KR20230089360A - Bakeout device using tqcm sensor - Google Patents

Abstract

In the bake-out apparatus according to an embodiment, a chamber, a shelf located in the chamber and on which a specimen to be baked out is disposed, located in the chamber, and measuring degassing generated during bake-out located above the specimen It may include a measuring unit including a sensor, at least a portion of which is located in the chamber, and a cooling unit for cooling the measuring unit, wherein an evaporation region of one side contacts the measurement unit, and a condensation region of the other side is in contact with the measurement unit. It may include a plurality of capillary bundles constituting a closed loop located outside the chamber, wherein the capillary bundles contain a working fluid therein, and the working fluid vibrates in the form of liquid slugs and bubble plugs to form the evaporation region. Heat may be transferred from the condensation zone to the condensation zone.

Description

Bakeout device using TQCM sensor {BAKEOUT DEVICE USING TQCM SENSOR}

Various embodiments below relate to a bake-out device using a TQCM sensor.

Bakeout is, in many industries, the process of removing volatile substances from a baked-out object using high-temperature heat and possibly vacuum. That is, it is an artificially accelerated outgassing process.

TQCM sensor (Thermoelectric Quartz Crystal Microbalance Sensor) is widely used worldwide in the space industry to measure the amount of outgassing and contaminants generated during the bake-out process of satellites and space parts. Accordingly, the TQCM sensor can be used to measure the degree of baking out of the part.

The TQCM sensor is a sensor that collects and quantitatively measures contaminant molecules generated from a specimen located in a vacuum chamber. , a thermoelectric module is embedded inside. In order to constantly maintain the surface of the measurement part at a low temperature of the level of -20 ℃, the temperature of the body part connected to the measurement part of the TQCM sensor must be maintained at room temperature.

As mentioned above, a cooling system is required to maintain the temperature of the body part at room temperature.

Meanwhile, TQCM sensors are widely used not only in the space industry but also in promising industries such as semiconductor processing, battery development, and the bio industry.

The above background art is possessed or acquired by the inventor in the process of deriving the present invention, and cannot necessarily be said to be known art disclosed to the general public prior to filing the present invention.

An object according to an embodiment is to provide a bake-out device capable of cooling a TQCM sensor.

An object according to an embodiment is to provide a bake-out device in which leakage does not occur.

In the bake-out apparatus according to an embodiment, a chamber, a shelf located in the chamber and on which a specimen to be baked out is disposed, located in the chamber, and measuring degassing generated during bake-out located above the specimen It may include a measuring unit including a sensor, at least a portion of which is located in the chamber, and a cooling unit for cooling the measuring unit, wherein an evaporation region of one side contacts the measurement unit, and a condensation region of the other side is in contact with the measurement unit. It may include a plurality of capillary bundles constituting a closed loop located outside the chamber, wherein the capillary bundles contain a working fluid therein, and the working fluid vibrates in the form of liquid slugs and bubble plugs to form the evaporation region. Heat may be transferred from the condensation zone to the condensation zone.

The capillary bundles may be arranged next to each other, one ends of two outermost bundles of the capillary bundles may be connected by bypassing other bundles, and one ends of the remaining bundles other than the two bundles of the capillary bundles may be connected. may be connected to one end of a neighboring bundle, and the other end of the remaining bundles may be connected to the other end of another neighboring bundle.

The measuring unit may further include a sensor body connected to the sensor, and the sensor body may be connected to the evaporation region of the capillary bundle.

Since the condensation region is located above the evaporation region, the working fluid may vibrate in a gravitational direction and an opposite gravitational direction.

The cooling unit may further include a heat sink contacting the condensation region to dissipate heat from the condensation region of the capillary bundle.

The heat sink may include a plurality of metal plates extending in a direction opposite to the capillary bundle, and the plurality of metal plates may be arranged at intervals.

The working fluid may include hydrofluorocarbon or nitrogen.

The sensor body may have an evaporation region accommodating space that opens in a direction toward the heat sink, and the heat sink may have a condensation region accommodating space that opens in a direction toward the sensor body. At least a portion may be accommodated in the condensation region accommodating space, and at least a portion of the evaporation region may be accommodated in the evaporation region accommodating space.

A bake-out device according to an embodiment may cool the TQCM sensor.

A bake-out device according to an embodiment provides a bake-out device that does not leak.

Effects of the bake-out device according to an embodiment are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a schematic diagram of a bake-out apparatus according to an embodiment.
2 illustrates a capillary bundle of a bake out apparatus according to one embodiment.
FIG. 3 shows a portion (portion A in FIG. 2 ) of a capillary bundle of a bake-out device according to an embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes can be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all changes, equivalents or substitutes to the embodiments are included within the scope of rights.

Terms used in the examples are used only for the purpose of explanation and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

In addition, in the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Components included in one embodiment and components including common functions will be described using the same names in other embodiments. Unless stated to the contrary, descriptions described in one embodiment may be applied to other embodiments, and detailed descriptions will be omitted to the extent of overlap.

1 is a schematic diagram of a bake out apparatus 100 according to an embodiment. The bake-out apparatus 100 according to an embodiment includes a chamber 110 in which a bake-out object and a sensor 131 are located, a shelf 120 located in the chamber 110, and a TQCM sensor for measuring degassing. It may include a measuring unit 130 including 131 and a cooling unit 140 cooling the measuring unit 130 .

Although the chamber 110 is shown schematically in FIG. 1, its shape may vary. For example, the chamber 110 may have a hexahedral shape or a cylindrical shape. In addition, since the type and size of the specimen T to be tested may vary from semiconductor parts to aerospace parts, the size of the chamber 110 to accommodate the specimen T therein may also vary.

The shelf 120 may be disposed inside the chamber 110 . For example, it may be disposed on the bottom surface of the chamber 110 and extend toward the top of the chamber 110 . The height of the shelf 120 extending from the bottom surface of the chamber 110 may vary. A specimen T to be measured for degassing may be disposed on the upper portion of the shelf 120 .

The measuring unit 130 may be located above the specimen T disposed inside the chamber 110 and above the shelf 120 . For example, the measurement unit 130 may be spaced upward by a predetermined distance from the specimen T disposed on the shelf unit 120 .

The measurement unit 130 may include a TQCM sensor 131 and a sensor body 132 on which the TQCM sensor 131 is seated.

The TQCM sensor 131 is a sensor 131 that collects and quantitatively measures contaminant molecules generated from the specimen T located in the vacuum chamber 110 . For example, since degassed contaminants are volatile substances and diffuse upward after degassing, it may be preferable that the TQCM sensor 131 is positioned above the specimen T.

On the other hand, in order to use the TQCM sensor 131, since the surface of the measurement unit 130 of the sensor 131 must be maintained at a constant temperature (about -20 ° C), the measurement unit 130 of the TQCM sensor 131 is connected. The temperature of the main body part should be maintained at room temperature level (about 20 ℃).

As mentioned above, in order to cool the TQCM sensor 131 as a result of cooling the sensor body 132, the bake-out device 100 according to an embodiment is a cooling unit capable of cooling the measuring unit 130. (140).

The cooling unit 140 may include a capillary bundle 141 serving to transfer heat from the sensor body 132 to a heat sink having a heat dissipation function and a heat sink dissipating heat received from the capillary bundle 141 to the outside. can

For example, the heat sink may be disposed outside the chamber 110, at least a portion of the capillary bundle 141 may be disposed inside the chamber 110, and the remaining portion may be disposed outside the chamber 110. . For example, the capillary bundle 141 is disposed above the measurement unit 130, and the heat sink is disposed above the capillary bundle 141, so that the measurement unit 130, the capillary bundle 141, and the heat sink are in the direction of gravity. can be arranged as

2 shows a capillary bundle 141 of a bake out apparatus 100 according to one embodiment. Referring to FIGS. 1 and 2 together, one side of the plurality of capillary bundles 141 contacts the measuring unit 130 and the other side contacts the heat sink outside the chamber 110 .

For example, one side of the capillary bundle 141 may come into contact with the measurement unit 130 by being accommodated in a receiving space concavely formed on one side of the measurement unit 130 to effectively contact the measurement unit 130 . In addition, the other side of the capillary bundle 141 may come into contact with the heat sink by being accommodated in a receiving space concavely formed on one side of the heat sink in order to effectively contact the heat sink.

As shown in FIG. 2 , a plurality of capillary bundles 141 may be connected to form a closed loop, and the number of capillary bundles 141 is not limited and may vary. For example, two capillary bundles 141 may be arranged adjacently to form a closed loop.

In the case of including more than two capillary bundles 141, one ends of the two outermost bundles 141 among the neighboring capillary bundles 141 are connected by bypassing the other bundles 141, and the remaining capillary bundles 141 are connected. One end of the bundles 141 is connected to one end of the neighboring bundle 141, and the other end of the remaining bundles 141 is connected to the other end of the other neighboring bundle 141, thereby forming a plurality of capillary bundles 141 can constitute a closed loop.

The inside of the capillary bundle 141 may be in a vacuum state, and a working fluid that directly transfers heat from the sensor body 132 to the heat sink while flowing inside the capillary bundle 141 may be included. Since the capillary bundle 141 constitutes a closed loop, the working fluid therein may not leak to the outside.

However, in consideration of the case where the capillary bundle 141 is damaged, the working fluid may include, for example, nitrogen or a hydrofluorocarbon-based refrigerant other than water. For example, the working fluid may be R-134a, R-143a or R-245ca. Since this hydrofluorocarbon-based refrigerant is chemically very stable and exists in a gaseous state at room temperature, it may not contaminate the chamber 110 and the specimen T when it leaks from the capillary bundle 141.

One side of the capillary bundles 141 may be heated in contact with the sensor body 132 to be cooled, and by this heating, the working fluid inside the capillary may evaporate and become a gaseous state, so this part is referred to as the evaporation area 1413 can be said

Conversely, the other side of the capillary bundles 141 can be cooled by being connected to a heat sink, which is a heat dissipation means, and by this cooling, the working fluid inside the capillaries can be condensed to become a liquid state, so this part is called the condensation area 1414. can be said

3 shows a portion of a capillary bundle 141 of a bake out apparatus 100 according to one embodiment. As described above, the working fluid may exist in a liquid state or a gaseous state as it is heated in the evaporation region 1413 and cooled in the condensation region 1414 inside the capillary bundle 141 .

For example, a slug 1411 train unit in which a vapor plug 1412 in a gaseous state and a liquid slug 1411 in a liquid state are sequentially arranged inside the capillary bundle 141 ) can be formed.

As mentioned above, in the capillary bundle 141 that thermally connects the measuring part 130 arranged in the direction of gravity and the heat sink, the condensation region 1414 is located on top of the evaporation region 1413. can be placed. At this time, when heat is applied to the evaporation area 1413, even if power is not supplied separately, the slugs 1411 and plugs 1412 existing inside vibrate up and down at a frequency of several tens of Hertz, regardless of the installed position and shape. move the heat

The heat sink contacting the condensation area 1414 may dissipate the heat transferred from the sensor body 132 to the outside of the chamber 110 as described above. The heat sink may include a plurality of metal plates extending in a direction opposite to the capillary bundle 141, and they may be arranged at intervals. By including a plurality of metal plates, the surface area exposed to the space outside the chamber 110 is widened and faster heat dissipation is possible.

As described above, although the embodiments have been described with limited drawings, those skilled in the art can apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from that described, and/or components of the described system, structure, device 100, circuit, etc. may be combined or combined in a manner different from that described; Appropriate results can be achieved even when substituted or substituted by other components or equivalents.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

T: specimen
100: bake-out device
110: chamber
120: shelf
130: measurement unit
140: cooling unit
131: TQCM sensor
132: sensor body
141: capillary bundle
142: heat sink
1411: liquid slug
1412: bubble plug
1413: evaporation area
1414: condensation area

Claims (7)

In the bake-out device using a sensor for detecting degassing,
chamber;
a shelf located in the chamber and on which a specimen to be baked is disposed;
a measurement unit located in the chamber, located above the specimen, and including a sensor for measuring degassing generated during bake-out;
a cooling unit at least partially located within the chamber and cooling the measuring unit;
including,
the cooling unit,
a plurality of capillary bundles constituting a closed loop, wherein an evaporation region on one side contacts the measurement unit and a condensation region on the other side is located outside the chamber;
including,
The capillary bundle contains a working fluid therein, and the working fluid transfers heat from the evaporation region to the condensation region while vibrating in the form of a liquid slug and a bubble plug.
Bakeout device.
According to claim 1,
The capillary bundles are arranged next to each other,
One ends of the two outermost bundles of the capillary bundles are connected by bypassing the other bundles,
Of the capillary bundles, one end of the remaining bundles other than the two bundles is connected to one end of a neighboring bundle, and the other end of the remaining bundles is connected to the other end of another neighboring bundle,
Bakeout device.
According to claim 2,
The measurement unit further includes a sensor body connected to the sensor,
The sensor body is connected to the evaporation region of the capillary bundle,
Bakeout device.
According to claim 3,
The condensation region is located above the evaporation region, so that the working fluid vibrates in the direction of gravity and in the opposite direction of gravity.
Bakeout device.
According to claim 4,
the cooling unit,
a heat sink contacting the condensation region to dissipate heat of the condensation region of the capillary bundle;
Including more,
The heat sink includes a plurality of metal plates extending in a direction opposite to the capillary bundle,
The plurality of metal plates are arranged at intervals,
Bakeout device.
According to claim 5,
The working fluid includes hydrofluorocarbon or nitrogen,
Bakeout device.
According to claim 5,
The sensor body has an evaporation region accommodating space that is open in a direction toward the heat sink,
The heat sink has a condensation region accommodating space that opens in a direction toward the sensor body,
At least a part of the condensation region is accommodated in the condensation region accommodating space;
At least a part of the evaporation region is accommodated in the evaporation region accommodating space,
Bakeout device.

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