased to improve the soldering quality.

In addition, by adding a magnetic core to the magnetic induction coil to concentrate magnetic flux (magnetic induction), heating efficiency can be increased and soldering quality can be further improved.

In addition, by arranging a plurality of magnetic cores, there is an advantage in that soldering of a plurality of objects to be soldered can be performed with uniform quality at once.

In addition, there is an advantage in that the magnetic core is provided with cooling and heat dissipation means to quickly dissipate heat from the magnetic core.

In addition, since the distance and position between the magnetic induction coil and the solder object can be precisely controlled, there is an advantage in that homogeneous and high-quality soldering can be performed.

1 and 2 are diagrams showing an induction heating soldering coil and a jig unit according to the present invention together.
3 is a view showing an induction heating soldering jig unit according to the present invention.
Figure 4 is an exploded view of the induction heating soldering coil unit according to the present invention.
Figure 5 is an exploded view of the magnetic induction coil and coil fixing body shown in Figure 4;
6 is a view showing a magnetic core and a lower magnetic core in an induction heating soldering coil and a jig unit according to the present invention.
7 is a diagram showing a fixed panel and MID parts (eg, a smartphone exterior case) in an induction heating soldering jig unit according to the present invention.

Since the present invention can apply various transformations and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, it should be understood that this is not intended to limit the present invention to specific embodiments, and includes all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of related known technologies may obscure the gist of the present invention, the detailed description will be omitted.

Hereinafter, an embodiment of an induction heating soldering coil and a jig unit according to the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are diagrams showing an induction heating soldering coil and a jig unit according to the present invention, FIG. 3 is a diagram showing an induction heating soldering jig unit according to the present invention, and FIG. 4 is an induction heating soldering according to the present invention It is an exploded view of the coil unit, and FIG. 5 is an exploded view of the magnetic induction coil and the coil fixing body shown in FIG. 4 .

6 is a diagram showing a magnetic core and a lower magnetic core in an induction heating soldering coil and jig unit according to the present invention, and FIG. 7 is a fixed panel and MID parts (eg, a smartphone) in an induction heating soldering jig unit according to the present invention. This is a diagram showing the exterior case).

As shown in FIGS. 1 to 7, the induction heating soldering apparatus according to the present invention is largely divided into a coil unit 90 in which a magnetic induction coil is installed and a jig unit 10 in which a soldering object is fixed. Soldering a plurality of elements (P) or a plurality of MID parts (M) at once with an induction coil.

The jig unit 10 is disposed below the magnetic induction coil 20 to fix a MID (Molded Interconnected Device: injection molding product having a circuit pattern) part M that is heated in a non-contact manner.

A lower magnetic core 10a is installed in the jig unit 10 . The exact point where the lower magnetic core 10a is installed is below the element P requiring soldering in the MID part M. Therefore, the magnetic core 30 and the lower magnetic core 10a face each other in the vertical direction during soldering of the element P, and magnetic flux is concentrated at the facing point. A more detailed description of the jig unit 10 will be described later.

The coil unit 90 includes a magnetic induction coil 20, a plurality of magnetic cores 30 disposed in an inner space of the magnetic induction coil 20, and a coil fixing body 40 in which the magnetic induction coil 20 is installed. ), the body jig 50 in which the coil fixing body 40 is embedded, the front jig 60 and the base jig 70 installed on the front and rear sides of the body jig 50, respectively, and the front jig 60 ) and a range finder 80 installed on the base jig 70.

The magnetic induction coil 20 is connected to a high-frequency supply unit (not shown) in order to convert electrical energy into thermal energy by electromagnetic induction, and is a MID component requiring soldering at a certain distance from the MID component M to the upper side. A certain area of (M) is locally heated in a non-contact state. Therefore, the magnetic induction coil 20 induction heats the pattern circuit implemented on the MID component M to solder the element P mounted on the pattern circuit.

These magnetic induction coils 20 are stacked upward in a plurality of turns in the form of a spiral closed loop. As the magnetic induction coils 20 are stacked in a closed loop form, a hollow magnetic flux passage having a certain height and forming a closed space is formed in the inner space 20a of the magnetic induction coil 20 . At this time, the inner space 20a of the magnetic induction coil 20 is made up of an area in which a plurality of magnetic cores 30 can be disposed.

In addition, the magnetic induction coil 20 is formed in a tube shape, and a cooling water path 21 through which cooling water is supplied to prevent heat load may be formed therein. Of course, depending on the MID component M to be soldered and the soldering environment, it may be formed in a general solid wire form instead of a tube form.

The magnetic core 30 is made of a magnetic material, preferably ferrite, and is installed in the inner space 20a of the magnetic induction coil 20, and serves to concentrate magnetic flux for soldering The heat source is concentrated in the part. The magnetic core 30 is made in the shape of a cylinder or a square cylinder having a small diameter.

In addition, a plurality of magnetic cores 30 are installed at regular intervals in the inner space 20a of the magnetic induction coil 20 . In this way, as the plurality of magnetic cores 30 are arranged at regular intervals inside the magnetic flux path formed by the multilayer magnetic induction coil 20, the magnetic flux around them is concentrated at one point, thereby distributing speed to each magnetic core 30. It is possible to locally heat only the corresponding soldering area.

To elaborate further, by arranging a plurality of magnetic cores at regular intervals in the internal space of the magnetic field formed in a relatively wide or long area compared to conventional magnetic induction coils, the internal space is focused on only the relevant regions to be heated, not the entire internal space. Therefore, a plurality of elements P can be collectively soldered without damaging peripheral components.

As described above, since the magnetic core 30 and the lower magnetic core 10a installed in the jig unit 10 are installed at points facing each other in the vertical direction, when a plurality of magnetic cores 30 are installed, the lower magnetic core 10a is installed. The same number of (10a) is also installed in the jig unit (10). Therefore, it is possible to place a plurality of objects to be soldered between the magnetic core 30 and the lower magnetic core 10a and solder them together.

In the jig unit 10, one MID component (M) or a plurality of MID components (M) are mounted in a cassette-type bundle, and a plurality of induction heating soldering is performed at once. In the case of one MID component (M), it is preferable that soldering is required for a plurality of electric elements (P). For example, as shown in FIG. 7, a circuit is directly formed on the exterior injection molding of a smartphone, and soldering of a plurality of elements P such as a volume key, a power key, an NFC, and a wireless charging antenna is required. In summary, the embodiment of the present invention suggests a technique for soldering a plurality of MID parts (M) at once, but the present invention is not limited thereto, and a plurality of elements are soldered to one MID part (M) at once. A soldering technique may also be applied.

To this end, the jig unit 10 has an internal space provided by each plate structure constituting the jig unit 10 so that one MID part (M) or a plurality of MID parts (M) can be combined, and one side is provided with a spring. Since the pressure plate 17 to which 16 is combined is formed, various shapes or multiple MID parts M can be stably mounted on the jig unit 10 regardless of the size or number of MID parts M. there is.

Hereinafter, a more detailed explanation of the jig unit 10 described above, the jig unit 10 is a pair of bottom plate 11 and a pair installed facing each other at both side ends of the upper surface of the bottom plate 11 of the guide plate 12, and the first and second support plates 13 and 14 installed facing each other on both side ends of the upper surface of the bottom plate 11 on which the guide plate 12 is not installed, and the pair of An upper plate 15 provided on the top of the guide plate 12 and the first and second support plates 13 and 14 of the , a spring 16 installed on the first support plate 13, and the spring 16 It is configured to include a pressing plate 17 connected to and receiving elastic force, and a fixing member 18 for fixing the MID part (M).

A long guide hole 12a is formed in the guide plate 12 .

The first support plate 13, the second support plate 14, and the pair of guide plates 12 are installed at the side edges of the bottom plate 11 to form a square shape.

An insertion hole 15a is formed in the upper plate 15 .

The spring 16 has one end connected to the first support plate 13 and the other end connected to the pressure plate 17 to provide an elastic force in a direction in which the pressure plate 17 is pushed toward the second support plate 14. .

The pressure plate 17 is provided with protrusions 17a at both ends, and the protrusions 17a are inserted into the guide holes 12a of the guide plate 12 to stably move back and forth without shaking. Accordingly, the pressure plate 17 can move forward and backward by a distance corresponding to the length of the guide hole 12a.

The fixing member 18 is disposed between the second support plate 14 and the pressing plate 17 through the insertion hole 15a of the upper plate 15, and the lower magnetic core 10a is installed.

This fixing member 18 is composed of a fixing panel 18a to which the MID component M is directly fixed, and a finishing panel 18b installed at one end of the fixing panel 18a. At this time, a plurality of fixed panels 18a are provided, and the MID component M is fixed to each fixed panel 18a.

At least one lower magnetic core 10a is installed on the fixed panel 18a, and a plurality of them are disposed between the second support plate 14 and the press plate 17.

On the other hand, when a plurality of fixed panels 18a are overlapped in the horizontal direction and connected to each other, an empty space is generated between the fixed panels 18a. are placed

Among the plurality of fixed panels 18a as above, the first fixed panel 18a is in contact with the pressure plate 17 .

The finishing panel 18b is installed next to the lastly arranged fixing panel 18a among a plurality of fixing panels 18a arranged to overlap each other in the horizontal direction. The MID part (M) is also installed between the finishing panel (18b) and the fixing panel (18a). And, this finishing panel 18b comes into contact with the second support plate 14 .

Meanwhile, a plurality of magnets 18c are installed on the fixed panel 18a so that the adjacent fixed panels 18a are brought into close contact with each other by magnetic force. Of course, a magnet is installed on the finishing panel 18b so that it adheres to the adjacent fixed panel 18a by magnetic force.

The coil fixing body 40 is to which the magnetic induction coil 20 is fixed, and is manufactured in a shape similar to an external shape in which the degree of freedom coils 20 are spirally stacked, and a plurality of magnetic cores 30 are inserted therein. Two core insertion grooves 41 are formed. A core cover 45 is installed at an inner upper end of the core insertion groove 41 to prevent the magnetic core 30 from escaping to the outside.

Further, a coil insertion groove 42 into which the magnetic induction coil 20 is inserted and wound is formed on an outer surface of the coil fixing body 40 .

On the other hand, when the magnetic core 30 is heated to a high temperature by the magnetic force of the magnetic induction coil 20, the effect of concentrating the magnetic flux is reduced, so it is preferable to prevent the magnetic core 30 from being heated to a high temperature.

To this end, in the coil fixing body 40, a plurality of communication holes 43 connecting the magnetic core 30 and the magnetic induction coil 20 are formed at regular intervals along the length direction of each magnetic core 30. .

The communication hole 43 is formed to communicate with the core insertion groove 41 into which the magnetic core 30 is inserted. The communication hole 43 serves as a cooling air passage capable of cooling the magnetic core 30 and the magnetic induction coil 20 through the flow of cooling air passing through the communication hole 43 . In order to further improve cooling efficiency, thermal grease may be filled in the communication hole 43 .

Meanwhile, a ball-shaped heat dissipation sheet 46 made of an insulating material having excellent thermal conductivity may be installed in the communication hole 43 . Since the heat dissipation sheet 46 is installed in the communication hole 43 formed to communicate with the core insertion groove 41, the inner surface of the heat dissipation sheet 46 is in contact with the outer surface of the magnetic core 30, and the outer surface It comes into contact with the magnetic induction coil (20).

Therefore, when the cooling water flows in the cooling water path 21 of the magnetic induction coil 20, the heat generated from the side of the magnetic core 30 is quickly released to the outside toward the magnetic induction coil 20.

As described above, the present invention provides the magnetic core 30 with a cooling or heat dissipation means, so that the magnetic core 30 is not heated to a high temperature, so that the magnetic flux of the magnetic induction coil 20 can be effectively focused, so that the soldering quality is improved. there is

Meanwhile, at least one protrusion 44 is formed on the bottom surface of the coil fixing body 40 . More specifically, the protrusion 44 is formed below the core insertion groove 41 and serves as the bottom surface of the core insertion groove 41 . Therefore, the lower end of the magnetic core 30 inserted into the core insertion groove 41 is blocked by the protruding portion 44 and the upper end is blocked by the core cover 45 so that it does not escape to the outside.

The body jig 50 includes a coil fixing body 40 in which a magnetic induction coil 20 is installed in a coil insertion groove 42. The coil fixing body 40 is installed on the body jig 50 by pushing the coil fixing body 40 from one end of the body jig 50 .

The front jig 60 and the base jig 70 are installed on the front and rear sides of the body jig 50, respectively. When the body jig 50, the front jig 60 and the base jig 70 are connected in this way, there is an empty space between them. A space is formed, and the distance measuring device 80 is installed in this empty space.

Both ends of the distance measuring device 80 are installed on the front jig 60 and the base jig 70, respectively, and transmit laser toward the jig unit 10 through the body jig 50 and the coil fixing body 40. investigate

The distance meter 80 irradiates laser toward the jig unit 10 to measure the distance and position between the magnetic core 30 and the element P mounted on the MID part M, thereby ensuring homogeneous and high-quality soldering. It is used to precisely control the distance and position of the magnetic core 30 and the magnetic induction coil 20 required to do so.

In this way, laser passage holes 47 and 51 through which the laser irradiated from the distance measurer 80 passes are formed to be connected to the coil fixing body 40 and the body jig 50.

At this time, the fixed panel 18a on which the MID part M is installed is provided with a detection means 91 for detecting the laser emitted from the distance meter 80. This sensing means 91 provides an origin (standard) for performing soldering. That is, the position where the laser is sensed by the sensing means 91 is the upper magnetic core 30 and the element P (more precisely, the upper magnetic core 30 and the lower magnetic core 10a) facing each other in the vertical direction. It is a location.

In this way, in the present invention, the origin (reference) position is recognized in the X-axis and Y-axis of the jig unit 10 installed at the lower side through the laser distance meter 80, and the distance is accurately calculated in the Z-axis to make the MID part Soldering can be performed at the exact location and height of (M).

Here, the coil unit 90 is moved in the X-axis/Y-axis/Z-axis directions through a transfer robot (not shown). That is, the coil unit 90 can be properly moved in the front/back/left/right/up and down directions by a transfer robot (not shown) to continuously solder the various elements P mounted on the plurality of MID parts M. .

The induction heating soldering apparatus according to the present invention having the above-described configuration can perform soldering of a plurality of elements (P) at once with one induction heating unit, so that the soldering time can be greatly reduced, and a plurality of elements (P) Soldering is performed at the correct height and position to obtain uniform soldering quality.

In the above, each embodiment of the present invention has been described with reference to the drawings, but those skilled in the art can make the present invention within the scope not departing from the spirit and scope of the present invention described in the claims below. It will be appreciated that various modifications and variations may be made. For example, in the present invention, the MID part (M) is described as a smartphone exterior case as a soldering object, but the present invention is not limited thereto and can be applied to various MID parts such as an optical sensor and a 5G antenna repeater. It can also be applied to a technology for soldering a plurality of electrical elements mounted on a general PCB board or FPCB board.

10: jig unit 10a: lower magnetic core
11: bottom plate 12: guide plate
12a: guide hole 13: first support plate
14: second support plate 15: upper plate
15a: insertion hole 16: spring
17: pressure plate 17a: protrusion
18: fixing member 18a: fixing panel
18b: finishing panel 18c: magnet
20: magnetic induction coil 20a: inner space
21: cooling water path 30: magnetic core
40: coil fixing body 41: core insertion groove
42: coil insertion groove 43: communication hole
44: protrusion 45: core cover
46: heat radiation sheet 47: laser passage hole
50: body jig 51: laser passage hole
60: front jig 70: base jig
80: distance meter M: MID part
P: element

Claims (18)

A jig unit 10 for fixing an object to be soldered; and
A magnetic induction coil stacked in one turn or a plurality of turns upwards in a closed loop form by induction heating a pattern circuit implemented in the soldering object to solder an element (P) mounted on the pattern circuit A coil unit 90 including (20); including,
Induction heating soldering coil and jig unit, characterized in that a plurality of elements (P) are disposed in the inner space (20a) of the magnetic induction coil (20) to solder a plurality of elements (P) at once.
The method of claim 1,
Induction heating soldering coil and jig unit, characterized in that a plurality of magnetic cores 30 are installed upright in the inner space (20a) of the magnetic induction coil (20) so that magnetic flux is concentrated in the soldering portion.
The method of claim 2,
An induction heating soldering coil further comprising a coil fixing body 40 in which the magnetic induction coil 20 is wound on an outer surface and a core insertion groove 41 into which the magnetic core 30 is inserted is formed. and jig units.
In claim 3,
The induction heating soldering coil and jig unit, characterized in that the coil insertion groove 42 into which the magnetic induction coil 20 is inserted is formed on the outer surface of the coil fixing body 40.
The method of claim 3,
The induction heating soldering coil and jig unit, characterized in that the magnetic induction coil (20) has a cooling water path (21) formed therein to supply cooling water.
The method of claim 4,
Induction heating soldering coil and jig unit, characterized in that the coil fixing body (40) is formed with a plurality of communication holes (43) connecting the magnetic core (30) and the magnetic induction coil (20).
The method of claim 6,
A heat dissipation sheet 46 is installed in the communication hole 43 of the coil fixing body 40, and an inner surface of the heat dissipation sheet 46 contacts the magnetic core 30 while an outer surface of the magnetic induction coil ( 20) induction heating soldering coil and jig unit, characterized in that in contact with.
The method of claim 3,
The coil unit 90 further includes a body jig 50 in which the coil fixing body 40 is embedded, a front jig 60 and a base jig 70 installed on the front and rear sides of the body jig 50, respectively. Induction heating soldering coil and jig unit, characterized in that to do.
The method of claim 1,
The coil unit 90 further comprises a distance meter 80 for measuring the height of the magnetic core 30 and the soldering portion.
The method of claim 9,
Induction heating soldering coil and jig unit, characterized in that the means for measuring the position of the magnetic core 30 and the soldering portion is further installed in the coil unit (90).
The method of claim 10,
The distance measurer 80 measures the distance of irradiating the laser toward the jig unit 10, characterized in that the induction heating soldering coil and jig unit.
The method of claim 11,
The induction heating soldering coil and jig unit, characterized in that the jig unit (10) is provided with a sensing means (91) for detecting the laser.
The method of claim 1,
Induction heating soldering coil and jig unit, characterized in that the lower magnetic core (10a) is installed below the element (P) in the jig unit (10).
The method of claim 1,
Induction heating soldering coil and jig unit, characterized in that a plurality of soldering objects are mounted on the jig unit (10).
The method of claim 14,
The induction heating soldering coil and jig unit, characterized in that the jig unit (10) is provided with a pressing plate (17) for pressurizing and fixing the plurality of soldering objects by one side coupled to the spring (16).
The method of claim 15
The jig unit 10 includes a bottom plate 11;
a pair of guide plates 12 installed facing each other on both sides of the upper surface of the bottom plate 11 and having guide holes 12a;
first and second support plates 13 and 14 installed facing each other on both sides of the upper surface of the bottom plate 11;
an upper plate 15 provided on top of the pair of guide plates 12 and the first and second support plates 13 and 14 and having an insertion hole 15a;
a spring 16 installed on the first support plate 13;
a pressure plate 17 connected to the spring 16 to receive elastic force and having protrusions 17a provided at both ends inserted into the guide holes 12a and moving;
It is disposed between the second support plate 14 and the pressing plate 17 through the insertion hole 15a of the upper plate 15, the lower magnetic core 10a is installed, and the MID part M Induction heating soldering coil and jig unit, characterized in that configured to include; a fixing member (18) for fixing.
The method of claim 16
The lower magnetic core 10a is installed in the fixing member 18, and a plurality of fixings are disposed between the second support plate 14 and the pressing plate 17, and the MID part M is disposed. panel 18a;
The induction heating soldering coil and jig unit, characterized in that composed of; a finishing panel (18b) installed at one end of the fixed panel (18a) and in contact with the second support plate (14).
The method of claim 16
Induction heating soldering coil and jig unit, characterized in that a plurality of magnets (18c) are installed on the fixed panel (18a) so that adjacent fixed panels (18a) are in close contact with each other by magnetic force.

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